Microelectronics

Introduction

2019/9/12

Jieh-Tsorng Wu

National Chiao-Tung University

Department of Electronics Engineering
 Outline
1. Electronic and Electrical Engineering
2. Signal Processing and Electronic Circuits
3. Analog and Digital Circuits
4. Integrated Circuits

1. Introduction 2 Microelectronics; Jieh-Tsorng Wu

 Electronic and Electrical Engineering

1. Introduction 3 Microelectronics; Jieh-Tsorng Wu

 A Radio System

 At the transmitter (TX), audio signal is converted to electro-magnetic (EM) wave.

 At the receiver (RX), the EM signal is received and converted to audio signal.

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 A Radio Transmitter

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 An Electronic Radio Transmitter

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 A Radio Receiver

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 A Electronic Radio Receiver

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 An Image Sensor

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 Analog-Digital Systems

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 Analog-to-Digital Converter (ADC)

Do = b0 20 + b1 21 + b2 22 +  + bN −1 2 N −1

An ADC samples its analog input and then quantizes (digitizes) the magnitude of the
sample into digital value.

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 CMOS Logic Gates

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 Analog or Digital?

 A digital signal operating at very high frequency is very “analog”.

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 Integrated Circuits

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 CMOS Technology

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 Fabrication of Integrated Circuits on Silicon

Oxidation

Lithography &
Etching

Ion Implantation

Annealing &
Diffusion

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 Optical Lithography

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 Lithography for Integrated Circuits

(a) Resist Coating (c) Development

(SiO2)
(b) Exposure
(d) Etching and Resist Strip
Deep Ultraviolet Light
Optical Photomask with
Lens system opaque and
clear patterns

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 Interconnect – The Back-End Process

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 An IC Fabrication Example (1)

Ion
Wafer Implantation

Oxidation Annealing &

Diffusion

Al
Sputtering

Lithography

Lithography
Etching

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 An IC Fabrication Example (2)

Metal
Etching

CVD
Back-Side
Nitride
Metallization
Deposition

Lithography
and Etching

Back-Side
Milling

Dicing, wire bonding,

and packaging

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 MOSFET Scaling Rule by Robert Dennard

Parameter Symbol Scaling

Gate Length L 1/a

Gate Width W 1/a

Oxide Thickness tox 1/a

Gate Capacitance CG 1/a

Substrate Doping Na a2

Voltage VDD 1/a

Current I 1/a

Transit Frequency fT a

Power P 1/a2

Power-Delay P x ∆t 1/a3

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 Technology Scaling

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 Moore’s Law

The number of transistors on integrated circuits doubles

approximately every two years.
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 Microprocessors

Intel 4004. 1971. Intel 8080. 1974. Intel 8086-8088. 1978.

Intel 80386. 1985. Intel Pentium. 1993. Intel Pentium III. 1999.

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 Modern Application Processors

 Apple A8, 2014.  Apple A9, 2015.

 20 nm CMOS. Area: 89 mm2.  16 nm FinFET. Area: 104.5 mm2.
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 Modern Application Processors

 Apple A10 Fusion, 2016.  Apple A11 Bionic, 2017.

 16 nm FinFET. Area: 125 mm2.  10 nm FinFET. Area: 87.66 mm2.
 3.3 billion transiistors.  4.3 billion transistors.

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 Radio Modem Chipset

 LTE+GPS transceiver.  Baseband and application processor.

 28 nm CMOS.

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 Analog-Digital Mixed-Signal Chips

 802.11a/b/g/n/ac WLAN SoC.  10 GBASE-T Analog Front-End

 40 nm CMOS. Area: 46 mm2.  40 nm CMOS. Area: 15.5 mm2.
 ISSCC 2014, S20.5.  ISSCC 2014, S8.5.

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 Beyond Moore’s Law

SoC (System on a Chip) SiP (System in a Package) 3D IC

3D IC
3D SiP

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 Digital Cloud and Communication Network

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 Sensors and Integrated Circuits

Audio Video MEMS Biomed

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