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IPACK2009-89370
SL Mean Standard
Tests
No (°/s) Deviation (°/s)
1 First Stationary baseline test 0.69 0.44
Fig.10. (a) First rotary baseline test result; (b) Mean of angular
2 Second Stationary baseline test 0.55 0.45 rate data with windowsize = 500.
SL Mean Standard
Tests
No (°/s) Deviation (°/s)
1 First Rotary baseline test 59.87 0.84
ACKNOWLEDGMENT
The authors would like to acknowledge the financial and
technical support of the Maryland Industrial Partnership
Program and TRX Systems, Inc. The authors would also like to
thank the CALCE Electronic Products and Systems Center for
the use of their laboratories in the conduct of this work.
REFERENCES
[1] Steven Nasiri, "A Critical Review of MEMS Gyroscopes
Technology and Commercialization Status," Inven Sense.
[2] B. Stark, “MEMS Reliability Assurance Guidelines for
Space Applications,” JPL internal document, JPL D-16460,
October 30, 1998
[3] Shcheglov,K.,etal.,"Temperature dependent characteristics
of the JPL silicon MEMS gyroscope, Proceedings 2000
IEEE Aerospace Conference, Big Sky, MT, USA, March
18-25, 2000, pp. 403-411.
[4] Jin-Won Joo and Sung-Hoon Choa, "Deformation Behavior
of MEMS Gyroscope Sensor Package Subjected to
Temperature Changes," IEEE Transactions on Components
and Packaging Technologies, VOL.30,No.2, June 2007
[5] P. Monajemi, P. J. Joseph, P. A. Kohl, and F. Ayazi, "A Low
Cost Wafer-Level MEMS Packaging Technology,"
International Conference on Microelectromechanical
Systems (MEMS 2005), pp. 634-637, 2005.
[6] Z.Szűcs, G.Nagy, S.Hodossy, M.Rencz, A.Poppe,
”Vibration Combined High Temperature Cycle Tests for
Capacitive MEMS Accelerometers”, Therminic 2006,
September 2006
[7] P. Qi Lin; Stern, "Analysis of a correlation for thermal
noise reduction in a mems gyroscope." In System Theory,
2002. Proceedings of the Thirty-Fourth Southeastern
Symposium on, pages 197{203, 2002.
[8] L.Felton, N.Hablutzel, W.Webster, K. Harney, “Chip scale
packaging of a MEMS accelerometer.” Electronics
Components and Technology Conference, vol. 1, pp. 869-
873, June 2004.
[9] M.I.Ferguson, D.Keymeulen, C.Peay, K.Yee, D.Li, “Effect
of Temperature on MEMS Vibratory Rate Gyroscope”, in
Proceedings of the IEEE Aerospace Conference, Big Sky,
March 2005.
[10] L.F.Wu, F.X.Zhang, “Effect of Temperature on the
Performance of a Silicon Micro-machined Gyroscope,”
Chinese Control and Decision Conference, 2008
[11] Donnelly M. K., Davis W. D., Lawson, J. R., and Selepak,
M. S., “Thermal Environment for Electronic Equipment
used by First Responders,” National Institute of Standards
and Technology, Gaithersburg, MD, NIST Technical Note
1474; January 2006.