Revision 3Q17

U
Alternative to underfill. PLACE-N-BONDTM
D
替代 underfill.

E
• Overview & Cost Savings R
F
• Implementation
• Package Mechanics
•
•
Freescale / Flextronics Study
Reworkability I
•
•
Tips for Success
Raw Material
L
•
•
CTE
Other Applications (Hot Bar)
M
• Conclusion
https://youtu.be/oLOhEq1QyVQ
• YouTube Videos
• Contact Information

Page 1 of 54
Savings

Winner “Best new Product”

SMT VISION AWARD2010

Presented at IPC/APEX
 Overview & Cost
Savings

Overview of Cost Reduction (降低成本)

Cost savings
• Capital Equipment
• Floor Space
• Labor Cost
• Material Shelf Life
• Reworkable
• Material Handling
• Cycle Time
• Down Time
• Application Cost
• Quality Cost
 Overview & Cost
Savings
Overview
PLACE-N-BOND Underfilm is packaged in standard EIA 481 Tape & Reel format, that
uses standard Pick & Place feeders. This allows for Underfilm to create a
thermoplastic edge bond to BGA / CSP devices during the first and only reflow oven
pass. Underfilm is reworkable and since no custom dispensing and curing equipment
is needed, the cost of Underfilm is much less than traditional thermoset underfill
methods.
• 0.008” partial Underfilm component in standard EIA-481
compliant carrier tape and SMT feeder

Cost analysis (Dispense vs. Underfilm)

Adding a traditional dispense underfill line can cost
$300k to $900k. PLACE-N-BOND Underfilm has no
capital investment cost.

• Optimize the material volume and placement under

package to match your specific needs.

热塑性
返工
Implementation

PLACE-N-BOND®
Adhesive micro-dot pre-applied to Underfilm strip. Red line indicates adhesive side.
胶
 Implementation
PLACE-N-BOND®
Step 1. Using standard machine and electronic feeder, pick and
place PLACE-N-BOND® strips from carrier tape onto PCB.

PLACE-N-BOND® strips
(8 strips in this design)
Implementation

PLACE-N-BOND®
Step 2. Using standard machine and feeder, pick and
place BGA onto solder pads. Reflow as normal.
Implementation

PLACE-N-BOND Underfilm- Reflow Mechanics

Solder Ball Collapse uninhibited by PLACE-N-BOND Underfilm

Upward force
near zero
 BGA removed to show PLACE-N-BOND Underfilm flow

Implementation BGA 132, .5mm Pitch

<- Reference 5.8mm (.228”) ->

<-> Ref. .76mm (.030”)

<- 1.14 mm (.045” ->

 PLACE-N-BOND Underfilm –Rework Procedure
•返工
•修复

• Heat to 135 C (275 F) (hot plate shown)

• Peel softened Underfilm from PCB
• Clean residue with brush IPA
Examples
 Package
Mechanics 1/6

m
 Package
Mechanics 2/6

Underfilm;
 Package
Mechanics 3/6
 Package
Mechanics 4/6

Underfilm
 Package
Mechanics 5/6

solder joints and Underfilm joints

 Package
Mechanics 6/6

Underfilm

Underfilm
PLACE-N-BOND Underfilm, Tips for Success
n Use electronic feeder for smooth and vibration–free
carrier tape advance. Suggest dampening strip under
carrier tape.减震
n No feeders next to Underfilm feeder. This leaves air gap
for Panasonic Ionizer. 电解 Best ESD practice.
n Humidity 湿度 minimum 40% to minimize ESD concerns.
n Store raw materials in a cool dry place.
n Static string (or bar) on cover tape.

www.StopStatic.com

No Static Electricity
无静电

Panasonic Industrial Automation Sales (available through DigiKey.com)

 Dampening strip under carrier tape
(Panasonic feeder shown) 减震

1,2,3’s of feeders: 最佳实践

- Remove cover tape
- Part moves under metal bar
- One part exposed for pick
 FEEDER SET-UP FOR SUCESS

1 exposed pocket
at pick point-
correct

Pick point

Cover tape release point- incorrect Cover tape

2 Exposed pockets before pick point- incorrect release
point-
correct
Typical
• Pick point Nozzle
RP-113178-B04 Panasonic MPM machine
450+900=1350 parts Pick & Place, 100%
yield, no errors.

Video 1 through 4:
https://youtu.be/zG9ataBmghk
https://youtu.be/OPx9D5ww2LI
https://youtu.be/MPF8MR3l1Qo
https://youtu.be/8G0WrBWiaDQ
Freescale / Flextronics

Background
• Solder for most portable / hand-held products
transitioned to Pb-free by July 2006
• Inferior drop test performance versus Pb bearing
solders
• Initially SAC387 / SAC405, then proliferation of
alloys for improved drop test performance
– SAC105, SACX, others
• Even with optimized alloys, many products require
use of dispensed epoxy underfill to meet drop /
shock test requirements
• Can be a long cycle time (dispense, capillary flow
and cure) and non-reworkable process that requires
additional equipment (dispenser, cure oven)
Freescale / Flextronics

Underfilm Material
• One possible alternative to traditional dispensed epoxy underfill
is preform Underfilm
– Fully cured, low flow Polyurethane polymer
• Preforms are placed in the corners / perimeter of the package
(typically BGA) prior to component placement
– Drop in to existing SMT process
– Supplied in tape and reel similar to resistors and capacitors
– Thermoplastic that softens, flows, expands, adheres and re-
solidifies in the reflow process.

PBGA Package
Freescale / Flextronics

PBGA Test Vehicle

• PBGA daisy-chain test vehicle was used to evaluate the
underfilm material for assembly, reliability in drop test and
thermal cycling and reworkability
• 338 PBGA with 0.50 mm staggered pitch
– 11x11 mm body size – array molding
– 5.3 x 5.4 x 0.28 mm die size
– SMD package pads with 0.30 mm diameter soldermask opening
– SAC105 spheres (98.5%Sn, 1.0%Ag, 0.5%Cu by weight)
Freescale / Flextronics

Test Board Assembly

n A test board that conformed to the JEDEC JEDS22-
B111 drop test standard was used
n Following matrix of parts was assembled for drop
test, temp cycle and rework / cross-sectioning:
# of Parts /
Underfilm Purpose
Boards Board
4 5 No Drop Test
4 5 Yes Drop Test
2 15 No Temp Cycle
2 15 Yes Temp Cycle
1 5 No Cross-Section
Cross-Section /
1 5 Yes
Rework Study
Freescale / Flextronics

Test Board Assembly

n Assembly carried out with a Pb-free, halogen free, no-
clean solder paste with a SAC305 composition
n Air atmosphere - peak temp 244.5 to 246ºC across PCB

Profile Board
(Shown on Reflow Palette)
Freescale / Flextronics

Test Board Assembly

n Typical JEDEC JEDS22-B111 compliant PCB following assembly
n Five-up populated underfilmed PCB shown – used for drop test
Freescale / Flextronics

Test Board Assembly

n 100% assembly yield achieved - no shorts or opens
n Total of 21,970 0.5 mm pitch joints on 65 BGAs with
underfilm
n X-ray showed no significant different in underfilmed joints

X-Ray of Corner Joints on Non- X-Ray of Corner Joints on

Underfilmed PBGA After Reflow Underfilmed PBGA After Reflow
Freescale / Flextronics

Test Board Assembly

n Post-assembly cross-sections showed good joint formation

SAC105
Underfilm
Solder Joint
Material

Cross-Section of Typical Solder Joint

Surrounded by Underfilm Material
Freescale / Flextronics

Reworkability
n Hot air removal as normal with slight upward force on
the BGA package – underfilm softens
n Excess solder then wicked from the BGA PCB pads
n Entire footprint cleaned up with IPA and an acid brush
n Site then ready to accept another BGA

Site Following BGA Removal Site Following Solder

(Residual Solder and Underfilm Still Present) Wicking and Underfilm Clean
Freescale / Flextronics

Drop Testing
n Drop testing carried out per
JEDEC JEDS22-B111
Base Plate -
n Continuously monitored during Test Board
the drop: Attached with
n Daisy-chain continuity with
Stand-Offs
high speed event detector
n G force as measured on the
base plate
n PCB strain as measured on
a triaxial strain gauge
affixed to the PCB on the
bottomside of the BGA
footprint
Freescale / Flextronics

Drop Testing

Strain Gauge Affixed to Bottom of

Test Board Under PBGA Footprint
Freescale / Flextronics

Drop Testing
n JEDEC standard calls for dropping at
Condition B which is 1,500 Gs
n Two underfilmed and two non-
underfilmed boards each dropped 100
times at 1,500 Gs with no failures
n Five parts per board
n Decided to drop at 3,500 Gs
n Maximum height of the drop tester of
120 cm
n Remaining test boards then dropped
between 118 and 300 times at 3,500 Gs
Freescale / Flextronics

Drop Testing
n Typical 3,500 G accelerometer output during drop

Approximately
0.5 msec Half
Sine Pulse
Width
Freescale / Flextronics

Drop Testing
n Summary table of 3,500 G drop test results
Board Number Underfilm? Part Location Drops to Failure Comments
U2 104
U4 136 Stopped dropping at
1 No U8 49 140 drops with four
U12 138 of five parts failed.
U14 N/A – did not fail
U2 117
U4 20 Stopped dropping at
2 No U8 112 118 drops with four
U12 92 of five parts failed.
U14 N/A – did not fail
Stopped dropping at
3 Yes All N/A – no failures 300 drops with no
failures.
One failure recorded
at 163 drops
N/A – no real attributed to broken
4 Yes All
failures test board at the
stand-off and was
discounted.
Freescale / Flextronics

Drop Testing
n Weibull plot of non-underfilmed drop test results
%

P
k
g
s

F
a
i
l
e
d

3,500 G Drops to Failure

Freescale / Flextronics

Drop Testing
n Dye penetrant analysis on a non-underfilmed PBGA
that failed at 104 drops
n Dye penetrant performed following 140 drops
n Unable to perform dye penetrant on underfilmed joints

Corner
Solder
Joint
Open

Optical Image Following Dye Penetrant

Showing Open Solder Joint
Freescale / Flextronics

Thermal Cycling
n Two underfilmed and two non-underfilmed boards
were each thermal cycled
n Single chamber cycling between 0 to 100ºC
n 10 min ramps and 10 min dwells for a cycle time of
40 mins. or 36 cycles per day
n 15 parts per board
n Currently at 5700 cycles with the following failures
recorded to date:
n No underfilm: 5057 cycles
n With underfilm: 3062, 4798, 5012, 5242, 5350
n 3062 cycle failure appears to be an early failure
which has been cut from the test board, X-ray
showed no issues and part will be cross-sectioned
n Results far exceed typical handheld requirements
Freescale / Flextronics

Conclusions
n The preform underfilm material was found to be a
drop-in to a conventional, high volume SMT process
n Minor design change on the PCB à tacky pads
n 100% SMT yield was achieved on 65 underfilmed
BGAs with 21,970 0.5 mm pitch joints
n Underfilm material had no observable effect on
solder joint shape or stand-off
n Using a severe 3,500 Gs, drops to 1st fail increased by
a minimum of 8X and probably much greater (15X+)
with the use of the underfilm
n No real fails recorded on any underfilmed units
n Underfilm found to be easily reworkable
n Underfilmed PBGAs passed 3000 0 to 100ºC cycles
with 1st failure at 3062 cycles
Freescale / Flextronics

Acknowledgements
Flextronics (Test board assembly):
-David Mendez and Kirk Kringel

Alltemated (Underfilm supplier):

-Randy Temple and Dave Skupien

Freescale (Drop testing, thermal cycling, failure

analysis, support):
-Terry Burnette, Scott Stoller, Roy Arldt, Kevin Hess
and Ed Hall
Raw Material
Alltemated RP-113178 Raw Material Data Sheet

Test Method English S.I.

Values† Units Values† Units
Feature: Film resin
Properties

Physical (1)
Shore Hardness ASTM D 2240 95 A 95 A

Mechanical (2)

Tensile Modulus ASTM D 412 1200 psi 8.3 MPa

50% elongation 1400 psi 9.7 MPa
100% elongation 3100 psi 21.4 MPa
300% elongation

Ultimate Elongation ASTM D 412 450 % 450 %

Melt Flow Rate 190C/8700g ASTM D 1238 - 13 g/10min.

Ultimate Tensile Strength ASTM D 412 5650 psi 38.9 MPa

Elongation Set After Break ASTM D 412 60 % 60 %

Tear Strength, Die C ASTM D 624 600 PLI 105 KN/m

Compression Set, Method B ASTM D 395 30 % 30 %

22 hrs @ 25°C 80 % 80 %
22 hrs @ 70C
Flexural Modulus ASTM D 790 13,000 psi 89.6 MPa

Thermal

Vicat Softening Point (120°C/hr, 9.8N) ASTM D 1525 177 °F 80.6 °C

Glass Transition Temperature DSC 5 °F -15 °C

CLTE, in-flow, -30 to +30°C ASTM D 696 85.0 in/in/°F 153 mm/mm/°C

Processing Conditions (Typical)

Melt Temperature 365-378 °F 185-192 °C

1. Typical properties; not to be construed as sales specifications. Fabrication conditions, part design, additives, processing
aids, finishing materials, and use conditions can all affect the integrity, performance, and regulatory status of finished
goods.
2. Tests conducted on 0.125 inch (3.2 mm) injection molded specimen, unannealed, unless noted.
Raw Material
TMA
Raw Material

Bond Formation
Thermoplastic Polyurethane Elastomer, Aromatic
Polyester Polyadipate Based
- Hardness, Shore A = 94A
- Tg = -15 C (5 F)
- CLTE = 85 u-in/in @68 F (153 um/m-C)
- Melt Flow Index 13 g/10 min.
- Flexural Modulus = 13,000 psi
- Tensile strength = 5660 psi
- Polymer tends to shrink in the first 24 hrs.
- Dielectric Constant @ 1 Khz ~3.5

• Mostly Isotropic PU
• Little or No cross-linking
• Excellent adhesion to Polyimide flex circuits
• PU wets the substrate surface
•There appears to be no Ionic or Covalent bonding
•van der Waals forces and electrostatic forces appear to be at work
•May be some Hydrogen bonding occurs (forms a pseudo cross-links)
Raw Material
CTE
- Hardness, Shore A = 94A
- Tg = -15 C
- CLTE = 85 u-in/in @68 F
- Flexural Modulus = 13,000 psi

PLACE-N-BOND works to: Minimize BGA warp during temperature life

cycling

- 24 hour shrinkage counters CTE

- Underfilm is DIFFERENT than underfill >>>

- Underfilm is Thermoplastic vs. Epoxy Thermoset
- Underfilm is Under tension after reflow
- Underfilm does not constrain the solder joint like a 100% encapsulation
would, edge bond, so less stress / strain the solder joint.
- Underfilm is relatively soft (94 Shore A), low modulus thermoplastic and
NOT a rigid thermoset like a traditional underfill or glue so it will not put
stress / strain on the solder joint over temperature.
- Underfilm passes -40 to +100 C thermal cycling (>2000 cycles.)
Sizes PLACE-N-BOND Underfilm, standard sizes, custom no problem.

Adhesive
Micro-dot area
 Other Applications
- Flex Hot Bar strain-relief
- Encapsulant (Overfilm)
- BGA seal (from conformal coating)
- Low temperature reflow (180 C)
 Conclusion
Conclusion
PLACE-N-BOND Underfilm is packaged in standard EIA 481 Tape & Reel format, that
uses standard Pick & Place feeders. This allows for Underfilm to create an edge bond
to BGA / CSP devices during the first and only reflow oven pass. Underfilm is
reworkable and since no custom dispensing and curing equipment is needed, the cost
of Underfilm is much less than traditional epoxy underfill methods.
• (0.008” partial Underfilm component in standard EIA-
481 compliant carrier tape and SMT feeder

Cost analysis (Dispense vs. Underfilm)

Adding a traditional dispense underfill line can cost
$300k to $900k. PLACE-N-BOND Underfilm has no
capital investment cost.

• Optimize the material volume and placement under

package to match your specific needs.
 https://youtu.be/oLOhEq1QyVQ

http://www.youtube.com/watch?v=wlcwCrKvw2Y
X-Ray of BGA with Underfilm

https://youtu.be/OPx9D5ww2LI Underfilm
placed using a Pansonic MPM

https://youtu.be/Ug_NuIoGGIc Underfilm in
reflow oven, bottom view

https://youtu.be/ZqlYjblBLl0 Underfilm in
reflow oven, side view
Contact information

PLACE-N-BONDTM Underfilm
Alltemated, Inc.
Arlington Heights, IL USA

Dave.Skupien@ActionIR.com +1-847-477-7587
Randy.Temple@ActionIR.com +1-847-391-3100
TobyT@Alltemated.com +1-847-394-5800
AnthonyD@Alltemated.com +1-847-394-5800
Raecel@Alltemated.com +1-847-394-5800

www.Alltemated.com www.ActionIR.com

Chicago
Tianjin

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