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Introduction
The main focus of the 8.14 release is Main Features
on supporting testpoints throughout
the software suite. Testpoints
This means that testpoints can be Set minimum requirements
both placed on the schematic and and clearances, then use live
the layout or simply designated as coverage monitor to achieve
an existing pad/via on the layout. compliance.
Testpoint strategies and clearances
can be created and a live coverage
monitor shows progress and Differential Pair
compliance.
Configurator
Separately, we’ve added a differential
Easily define the signal paths for
pair configurator on the schematic to your diff pairs, including pass
simplify the setup and make it easy to through components.
specify pass through components on
the diff pair signal lines.
Resin Filled Via
Support
Specify vias as resin filled to
prevent solder wick when used
as via in pad.
Testpoint support
Dedicated support for testpoints:
• Set minimum numbers on a net class basis.
• Define clearances, board sides and other rules.
Align and Distribute • Either place and wire or designate existing pads/
vias.