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SPP07N60S5

SPI07N60S5

Cool MOS™ Power Transistor VDS 600 V


Feature RDS(on) 0.6 Ω
• New revolutionary high voltage technology ID 7.3 A
• Worldwide best RDS(on) in TO 220
• Ultra low gate charge PG-TO262 PG-TO220

• Periodic avalanche rated 2

• Extreme dv/dt rated 23


1
• Ultra low effective capacitances P-TO220-3-1

• Improved transconductance

Type Package Ordering Code Marking


SPP07N60S5 PG-TO220 Q67040-S4172 07N60S5
SPI07N60S5 PG-TO262 Q67040-S4328 07N60S5

Maximum Ratings
Parameter Symbol Value Unit
Continuous drain current ID A
TC = 25 °C 7.3
TC = 100 °C 4.6
Pulsed drain current, tp limited by Tjmax I D puls 14.6
Avalanche energy, single pulse EAS 230 mJ
I D = - A, V DD = 50 V
Avalanche energy, repetitive tAR limited by Tjmax1) EAR 0.5
I D = 7.3 A, VDD = 50 V
Avalanche current, repetitive tAR limited by Tjmax I AR 7.3 A
Gate source voltage VGS ±20 V
Gate source voltage AC (f >1Hz) VGS ±30
Power dissipation, T C = 25°C Ptot 83 W
Operating and storage temperature T j , T stg -55... +150 °C

Rev. 2.7 Page 1 2009-11-27


SPP07N60S5
SPI07N60S5
Maximum Ratings
Parameter Symbol Value Unit
Drain Source voltage slope dv/dt 20 V/ns
V DS = 480 V, ID = 7.3 A, Tj = 125 °C

Thermal Characteristics
Parameter Symbol Values Unit
min. typ. max.
Thermal resistance, junction - case RthJC - - 1.5 K/W
Thermal resistance, junction - ambient, leaded RthJA - - 62
SMD version, device on PCB: RthJA
@ min. footprint - - 62
@ 6 cm2 cooling area 2) - 35 -
Soldering temperature, wavesoldering Tsold - - 260 °C
1.6 mm (0.063 in.) from case for 10s

Electrical Characteristics, at Tj=25°C unless otherwise specified


Parameter Symbol Conditions Values Unit
min. typ. max.
Drain-source breakdown voltage V(BR)DSS V GS=0V, ID=0.25mA 600 - - V
Drain-Source avalanche V(BR)DS V GS=0V, ID=7.3A - 700 -
breakdown voltage
Gate threshold voltage VGS(th) ID=350µΑ, VGS=V DS 3.5 4.5 5.5
Zero gate voltage drain current I DSS V DS=600V, VGS=0V, µA
Tj=25°C, - 0.5 1
Tj=150°C - - 100
Gate-source leakage current I GSS V GS=20V, VDS=0V - - 100 nA
Drain-source on-state resistance RDS(on) V GS=10V, ID=4.6A, Ω
Tj=25°C - 0.54 0.6
Tj=150°C - 1.46 -
Gate input resistance RG f=1MHz, open Drain - 19 -

Rev. 2.7 Page 2 2009-11-27


SPP07N60S5
SPI07N60S5
Electrical Characteristics , at Tj = 25 °C, unless otherwise specified
Parameter Symbol Conditions Values Unit
min. typ. max.
Characteristics
Transconductance g fs V DS≥2*I D*RDS(on)max, - 4 - S
ID=4.6A

Input capacitance Ciss V GS=0V, V DS=25V, - 970 - pF


Output capacitance Coss f=1MHz - 370 -
Reverse transfer capacitance Crss - 10 -
Effective output capacitance,3) Co(er) V GS=0V, - 30 - pF
energy related V DS=0V to 480V

Effective output capacitance,4) Co(tr) - 55 -


time related
Turn-on delay time t d(on) V DD=350V, V GS=0/10V, - 120 - ns
Rise time tr ID=7.3A, RG=12Ω - 40 -
Turn-off delay time t d(off) - 170 255
Fall time tf - 20 30

Gate Charge Characteristics


Gate to source charge Qgs VDD=350V, ID=7.3A - 7.5 - nC
Gate to drain charge Qgd - 16.5 -
Gate charge total Qg VDD=350V, ID=7.3A, - 27 35
VGS=0 to 10V

Gate plateau voltage V(plateau) VDD=350V, ID=7.3A - 8 - V

1Repetitve avalanche causes additional power losses that can be calculated as P =EAR*f.
AV
2Device on 40mm*40mm*1.5mm epoxy PCB FR4 with 6cm² (one layer, 70 µm thick) copper area for drain
connection. PCB is vertical without blown air.
3C is a fixed capacitance that gives the same stored energy as Coss while VDS is rising from 0 to 80% V
o(er) DSS.
4C o(tr) is a fixed capacitance that gives the same charging time as Coss while VDS is rising from 0 to 80% VDSS.

Rev. 2.7 Page 3 2009-11-27


SPP07N60S5
SPI07N60S5
Electrical Characteristics, at Tj = 25 °C, unless otherwise specified
Parameter Symbol Conditions Values Unit
min. typ. max.
Inverse diode continuous IS TC=25°C - - 7.3 A
forward current
Inverse diode direct current, ISM - - 14.6
pulsed
Inverse diode forward voltage VSD VGS=0V, IF=IS - 1 1.2 V
Reverse recovery time trr VR=350V, IF =IS , - 750 1275 ns
Reverse recovery charge Qrr di F/dt=100A/µs - 4.9 - µC

Typical Transient Thermal Characteristics


Symbol Value Unit Symbol Value Unit
typ. typ.
Thermal resistance Thermal capacitance
R th1 0.024 K/W Cth1 0.00012 Ws/K
R th2 0.046 Cth2 0.0004578
R th3 0.085 Cth3 0.000645
R th4 0.308 Cth4 0.001867
R th5 0.317 Cth5 0.004795
R th6 0.112 Cth6 0.045

Tj R th1 R th,n E xternal H eatsink


T case
P tot (t)

C th1 C th2 C th,n

T am b

Rev. 2.7 Page 4 2009-11-27


SPP07N60S5
SPI07N60S5
1 Power dissipation 2 Safe operating area
Ptot = f (TC) ID = f ( V DS )
parameter : D = 0 , T C=25°C
100
SPP07N60S5 10 2

W A

80
10 1
70
Ptot

ID
60

50 10 0

40 tp = 0.001 ms
tp = 0.01 ms
tp = 0.1 ms
30
10 -1
tp = 1 ms
DC
20

10

0 10 -2 0 1 2 3
0 20 40 60 80 100 120 °C 160 10 10 10 V 10
TC VDS

3 Typ. output characteristic 4 Typ. output characteristic


ID = f (VDS); Tj=25°C ID = f (VDS); Tj=150°C
parameter: tp = 10 µs, VGS parameter: tp = 10 µs, VGS
25 12

20V 20V
A 12V 9V
A
10V
12V
8.5V
8
ID

ID

15 10V
8V
6
9V
10 7.5V
4
7V
8V
5 6.5V
2
7V 6V

0 0
0 5 10 15 V 25 0 5 10 15 V 25
VDS VDS

Rev. 2.7 Page 5 2009-11-27


SPP07N60S5
SPI07N60S5
5 Typ. drain-source on resistance 6 Drain-source on-state resistance
RDS(on)=f(ID) RDS(on) = f (Tj)
parameter: Tj=150°C, VGS parameter : ID = 4.6 A, VGS = 10 V
SPP07N60S5
3 3.4

2.8
mΩ

RDS(on)
RDS(on)

2.4

2
1.6
20V
12V
10V 1.2
9V
1.5 8.5V 0.8 98%
8V
typ
7.5V
7V 0.4
6.5V
6V
1 0
0 2 4 6 8 10 A 14 -60 -20 20 60 100 °C 180
ID Tj

7 Typ. transfer characteristics 8 Typ. gate charge


ID= f ( VGS ); VDS≥ 2 x ID x RDS(on)max VGS = f (Q Gate)
parameter: tp = 10 µs parameter: ID = 7.3 A pulsed
SPP07N60S5
24 16
A
V

20 0.2 VDS max

18 12 0.8 VDS max

16
VGS
ID

25 °C 10
14
150 °C
12 8

10
6
8

6 4

4
2
2

0 0
0 4 8 12 V 20 0 4 8 12 16 20 24 28 32 nC 38
VGS Q Gate

Rev. 2.7 Page 6 20079-11-27


SPP07N60S5
SPI07N60S5
9 Forward characteristics of body diode 10 Avalanche SOA
IF = f (VSD) IAR = f (tAR)
parameter: Tj , tp = 10 µs par.: Tj ≤ 150 °C
2 SPP07N60S5
10 8

A
A

6
1
10

IAR
5
IF

T j(START) =25°C

3
10 0 T j(START) =125°C

Tj = 25 °C typ
2
Tj = 150 °C typ
Tj = 25 °C (98%)
Tj = 150 °C (98%) 1

10 -1 0 -3 -2 -1 0 1 2 4
0 0.4 0.8 1.2 1.6 2 2.4 V 3 10 10 10 10 10 10 µs 10
VSD tAR

11 Avalanche energy 12 Drain-source breakdown voltage


EAS = f (Tj) V(BR)DSS = f (Tj)
par.: ID = - A, VDD = 50 V
SPP07N60S5
260 720
mJ
V
220

200 680
V(BR)DSS

180
660
EAS

160

140 640

120
620
100
600
80

60 580
40
560
20

0 540
20 40 60 80 100 120 °C 160 -60 -20 20 60 100 °C 180
Tj Tj

Rev. 2.7 Page 7 2009-11-27


SPP07N60S5
SPI07N60S5
13 Avalanche power losses 14 Typ. capacitances
PAR = f (f ) C = f (VDS)
parameter: E AR=0.5mJ parameter: V GS=0V, f=1 MHz
300 10 4

pF
W
Ciss
10 3
PAR

200

C
150 10 2
Coss

100

10 1
Crss
50

0 4 5 6
10 0
10 10 MHz 10 0 100 200 300 400 V 600

f VDS

15 Typ. Coss stored energy 16 Typ. gate threshold voltage


Eoss=f(VDS) VGS(th) = f (Tj)
parameter: V GS = VDS
5.5
µJ

4.5

4
Eoss

3.5

2.5

1.5

0.5

0
0 100 200 300 400 V 600
VDS

Rev. 2.7 Page 8 2009-11-27


SPP07N60S5
SPI07N60S5

Definition of diodes switching characteristics

Rev. 2.7 Page 9 2009-11-27


SPP07N60S5
SPI07N60S5

PG-TO220-3-1, PG-TO220-3-21

Rev. 2.7 Page 10 2009-11-27


SPP07N60S5
SPI07N60S5

PG-TO262-3-1, PG-TO262-3-21 (I²-PAK)

Rev. 2.7 Page 11 2009-11-27


SPP07N60S5
SPI07N60S5

Published by
Infineon Technologies AG,
Bereichs Kommunikation
St.-Martin-Strasse 53,
D-81541 München
© Infineon Technologies AG 1999
All Rights Reserved.

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characteristics.

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regarding circuits, descriptions and charts stated herein.

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For further information on technology, delivery terms and conditions and prices please contact your nearest
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Warnings
Due to technical requirements components may contain dangerous substances.
For information on the types in question please contact your nearest Infineon Technologies Office.

Infineon Technologies Components may only be used in life-support devices or systems with the express
written approval of Infineon Technologies, if a failure of such components can reasonably be expected to
cause the failure of that life-support device or system, or to affect the safety or effectiveness of that device
or system Life support devices or systems are intended to be implanted in the human body, or to support
and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health
of the user or other persons may be endangered.

Rev. 2.7 Page 12 2009-11-27

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