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  • 2013 - US9209190 - Deep Trench Capacitor

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    Lim Li
    7 views13 pages
    This document describes a 3D IC structure with two stacked dies connected through through-silicon vias (TSVs). The bottom die contains a high voltage or power IC and is connected to a substrate through solder balls. The top die contains a capacitor IC and is connected to the bottom die through larger TSVs and solder balls to integrate different functionality into a single package with a reduced footprint.

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    2013_US9209190_Deep trench capacitor

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    This document describes a 3D IC structure with two stacked dies connected through through-silicon vias (TSVs). The bottom die contains a high voltage or power IC and is connected to a substrate through solder balls. The top die contains a capacitor IC and is connected to the bottom die through larger TSVs and solder balls to integrate different functionality into a single package with a reduced footprint.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    7 views13 pages

    2013 - US9209190 - Deep Trench Capacitor

    Uploaded by

    Lim Li
    This document describes a 3D IC structure with two stacked dies connected through through-silicon vias (TSVs). The bottom die contains a high voltage or power IC and is connected to a substrate through solder balls. The top die contains a capacitor IC and is connected to the bottom die through larger TSVs and solder balls to integrate different functionality into a single package with a reduced footprint.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    of 13

    contact

    planar surface contact

    contact

    contact

    2nd dielectric oxide layer


    ILD

    2nd conductive layer

    1st dielectric

    1st conductive
    layer
    doped region

    2nd recess

    1st recess
    1st 3D IC structure

    HV or power IC epoxy capacitor IC

    wirebond
    wirebond
    wirebond
    wirebond
    wirebond
    wirebond
    underfill layer, e.g. PI, BCB

    substrate

    solder balls

    1st larger solder ball


    2nd large solder ball
    TSV

    1st mini solder ball 2nd TSV

    substrate 2nd mini solder ball


    epoxy

    HV or power IC capacitor IC

    package

    solder balls, flip chip ball grid array, FCBGA

    substrate

    HV or power IC
    1st bond pad

    1st package
    2nd bond pad
    2nd package

    capacitor IC

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