Application of photolithographic techniques

with aid of ion implantation in making of

micro processors

CPU Processor
Manufacturing
Introduction
In recent years with the advancement in technology and inevitable need for computing in our daily lives
for daily based tasks has led to manufacture of computer and with that in our simplest gadgets this is
done by programed microchips. Although the production of microprocessors is not an easy task to dealt
with. Thus, new research is being done every day to make them more powerful and smaller.

CPU is considered brain of computer like human brain anatomy it has also complex structure only
possible by MOS technology and its manufacturing require further two discreate method
photolithographic techniques with combination of ion implication to make microprocessors.

The metal–oxide–semiconductor field-effect transistor (MOSFET, MOS-FET, or MOS FET), also known as
the metal–oxide–silicon transistor (MOS transistor, or MOS) is a type of insulated-gate field-effect
transistor (IGFET) that is fabricated by the controlled oxidation of a semiconductor, typically silicon.

Key quality characteristics for consumer

In case of processors consumer is never concerned with geometry or aesthetics so only performance is
considered in this regard.

Type: When one is considering buying a CPU unit either it’s going to be part of a desktop or laptop,
mobile and even for a server there are many variations due to different design no works in others place
and all have different power levels

1. For instance, one favorable position that work area CPUs offer is that they can offer a higher
warm resistance. Work area processors are likewise increasingly good with overclocking.
2. Versatile processors will in general be increasingly slow less force principally to preserve battery
power. In any case, many do offer highlights that work area processors don't, for example,
Wireless Display technology (WiDi)
3. Server processors are worked for high unwavering quality. At the point when these processors
are tried, they are gotten through upsetting conditions, for example, higher temperatures and
high registering loads

Cores: Number of cores integrated also affect the performance single core handles job much slower
than multi core and at the point when processors were running on a solitary center, that one center was
answerable for taking care of the considerable number of information sent to the processor. As more
centers are incorporated into a processor, those centers can separate the processor's assignments. This
makes the processor quicker and progressively proficient

Socket Compatibility: Attachment similarity is an essential concern with regards to purchasing a

processor. The attachment similarity empowers the interface between a motherboard and its CPU. On
the off chance that a motherboard has just been gained, just explicit model of the processor is perfect
with the motherboard's attachment.

Thermal design: Processors create heat. The thermal design power determination allotted to a CPU
clarifies how much heat the processor is going to radiate. This will legitimately influence the kind of
cooling gadget required for a CPU. If the CPU doesn't accompany a cooling gadget or if the cooling
gadget provided isn't utilized, a gadget must be introduced that can cool the framework adequately.
Overheating is an essential risk to a PC's componentry.

Process
The manufacturing process start in a very secured dust proof environment from perfect single crystal
silicon wafers cut into plates on which design circuit projections are to be made by a photo sensitive
resist film is spin coated at surface evenly and UV light is subjected in a particular image and exposed
film is removed by developer later. Now by ion implantation transistors are made onto template (P and
B mainly). Next a barrier is subjected of gold or copper to make sure that each transistor is connected to
other electrically throughout template and then filled with Cu. During process multiple time brief
cleaning is done repeatedly to take away any impurity. multiple layers like these if Si doped together are
stacked onto each other and after 2 months with complete automation processes the processers are
finally ready.

Due to network of integrated circuits connected by copper wire the chips start to function properly and
electric and dielectric properties are achieved in matrix where required. The speed and efficiency
depend on close lessness of IC’s and to matrix design attributes. Currently up to 7nm size transistor
capacity is achieved by latest developments.

General parameters
 Temperature range near room or lower  Batch process
 Fully automated equipment  Extreme precision required
 Aluminum heat sinks used  Checking up to atomic level

Variables in process
1. Silicon crystal formation 3. Type of photo resist film and developer
2. Type of barrier layer used in template 4. UV light and ionization potential

Output via variable variations

1. The crystal formation is first and foremost important in chip making as any defects in crystal can
lead to faulted chips so the temp is above 2500 0F and crystal pulling speed is around 10-
40mm/h anymore and perfect crystal lattice will distort
2. The barrier recently used was Al which is slower now we have switched to Cu which is much
faster but can lead to corrosion problem so that task must be handled beforehand.
3. the selection of photoresist is also crucial positive one has fair adhesion but is vey expensive.it is
aqueous and has minimum thickness of 0.5 um but negative photoresist is organic and has far
better adhesion, but minimum thickness is 2 um and is less expensive and developer used to
etch photoresist should not damage the wafer at any cost and contaminate surface. Leading to
chip failure in application.
4. to expose templet on photoresist minimum wavelength is required to achieve higher resolution
so only feasible option is UV light (ʎ = 350 – 400) and near ionization potential of photoresist 5 –
20 eV above it due to auger transition heat dissipation can lead to contamination of photoresist