11th European Conference on Non-Destructive Testing (ECNDT 2014), October 6-10, 2014, Prague, Czech Republic

Eddy current imaging using array probes

More Info at Open Access Database www.ndt.net/?id=16514

Gerhard MOOK 1, Youri SIMONIN 1

1
Institute of Materials and Joining, Otto-von-Guericke-University Magdeburg; Magdeburg, Germany
Phone: +49 391 6714555, Fax: +49 391 6714569; e-mail: mook@ovgu.de, simonin@ovgu.de

Abstract
Electromagnetic imaging is a rapidly developing branch of NDT. For some decades eddy current has been
visualizing the area under inspection using single probes attached to mechanical scanners. Some years ago array
probes appeared reducing the handling costs and the inspection time significantly.
The paper presents steps ahead to modular one dimensional and two dimensional low frequencies probe arrays
able to penetrate below the surface and provide good lateral resolution. That way, they bring up not only surface
but also hidden defects and anomalies in flat or even curved objects.

Keywords: Eddy current testing (ECT), low frequency probe arrays, tube inspection, matrix probes, hidden
defects

1. Introduction
Eddy current method brings up the distribution of conductivity, magnetic permeability and
some geometric parameters of the object under inspection. Usually, a single open coil system
fed by an alternating current induces eddy currents in a conductive material. The eddy
currents build up a response field interfering with the exciting field. The complex
measurement signals may be used for imaging. One of the pioneers in this field was Thomas
[1] who used mechanical scanners to systematically move the probe along the object. Scholz
already suggested a two-dimensional array probe [2]. From that point eddy current array
probes started to develop [3-23].Today, even flexible probe arrays are available [24].
For hidden defect detection and characterization one has to use low inspection frequencies.
Low frequency receiver coils should get more windings, high permeable ferrite cores or
sophisticated balancing of two or more coils. On the other hand, anisotropic magneto-resistors
(AMR) [25] and giant magneto-resistors (GMR) [26, 27] were tested to substitute inductive
receivers by new magneto-resistors. These elements are able to sense even DC fields. Their
drawbacks are non-linearity, saturation, hysteresis effects and the demand for DC offset. For
eddy current applications, special inductive receivers perform not worse than magneto-
resistors and are easier to handle.

2. Probe elements

Not a single eddy current probe type can meet all demands occurring in imaging tasks. On the
one hand, good spatial resolution is possible with small coils and high inspection frequencies.
But such probes are characterized by low penetration. On the other hand, for good penetration
lower frequencies with bigger coils are needed not providing sufficient spatial resolution.

2.1 Probe types

One kind of inductive probes with increased inspection depth is the non-axial transmit-receive
type sometimes called half transmission, pitch-catch or even remote field probe. This probe
type offers the opportunity to optimize the distance between the transmitting and the receiving
coil. Figure 1 brings up the principle of these probes. The magnetic field of the exciting coil
penetrates accordingly to the well known rules of alternating field spreading into the material.
The receiving coil only picks up this part of the flux, which has penetrated deeply into the
material. The larger the spacing between the two coils the deeper the detected flux lines have
penetrated into the material but the lower becomes the measurement signal.
This system of two non-axial coils may be considered as an axial coil system with a diameter
corresponding to the coil distance of the non-axial system. With increasing distance (or
diameter) of the coils the defect volume decreases relatively to the volume of interaction
lowering the signal amplitude. One has to trade off between these parameters.

Fig. 1. Non-axial probe selects deep penetration field trajectories

2.2 Point spread function

Figure 2 displays the Point Spread Function of this probe type. It differs significantly from
that of common axial eddy current probes [4] and is most suitable for imaging applications.

Fig. 2: Calculated signal distribution of a small hidden pore, z - signal magnitude (arb. units), x and
y - position of the pore, calculated using VIC-3D code

3. Linear arrays
The principle of the sensor array has been presented by the authors in [18-22]. Instead of a
single sensor many sensors are combined into a sensor array. The speed of electronic field
movement ranges from 0.4 to 3 m/s according to the inspection requirements. This linear
array is guided over the area of inspection and provides eddy current images in real time. A
rotary encoder picks up the displacement of the array and cares for correct imaging. All
necessary electronics is concentrated in the array’s housing, so that a single USB-cable to the
notebook is sufficient for energy supply and data transfer. Figure 3 shows the array over an
engraved aluminium sheet as reference piece. On the left, the control windows gives access to
the setting and displays the signals of all sensors in the XY-plane.

Fig. 3: Sensor array, left: control window, right: array over the reference sheet

Figure 4 displays the picked up images. The engraving is clearly readable from the front side
and the back side also. The first image on the left represents the original data, the second
includes a threshold and the third is a false color representation. For edge enhancement may
be used filters, e.g. band or high pass filters. A common band pass has to be adopted to the
velocity of array over the object. Spatial filtering avoids this disadvantage. Not the time but
the displacement is the filter base. The spatial frequency is given by the number of repetition
per length. This way, this filter does not depend on the velocity of the movement.
The right image of Figure 4 gives an idea of the high pass effect. At the same time, this filter
eliminates the need of balancing each sensor of the array.

Fig. 4: Eddy current images of the sensor array, from left to right: raw data, data with y-threshold,
false color image, high pass filtered image

Figure 5 displays a real aluminium cast with hidden anomalies. Other applications also cover
curved surfaces like pipes, rods or rails.
 Fig. 5: Visualization of hidden anomalies in aluminium cast,
a) photograph of the area of interest, b) electromagnetic signature of this area,
c) photograph after 1 mm rework brings up the anomaly visually.

4. Curved arrays
For curved surfaces eddy current arrays also may be fitted. Figure 6 gives some ideas for
convex objects like pipes, rods or rails.

Fig. 6: Potential applications of probe arrays for curved surfaces

The arrays are also suited for concave objects like tube inspection from the inner surface.
Figure 7 displays a probe for 21 mm inner diameter tubes.

USB connector Housing of 4-channel EC electronics 4 parallel working arrays Centering

and centering

Fig. 7: Low frequency tube inspection probe with four sensor arrays

Four spring-loaded heads cover the complete circumference. Additional sensors record the
wall thickness. The inspection speed reaches up to 120 mm/s. The probe contains all analog
and digital hardware for the arrays and is connected to a notebook by an extended USB cable
of up to 30 m length. No additional power supply is required making the handling most
comfortable.
Figure 8 shows one of the head and its measurement in the complex plane. All sensor signals
may be watched simultaneously either in the complex plane or in the C-Scan display. If
necessary each sensor may be adjusted individually. The head carrier is made from titanium
for minimal wear out. Flexible strips connect each head to its electronics.
 Fig. 8: Single sensor head with coil array and complex plane indication

The C-Scans are recorded from the x- and the y-components of all sensors. The travel
distance is recorded by a cable driven wheel encoder. The encoder itself is also plugged to a
USB-port of the notebook.

Fig. 9: Circumferential C-Scan image of an austenitic steel tube of 21 mm inner diameter with standard
calibration defects of different distance. The scan consists of 36 sensor tracks.

Figure 9 displays a 600 mm section of an austenitic steel tube of 21 mm inner diameter.

Groups of standard calibration defects with different distance become visible.

5. Two dimensional arrays

The principle of multiplexed coils may be extended to 2D-arrays. The first array in Figure 10
is optimized for large inspection areas covering 38 x 44 mm with a resolution of about
1.5 mm. The array electronics contains the 256-channel eddy current instrument and
communicates with a Windows-Notebook via USB. The sensors may work in two different
modes. In half-transmission mode each coil corresponds with its neighbours (705 sensors), in
single core mode each coil works separately (256 sensors). The build-up time is 0.64 seconds
providing an image refresh rate of 1.56 Hz.

Fig. 10: Flat array consisting of 16x16 coils working as 961 sensors covering an area of
38 x 44 mm, dimension of the array housing: W x D x H = 60 x 60 x 82 mm
6. Micro-Scanning

When put on the engraved aluminium sheet (Figure 11) the large array provides images
shown in the four right frames of Figure 12. The individual sensors can be recognized in the
image. Only the 10-mm-font and partially the 7-mm-font can be read.

Fig. 11: The flat array on the engraved aluminium sheet for testing the spatial resolution

The idea of micro-scanning [23] consists of moving the array by steps, much lower than the
distance between the single sensors and accumulate a weighted resultant image. When moved
by 0.5 mm steps the resultant image is much clearer and less noisy than every of the original
images. The right frame in Figure 12 gives the evidence of the increase in readability down to
the 5-mm-font. The dark halo of every sign is the result of the Mexican hat PSF.

Fig. 12: Images of the flat array in pitch-catch mode on the engraved aluminium sheet,
left: sequence of 4 eddy current images gathered with minimal shift of the array by 0.5 mm,
right: weighted images following the principles of micro-scanning

For this micro-scanning the displacement of the array should be measured. Among the
possible solutions we find mechanical systems like wheels or optical systems like sensors
known from computer mice. These sensors calculate the displacement using two or more
subsequent images of the substrate. Known techniques like differential image processing and
2D-correlation algorithms are implemented in a special processor inside the mouse.
We combined a mouse optics with an array optimized for spatial resolution and fast image
refreshing. It consists of 60 coils of 2 mm diameter providing a resolution of about 1 mm. The
refresh rate reaches the European video clock of 25 Hz. Figure 13 explains how an array can
fill the whole area of inspection without any gaps.
For increasing the signal-to-noise-ratio the software can integrate over a number of
subsequent images. The images may be stored for quality documentation or defect growth
analysis. Basing on the magnitude and the angle of the defect signal in the complex
measurement plane defect classification becomes possible.

Fig. 13: Covering the area of inspection by a probe array track by track. An optical mouse sensor
records the relative position of the array and helps to stitch the track images.

The micro-scanning has another advantage even in this situation. When scanning large areas
the array may be moved fast. If there is any indication and the sensor is moved slower, the
image quality automatically will enhance for good visualization and documentation. This
way, an optimum between inspection speed and image quality is found.

7. Conclusion
Eddy current arrays using non-axial probes at low frequencies can combine fast imaging with
good resolution and penetration. Compared with single probe scanners the handling becomes
much easier and cheaper. With rotary applications curved arrays can save the sophisticated
mechanical rotor.
The eddy current hardware is reduced to a minimum and addresses most signal treatment to
the software. This way, the complete electronics is enclosed in the array’s housing and easily
can be connected to the notebook via USB.

References

1. H-M Thomas and G Weigelt, ’Anwendung von Wirbelstromverfahren zur quantitativen Bestimmung der
Tiefenausdehnung von Korrosionsschäden an Aluminiumstrukturen’, DECHEMA final report 11L08-4,
1991.
2. A Scholz, ’Sondenmatte - neuer Weg für die Oberflächenprüfung mit Wirbelstrom‘, Proc DGZfP Annl
Conf, Trier, pp 218-22, May 1990.
3. M Gramz and T Stepinski, ‘Eddy Current Imaging array sensors and flaw reconstruction’, Research in
Nondestructive Evaluation, Vol 5, pp 157 -174, 1994.
4. G Mook, J Simonin and F Heindörfer, ‘Aspekte der Bildgewinnung und -verarbeitung in der
Wirbelstromprüfung‘, Proc DGZfP Annl Conf, Timmendorfer Strand, pp 255-262, May 1994.
5. S P Sullivan, V S, Cecco, L S Obrutsky, J R Lakhan and A H Park, ‘Validating Eddy Current Array Probes
for Inspecting Steam Generator Tubes’, ndt.net, January, Vol 3, No 1, 1998.
6. T Sollier, M Talvard and M Aïd, ‘Use of EC Sensor Arrays on Thin Films’, in S S Upda et al. (Eds.),
‘Electromagnetic Nondestructive Evaluation (IV)’, IOS Press, 2000.
7. G Lafontaine and R Samson, ‘Eddy Current Array Probes for Faster, Better and Cheaper Inspections’,
ndt.net, October, Vol 5, No 10, 2000.
8. G Mook, J Pohl and F Michel, ‘Non-destructive characterization of smart CFRP structures’, Smart Mater
Struct, Vol 12, pp 997-1004, 2003.
9. C Gilles-Pascaud, B Lorecki and M Pierantoni, ‘Eddy current array probe development for non-destructive
testing’, 16th World Conf on NDT, Montreal, Aug-Sep 2004.
10. L Perez, C Dolabdjian, C W Waché and L Butin, ’Advance in magnetoresistance magnetometer
performances applied in eddy current sensor arrays’, 16th World Conf on NDT, Montreal, Aug-Sep 2004.
11. V Zilberstein, N Goldfine, A Washabaugh, V Weiss and D Grundy, ‘The use of fatigue monitoring MWM-
arrays in production of NDI-Standards with real fatigue cracks for reliability studies’, 16th World Conf on
NDT, Montreal, Aug-Sep 2004.
12. W D Feist, G Mook, J H Hinken, J Simonin and H Wrobel, ‘Electromagnetic detection and characterization
of tungsten carbide inclusions in non-ferromagnetic alloys’, Advanced Engineering Materials, Vol 7, No 9,
pp 841-846, 2005.
13. E Pelletier, M Grenier, A Chahbaz and T Bourgelas, ‘Array Eddy Current for Fatigue Crack Detection of
Aircraft Skin Structures’, Proc Vth Int Workshop on Advances in Signal Processing for NDE of Materials,
Québec City, Canada, Aug 2005.
14. P Y Joubert, Y Le Diraison, J Pinassaud and L Satie, ‘Eddy Current Imager for the Detection of Buried
Flaws in Large Metallic Structures’, Proc 9th ECNDT, Berlin, Sep 2006.
15. P Meilland, ’Novel Multiplexed Eddy-Current Array for Surface Crack Detection on Rough Steel Surface’,
Proc 9th ECNDT, Berlin, 2006.
16. W Reimche et al, ‘Development and Qualification of a Process-Oriented Nondestructive Test Method for
Weld Joints to Operate with Remote Field Eddy Current Technique’, Proc 9th ECNDT, Berlin, Sep 2006.
17. R Grimberg, A Savin, S Leitoiu, A Bruma, R Steigmann, L Udpa and S Udpa, ‘Automated Eddy Current
Data Analysis’, 4th Int Conf on NDT, Hellenic Society for NDT, Chania, Crete-Greece, Oct 2007.
18. G Mook, F Michel, J Simonin, M Krüger and M Luther, ‘Subsurface Imaging using Moving
Electromagnetic Fields and Surface Acoustic Waves’, in: G Busse, D v Hemelrijck, I Solodov and A
Anastasopoulus, ‘Emerging Technologies in Non-Destructive Testing’, Taylor & Francis, pp 275 -280,
2008.
19. G Mook, F Michel and J Simonin, ’Wirbelstrom-Bewegtfeldsensoren - Potenziale für die industrielle
Anwendung, Proc DGZfP Annl Conf, St Gallen, Apr 2008.
20. G Mook, ’Randschichtprüfung mit bildgebenden Wirbelstromverfahren - Neue Wege zur Fehlerdetektion
und -bewertung‘, ZfP in Forschung, Entwicklung und Anwendung, Proc DGZfP Annl Conf, Erfurt, May
2010.
21. G Mook, P Rost, F Michel and J Simonin, ’Low Frequency Eddy Current Arrays with Video Clock’, 10th
ECNDT, Moscow, Jun 2010.
22. G Mook, F Michel and J Simonin, ’Electromagnetic imaging using probe arrays’, J of Mechanical
Engineering, Vol 57, No 3, pp 227 -236, 2011.J-M Decitre, D Premel, G Mangenet, E Juliac and W D
Feist, ‘Flexible EC Array Probe for the Inspection of Complex Parts developed within the European
VERDICT Project’, Proc 9th ECNDT, Berlin, Sep 2006.
24. A Lamarre, ’Flexible PCB-based eddy current array probes for the inspection of turbine components’, 9th
Int Conf on NDE in Relation to Structural Integrity for Nuclear and Pressurized Components, Seattle,
Washington, May 2012.
25. G Mook, O Hesse and V Uchanin, ‘Deep Penetrating Eddy Currents and Probes’, Proc 9 th ECNDT, Berlin,
Sep 2006.
26. A Yashan, W Bisle and T Meier, ‘Inspection of Hidden Defects in Metal-Metal Joints of Aircraft Structures
Using Eddy Current Technique with GMR Sensor Array’, Proc 9 th ECNDT, Berlin, Sep 2006.
27. F Vacher, C Gilles-Pascaud, J M Decitre, C Fermon, M Pannetier and G Cattiaux, ‘Non Destructive
Testing with GMR Magnetic Sensor Arrays’, Proc 9th ECNDT, Berlin, Sep 2006.