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PRODUCT INFORMATION
Information is current as of publication date. Products conform to specifications in accordance
with the terms of Power Innovations standard warranty. Production processing does not
necessarily include testing of all parameters.
1
BUV47, BUV47A
NPN SILICON POWER TRANSISTORS
AUGUST 1978 - REVISED MARCH 1997
thermal characteristics
PARAMETER MIN TYP MAX UNIT
RθJC Junction to case thermal resistance 1 °C/W
PRODUCT INFORMATION
2
BUV47, BUV47A
NPN SILICON POWER TRANSISTORS
AUGUST 1978 - REVISED MARCH 1997
+25 V
BD135 680 µ F
120 Ω 100 Ω
T
V1 V cc V=CC250 V
100 µ F
47 Ω
tp TUT
15 Ω
V1 100 Ω
82 Ω 680 µ F
BD136
tp = 20 µs
Duty cycle = 1%
V1 = 15 V, Source Impedance = 50 Ω
C 90% 90% E
IC
A - B = td
B - C = tr
B 10% 10% F
E - F = tf 0%
D - E = ts
A - C = ton
D - F = toff
dIB
≥ 2 A/µs
90% D dt
IB
I B(on)
A 10%
0%
I B(off)
PRODUCT INFORMATION
3
BUV47, BUV47A
NPN SILICON POWER TRANSISTORS
AUGUST 1978 - REVISED MARCH 1997
33 Ω
+5V
D45H11
BY205-400
BY205-400
33 Ω RB
(on)
1 pF
180 µ H
vcc
V Gen 2N2222
1 kΩ
68 Ω 0.02 µ F TUT
BY205-400
1 kΩ Vclamp = 400 V
+5V
5X BY205-400
270 Ω BY205-400 1 kΩ
2N2904
Adjust pw to obtain IC
D44H11
47 Ω
For IC < 6 A VCC = 50 V
V
For IC ≥ 6 A VCC = 100 V BE(off)
100 Ω
I B(on)
A (90%)
A - B = tsv IB Base Current
B - C = trv
D - E = tfi
E - F = tti
C 90%
B - E = txo
B 10%
V Collector Voltage
CE
D (90%)
E (10%)
I Collector Current
C(on)
F (2%)
NOTES: A. Waveforms are monitored on an oscilloscope with the following characteristics: tr < 15 ns, Rin > 10 Ω, Cin < 11.5 pF.
B. Resistors must be noninductive types.
PRODUCT INFORMATION
4
BUV47, BUV47A
NPN SILICON POWER TRANSISTORS
AUGUST 1978 - REVISED MARCH 1997
TYPICAL CHARACTERISTICS
IC = 4 A
IC = 2 A
3·0
10
2·0
1·0
1·0 0
0·1 1·0 10 0 0·5 1·0 1·5 2·0 2·5
IC - Collector Current - A IB - Base Current - A
Figure 5. Figure 6.
TC = 100°C
IC = 8 A
ICES - Collector Cut-off Current - µA
IC = 6 A
0·4 IC = 4 A
1·0
IC = 2 A
BUV47A
0·3
VCE = 1000 V
0·1
0·2 BUV47
VCE = 850 V
0·01
0·1
0 0·001
0 0·5 1·0 1·5 2·0 2·5 -80 -60 -40 -20 0 20 40 60 80 100 120 140
IB - Base Current - A TC - Case Temperature - °C
Figure 7. Figure 8.
PRODUCT INFORMATION
5
BUV47, BUV47A
NPN SILICON POWER TRANSISTORS
AUGUST 1978 - REVISED MARCH 1997
MAXIMUM FORWARD-BIAS
SAFE OPERATING AREA
SAP762AA
100
10
IC - Collector Current - A
1·0
0.1
tp = 100 µs
tp = 1 ms
tp = 10 ms BUV47
DC Operation BUV47A
0·01
1·0 10 100 1000
VCE - Collector-Emitter Voltage - V
Figure 9.
THERMAL INFORMATION
TCP762AD
1·0
50%
20%
10%
0·1
5%
2%
1%
0·01
0%
t1
duty cycle = t1/t2 t2
Read time at end of t1,
TJ(max) - TC = PD(peak) · ( )
ZθJC
Rθ JC
· RθJC(max)
0·001
10-5 10-4 10-3 10-2 10 -1
t1 - Power Pulse Duration -s
Figure 10.
PRODUCT INFORMATION
6
BUV47, BUV47A
NPN SILICON POWER TRANSISTORS
AUGUST 1978 - REVISED MARCH 1997
MECHANICAL DATA
SOT-93
3-pin plastic flange-mount package
This single-in-line package consists of a circuit mounted on a lead frame and encapsulated within a plastic
compound. The compound will withstand soldering temperature with no deformation, and circuit performance
characteristics will remain stable when operated in high humidity conditions. Leads require no additional
cleaning or processing when used in soldered assembly.
SOT-93 4,90
4,70
15,2 1,37
ø
4,1
14,7 3,95 1,17
4,0
4,15
16,2 MAX.
12,2 MAX.
31,0 TYP.
18,0 TYP.
1 2 3
1,30 0,78
1,10 0,50
11,1
2,50 TYP.
10,8
NOTE A: The centre pin is in electrical contact with the mounting tab. MDXXAW
PRODUCT INFORMATION
7
BUV47, BUV47A
NPN SILICON POWER TRANSISTORS
AUGUST 1978 - REVISED MARCH 1997
IMPORTANT NOTICE
Power Innovations Limited (PI) reserves the right to make changes to its products or to discontinue any
semiconductor product or service without notice, and advises its customers to verify, before placing orders, that the
information being relied on is current.
PI warrants performance of its semiconductor products to the specifications applicable at the time of sale in
accordance with PI's standard warranty. Testing and other quality control techniques are utilized to the extent PI
deems necessary to support this warranty. Specific testing of all parameters of each device is not necessarily
performed, except as mandated by government requirements.
PI accepts no liability for applications assistance, customer product design, software performance, or infringement
of patents or services described herein. Nor is any license, either express or implied, granted under any patent
right, copyright, design right, or other intellectual property right of PI covering or relating to any combination,
machine, or process in which such semiconductor products or services might be or are used.
PRODUCT INFORMATION