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2.1 INTRODUCTION
Semiconductors play an important role in the modern engineering technology. In
IC and Medical equipment fabrication communication technology and Consumer
electronics, the semiconductors are widely used. The field of electronics has been
revolutioned since to discovery of the transistor in 1948. Semiconductors have their
electrical conduction in between insulator's and conductors.
Semiconducting materials have some specific properties such that the addition of
impurities and increasing of temperature increase their electrical conductivity, unlike
metals. Further semiconductor devices have very small size and less weight and require
a small power to operate.
Energy level diagram of a semiconductor
Band gap
Electrons
Figure 2.1
2.2 ENGINEERING PHYSICS - II
Electron-hole pair
Hole current
Due to thermal energy when an electron moves from valence band to conduction
band, a hole is created in the valence band. This hole is filled by the valence electron
creating a hole in its original position. This movement of valence electrons from one
covalent bond to another covalent bond in the valence band leads to a current known as
hole current.
3. When the temperature is raised or when impurities are added, their conductivity
increases.
Explanation
The reason for the above property is, when the tempeature is increased, large
number of charge carriers are produced due to breaking of covalent bonds and hence
these electrons move freely and gives rise to conductivity.
SEMICONDUCTORS 2.3
5. In conductors the electrons are charge carriers and will take part in conduction
but in semiconductor both electrons and holes are charge carriers and will
take part in conduction. (Hole is produced by the vacancy of electrons at
bond sites).
Total conductivity, = e + h
E
CB
– – electron
h hole E
k – CB
k
VB VB
(a) (b)
Table 2.1
1. Elemental semiconductors
2. Compound semiconductors
1. Elemental semiconductors
The elemental semiconductor is made of single element from the fourth column
elements. Germanium and Silicon are the important examples for elemental
semiconductors, these are also known as indirect band gap semiconductors.
Here the recombination of an electron from the conduction band with a hole in
the valence band takes place via traps. In this process, the phonons are emitted while
recombination and they heat the lattice.
2. Compound Semiconductors
The compound semiconductors are made by combining the third and fifth column
elements (or) second and sixth column elements. GaAs, lnP are the important examples
for compound semi conductors, these are also known as direct band gap
semiconductors.
Here the recombination of electron and hole takes place directly and its energy
difference is emitted in the form of photons in the visible (or) Infrared range.
Since the life time of the charge carrier is so small, the current amplification is
small. Here these diodes are not suitable for making transistors and ICs, rather they
are used in making LEDs and LASER diodes.
2.6 ENGINEERING PHYSICS - II
At present germanium and silicon are the most widely used semiconducting
materials.
Types of Semiconductor Based on the Purity of Atom
Based on the purity, semiconductors are classified into the following two types:
i) Intrinsic Semiconductor
ii) Extrinsic Semiconductor
i) Intrinsic Semiconductor
A semiconductor in a extremely pure form is called as intrinsic semiconductors.
Examples: Germanium and Silicon.
In these semiconductors the electrons and holes can be created only by thermal
agitation. As there are no impurities the number of free electrons must be equal to the
number of holes.
SEMICONDUCTORS 2.7
At 0 K the valence band is completely filled and the conduction band is empty.
The carrier concentration (i.e.) electron density (or) hole density increases exponentially
with the increase in temperature.
ii) Extrinsic Semiconductor
A semiconductor material in which the change carriers orginate from impurity
atoms added to the material is called impurity semiconductor or extrinsic semiconductor.
The addition of impurity increases the carrier concentration and hence the conductivity
of the conductor.
Usually pentavalent elements from group V or trivalent elements from group III
are used as dopants the atoms belonging to there two groups are nearly of the same
size as silicon or germanium atoms and easily substitute themselves in place of some of
the host atoms (silicon/germanium atoms) in the semiconductor crystal. Thus they are
substitutional impurities and do not produce any lattice distortion in the original crystal
stucture.
Completely filled
Valence band
Figure 2.3
2.8 ENGINEERING PHYSICS - II
Electrons
CB
Pure Ge
Holes
VB
CB - Conduction band
VB - Valence band
Ge L
M –
P e
Ge Ge N Ge
Hole
O Electron
Ge
Figure 2.6
Definition
It is noted that hole current is due to the movemnet of valence electrons from one
covalent bond to another bond (not by the free electrons in conduction based).
Thus it is clear that the valence electrons, move along the path NML, whereas
holes move in the opposite direction (i.e) along the path L M N etc as in Figure 2.7.
Conduction band
M Ele
ctr
on
N Hole L
Valence band
Figure 2.7
2.10 ENGINEERING PHYSICS - II
Conduction Band
EC
Eg
EV
Valence Band
top energy
The electrons moving in the periodic potential of conduction band are not like
free electron, moving in air or under constant potential. But if the mass of the electron
is replaced mass me* an electron moving in a periodic potential could be treated as a
free electron. Therefore, the density of electrons (number of free electrons per unit
volume) in the conduction band is given by
4
2g(E) dE = 2 3 21/2 (me*)3/2 (E – Ec)1/2 dE ... (2)
h
1
p(E) = (Fermi-Dirac distribution function) ...(3)
E Ef
exp 1
kT
where Ef is called the fermi energy level and k is called the Boltzmann constant. Therefore
4 * 3/ 2 1/ 2
3 2 me E – E c dE
h
2 p (E) g(E) dE = E – Ef
exp 1
kT
Integrating, we get
4 *
3/ 2 E E c ½
dE
n = h 3 2m e
EC E Ef ... (4)
exp 1
kT
At room temperature, E Ec
E Ef
E – Ef 4kT and exp >> 1
kT
Therefore
1 E Ef E E
exp exp f
E Ef kT kT
exp 1
kT
Therefore
4 Ef E
n 3
2m*e
3/ 2 ½
(E E c ) exp dE
h Ec kT
Let E – Ec + x
4 3/ 2 E
3
2m*e
E c / kT x / kT
n exp f x1/ 2 e e dx
h kT 0
or
4 3/ 2 E Ec
3
n 2m*e exp f x1/ 2 e x / kT dx
h kT 0
2.12 ENGINEERING PHYSICS - II
E Ef
exp 1
E Ef kT
1 p(E) 1 exp 1 ... (8)
kT 1 exp E Ef
kT
Assuming the Fermi level lies at an energy distance >> 4kT from E v’ the top of
the valance band, we get
E Ef
exp << 1
kT
E Ef
and hence 1 – p(E) = exp
kT
4 E Ef
3
2m*h
3/ 2
dp
E ½ exp dE ... (10)
h kT
The highest energy is corresponding to the top of the valence band. The lowest
energy for the sake of mathematical simplification may be taken as – .
SEMICONDUCTORS 2.13
Integrating we get
EV
4 E Ef
p h 3
(2m*h ) 3 / 2 (E v E)½ exp dE ... (11)
kT
Equation (11) can be solved with the help of gamma function and then
3/ 2
2 m*h kT E Ef
p 2
exp v ... (12)
h2 kT
This equation gives the number of holes or vacancies in the valence band per unit
volume.
Since in intrinsic semiconductors, n = p
We assume n = p = n i is called the intrinsic carrier concentration.
3
2 kT E \ kT
Therefore n i2 np 4 2 (m*e m*h ) 3 / 2 e g
h
3/ 2
2 kT E g \ 2 kT
Therefore ni = 2 2 ( m*e m *h ) 3 / 4 e ... (13)
h
log
1\T
Figure 2.9: Variation of log s with reciprocal of
temperature in intrinsic semiconductor
* 3/2 E Ec * 3/2 E Ef
m
e exp f
kT
= m
h exp v
kT
E Ec
3/2 exp f
m *h kT
=
m *e Ev Ef
exp
kT
SEMICONDUCTORS 2.15
E f Ec E v E f
= exp
kT
3/2
m *h 2Ef Ev Ec
= exp
m * kT
e
Taking log on both sides we have,
m* 2Ef Ev Ec
3 / 2 log h* =
kT
me
m*e
2Ef = E c E v 3 / 2 kT log *
mh
* * m*
If m h = m e then log h* = 0
me
Ec Ev
Ef =
2
i.e., the Fermi energy level lies in the midway between E e and Ev.
Carrier Transport
In metals, the electrons are fully responsible for electrical conduction. But in
semiconductors, both electrons and holes are the charge carriers. The electrical
conductivity in semiconductor is produced due to the movement of the holes and electrons
Drift Velocity
The drift velocity ‘vd’ is the average velocity acquired by the free electron of a
metal in a particular direction during the application of the electric field.
Mobility
Mobility is defined as the extra velocity acquired by the electron or hole under
potential gradient.
2.16 ENGINEERING PHYSICS - II
Bz
Ex
+ + + + + +
vx
Ey
z
y
– – – – – –
x
1
where the factor R H is called the Hall coefficient for the specimen. Hall coefficient
ne
is negative for free electrons. If the charge carriers are positive (holes), then the Hall
coefficient is positive. Thus it is the same as the sign of the charge carrier.
Results
1
1) R H n e is correct for a metal where only the electrons at fermi surface
3 1
RH
8 n e
A ( n b 2 p)
RH
e ( n b p) 2
where n is the concentration of electrons; p is the concentration of holes and
b = µe/µh, is the ratio of the mobilities of electrons and holes. For a metal or
degenerate semiconductor A = 1: For a non-degenerate semiconductor with
thermal (phonon) scattering, A = 3/8 (i.e., for intrinsic semiconductor); but
for ionised impurity scattering A = 1.93 (i.e., for p type and n type
semiconductors).
2.18 ENGINEERING PHYSICS - II
3) Most of the metals like monovalent metals have –ve Hall coefficient. But for
divalent alkaline earth metals like Zinc and Cadmium R H is +ve. The reason
can be explained as follows. According to Band theory of solids, a material
with nearly filled valence band can give rise to negative electron mass
conduction or hole conduction; Due to the possible hole conduction, the above
metals have +ve R H.
4) In n type semiconductor RH is –ve and so the electrons are the majority charge
carriers. In p type semiconductor R H is +ve and so the holes are the majority
charge carriers. Thus by measuring the Hall coefficient one can determine
the nature of charge carriers in that material and the number of charge carriers
per unit volume as well as mobility of charge carriers.
A
D VH
C
B
N-Pole
k
+ –
mA Rh
Figure 2.11: Experimental arrangement to study the Hall effect
SEMICONDUCTORS 2.19
Vy
Since Ey
d
where d is the thickness of the specimen,
V y = E y d = R H J x B zd
1 I
Since RH and J x x
ne bd
Jx
Further = electrical conductivity of the specimen.
Ex
Since E y = RH Jx Bz and
2.20 ENGINEERING PHYSICS - II
R H J x Bz J
RH x RH
Bz E x Ex
n | e | .
RH
So by determining n and µ, the electrical conductivity of the specimen can be
evaluated.
2.11 DIODES
Introduction
The energy levels of a semiconductor can be modified so that a material
(e.g. silicon or germanium) that is normally an insulator will conduct electricity. Energy level
structure of a semiconductor is quit complicated requires a quantum mechanical treatment.
E E E
0 0 0
Valence band Valence band Valence band
3 or 5 to a piece of silicon.
N type silicon:
Adding atoms which have 5 valence electrons makes the silicon more negative.
P type silicon:
Adding atoms which have 3 valence electrons makes the silicon more
positive.
The majority carriers are “holes”. A hole is the lack of an electron in the
valence shell.
Si Si Si B Si As
+4 +4 +4 +3 +4 +5
Figure 2.13
2.22 ENGINEERING PHYSICS - II
Diodes
Diodes are used to:
protect circuits by limiting the voltage (clipping and clamping)
turn AC into DC (voltage rectifier)
voltage multipliers (e.g. double input voltage)
non-linear mixing of two voltages (e.g. amplitude modulation)
Symbol for Diode
Anode Cathode
Figure 2.14
Depletion zone
P N
Mobile electron
Mobile hole
Fixed ionized acceptor atom
Ed
Fixed ionized doner atom
Figure 2.15
SEMICONDUCTORS 2.23
Forward current
Figure 2.16
Figure 2.17
V- I Characteristics
Forward current
+ –
+ –
mA
A
10 V
Reverse Forward
voltage voltage
0.5 V
A
Reverse current
Figure 2.18
2.24 ENGINEERING PHYSICS - II
mA
15
V=1V
I R = 100 10
V diode
5
Load line
V
0.5 1
Figure 2.19
SOLVED PROBLEMS
1. Calculate the number of electron-hole pairs per cubic metre in an intrinsic
silicon at 310K, the value of its forbidden energy gap being 1.12 electron
volt. The number of electron-hole pairs per cubic metre in pure germanium
crystal is 2.5 × 10 19 at 300 K and the value of E g for germanium is 0.72 eV.
(Given : Boltzmann constant ‘k’ = 1.38 × 10 –23 J/K).
The density of electron-hole pair in an intrinsic semiconductor is given by
3
2kT 2 3 Eg
n1 = 2 2 m *
h m*e 4
exp per cubic metre.
h 2kT
11600 0.72
= A(300)3/2 exp 2 300
....1
The density of electron-hole pairs in silicon
11600 1.12
ni = A(310)3/2 exp 2 310 ....2
32
310 11600 1.12
exp
2 ni 300 2 310
gives
1 2.5 1019 11600 0.72
exp
2 300
SEMICONDUCTORS 2.27
116 1.12
exp
6.2
= 2.5 × 1019 × (1.033)3/2 116 0.72
exp
6
1
Resistivity = = 0.496 ohm metre.
2.28 ENGINEERING PHYSICS - II
6.025 10 26 5400
Number of germanium atoms per metre³ =
72.6
= 4.5 × 1028
4.5 10 28
Boron density =
105
= 4.5 × 1023 atom/m³.
Approximately the hole density is about 10 8 times greater that electron density,
we can neglect the electron contribution in calculating the electrical conductivity.
= peµp
= 4.5 × 1023 × 1.6 × 10 –19 × 0.2
= 1.44 × 104 ohm–4 metre–1
1
and =
= 0.694 × 10–4 ohm metre
Germanium becomes p-type semiconductor due to the addition of boron atoms.
Further conductivity increases enormously nearly 10 4 times.
3. A n type semiconductor specimen has hall coefficient RH = 3.66 × 10–4 m³/
coulomb. The conductivity of specimen is found to be 112 ohm –1 m –1 .
Calculate the charge carrier density n e and electron mobility at room
temperature.
3 1
RH = 8 ne e
3 1 3 1
ne = 8 R e 8 = 2 × 1022/m³
H 3.66 10 1.6 1019
4
= e ne (µe + µh)
Assuming µh = 0,
= e n e µe
112 m2
µe = 0 . 035 .
e ne 1.6 10 19 2 10 22 Vs
SEMICONDUCTORS 2.29
4. Find the conductivity of intrinsic silicon at 300 K. It is given that the intrinsic
concentration at 300 K in silicon is 1.5 × 10 16 /m³ and the mobilities of
electrons and holes in silicon are 0.13 m²/V-s and 0.05 m²/V-s respectively.
The number of silicon atoms/m³ = 5 × 10 28 . Also find the resultant
conductivity if donor or acceptor type impurity is added to the extent of 1
impurity atom in 10 8 silicon atoms.
a) Intrinsic conductivity of silicon = nie (µe + µh)
= 1.5 × 1016 × 1.6 × 10–19 × (0.13 + 0.05)
= 0.432 × 10–3 ohm–1 m–1.
b) Conductivity of silicon during donor impurity is added can be calculated as follows.
N D = 5 × 1020 atoms/m³ since 1 donor atom in 10 8 silicon atoms.
Further n ND
n =
n i2
1.5 1016 2
0.45 1012 / m 3
ND 5 10 20
= 10.4 ohm–1m–1
NA = 5 × 1020 atoms/m³
p NA
= 4 ohm–1m–1.
2.30 ENGINEERING PHYSICS - II
2 Eg 1 1
exp
1 2k T2 T1
log10 2 0.72 1.6 10 19 1 1 = 0.395
23
1 2.303 2 1.38 10 293 313