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Material or Methods Specification NO.

SD18C74384

TITLE: LCD MODULE, 68.87× 160.04× 1.23MM, MIPI,DISPLAY, ± 5.5V,1.8V


REVISION DATE: 04/28/2020 MEMO: ISSUE: A PAGE 1 / 50

SPECIFICATION
FOR
( ) Preliminary Specification
APPROVAL
(● ) Final Specification

Title Customer Approval Sheet for Moto


Nairobi
Customer Lenovo

Part Number SD18C74384

SUPPLIER Tianma

MODEL TL067FVXH30-00

Version A

SIGNATURE DATE APPROVED BY DATE

REVIEWED BY

Please return 1 copy for your confirmation with


your signature and comments.

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Printed copies of this document are not controlled.
Material or Methods Specification NO. SD18C74384

TITLE: LCD MODULE, 68.87× 160.04× 1.23MM, MIPI,DISPLAY, ± 5.5V,1.8V


REVISION DATE: 04/28/2020 MEMO: ISSUE: A PAGE 2 / 50

CONTENT LIST

No ITEM Page

COVER 1

CONTENTS 2

RECORD OF REVISIONS 6

1 GENERAL DESCRIPTION 7
2 ABSOLUTE MAXIMUM RATINGS 14

3 ELECTRICAL SPECIFICATIONS 15

4 OPTICAL CHARACTERISTICS 31

5 MECHANICAL CHARACTERISTICS 38

6 RELIABLITY TEST 44

7 INTERNATIONAL STANDARDS 45

8 PACKING 46

9 Incoming Inspection Standard 49

10 Checklist 50

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Material or Methods Specification NO. SD18C74384

TITLE: LCD MODULE, 68.87× 160.04× 1.23MM, MIPI,DISPLAY, ± 5.5V,1.8V


REVISION DATE: 04/28/2020 MEMO: ISSUE: A PAGE 3 / 50

SCOPE
The purpose of this document is to provide a better understanding of Motorola Mobility requirements for
TFT- LCD and Organic Light Emitting Diode (OLED) Displays to suppliers. Its goal is to clarify quality control
procedures and components specifications, so that suppliers ship only 100% acceptable material to
Motorola.
This document contains specific electrical, optical, mechanical, environmental, packaging, and general
Motorola manufacturing, quality, and qualification requirements.

APPLICABLE DOCUMENTS
12G80967A78 Supplier Material Quality Control
12M09195A94 Supplier Production Part Approval Process (PPAP) and Process Sign-Off (PSO)
12M09198A35 Storyboard Approval, Distribution and Maintenance Process Flow
12M09188A95 Shipping Package Test Specification
12M09162A44 Supplier Material Corrective Action Request Procedure
12M09192A78 Lenovo/Moto Supplier Process/Product Change Notification Procedure
MBG-S-PQM-061COSMETIC SPECIFICATION FOR MOBILITY PHONES AND WEARABLE PRODUCTS
12S10601A Packaging Requirements for Inbound Shipments to Motorola
12G02897W18 Controlled and Reportable Materials Disclosure
12G13933A01 Motorola Receiving Bar Code Specification
12G13933C77 Qualification Procedure for LCD Displays
12M09195A44 LCD Mechanical Strength 4-Point Bending Test Method
MBG-S-SCEQ-053 Display_Touch Panel_ Display Touch Module reliability testing standard
MBG-S-SCEQ-090 Display Touch Module Run in and ERT Testing
TFT Lenovo_Moto Unified ME Workbook
TFT Lenovo_Moto Unified EE Workbook
TFT Lenovo_Moto Unified OE Workbook
TFT Lenovo_Moto Unified Reliability
OLED Lenovo_Moto Unified OLED ME Workbook
OLED Lenovo_Moto Unified OLED EE Workbook
OLED Lenovo_Moto Unified OLED OE Workbook
OLED Lenovo_Moto Unified OLED Reliability

CAUTION: This specification cannot be distributed to parties outside of Motorola Mobility without first having
on file a signed Non-Disclosure Agreement.

If this part does NOT comply with the ESD, Latch-up, or any stress tests as outlined in 12G13933C77, the
following note(s) are required to be added.

CAUTION: This device does not meet all the reliability stress test requirements according to Motorola
Mobility ALT test conditions at the product level. Testing conditions in ALT at product level may have wider
temperature ranges compared with the conditions that are specified in this document.

WARNING: IC's on this product are inherently static sensitive devices. As a result, extreme caution should
be used when handling these parts. Every possible precaution should be taken in the manufacturing
process to insure that any AMOLED display is not exposed to any static voltages.

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Material or Methods Specification NO. SD18C74384

TITLE: LCD MODULE, 68.87× 160.04× 1.23MM, MIPI,DISPLAY, ± 5.5V,1.8V


REVISION DATE: 04/28/2020 MEMO: ISSUE: A PAGE 4 / 50

REQUIREMENT TO 12G13933C77
●This item must be qualified according to the requirements in 12G13933C77.
●Cpk data acquisition:

○ [ ] If this box is checked, Calculate Cp/Cpk on all specified parameters


per Motorola 12M80967A78.
○ [✔] If this box is checked, Calculate Cp/Cpk on "[X]" and <ST> parameters
only per Motorola 12M80967A78.

DESCRIPTION
This display is a color Active Matrix TFT- LCD of glass construction with White pixels on a Black
background. The display consists of 1080 (RGBG - Diamond) x 2520 pixels (sub pixel rendered) with a
color depth of 16.6 M colors (24 bpp). The display interface is 1 MIPI channel with four DSI lane. The
touch interface is via I2C.

This display module is constructed of


●The Liquid Crystal Display Glass consisting of the top glass plate, ​top polarizer +QWP and bottom pol
arizer, (No PET included into Top/Bottom Pol),​ color filter, liquid crystal, and LTPS backplane containi
ng the pixel transistors.
●Chip-on-FPC (COF) with the driver (“chip”) located at bottom front of panel.
●FPC with the necessary passive/active components.
●Tearing Effect output signal
●Display has 1/3 RAM. (1080x2520x24 ) / 3 = 21,772,800 virtual bits

Note: This platform display may be used on devices with operating systems such as Android, Linux and
Java which are open source, and thus may be published and available to the general public. The
information contained in any display interaction open source file will be the minimum required to
successfully communicate and configure the display module.
Note: Do not ship any samples for any reason without MTPing the correct manufacturer/version
numbers in registers A1h, DAh, DBh, DCh. If they are not programmed correctly, they will be rejected
as defective. If you have a question regarding the correct programming. contact Motorola DDC
immediately.

CHANGES TO PLATFORM DISPLAY


This document describes a platform display glass and driver intended for reuse in multiple display
modules within Motorola. As a result, no element of the display design may change without the written
permission from Motorola and an appropriate re-qualification of the display glass and driver.
Furthermore, any requests or discussion for changes to the displays from within Motorola must be
signed off by the following representatives on the Strategy Commodity Team: the head of the global
display commodity team, the head of the Display Design Center.

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Material or Methods Specification NO. SD18C74384

TITLE: LCD MODULE, 68.87× 160.04× 1.23MM, MIPI,DISPLAY, ± 5.5V,1.8V


REVISION DATE: 04/28/2020 MEMO: ISSUE: A PAGE 5 / 50

QUALIFICATION REQUIREMENTS
Cpk data must be presented to Component Technologies Engineering for the following process control
parameters for initial qualification purposes. Data must be continuously collected for these process control
parameters, and be made available to Motorola upon request for the prior 2 EPrs.
Definitions:
Box-X, [X]: Process Control Parameter: Parameter indicative of process control and capability of
manufacturing component. Refer to 12M80967A78 for further details.
<ST>: Statistical Tolerance Parameter: Used where statistically valid samples are required for non Box-X,
[X] parameters for module approval. Refer to 12M80967A78 for further details.

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Material or Methods Specification NO. SD18C74384

TITLE: LCD MODULE, 68.87× 160.04× 1.23MM, MIPI,DISPLAY, ± 5.5V,1.8V


REVISION DATE: 04/28/2020 MEMO: ISSUE: A PAGE 6 / 50

RECORD OF REVISIONS

Revision No. Revision Date Page Description

A 20200508 First release

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Material or Methods Specification NO. SD18C74384

TITLE: LCD MODULE, 68.87× 160.04× 1.23MM, MIPI,DISPLAY, ± 5.5V,1.8V


REVISION DATE: 04/28/2020 MEMO: ISSUE: A PAGE 7 / 50

1-1. GENERAL DESCRIPTION

Block Diagram

LCD Signal
TFT LCD 1080
X2520

LCD Power
Input connector

DC/DC
Converter

LED Cathode
IC

Output
Pin LED Light Bar
LED Anode

Features

TL067FVXH30-01 is 6.7” color TFT-LCD (Thin Film Transistor Liquid Cry


stal Display) module composed of LCD panel, MIPI driver ICs, control cir
cuit ,backlight and cover lens. By applying 8 bit digital data, 1080× RGB
(3) × 2520, 16.7M-color images are displayed on the 6.7” diagonal scree
n

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Material or Methods Specification NO. SD18C74384

TITLE: LCD MODULE, 68.87× 160.04× 1.23MM, MIPI,DISPLAY, ± 5.5V,1.8V


REVISION DATE: 04/28/2020 MEMO: ISSUE: A PAGE 8 / 50

1-2. General Spec

No Item Specification Unit Remark

1 Screen Size 6.7 inch -

2 Active Area 67.07(H)x156.492(V) mm -

3 Panel Size 68.47(H)x159.09(V) mm -

4 Outline Dimension 68.87 (H)× 160.04(V)× 1.23(TYP.) mm -

5 Display Resolution 1080(H) × RGB× 2520(V) pixel -

6 Pixel Pitch 20.7× 62.1 um -

7 Display Method LTPS - -

8 Display Mode FFS - -

9 Display Color 16.7M - 8bit

10 Color Gamut 83% % typ

11 Luminance 380min/450typ nit Typ, center P

12 Contrast Ratio 1500:1 - Typ, center P

13 Viewing Angle 80/80/80/80 ° CR>10(U/D/L/R)

14 Pol Surface Treatment HC - -

15 Weight 53.1 g max

16 D-IC NT36672C - RAMless

17 Inversion Method Column -

18 LED Q’ty 20 ea String4*Parallel5

19 Power Consumption 154(90HZ)/120(60HZ) mw White pattern

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Material or Methods Specification NO. SD18C74384

TITLE: LCD MODULE, 68.87× 160.04× 1.23MM, MIPI,DISPLAY, ± 5.5V,1.8V


REVISION DATE: 04/28/2020 MEMO: ISSUE: A PAGE 9 / 50
1-3. Key Part List(5pcs average data)
item Supplier Spec/Size Weight/ g Remark
TFT Glass AGC 1300*1500mm*0.5t 4
C/F Glass AGC 1300*1500mm*0.5t 4

Upper Pol NITTO 0.084mm

Lower Pol NITTO 0..073mm

Liquid Crystal Merk LCA


Cell
UV Glue/Tuffy AICA Z-519T15 0.0073
D-IC nova NT36672C 0.1

ACF(COF) Hitachi AC-18358 NA

ACF(FOF) Hitachi MF-372 NA

COF Film JMC JMC

FPC Yuansheng

EMI coating FB HSF6000-2

Main Connector molex 5055514020


FPCA LED lightbar CNT NA NA
Insulation Tape SKM KM2530

Conductive Tape Meisu H3660

CNT Stiffener sus 304


FPC Ass’y Yuansheng
B/W tape liwang LK06

Upper Prism
3M ASOC 4.0-LS-82(24)HH
Lower Prism

Diffuser Sheet Kimoto 38TMQ

LGP Sumitomo TR1801A


BLU
Mold frame Inhouse PC

Reflector 3M ESR80-V2

LED JB 01.JB.11AS264W65P03-A1

LED Lightbar Inhouse

BLU Ass’y Inhouse

Lens lens jingbo NEG 19.3

OCA OCA 3M 7106 1.5

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Material or Methods Specification NO. SD18C74384

TITLE: LCD MODULE, 68.87× 160.04× 1.23MM, MIPI,DISPLAY, ± 5.5V,1.8V


REVISION DATE: 04/28/2020 MEMO: ISSUE: A PAGE 10 / 50

1-3-1. FPCA Gerber/Layout and Schematic Diagram

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Material or Methods Specification NO. SD18C74384

TITLE: LCD MODULE, 68.87× 160.04× 1.23MM, MIPI,DISPLAY, ± 5.5V,1.8V


REVISION DATE: 04/28/2020 MEMO: ISSUE: A PAGE 11 / 50

1-3-2. FPC Pin Assignment


Please pay attention that IC bump up(COF1.8)
1 DUMMY_16 81 VSS_11 161 VDD_8 241 VGL_11
2 DUMMY_15 82 VP_HSSI_4 162 VDD_7 242 C21M_2
3 DUMMY_14 83 VP_HSSI_3 163 VSS_10 243 C21M_1
4 DUMMY_13 84 VG_HSSI_7 164 VSS_9 244 C21P_2
5 DUMMY_12 85 D3_N_2 165 FLASH_SPI_SCK 245 C21P_1
6 DUMMY_11 86 D3_N_1 166 FLASH_SPI_MOSI 246 VGH_12
7 DUMMY_10 87 CPHY_GND_5 167 FLASH_SPI_MISO 247 VGH_11
8 DUMMY_9 88 D3_P_2 168 FLASH_SPI_CSN 248 VDD_TP_2
9 GND_8 89 D3_P_1 169 DSV_EN 249 VDD_TP_1
10 GND_7 90 VG_HSSI_6 170 TP_OPT 250 VSS_1
11 GND_6 91 D0_N_2 171 GPIO[9] 251 TVSS_2
12 GND_5 92 D0_N_1 172 GPIO[10] 252 TVSS_1
13 FPCTEST_4 93 CPHY_GND_4 173 TCH_IO_SCK 253 TVDD_ADC_8
14 FPCTEST_3 94 D0_P_2 174 TCH_IO_MOSI 254 TVDD_ADC_7
15 VGH_10 95 D0_P_1 175 TCH_IO_MISO 255 TVDD_2
16 VGH_9 96 VG_HSSI_5 176 TCH_IO_CSN 256 TVDD_1
17 VGH_8 97 CLK_N_2 177 TCH_IO_SCL 257 TVSS_ADC_2
18 VGH_7 98 CLK_N_1 178 TCH_IO_SDA 258 TVSS_ADC_1
19 VGL_10 99 CPHY_GND_3 179 TCH_ATTN 259 TEST_TP[1]
20 VGL_9 100 CLK_P_2 180 TP_EN 260 TEST_TP[0]
21 VGL_8 101 CLK_P_1 181 RESX 261 TVDD_ADC_2
22 VTCOMB_2 102 VG_HSSI_4 182 GPIO[11] 262 TVDD_ADC_1
23 VTCOMA_2 103 D1_N_2 183 VSS_8 263 VMOD_GATE_2
24 VTCOMC_2 104 D1_N_1 184 VSS_7 264 VMOD_GATE_1
25 COFTESTR[2] 105 CPHY_GND_2 185 VSS_OSC_DP 265 AVDD_2
26 COFTESTR[1] 106 D1_P_2 186 FUN_TEST[1] 266 AVDD_1
27 VGLO_4 107 D1_P_1 187 FUN_TEST[0] 267 AVEE_2
28 VGLO_3 108 VG_HSSI_3 188 VDD_6 268 AVEE_1
29 VGHO_4 109 D2_N_2 189 VDD_5 269 VCOMDC3_2
30 VGHO_3 110 D2_N_1 190 VCOMDC3_4 270 VCOMDC3_1
31 AVSS_8 111 CPHY_GND_1 191 VCOMDC3_3 271 AVSS_2
32 AVSS_7 112 D2_P_2 192 VDD_TP_6 272 AVSS_1
33 VCOMDC3_6 113 D2_P_1 193 VDD_TP_5 273 VGHO_2
34 VCOMDC3_5 114 VG_HSSI_2 194 VSS_6 274 VGHO_1
35 AVEE_8 115 VG_HSSI_1 195 VSS_5 275 VGLO_2
36 AVEE_7 116 VP_HSSI_2 196 VDDI_2 276 VGLO_1
37 AVDD_10 117 VP_HSSI_1 197 VDDI_1 277 COFTESTL[2]
38 AVDD_9 118 VDDI_6 198 AVSS_16 278 COFTESTL[1]
39 TVDD_ADC_6 119 VDDI_5 199 AVSS_15 279 VTCOMC_1
40 TVDD_ADC_5 120 VDDI_4 200 VDDI_DC_2 280 VTCOMA_1
41 VCOM_OPT_2 121 VDDI_3 201 VDDI_DC_1 281 VTCOMB_1
42 VCOM_OPT_1 122 FTE1 202 VDD_4 282 VGL_3
43 TEST_TP[3] 123 FTE 203 VDD_3 283 VGL_2
44 TEST_TP[2] 124 D[0] 204 VSS_16 284 VGL_1
45 TVDD_ADC_4 125 D[1] 205 VSS_15 285 VGH_4
46 TVDD_ADC_3 126 D[2] 206 VCL_2 286 VGH_3
47 TVDD_4 127 D[3] 207 VCL_1 287 VGH_2
48 TVDD_3 128 LEDPWM 208 VCL_DC 288 VGH_1
49 TVSS_4 129 D[4] 209 VCI_2 289 FPCTEST_2
50 TVSS_3 130 D[5] 210 VCI_1 290 FPCTEST_1
51 TVSS_ADC_5 131 D[6] 211 VCI_DET_2 291 GND_4
52 TVSS_ADC_4 132 D[7] 212 VCI_DET_1 292 GND_3
53 TVSS_ADC_3 133 PNSWAP 213 GVDDP 293 GND_2
54 VSS_14 134 DSWAP[0] 214 GVDDN 294 GND_1
55 VSS_13 135 DSWAP[1] 215 AVEE_DC_2 295 DUMMY_8
56 VDD_TP_8 136 DCX 216 AVEE_DC_1 296 DUMMY_7
57 VDD_TP_7 137 CSX 217 AVSS_DC_2 297 DUMMY_6
58 C31M_2 138 WRX 218 AVSS_DC_1 298 DUMMY_5
59 C31M_1 139 RDX 219 AVDD_DC_2 299 DUMMY_4
60 C31P_2 140 FRM 220 AVDD_DC_1 300 DUMMY_3
61 C31P_1 141 IM[0] 221 VDD_TP_4 301 DUMMY_2
62 VGL_OUT_2 142 IM[1] 222 VDD_TP_3 302 DUMMY_1
63 VGL_OUT_1 143 TEST[4] 223 VSS_4
64 CVSS_4 144 TEST[3] 224 VSS_3
65 CVSS_3 145 TEST[2] 225 AVSS_4
66 AVSS_6 146 TEST[1] 226 AVSS_3
67 AVSS_5 147 TEST[0] 227 VDD_2
68 AVEE_6 148 TEST[6] 228 VDD_1
69 AVEE_5 149 TEST[5] 229 AVEE_4
70 AVDD_8 150 GPIO[8] 230 AVEE_3
71 AVDD_7 151 GPIO[0] 231 AVDD_6
72 VDD_12 152 GPIO[1] 232 AVDD_5
73 VDD_11 153 GPIO[2] 233 AVDD_4
74 VDDI_12 154 GPIO[3] 234 AVDD_3
75 VDDI_11 155 GPIO[4] 235 TEST[10]
76 VDDI_10 156 GPIO[5] 236 TEST[9]
77 VDDI_9 157 GPIO[6] 237 TEST[8]
78 VDDI_8 158 Motorola MobilityGPIO[7] 238 - Do Not Redistribute
Confidential Restricted CVSS_2
79 Information VDDI_7
contained on pages of this document VDD_10
159 cannot be reproduced 239or used in whole or in part without Motorola’s
CVSS_1 written consent.
80 VSS_12 160 Printed VDD_9
copies of this document240are not controlled.
VGL_12
Material or Methods Specification NO. SD18C74384

TITLE: LCD MODULE, 68.87× 160.04× 1.23MM, MIPI,DISPLAY, ± 5.5V,1.8V


REVISION DATE: 04/28/2020 MEMO: ISSUE: A PAGE 12 / 50

1-3-3. Pol General Spec

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Material or Methods Specification NO. SD18C74384

TITLE: LCD MODULE, 68.87× 160.04× 1.23MM, MIPI,DISPLAY, ± 5.5V,1.8V


REVISION DATE: 04/28/2020 MEMO: ISSUE: A PAGE 13 / 50

1-4. Change List

Change Details
Remar
No. Reason
Before After ks

IR/led hole
1 CG change
Move upward

2 Rimtape 0.575/0.6 0.525/0.55

3 Conductive tape
H/W change
4 Graphite sheet

5 COF FILM LGIT JMC

6 FPC EMI

dot
Design Change 1 shape of Ag L shape
shape

S/W change 1 TP frequency 120HZ 180HZ

Remarks:
1.H/W change includes all materials, components, label etc.
2.Design change includes size, position etc.
3.S/W change includes initial code etc.

Please pay attention that this list is just a summary, an individual Design Ch
ange List which contain much more information is also needed
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Material or Methods Specification NO. SD18C74384

TITLE: LCD MODULE, 68.87× 160.04× 1.23MM, MIPI,DISPLAY, ± 5.5V,1.8V


REVISION DATE: 04/28/2020 MEMO: ISSUE: A PAGE 14 / 50

2-1. Absolute Maximum Ratings


The following are maximum values which, if exceeded, may cause faulty operation or damage to the unit.
Table 2.1 Absolute Maximum Ratings

Values
Parameter Symbol Units Notes
Min Max
VSP 4.5 6 V
LCD Analog Voltage
VSN -4.5 -6 V
LCD I/O Voltage IOVCC 1.65 1.95 V
LED Current ILED - - mA TYP 20
Storage Humidity Hstg 5% - %RH
Storage Temperature Tstg -30℃ 80 ℃

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Material or Methods Specification NO. SD18C74384

TITLE: LCD MODULE, 68.87× 160.04× 1.23MM, MIPI,DISPLAY, ± 5.5V,1.8V


REVISION DATE: 04/28/2020 MEMO: ISSUE: A PAGE 15 / 50
3-1. ELECTRICAL CHARACTERISTICS
Table 3.1 Electrical Characteristics Of TFT-LCD Module
Values Unit
Parameter Symbol Notes
Min Typ Max s

VSP-Vss 5.3 5.5 5.7 V


LCD Input Analog Voltage
VSN-Vss -5.3 -5.5 -5.7 V

LCD Logic I/O Voltage IOVCC-Vss 1.65 1.8 1.95 V

LED Input Current ILED - 80 - mA

Applicable
“H” Level Input Voltage VIH 0.7xIOVCC - IOVCC V
Pin: REST

Applicable
“L” Level Input Voltage VIL 0.0 - 0.3xIOVCC V
Pin: REST

Applicable
“H” Level Output Voltage VOH 0.8xIOVCC - IOVCC V Pin: BC
I OUT = -1mA

Applicable
“L” Level Output Voltage VOL 0.0 - 0.2xIOVCC V Pin: BC
I OUT = +1mA

Input high level leakage curre Applicable


I IH - - 1 µA
nt
Pin: REST
H :IOVCC
Input low level leakage curren
I IL -1 - - µA L :Vss
t

Normal PN - 170 200 mW (1)(no touch)

LCD
Power Sleep in PD - 2400 7565 uW
Consumption

BLU PB - 1136 1200 mW (2)

Notes:
(1) The specified current and power consumption are under the conditions at VSP = 5.5V,VSN=-5.5V,IOVCC = 1.8V, T = 25°C, and f
v = 60 Hz, at white pattern (TYP)
The specified current and power consumption are under the conditions at VSP = 5.5V,VSN=-5.5V,IOVCC = 1.8V, T = 25°C, and fv =
60 Hz, at R/G/B pattern (MAX)
(2) LED Backlight assumptions:15Vf(MAX), 80 mA. (5S4P LED Total Input )
3-2. Logic Power Consumption
Values
Parameter Symbol Units Notes
Typ Max

IIOVCC 37 58 mA
White Pattern
Normal Mode IVsp 10.6 18 mA
(no touch)
IVsn 8.7 12 mA

IIOVCC 1030 3500 uA

Sleep Mode IVsp 80.5 180 uA

IVsn 5 50 uA

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Material or Methods Specification NO. SD18C74384

TITLE: LCD MODULE, 68.87× 160.04× 1.23MM, MIPI,DISPLAY, ± 5.5V,1.8V


REVISION DATE: 04/28/2020 MEMO: ISSUE: A PAGE 16 / 50

3-3. BACK LIGHT UNIT


3-3-1 The edge-lighting type of back light unit consists of 20LEDs which is connected in serial.
Table 2-3-1 Electrical Characteristics Of Back Light Unit

Values
Parameter Symbol Units Notes
Min Typ. Max
LED Current ILED 20 mA 5S4P
LED Forward Voltage VLED 14.2 15 V 5S4P

LED Circuit Diagram

3-3-2 LED Rank

Luminous Flux Rank Chart

Flux Rank 37/38 39

Color Rank Chart LED:JB.11AS264W65P03


Color Rank G65TX&(G65TS&F65TS混)

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Material or Methods Specification NO. SD18C74384

TITLE: LCD MODULE, 68.87× 160.04× 1.23MM, MIPI,DISPLAY, ± 5.5V,1.8V


REVISION DATE: 04/28/2020 MEMO: ISSUE: A PAGE 17 / 50
3-4. LCD INTERFACE CONNECTIONS
Interface Connector: AXE630124,
Table 3.4 LCD Connector Pin Configuration

Pin No. Symbol I/O Description


1 GND I Ground
2 SCLK IO SPI interface clock pin for touch
3 SMOSI IO SPI interface data input for touch
4 MISO IO SPI interface data output for touch
5 SS IO SPI interface enable pin for touch
6 GND I Ground
7 MCU_RESET I Reset for touch
8 I2C_SDA - NC
9 I2C_SCL - NC
10 T_INT I interrupt
11 NC - NC
12 LED_C4 I LED-
13 LED_C3 I LED-
14 LED_C2 I LED-
15 LED_A1 I LED+
16 LED_C1 - NC
17 NC - NC
18 VSN I Power Supply, 5.5V
19 VSP I Power Supply, 5.5V
20 NC - NC
21 IOVCC I Power Supply, 1.8V
22 RESET I REST PIN
23 TE O Tearing Effect
24 LEDPWM O Backlight PWM control
25 GND I Ground
26 D2_P I MIPI Input Data Pair
27 D2_N I MIPI Input Data Pair
28 GND I Ground
29 D1_P I MIPI Input Data Pair
30 D1_N I MIPI Input Data Pair
31 GND I Ground
32 CLK_P I MIPI Input Data Pair
33 CLK_N I MIPI Input Data Pair
34 GND I Ground
35 D0_P I MIPI Input Data Pair
36 D0_N I MIPI Input Data Pair
37 GND I Ground
38 D3_P I MIPI Input Data Pair
39 D3_N I MIPI Input Data Pair
40 GND I Ground

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3-5. SIGNAL TIMING SPECIFICATIONS


ITEM SYNBOL Timing UNIT
LCD Frame Rate - 90 Hz
Frequency fCLK MHz
DCLK
Period Tclk ns
Horizontal total time tHP 1106 tCLK
Horizontal Active time tHadr 1080 tCLK
Horizontal Horizontal Pulse Width tHsync 4 tCLK
Horizontal Back Porch tHBP 8 tCLK
Timing
Horizontal Front Porch tHFP 14 tCLK
Vertical total time tvp 2584 tH
Vertical Active time tVadr 2520 tH
Vertical Vertical Pulse Width tVsync 4 tH
Vertical Back Porch tVBP 28 tH
Vertical Front Porch tVFP 32 tH

Differential Swing VDswing mV

Bit Rate
※Please refer to initial code TX SPD(MBPS) Mbps

Pixel Fomat Data bit/pixel

Lane 4 Lane

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3-6. MIPI Data&CLK Line Impedance Test Result


(1) MIPI Interface Timing Sequence
(a) MIPI interface DC characteristic:

Item Parameter Min. Typ. Max. Unit

Thevenin output high level VOH 1.1 1.2 1.3 V


LP_T
Thevenin output low level VOL -50 50 mV
W
Output impedance of LP transmitter ZOLP 80 100 125 Ω

Common-mode voltage HS receive mode VCMRX(DC) 70 - 330 mV

Differential input high threshold VIDTH - - 70 mV


Differential input low threshold VIDTL -70 - - mV
HS_RX Single-ended input high voltage VIHHS - - 460 mV
Single-ended input low voltage VILHS -40 - - mV
Single-ended threshold for HS termination enabl
VTERM-EN - - 450 mV
e
Differential input impedance ZID 80 100 125 Ω

Logic 1 input voltage VIH 880 - - mV

LP_RX
Logic 0 input voltage. not in ULPState VIL - - 550 mV

Input hysteresis VHYST 25 - - mV

Logic 1 contention threshold VIHCD 450 - - mV


LP_CD
Logic 0 contention threshold VILCD - - 200 mV

MIPI DC Diagram

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Signal-ended and Resulting Differential HS Signals Diagram


(b) MIPI data to clock timing definitions
Clock Parameter Symbol Min Typ. Max. Unit

UI instantaneous UI INST 0.833 - 12.5 ns

Data to Clock Setup Time [Receiver] T SETUP[RX] 0.15 - - UI INST

Clock to Data Hold Time [Receiver] T HOLD[RX] 0.15 - - UI INST

Data to Clock Skew (Measured at transmitter) T SKEW[TX] -0.15 - 0.15 -

【Note】
*1) This max value corresponds to a minimum 80 Mbps data rate per lane
*2) The minimum UI shall not be violated for any single bit period, i.e., any DDR half cycle within a dat
a
burst.
*3) Total silicon and package delay budget of 0.3 UIINST
*4) Total setup and hold window for receiver of 0.3* UIINST
*5) T SETUP[Rx] and T HOLD[RX] are only for RX without FPCB and connector and guaranteed by
design.

MIPI data to clock timing definitions

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(2)Reset Input Timing

Symbol Parameter Pad Min. Typ. Max. Unit Note

tRESW Reset low pulse width RESX 10 us

RESX 10 Reset during Sleep In mode


tREST Reset completion time ms Reset during Sleep Out mod
RESX 120(5)
e

【Note】
*1) Spike due to an electrostatic discharge on RESX line does not cause irregular system reset according to
the table below.

RESX Pulse Action

Shorter than 5us Reset Rejected


Longer than 10us Reset
Between 5us and 10us Reset Start

*2) During the reset period, the display will be blanked. (The display is entering blanking sequence, for
which the maximum time is 120ms, when Reset starts is sleep out-mode. The display remains in the
blank state is Sleep In-mode) and then return to default condition for H/W reset.
*3) During Reset Completion Time, ID bytes (or similar) value in MTP block will be latched to the internal
register during this period. This loading is done every time when there is H/W reset complete time
(tREST) within 5ms after a rising edge of RESX.
*4) Spike Rejection also applies during a valid reset pulse as shown below:

*5) It is necessary to wait for 5msec after releasing RESX before sending commands. Also Sleep Out command
cannot be sent for 120msec.

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(3)TE
4.1 Tearing Effect Line Modes
the tearing effect output signal consists of V-sync information only.

 t vdh = The LCD display is not updated.


 t vdl = The LCD display is updated (except Invisible line-see below).

•NOTE: During sleep in mode, the tearing effect output pin is low.

4.2 TE Input Timing

Symble Parameter Specification Unit Descripti


on
Min. Typ. Max.

tvdl Vertical timing low duration Base on MPU video mode


Setting
us
tvdh Vertical timing high duration

NOTE: The signal's rise and fall times (tf, tr) are stipulated to become equal to or less than 15ns.

Note Figure: Rise and Fall Times

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3-7. Power On/Off Sequence

Figure 1 Interface power on/off sequence

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3-7. Power On/Off Sequence

EE

Figure 2 Interface power on/off sequence


Remark:VDDI—>IOVCC,RESX—>Reset

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3-8. Software Flow

Block A : Power On

Block B : Initialize

Block C : MIPI CMD mode on

Block D : Sleep Out & BC_CTRL enable & Display On

Normal mode

Block E : Display Off & BC_CTRL_disable & Sleep In

Standy by mode
Block F : MIPI CMD mode off

Block G : Power Off

Fig 3.7 Software Flowchart

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3-9. Initial Code
上电
项目 Initial code IC厂商确认
MIPI
Low power+Generate
下初始化的方式

Sleep in/out MIPI下code方式 Low power+Generate/DCS


RESET_N = L
Power Supply On: VDDI=1.8V
- Wait 1ms
Power Supply On: AVDD=5.5V
- Wait 1ms
Power Supply On: AVEE=-5.5V
- Wait 10ms
LCD_RESX=High
- Wait 10ms
LCD_RESX=Low
- Wait 10ms
LCD_RESX=High
Wait more than 10ms
MIPI DCS
0xFF,0x25
0xFB,0x01
0x18,0x20 TableA 90Hz

0xFF,0x10
0xFB,0x01
0x3B,0X03,0X20,0X20,0X04,0X04
0XB0,0X00
0XC2,0X1B

0XFF,0XF0
0xFB,0x01
0X5A,0X00
初始化代码
设定和延时
(若代码全部OTP,仅提供点亮初始化code)
0XFF,0X24,
0XFB,0X01,
0X06,0X8B,
0X07,0X8C,
0X1E,0X8B,
0X1F,0X8C,

0XFF,0X25,
0XFB,0X01,
0X66,0X40,
0X67,0X29,
0XF0,0X00,

0XFF,0X26,
0XFB,0X01,
0X05,0X08,

0xFF,0x10
0xFB,0x01
0XC0,0X03 //DSC:03 NO DSC:00

MIPI DCS
0x11
Wait more than 100ms
0x29
Wait more than 40ms
Display

断电
Backlight off
0xFF,0x10
0xFB,0x01
0x28
Wait more than 1ms
0x10
Wait more than 60ms

LCD_RESX=Low
Wait more than 1ms
Power Supply Off: AVEE=-5.5V
Wait more than 1ms
Power Supply Off: AVDD=5.5V
Wait more than 1ms
初始化代码 Power Supply Off: VDDI=1.8V
设定和延时
(若代码全部OTP,仅提供点亮初始化code)

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3-9-7: Exit deep standby

Step Command
Command name Operation
Parameter
1 F700=5A,A5,95,
27
2 Deep standby mode

3-9-8: CE off

Step Command
Command name Operation
Parameter
1 91h=00
Color Enhancement function
off

3-9-9: CE on

Step Command
Command name Operation
Parameter
1 91h=80 Color Enhancement functi
on on

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3-9-10: CABC off

Step Command
Command name Operation
Parameter
1 55h=00
CABC OFF

3-9-11: CABC on

Step Command
Command name Operation
Parameter
1 55h = 01
UI mode
Delay 5ms

3-9-12: ACO off


Step Command
Command name Operation
Parameter
1 N/A

3-9-13: ACO on

Step Command
Command name Operation
Parameter
1 N/A

3-9-14: SRE off

Step Command
Command name Operation
Parameter
1 92h = 00
sunlight readability enhance
ment

3-9-15: SRE on
Step Command
Command name Operation
Parameter
1 92h = 80
sunlight readability enhance
ment

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3-10. IC General Spec and Size

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3-11. Power Consumption


Parameter Symbol Typ Unit Remarks
L0 156 mW
L32 158 mW
L64 161 mW
L96 163 mW
L127 165 mW
L160 167 mW
L192 168 mW
L224 169 mW
Logic Power
L255 170 mW
R255 195 mW
CABC off
G255 215 mW
B255 191 mW
8 color bar 191 mW
0-255 Gray Transition 195 mW
Lenovo UI
Follow workbook pic.
Icon Interface
25% on 284 mW
50% on 568 mW
BLU
75% on 852 mW
100% on 1136 mW

Symbol Logic BLU Remarks


L0 127 900 UI Mode
L32 129 917 UI Mode
L64 136 935 UI Mode
L96 137 955 UI Mode
L127 138 973 UI Mode
L160 138 989 UI Mode
L192 139 1006 UI Mode
L224 139 1025 UI Mode
CABC on
L255 134 1037 UI Mode
R255 139 1037 UI Mode
G255 139 1037 UI Mode
B255 146 1037 UI Mode
8 color bar 140 1025 UI Mode
0-255 Gray Transition 139 971 UI Mode
Lenovo UI
Follow workbook pic.
Icon Interface

If there is more than one mode for CABC function, please fill out all data

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4. OPTICAL CHARACTERISTICS
4-1. Optical Characteristics – Backlight 100%
Parameter Symbol Condition Min Typ Max Unit Remarks
Θ12 80 85 - ° Note 1
Θ6 80 85 - ° Note 1
Viewing Angle CR >10 80
Θ9 85 - ° Note 1
Θ3 80 85 - ° Note 1
Contrast Ratio CR Optimal 1000 1500 - - Note 1,4
Brightness Lv Optimal 380 450 - Cd/m2 Note 1
Brightness Uniformity Y Optimal 72 82 - % Note 1,7(9P)
Flicker -30 dB Note 1,2
Crosstalk 2 % Note 1,3
Θ =0 °
Response time τf or τr - 30 35 ms Note 1,6
Ta =25 °C
Color Gamut NTSC - 78 82 - % Note 1
Suv = max 0.13, huv = 0~360 - Note 1
White Chromaticity
Suv = max 0.2, huv = 225 ± 45 - Note 1
x - Note 1
Red Chromaticity Suv = 3.58 ± 0.1, huv = 14.2 ± 1
y - Note 1
x - Note 1
Green Chromaticity Suv = 1.79 ± 0.1, huv = 124 ± 2
y - Note 1
x - Note 1
Blue Chromaticity Suv = 4.1 ± 0.25, huv = 268 ± 3
y - Note 1

4-2. Cell&BLU Optical Characteristics


Parameter Typ Unit Remarks
Aperture Ratio 45%(mis1.5) %
Upper Pol Trans. 43 %
Lower Pol Trans. 42.5 %
Panel Trans. % w/o APF
Panel Trans. 4.62 % with APF
BLU Luminance 10600 Cd/m2 Center
BLU Luminance Uniformity 75 % Note1,7

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4-3. Gamma/Color Coordinate Uniformity/CE Function/CABC Function


4.3-1 Gamma Curve
Request: R/G/B/W, 0-255 gray scale, step 1 gray scale

4.3-2 Color Coordinate Uniformity


Request: white pattern, 0-255 gray scale, step 15 gray scale.
Gray Scale x y White x y
0 0.258 0.252 135 0.300 0.323
15 0.290 0.308 150 0.300 0.323
30 0.298 0.321 165 0.300 0.323
45 0.299 0.323 180 0.300 0.323
60 0.300 0.323 195 0.300 0.323
75 0.300 0.323 210 0.301 0.323
90 0.300 0.323 225 0.301 0.324
105 0.300 0.323 240 0.302 0.325
120 0.300 0.323 255 0.303 0.327

4.3-3 CABC function(on and off)


Request: Movies comparison( three segments with different frames details, lighter, light+dark, darker)
Measure LCD power consumption of three segments , including logic and BLU

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4-4. LCD Spectrum and BLU Spectrum


Center Point

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[Note 1] Optical Test Equipment Setup

The LCD module should be turn-on to a stable luminance level to be reached. The measure
ment should be executed after lighting Backlight for 20 minutes and in a dark room.

Fig 4.1. Optical Characteristic Measurement Equipment and Method

[Note 2] Flicker
The flicker level should be measured with horizontal gray/black stripes. The flicker is essentially a ratio of t
he powers in the frequency spectrum at 30 Hz (PX) and 0 Hz (P0- DC level).

F = 20 Log (PX/ P0)

G1
G2

G1280

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[Note 3] Crosstalk

H/2
H/8 H/8

P1

V/8
P2 P5 P3

V
P4 V/2
V/8

Fig 2-5. Crosstalk measurement points

A: Luminance for P1 ~ P4 with all 127gray pixels


B: Luminance for P1 ~ P4 with 127gray pixels when the black box is applied

Crosstalk [%] = Maximum [ Absolute ( A-B


A )]

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[Note 4]

Contrast Ratio is defined as follows ;

Photo detector output with LCD being “White”


Contrast Ratio(CR) =
Photo detector output with LCD being “Black”

[Note 5]

Viewing Angle Range is defined as follows;

UP θ=0o
(12 o’clock) z
A
Φ=90o

yu θ

Φ
LEFT RIGHT
xl xr
(9 o’clock) (3 o’clock)
Φ=180o Φ=0o
TFT-LCD
Module

yd

DOWN
(6 o’clock)
Φ=270o

Fig 4.2 Viewing Angle Definitions

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[Note 6]

Response time is obtained by measuring the transition time of photo detector output, when input s
ignals are applied so as to make the area “black” to and from “white”.

White
Photo detector Output

100%
90%

10%
0%
Black Black
τr τf

[Note 7] Time
Fig 4.3 Response Time Definition

The brightness measurement is taken at point 5P/13P.

Brightness Minimum Photo detector output for P1-P400with all pixels white
= X 100
Uniformity Maximum Photo detector output for P1-P400with all pixels white

Fig 4.4 Brightness Measurement Points

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5. MECHANICAL CHRACTERISTICS
The contents provide general mechanical characteristics for the model.
In addition the figures in the next page are detailed mechanical drawing of the LCD.

Items Description Typ. Tolerance Unit


Mother Glass Size 1300*1500mm*0.5t - mm
Q-Panel Size 650*750*0.5t - mm
C/F and TFT t
hickness afte thickness 0.16/ 0.16 ± 0.025 mm
r slimming
A/A 67.07x 156.492 - mm
C/F 68.47x 158.19 ± 0.2 mm
TFT 68.47x 159.09 ± 0.2 mm

Panel BM(U/D/L/R) 0.8/1.8/0.7/0.7 - mm

0.084(u)
Pol Size - mm
0.073(d)
Gap Between Pol~C/F
0/0.3/0/0 ± 0.15 mm
border (U/D/L/R)
Horizontal 68.87 ± 0.15 mm

Vertical 160.04 ± 0.15 mm

Module
Thickness 1.23 ± 0.1 mm
UV Glue Thickness <0.16 - mm
Gap between Glass~
0.2/0.2/0.2/0.75 ±0.2 mm
LCM outline

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5.1 LCM Drawing


Folded and unfolded status
(1) Front side
The tolerance, not show in the figure, is ± 0.2mm. [Unit: mm]

PLUS

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(1) Rear side


The tolerance, not show in the figure, is ± 0.2mm. [Unit: mm]

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5.2-1 BLU Outline Dimension


Including each film

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Material or Methods Specification NO. SD18C74384

TITLE: LCD MODULE, 68.87× 160.04× 1.23MM, MIPI,DISPLAY, ± 5.5V,1.8V


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5.3 Panel Outline Dimension

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Material or Methods Specification NO. SD18C74384

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5.4 FPCA Outline Dimension

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6. RELIABLITY TEST
Must be accordance with Lenovo RA test items

Test Items Conditions


Operation Temperature -20℃ To 60℃
Operating Humidity 20% ~ 90%
Temperature when
-30℃ To 70℃
stored
Humidity when stored 5% ~ 90%
MTBF >10,000POH
If after 10,000 hours, the brightness of the panel is 50% greater than the
initial value, the MTBF report and SDA test report should be given to
providers.

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7. Safety & Environment Test Reports

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8. Package
8.1. Packing Description

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Material or Methods Specification NO. SD18C74384

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8.2. Description of Packing Tray

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Material or Methods Specification NO. SD18C74384

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8.3. Description of Packing Box

(1) 纸箱堆叠数按2*3/每层*共5层

上海天马微电子有限公司 上海天马微电子有限公司
地址:中国上海市浦东新区汇庆路 号
地址:中国上海市浦东新区汇庆路 号

上海天马微电子有限公司 上海天马微电子有限公司
地址:中国上海市浦东新区汇庆路 号
地址:中国上海市浦东新区汇庆路 号 :

上海天马微电子有限公司 上海天马微电子有限公司
地址:中国上海市浦东新区汇庆路 号
地址:中国上海市浦东新区汇庆路 号 :

上海天马微电子有限公司 上海天马微电子有限公司
地址:中国上海市浦东新区汇庆路 号
地址:中国上海市浦东新区汇庆路 号

上海天马微电子有限公司 上海天马微电子有限公司
地址:中国上海市浦东新区汇庆路 号 地址:中国上海市浦东新区汇庆路 号
: :

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Material or Methods Specification NO. SD18C74384

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REVISION DATE: 04/28/2020 MEMO: ISSUE: A PAGE 49 / 50

9. Incoming Inspection Standard

9.1 Defect definition


Critical defect CR : (Ac=0 Re=1)Bring on or maybe hurt to user.
Major defect MA :
1. Reflect on parts invalidation or unstable;
2. Product function can not meet requirement;
3. Cosmetic defect obviously.
Minor defect MI :
1. Do not impact product function & performance;
2. Cosmetic defect unclear;
3. Defect can be repaired easily.

9.2 Incoming Inspection


Refer to GB2828. 1-2003, general inspection level Ⅱ, Qualification level is as bel
ow
MA: AQL 0.4 MI: AQL 0.65

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Material or Methods Specification NO. SD18C74384

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REVISION DATE: 04/28/2020 MEMO: ISSUE: A PAGE 50 / 50

10. Checklist

Description Request Value

MIPI Impedance 90±10Ω 90±10Ω


BTB CNT Yes
Connection
ID Pin GND N/A

IC Protection Shielding tape on IC Yes

Bending Area Not exceed M/F Yes

FPC status Unfolded while direct bonding Yes

GND Area Need GND area to connect FR4 Yes


FPC

Test Points Need shieling tape on it Yes

Bending Area Single layer Yes

SUS 4 Corner side At lease 1.2mm No

Glass Generation G5?G6? G6


Cutting Q’ty panel Q’ty each mother glass 240
Display mode VA/IPS FFS
Mask Q’ty Array mask 11
Pixel Domain 1 or 2? P2D
ITO@C/F ITO square resistance, thickness <60Ω/□ , 500Å
Scan direction Single scan or dual scan Dual scan
Main: Φ9um,
density=0.087%,
PS Parameter Main/Sub PS density and size
Sub: Φ11um,
Panel density=2.60%
Cell gap Center gap 3.0um
LC injection Vacuum injection or ODF ODF
LC Margin >6% 6%
None compensation
Pol compensation A+C/B+B/None compensation film
film(0-Tac)
UV Glue Fill out at IC around OK

Direct bonding: HC+Glare Direct bonding: HC


Pol surf. Treatment
Air bonding: Haze44+glare(>4inch) Air bonding:HC

Direct bonding: pol is higher 0.05mm than M/F Higher than M/F
Pol position
Air bonding: pol is lower 0.05mm than M/F 0.05mm

Surface resistance 10^4~10^11Ω Yes


Package Friction voltage ≦100V Yes
Layer in one Box <10layer Yes

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