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SiGe HBT
Wireless Data, Satellite Termi-
nals
dB
-10.0
S11
GaAs pHEMT
-20.0
Si CMOS
-30.0 S11
Si BJT
S21
GaN HEMT -40.0 S22
S22
InP HBT -50.0
RF MEMS 50.0 150.0 250.0 350.0 450.0 550.0 650.0 750.0 850.0
Specification
Parameter Unit Condition
Min. Typ. Max.
Small Signal Gain 20.0 dB 70MHz
20.0 18.5 21.5 dB 240MHz
20.0 18.5 21.5 dB 400MHz
Output Power at 1dB Compression 20.0 dBm 70MHz
20.0 dBm 240MHz
18.5 21.0 dBm 400MHz
Third Order Intercept Point 41.0 dBm 70MHz
43.0 dBm 240MHz
39.0 41.0 dBm 400MHz
Return Loss 50 to 850 MHz Minimum 10dB
Input Return Loss 15.0 20.0 dB 70MHz to 5000MHz
Output Return Loss 11.0 14.0 dB 70MHz to 5000MHz
Noise Figure 2.7 3.7 dB 500MHz
Reverse Isolation 22.0 dB 70MHz to 5000MHz
Thermal Resistance 48.8 °C/W junction - lead
Device Operating Voltage 5.0 5.3 V
Device Operating Current 82.0 90.0 98.0 mA
Test Conditions: VD =5V, ID =90mA Typ., OIP3 Tone Spacing=1MHz, POUT per tone=0dBm, TL =25°C, ZS =ZL =50, Tested with Bias Tees
RF MICRO DEVICES®, RFMD®, Optimum Technology Matching®, Enabling Wireless Connectivity™, PowerStar®, POLARIS™ TOTAL RADIO™ and UltimateBlue™ are trademarks of RFMD, LLC. BLUETOOTH is a trade-
mark owned by Bluetooth SIG, Inc., U.S.A. and licensed for use by RFMD. All other trade names, trademarks and registered trademarks are the property of their respective owners. ©2006, RF Micro Devices, Inc.
6.0 25.0
5.0
20.0
4.0
P1dB (dBm)
NF (dB)
3.0 15.0
2.0
10.0 25C
25C
1.0 -40C -40C
85C 85C
0.0 5.0
50.0 150.0 250.0 350.0 450.0 550.0 650.0 750.0 850.0
50.0 150.0 250.0 350.0 450.0 550.0 650.0 750.0 850.0
Frequency (MHz) Frequency (MHz)
OIP3 versus Frequency
50.0
45.0
OIP3 (dBm)
40.0
35.0
30.0 25C
-40C
85C
25.0
50.0 150.0 250.0 350.0 450.0 550.0 650.0 750.0 850.0
Frequency (MHz)
0.0 30.0
-5.0
25.0
-10.0
S21 (dB)
S11 (dB)
-15.0 20.0
-20.0
15.0
25C 25C
-25.0 -40C -40C
85C 85C
-30.0 10.0
50.0 150.0 250.0 350.0 450.0 550.0 650.0 750.0 850.0 50.0 150.0 250.0 350.0 450.0 550.0 650.0 750.0 850.0
Frequency (GHz) Frequency (GHz)
0.0 0.0
25C
-5.0 -40C -10.0
85C
-10.0
-20.0
S22 (dB)
S12 dB
-15.0
-30.0
-20.0
-40.0
25C
-25.0 -40C
85C
-30.0 -50.0
50.0 150.0 250.0 350.0 450.0 550.0 650.0 750.0 850.0 50.0 150.0 250.0 350.0 450.0 550.0 650.0 750.0 850.0
Frequency (GHz) Frequency (GHz)
100.0
80.0
Current (mA)
60.0
40.0
-40C
20.0 25C
85C
0.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Voltage (V)
0.0 30.0
25C 25C
-5.0 -40C -40C
85C 25.0 85C
-10.0
S21 (dB)
S11 (dB)
-15.0 20.0
-20.0
15.0
-25.0
-30.0 10.0
50.0 150.0 250.0 350.0 450.0 550.0 650.0 750.0 850.0 50.0 150.0 250.0 350.0 450.0 550.0 650.0 750.0 850.0
Frequency (MHz) Frequency (MHz)
0.0 0.0
25C
-40C
-5.0 -5.0
85C
-10.0 -10.0
S22 (dB)
S12 (dB)
-15.0 -15.0
-20.0 -20.0
25C
-25.0 -25.0 -40C
85C
-30.0 -30.0
50.0 150.0 250.0 350.0 450.0 550.0 650.0 750.0 850.0 50.0 150.0 250.0 350.0 450.0 550.0 650.0 750.0 850.0
Frequency (MHz) Frequency (MHz)
Device Current Over Temperature with Application Circuit
Current versus Voltage Over Temperature
Application Circuit
120.0
100.0
80.0
Current (mA)
60.0
40.0
-40C
20.0 25C
85C
0.0
1.5 2.0 2.5 3.0 3.5 4.0 4.5 5.0 5.5
Voltage (V)
2, 4 GND Connection to ground. Use via holes for best performance to reduce lead inductance as close to ground leads as possi-
ble.
3 RF OUT/BIAS RF output and bias pin. DC voltage is present on this pin, therefore a DC blocking capacitor is necessary for proper oper-
ation.
Package Drawing
Dimensions in inches (millimeters)
Refer to drawing posted at www.rfmd.com for tolerances.
Application Schematic
Vs
1uF 1200pF
4 Lc
1 3
RF in SBB-2089 RF out
Ls
Cb Cb
2
Ordering Information