By

JOYDEV PAL

Under
DR. TARUN KUMAR DEY
At

SUPREME KNOWLEDGE FOUNDATION GROUP OF INSTITUTION

Under

MAULANA ABUL KALAM AZAD UNIVERSITY OF TECHNOLOGY

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 THESIS REPORT ON
DESIGN AND FABRICATION OF PERFORATED SHIELD FOR PROTECTION FROM
EMI UNDER DR. TARUN KUMAR DEY

BY
JOYDEV PAL
ROLL NO:-25310515001
REGISTRATION NO:-152530410001

YEAR -2015-16
OF

MAULANA ABUL KALAM AZAD UNIVERSITY OF TECHNOLOGY

ROLL NO:-03
OF

SUPREME KNOWLEDGE FOUNDATION GROUP OF INSTITUTION

M.TECH 4TH (FINAL) SEMESTER
ELECTRONICS AND COMMUNICATION ENGINEERING

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 CERTIFICATE OF APPROVAL

This is to certify that the final year thesis “Dissertation” report entitled “DESIGN
AND FABRICATION OF PERFORATED SHIELD FOR PROTECTION FROM
ELECTROMAGNETIC INTERFERANCE GENERATED BY HORN
ANTENNA AT X BAND FREQUENCY” submitted by Mr. Joydev Pal, M.Tech
(ECE), 2nd year, 4th Sem., Roll No.: 25310515001, Reg.No:-152530410001 of
2015-2016,to the Department of Electronics and Communication Engineering,
Supreme Knowledge Foundation Group of Institutions, Mankundu, Hooghly,
W.B., for the fulfillment of the thesis of M.Tech course is bonafide record of
work carried out by him under my guidance and supervision.

Signature (HOD) Signature (Supervisor)

Mr. SOUMEN KHATUA Dr. TARUN KUMAR DEY

HOD (Dept . ECE), SKFGI Professor (Dept . ECE), SKFGI .

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 ACKNOWLEDGEMENTS

Any achievement requires the effort of many diligent persons and this thesis plan is
no difference. I thank my project guide Dr. Tarun Kumar Dey whose support and
encouragement was influential in accomplishing this assignment. I thank HOD
(ECE) Mr. Soumen Khatua who helps us by permitting the access of sophisticated
laboratories of microwave and antenna wave propagation for experiment of
hardware and software level. I thank Rahim Sir, Jayanta Sir, all lab assistants
whose aid made this project successful.

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Introduction: EMI is an unwanted disturbance that affects an electrical circuit due to
electromagnetic radiation emitted from an external source. The disturbance may interrupt,
obstruct, or otherwise degrade or limit the effective performance of the circuit. The
source may be any object, artificial or natural, that carries rapidly changing electrical
currents, such as an electrical circuit, the Sun or the Northern lights. EMI can be induced
intentionally for radio jamming, as in some forms of electronic warfare, or
unintentionally, as a result of spurious emissions and responses, inter modulation
products, and the like. It frequently affects the reception of AM radio in urban areas. It
can also affect cell phone, FM radio and television reception, although to a lesser extent.
Electromagnetic shielding is designed to limit the influence of electromagnetic fields and
radiation on a device or object. The process uses a barrier made from conductive material
containing electric charges of either positive or negative properties at the subatomic
particle level. Usually, this material is used to separate the electrical components on the
inside of the device from the outside world. Cables also utilize the concept to separate
wires from outside environments. When used to block radio frequencies, it is known as
RF shielding. The exact purpose of this shielding is to protect devices from the coupling
effect, the transfer of one form of energy to a device that uses a different form. This is
commonly caused by radio waves, electrostatic fields, and the full spectrum of
electromagnetic radiation. The full level of protection is based on the amount of reduction
to the electric and magnetic fields. This depends on the size, shape and orientation of the
shielding. No matter the standards in place, however, shielding cannot protect against
low-frequency magnetic fields. A variety of materials can be used as electromagnetic
shielding to protect an electrical device. Examples include ionized gas in the form of
plasma, metal foam with gas-filled pores, or simply sheet metal. In order for holes within
the shielding to be present, they must be considerably smaller than any wavelength from
the electromagnetic field. Length of perforation must be<λ/2, where λ is wave length of
the frequency. If the shielding contains any openings larger than the λ/2, it cannot
effectively prevent the device from becoming compromised. Household devices often use
a different shielding method due to the likelihood of exposure to electromagnetic fields.
Plastic enclosures usually use some sort of metallic ink consisting of copper or nickel in a
small particular state. This material can be sprayed onto the enclosure, producing a
conductive layer of metal that acts as protection. The main reason this layer works is due
to its close proximity to the grounding of the device.

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 Contents Page

Thesis topics 3

Acknowledgements 5

Literature Survey (Theory example of EMI and Shielding) 8

Theoretical Design Calculation with Formula 18

Practical Design Calculation 24

Conclusion 40

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Literature Survey (Theory example of EMI and Shielding)

Electromagnetic Interferences and Shielding

Objective:-

Aim is protection of human being and sophisticated systems from interaction with
electric and magnetic fields. Main solutions are in shielding i.e. to apply protective
measures at the victim side. Interference in the form of unwanted waves or pulses
may be controlled by grounding, shielding, or filtering. But it is difficult to
minimize or eliminate the undesirable waves or pulses by grounding or filtering.
Shielding is the best method of reducing electromagnetic interaction.

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 NEAR FIELDS AND FAR FIELDS

The characteristics of a field are determined by the source (the antenna), the media
surrounding the source, and the distance between the source and the point of
observation. At a point close to the source, the field properties are determined
primarily by the source characteristics. Far from the source, the properties of the
field depend mainly on the medium through which the field is propagating.
Therefore, the space surrounding a source of radiation can be broken into two
regions, as shown in figure. Close to the source is the near or induction field. At a
distance greater than the wavelength (λ) divided by 2π (approximately one sixth of
a wavelength) is the far or radiation field. The region around l/2π is the transition
region between the near and far fields.

The ratio of the electric field (E) to the magnetic field (H) is the wave impedance.
In the far field, this ratio equals the characteristic impedance of the medium (e.g.,
E/H=Z0=377 Ω for air or free space). In the near field, the ratio is determined by
the characteristics of the source and the distance from the source to where the field
is observed. If the source has high current and low voltage (E/H < 377 Ω), the near
field is predominantly magnetic. Conversely, if the source has low current and high
voltage (E/H > 377), the near field is predominantly electric.

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Electromagnetic interference (EMI)

EMI is an unwanted disturbance that affects an electrical circuit due to

electromagnetic radiation emitted from an external source. The disturbance may
interrupt, obstruct, or otherwise degrade or limit the effective performance of the
circuit. The source may be any object, artificial or natural, that carries rapidly
changing electrical currents, such as an electrical circuit, the Sun or the Northern
lights. EMI can be induced intentionally for radio jamming, as in some forms of
electronic warfare, or unintentionally, as a result of spurious emissions and
responses, intermediation products, and the like. It frequently affects the reception
of AM radio in urban areas. It can also affect cell phone, FM radio and television
reception, although to a lesser extent.

RADIATED INTERFERENCE

Narrow band interference usually arises from intentional transmissions such as

radio and TV stations, pager transmitters, cell phones etc. It is a high frequency
operation. Broad band interference usually comes from incidental radio frequency
culprits. These includes electric power transmission lines, electric motors etc. It is
a low frequency operation.

CONDUCTED INTERFERENCE

Power supply Line Impedance Device Under Test

Stabilization Network

Conducted Emission measurement using LISN

Conducted electromagnetic interference is caused by the physical contact of the

conductors as opposed to radiated EMI.A Line Impedance Stabilization Network
(LISN) is normally connected between the electric power supply mains and the
DUT, as shown in Figure.The purpose of the LISN is to present a defined,
standard impedance to the DUT power input terminals at high frequencies so
that the power supply line impedance variations are sufficiently isolated from the
DUT. Also the LISN is used to filter out any incoming noise on the main power
supply so that only clear power is provided to the DUT.

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Electromagnetic compatibility (EMC)

EMC is the branch of electrical sciences which studies the unintentional

generation, propagation and reception of electromagnetic energy with reference to
the unwanted effects (Electromagnetic Interference, or EMI) that such energy may
induce. The goal of EMC is the correct operation, in the same electromagnetic
environment, of different equipment which uses electromagnetic phenomena, and
the avoidance of any interference effects. In order to achieve this, EMC pursues
two different kinds of issues. Emission issues are related to the unwanted
generation of electromagnetic energy by some source, and to the countermeasures
which should be taken in order to reduce such generation and to avoid the escape
of any remaining energies into the external environment. Susceptibility or
immunity issues, in contrast, refer to the correct operation of electrical equipment,
referred to as the victim, in the presence of unplanned electromagnetic
disturbances. Interference, or noise, mitigation and hence electromagnetic
compatibility is achieved primarily by addressing both emission and susceptibility
issues, i.e., quieting the sources of interference and hardening the potential victims.
The coupling path between source and victim may also be separately addressed to
increase its attenuation.

CLASSIFICATION OF EMI BASED ON CAUSES AND PROBLEM :-

1) INTRA SYSTEM EMI

EMITTERS SUCCEPTORS
POWER SUPPLY RELAYS
RADAR TRANSMITTERS RADAR RECEIVERS
CAR IGNITION SYSTEMS CAR RADIO RECEIVERS
FLUORESCENT LIGHT ORDNANCE
MOBILE TRANSMITTERS MOBILE RECEIVERS

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 2) INTER SYSTEM EMI

EMITTERS SUCCEPTORS
COMPUTERS TV SETS
RADAR TRANSMITTERS AIRCRAFT NAVIGATION SYSTEM
LIGHTNING RADIO RECEIVER
FLUORESCENT LIGHT INDUSTRIAL CONTROL
AIRCRAFT TRANSMITTERS SHIP RECEIVERS

Effects of EMI

Momentary disturbance in TV and radio reception due to operation of mixer-

grinder/electric shavers/a passing vehicles etc
Reset of computers and loss of data.
Change of setting of status of control equipments.
Failure of pace maker implemented in a patient due to a „walkie talkie‟
Malfunctioning of flight controlling system due to use of laptop by
passenger.
Biological hazards.

Sources of EMI

The sources of EMI can be broadly classified into two groups

Natural sources of EMI
Example: lightning
Manmade sources of EMI
Example: commercial radio and telephone communications
In specific we can classify as
Functional: EMI can originate from any source designed to generate
electromagnetic energy and which may create interference as a normal part
of its operation
Incidental: EMI can originate from manmade sources .These sources are not
designed specifically to generate electromagnetic energy but which do in
fact cause interference.
Natural: EMI can be caused by natural phenomena, such as electrical
storms, rain particles, solar and interstellar radiation.

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EMI CONTROL TECHNIQUES

To control or suppress EMI, the three common means employed in the

design process are
Grounding
Shielding
Filtering

Grounding:-

Grounding is the establishment of an electrically conductive path between

two points to connect electrical and electronic elements of a system to one
another or to some reference point, which may be designated as the ground.
An ideal ground plane is a zero-potential ,zero-impedance body that can be
used as a reference for all signals in associated circuitry and to which any
undesired current can be transferred for the elimination of its effects.
Three Types of Grounding:-

1) Single-Point Grounding,

2) Multipoint Grounding,

3) Hybrid Grounding

Bonding is the establishment of a low-impedance path between two metal

surfaces. Grounding is a circuit concept, while bonding denotes the physical
implementation of that concept.Bonds provide protection from electrical
shock, power circuit current return paths, and antenna ground plane
connections, and also minimize the potential difference between the devices.
They have the ability to carry large fault current.

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Filter :-
An electrical filter is a network of lumped or distributed constant resistors,
inductors, and capacitors that offers comparatively little opposition to certain
frequencies, while blocking the passage of other frequencies.
Filter provides the means whereby levels of conducted interference are
substantially reduced. The most significant characteristic of a filter is the
insertion loss it provides as a function of frequency.
Insertion loss is defined as
IL=20 log V2/V1

Where V1 is the output voltage of a signal source with the filter in the
circuit, and V2 is the output voltage of the signal source without the use of
the filter.

The methodologies used to prevent EMI are:-

Suppress the emissions at source point, best method to control EMI.

Make the coupling path as inefficient as possible.
Make the receiver less susceptible to emission.

COUPLING MECHANISM

The basic arrangement of noise source, coupling path and victim, receptor or
sink is shown in the figure below. Source and victim are usually electronic
hardware devices, though the source may be a natural phenomenon such as
a lightning strike, electrostatic discharge (ESD) or, in one famous case,
the Big Bang at the origin of the Universe.
The basic arrangement of noise source, coupling path and victim, receptor or
sink is shown in the figure below. Source and victim are usually electronic
hardware devices, though the source may be a natural phenomenon such as
a lightning strike, electrostatic discharge (ESD) or, in one famous case,
the Big Bang at the origin of the Universe.

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 There are four basic coupling mechanism :
1. Conductive
2. Capacitive
3. Magnetic/Inductive
4. Radiative

Conductive coupling:

Conductive coupling occurs when the coupling path between the source
and the receptor is formed by direct contact with a conducting body, for
example a transmission line, wire, cable, PCB trace or metal enclosure.

Conduction modes:
Conducted noise is also characterized by the way it appears on different
conductors:

Common mode or common impedance coupling:

Noise appears in phase (in the same direction) on two conductors.

Differential mode coupling:-

Noise appears out of phase(in the opposite direction)on two conductors.

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 Capacitive coupling:

Capacitive coupling occurs when a varying electrical field exists between

two adjacent conductors typically less than a wavelength apart, inducing a
change in voltage across the gap.

Inductive coupling:

Inductive coupling occurs where the source and receiver are separated by a
short distance (typically less than a wavelength). Strictly, "Inductive
coupling" can be of two kinds, electrical induction and magnetic induction.
It is common to refer to electrical induction as capacitive coupling, and to
magnetic induction as inductive coupling.

Magnetic coupling:

Magnetic coupling (MC) occurs when a varying magnetic field exists between
two parallel conductors typically less than a wavelength apart, inducing a
change in voltage along the receiving conductor.

Radiative coupling:

Radiative coupling or electromagnetic coupling occurs when source and

victim are separated by a large distance, typically more than a wavelength.
Source and victim act as radio antennas: the source emits or radiates
an electromagnetic wave which propagates across the open space in between
and is picked up or received by the victim.

ADVANTAGES OF EMC STANDARDS

The advantages are:

Compatibility, reliability and maintainability are increased.
Design safety margin is provided.
The equipment operates in EMI scenario satisfactorily.

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Structure of Shield :-

1. Shielding

2. Shielding effectiveness

3. Equations of SE

4. Absorption Loss

5. Reflection Loss

6. Multiple Reflection

7. Total effectiveness

8. Multilayer Shield

9. Practical Experimental Results

1 SHIELDING

Shielding is the primary means of protection of victim devices including bio-

objects when the source of interference cannot be controlled. Creation of shield
may be done in several ways like :

1. Spatial separation,

2. Orthogonalization ; and

3. Metal barrier.[1]

Spatial separation:

When the distance of the victim or susceptor is too large from the source or culprit,
then automatically interference is eliminated.

Orthogonalisation :-

Here the source and victim are cross- polarized.

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Metal barrier:-

Metal barrier may function in two ways.

Theoretical Design Calculation with Formula

2 SHIELDING EFFECTIVENESS

So shields may be in the form of partitions and boxes as well as in form of cable
and connector shields. Shields types include solid, non-solid (screen) and braid
with cables. A shield is characterized by its shielding effectiveness. The shielding
effectiveness is the number of decibels (dB) by which the shield reduces the field
strength by using the shield.

Shield –effectiveness depends on the following:

1. Material of the shield,

2. Thickness of the shield,

3. Frequency of the incident wave,

4. Distance of the shield from the culprit

5. Quantity and shape of shield-discontinuities, if any.[2]

The attenuation offered by a shield comes from these interfaces:-

1. The impedances of air and metal are different. So the incident energy is
reflected by the surface of the shield. This reflection depends on the
difference in impedances.

2. A part of energy is absorbed by material of the shield.

3. A part of energy may reach the opposite face of the shield. The impedance-
mismatch between air and metal occurs there. So some of the energy is
reflected back to the shield.

4. The shield may be made of metals, like Silver, Copper, Aluminium,

conducting polymer or wire mesh.[3]

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When an EMI problem of known potential is identified to be generated from
electromagnetic fields emitted from equipment or interacting with the equipment
or biological objects, suppression or attenuation of these fields is done by a
conductive barrier or shield. The shield may be simple and cost-effective method
for solving the EMI problem.

3 SHIELDING EFFECTIVENESS EQUATION

The shielding effectiveness is defined as

SE=10

where the incident power density is the power density at a measuring point before
a shield is installed and the transmitted power is the power density at the same
point after the shield is in place.

Incident wave Transmitted power

Reflected wave

Metallic Shield

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EXAMPLE OE SE IN POWER

Field strength=10 volts/meter Field strength=0.3 volts/meter

Metallic Shield

The SE would be the following:

SE=20 =29.6 dB

4 ABSORPTION LOSS (AdB):-

All of the forward and reverse waves propagating within the conducting shield are
significantly attenuated according to the attenuation constant for the conducting
shield. This attenuation of the wave corresponds to the loss of wave energy in the
form of heat. The complex valued propagation constant (γ ) within the conducting
shield is given by

γ =√

AdB = 20 ,

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Skin Depth (δ)
Skin effect is the tendency of an alternating electric current (AC) to become
distributed within a conductor such that the current density is largest near the
surface of the conductor, and decreases with greater depths in the conductor. The
electric current flows mainly at the "skin" of the conductor, between the outer
surface and a level called the skin depth. The skin effect causes the effective
resistance of the conductor to increase at higher frequencies where the skin depth is
smaller, thus reducing the effective cross-section of the conductor. The skin effect
is due to opposing eddy currents induced by the changing magnetic field resulting
from the alternating current. At 60 Hz in copper, the skin depth is about 8.5 mm.
At high frequencies the skin depth becomes much smaller. As high frequency
microwave passes through conductive medium, its amplitude is attenuated
according to the factor , where α is the attenuation constant of the material

Skin depth= δ= , , at high frequency, skin depth should be considered.

√
Skin depth (δ) is the distance up to which field penetrates into material of shield. It
is a number where the field reduces to (37%) of the impinging value.[4]

Absorption Loss=AdB= 1.314 √ t

Where t = thickness of shield

δ = skin depth
f = frequency of culprit/source
= Relative Permeability
ζ = Relative Conductivity
ε = Permittivity
γ = propagation constant
α = attenuation constant

5 Reflection loss (RdB):-

A portion of the incident wave is reflected from interface. The amplitude of
the reflected wave fields are equal to those of incident wave fields multiplied
by the reflection coefficient for waves moving from air into the conductor.

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 RdB=168+10
Where f = frequency of culprit/source
= Relative Permeability
ζ = Relative Conductivity

6 Multiple-Reflection (BdB):-
If the barrier thickness is not much greater than a skin depth, as was
assumed, then the reflections and transmissions may be important. This is
particularly true for magnetic fields, since the primary transmission occurs
at the first boundary and thus these multiple reflections can be more
significant for magnetic
field shielding.

BdB=20 = loss due to multiple reflection.

RE= 322+10 , reflection loss for electric field.

RM(dB) =14.5 + 10 / ) , reflection loss for magnetic field.

RP(dB)=168+10 , reflection loss for plane wave.

A=1.34√ t , absorption loss.

Where t = thickness of shield

δ = skin depth
f = frequency of culprit/source
= Relative Permeability
ζ = Relative Conductivity

ABSORPTION AND REFLECTION OF METAL

MATERIAL σr μr A~μ r σ r R~σ r/μ r
SILVER 1.05 1 1.05 1.05
COPPER 1 1 1 1
STAINLESS STEEL(430) 0.02 500 10 4X10-5
STEEL(SAE 1045) 0.1 1000 100 1x10-4

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7 TOTAL EFFECTIVENESS (SEdB)

Shielding effectiveness depends on two items: - (i) reflection and (ii) absorption.
None of these are linked with potential. So the shield does not require grounding.

Each time any electromagnetic wave strikes an impedance discontinuity, (i) a part
of its energy passes through the discontinuity and (ii) rest of its energy is reflected.
At the first discontinuity a part of incident energy enters into the shield. At the
second discontinuity a part of the energy is reflected back to the first discontinuity.
These process continues. So multiple reflection occurs. A correction term
corresponds to that comes into the shielding effectiveness. This is B. When
absorption loss is greater than 15dB, then B is ignored. The value of B for A<15dB
is B=20log10{1-((k-1)/(k+1))2x10-A/10} dB where K=ω/πr for low impedance
fields and rectangular apertures,

K=D/3.682 r for low impedance fields and rectangular apertures

K=j 6.69 X 10-5 fw for plane waves and rectangular apertures,

K=j 5.79 X 10-5 fd for plane waves and circular apertures,

r=source to shield distance,

d=depth of opening,

w=width of opening perpendicular to electric field,

D=diameter of opening and

f=frequency.

r,d,w and D are in cm and f is in MHz.[2]

when the source is at a large distance from the shield in discontinuity

SEdB =(RdB + AdB +BdB)= total shielding effectiveness.

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8 MULTILAYER SHIELD

A complete structure offering high shield for both magnetic and electric fields may
be prepared by combining (i) a highly conductive outer layer and (ii) a highly
magnetic inner layer.The absorption obtained results from the total shield material
thickness. [5]The reflection occurs at each surface of each shield. So a greater
amount of shielding effectiveness is achieved from the multiple shields. But this
requires complexity in mechanical design. The shield material surfaces should not
intimate with one another. Small spaces should be kept in between consecutive
shield materials. The spaces are filled up with air or dielectric material. The
increase in shielding occurs with the use of multiple layers of shields. For multiple
shields the interactions between each of the two layer-junctions cause more
absorption loss compared to a single summing of absorption in each layer. Actually
a completely new material is obtained with average electrical properties. The
permittivity(є) and permittivity (µ) are modified.

The permittivity = є = є-j є”= є‟- ζ/jω є0 ,

Where є‟=relative permittivity,
є0=absolute permittivity,
ζ=conductivity
ω=angular frequency.
For a good conductor , ζ is high and є”= -j ζ/w є0. So conductivity may
be averaged.
For very thin flims, average conductivity, σav=(σ1t1+σ2t2)/(t1+t2),
Where ζ1 and ζ2 are the conductivities of the layers having thickness t1
and t2 respectively.
Similarly average permeability,

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 µav=( µ1 t1+ µ2 t2)/(t1+t2),
where µ1 and µ2 are the permeabilities of the films of thickness t1 and t2
respectively.
The following table compares the shielding properties of single and
mixed materials:

ζr µr R(dB) A(dB) A+R dB

Cu 1 1 138 1 139
Permalloy 0.027 2x104 80 24.5 104.5
Mixed (Cu & 0.5 104 95 74.6 164.5
permalloy )

DESIGN OF SHIELD :-

Perforated shield [length of each sides of small perforation (perforation)= 9.4mm,

Maximum length(diagonal of small square) of perforation=1.3 cm],

MATERIAL USED IN SHIELD:-

304 GRADE STAINLESS STEEL USED FOR MAKING THIS PERFORATED

GRID TYPE SHIELD.THIS 304 GRADE STAINLESS STEEL IS COMPOSED
OF CHOROMIUM 18% AND NICLEL 8%.

Components of 304 grade Type 304

Carbon 0.08% max
Manganese 2.00% max
Phosphorus 0.045% max
Sulfur 0.030% max

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Silicon 1.00%max
Chromium 18.00-20.00
Nickel 8.00-10.50%
Iron Balance

Practical Design Calculation

When choice of frequency f=11.1 Ghz, then ,Wave length(λ)=2.7cm(λ= ) so,

diagonal of each small perforated shield must be <λ/2, by calculation diognal
d=13.292 mm, so length of each small square(perforation)= 9.4mm for shielding of
microwave frequency from 11.1 Ghz to subsequent lower frequencies. In
laboratory practical microwave source of 10.525 Ghz taken as culprit. USB
Average Power Sensor Panel U2000A (Agilent) taken for measurement of received
power to the receiver. Here the U2000A (Agilent) has a capacity of measurement
range of 10Mhz to 18 Ghz frequency.

1. Calculations for perforated(wire mesh) shields:

S.E = k – 10
Where k =20 for rectangular aperture, k =40 for circular aperture. Here our area of
interest is rectangular aperture. So k =20.
L is the largest dimension of aperture =1.3 cm(diagonal of small perforation =1.3
cm)
n is the number of apertures = (28*29) = 812
So the S.E. = 20 – 10 ) =- 27.86 dB

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EQIUIPMENT USED FOR MEASURING SHIELDING EFFECTIVENESS:-

1)USB Average Power Sensor Panel U2000A (Agilent) taken for measurement
of received power to the receiver. Here the U2000A (Agilent) has a capacity of
measurement range of 10Mhz to 18 Ghz frequency

2). Horn Antenna used in laboratory for microwave frequency source of 10.525
Ghz . Horn Antenna used as transmitter and receiver. Diagonal length of Horn
aperture is 12.3 cm.

3) DRO Transmitter (10.525 Ghz).

4) Shields (304 grade stainless steel)

5) Stands

6) Power cord

7) Directional Coupler 10 dB

8) Software for USB Average Power Sensor Panel U2000A

~ 27 ~
9 Practical Experimental Results :-

1.RESULTS FOR NEAR FIELD USING THE POWER SENSOR

PANEL(U2000A)

Distance between Tx and Rx=59 cm, Diagonal distance of Pyramidal

Horn=12.3 cm, Smin=106 cm

RESULTS FOR CHANGING THE DISTANCE BETWEEN Rx AND

SHIELD (WITH SHIELD)
DISTANCE DISTANCE
SL BETWEEN Rx BETWEEN Tx POWER POWER IN
NO AND AND IN dBm MICROWATT
SHIELD(cm) SHIELD(cm)
1 31 28 -11.6 68
2 30 28 -11.5 71
3 29 28 -12.7 53.5
4 28 28 -13 49

RESULTS FOR CHANGING THE DISTANCE BETWEEN Tx AND

SHIELD (WITH SHIELD)
DISTANCE DISTANCE
SL BETWEEN Rx BETWEEN Tx POWER IN POWER IN
NO AND AND dBm MICROWATT
SHIELD(cm) SHIELD(cm)
1 31 28 -11.6 68
2 31 27 -13.15 48.9
3 31 26 -12.3 58
4 31 25 -12.77 54

~ 28 ~
RESULTS FOR CHANGING THE DISTANCE BETWEEN Rx
AND Tx
BY MOVING THE Rx only (WITHOUT SHIELD)
DISTANCE
SL POWER IN POWER IN
BETWEEN Rx
NO dBm MICROWATT
AND Tx(cm)
1 59 -7.99 158
2 58 -7.96 160
3 57 -7.75 167
4 56 -7.82 165

RESULTS FOR CHANGING THE DISTANCE BETWEEN Rx

AND Tx
BY MOVING THE Tx only (WITHOUT SHIELD)
DISTANCE
SL POWER IN POWER IN
BETWEEN Rx
NO dBm MICROWATT
AND Tx(cm)
1 59 -7.99 158
2 58 -8.18 152
3 57 -8 158
4 56 -7.99 159

Distance between Tx and Rx=56 cm

RESULTS WITH ROTATION(WITH SHIELD)
DISTANCE
SL POWER IN POWER IN
DEGREE BETWEEN Rx
NO dBm MICROWATT
AND Tx(cm)
1 0 56 -12.77 54
2 5 56 -12.8 52
3 10 56 -14.59 34.6
4 15 56 -17.8 16.5

~ 29 ~
 RESULTS WITH ROTATION(WITHOUT SHIELD)
DISTANCE
SL POWER IN POWER IN
DEGREE BETWEEN Rx
NO dBm MICROWATT
AND Tx(cm)
1 0 56 -7.99 159
2 5 56 -8.5 138.9
3 10 56 -10.6 86.8
4 15 56 -13.76 42

2.RESULTS FOR FAR FIELD USING THE POWER SENSOR

PANEL(U2000A)

Distance between Tx and Rx=193 cm

RESULTS FOR CHANGING THE DISTANCE BETWEEN Rx

AND SHIELD (WITH SHIELD)
DISTANCE DISTANCE
POWER IN
SL BETWEEN Rx BETWEEN Tx POWER IN
MICROWA
NO AND AND dBm
TT
SHIELD(cm) SHIELD(cm)
1 153 40 -21.9 6.3
2 148 40 -21.5 6.9
3 143 40 -21.2 7
4 138 40 -21.2 7.7
5 128 40 -20.4 8.2
6 118 40 -20.4 8.5
7 98 40 -19.16 11

~ 30 ~
 RESULTS FOR CHANGING THE DISTANCE
BETWEEN Rx AND Tx
BY MOVING THE Rx only (WITHOUT SHIELD)
DISTANCE POWER IN
SL POWER
BETWEEN Rx MICROWA
NO IN dBm
AND Tx(cm) TT
1 193 -17.7 16.5
2 188 -17.6 17.3
3 183 -17.3 18
4 178 -17.6 17
5 168 -16 21.1
6 158 -17.2 18.5
7 138 -15.5 28

3.RESULTS FOR FAR FIELD MANUALLY(BY CHANGING DISTANCE

BETWEEN Tx AND Rx)

POWER IN POWER IN
DIATANCE
SL MICROdB MICROdB
BETWEEN Tx
NO WITHOUT WITHOUT
AND Rx
SHIELD SHIELD
1 5ft 4.5 inch 75.8 71.7
2 4ft 7 inch 74.3 70.7
3 3ft 71.1 69.4

~ 31 ~
Analysis:-

Generally

 S.E =(< 20 dB ) is considered as nominal shielding

 S.E = (20 to 80 dB) is considered acceptable shielding value
 S.E = (80 to 120 dB) is taken above the average shielding
Theoretically S.E. has the value -27.86 dB but practically we get less value than
that. The practical results are lower than the theoretical values obtained because
interferences from outer sides come to the receiver as well as the original source.
The room used for the experiment was not Anechoic Chamber so reflection and
absorption of all other interferences may also encounter the results. Also the room
was not perfect vacuum so room wall also absorb and reflect. We use 10.525 GHz
as a source and it consist of harmonics of similar frequencies which also
encounter as additive or subtractive to the original value. Environmental factors
are also not ideal to the point so variation may take place. The theoretical shield is
infinite in nature but practically infinite shield is not possible, so here we are using
finite length shield which may differ the theoretical values. Also we desire to do
the experiment in future in a close room like anechoic chamber or semi anechoic
chamber. We also prefer thin wire instead of thick wire in future experiments so
that we can use the shield for the use of human beings. Multilayer shield is also
our future choice of experiment as it will give us better result than the single
layer.Instead of using Solid Shield we prefer here perforated shield because of its
low cost and less weight.

~ 32 ~
References :-

[1] The Role of Shielding in Interference Control-Edward F. Vance and Werner

Graf, IEEE Trans. ON EMC, Volume-30, No.3, Pag294-297, August 1988
[2] Principles of Electromagnetic Compatibility, Chapter-6 Shielding-Bernhard
Keiser, ARTECH, Page-111-140
[3] Electromagnetic Compatibility by Design, Chapter-Shielding-Oren Hartal, R
& B Enterprise, USA, Page-161-218
[4] Technique for Measuring the Electromagnetic Shielding Effectiveness of
Materials.Part I :- Far Field Source Simulation-Perry F. Wilson, Mark T. MA. And
J.W.Adams, IEEE Trans. On EMC, Volume 30,No-3,Page-239-200. August-1988

[5] Micro engineering Multilayer Flims for Shielding Application-W.J.Biter,

P.J.Jamnicky and W.Cobum, Item 1995, Page-128-132 & 265.

[6] U2000A 10 MHz - 18 GHz USB Power Sensor guide manual page 4

~ 33 ~
EXPERIMENT PICTURES:-

~ 34 ~
USB Average Power Sensor Panel U2000A (Agilent)

USB Average Power Sensor Panel U2000A (Agilent)

~ 35 ~
Key Features & Specifications of USB Average Power Sensor Panel U2000A
(Agilent) [6]

 Frequency range of 10 MHz to 18 GHz

 Wide dynamic range of -60 to +20 dBm
 Internal zeroing capability to eliminate external calibration
 High measurement speed of up to 250readings/second
 Support internal and external trigger measurements
 Display power measurements on a PC or other Keysight‟s instruments
 Internal triggering and trace display capability

Description USB Average Power Sensor Panel U2000A (Agilent):-

Keysight U2000 Series USB power sensors make setup and measurement fast
without the need of a power meter, just plug the USB sensor cable to the PC, you
can control the USB power sensor with the FREE Power Panel (N1918A)
software.
The U2000 Series is also supported by the Keysight BenchVue software.
BenchVue makes it easy to control your power meter to log data and visualize
measurements in a wide array of display options without any programming.

~ 36 ~
~ 37 ~
~ 38 ~
~ 39 ~
~ 40 ~
~ 41 ~
CONCLUSION

Our goal to measure the shielding effect using perforated shield has been
successfully done in practical laboratory experiments. Various differences in
power dissipation due to screening effect observed. The main thing observed here
that the theoretical and practical value is in proximity. We use finite area of shield
in practical situations but theoretically shield is not finite. So difference of
theoretical and practical result can happen. It was very interesting observation in
laboratory that the shield practically works very successfully as our supposed
calculations follows.EMC has developed into a very interdisciplinary subject. In
Laboratory we are planning to design perforated shielding to prevent
objects/electrical or electronics devices from microwave frequency generated by
HORN Antenna (diagonal aperture=12.3 cm) of X band frequency ( 9 GHz to 12
GHz). I practically use 10.525 GHz frequency and above near about 11.1 GHz
frequencies. Many problems and topics in this field are however still open for
further research. In future our planning of research is related to multilayer shield
composed of copper and stainless steel both. As the room was not perfect vacuum
so room wall also absorb and reflect. So that reflection and absorption can change
results from perfect theoretical aspects. The space used for the experiment was not
Anechoic Chamber, so reflection and absorption of all other interferences may also
encounter the results. Also the room was not ideal void so area wall also absorb
and reflect. There is aerial need for further research on several aspects of EMC.
Also we are longing for the experiment in future in anechoic chamber or semi
anechoic chamber. We also favor thin wire instead of thick wire in future
experiments so that we can use the shield for the use of human beings. Multilayer
shield is also our future choice of experiment as it will give us better result than the
single layer. These experiments include depiction of interferences, measurements
techniques, sophisticated hardware and software for measurement of shielding
effects.

~ 42 ~