,

NANO POLISHING
Presented by
S.SARAVANAN,
AP & HOD / Mechanical Engg.,
 INTRODUCTION
Nanotechnology was first used to classify integrated
manufacturing technologies and machine systems which provide
ultra precision machining capabilities in the order of 1 nm.
TRADITIONAL FINISHING PROCESSES
• Coated abrasives
• Belt Grinding
• Wire Brushing
• Honing
• Super finishing
• Lapping
• Chemical-Mechanical Polishing
• Electroplating
TRADITIONAL FINISHING PROCESSES
Coated Abrasives – have a more
pointed and open structure
than grinding wheels. Uses
coated abrasives in the form of
a belt; cutting speeds are about
2500-6000 ft/min Common
examples: sand paper, emery.

Belt Grinding – high rate of

material removal with good
surface finish
Finishing Operations
• Wire Brushing -
produces a fine or
controlled texture

• Honing – Used
mainly to improve
the surface finish of
holes like boring,
drilling, or internal
grinding. .
Finishing Operations
• Superfinishing – very
light pressure in a
different path to the
piece

• Lapping – abrasive or
slurry wears the piece’s
ridges down softly
Finishing Operations

• Chemical-mechanical
Polishing – slurry of
abrasive particles and a
controlled chemical
corrosive
• Electropolishing – an
unidirectional pattern
by removing metal from
the surface
 ADVANCED FINISHING PROCESSES (AFPs)
The performance and use of certain specific
process depend on work piece material properties
and functional requirement of the component.

Abrasive Flow Machining (AFM)

Magnetic Abrasive Finishing(MAF),
Magnetic Float Polishing (MFP),
Magneto rheological Finishing (MRF),
Magneto rheological Abrasive Flow Finishing (MRAFF)
Chemo Mechanical polishing (CMP)
Abrasive Flow Machining (AFM)
 Magnetic Abrasive Finishing (MAF)

WORKING PRINCIPLE
EXPERIMENTAL SETUP
 Magneto rheological Finishing (MRF)
Magneto rheological effect
EXPERIMENTAL SETUP
Magneto rheological Abrasive Flow Finishing (MRAFF)
MECHANISM OF MRAFF
EXPERIMENTAL SETUP
Magnetic Float Polishing (MFP)
Elastic Emission Machining (EEM)

Rotating sphere and work piece interface in EEM

EXPERIMENTAL SETUP
Chemical Mechanical polishing (CMP)

Schematic of CMP planarization process equipment

MICRO EXTRUSION