FYP Mid Defense

Thermal Management of
Microelectronics Devices using
Nanofluid with Metal Foam Heat Sink

Presented By:
Shahzaib Anwar (180501008)
M. Teham Tahir (180501016)

Supervisor:
Dr. Naseem Ahmad

BS-Mechanical Engineering
 INTRODUCTION

➢Microelectronics are mainly manufactured using semiconductor materials

➢Composed of transistors, capacitors, inductors, resistors, and diodes

connected through wire bonding

➢To counter heat dissipation in microelectronics cooling systems are needed.

This can be achieved using a combination of metal foam, heat sinks, and
nanofluids

10/19/2022 3
 Metal Foam

➢Metal foam is a cellular structure comprised of solid metal with gas filled
pores.

➢Metal foam can be open cell or closed cell. Open cell foam used in
electronics cooling.

➢Metal foam has very low mass, large exchange surface area, high
permeability, high effective thermal conductivity, and high pressure
resistance.

10/19/2022 4
 Nanofluid

➢Combination of nanoparticles and base fluid.

➢Better thermal properties than base fluid.

➢Properties depend on concentration of nanoparticles and type of base fluid.

➢Hybrid nanofluids have two or more types of nanoparticles.

10/19/2022 5
 Fins

➢Extended surfaces

➢One of the most commonly used method for improving heat transfer.

➢Different configurations like in-line, staggered, and V shape.

➢Different shapes like pin fins, rectangular, annular, and constant or variable
area.

10/19/2022 6
 Thermal Management of Electronic Devices

➢Overheating a major concern in electronics during operation

➢Involves the generation, control and dissipation of heat generated

➢Avoids failure and shortage of service life of electronics

➢Techniques used include heat sinks, thermoelectric coolers, forced convection

systems, fans, and heat pipes

10/19/2022 7
OBJECTIVES
A configuration of metal
A cooling system that can be
foam and nanofluid that
used for effective
provides best thermal
microelectronics cooling
performance

Improve the service life and

Perform a parametric study
reliability of microelectronic
to obtain the best results
devices

10/19/2022 8
LITERATURE REVIEW
Year Author Title Important Points
2013 Tu-Chieh Hung , Numerical Optimization • For a specified pumping power, number of channels,
Yu-Xian Huang , of the Thermal channel aspect ratio and channel width ratio decrease as
Tsung-Sheng Sheu Performance of a Porous- porosity of microchannel decreases.
& Wei-Mon Microchannel
Yan Heat Sink • As pumping power increases, values of number of
channels and channel aspect ratio increase whereas
channel width ratio increases till its maximum value is
reached.
2013 Mostafa Keshavarz CFD investigation of • The heat transfer coefficient increases with increasing
Moraveji, Reza nanofluid effects (cooling the Reynolds number and the nanoparticle concentration.
Mohammadi performance and pressure
Ardehali , Ali Ijam drop) in • The Nusselt number depends on thermal conductivity,
mini-channel heat sink heat capacity, viscosity, density and velocity of the
nanofluid.

10/19/2022 9
Cont’d…
Year Author Title Important Points
2016 A.M. Bayomy, M.Z. Saghir Experimental study of • Metal foam filled channel enhanced the heat
using γ-Al2O3–water transfer when compared to empty channel.
nanofluid flow through
aluminum foam heat • Nanofluids enhanced the average Nusselt number
sink: Comparison with when compared with pure water.
numerical approach

2017 Seyed Ebrahim Ghasemi, Experimental evaluation • A considerable enhancement in heat transfer
A.A Ranjbar, M.J. of cooling performance of coefficient when using nanofluid instead of pure
Hosseini circular heat sinks for water.
heat dissipation from
electronic chips • Small percentage increase in pumping power with
using nanofluid the use of nanofluids compared to pure water.

10/19/2022 10
Cont’d…
Year Author Title Important Points
2019 Turgay Coşkun & Erdal Heat Transfer • Nanofluids improve the thermal conductance in
Çetkin Enhancement in a each case, however there is also an increase in
Microchannel resistance to flow.
Heat Sink: Nanofluids
and/or Micro Pin Fins • Depending on material properties of the
substances, the volume fraction which provides
minimum peak temperature is affected.
2019 P.C. Mukesh Kumar, C.M. Numerical evaluation of • Improvement in heat transfer coefficient is due to
Arun Kumar cooling performances of lower thermal resistance and effective mixing of
semiconductor using nanoparticles in the base fluid.
CuO/
water nanofluids • There is no sudden change in temperature which
leads to reduced thermal stresses when using
nanofluid.

10/19/2022 11
Cont’d…
Year Author Title Important Points
2019 C. A. Welsford, C. Effects of nanofluid • When pumping power is not a major constraint
S. Delisle, R. D. concentration and channeling porously filled channels are favorable due to
Plant, M. Z. on the thermal increased convective strength.
Saghir effectiveness of highly porous
open-cell foam metals: a • When pumping power is a constraint, bulk porous
numerical media are preferable.
and experimental study
2020 Z. Alhajaj, A.M. A comparative study on best • Nanofluids with water as base fluid give a better
Bayomy, M.Z. configuration for heat thermal performance than those with ethyl base fluid.
Saghir enhancement using
nanofluid • Nanoparticles with water base mixture have a lower
friction factor when compared to same nanoparticle
concentration with ethyl base fluid.

10/19/2022 12
Cont’d…
Year Author Title Important Points
2021 • Excessive number of fins block the fluid flow path
Md. Zavid Iqbal
which disrupts the convection rate.
Bangalee, Md.
Mizanur Rahman, Numerical Optimization of a
• Increasing baseplate thickness increases heat sink
Khairy Zaimi, CPU Heat Sink Geometry
capability to absorb heat. Increase in fin height
Mohammad
increases heat transfer, until a certain height is
Ferdows
achieved.
2021 Mohammed Design and Simulation of • Heat dissipation and temperature decide geometry of
Imran, Syed Heat Sink for model, selection of material, and number of fins.
Abdul Moeed Different Components
Geometry with Various
Heat Capacities

10/19/2022 13
 METHODOLOGY

Literature survey of already existing methods and technology used in

electronics cooling

Use of SOLIDWORKS to generate the CAD model for the fins,

nanofluid, and metal foam regions.

Use of ANSYS FLUENT for simulation of the model and generation

of results.

10/19/2022 14
 CAD AND SIMULATION MODELS

➢Fins ➢Metal Foam

10/19/2022 15
 ➢Nanofluid ➢Assembly

10/19/2022 16
 ➢ANSYS Model ➢Mesh

10/19/2022 17
 CALCULATIONS AND SIMULATION
RESULTS
➢For Finned Heatsink:- ➢𝑃𝑟 = 0.70707
1
➢𝑇𝑏𝑎𝑠𝑒 = 400 𝐾 ➢𝛽 = = 2.857 ∗ 10−3 𝐾 −1
350
➢𝑇𝑠𝑢𝑟𝑟 = 300 𝐾 ➢Taking:-
300+400
➢𝑇𝑓 = = 350 𝐾 ➢𝐿 = 0.085 𝑚
2
➢At 350 K:- ➢𝑊 = 0.085 𝑚
𝑊 ➢𝐻 = 0.05 𝑚
➢𝑘 = 0.029712
𝑚𝐾
𝑚2 ➢𝑡 = 0.002 𝑚
➢υ = 2.0649 ∗ 10−5
𝑠

10/19/2022 18
 𝑔∗𝛽∗ Δ𝑇 ∗𝐿3
➢𝑅𝑎 =
υ2
➢𝑅𝑎 = 142.7 ∗ 103
𝐿
➢𝑆 = 2.714 ∗
𝑅𝑎0.25
➢𝑆 = 0.012 𝑚
𝑊
➢𝑛 =
𝑆𝑜𝑝𝑡 +𝑡

➢𝑛𝑓𝑖𝑛 = 6 𝑓𝑖𝑛𝑠

10/19/2022 19
 Velocity Temperature (K) Pressure (Pa)
0.01 351.318 1.4336
0.02 344.223 3.052
0.03 339.102 4.774
0.04 334.912 6.519
0.05 331.507 8.346
0.06 329.185 10.361
0.07 327.363 12.7

10/19/2022 20
 CONTOURS OF BEST SIMULATION
➢TEMPERATURE ➢PRESSURE

10/19/2022 21
 For Nanofluid

➢𝜌𝑒𝑓𝑓 = 1 − Φ ∗ 𝜌𝑓 + Φ ∗ 𝜌𝑝
1−Φ ∗(𝜌𝑓 ∗𝑐𝑝,𝑓 )+Φ∗(𝜌𝑝 ∗𝑐𝑝,𝑝 )
➢𝑐𝑝,𝑒𝑓𝑓 =
𝜌𝑒𝑓𝑓
𝜇𝑓
➢𝜇𝑒𝑓𝑓 =
1−Φ 2.5
𝑘𝑝 + 𝑛−1 ∗𝑘𝑓 − 𝑛−1 ∗Φ∗(𝑘𝑓 −𝑘𝑝 )
➢𝑘𝑒𝑓𝑓 =
𝑘𝑝 + 𝑛−1 ∗𝑘𝑓 +Φ∗(𝑘𝑓 −𝑘𝑝 )
➢ Where:-
➢ Φ = 𝑁𝑎𝑛𝑜𝑓𝑙𝑢𝑖𝑑 𝑣𝑜𝑙. 𝑐𝑜𝑛𝑐.
➢ 𝑛 = 𝑆ℎ𝑎𝑝𝑒 𝐹𝑎𝑐𝑡𝑜𝑟 = 3

10/19/2022 22
 For Different Nanofluids

Nanofluid 𝝆𝒆𝒇𝒇 (𝒌𝒈Τ𝒎𝟑 ) 𝒄𝒑,𝒆𝒇𝒇 (𝑱Τ𝒌𝒈𝑲) 𝝁𝒆𝒇𝒇 (𝒌𝒈Τ𝒎𝒔) 𝒌𝒆𝒇𝒇 (𝑾Τ𝒎𝑲)

Alumina 1022.02 4067.39 9.1367*10−4 1.027
Copper 1077.52 3864.7 9.1367*10−4 1.030
Copper Oxide 1053.02 3955.06 9.1367*10−4 1.027
Silicon Carbide 1020.12 4169.80 9.1367*10−4 1.030
Silicon Dioxide 1014.52 4090.48 9.1367*10−4 1.026
Zinc 1059.42 3924.50 9.1367*10−4 1.030

10/19/2022 23
 Nanofluid Temperature (K) Pressure (Pa)
Alumina 324.488 7.742
Copper 324.16 7.824
Copper Oxide 324.461 7.827
Silicon Carbide 324.217 7.849
Silicon Dioxide 324.522 7.845
Zinc 324.406 7.832

10/19/2022 24
 CONTOURS OF BEST SIMULATION
➢TEMPERATURE ➢PRESSURE

10/19/2022 25
 PROGRESS

Literature Review of majority of articles needed for completion of

project.

Design of fins for the heatsink needed for the cooling system.

Selection of the Nanofluid and its Concentration needed for the cooling
system.

10/19/2022 26
 REMAINING WORK
Any additional articles needed for consultation related to selection of metal
foam for heatsink.

Selection of Metal foam porosity and pore density for maximum

performance of heatsink.

Optimization of the model and compilation of results.

Writing of Thesis and designing of project poster.

10/19/2022 27
QUESTIONS
THANK YOU