1/27 SDH MSPP

Thomas Jost

Coriant hiT 7025

7

Technical Description
2/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

The information in this document is subject to change without notice and describes only the product defined in the
introduction of this documentation. This documentation is intended for the use of Coriant customers only for the
purposes of the agreement underder which the document is submitted, and no part of it may be used, reproduced,
modified or transmitted in any form or means without the prior written permission of Coriant. The documentation has
been prepared to be used by professional and properly trained
trained personnel, and the customer assumes full
responsibility when using it. Coriant welcomes customer comments as part of the process of continuous
development and improvement of the documentation.

The information or statements given in this documentation cconcerning

oncerning the suitability, capacity, or performance of the
mentioned hardware or software products are given “as is” and all liability arising in connection with such hardware
or software products shall be defined conclusively and finally in a separate agreement
agreement between Coriant and the
customer. However, Coriant has made all reasonable efforts to ensure that the instructions contained in the
document are adequate and free of material errors and omissions. Coriant will, if deemed necessary by Coriant,
explain
n issues which may not be covered by the document.

Coriant will correct errors in this documentation as soon as possible. IN NO EVENT WILL CORIANT BE LIABLE
FOR ERRORS IN THIS DOCUMENTATION OR FOR ANY DAMAGES, INCLUDING BUT NOT LIMITED TO
SPECIAL, DIRECT, INDIRECT, INCIDENTAL OR CONSEQUENTIAL OR ANY LOSSES, SUCH AS BUT NOT
LIMITED TO LOSS OF PROFIT, REVENUE, BUSINESS INTERRUPTION, BUSINESS OPPORTUNITY OR
DATA,THAT MAY ARISE FROM THE USE OF THIS DOCUMENT OR THE INFORMATION IN IT.

This documentation and the product it describes are considered protected by copyrights and other intellectual
property rights according to the applicable laws.
Other product names mentioned in this document may be trademarks of their respective owners, and they are
mentioned for identification purposes only.

Copyright © Coriant 2013. All rights reserved.

3/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

Contents
1. Introduction ................................................................
........................................................................... 5
1.1 Editorials ................................
................................................................................................
......................................... 5
1.2 Next Generation SDH ......................................................................................
...................... 5
1.3 hiT 70 series ................................................................................................
................................ .................................... 6

2. hiT 7025 Overview ................................................................

................................ 7
2.1 Overview ................................
................................................................................................
......................................... 7
2.2 Data Capabilities .............................................................................................
................................ ............................. 8

3. System Application ...............................................................

............................... 9
3.1 Networking ng Capability ......................................................................................
...................... 9
3.1.1 Termination and Multiplexing (TM) ................................................................
.................................. 9
3.1.2 Hubbing and Local Cross Connect ................................................................
................................ 10
3.1.3 Linear ................................
................................................................................................
............................................ 11
3.1.4 Ring ................................................................................................
................................ ............................................... 11
3.1.5 Multiple Ring Closure ....................................................................................
.................... 12
3.1.6 OA extension shelf ........................................................................................
........................ 12
3.2 Ethernet Service Applications ................................................................
........................................ 13

4. System Description .............................................................

............................. 14
4.1 Physical
al Structure and Module Construction .................................................
................................ 14

5. Protection and Redundancy ................................................

................ 15
5.1 Network Protection ........................................................................................
........................ 15

6. Technical Specification .......................................................

....................... 16
6.1 Interface Types................................
..............................................................................................
.............................. 16
6.1.1 Electrical Interfaces .......................................................................................
....................... 17
6.1.2 Optical Interfaces ..........................................................................................
.......................... 17
6.2 Timing ................................................................................................
................................ ........................................... 18
6.3 Power Source ................................
................................................................................................
................................ 18
6.3.1 Power Supply ................................
................................................................................................
................................ 18
6.3.2 Power Consumption ......................................... Error! Bookmark not defined.
6.3.3 Cooling ................................
................................................................................................
.......................................... 18
6.4 Mechanical Structure .....................................................................................
..................... 19
6.5 Environment Requirements ................................................................
........................................... 20
6.5.1 Enhanced Temperature Variant ................................................................
..................................... 20
6.6 Vibration Tests ................................
..............................................................................................
.............................. 21
6.6.1 Shipping Test ................................
................................................................................................
................................ 21
6.6.2 Office Test ................................
................................................................................................
..................................... 21
4/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

List of Figures
Figure 1 - Future Traffic Growth ................................
................................................................................................
.......................................... 5
Figure 2 - hiT 7025 chassis ................................
................................................................................................
................................................. 7
Figure 5 - hiT 7025 termination and multiplexing capability ................................................................
................................ 9
Figure 6 - hiT 7025 termination and multiplexing capability ..............................................................
.............................. 10
Figure 7 - hiT 7025 linear network configuration................................................................
............................................... 11
Figure 8 - hiT 7025 2-fiber MS-SPRing
SPRing application ................................................................
.......................................... 11
Figure 9 - Multiple Ring closure at a single hiT
h 7025 node ...............................................................
............................... 12
Figure 10 - hiT 7025 Chassis view ................................................................................................
.................................... 14
Figure 33 – hiT 7025 Interface Types ...............................................................................................
............................... 16
Figure 59 - hiT 7025 Environment Requirements ................................................................
............................................ 20
Figure 61 - Shipping Test Standards ................................................................................................
................................ 21
Figure 62 - Office test standards ................................................................................................
....................................... 21
5/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

1. Introduction
1.1 Editorials
This document is a technical
al description for the product hiT 7025. The technical
descriptions
ptions of other products of the hiT 70 series are also available. This document is not
a marketing document. The target of this document is to inform on detail about the
product, product features and the application in the network environment.
It is not a document for advertisement purposes but it is useful to inform our customer in
detail in the after sales period. For marketing and advertisement related product
information please contact the sales department.

1.2 Next Generation SDH

For almost two decades, Synchronous Digital Hierarchy (SDH) has been the preferred
transport technology over optical fibers. SDH is the dominant transport protocol in virtually
all long-haul
haul networks (voice and data) as well as in metro networks that were originally
developed for voice traffic. As a resilient, well
well-understood
understood transport mechanism, SDH has
stood the testt of time. Its reliability is uned.
un The ability of SDH to support 50-mse
msec
switching to backup paths, combined with extensive performance monitoring features for
carrier-class transport.
Legacy SDH was designed mainly to transport circuit oriented services like voice and as
such is an inherently rigid and inefficient method for transporting data. Traditionally a
single wire speed Gigabit Ethernet service (1.25G) will be allocated to one STM 16
channel (2.5G). This means 48 % of the of this STM-16
STM 16 pipe remains as idle capacity.

Figure 1 - Future Traffic Growth

The phenomenal growth in bandwidth, connectivity and content generated by the Internet,
Internet
Intranet and broadband applications, has made native data transfer a very important
criteria for telecommunication infrastructure (see Figure 1). Ethernet has become the de
6/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

facto standard for enterprise networks. In Storage Area Networks (SAN), ESCONTM,
FICONTM and Fiber Channel are by far today‘s most dominating technology as well.
The solution is Next Generation SDH
SDH—technology
technology that transforms rigid, circuit-oriented
circuit
SDH networks to a universal transport mechanism that is optimized for both voice and
data.
ata. The technology enables carriers to keep up with growing demands for bandwidth, to
efficiently carry both streaming and bursty traffic, and adapt to constantly changing traffic
patterns. Multiple protocols and thus services are supported: from basic TD TDMM voice,
Ethernet, as well as SAN.

1.3 hiT 70 series

Coriant has introduced a new range of equipment that makes the promise of Next
Generation SDH a reality: the hiT 70 series.. This platform provides the flexibility of true
packet switching and Ethernet transport, while operating with the inherent reliability of
SDH. Multiple network applications are integrated and consolidated into a single compact
unit. The efficiency of this approach, together with extensive use of highly integrated
integrated
components allows the hiT 70 series to be offered at lower costs than current solutions.
Data + Voice = hiT 70 series
In order to address the varying needs and requirements of carrier‘s carrier, carrier
car and
enterprise, the hiT 70 series consists of a diverse range of product
products,
s, namely:

• hiT 7080 ADM / CC, multiple STM-64

• hiT 7065 ADM / CC, multiple STM-64
• hiT 7060 HC ADM 64, multiple STM-16
• hiT 7060 ADM, multiple STM-16
• hiT 7035 ADM, STM-16, STM- 4, STM-1
• hiT 7025 ADM, STM-16, STM-4, STM-1
• hiT 7030 ADM 4/1 modular
• hiT 7020 ADM 4/1 single board CPE

This Technical Description covers hiT 7025, only.

7/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

2. hiT 7025 Overview

2.1 Overview
hiT 7025 is a compact carrier class full blown STM
STM-16/-4/-1 add-drop-multiplexer
multiplexer. hiT
7025 supports core equipment protection with no single point of failure, and PDH electrical
protection.
It offers rich Ethernet features.
Applications:
• Optimized for SDH applications with data capabilities
• In transmission networks of mobile network
• Central office STM-16/-4/
4/-1 add drop multiplexer
• Highend enterprise service
services

hiT 7025 offers a High Order cross connection capacity up to 33G

G and a Low Order cross
connection capacity up to 10G.
G.

Figure 2 - hiT 7025 chassis

hiT 7025 offers a powerful and cost
cost-effective
effective product design for PDH, SDH and data
applications independent if these applications capabilities are requested for use in central
offices, fixed part of mobile networks or in combination with highend enterprise services.
se
hiT 7025 supports the complete range of PDH and SDH interfaces ranging from E1,
E3/DS3, STM-1 1 el./opt. up to STM-4
STM and even STM-16.16. It provides a full suite of SDH
functions including mapping, multiplexing, cross
cross-connection
connection and various protection
schemes.
hiT 7025 has a modular and scalable design, enabling a paypay-as-you-grow
grow deployment
plan. The system can be initially deployed as a low cost, modest capacity system, and
then enlarged to a high capacity, multi-service
multi system. A large variety of service
vice modules
ensure a cost-effective
effective match with service demands of today while retaining superior
flexibility to meet future service requirements.
Its advance software architecture design results in a highly fault-tolerant
fault tolerant system.
Combined with built-in hardware
rdware redundancies, hiT 7025 achieves carrier-class
carrier class reliability
with 99.999% availability.
8/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

The system is fully compliant with ITU-T

ITU and/or IEEE standards, and is inter--operable with
other standards-based
based SDH, multi
multi-service transport, and data communication
on products.
Utilizing hiT 7025 in combination with the multi
multi-service capabilities of Coriant TNMS
network management system, service providers can cost-effectively
cost effectively grow their embedded
base networks or launch new networks

2.2 Data Capabilities

hiT 7025 supports GFP (ITU--T

T G.7041 / Y.1303) encapsulation for Ethernet data.
9/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

3. System Application

hiT 7025 multi-service

service access platform is a highly flexible product capable of supporting a
variety of network applications like bandwidth access, service-on-demand
service and
nd LAN
services.
hiT 7025 can be configured in such a way that it supports a large variety of network
applications with any mix of PDH, SDH and Ethernet services.

3.1 Networking Capability

hiT 7025 provides high flexibility and compactness supporting a large

large variety of
configurations for STM-16,
16, STM
STM-4 and STM-1 network applications:
• Termination and multiplexing
• Small local cross connect
• Linear
• Ring
• Multi Ring closure

3.1.1 Termination and Multiplexing (TM)

hiT 7025 system can be configured to function as a hub-Terminal at STM-16,

16, STM
STM-4 or
STM-1 level.

E1
E3/DS3
10/100M STM-1/
1/-4/16
10/100/1000M hiT 7025
100M FX
GE
STM-1E
STM-1/4
ATM IMA
FC

Figure 3 - hiT 7025 termination and multiplexing capability

10/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

3.1.2 Hubbing and Local Cross Connect

hiT 7025 system can be used to function as a small local cross

cross-connect
connect system (or can
be applied in hubbing configurations). This allows various hybrid network architectures
with a variety of connection speeds and network topologies such as rings, multi-rings,
multi
subtending rings, or linear structures. This eliminates the need for back-to-back
back back terminals
and greatly increases network flexibility.
hiT 7025 can serve a cluster of other terminals, for example hiT 7030 or other vendor’s
products that have standard SDH interfaces, located at remote sites, through point-to-
point
point connections with optional 1+1 MSP protection. It also serves as an aggregation Hub
for Subtending Rings. This feature eliminates back-to-back
back back terminals that would be
required to serve multi-ring
ring connections using equipment with less ring
ring-closure
closure
capabilities.

STM-1/-4/16 STM-1/
1/-4/16
hiT 7025

E1
E3/DS3
100/100M
10/100/1000M
100M FX
GE
STM-1E
STM-1/4
ATM IMA
FC

Figure 4 - hiT 7025 termination and multiplexing capability

11/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

3.1.3 Linear

hiT 7025 supports STM-16/-4/

4/-1
1 linear network topology as depicted in figure below:

hiT7025 hiT7025 hiT7025

TM ADM TM

Figure 5 - hiT 7025 linear network configuration

3.1.4 Ring

Rings provide redundant bandwidth and/or equipment to ensure system integrity in the
event of any transmission or timing failure, including a fiber cut or node failure. A ring is a
collection of nodes that form a closed loop, in which each node is connected to adjacent
nodes.
hiT 7025 supports two-fiber
fiber MS-SPRing.
MS Figure below shows a hiT
iT 7025 ring example.
hiT7025

hiT7025 2-Fiber STM-4/16 ring hiT7025

hiT7025

Figure 6 - hiT 7025 2-fiber MS-SPRing application

When using the MS-SPRing
SPRing protection mechanism, rings ranging from 3 to 16 nodes are
supported (the maximum of 16 nodes in a ring is specified in G.841). They perform
automatic protection switching (revertive) in less than 50 milliseconds.
12/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

3.1.5 Multiple Ring Closure

A single network element as depicted in Figure 7 can interconnect two hiT 7025 rings
working at different or the same line speeds
speeds.

hiT7025 hiT7025

Ring 1 hiT7025 Ring 2

hiT7025 hiT7025
(STM-1/4/16)
1/4/16) (STM-4/16)

hiT7025 hiT7025

Figure 7 - Mul
Multiple Ring closure at a single hiT 7025 node

3.1.6 OA extension shelf

In OA Extension Shelf Mode the hiT 7025 can be used as an Optical Amplifier (OA)
extension shelf for the hiT 70xx series products. This configuration has no CC, tributary,
or line cards. Only basic cards (power, fan, Enhanced System Controller (SCE)), and
Optical Amplifier (OA) cards are supported.

Connection is made either directly between the management ports of these two NEs or if
multiple OA Extension Shelves are required, through a hub or switch (see Fig. 3.1).

SURPASS hiT 7025 SURPASS hiT 7025

OA Extension Shelf OA Extension Shelf

MAIN SHELF

SWITCH
/ HUB
MGT Port 1

MGT Port 2

When more than one OA Extension Shelf is needed,

a hub or switch is necessary

Fig. 3.1 OA Extension Shelf connection to main shelf

13/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

In OA Extension Shelf configuration, the NE has no cross connect card or tributary cards
and can be equipped with up to 8 OA cards in slots 1 – (LC1) to 8 – (LC8).

3.2 Ethernet Service Applications

hiT 7025 provides data transport over SDH, and offers various data applications in
addition to traditional TDM app
applications. This offers service providers a cost-effective,
effective,
simple, and reliable multi-service
service solution for their customers.
The use of GFP data mapping techniques within hiT 7025 greatly improves the bandwidth
efficiency of the connections.
14/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

4. System Description
Descri
4.1 Physical Structure and Module Construction

hiT 7025 is designed to fit ETSI (21 inch) and EIA 300 (19 inch) requirements. A hiT 7025
chassis view is shown below:

Figure 8 - hiT 7025 Chassis view

hiT 7025 sub-rack

rack is structured using a horizontal oriented, multi-card
multi card chassis.
15/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

5. Protection and Redundancy

5.1 Network Protection

hiT 7025 supports multiple layer network protection functions and multiple layer protection
escalation. The network protect
protection functions supported are:
• MS-SPRing,
SPRing, in compliance with ITU-T
ITU G.841
• MSP 1+1 protection, revertive or non
non-revertive
revertive modes, in compliance with ITU
ITU-T
G.841
• SNCP at VC-12, VC-3,
3, VC-4,
VC VC-4-4c level in compliance with ITU-T
T G.841
• Rapid Spanning Tree Protocol
Protocol (RSTP) to provide Layer 2 Ethernet data protection by
converging data to another path, in compliance with IEEE 802.1w protocol
16/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

6. Technical Specification

6.1 Interface Types

hiT 7025 supports the following interfaces listed in Table below:

Interface Types Interface Name and Rates
10/100M/1000 Base-T
Base
E1 (2048kbit/s)
Electrical Interface
E3/DS3
STM-1
1 el. (155.520Mbit/s)
STM-1
1 (155.520Mbit/s)
STM-4
4 (622.080Mbit/s)
STM-16
16 (2.5 Gbit/s)
Optical Interface
GE
FC
100M FX
2048kbit/s
Timing Interface
2048kHz
Auxiliary Management and Maintenance Interface
Interface） RS-232, RJ-45
45 (802.3 LAN)
TIF (MDO or MDI) , ALM (alarm contact) RJ-45
Data Channels 64Kbps/s, G703, RJ45

Figure 9 – hiT 7025 Interface Types

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July 15, 2013 / Issue 12

6.1.1 Electrical Interfaces

hiT 7025 Ethernet 10/100M Base

Base-T rate-adaptive
adaptive electrical interface complies with IEEE
Standard 802.3. The transmission media is 100 Ohms
Ohms–two
two pairs shielded twisted pair
cable (STP) and two pairs of unshielded twisted pair cable (Category 5 UTP); the interface
inte
connector is using standard RJ
RJ-45 (1000ohm) connector.
hiT 7025 STM-1E
1E interface complies with ITU-T
ITU T G.703 Recommendation and uses CC4
connector (75 ohm) unbalanced.
hiT 7025 E3/DS3 interface complies with ITU-T
ITU T G.703 Recommendation and uses CC4
connector
nnector (75ohm) unbalanced.
hiT 7025 E1 interface complies with ITU
ITU-T
T G.703 Recommendation, and uses 2mm High
Density (75ohm or 120ohm) connector.

6.1.2 Optical Interfaces

hiT 7025 optical interfaces comply with ITU

ITU-T
T Recommendations G.957 and G.691. The
SFP
P optical modules are field replaceable.

Optical Interfaces:
STM-16
16 SFP interfaces S-16.1, L16.1 and L-16.2, V-16.2,
16.2, U-16.2
U also
FC 2G.
STM-4
4 SFP interfaces S-4.1, L4.1, L-4.2 and V-4.2
STM-1
1 SFP interfaces I-1, S-1.1, L1.1, L1.2 and V-1.2
1.2 also 100M FX
GE SFP interfaces SX, LX, LH, ZX also FC(1G)
STM-1
1 electrical SFP interfaces
Multi-rate
rate CWDM SFP interfaces G. 695 C8L1
C8L1-1D2 and C8L1-0D2
2.5G DWDM SFP interfaces 100G Hz channel g
grid
GE electrical SFP interfaces

Laser safety for the STM-16,

16, STM-4
STM and STM-1 optical interfaces:: complies with IEC
IEC-
60825 recommendations
Optical
ptical connectors are LC type.
type
18/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

6.2 Timing

hiT 7025 provides the following timing clock interfaces:

urce (T3): 2 input port, 2048kbit/s (G.703-6)

External clock source (G.703 6) or 2048 kHz (G.703-10)75Ω
(G.703
Synchronize output (T4): 2 output port, 2048kbit/s (G.703) or 2048 kHz 75Ω

hiT 7025supports the selection of the following 4 timing references:

• Line/tributary timing (STM-1/-4/-16
(STM lines, or E1 tributary)
• External station clock timing
• Internal clock (ITU-T
T G.813 option 1)
• E1 tributary timing (any E1 port can be selected as the timing source)

Additionally, hiT 7025 is able to provide retiming for E1 (2Mbit/s) traffic interfaces to
provide synchronized reference to another equipment.

6.3 Power Source

6.3.1 Power Supply

hiT 7025 supports -48V/60V

48V/60V ((-40.5~-72.0
72.0 V) DC power supply, support load balanced
1+1 power supply
upply modular protection.

6.3.2 Cooling

The equipment is assembled with one fan unit. It is field replaceable. Fan failure does not
affect service.
19/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

6.4 Mechanical Structure

hiT 7025 chassis mechanical parameters:
• Height: 238mm
mm (5U)
• Width: 445mm
• Depth: 240mm (300 mm back-to-door)

hiT 7025 can be installed in the following types of racks:

• EIA 310 19”
• 2200mm(Height) × 600mm (Width) × 300mm (Depth)
• 2600mm(Height)×600mm(Width)×300mm(Depth)

Depending on the electrical cabel load you can install up to six hiT 7025 chassis into a
2200mm high ETSI rack or an EIA 310 19” rack ( typically four systems per rack ).
20/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

6.5 Environment Requirements

hiT 7025 system is designed to comply with the following ETSI requirements (ETS 300
019) on environmental conditions:

• ETSI Class 3.2 on Environment

• ETSI Class 1.2 on Storage
• ETSI Class 2.3 on Transportation

The environmental
onmental conditions required by hiT 7025 are as follows:

Environmental Condition Temperature Relative Humidity

Transport and storage -20º ~ 60ºC 2% ~ 98%
Operation for long term -5º ~ 45ºC 5% ~ 90% (30ºC)
Operation for short term -10º ~ 50ºC 5% ~ 90% (30ºC)

Figure 10 - hiT 7025 Environment Requirements

6.5.1 Enhanced Temperature Variant

Depending on the used chassis variant of hiT 7025 also an operating temperature up to
55 degree is available.
This enhanced temperature variant has a more powerful fan assembly and is introduced
with system software R4.2. To comply with the operation in a higher temperature range,
the chassis has to be mounted in vertical position.
Performance Guaranteed:
Operation for long term: -5°
5°C~55°C
Relative Humidity: 10%~100% (30°C)
21/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

6.6 Vibration Tests

6.6.1 Shipping Test

hiT 7025 meets the following shipping test standards.

Test Test Standard

Amplitude (>= 0.6 mm) ETSI
Acceleration (>= 15 m/s
m/s—X, Y, Z three directions) ETSI
Test time (>=3 hours) ETSI

Figure 11 - Shipping Test Standards

6.6.2 Office Test

hiT 7025 meets the following office test standards.

Test Test Standard

Amplitude (>= 0.6 mm) ETSI
Acceleration (>= 15 m/s
m/s—X, Y, Z three directions) ETSI
Test time (>= 3 hours) ETSI

Figure 12 - Office test standards

22/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

Appendix 1: Definitions and Abbreviations

Abbreviation Definition

ADM Add
Add-Drop Multiplexer

AIS Alarm Indication Signal

APS Automatic Protection Switching

ASON Automatic Switched Optical Network

ASTN Automatic Switched Transport Network

ATM Asynchronous Transfer Mode

AU Administrative Unit

AU-n Administration Unit

Unit，level n

AUG Administration Unit Group

AU-PTR Administration Unit Pointer

BA Booster Amplifier

BBE Background Block Error

BBER Background Block Error Ratio

BER Bit Error Ratio

BITS Building Integrated Timing Supply

BML Business Management Layer

BoD Bandwidth on Demand

Broadband
Broadband-Remote Access Server
B-RAS
(or Broadband Access Management Switch)

CDV Cell Delay Variation

CLR Cell Loss Rate

CMI Coded Mark Inversion

C-n Container
Container- n

CORBA Com
Common Object Request Broker Architecture

CTD Cell Transfer Delay

23/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

Abbreviation Definition

CV Code Violation

DB Data Base

DBMS Data Base Management System

DCC Data Communications Channel

DCE Data Circuit-terminating

Circuit Equipment

DCF Data Communications Function

DCN Data Communications Network

DDN Digital Data Network

DNA Distributed Network Architecture

Archi

DNI Dual Node Interconnection

DNU Do Not Use for Sync.

DTE Data Terminal Equipment

DWDM Dense Wavelength

Wavelength-division Multiplexing

DXC Digital Cross Connect

ECC Embedded Control Channel

EM Element Management

EMC Electromagnetic Compatibility

EMI Electromagnetic Interference

EML Element Management Layer

EMS Element Management System

EOS Ethernet Over SDH

ES Error Second

ESD Electronic Static Discharge

ESR Error Second Ratio

ETSI European Telecommunication Standards Institute

FDM Frequency Division Multiplexing

24/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

Abbreviation Definition

FDDI Fiber Distributed Data Interface

FEBBE Far End Background Block Error

FEES Far End Errored Second

FESES Far End Severely Errored Second

GMPLS Generalized Multi

Multi-Protocol Label Switching

GUI Graphical User Interface

HDLC High Digital Link Control

HPC Higher order Path Connection

IP Internet Protocol

International Telecommunication Union-Telecommunication

Union Telecommunication
ITU-T
Standardization Sector

L2 Layer 2

LAN Local Area Network

LAPD Link Access Procedure On D-channel

LCT Local Craft Terminal

LMS Local NE Management System

LOF Loss Of Frame

LOM Loss of Multi

Multi-Frame

LOP Loss Of Pointer

LOS Loss Of Signal

LPC Lower order Path Connection

MAC Medium Access Control

MAN Metropolitan Area Network

MCU Micro Control Unit

MDI Miscellaneous Discrete Input

MDO Miscellaneous Discrete Output

MM Multi Mode
25/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

Abbreviation Definition

MS Multiplex Section

MS-AIS Multiplex Sections - Alarm Indication Signal

MS-PSC Multiplex Sections - Protection Switching Count

MS-PSD Multiplex Sections - Protection Switching Duration

MS-SPRing Multiplexer Section Shared Protection Ring

MSAP Multiple Service Access Platform

MSOH Multiplex Section Overhead

MSP Multiplex Section Protection

MSTP Multiple Service Transport Platform

MSSP Multiple Service Switching Platform

MTBF Mean Time Between Failures

MTIE Maximum Time Interval Error

NE Network Element

NEF Network Element Function

NEL Network Element Layer

NML Network Manager Layer

NMS Network Management System

NUT Non
Non-preemptible and Unprotected Traffic

OAM Operation, Administration and Maintenance

OFS Out of Frame Second

OOF Out of Frame

OS Operation System

OSF Operation System Function

OSI Open System Interconnect

PCB Printed Circuit Board

PCM Pulse Code Modulation

26/27 Technical Description hiT 7025
July 15, 2013 / Issue 12

Abbreviation Definition

PDH Plesiochronous Digital Hierarchy

PGND Protection GND

PJE+ Pointer Justification Event +

PJE- Pointer Justification Event -

POH Path Overhead

PPP Point to Point Protocol

PRC Primary Reference Clock

QA Q Adaptor

QoS Quality of Service

RAM Random Access Memory

RDI Remote Defect Indication

REI Remote Error Indication

REG Regenerator

RFI Remote Failure Indication

RIP Router Information Protocol

RMII Reduced Medium Independent Interface

RS Regenerator Section

RSOH Regenerator Section Overhead

SD Signal Degrade

SDH Synchronous Digital Hierarchy

SEC Station Equipment Clock

SES Severely Errored Second

SESR Severely Errored Second Ratio

SETS Synchronous Equipment Timing Source

SF Signal Failure

SFF Small Form Factor

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Abbreviation Definition

SFP Small Form Factor Pluggable

SM Single Mode

SMCC Sub
Sub-network management control center

SML Service Management Layer

SMN SDH Management Network

SMS SDH Management Sub-Network

Sub

SMT Surface Mount Technology

SNCP Sub
Sub-network Connection Protection

SOH Section Overhead

SPRING Shared Protection Ring

SSM Synchronous State Message

STM-N Synchronous Transport Module Level-N

Level

TCP Transport Control Protocol

TDEV Time Deviation

TDM Time Division Multiplex

TIF Telemetry Interface

TM Terminal Multiplexer

TMN Telecommunications Management Network

TU Tributary Unit

UAS Unavailable Second

VC Virtual Container

VC-n Virtual Container level n

VDN Virtual Data Network

VLAN Virtual Local Area Network

WAN Wide Area Network

WDM Wavelength Division Multiplexing