MAINTENANCE MANUAL

KA 51A
SLAVING ACCESSORY

MANUAL NUMBER 006-15626-0007

REVISION 7 JULY, 2001
 WARNING
Prior to the export of this document, review for export license requirement is needed.

COPYRIGHT NOTICE

©1975-2001 Honeywell International Inc.

Reproduction of this publication or any portion thereof by any means without the express written
permission of Honeywell is prohibited. For further information contact the manager, Technical
Publications, Honeywell, One Technology Center, 23500 West 105th Street Olathe KS 66061
telephone: (913) 712-0400.
MAINTENANCE MANUAL

KA 51A
SLAVING ACCESSORY
The binder(s) required to hold this publication(s) are available at an additional cost and
may be ordered from:

Honeywell
One Technology Center
23500 West 105th Street
Olathe, Kansas, 66061
Telephone 1-800-757-8999

Orders must specify part number, description, and the quantity. Use the following list to
complete the order

PART NUMBER DESCRIPTION

006-03140-0001 (1) inch Binder.

006-03140-0002 (1.5) inch Binder.
006-03140-0003 (2) inch Binder.
006-03140-0004 (3) inch Binder.
006-03140-0005 (4) inch Post Binder.

WARNING
Prior to the export of this document, review for export license requirement is needed.

COPYRIGHT NOTICE

©1975-2001 Honeywell International Inc.

Reproduction of this publication or any portion thereof by any means without the express written
permission of Honeywell is prohibited. For further information contact the manager, Technical
Publications, Honeywell, One Technology Center, 23500 West 105th Street Olathe KS 66061
telephone: (913) 712-0400.
BENDIX/KING KA 51A

REVISION HISTORY
KA 51A Maintenance Manual

Part Number: 006-15626-XXXX

For each revision, add, delete, or replace pages as indicated.

REVISION No. 7, July 2001

ITEM ACTION
All pages Full Reprint, new manual

Revision 7 creates a new stand-alone manual for the KA 51A which was extracted from revision
6 of the KCS 55/55A maintenance manual, (P/N 006-05111-0006). Any revisions to the KA 51A,
beginning with revision 7, will not be a part of the KCS 55/55A manual.

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THIS PAGE IS RESERVED

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TABLE OF CONTENTS

SECTION IV
THEORY OF OPERATION

PARAGRAPH PAGE

4.1 General 4-1

4.2 Slave Meter Description 4-1
4.3 Auto-Manual Slave Switch Operation 4-1
4.4 Flux Valve Compensation Circuit 4-1

SECTION V
MAINTENANCE
PARAGRAPH PAGE

5.1 General Information 5-1

5.2 Test and Alignment 5-1
5.2.1 General Requirements 5-1
5.2.2 Signal Test Sources and Test Equipment 5-1
5.2.3 Test Requirements 5-1
5.3 Overhaul 5-7
5.3.1 Visual Inspection 5-7
5.3.2 Cleaning 5-8
5.3.3 Repair 5-13
5.3.4 Disassembly/Assembly Procedures 5-17
5.4 Troubleshooting 5-17

SECTION VI
ILLUSTRATED PARTS LIST
PARAGRAPH PAGE

6.1 General 6-1

6.2 Revision Service 6-1
6.3 List of Abbreviations 6-1
6.4 Sample Parts List 6-3
6.5 KA 51A Final Assembly 6-5
6.6 KA 51A Compensator P. C. Board 6-15

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LIST OF ILLUSTRATIONS
FIGURE PAGE

4-1 Slave Meter System Diagram 4-1

4-2 KA 51A Compensator System Diagram 4-2
4-3 KA 51A 800Hz Generator Circuit 4-2
4-4 E/W Compensation Diagram 4-3
4-5 N/S Compensation Schematic 4-3
5-1 Waveforms 5-2
5-2 Waveforms 5-3
5-3 Waveforms 5-3
5-4 KA 51A Test Circuit 5-4
5-5 KA 51A Troubleshooting Flow Chart 5-18
6-1 Sample Parts List 6-3
6-2 KA 51A Final Assembly 6-9
6-3 KA 51A Schematic Diagram 6-13
6-4 KA 51A Compensator P. C. Board Assembly 6-17

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SECTION IV
THEORY OF OPERATION

4.1 GENERAL
The KA 51A slaving accessory consists of three individual circuit functions; a slave meter, an auto-
manual slave switching function, and a flux valve compensation circuit.

4.2 SLAVE METER DESCRIPTION

Slave meter current is generated in the KG 102A directional gyro and represents the difference
between the existing aircraft heading and the heading displayed on the KI 525A indicator. A pos-
itive indication represents an actual heading that is greater than the displayed heading. See figure
4-1.

FIGURE 4-1 SLAVE METER SYSTEM DIAGRAM

4.3 AUTO-MANUAL SLAVE SWITCH OPERATION

The auto and manual slave switches located on the front panel of the KA 51 are normally ground-
ed push button switches. Operation of the CW and CCW momentary buttons causes a 5 volts sig-
nal to be transmitted to KG 102A directional gyro. This signal results in a CW or CCW pulse train
to be sent to the KI 525A display where the compass card rotates in response to the switching
action. A third switch located between the other two, is an alternate action unit used to engage the
auto slave function in the KG 102A. As with the CW and CCW switches a 5 volt signal is transmit-
ted to the KG 102A whenever the switch is depressed.

4.4 FLUX VALVE COMPENSATION CIRCUIT

In addition to the slave meter and slave switching functions, the KA 51A also include the flux valve
compensation circuit. This circuit operates in parallel with the flux valve to PNI connection as
shown in Figure 4-2.

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FIGURE 4-2 KA 51A COMPENSATOR SYSTEM DIAGRAM

The basic operational principle involves the summation of a low amplitude 800Hz signal, appro-
priately phased, with the 800Hz flux valve signal. This summation results in a shift of the magnetic
direction vector and thus can compensate for "hard iron" effects in the aircraft fuselage and flight
surfaces.
A full wave bridge rectifier consisting of diodes CR101 thru CR104, converts the 400Hz flux valve
excitation waveform to 800Hz as shown in Figure 4-3. The DC component of this waveform is re-
moved by capacitor C101, and the AC portion is used to drive transformer T101.

FIGURE 4-3 KA 51A 800HZ GENERATOR CIRCUIT

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Two isolated secondaries of T101 provide the North-South and East-West correction voltages re-
quired to offset the magnetic vector in the flux valve. One of the secondaries is connected across
the X and Y windings of the flux valve as shown in Figure 4-4. Adjustment of the E/W potentiom-
eter, R106, will cause in-phase or out-of-phase 800Hz current to flow through resistor R103 and
thence through the X-Y winding of the flux valve generating the desired east-west offset.

FIGURE 4-4 E/W COMPENSATION DIAGRAM

Likewise, the other secondary winding is connected across the Z leg and the parallel connected
X and Y legs as shown in Figure 4-5. Adjustment of the N/S potentiometer, R105, will cause in-
phase or out-of-phase 800Hz current to flow through the Z leg of the flux valve. This current is then
equally divided by the X and Y legs as it flows through resistors R101 and R102 back to the trans-
former center top. By dividing the current in this way, North-South compensation will not affect the
east-west adjustment and vice-versa.

FIGURE 4-5 N/S COMPENSATION SCHEMATIC

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SECTION V
MAINTENANCE

5.1 GENERAL INFORMATION

This section deals with the testing, overhaul and troubleshooting procedures for the KA 51A Slav-
ing Accessory.

5.2 TEST AND ALIGNMENT

This following establishes the performance requirements that this unit must meet before it can be
used as part of an operational system.
5.2.1 GENERAL REQUIREMENTS
Unless otherwise specified, all tests shall be conducted with the unit in its normal operating posi-
tion and at ambient room temperature (25 ±5 deg. C) and humidity not to exceed 80%.
5.2.1.1 ELECTRICAL Output Signals
a) Autoslave switch Ground - OFF
+5VDC - ON
b) CW Manual slave Ground - OFF
+5VDC - ON
c) CCW Manual slave Ground - OFF
+5VDC - ON
d) Flux Valve Compensation outputs for N/S and E/W Correction.
5.2.1.2 ELECTRICAL
Input Signals
a) Flux valve excitation voltage from the KG 102A gyro.
b) Slave meter drive signal from the KG 102A gyro.
c) Power input - +5VDC
5.2.1.3 MECHANICAL
a) Autoslave switch - SPDT alternate action pushbutton switch.
b) Manual slave switches - SPDT momentary action pushbutton switches.
5.2.2 SIGNAL TEST SOURCES AND TEST EQUIPMENT
a) Electronic test circuitry shown in Figure 5-4.
b) Test Equipment
DC voltmeter - Similar to Hewlett-Packard, Model 412A.
AC voltmeter - Similar to Ballantine Laboratories Inc., Model 300-G.
Oscilloscope - Similar to Tektronics, Model 516.
5.2.3 TEST REQUIREMENTS
1) Connect the unit as shown in Figure 5-4. Switch the 26VAC on and record the fol-
lowing voltages:
a) Pin B +5. 1 ±1VDC

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b) Pin C 0. 0 ±0.05VDC
c) Pin A 0. 0 ±0.05VDC
d) Pin D 0. 0 ±0.05VDC
e) Pin 3 26 ±3VAC
2) Depress the SLAVE switch. The switch shall remain depressed.
a) Pin C 5. 1 ± 1VDC
b) Pin A 0. 0 ±0.05VDC
c) Pin D 0. 0 ±0.05VDC
3) Depress the slave switch, the button shall release to the extended position. Manu-
ally depress the CCW slave button.
a) Pin C 0. 0 ±0.05VDC
b) Pin A 5. 1 ± 1VDC
c) Pin D 0. 0 ±0.05VDC
Release the CCW slave button. The button shall return to the ex-
tended position.
4) Depress the CW slave button.
a) Pin C 0. 0 ±0.05VDC
b) Pin A 0. 0 ±0.05VDC
c) Pin D 5. 1 ±1VDC
Release the CW slave button. The button shall return to the extend-
ed position.
5) Adjust the slave meter pot to position the slave meter needle over the neg full scale
mark.
Pin E -0. 88 ±0.15VDC
Repeat for the positive full scale mark.
Pin E +0. 88 ±0.15VDC.
6) Adjust the slave meter pot for 0.0VDC at Pin E. The slave meter shall be within 1/
2 needles width of center scale.
7) Connect the scope from Pin 6(+) to Pin 4(-). Adjust both the N/S and the E/W pots
fully CW or fully CCW to obtain the waveform shown in Figure A below. Observe
the waveforms from Pin 6(+) to 2(-) and from Pin 2(+) to 4(-). They shall appear as
shown in figure 5-1 below.

FIGURE 5-1

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8) With the scope connected from Pin 2(+) to Pin 4(-), rotate the E/W wiper to the op-
posite end of the pot. The waveform shall decrease in amplitude smoothly and then
increase out of phase as shown in figure 5-2 below.

FIGURE 5-2

Rotate the E/W adjust pot to minimize the waveform amplitude.

9) Connect the scope between Pin 6 (+) and Pin 4 (-). Rotate the N/S wiper to the op-
posite end of the pot. The waveform shall decrease in amplitude smoothly and then
increase out of phase as shown in figure 5-3 below.

FIGURE 5-3

Return the N/S wiper to the original position and repeat this test with scope leads
between Pins 6 (+) and Pin 4 (-). Rotate the N/S adjust pot to minimize the wave-
form amplitude, disconnect the 26VAC input power and remove the unit.

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FIGURE 5-4 KA 51A TEST CIRCUIT

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TEST DATA SHEET

1) Power ON Pin B _____________ +5.1 ± 1VDC
Pin C _____________ 0.0 ±0.05VDC
Pin A _____________ 0.0 ±0.05VDC
Pin D _____________ 0.0 ±0.05VDC
Pin 3 _____________ 26 ±3VAC
2) SLAVE switch ON Pin C _____________ 5.1 ± 1VDC
Switch ON Pin A _____________ 0.0 ±0.05VDC
Pin D _____________ 0.0 ±0.05VDC
3) Depress Slave SW Pin C _____________ 0.0 ±0.05VDC
Depress CCW SW Pin A _____________ 5.1 ± 1VDC
Pin D _____________ 0.0 ±0.05VDC
SLAVE SWITCH _____________ Extended
Release CCW SW CCW SW _____________ Extended
4) Depress CW SW Pin C _____________ 0. 0 ±0.05VDC
Pin A _____________ 0. 0 ±0.05VDC
Pin D _____________ 5. 1 ±1VDC
Release CW SW CW SW _____________ Extended
5) Slave meter pot for Neg full scale Pin E _____________ -0. 88 ±0.15VDC
Pos Full Scale Pin E _____________ +0. 88 ±0. 15V DC
6) Slave meter pot for
0.0VDC at E Meter _____________ Center 1/2 needle
7) Scope from 6(+) to 4(-) _____________ OK
Scope from 6(+) to 2(-) _____________ OK
Scope from 2(+) to 4(-) _____________ OK
8) Scope from 2(+) to V-) _____________ OK
E/W wiper to opposite end of pot.
E/W pot to minimize amplitude
9) Scope from 6(+) to 4(-) _____________ -OK
N/S wiper to opposite end of pot.
N/S pot to original position
Scope from 6(+) to 2(-)
N/S wiper to opposite end of pot. _____________ OK
N/S pot to minimize amplitude _____________ OK
10. Place the unit in a light box. Apply the appropriate voltage to lamp, (5, 14 or 28V) and actuate
lamp test switch. Check that meter scale is evenly lit. And that the light shines through slot
in housing and illuminates the white lines on the push buttons below.

Tested by _____________
Inspected by _____________

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5.3 GENERAL OVERHAUL

5.3.1 VISUAL INSPECTION
This section contains instructions and information to assist in determining, by visual inspection,
the condition of the units major assemblies and subassemblies. These inspection procedures will
assist in finding defects resulting from wear, physical damage, deterioration, or other causes. To
aid inspection, detailed procedures are arranged in alphabetical order.
A. Capacitors, Fixed
Inspect capacitors for case damage, body damage, and cracked, broken, or
charred insulation. Check for loose, broken, or corroded terminal studs, lugs, or
leads. Inspect for loose, broken, or improperly soldered connections. On chip caps,
be especially alert for hairline cracks in the body and broken terminations.
B. Capacitors, Variable
Inspect trimmers for chipped and cracked bodies, damaged dielectrics, and dam-
aged contacts.
C. Chassis
Inspect the chassis for loose or missing mounting hardware, deformation, dents,
damaged fasteners, or damaged connectors. In addition, check for corrosion or
damage to the finish that should be repaired.
D. Circuit Boards
Inspect for loose, broken, or corroded terminal connections; insufficient solder or
improper bonding; fungus, mold, or other deposits; and damage such as cracks,
burns, or charred traces.
E. Connectors
Inspect the connector bodies for broken parts; check the insulation for cracks, and
check the contacts for damage, misalignment, corrosion, or bad plating. Check for
broken, loose, or poorly soldered connections to terminals of the connectors. In-
spect connector hoods and cable clamps for crimped wires.
F. Covers and Shields
Inspect covers and shields for punctures, deep dents, and badly worn surfaces. Al-
so, check for damaged fastener devices, corrosion and damage to finish.
G. Flex Circuits
Inspect flex circuits for punctures, and badly worn surfaces. Check for broken trac-
es, especially near the solder contact points.
H. Front Panel
Check that name, serial, and any plates or stickers are secure and hardware is
tight. Check that the handle is functional, securely fastened, and handle casting is
not damaged or bent.
I. Fuse
Inspect for blown fuse and check for loose solder joints.
J. Insulators
Inspect insulators for evidence of damage, such as broken or chipped edges,
burned areas, and presence of foreign matter.
K. Jacks
Inspect all jacks for corrosion, rust, deformations, loose or broken parts, cracked
insulation, bad contacts, or other irregularities.

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L. Potentiometers
Inspect all potentiometers for evidence of damage or loose terminals, cracked in-
sulation or other irregularities.
M. Resistors, Fixed
Inspect the fixed resistors for cracked, broken, blistered, or charred bodies and
loose, broken, or improperly soldered connections. On chip resistors, be especially
alert for hairline cracks in the body and broken terminations.
N. RF Coils
Inspect all RF coils for broken leads, loose mountings, and loose, improperly sol-
dered, or broken terminal connections. Check for crushed, scratched, cut or
charred windings. Inspect the windings, leads, terminals and connections for cor-
rosion or physical damage. Check for physical damage to forms and tuning slug
adjustment screws.
O. Terminal Connections Soldered
(1) Inspect for cold-soldered or resin joints. These joints present a po-
rous or dull, rough appearance. Check for strength of bond using
the points of a tool.
(2) Examine the terminals for excess solder, protrusions from the joint,
pieces adhering to adjacent insulation, and particles lodged be-
tween joints, conductors, or other components.
(3) Inspect for insufficient solder and unsoldered strands of wire pro-
truding from the conductor at the terminal. Check for insulation that
is stripped back too far from the terminal.
(4) Inspect for corrosion at the terminal.
P. Transformers
(1) Inspect for signs of excessive heating, physical damage to the case,
cracked or broken insulation, and other abnormal conditions.
(2) Inspect for corroded, poorly soldered, or loose connecting leads or
terminals.
Q. Wiring/Coaxial Cable
Inspect wiring in chassis for breaks in insulation, conductor breaks, cut or broken
lacing and improper dress in relation to adjacent wiring or chassis.

5.3.2 CLEANING
A. General
This section contains information to aid in the cleaning of the component parts and
subassemblies of the unit.

WARNING:
GOGGLES ARE TO BE WORN WHEN USING
PRESSURIZED AIR TO BLOW DUST AND
DIRT FROM EQUIPMENT. ALL PERSONNEL
SHOULD BE WARNED AWAY FROM THE IM-
MEDIATE AREA.

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WARNING:
OPERATIONS INVOLVING THE USE OF A
CLEANING SOLVENT SHOULD BE PER-
FORMED UNDER A VENTILATED HOOD.
AVOID BREATHING SOLVENT VAPOR AND
FUMES; AVOID CONTINUOUS CONTACT
WITH THE SOLVENT. WEAR A SUITABLE
MASK, GOGGLES, GLOVES, AND AN APRON
WHEN NECESSARY. CHANGE CLOTHING
UPON WHICH SOLVENTS HAVE BEEN
SPILLED.

WARNING:
OBSERVE ALL FIRE PRECAUTIONS FOR
FLAMMABLE MATERIALS. USE FLAMMABLE
MATERIALS IN A HOOD PROVIDED WITH
SPARK-PROOF ELECTRICAL EQUIPMENT
AND AN EXHAUST FAN WITH SPARKPROOF
BLADES.

B. Recommended Cleaning Agents

Table 5-1 lists the recommended cleaning agents to be used during overhaul of the
unit.
NOTE:
EQUIVALENT SUBSTITUTES MAY BE USED FOR
LISTED CLEANING AGENTS.

TYPE USED TO CLEAN

Denatured Alcohol Various, exterior and interior
DuPont Vertrel SMT Various, interior
PolaClear Cleaner (Polaroid Corp.) or CRT display filter, LCD displays, and
Texwipe TX129 (Texwipe Co.) general purpose lens/glass cleaner.
KimWipes lint-free tissue Various
(Kimberly Clark Corp.)
Cloth, lint-free cotton Various
Brush, flat with fiber bristles Various
Brush, round with fiber bristles Various
Dishwashing liquid (mild) Nylon, Rubber Grommets

TABLE 5-1 RECOMMENDED CLEANING AGENTS

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C. Recommended Cleaning Procedures

CAUTION:
DO NOT ALLOW SOLVENT TO RUN INTO
SLEEVES OR CONDUIT THAT COVERS
WIRES CONNECTED TO INSERT TERMI-
NALS.
1. Exterior
(a) Wipe dust cover and front panel with a lint-free cloth dampened with
denatured alcohol.
(b) For cleaning connectors, use the following procedure.
(1) Wipe dust and dirt from bodies, shells, and cable
clamps using a lint-free cloth moistened with dena-
tured alcohol.
(2) Wipe parts dry with a clean, dry lint-free cloth.
(3) Remove dirt and lubricant from connector inserts, in-
sulation, and terminals using a small soft bristled
brush moistened with denatured alcohol.
(4) Dry the inserts with an air jet.
(c) Remove cover(s).
(d) If necessary, open any blocked ventilation holes by first saturating
the debris clogging the apertures with denatured alcohol and then
blowing the loosened material out with an air stream.
2. Interior
The following solvents are no longer recommended for benchtop or
rework cleaning of printed circuit boards, modules, or sub-assem-
blies.

FREON TF, IMC TRICHLOROETHANE

CARBON TETRACHLORIDE DETERGENT (ALL AND EQUIVALENTS)
CHLOROFORM METHYLENE CHLORIDE
TRICHLOROETHYLENE GENESOLV 2004/2010
PROPYL ALCOHOL METHYL ALCOHOL
ETHYL ALCOHOL BUTYL ALCOHOL
XYLENE PRELETE (CFC-113)

TABLE 5-2 UNSAFE CLEANING AGENTS

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CAUTION:
DO NOT USE SOLVENT TO CLEAN PARTS
COMPOSED OF OR CONTAINING NYLON OR
RUBBER GROMMETS. CLEAN THESE
ITEMS WITH MILD LIQUID DISHWASHING
DETERGENT AND WATER. USE DETER-
GENT FOR THIS PURPOSE ONLY.

CAUTION:
DUPONT VERTREL SMT DOES HAVE GEN-
ERAL MATERIAL COMPATIBILITY PROB-
LEMS WITH POLYCARBONATE, POLYSTY-
RENE, AND RUBBER. IT IS RECOMMENDED
THAT THESE MATERIALS BE CLEANED
WITH DENATURED ALCOHOL.

CAUTION:
DO NOT ALLOW EXCESS CLEANING SOL-
VENT TO ACCUMULATE IN ANY OF THE AD-
JUSTMENT SCREW CREVICES AND THERE-
BY SOFTEN OR DISSOLVE THE ADJUST-
MENT SCREW EPOXY SEALANT.

CAUTION:
AVOID AIR-BLASTING SMALL TUNING COILS
AND OTHER DELICATE PARTS BY HOLDING
THE AIR NOZZLE TOO CLOSE. USE BRUSH-
ES CAREFULLY ON DELICATE PARTS.

CAUTION:
IMPROPER CLEANING CAN RESULT IN SUR-
FACE LEAKAGE AND CONDUCTIVE PARTIC-
ULATES, SUCH AS SOLDER BALLS OR ME-
TALLIC CHIPS, WHICH CAN CAUSE ELEC-
TRICAL SHORTS. SEVERE IONIC CONTAM-
INATION FROM HANDLING AND FROM
ENVIRONMENTAL CONDITIONS CAN RE-
SULT IN HIGH RESISTANCE OR OPEN CIR-
CUITS.

CAUTION:
ULTRASONIC CLEANING CAN DAMAGE
CERTAIN PARTS AND SHOULD GENERALLY
BE AVOIDED.

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NOTE:
Solvents may be physically applied in several ways
including agitation, spraying, brushing, and vapor
degreasing. The cleaning solvents and methods
used shall have no deleterious effect on the parts,
connections, and materials being used. If sensitive
components are being used, spray is recommended.
Uniformity of solvent spray flow should be maxi-
mized and wait-time between soldering and cleaning
should be minimized.

NOTE:
Clean each module subassembly. Then remove any
foreign matter from the casting.

Remove each module subassembly. Then remove any foreign mat-

ter from the casting.
(a) Casting covers and shields should be cleaned as follows:
(1) Remove surface grease with a lint-free cloth.
(2) Blow dust from surfaces, holes, and recesses using
an air stream.
(3) If necessary, use a solvent, and scrub until clean,
working over all surfaces and into all holes and re-
cesses with a suitable non-metallic brush.
(4) Position the part to dry so the solvent is not trapped
in holes or recesses. Use an air stream to blow out
any trapped solvent.
(5) When thoroughly clean, touch up any minor damage
to the finish.
(b) Assemblies containing resistors, capacitors, rf coils, inductors,
transformers, and other wired parts should be cleaned as follows:
(1) Remove dust and dirt from all surfaces, including all
parts and wiring, using soft-bristled brushes in con-
junction with air stream.
(2) Any dirt that cannot be removed in this way should
be removed with a brush (not synthetic) saturated
with an approved solvent, such as mentioned above.
Use of a clean, dry air stream (25 to 28 psi) is recom-
mended to remove any excess solvent.
(3) Remove flux residue, metallic chips, and/or solder
balls with an approved solvent.
(c) Wired chassic devices containing terminal boards, resistor and ca-
pacitor assemblies, rf coils, switches, sockets, inductors, transform-
ers, and other wired parts should be cleaned as follows:

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NOTE:
When necessary to disturb the dress of wires and
cables, note the positions before disturbing and re-
store them to proper dress after cleaning.

(1) Blow dust from surfaces, holes, and recesses using

an air jet.
(2) Finish cleaning chassis by wiping finished surfaces
with a lint-free cloth moistened with solvent.
(3) Dry with a clean, dry, lint-free cloth.
(4) When thoroughly clean, touch-up any minor damage
to the finish.
(5) Protect the chassis from dust, moisture, and damage
pending inspection.
(d) Ceramic and plastic parts should be cleaned as follows:
(1) Blow dust from surfaces, holes, and recesses using
an air jet.
(2) Finish cleaning chassis by wiping finished surfaces
with a lint-free cloth moistened with solvents.
(3) Dry with a clean, dry, lint-free cloth.

5.3.3 REPAIR
A. General
This section contains information required to perform limited repairs on the unit.
The repair or replacement of damaged parts in airborne electronic equipment usu-
ally involves standard service techniques. In most cases, examination of drawings
and equipment reveals several approaches to perform a repair. However, certain
repairs demand following an exact repair sequence to ensure proper operation of
the equipment. After correcting a malfunction in any section of the unit, it is recom-
mended that a repetition of the functional test of the unit be performed.
B. Repair Precautions
1. Ensure that all ESDS and MOS handling precautions are followed.
2. Perform repairs and replace components with power disconnected
from equipment.
3. Use a conductive table top for repairs and connect table to ground
conductors of 60Hz and 400Hz power lines.
4. Replace connectors, coaxial cables, shield conductors, and twisted
pairs only with identical items.
5. Reference “component side” of a printed circuit board in this manual
means the side on which components are located; “solder side” re-
fers to the other side. The standard references are as follows: near-
side is the component side; farside is the solder side; on surface
mount boards with components on both sides, the nearside is the
side that has the J#### and P#### connector numbers.
6. When repairing circuits, carefully observe lead dress and compo-
nent orientation. Keep leads as short as possible and observe cor-
rect repair techniques.

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7. There are certain soldering considerations with surface mount com-

ponents. The soldering iron tip should not touch the ceramic com-
ponent body. The iron should be applied only to the termination-sol-
der filet.
8. Observe cable routing throughout instrument assembly, prior to dis-
assembly, to enable a proper reinstallation of cabling during reas-
sembly procedures.

CAUTION
THIS EQUIPMENT CONTAINS ELECTRO-
STATIC DISCHARGE SENSITIVE (ESDS) DE-
VICES. EQUIPMENT MODULES AND ESDS
DEVICES MUST BE HANDLED IN ACCOR-
DANCE WITH SPECIAL ESDS HANDLING
PROCEDURES.

C. Electrostatic Sensitive Devices (ESDS) Protection

1. Always discharge static before handling devices by touching some-
thing that is grounded.
2. Use a wrist strap grounded through a 1MΩ resistor.
3. Do not slide anything on the bench. Pick it up and set it down in-
stead.
4. Keep all parts in protective cartons until ready to insert into the
board.
5. Never touch the device leads or the circuit paths during assembly.
6. Use a grounded tip, low wattage soldering station.
7. Keep the humidity in the work environment as high as feasibly pos-
sible.
8. Use grounded mats on the work station unless table tops are made
of approved antistatic material.
9. Do not use synthetic carpet on the floor of the shop. If a shop is car-
peted, ensure that a grounded mat is placed at each workstation.
10. Keep common plastics out of the work area.

D. MOS Device Protection

MOS (Metal Oxide Semiconductor) devices are used in this equipment. While the
attributes of MOS type devices are many, characteristics make them susceptible
to damage by electrostatic or high voltage charges. Therefore, special precautions
must be taken during repair procedures to prevent damaging the device. The fol-
lowing precautions are recommended for MOS circuits, and are especially impor-
tant in low humidity or dry conditions.
1. Store and transport all MOS devices in conductive material so that
all exposed leads are shorted together. Do not insert MOS devices
into conventional plastic “snow” or plastic trays used for storing and
transporting standard semiconductor devices.

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BENDIX/KING KA 51A

2. Ground working surfaces on workbench to protect the MOS devic-

es.
3. Wear cotton gloves or a conductive wrist strap in series with a
200KΩ resistor connected to ground.
4. Do not wear nylon clothing while handling MOS devices.
5. Do not insert or remove MOS devices with power applied. Check all
power supplies to be used for testing MOS devices. and be sure that
there are no voltage transients present.
6. When straightening MOS leads, provide ground straps for the appa-
ratus for the device.
7. Ground the soldering iron when soldering a device.
8. When possible, handle all MOS devices by package or case, and
not by leads. Prior to touching the device, touch an electrical
ground to displace any accumulated static charge. The package
and substrate may be electrically common. If so, an electrical dis-
charge to the case would cause the same damage as touching the
leads.
9. Clamping or holding fixtures used during repair should be ground-
ed, as should the circuit board, during repair.
10. Devices should be inserted into the printed circuit boards such that
leads on the back side do not contact any material other than the
printed circuit board (in particular, do not use any plastic foam as a
backing).
11. Devices should be soldered as soon as possible after assembly. All
soldering irons must be grounded.
12. Boards should not be handled in the area around devices, but rather
by board edges.
13. Assembled boards must not be placed in conventional, home-type,
plastic bags. Paper bags or antistatic bags should be used.
14. Before removing devices from conductive portion of the device car-
rier, make certain conductive portion of carrier is brought in contact
with well grounded table top.

E. PC Board, Two-Lead Component Removal (Resistors, Capacitors, Diodes, etc.)

1. Heat one lead from component side of board until solder flows, and
lift one lead from board; repeat for other lead and remove compo-
nent (note orientation).
2. Melt solder in each hole, and using a desoldering tool, remove sol-
der from each hole.
3. Dress and form leads of replacement component; insert leads into
correct holes.
4. Insert replacement component observing correct orientation.

F. PC Board, Multi-Lead Component Removal (IC’s, etc.)

1. Remove component by clipping each lead along both sides. Clip off
leads as close to component as possible. Discard component.
2. Heat hole from solder side and remove clipped lead from each hole.

Rev 7, July/2001 15626M07.JA Page 5-15

BENDIX/KING KA 51A

3. Melt solder in each hole, and using a desoldering tool, remove sol-
der from each hole.
4. Insert replacement component observing correct orientation.
5. Solder component in place from farside of board. Avoid solder runs.
No solder is required on contacts where no traces exist.

G. Replacement of Power Transistors

1. Unsolder leads and remove attaching hardware. Remove transistor
and hard-coat insulator.
2. Apply Thermal Joint Compound Type 120 (Wakefield Engineering,
Inc.) to the mounting surface of the replacement transistor.
3. Reinstall the transistor insulator and the power transistor using
hardware removed in step (1).
4. After installing the replacement transistor, but before making any
electrical connections, measure the resistance between the case of
the transistor and the chassis, to ensure that the insulation is effec-
tive. The resistance measured should be greater than 10MΩ.
5. Reconnect leads to transistor and solder in place.

H. Replacement of Printed Circuit Board Protective Coating

WARNING
CONFORMAL COATING CONTAINS TOXIC
VAPORS! USE ONLY WITH ADEQUATE VEN-
TILATION.
1. Clean repaired area of printed circuit board per instructions in the
Cleaning section of this manual.
2. Apply Conformal Coating, Humiseal #1B-31 HYSOL PC20-35M-01
(Humiseal Division, Columbia Chase Corp., 24-60 Brooklyn
Queens Expressway West, Woodside, N.Y., 11377) P/N 016-
01040-0000.
3. Shake container well before using.
4. Spray or brush surfaces with smooth, even strikes. If spraying, hold
nozzle 10-15 inches from work surface.
5. Cure time is ten minutes at room temperature.

I. Programmable Read Only Memory (PROM) Replacement

The read only memory packages are specially programmed devices to provide
specific logic outputs required for operation in the unit. The manufacturer’s part
(type) number is for the un-programmed device, and cannot be used. The Honey-
well part number must be used to obtain the correctly programmed device. Refer
to the “Illustrated Parts List” (IPL).

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BENDIX/KING KA 51A

5.3.3.1 REPLACEMENT OF COMPONENTS

This section describes the procedure, along with any special techniques, for replacing damaged
or defective components.
A. Connectors
When replacing a connector, refer to the appropriate PC board assembly drawing,
and follow the notes, to ensure correct mounting and mating of each connector.
B. Crystal
The use of any crystal, other than a Honeywell crystal, is considered an unautho-
rized modification.
C. Diodes
Diodes used are silicon and germanium. Use long-nose pliers as a heat sink, under
normal soldering conditions. Note the diode polarity before removal.
D. Integrated Circuits
Refer to the applicable reference for removal and replacement instructions.
E. Wiring/Coaxial Cable
When repairing a wire that has broken from its terminal, remove all old solder, and
pieces of wire from the terminal, re-strip the wire to the necessary length, and resol-
der the wire to the terminal. Replace a damaged wire or coaxial cable with one of
the same type, size and length.

5.3.4 DISASSEMBLY/ASSEMBLY PROCEDURES

The following instructions included the procedures that are necessary to remove and disassemble
the subassemblies of the KA 51A.
It is assumed that the unit has been tested in accordance with Section 5.2 to locate the source of
the malfunction. The unit should be disassembled only to the station where the malfunction can
be corrected by repair, cleaning, or adjustment. Do not disassemble any parts or wiring unneces-
sarily as repeated tear downs can be detrimental to the life of the unit.
The KA 51A is comprised of a final assembly and one major subassembly. Disassembly instruc-
tions are provided to separate the subassembly from the basic unit. Reassembly can be accom-
plished by reversing the disassembly procedures. Refer to the subassembly drawings in Section
VI during disassembly or assembly.
5.3.4.1 P.C. BOARD REMOVAL
A. Snap the three pushbuttons off of the switch shafts by pulling out on the buttons.
B. Remove the two screws that hold the back cover to the main housing.
C. Slide the printed circuit board and the meter mechanism out of the main housing.
D. When in this state of disassembly the components of the printed circuit board are
readily accessible.

5.4 TROUBLESHOOTING
Refer to the troubleshooting flow chart, figure 5-5.

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BENDIX/KING KA 51A

FIGURE 5-5 KA 51A TROUBLESHOOTING FLOW CHART

Page 5-18 15626M07.JA Rev 7, July/2001

BENDIX/KING KA 51A

ILLUSTRATED PARTS LIST

6.1 General

The Illustrated Parts List (IPL) is a complete list of assemblies and parts required
for the unit. The IPL also provides for the proper identification of replacement
parts. Individual parts lists within this IPL are arranged in numerical sequence
starting with the top assembly and continuing with the sub-assemblies. All me-
chanical parts will be separated from the electrical parts used on the sub-assembly.
Each parts list is followed by a component location drawing.

Parts identified in this IPL by Honeywell part number meet design specifications for
this equipment and are the recommended replacement parts. Warranty informa-
tion concerning Honeywell replacement parts is contained in Service Memo #1,
P/N 600-08001-00XX.

Some part numbers may not be currently available. Consult the current Honeywell
catalog or contact a Honeywell representative for equipment availability.

6.2 Revision Service

The manual will be revised as necessary to reflect current information.

6.3 List of Abbreviations

Abbreviation Name
B Motor or Synchro
C Capacitor
CJ Circuit Jumper
CR Diode
DS Lamp
E Voltage or Signal Connect Point
F Fuse
FL Filter
FT Feedthru
I Integrated Circuit
J Jack or Fixed Connector
L Inductor
M Meter
P Plug
Table 1
Abbreviations

Rev 7, July/2001 15626M07.JA Page 6-1

BENDIX/KING KA 51A

Abbreviation Name
Q Transistor
R Resistor
RT Thermistor
S Switch
T Transformer
TP Test Point
U Component Network, Integrated Circuit,
Circuit Assembly
V Photocell/Vacuum Tube
W Waveguide
Y Crystal
Table 1 (Continued)
Abbreviations

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BENDIX/KING KA 51A

6.4 Sample Parts List

The above is only a sample. The actual format and style may vary slightly. A ‘Find
Number’ column, when shown, references selected items on the BOM’s accompa-
nying Assembly Drawing. This information does not apply to every BOM. There-
fore, a lack of information in this column, or a lack of this column, should not be
interpreted as an omission.

Figure 6-1
Sample Parts List

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BENDIX/KING KA 51A

THIS PAGE IS RESERVED

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BENDIX/KING KA 51A

6.5 KA 51A FINAL ASSEMBLY

071-01053-0001 Rev. 8
071-01053-0002 Rev. 8
071-01053-0003 Rev. 8
071-01053-0004 Rev. 8
071-01053-0005 Rev. 8
071-01053-0006 Rev. 8
071-01053-0007 Rev. 8
071-01053-0008 Rev. 8
071-01053-0009 Rev. 8
071-01053-0099 Rev. 1

-----------------------------------------------------------------------------
SYMBOL PART NUMBER FIND NO DESCRIPTION UM 0001 0002 0003
-----------------------------------------------------------------------------
023-00096-0001 MTR SLAVE EA 1.00 1.00 1.00
025-00018-0033 WIRE 26 ORG IN 3.60 3.60 3.60
025-00018-0099 WIRE 26 WHT IN 3.60 3.60 3.60
035-01361-0008 PROTECTIVE COVER EA 1.00 1.00 1.00
037-00012-0001 LAMP MIN T-1 5V EA 1.00 1.00 .
037-00013-0000 LMP 7219 T1 12V EA . . 1.00
047-03141-0001 CLIP LAMP W/F EA 2.00 2.00 2.00
047-04505-0000 CVR SHLD EA 1.00 1.00 1.00
057-01583-0001 SERIAL NUMBER TAG EA 1.00 1.00 1.00
057-01764-0000 WRN TAG 5V LGT EA 1.00 1.00 .
057-01764-0001 WRN TAG 14V LGT EA . . 1.00
071-01053-0099 COMMON BOM EA 1.00 1.00 1.00
088-00084-0007 FLTR LAMP LT BLU EA 1.00 1.00 1.00
088-00393-0001 PLATE FACE EA 1.00 . 1.00
088-00393-0002 PLATE FACE EA . 1.00 .
088-00406-0005 PSHBTN W/WHT LINE EA 1.00 1.00 1.00
088-00439-0000 COVER EA 1.00 1.00 1.00
091-00056-0001 INSUL FISHPAPER EA 1.00 1.00 1.00
200-01510-0000 COMPENSATOR BD EA 1.00 1.00 1.00

Rev 7, July/2001 15626M07.JA Page 6-5

BENDIX/KING KA 51A

-----------------------------------------------------------------------------
SYMBOL PART NUMBER FIND NO DESCRIPTION UM 0004 0005 0006
-----------------------------------------------------------------------------
023-00096-0001 MTR SLAVE EA 1.00 1.00 1.00
025-00018-0033 WIRE 26 ORG IN 3.60 3.60 3.60
025-00018-0099 WIRE 26 WHT IN 3.60 3.60 3.60
035-01361-0008 PROTECTIVE COVER EA 1.00 1.00 1.00
037-00012-0001 LAMP MIN T-1 5V EA . . 1.00
037-00013-0001 LMP 6838 T1 28V EA 1.00 1.00 .
047-03141-0001 CLIP LAMP W/F EA 2.00 2.00 2.00
047-04505-0000 CVR SHLD EA 1.00 1.00 1.00
057-01583-0001 SERIAL NUMBER TAG EA 1.00 1.00 1.00
057-01764-0000 WRN TAG 5V LGT EA . . 1.00
057-01764-0002 WRN TAG 28V LGT EA 1.00 1.00 .
071-01053-0099 COMMON BOM EA 1.00 1.00 1.00
088-00084-0000 FILTER LAMP RED EA . . 1.00
088-00084-0007 FLTR LAMP LT BLU EA 1.00 1.00 .
088-00393-0001 PLATE FACE EA 1.00 . 1.00
088-00393-0002 PLATE FACE EA . 1.00 .
088-00406-0005 PSHBTN W/WHT LINE EA 1.00 1.00 1.00
088-00439-0000 COVER EA 1.00 1.00 1.00
091-00056-0001 INSUL FISHPAPER EA 1.00 1.00 1.00
200-01510-0000 COMPENSATOR BD EA 1.00 1.00 1.00

Page 6-6 15626M07.JA Rev 7, July/2001

BENDIX/KING KA 51A

-----------------------------------------------------------------------------
SYMBOL PART NUMBER FIND NO DESCRIPTION UM 0007 0008 0009
-----------------------------------------------------------------------------
023-00096-0001 MTR SLAVE EA 1.00 1.00 1.00
025-00018-0033 WIRE 26 ORG IN 3.60 3.60 3.60
025-00018-0099 WIRE 26 WHT IN 3.60 3.60 3.60
035-01361-0008 PROTECTIVE COVER EA 1.00 1.00 1.00
037-00012-0001 LAMP MIN T-1 5V EA 1.00 . .
037-00013-0000 LMP 7219 T1 12V EA . 1.00 .
037-00013-0001 LMP 6838 T1 28V EA . . 1.00
047-03141-0001 CLIP LAMP W/F EA 2.00 2.00 2.00
047-04505-0000 CVR SHLD EA 1.00 1.00 1.00
057-01583-0001 SERIAL NUMBER TAG EA 1.00 1.00 1.00
057-01764-0000 WRN TAG 5V LGT EA 1.00 . .
057-01764-0001 WRN TAG 14V LGT EA . 1.00 .
057-01764-0002 WRN TAG 28V LGT EA . . 1.00
071-01053-0099 COMMON BOM EA 1.00 1.00 1.00
088-00084-0000 FILTER LAMP RED EA 1.00 . 1.00
088-00084-0007 FLTR LAMP LT BLU EA . 1.00 .
088-00393-0001 PLATE FACE EA . . 1.00
088-00393-0002 PLATE FACE EA 1.00 1.00 .
088-00406-0005 PSHBTN W/WHT LINE EA 1.00 1.00 1.00
088-00439-0000 COVER EA 1.00 1.00 1.00
091-00056-0001 INSUL FISHPAPER EA 1.00 1.00 1.00
200-01510-0000 COMPENSATOR BD EA 1.00 1.00 1.00

Rev 7, July/2001 15626M07.JA Page 6-7

BENDIX/KING KA 51A

---------------------------------------------------------------
SYMBOL PART NUMBER FIND NO DESCRIPTION UM 0099
---------------------------------------------------------------
012-01088-0000 CUSHION EA 1.00
025-00018-0000 WIRE 26 BLK IN 3.60
025-00018-0022 WIRE 26 RED IN 3.60
088-00406-0001 PSHBTN W/MARKING EA 1.00
088-00406-0003 PSHBTN W/MARKING EA 1.00
089-06414-0004 SCR PHP 2-28X1/4 EA 2.00

Page 6-8 15626M07.JA Rev 7, July/2001

BENDIX/KING KA 51A

FIGURE 6-2 KA 51A FINAL ASSEMBLY DRAWING

(Dwg. 300-00855-0001 Rev. 8)

Rev 7, July/2001 15626M07.JA Page 6-9

BENDIX/KING KA 51A

FIGURE 6-2A KA 51A FINAL ASSEMBLY DRAWING

(Dwg. 300-00855-0001 Original Manual Revision)

Rev 7, July/2001 15626M07.JA Page 6-11

BENDIX/KING KA 51A

FIGURE 6-3 KA 51A SCHEMATIC

(Dwg. 002-00316-0001 Rev. 2)

Rev 7, July/2001 15626M07.JA Page 6-13

BENDIX/KING KA 51A

6.6 KA 51A COMPENSATOR PC BD

200-01510-0000 Rev. 1

---------------------------------------------------------------
SYMBOL PART NUMBER FIND NO DESCRIPTION UM 0000
---------------------------------------------------------------
007-06029-0000 DIO S 1N457A EA 4.00
009-05542-0000 PC BD SLVG ACC EA 1.00
016-01082-0000 DC RTV 3145 AR .00
019-05069-0000 XFMR EA 1.00
031-00226-0000 SW MOM DPDT EA 2.00
031-00226-0002 SW MOM DPDT EA 1.00
096-01030-0030 CAP TN 22UF10%35V EA 1.00
130-00103-0023 RES FC 10K QW 5% EA 1.00
130-00512-0023 RES FC 5.1K QW 5% EA 1.00
133-00045-0005 RES VA 10K QW 30% EA 2.00
136-01002-0072 RES PF 10K QW 1% EA 2.00
150-00004-0010 TUBING TFLN 22AWG IN 1.20

Rev 7, July/2001 15626M07.JA Page 6-15

BENDIX/KING KA 51A

THIS PAGE IS RESERVED

Page 6-16 15626M07.JA Rev 7, July/2001

BENDIX/KING KA 51A

FIGURE 6-4 KA 51A COMPENSATOR PC BOARD ASSEMBLY DRAWING

(Dwg. 300-01510-0000 Rev. 3)

Rev 7, July/2001 15626M07.JA Page 6-17

BENDIX/KING KA 51A

FIGURE 6-4A KA 51A COMPENSATOR PC BOARD ASSEMBLY DRAWING

(Dwg. 300-01510-0000 Original Manual Revision)

Rev 7, July/2001 15626M07.JA Page 6-19