Senior Product Development Engineer (Burn-in, TPS) (Penang)

In Custom Logic Engineering (CLE), we offer exciting opportunities to develop technical depth and
organizational leadership in a fundamentally sound organization developing breakthrough test
methodology and solutions.

Responsibilities:
 Responsible for developing strategic solutions for burn-in (BI) stress flows and methodologies for
FPGA (Field Programable Gate Array) products for Qualification and HVM (High Volume
Manufacturing).
 Responsible to define burn-in hardware requirement based on burn-in hardware capability and
coverage definition based on FPGA product IP requirements.
 Responsible to ensure optimal stress application for products to meet reliability goal and define
stress plan based on use conditions and requirements for infant mortality screening.
 Responsible to perform BIB (Burn-in board) validation, BI Pattern development, and BI Test
Program development validation for qualification and HVM.
 Responsible to drive continuous stress coverage improvement and PHI (Product Health Indicator)
throughout the lifecycle of product.
 Responsible to perform BI Yield analysis and improvement plan to mitigate yield issue for
qualification and HVM.
 Responsible to develop strategic BI solution for MCP (Multi Chip Packages) products and working
closely with design and validation teams to define and implement the solution.
 Responsible to use methodical problem-solving techniques to resolve issues that arises during
stress implementation, validation, and deployment to HVM.
 Collaborate with Design, Development, QRE, and HVM Manufacturing team for product
qualification and HVM deployment.
                                                                                              
Requirements:
 Candidate must possess at least a BS/MS in Electrical Engineering or equivalent, with 5-7 years
of industry experience in IC Burn-in, IC Test, FA, or equivalent field.
 Strong knowledge and experience in programming (VB, C, Perl, Python), code debugging
and unit level test.
 Solid understanding of digital and analog circuit physic, stress method, test methods and
fault models.
 Strong knowledge and experience in yield analysis, root cause analysis, yield
improvement and problem-solving techniques.
 Good knowledge in Burn-in system (Hardware platform), and experience in burn-in qualification
(and DOE), and production deployment.