INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION #20730

Generic Copy

Issue Date: 13-Jan-2015

TITLE: Back Grind/Back Metal Capacity Expansion at the ON Semiconductor Wafer Fab (CZ4)
located in Roznov, Czech Republic.

PROPOSED FIRST SHIP DATE: 20-May-2015

AFFECTED CHANGE CATEGORY(S): ON Semi Wafer Fab Site and assembly sites

FOR ANY QUESTIONS CONCERNING THIS NOTIFICATION:

Contact your local ON Semiconductor Sales Office or following Contact Sales and Marketing and
Product Engineers:

IPCN Contact Person by Affected Technology:

Sales / Marketing Richard White Richard.White@onsemi.com
IGBT3
Product Engineering Marc Fillion Marc.Fillion@onsemi.com
Sales / Marketing Richard White Richard.White@onsemi.com
IGBT4
Product Engineering Marc Fillion Marc.Fillion@onsemi.com

NOTIFICATION TYPE:

Initial Product/Process Change Notification (IPCN)

First change notification sent to customers. IPCNs are issued at least 120 days prior to
implementation of the change. An IPCN is advance notification about an upcoming change and
contains general information regarding the change details and devices affected. It also contains the
preliminary reliability qualification plan.

The completed qualification and characterization data will be included in the Final Product/Process
Change Notification (FPCN).

This IPCN notification will be followed by a Final Product/Process Change Notification (FPCN) at least
90 days prior to implementation of the change.

Issue Date: 13-Jan-2015 Rev. 00-April 2014 Page 1 of 3

INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION #20730
DESCRIPTION AND PURPOSE:

ON Semiconductor is pleased to announce the intent to implement in the third quarter of the year
2015 a back grind & back metal capacity expansion at the CZ4 Wafer Fab at Roznov, Czech
Republic. This expansion will supplement the current back grind & back capability ISMF Fab in
Seremban, Malaysia.

Upon expiration of the associated Final PCN(s), the back grind & back metal for the affected devices
could be processed from either the ISMF or CZ4 wafer fab.

QUALIFICATION PLAN:

Full qualification testing will be performed on representative devices or family of devices as necessary
to ensure compliance to all existing ON Semiconductor reliability requirements. Specific plans and
qualification results for each device family will be announced via individual Final PCN’s as those
qualifications are achieved.

Qualification Vehicles:
• NGD8201A
• NGD18N40A

Reliability testing for each qualification vehicle may include the following:

Reliability Test:

Test Test Conditions Read points Sample Size

Scanning Acoustic
PC-SAT Tomography T0 and Post TC 3 lots x 10 units

PC-TC -55 C to 150 C for 1000 cycles Test @ 0, 500, 1000 3 lots x 80 units
2 Units from 1
DPA Post TC1000 Lot
130°C/85% RH, 18.8 PSI for
PC-HAST 96 hrs biased T96, Test at R 3 lots x 80 units
2 Units from 1
DPA Post HAST Lot
RSH Loose Units 30 units
TJ = 150°C for 1000 hrs, 80%
HTRB Bias Test @ 500, 1000 3 lots x 80 units
Test @ IOL4286,
IOL 3.5 min On/Off, ΔT > 100 C IOL8572 3 lots x 80 units
Parametric Verification, Test
PV @ R,H,C >1.67 Cpk 3 lots x 30 units
ESD ESD HBM 1/V per Model 10 units
Unclamped Inductuve
UIS Switching Test at room 5 Units

Issue Date: 13-Jan-2015 Rev. 06-Jan-2010 Page 2 of 3

INITIAL PRODUCT/PROCESS CHANGE NOTIFICATION #20730

List of affected General Parts:

NGB15N41ACLT4G
NGB18N40ACLBT4G
NGB8202ANT4G
NGB8204ANT4G
NGB8206ANSL3G
NGB8206ANT4G
NGB8206ANTF4G
NGB8207ABNT4G
NGB8207BNT4G
NGB8245NT4G
NGD15N41ACLT4G
NGD18N40ACLBT4G
NGD18N45CLBT4G
NGD8201ANT4G
NGD8201BNT4G
NGD8205ANT4G
NGD8209NT4G

List of affected Customer Specific Parts:

SGB8206ANSL3G
SGB8206ANT4G
SGB8206ANTF4G
SGD8290NT4G

Issue Date: 13-Jan-2015 Rev. 06-Jan-2010 Page 3 of 3