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LCM SPEC - XT2075 - Nairobi - 6 7FHD - TIANMA - Nairobo - SD18C74384 - 20200513 - LCDstandard-Spec
LCM SPEC - XT2075 - Nairobi - 6 7FHD - TIANMA - Nairobo - SD18C74384 - 20200513 - LCDstandard-Spec
SD18C74384
SPECIFICATION
FOR
( ) Preliminary Specification
APPROVAL
(● ) Final Specification
SUPPLIER Tianma
MODEL TL067FVXH30-00
Version A
REVIEWED BY
CONTENT LIST
No ITEM Page
COVER 1
CONTENTS 2
RECORD OF REVISIONS 6
1 GENERAL DESCRIPTION 7
2 ABSOLUTE MAXIMUM RATINGS 14
3 ELECTRICAL SPECIFICATIONS 15
4 OPTICAL CHARACTERISTICS 31
5 MECHANICAL CHARACTERISTICS 38
6 RELIABLITY TEST 44
7 INTERNATIONAL STANDARDS 45
8 PACKING 46
10 Checklist 50
SCOPE
The purpose of this document is to provide a better understanding of Motorola Mobility requirements for
TFT- LCD and Organic Light Emitting Diode (OLED) Displays to suppliers. Its goal is to clarify quality control
procedures and components specifications, so that suppliers ship only 100% acceptable material to
Motorola.
This document contains specific electrical, optical, mechanical, environmental, packaging, and general
Motorola manufacturing, quality, and qualification requirements.
APPLICABLE DOCUMENTS
12G80967A78 Supplier Material Quality Control
12M09195A94 Supplier Production Part Approval Process (PPAP) and Process Sign-Off (PSO)
12M09198A35 Storyboard Approval, Distribution and Maintenance Process Flow
12M09188A95 Shipping Package Test Specification
12M09162A44 Supplier Material Corrective Action Request Procedure
12M09192A78 Lenovo/Moto Supplier Process/Product Change Notification Procedure
MBG-S-PQM-061COSMETIC SPECIFICATION FOR MOBILITY PHONES AND WEARABLE PRODUCTS
12S10601A Packaging Requirements for Inbound Shipments to Motorola
12G02897W18 Controlled and Reportable Materials Disclosure
12G13933A01 Motorola Receiving Bar Code Specification
12G13933C77 Qualification Procedure for LCD Displays
12M09195A44 LCD Mechanical Strength 4-Point Bending Test Method
MBG-S-SCEQ-053 Display_Touch Panel_ Display Touch Module reliability testing standard
MBG-S-SCEQ-090 Display Touch Module Run in and ERT Testing
TFT Lenovo_Moto Unified ME Workbook
TFT Lenovo_Moto Unified EE Workbook
TFT Lenovo_Moto Unified OE Workbook
TFT Lenovo_Moto Unified Reliability
OLED Lenovo_Moto Unified OLED ME Workbook
OLED Lenovo_Moto Unified OLED EE Workbook
OLED Lenovo_Moto Unified OLED OE Workbook
OLED Lenovo_Moto Unified OLED Reliability
CAUTION: This specification cannot be distributed to parties outside of Motorola Mobility without first having
on file a signed Non-Disclosure Agreement.
If this part does NOT comply with the ESD, Latch-up, or any stress tests as outlined in 12G13933C77, the
following note(s) are required to be added.
CAUTION: This device does not meet all the reliability stress test requirements according to Motorola
Mobility ALT test conditions at the product level. Testing conditions in ALT at product level may have wider
temperature ranges compared with the conditions that are specified in this document.
WARNING: IC's on this product are inherently static sensitive devices. As a result, extreme caution should
be used when handling these parts. Every possible precaution should be taken in the manufacturing
process to insure that any AMOLED display is not exposed to any static voltages.
REQUIREMENT TO 12G13933C77
●This item must be qualified according to the requirements in 12G13933C77.
●Cpk data acquisition:
DESCRIPTION
This display is a color Active Matrix TFT- LCD of glass construction with White pixels on a Black
background. The display consists of 1080 (RGBG - Diamond) x 2520 pixels (sub pixel rendered) with a
color depth of 16.6 M colors (24 bpp). The display interface is 1 MIPI channel with four DSI lane. The
touch interface is via I2C.
Note: This platform display may be used on devices with operating systems such as Android, Linux and
Java which are open source, and thus may be published and available to the general public. The
information contained in any display interaction open source file will be the minimum required to
successfully communicate and configure the display module.
Note: Do not ship any samples for any reason without MTPing the correct manufacturer/version
numbers in registers A1h, DAh, DBh, DCh. If they are not programmed correctly, they will be rejected
as defective. If you have a question regarding the correct programming. contact Motorola DDC
immediately.
QUALIFICATION REQUIREMENTS
Cpk data must be presented to Component Technologies Engineering for the following process control
parameters for initial qualification purposes. Data must be continuously collected for these process control
parameters, and be made available to Motorola upon request for the prior 2 EPrs.
Definitions:
Box-X, [X]: Process Control Parameter: Parameter indicative of process control and capability of
manufacturing component. Refer to 12M80967A78 for further details.
<ST>: Statistical Tolerance Parameter: Used where statistically valid samples are required for non Box-X,
[X] parameters for module approval. Refer to 12M80967A78 for further details.
RECORD OF REVISIONS
Block Diagram
LCD Signal
TFT LCD 1080
X2520
LCD Power
Input connector
DC/DC
Converter
LED Cathode
IC
Output
Pin LED Light Bar
LED Anode
Features
FPC Yuansheng
Upper Prism
3M ASOC 4.0-LS-82(24)HH
Lower Prism
Reflector 3M ESR80-V2
LED JB 01.JB.11AS264W65P03-A1
Change Details
Remar
No. Reason
Before After ks
IR/led hole
1 CG change
Move upward
3 Conductive tape
H/W change
4 Graphite sheet
6 FPC EMI
dot
Design Change 1 shape of Ag L shape
shape
Remarks:
1.H/W change includes all materials, components, label etc.
2.Design change includes size, position etc.
3.S/W change includes initial code etc.
Please pay attention that this list is just a summary, an individual Design Ch
ange List which contain much more information is also needed
Motorola Mobility Confidential Restricted - Do Not Redistribute
Information contained on pages of this document cannot be reproduced or used in whole or in part without Motorola’s written consent.
Printed copies of this document are not controlled.
Material or Methods Specification NO. SD18C74384
Values
Parameter Symbol Units Notes
Min Max
VSP 4.5 6 V
LCD Analog Voltage
VSN -4.5 -6 V
LCD I/O Voltage IOVCC 1.65 1.95 V
LED Current ILED - - mA TYP 20
Storage Humidity Hstg 5% - %RH
Storage Temperature Tstg -30℃ 80 ℃
Applicable
“H” Level Input Voltage VIH 0.7xIOVCC - IOVCC V
Pin: REST
Applicable
“L” Level Input Voltage VIL 0.0 - 0.3xIOVCC V
Pin: REST
Applicable
“H” Level Output Voltage VOH 0.8xIOVCC - IOVCC V Pin: BC
I OUT = -1mA
Applicable
“L” Level Output Voltage VOL 0.0 - 0.2xIOVCC V Pin: BC
I OUT = +1mA
LCD
Power Sleep in PD - 2400 7565 uW
Consumption
Notes:
(1) The specified current and power consumption are under the conditions at VSP = 5.5V,VSN=-5.5V,IOVCC = 1.8V, T = 25°C, and f
v = 60 Hz, at white pattern (TYP)
The specified current and power consumption are under the conditions at VSP = 5.5V,VSN=-5.5V,IOVCC = 1.8V, T = 25°C, and fv =
60 Hz, at R/G/B pattern (MAX)
(2) LED Backlight assumptions:15Vf(MAX), 80 mA. (5S4P LED Total Input )
3-2. Logic Power Consumption
Values
Parameter Symbol Units Notes
Typ Max
IIOVCC 37 58 mA
White Pattern
Normal Mode IVsp 10.6 18 mA
(no touch)
IVsn 8.7 12 mA
IVsn 5 50 uA
Values
Parameter Symbol Units Notes
Min Typ. Max
LED Current ILED 20 mA 5S4P
LED Forward Voltage VLED 14.2 15 V 5S4P
Bit Rate
※Please refer to initial code TX SPD(MBPS) Mbps
Lane 4 Lane
LP_RX
Logic 0 input voltage. not in ULPState VIL - - 550 mV
MIPI DC Diagram
【Note】
*1) This max value corresponds to a minimum 80 Mbps data rate per lane
*2) The minimum UI shall not be violated for any single bit period, i.e., any DDR half cycle within a dat
a
burst.
*3) Total silicon and package delay budget of 0.3 UIINST
*4) Total setup and hold window for receiver of 0.3* UIINST
*5) T SETUP[Rx] and T HOLD[RX] are only for RX without FPCB and connector and guaranteed by
design.
【Note】
*1) Spike due to an electrostatic discharge on RESX line does not cause irregular system reset according to
the table below.
*2) During the reset period, the display will be blanked. (The display is entering blanking sequence, for
which the maximum time is 120ms, when Reset starts is sleep out-mode. The display remains in the
blank state is Sleep In-mode) and then return to default condition for H/W reset.
*3) During Reset Completion Time, ID bytes (or similar) value in MTP block will be latched to the internal
register during this period. This loading is done every time when there is H/W reset complete time
(tREST) within 5ms after a rising edge of RESX.
*4) Spike Rejection also applies during a valid reset pulse as shown below:
*5) It is necessary to wait for 5msec after releasing RESX before sending commands. Also Sleep Out command
cannot be sent for 120msec.
(3)TE
4.1 Tearing Effect Line Modes
the tearing effect output signal consists of V-sync information only.
•NOTE: During sleep in mode, the tearing effect output pin is low.
NOTE: The signal's rise and fall times (tf, tr) are stipulated to become equal to or less than 15ns.
EE
Block A : Power On
Block B : Initialize
Normal mode
Standy by mode
Block F : MIPI CMD mode off
0xFF,0x10
0xFB,0x01
0x3B,0X03,0X20,0X20,0X04,0X04
0XB0,0X00
0XC2,0X1B
0XFF,0XF0
0xFB,0x01
0X5A,0X00
初始化代码
设定和延时
(若代码全部OTP,仅提供点亮初始化code)
0XFF,0X24,
0XFB,0X01,
0X06,0X8B,
0X07,0X8C,
0X1E,0X8B,
0X1F,0X8C,
0XFF,0X25,
0XFB,0X01,
0X66,0X40,
0X67,0X29,
0XF0,0X00,
0XFF,0X26,
0XFB,0X01,
0X05,0X08,
0xFF,0x10
0xFB,0x01
0XC0,0X03 //DSC:03 NO DSC:00
MIPI DCS
0x11
Wait more than 100ms
0x29
Wait more than 40ms
Display
断电
Backlight off
0xFF,0x10
0xFB,0x01
0x28
Wait more than 1ms
0x10
Wait more than 60ms
LCD_RESX=Low
Wait more than 1ms
Power Supply Off: AVEE=-5.5V
Wait more than 1ms
Power Supply Off: AVDD=5.5V
Wait more than 1ms
初始化代码 Power Supply Off: VDDI=1.8V
设定和延时
(若代码全部OTP,仅提供点亮初始化code)
Step Command
Command name Operation
Parameter
1 F700=5A,A5,95,
27
2 Deep standby mode
3-9-8: CE off
Step Command
Command name Operation
Parameter
1 91h=00
Color Enhancement function
off
3-9-9: CE on
Step Command
Command name Operation
Parameter
1 91h=80 Color Enhancement functi
on on
Step Command
Command name Operation
Parameter
1 55h=00
CABC OFF
3-9-11: CABC on
Step Command
Command name Operation
Parameter
1 55h = 01
UI mode
Delay 5ms
3-9-13: ACO on
Step Command
Command name Operation
Parameter
1 N/A
Step Command
Command name Operation
Parameter
1 92h = 00
sunlight readability enhance
ment
3-9-15: SRE on
Step Command
Command name Operation
Parameter
1 92h = 80
sunlight readability enhance
ment
If there is more than one mode for CABC function, please fill out all data
4. OPTICAL CHARACTERISTICS
4-1. Optical Characteristics – Backlight 100%
Parameter Symbol Condition Min Typ Max Unit Remarks
Θ12 80 85 - ° Note 1
Θ6 80 85 - ° Note 1
Viewing Angle CR >10 80
Θ9 85 - ° Note 1
Θ3 80 85 - ° Note 1
Contrast Ratio CR Optimal 1000 1500 - - Note 1,4
Brightness Lv Optimal 380 450 - Cd/m2 Note 1
Brightness Uniformity Y Optimal 72 82 - % Note 1,7(9P)
Flicker -30 dB Note 1,2
Crosstalk 2 % Note 1,3
Θ =0 °
Response time τf or τr - 30 35 ms Note 1,6
Ta =25 °C
Color Gamut NTSC - 78 82 - % Note 1
Suv = max 0.13, huv = 0~360 - Note 1
White Chromaticity
Suv = max 0.2, huv = 225 ± 45 - Note 1
x - Note 1
Red Chromaticity Suv = 3.58 ± 0.1, huv = 14.2 ± 1
y - Note 1
x - Note 1
Green Chromaticity Suv = 1.79 ± 0.1, huv = 124 ± 2
y - Note 1
x - Note 1
Blue Chromaticity Suv = 4.1 ± 0.25, huv = 268 ± 3
y - Note 1
The LCD module should be turn-on to a stable luminance level to be reached. The measure
ment should be executed after lighting Backlight for 20 minutes and in a dark room.
[Note 2] Flicker
The flicker level should be measured with horizontal gray/black stripes. The flicker is essentially a ratio of t
he powers in the frequency spectrum at 30 Hz (PX) and 0 Hz (P0- DC level).
G1
G2
G1280
[Note 3] Crosstalk
H/2
H/8 H/8
P1
V/8
P2 P5 P3
V
P4 V/2
V/8
[Note 4]
[Note 5]
UP θ=0o
(12 o’clock) z
A
Φ=90o
yu θ
Φ
LEFT RIGHT
xl xr
(9 o’clock) (3 o’clock)
Φ=180o Φ=0o
TFT-LCD
Module
yd
DOWN
(6 o’clock)
Φ=270o
[Note 6]
Response time is obtained by measuring the transition time of photo detector output, when input s
ignals are applied so as to make the area “black” to and from “white”.
White
Photo detector Output
100%
90%
10%
0%
Black Black
τr τf
[Note 7] Time
Fig 4.3 Response Time Definition
Brightness Minimum Photo detector output for P1-P400with all pixels white
= X 100
Uniformity Maximum Photo detector output for P1-P400with all pixels white
5. MECHANICAL CHRACTERISTICS
The contents provide general mechanical characteristics for the model.
In addition the figures in the next page are detailed mechanical drawing of the LCD.
0.084(u)
Pol Size - mm
0.073(d)
Gap Between Pol~C/F
0/0.3/0/0 ± 0.15 mm
border (U/D/L/R)
Horizontal 68.87 ± 0.15 mm
Module
Thickness 1.23 ± 0.1 mm
UV Glue Thickness <0.16 - mm
Gap between Glass~
0.2/0.2/0.2/0.75 ±0.2 mm
LCM outline
PLUS
6. RELIABLITY TEST
Must be accordance with Lenovo RA test items
8. Package
8.1. Packing Description
(1) 纸箱堆叠数按2*3/每层*共5层
上海天马微电子有限公司 上海天马微电子有限公司
地址:中国上海市浦东新区汇庆路 号
地址:中国上海市浦东新区汇庆路 号
:
:
上海天马微电子有限公司 上海天马微电子有限公司
地址:中国上海市浦东新区汇庆路 号
地址:中国上海市浦东新区汇庆路 号 :
:
上海天马微电子有限公司 上海天马微电子有限公司
地址:中国上海市浦东新区汇庆路 号
地址:中国上海市浦东新区汇庆路 号 :
:
上海天马微电子有限公司 上海天马微电子有限公司
地址:中国上海市浦东新区汇庆路 号
地址:中国上海市浦东新区汇庆路 号
:
:
上海天马微电子有限公司 上海天马微电子有限公司
地址:中国上海市浦东新区汇庆路 号 地址:中国上海市浦东新区汇庆路 号
: :
10. Checklist
Direct bonding: pol is higher 0.05mm than M/F Higher than M/F
Pol position
Air bonding: pol is lower 0.05mm than M/F 0.05mm