The document provides technical specifications for a component, listing its holding current as 180 mA and dropout current as 60mA. Materials for the seal and o-ring are also specified as Silicon and Viton, respectively.
The document provides technical specifications for a component, listing its holding current as 180 mA and dropout current as 60mA. Materials for the seal and o-ring are also specified as Silicon and Viton, respectively.
The document provides technical specifications for a component, listing its holding current as 180 mA and dropout current as 60mA. Materials for the seal and o-ring are also specified as Silicon and Viton, respectively.