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SPP11N60C3 SPI11N60C3, SPA11N60C3 Cool MOS™ Power Transistor
SPP11N60C3 SPI11N60C3, SPA11N60C3 Cool MOS™ Power Transistor
Maximum Ratings
Parameter Symbol Value Unit
Drain Source voltage slope dv/dt 50 V/ns
VDS = 480 V, ID = 11 A, Tj = 125 °C
Thermal Characteristics
Parameter Symbol Values Unit
min. typ. max.
Thermal resistance, junction - case RthJC - - 1 K/W
Thermal resistance, junction - case, FullPAK RthJC_FP - - 3.8
Thermal resistance, junction - ambient, leaded RthJA - - 62
Thermal resistance, junction - ambient, FullPAK RthJA_FP - - 80
SMD version, device on PCB: RthJA
@ min. footprint - - 62
@ 6 cm 2 cooling area 3) - 35 -
Soldering temperature, wavesoldering Tsold - - 260 °C
1.6 mm (0.063 in.) from case for 10s 4)
Electrical Characteristics
Parameter Symbol Conditions Values Unit
min. typ. max.
Transconductance gfs VDS≥2*ID*R DS(on)max, - 8.3 - S
ID=7A
Electrical Characteristics
Parameter Symbol Conditions Values Unit
min. typ. max.
Inverse diode continuous IS TC=25°C - - 11 A
forward current
Inverse diode direct current, I SM - - 33
pulsed
Inverse diode forward voltage VSD VGS =0V, IF=IS - 1 1.2 V
Reverse recovery time t rr VR =480V, IF =IS , - 400 600 ns
Reverse recovery charge Q rr diF/dt=100A/µs - 6 - µC
Peak reverse recovery current I rrm - 41 - A
Peak rate of fall of reverse dirr /dt Tj=25°C - 1200 - A/µs
recovery current
Tj E xternal H eatsink
R th1 R th,n T case
P tot (t)
T am b
SPP11N60C3
140 35
W
W
120
110
100 25
Ptot
Ptot
90
80 20
70
60 15
50
40 10
30
20 5
10
0 0
0 20 40 60 80 100 120 °C 160 0 20 40 60 80 100 120 °C 160
TC TC
A A
10 1 10 1
ID
ID
10 0 10 0
tp = 0.001 ms
tp = 0.001 ms tp = 0.01 ms
tp = 0.01 ms tp = 0.1 ms
10 -1 tp = 0.1 ms 10 -1 tp = 1 ms
tp = 1 ms tp = 10 ms
DC DC
10 -2 0 1 2 3
10 -2 0 1 2 3
10 10 10 V 10 10 10 10 V 10
VDS VDS
10 0 10 0
ZthJC
ZthJC
10 -1 10 -1
D = 0.5
D = 0.2
D = 0.5 D = 0.1
10 -2 D = 0.2 10 -2 D = 0.05
D = 0.1 D = 0.02
D = 0.05 D = 0.01
D = 0.02 single pulse
10 -3 D = 0.01 10 -3
single pulse
10 -4 -7 -6 -5 -4 -3 -1
10 -4 -7 -6 -5 -4 -3 -2 -1 1
10 10 10 10 10 s 10 10 10 10 10 10 10 10 s 10
tp tp
6,5V 14
ID
24
5.5V
12
20
6V 10
16 5V
8
12 5,5V
6
4.5V
8
5V 4
4V
4 4,5V 2
0 0
0 3 6 9 12 15 18 21 V 27 0 5 10 15 V 25
VDS VDS
1.6 1.6
RDS(on)
RDS(on)
1.4
1.4
1.2
1.2
1
1 0.8
0.6
0.8 98%
0.4 typ
6.5V
0.6 8V
20V 0.2
0.4 0
0 2 4 6 8 10 12 14 16 A 20 -60 -20 20 60 100 °C 180
ID Tj
32
12
28
VGS
20 8
16
6
12
4
8
2
4
0 0
0 2 4 6 8 10 12 V 15 0 10 20 30 40 50 nC 70
VGS QGate
55 td(off)
50
10 1
45
IF
t
40
35
30
10 0 25
Tj = 25 °C typ 20 tf
Tj = 150 °C typ 15 td(on)
Tj = 25 °C (98%)
10
Tj = 150 °C (98%)
5 tr
-1
10 0
0 0.4 0.8 1.2 1.6 2 2.4 V 3 0 2 4 6 8 A 12
VSD ID
ns
A/µs
250
2000
di/dt
t
200
td(off) 1500
td(on)
150 tr
tf
1000
100
di/dt(off)
500
50 di/dt(on)
0 0
0 10 20 30 40 50 Ω 70 0 20 40 60 80 Ω 120
RG RG
110
0.03
100
dv/dt
90 0.025
E
80
0.02
70
60 0.015
50
Eon*
0.01
40 dv/dt(on)
30
0.005
20 Eoff
10 0
0 10 20 30 40 50 Ω 70 0 2 4 6 8 A 12
RG ID
8
0.16 Eoff
IAR
7
E
6
0.12
5 T j(START)=25°C
4
0.08
3 T j(START)=125°C
Eon*
0.04 2
0 0 -3 -2 -1 0 1 2 4
0 10 20 30 40 50 Ω 70 10 10 10 10 10 10 µs 10
RG tAR
V
mJ
680
V(BR)DSS
250
EAS
660
200
640
150 620
600
100
580
50
560
0 540
20 40 60 80 100 120 °C 160 -60 -20 20 60 100 °C 180
Tj Tj
pF
W Ciss
10 3
P AR
200
C
150 10 2
Coss
100
10 1 Crss
50
0 4 5 6
10 0
10 10 Hz 10 0 100 200 300 400 V 600
f VDS
7.5
µJ
6
5.5
Eoss
5
4.5
4
3.5
3
2.5
2
1.5
1
0.5
0
0 100 200 300 400 V 600
VDS
1 2 3
MILLIMETERS
DIMENSIONS
MIN. MAX.
DOCUMENT NO.
A 4.50 4.90
Z8B00003319
A1 2.34 2.85
A2 2.42 2.86 REVISION
b 0.65 0.90 07
b1 0.95 1.38
b2 0.95 1.51 SCALE 5:1
b3 0.65 1.38 0 1 2 3 4 5mm
b4 0.65 1.51
c 0.40 0.63
D 15.67 16.15
D1 8.97 9.83 EUROPEAN PROJECTION
E 10.00 10.65
e 2.54
H 28.70 29.75
L 12.78 13.75
L1 2.83 3.45
øP 3.00 3.30 ISSUE DATE
Q 3.15 3.50 27.01.2017
PG-TO-262-3-1 (I²-PAK)
PG-TO-220-3-1, PG-TO-220-3-21
RevisionHistory
SPx11N60C3
Revision:2018-02-09,Rev.2.3
Previous Revision
Revision Date Subjects (major changes since last revision)
3.3 2018-02-09 Outline FullPAK update
TrademarksofInfineonTechnologiesAG
AURIX™,C166™,CanPAK™,CIPOS™,CoolGaN™,CoolMOS™,CoolSET™,CoolSiC™,CORECONTROL™,CROSSAVE™,DAVE™,DI-POL™,DrBlade™,
EasyPIM™,EconoBRIDGE™,EconoDUAL™,EconoPACK™,EconoPIM™,EiceDRIVER™,eupec™,FCOS™,HITFET™,HybridPACK™,Infineon™,
ISOFACE™,IsoPACK™,i-Wafer™,MIPAQ™,ModSTACK™,my-d™,NovalithIC™,OmniTune™,OPTIGA™,OptiMOS™,ORIGA™,POWERCODE™,
PRIMARION™,PrimePACK™,PrimeSTACK™,PROFET™,PRO-SIL™,RASIC™,REAL3™,ReverSave™,SatRIC™,SIEGET™,SIPMOS™,SmartLEWIS™,
SOLIDFLASH™,SPOC™,TEMPFET™,thinQ™,TRENCHSTOP™,TriCore™.
TrademarksupdatedAugust2015
OtherTrademarks
Allreferencedproductorservicenamesandtrademarksarethepropertyoftheirrespectiveowners.
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