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Microelectronics Reliability 92 (2019) 96–105

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Microelectronics Reliability
journal homepage: www.elsevier.com/locate/microrel

Prognostics of IGBT modules based on the approach of particle filtering T


a,⁎ a,b
Yizhou Lu , Aris Christou
a
Department of Mechanical Engineering, University of Maryland, College Park, MD, USA
b
Department of Material Science and Engineering, University of Maryland, College Park, MD, USA

A R T I C LE I N FO A B S T R A C T

Keywords: In the present work, a prognostic model combining model-based and data-driven techniques was developed and
Prognostics validated for dynamic life prediction of insulated gate bipolar transistor (IGBT) modules under power cycling
RUL prediction conditions. The prognostic model integrates both anomaly detection based on semi-supervised machine learning
IGBT and remaining useful life (RUL) estimation based on the particle filter (PF) approach. A range of healthy failure
Particle filter
precursor data was predefined as labeled training data and machine learning techniques including principal
Sequential importance resampling
Anomaly detection
component analysis (PCA) for feature extraction, and k-means clustering for anomaly detection were im-
plemented. The clustering technique partitioned the predefined healthy data points into healthy clusters using a
singular-value-weighted distance measure. The safety margin between a healthy distribution of distances be-
tween healthy data points within each cluster, and a test distribution of distances between a test data point and
all the healthy data points within each cluster, was calculated to determine the affiliation of a test data point to
the healthy cluster. A failure precursor process model incorporating the crack propagation physics law, the Paris
Equation, and a measurement model was developed facilitating a sampling importance resampling (SIR) filter
for RUL estimation. The developed prognostic model was validated on the degradation data from literature
sources reporting IGBT power cycling test results to demonstrate its robustness.

1. Introduction top and the bottom layer made of copper, and the intermediate layer
made of a ceramic. The substrate is soldered to a base plate, which is
The applications of power electronic converters can be found in usually attached to a heat sink. During operation, the loading condi-
multiple industrial sectors which require high levels of reliability [1]. tions and consequently the temperature profile of power converters are
Power electronic modules (PEMs) are the critical components of power often highly dynamic [6], and heat generated from the Si chips is
converters, whose packages provide housing and fixtures for power conducted through the multi-layer stacking package structure for dis-
devices and facilitate heat dissipation [2]. Power electronics, especially sipation. The interfaces between adjacent layers, whose materials have
the package of PEMs in power converters play a crucial role in the re- very different coefficients of thermal expansion (CTEs), are therefore
liability of power converters and even the entire systems. In wind tur- subject to a wide range of temperature variation. This may lead to stress
bines, failures due to power electronics in power converters make up concentration and crack initiation near these interfaces. As a result,
over 10% of all the failures [3]. In electric motor drives, semiconductor several fatigue-related failure modes arise from the cumulative effect of
and package-related failures like solder failure account for 34% of all dynamic loading conditions. It was reported that the most common
power converter failures [4]. A survey on various industries including ones of these failure modes were bond wire lift-off and fatigue of solder
aerospace, automotive, marine equipment, utility power supplies, etc., interconnects [7–9].
showed that insulated gate bipolar transistor (IGBT) takes up 42%, In a multi-chip IGBT module, there could be hundreds of bond wires
being the most common type of power devices in the surveyed in- provided the electrical interconnection between the active area of
dustrial applications [5]. The package reliability of IGBT modules has semiconductor devices (IGBT and freewheeling diodes) and other
been the topic of many studies, and it is also the concern of the present components (passive) in the module, as is shown in Fig. 1. IGBT and
work. diode chips are the heat sources during the power module operation.
The general internal structure of the IGBT module package is shown The large temperature swing and the self-heating of the wires due to
in Fig. 1. The semiconductor dies (silicon) are soldered to an insulating current flow, combined with the significant CTE mismatches between
direct bonded copper substrate, which is a three-level substrate with the bond wire metals and the bond pads located on the Si die, result in high


Corresponding author.
E-mail address: lvyz123@umd.edu (Y. Lu).

https://doi.org/10.1016/j.microrel.2018.11.012
Received 20 December 2017; Received in revised form 18 June 2018; Accepted 22 November 2018
Available online 01 December 2018
0026-2714/ © 2018 Elsevier Ltd. All rights reserved.
Y. Lu, A. Christou Microelectronics Reliability 92 (2019) 96–105

Bond Wires

Fig. 1. Cross-sectional views of standard module package for IGBTs.


A cross-sectional view of the standard module package for IGBTs.

susceptibility of these bond wires to fatigue damage. The solder inter- historical information and routinely monitored data obtained from the
connect degradation has a similar root cause, associated with the CTE systems to estimate RUL [23,24]. Data-driven approaches are ad-
mismatches between the solder material and silicon chip or substrate. vantageous over model-based approaches for complex systems and
An important premise in this paper is that the parametric failure of where accurate modeling from first principles becomes infeasible [23].
IGBT modules under dynamic loading conditions are mainly due to For IGBT modules, the fundamental physics-of-failure of typical pack-
bond wire lift-off at the bond pads of the IGBT and diode die. The solder aged components under power cycling conditions are well understood.
interconnect fatigue mechanism also results in an increase in junction- Nevertheless, the complexity and variability of the design and materials
to-case thermal resistance of the IGBT module, which also increases the of the module architecture, as well as the variability of the power cy-
die junction temperature further accelerating bond wire lift-off. cling conditions, introduce uncertainties in the actual degradation be-
A power module's capability to sustain dynamic loading conditions havior. Therefore, the developed model makes a fusion of both types of
is determined through power cycling tests. In field applications, the prognostic approaches. It is based on the PF approach utilizing the in-
variations of loading profiles are often random and unpredictable. In situ monitored data, while the physics-of-failure knowledge was in-
wind turbine applications, for example, varying wind speeds in the tegrated in the non-linear process model for RUL prediction. A classic
marine environment lead to dynamic loading profiles that require in- type of PF, the sampling importance resampling (SIR) filter was im-
tensive monitoring and measurements for evaluation [10], which can plemented on the degradation data collected from open literature
be both time-consuming and costly to perform, and is not within the sources reporting IGBT power cycling test results [25–27]. It is em-
scope of the present work. Power cycling tests for dynamic loading in phasized that the reported failure mechanism reported from tests per-
the present investigation were carried out under highly accelerated formed on different IGBT modules and under power cycle loads, was
conditions and by eliminating any random variations in loads. consistently bond wire failure which further confirmed the criticality of
The basic goal of the present work is to develop a prognostic model bond wires in the module package reliability.
combining both model-based and data-driven techniques and to vali-
date it for remaining useful life (RUL) estimation for the selected IGBT 2. Particle filter
modules. State-of-the-art reliability prediction techniques have been
switching from relying on historical field data to relying on in-situ The basic idea of a particle filter is to represent the posterior
operational and environmental data, and the most promising of such probability density function with a large number of particles and their
techniques is prognostics and health management (PHM) [11]. The associated weights, which are updated iteratively at every time step.
purpose of PHM is to detect signs of failures, provide warnings in ad- The sequential importance sampling (SIS) is the most basic particle
vance, and forecast maintenance. In this sense, the successful im- filter, with a number of variants such as the SIR filter, the auxiliary
plementation of PHM depends heavily on the availability of models sampling importance resampling (ASIR) filter and the regularized par-
with capability in both fault detection and lifetime prediction. In the ticle filter (RPF), developed to solve the issue of degeneracy in SIS filter.
present work, a robust and comprehensive model integrating both fault Usually after several iterations, all but very few weights tend to be zero,
diagnosis based on machine learning and lifetime prediction based on leading to a severe loss of particle diversity in predictions [28]. The two
particle filter approach is developed. Particle filter (PF) is a state-of-the- general solutions are to choose the proper proposed distribution, and
art Bayesian inference approach solving nonlinear state estimation the implementation of resampling. A classic example of addressing the
problems. Applications of particle filter in the field of prognostics in- degeneracy issue based on resampling is the SIR filter, which is the most
clude state-of-health estimation of batteries [12–15], power electronic prevalent filter used in prognostics [29]. The standard formulation and
modules [16–18], LED lumen maintenance [19] and mechanical or procedure of the SIR filter is given in four steps below [30].
structural components like helicopter gear plates [20]. Different model-
based and data-driven approaches were implemented and compared in 1) Initialization
the prognostics of power electronic devices, including Gaussian process
regression, extended Kalman filter and particle filter, among which Let k be the number of time steps in sequence. To initialize, set
particle filter has been demonstrated to give the most accurate results k = 0 and generate a set of N particles x0i, i = 1, 2, …, N, from the prior
[16]. Therefore, the robustness of the PF approach in prognostics of distribution of the state variable x at t = 0, denoted p(x0).
power electronics devices have been demonstrated.
Prognostic approaches are either model-based or data-driven [21]. 2) Importance sampling and calculation of weights
Model-based approaches require that accurate mathematical and phy-
sical models can be developed from first principles [22]. Data-driven At each time step k, generate a set of particles xki from the proposal
approaches use statistical and probabilistic techniques based on distribution q(xki| x0:k−1i, z0:k), where z0:k are the series of

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Y. Lu, A. Christou Microelectronics Reliability 92 (2019) 96–105

measurements of the state. In the SIR filter, define q(xki|x0:k−1i, and failure threshold level.
z0:k) = p(xki|xk−1i), which is the conditional distribution of xki given
the set of particles in the previous step xk−1i. Assign each particle a A. Anomaly detection technique
weight based on Eq. (1) below:
Fault detection is an integral part of the PHM cycle because it is the
p z k | xki ) p (xki | xki − 1 )
ωki = ωki − 1 p (z k | xki − 1) = ωki − 1 ( basis of troubleshooting as well as maintenance decision support.
q (xki | xki − 1, z k ) (1) Practically, it is also required to initiate RUL prediction. Similar to
Normalize the weights: prognostic approaches, fault detection techniques can also be categor-
ized into two types: model-based and data-driven. The model-based
ωki techniques are also based on first principles, while data-driven techni-
ωki = N
∑i = 1 ωki (2) ques rely on data processing and knowledge-based methodologies to
discover data anomalies [31]. For bond wire lift-off, the failure physics
3) Resampling behind fault initiation and identification is fatigue-induced void and
crack initiation, which is more complex than that of crack propagation.
If the effective sample size Neff calculated using Eq. (3) is below the A complete three step fatigue model is much more difficult to imple-
given threshold Nth, then resampling is performed. Commonly, ment for the fault detection process since the crack initiation is based
Nth = 2/3 N is taken as the threshold. on knowledge of pre-existing material defects in the bond wire or bond
pad. A pure data-driven fault detection, or data anomaly detection, is
1
Neff ≈ N more desirable and easier to implement.
∑i = 1 (ωki )2 (3) Nevertheless, very few publications so far have integrated an
∼i i
Generate N new particles x k from the current particle set xk , and anomaly detection technique in the PF-based prognostics. Orchard et al.
replace xki with the new set. The weights of the new set are assumed to [20,31] proposed an on-line PF framework for anomaly detection and
be equally distributed. time-to-failure prediction by implementing a fault detection and iden-
tification (FDI) module for anomaly detection and a failure prognostic
∼i = 1
ω module estimating the RUL of the faulty system, but the discussion on
k
N (4)
the FDI module was limited. A fundamental challenge of integrating
anomaly detection with the RUL prediction lies in the difficulties in the
4) State prediction
development of a valid anomaly detection technique itself, especially
the criterion for the establishment of identifying a test data point as an
Calculate the estimated state 
xk using Eq. (5):
anomaly. In practice, this criterion is determinant for the effectiveness
N and robustness of the anomaly detection technique. Previous works on

xk = ∑ ω∼ki ∼x ki prognostics [16,17,32,33] empirically selected a single threshold in the
i=1 (5)
variations of the failure precursors or a specific anomaly detector as the
criterion of fault detection. The present work proposes a unique cri-
3. Prognostic model development terion of anomaly identification by computing safety margins based on
two distributions of distances, as will be discussed later.
The development of the prognostic model in the present work in- Anomaly detection typically requires some machine learning tech-
volved three steps: (i) the development of a novel anomaly detection niques to justify whether a test data point shows some anomalous be-
model, (ii) the development of a non-linear process model and (iii) a havior compared with known healthy or previously observed data,
measurement model for PF-based RUL prediction. The first step to the using the features extracted from the raw data. Machine learning al-
formulation of these models was the definition of the state variable for gorithms can generally be categorized into supervised learning, semi-
the particle filter, called failure precursor in the context of reliability supervised learning and unsupervised learning. Supervised learning is
prediction. A failure precursor is a variable that can clearly identify and based a fully-labeled training dataset, including nominal or healthy
allows real-time tracking of a specific type of degradation. IGBT is a data and all types of anomalous data, while unsupervised learning
three-terminal power electronic device with a collector, a gate and an works with no labeled training data. Semi-supervised learning, used in
emitter. It is turned on by applying a positive gate-emitter voltage VGE the present work, stands halfway between supervised and unsupervised
greater than the threshold voltage Vth. As a result, some current flows learning, with a mixture of labeled and unlabeled training data [34]. It
from the collector to the emitter, denoted IC. In an IGBT module, the is demonstrated in the machine learning literature to reach a compro-
current flows not only through multiple semiconductor die but through mise between the availability of fully-labeled training data and the
passive components as well as through interconnects such as bond learning accuracy [35]. Recent investigations in a variety of domains
wires. The net result is an on-state forward voltage drop Vforward be- have utilized semi-supervised learning techniques for anomaly detec-
tween the collector and emitter terminals of the module. In power cy- tion. Ashfaq et al. [36] proposed a fuzziness based semi-supervised
cling tests, the current IC is typically kept constant, and hence as bond learning approach with the supervised learning approach of single
wire degradation develops, the on-state resistance of the module in- hidden layer feed-forward neural network (SLFN) assisted by unlabeled
creases, resulting in an increase in Vforward. Therefore, Vforward is com- samples to improve the classifier's performance for the intrusion de-
monly used to indicate degradation in the package-related failures of tection systems in cyber security. The experimental results of intrusion
IGBT modules and it was selected as the failure precursor in the present detection on an evaluation dataset based on this approach showed that
work as well. The threshold of device failure was a 5% increase in unlabeled samples contributed enormously to improve the classifier's
Vforward over the upper bound of a pre-defined healthy data interval, performance compared to existing classifiers like naive bayes, support
which will be discussed in the subsequent anomaly detection technique vector machine, etc. Zhao et al. [37] proposed a graph-based semi-su-
part. Dramatic increases in Vforward can be expected after this threshold pervised learning model utilizing a few labeled training data for fault
because of the increasing pace of bond wire detachments. The func- detection in solar photovoltaic (PV) arrays. The model learned PV
tional failure of the device under test (DUT) occurs when enough bond systems autonomously over time as weather changes based on nor-
wires detach to completely cut off the electrical connection in the malized voltage and current measurements, and also further identifies
module. The following subsections will discuss the anomaly detection the possible fault type to promote system recovery. It was demonstrated
and process model development in detail, based on the failure precursor experimentally that the proposed model could correctly detect and

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Y. Lu, A. Christou Microelectronics Reliability 92 (2019) 96–105

classify specific normal conditions, line–line faults, and open-circuit voltage VCE values of all the 60 IGBTs, a sample set sized 60 was es-
faults in real-working conditions. Sillito et al. [38] proposed and de- tablished and imported into MINITAB [40] for parametric normal dis-
monstrated an incremental semi-supervised one-class learning proce- tribution analysis. The normal distribution was selected since it out-
dure for anomalous behavior detection in a video surveillance scenario, performed the Weibull distribution in goodness-of-fit for the dataset.
in which unlabeled trajectories were combined with occasional ex- The 95% confidence interval (CI) of the mean of the fitted normal
amples of normal behavior labeled by a human operator. Although the distribution was considered an acceptable variation interval of healthy
author believed that the new procedure at least as effective as existent data. This is because the mean of the distribution, calculated based on a
unsupervised learning techniques, not enough demonstration of su- relatively large population, can be taken as the estimated Vforward
periority using large real-world datasets was provided. output of a single “nominal device”. The 95% CI of the mean can thus
The semi-supervised anomaly detection in the present work was be considered the acceptable variation interval of this “nominal de-
based on unsupervised machine learning techniques including principal vice”. MINITAB calculations showed that the 95% CI of the mean was
component analysis (PCA) and k-means clustering, with a range of [2.496 2.529]. Therefore, it was assumed that the set of data whose
healthy data defined for each time series of Vforward degradation data values stayed within ± 0.6546% of the nominal value could be labeled
and serving as labeled training data. Several baseline clusters consisting healthy data.
of the identified healthy data was obtained, and an anomaly was sig- Then the training of the detection algorithm was conducted based
naled when a test data point failed to conform to any of these clusters. on the predefined healthy data using k-means clustering technique to
The novelty of the technique is the development and implementation of establish the baseline for anomaly detection. If a test data point failed to
a singular-value-weighted Euclidean distance as the distance measure fall into any of the baseline healthy clusters, then it was considered an
in clustering, and safety margin between the distribution of a distance anomaly. In each case, the number of clusters k ranged from 2 to 3. The
between healthy data within each cluster and another one of distances value of k was selected using the average silhouette method, which was
between test data and healthy data. First, feature pre-selection was introduced by Kaufman and Rousseeuw in 1990 as an effective and
performed. Nine common time-domain statistical features, given below, direct method for determining an optimal number of clusters based on
were empirically selected and believed to contain useful information for comparison of the tightness and separation of the clusters in each case
detecting anomalous behavior. Note that s denotes the failure pre- [41]. An important step in clustering is the selection of distance mea-
cursor, or Vforward. At each time step t, these features were calculated by sure. A distance measure is used to determine the level of similarity
setting a moving window that included the 10 latest Vforward points. between data points. The essence of clustering for healthy data is to
create groups benchmarking the typical values representing the nom-
1) Mean ds / dt . inal behavior in healthy conditions. Deviation from the expected be-
2) Maximum (ds/dt)max. havior, or anomalies, is typically determined by the distance from the
3) Root mean square (ds/dt)rms. centroids of the healthy clusters [42]. A singular-value-weighted Eu-
4) Standard deviation σds/dt. clidean distance measure was developed. The conventional Euclidean
5) Crest factor CFds/dt. distance measure in the feature space is given in Eq. (6):
6) Impulse factor IFds/dt.
7) Shape factor SFds/dt. di (k )
8) Energy of the domain EDds/dt. = (PC1 (k ) − PC1m j )2 + (PC2 (k ) − PC2m j )2 +…+(PCn (k ) − PCnm j )2
9) Clearance factor CLFds/dt. (6)

Then the feature extraction was performed using PCA. where PC1, PC2, …, PCn denote the coordinates of the test data point in
Dimensionality reduction is an important task in unsupervised/semi- the n-dimensional feature space, given that the number of PC is n;
supervised machine learning involving feature extraction and feature PC1mj, PC2mj, …, PCnmj denote the coordinates of the mean of the
selection. Feature extraction was adopted in the present work instead of healthy cluster in the feature space. This distance measure is con-
feature selection from the original features because feature extraction sidering all the PCs as equally weighted. However, the importance of
not just reduces the number of dimensions, but more importantly, it different PCs varies, as is indicated in the corresponding singular values
comes up with uncorrelated features called principal components (PCs) representing the percentage of the variance each PC accounts for. In
that capture the maximum variance in the raw data. This is critical PCA, PC1 corresponds to the largest singular value, so it accounts for the
since the statistical features might be correlated with each other, re- largest amount of variance. Therefore, the classic Euclidean distance
sulting in redundant information in features. The essence of PCA is was revised by assigning the corresponding singular values as weights
maximizing the variances of the features along the axis of the PCs in the to the PCs, as is shown in Eq. (7):
feature space, while minimizing the correlations between pertinent 2 2
j j
features. In other words, PCA-based feature extraction can eliminate the di (k ) = ⎛ SV1 (PC1 (k ) − PC1m ) ⎞ + ⎛ SV2 (PC2 (k ) − PC2m ) ⎞
⎜ ⎟ ⎜ ⎟

redundant information between features while retaining useful in- ⎝ SV1 + SV2+…+SVn ⎠ ⎝ SV1 + SV2+…+SVn ⎠
2
formation as much as possible. The number of PCs is determined using SV (PCn (k ) − PCnm j ) ⎞
+…+⎛ n⎜ ⎟
the common criterion that the cumulative percentage of variance of the
⎝ SV1 + SV2+…+SVn ⎠ (7)
PCs exceeds 80%. For the degradation data series studied, the number
of PCs varied from 2 to 4. As the PCs were extracted, the PC-based where SVi (i = 1, …, n) are the singular values corresponding to each
feature space could be established, and both the healthy and the test PC. Based on the new distance measure, for each healthy cluster, the set
data points could be located in it. of distances between the healthy data points within the cluster could be
The definition of a labeled nominal (healthy) region in the raw data calculated. For each test data point, the set of distances between the test
was realized through evaluating the variations of the I–V output char- data point and the healthy data points in each cluster could also be
acteristics of 60 IGBTs in 10 IGBT modules, measured using an Agilent calculated. Consequently, two distributions were obtained for each
B1505A curve tracer. The tested modules were Infineon FS20R06W1E3 healthy cluster and each test data point. It was then justified whether
with a rated collector-emitter voltage (VCE) of 600 V [39], and each these two distributions could be considered the same distribution to a
module consisted of 6 IGBTs. The measured output characteristic curves certain degree of confidence, to determine whether the test data point
with a gate voltage VGE of 9 V and 11 V for one of the IGBTs, is shown in belongs to that cluster. Unless it belonged to any healthy cluster, the
Fig. 2. The point in the I–V curves selected for statistical analysis was test data point was considered anomalous. Therefore, the safety margin
IC = 30A, VGE = 11 V. By collecting the corresponding collector-emitter (SM) between the two distributions was calculated, assuming both

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Y. Lu, A. Christou Microelectronics Reliability 92 (2019) 96–105

VGE=11V

VGE=9V

Fig. 2. Example of I–V output characteristics curves of an IGBT in Infineon FS20R06W1E3, given a gate voltage VGE of 9 V and 11 V, respectively.

distributions were normal. SM indicates the degree of relative separa- failure precursor. l(k) is a hypothetic variable associated with the power
tion between the means of two distributions (commonly load and cycle loading parameters, the load current Iload, and the junction tem-
strength) [43], and it can be calculated using Eq. (8): perature variation ΔTj, as is shown in Eq. (10). The values of ΔTj were
μtest − μhealthy, x derived from the base plate temperature, which was monitored in-situ
SMx = throughout the tests in parallel with Vforward. In this sense, l(k) indicates
σtest 2 + σhealthy, x 2 (8) the real-time loading condition in the test.

where μtest, σtest are the mean and the standard deviation of the dis- l (k ) = fl (Iload , ∆Tj (k ) ) (10)
tribution of dt between the test data point and healthy cluster x (x = 1,
ΔK(k) is the stress intensity factor analytically derived from Paris
2, 3), respectively, and μhealthy, σhealthy are the mean and the standard
Equation, which governs crack propagation under fatigue loads. The
deviation of the distribution of dh in healthy cluster x, respectively. Let
idea is to simulate the crack growth procedure in the critical compo-
Rx be the probability that the test data point does not belong to the
nents of IGBT module package. In the theory of fatigue, ΔK(k) is related
healthy cluster x, SM can then be used to determine Rx:
to the crack length a and the stress amplitude Δσ:
Rx = Φ (SMx ) (9)
∆K (k ) = α∆σ πa (11)
A critical reliability threshold of Rx = 0.995 was defined. Once the where α is a constant. Δσ is related to ΔTj, while the crack length is not
Rx values for all the healthy clusters exceeded 0.995, it was believed directly calculable. The famous Paris Equation is:
that the test data point didn't belong to any healthy cluster with at least
99.5% confidence level, and an anomaly was considered detected and da
= A (∆K )n
was signaled at this point. dN (12)

where A, n are material-related constants. Combining Eq. (11) with Eq.


B. Process and measurement model (12) and performing an integral over da and dN, respectively, yielded
the relationship between ΔK(k) and N, the elapsed power cycles, given
The process model is the basis of PF implementation for RUL pre- in Eq. (13). The bond wire material was assumed to be aluminum. The
diction. Variables that constitute the process model should be those NASGRO database [44] gave the n value of around 3.2 for aluminum
whose evolutions can effectively signal the degradation of the DUTs, or and aluminum alloys.
relevant to the real-time loads or stresses, to “drive” the evolution of the
1
failure precursor. The most straightforward choice was t, the elapsed n n 2−n
test time or cycles, as was used in [14,15]. The problem with using t ∆K (k ) ∝ B ⎡A ⎛1 − ⎞ BnN + ai1 − 2 ⎤
⎣ ⎝ 2⎠ ⎦ (13)
only is that the evolution of Vforward in IGBT modules is not smooth and
monotonic. A better choice should account for the real-time loading where B = 1.12∆σ π , in which Δσ is the stress amplitude at the crack
condition. Saha et al. [12] used Δtk, the resting period between each location, and in turn associated with the junction temperature variation
power cycle, while Orchard et al. [20] used a hypothetical loading ΔTj with the following relationship:
parameter incorporating in-situ loading conditions. On the other hand, ∆σ = CE (αAl − αSi ) ∆Tj (14)
the principal failure mechanism was known to be bond wire lift-off, and
the physics of this failure mechanism was well-known. The parametric where C < 1 is a constant, E is the young's modulus of aluminum, the
degradation could be associated with the physics-of-failure of devices, bond wire material, and αAl and αSi are the CTEs of the aluminum and
or the crack propagation inside the bond wires during power cycling. silicon, respectively. The optimal choice of process noise, as was dis-
Note that in the model proposed in the present work, the influence of cussed in Corbetta et al. [45], is a multiplicative noise where a log-
solder interconnect degradation was neglected since it was difficult to normal random noise eω, ω ~ N(0,σω2) is multiplied by the increments
gauge and model its exact influence on the acceleration of bond wire to represent the uncertainties. The ω in the noise follows the normal
failures. Based on these justifications, another contribution of the pre- distribution and is subject to the principle below:
sent work is the simultaneous incorporation of the physics-of-failure
σw 2
model related to the dominant failure mechanism and the in-situ μw = −
2 (15)
loading profile monitored and acquired during the test. Two determi-
nant variables, l(k) and ΔK(k), were used to “drive” the increase of Thus, the process model takes the following form:

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Y. Lu, A. Christou Microelectronics Reliability 92 (2019) 96–105

s (k + 1) = fm (s (k ), l (k ), ∆K (k ), w (k )) (16) the ΔTj values generally showed an increasing trend over elapsed cy-
cles. An initial model check was performed on the Vforward data using
where s(k) denotes the failure precursor value (Vforward for IGBTs) at
least square regression to ensure that the power law polynomial process
time step k, and w(k) denotes the process noise. To specify the process
model could provide satisfactory fits to the data. The goodness-of-fit
model, as well as the relationship between l(k) and the loading para-
was defined as that given the model followed the trend of the precursor
meters Iload and ΔTj, a proper nonlinear mathematical model needed to
data tightly in the initial part of the test (a few thousand cycles), the
be selected. The power law polynomial model was selected among a
regression results should follow the evolution of the actual curve
number of common nonlinear mathematical models, including the
throughout the subsequent test time (cycles). In case the regression
power law model, the exponential model, multiplicative model, etc.,
results could not follow, the power law polynomial model had to be
because it had the greatest flexibility in shape. Therefore, the process
replaced. It turned out that the power law polynomial model fitted well
model related to the initial value of the failure precursor s0 is shown in
to all the Vforward series, providing a solid basis for the actual PF im-
Eq. (17):
plementation.
s (k ) = s0 + (l (k ) − l 0 + m1 ∗ ∆K (k )n1 ) ∗ e w (k ) (17) The SIR filter introduced in section II was then implemented. In PF,
the larger the number of particles is, the more accurately it should re-
The load variable l(k) was also assumed to follow the power law
present the prediction results proposed by the process model. However,
polynomial model:
the limited computing power prevented the implementation of a very
l (k ) = m2 Iload n2 + m3 ∆Tj (k )n3 (18) large number of particles in the present work. The number of particles
is 100 was chosen for this work. The particles were initiated from the
Taking the derivative of Eq. (17) and combining Eq. (18) lead to: actual measurement at 500 cycles, when there were 5 actual measure-
ds (k ) d∆Tj (k ) d∆K (k ) ⎞ w (k ) ments available for initial regression. Uniform initial weights were as-
= ⎛m3 n3 ∆Tj (k )n3− 1
⎜ + m1 n1 ∆K (k )n1− 1 e

sumed for the particles since their importance could not be dis-
dt ⎝ dt dt ⎠
tinguished at the initiation. The particles were propagated to predict
(19) the Vforward value at the next step (100 cycles later) using the power law
By assuming that dt can be discretized into small steps, Eq. (19) was polynomial model whose parameters were estimated in least square
converted to the following canonical form: regression on all the prior Vforward data, or y(1:k − 1) as denoted in the
PF model. The process noise distribution was assumed to be Gaussian
s (k + 1) = s (k ) + (m3 n3 ∆Tj (k )n3− 1 (∆Tj (k + 1) − ∆Tj (k )) with μ = −1.25 × 10−3 V and σ = 0.05 V, based on Eq. (15). The
+ m1 n1 ∆K (k )n1− 1 (∆K (k + 1) − ∆K (k ))) e w (k ) (20) value of σ was chosen empirically. As predictions were made for all the
particles at each step, the weights of the particles were updated based
whereas
on the Z-score calculated from the deviation of the predicted value of
s (1) = s0 + (l (1) − l 0 + m1 ∗ ∆K (1)n1 ) e w (1) (21) each particle from the actual measurement at the step, given the
Gaussian process noise distribution just mentioned. The updated
The last part of the prognostic model was the measurement model weights were then normalized using Eq. (2). The resampling step fol-
accounting for the differences between the measured values and the lowed Eqs. (3) and (4) stringently. This “prediction” and “weight up-
actual values of the variables. In the present work, the two variables date” procedure was carried out iteratively until an anomaly was sig-
with a measurement error are Vforward and ΔTj. The measurement error naled. Then the RUL prediction was triggered offering a distributional
was assumed to be Gaussian. The measurement model is as follows: estimation on all the subsequent states based on the latest updated
y (k ) = s (k ) + v1 (k ) process model at the point of anomaly signaling, until when the pre-
ΔTy (k ) = ΔTj (k ) + v2 (k ) (22) defined failure threshold was reached. The predicted cycles to failure
(CTF) was defined as the point when the failure threshold was reached
where y(k) and ΔTy(k) are the measured raw values of s(k) and ΔTj(k), by a number of particles whose weights added up to over 0.5. It should
v1(k) and v2(k) denote the measurement noise of s(k) and ΔTj(k), re- be noted that the inherent randomness of the PF approach leads to
spectively. slight different prediction results every time the algorithm is executed.
Therefore, to minimize the randomness of an individual execution, the
4. Prognostic model validation through particle filter algorithm was executed 10 times independently in each case and the
implementation results of the 10 executions were averaged for the final prediction result
of CTF value. The 95% confidence interval of each execution was also
The procedure of the prognostic model implementation is given as a determined and averaged. This value was compared with the actual
flow chart in Fig. 3. The prognostic model developed in the previous CTF value of the raw data to calculate the prediction error and assess
section was validated through its implementation on several Vforward the robustness of the prognostic model in the relevant case. The CTF
degradation curves from the literature sources mentioned at the end of value scattering resulting from the scattering of individual particle
section I. The series of Vforward data were extracted and digitized from trajectories, combined with the particle weights, also formed a dis-
the original plots in the literature sources using Plot Digitizer. Then the tribution of the CTFs that was of significance in real-world application
data was pre-processed to have an identical interval of 100 cycles be- schemes. In some cases, the Vforward series showed a decreasing trend in
tween adjacent data points using linear interpolation locally. Both the initial part of the test. This was because of the slow variation of the
anomaly detection as well as parametric estimation and updates of the average device temperature that rose by several degrees [46]. This part
process model were based on the pre-processed precursor data. The of the curve was therefore considered useless and neglected. The actual
complete anomaly detection procedure introduced in section III.A was minimum of the Vforward across the curve was considered the starting
then implemented to determine of the probability of anomaly for each point of degradation and prognostic modeling.
test data point.
For the process model, the two determinant variables l(k) and ΔK(k) 5. Results and discussions
was derived. Iload was set to be constants in the literature sources and
the values were provided. For ΔTj, the corresponding raw data of either The prognostic model developed in the present work was coded and
ΔTj or Tj,max/Tj,min were provided for each degradation curve as well, validated using MATLAB [47]. Following the previous discussions,
which were extracted and digitized in the same way as the Vforward data calculations of the 9 time-domain statistical features and feature ex-
from the relevant plots in the papers. In agreement with the hypothesis, traction using PCA were performed first. Fig. 4 shows the results of PCA

101
Y. Lu, A. Christou Microelectronics Reliability 92 (2019) 96–105

Fig. 3. The flow chart of the prognostic model implementation.

based on the healthy Vforward data from [27], by plotting the data points the same cluster. After the healthy data were clustered, the affiliation of
in the 3D and 2D feature space constructed from the three most im- each test data point to each healthy cluster was determined based on
portant PCs and the two most important PCs corresponding to the lar- the singular-value-weighted distance measure given in Eq. (7), and the
gest singular values, respectively. probability of anomaly using Eqs. (8) and (9). Table II summarizes the
Then k-means clustering was implemented as the key step for anomaly detection results for all the cases studied in the present work,
anomaly detection, which resulted in three healthy clusters. As was showing the anomaly signaling point (ASP) for each case. To evaluate if
discussed earlier, the optimal number of clusters was determined using the anomaly detection model was functioning properly, a percentage
average silhouette method. Table I summarized the optimal number of metric was used indicating where the ASP lied in the range from the
clusters in each case studied and the corresponding maximum silhou- onset of test data to the actual DUT failure point. It turned out that the
ette value. Fig. 5 shows the results of k-means clustering for the healthy anomaly detection model could successfully detect anomalies and
Vforward data from [27]. The shapes of points plotted in the figure, in- provide timely warning in all cases.
cluding star, circle and cross sign, represent their affiliations to the After an anomaly was detected and signaled, the time series of ΔK
three healthy clusters. All the points plotted in the same shape belong to (k) were calculated, and the SIR filter was implemented for RUL

102
Y. Lu, A. Christou Microelectronics Reliability 92 (2019) 96–105

(a) (b)

Fig. 4. Principal Component Feature Plot of a) 3D with all the three PCs; b) 2D with the two most important PCs.

Table I Table II
Summary of optimal number of clusters. Summary of anomaly detection results.
Literature source Max. silhouette value Optimal number of clusters Literature source Upper bound of Anomaly signaling Percentage of CTF
healthy data point (ASP) at the ASP (%)
Tounsi [25] 0.768 3 (cycles) (cycles)
Scheuermann [26] 0.85 3
Schmidt [27] 1E 0.686 2 Tounsi [25] 111,100 129,700 79.15
Schmidt [27] 2E 0.62 3 Scheuermann [26] 3100 3800 4.02
Schmidt [27] 1E 21,800 56,900 78.52
Schmidt [27] 2E 31,100 53,900 70.59
prediction of the DUTs. Fig. 6 shows the life prediction results using the
SIR filter for the Vforward data in [27]. The trajectories of particles at the
training stage are marked in black, formed by the recursive prediction Table III summarizes the results the predicted CTFs, the raw data CTFs,
and update procedure. As an anomaly was detected and signaled at the prediction errors and 95% two-sided confidence intervals of all the
39,800 cycles, the RUL prediction was triggered, and the particles were studied cases.
propagated until the 5% Vforward increase failure threshold was reached, Generally, the prediction results in the present work were satisfac-
whose trajectories are marked in blue at the prediction stage. The tory, with half of the cases giving average prediction errors below 3%,
predicted CTF was 65,061 cycles, as the average of 10 individual and showing the robustness of the proposed prognostic model for different
independent predictions of the PF-based prognostic model. The raw IGBT modules under varying power cycling conditions. A significant
data series hit the failure threshold at 63,400 cycles. The average pre- advantage of this model is the incorporation of the physics-of-failure
diction error in this case was 2.62%. In the other cases, the average knowledge in the data-driven model. It combines the merits of both
prediction errors of 10 predictions ranged from 1.15% to 13.57%. For model-based and data-driven prognostic approaches and has demon-
each case, the 95% two-sided confidence interval was also calculated. strated great promise in prognostics of semiconductor electronic

(a) (b)

Fig. 5. K-means clustering results of a) 3D with all the three PCs; b) 2D with PC1 and PC2 only, the two most important PCs; All the points plotted in the same shape
of star, circle or cross belong to the same cluster.

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Y. Lu, A. Christou Microelectronics Reliability 92 (2019) 96–105

Failure Prediction Stage


Threshold

Training Stage

TTF (×100 Cycles)

(a) (b)

Fig. 6. a) Life prediction results on the Vforward curve based on SIR filter; b) Predicted cycles-to-failure (CTF) distribution of 100 Particles for the Vforward curve [27].

Table III
Summary of prediction errors.
Literature source Predicted CTF (cycles) Actual CTF (cycles) Prediction error (%) 95% confidence interval (cycles)

Tounsi [25] 155,590 134,600 +15.59 [148,960; 161,010]


Scheuermann [26] 20,390 20,500 −0.54 [19,130; 21,300+a]
Schmidt [27] 1E 67,220 66,500 +1.08 [63,450; 74,590]
Schmidt [27] 2E 63,890 63,400 +0.77 [60,390; 67,580]

a
Right-censored data due to end of test at 21,300 cycles.

devices, given that a dominant failure mechanism exists, and the phy- learning techniques including principal component analysis and k-
sics of this failure mechanism is well understood. Another advantage of means clustering. The algorithm successfully detected data anomalies
the model is the integration of an anomaly detection technique, which for all the cases studied. The novelty of the anomaly detection tech-
in prospective field applications where online monitoring and RUL nique lies in the implementation of the singular-value-weighted
prediction is required, can work with the training stage (recursive Euclidean distance measure and the determination of the probability of
prediction and update procedure) of the process model in parallel so anomaly based on safety margin between the distribution of distances
that they don't interfere or rely on each other until an anomaly is de- between a test data point and the healthy data points in each cluster,
tected. This could potentially reduce the complexity of the adaption of and the distribution of distances between the healthy data points within
the prognostic model to different failure precursors and model para- each cluster. The PF-based RUL prediction was based on a non-linear
meters for different types of semiconductor electronic devices, subject failure precursor process model, which was a power law polynomial
to different operating conditions and failure mechanisms. A drawback model and its novelty lies in the simultaneous incorporation of the
of this model might be its reliance on a known dominant failure me- physics-of-failure knowledge related to the failure mechanism and the
chanism. For complex systems with multiple failure mechanisms com- in-situ loading profile during the test. The sampling importance re-
peting against each other, this model may not be applicable. Also, this sampling filter was implemented, and the model was validated on
model requires the in-situ monitoring of the actual loading condition in several different series of Vforward data, from literature sources reporting
the reliability test or field operation as the input. the power cycling test results on different IGBT modules under different
In addition to IGBT modules, the framework of the prognostic model testing conditions. The RUL prediction results demonstrated the ro-
developed in the present work will also be applied to wide-bandgap bustness of the model, with half of cases reporting errors within 3%.
semiconductor devices, such as GaN high-electron-mobility transistors The present work also laid a solid foundation for future work im-
(HEMTs) developed for RF and microwave applications, with entirely plementing the developed PF models on different types of semi-
different device structures, operating conditions and failure mechan- conductor electronic devices.
isms, to demonstrate the broader applicability of the model. The ulti-
mate goal is to develop and validate a generic model framework for Nomenclature
prognostics of various types of failures of semiconductor electronic
devices. ASP anomaly signaling point
CI confidence interval
6. Conclusions CTE coefficient of thermal expansion
CTF cycles-to-failure
In the present work, a prognostic model incorporating both a novel DIAD dynamical invariant anomaly detector
anomaly detection technique and particle-filter-based RUL prediction DUT devices under test
was developed and validated for dynamic life prediction of the IGBT FDI fault detection and identification
modules under power cycling conditions, where the dominant failure IGBT insulated gate bipolar transistor
mechanism was bond wire lift-off. The anomaly detection technique PC principal component
was based on semi-supervised machine learning, utilizing unsupervised PCA principal component analysis

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Y. Lu, A. Christou Microelectronics Reliability 92 (2019) 96–105

PEM power electronic module (5) (2015) 2411–2420.


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