SEMICONDUCTOR EQUIPMENT

http://www.asmpacific.com
 ASM Semiconductor Equipment Products
Index

Materials Materials
Process Model Process Model
Handling Handling
AD9312 Chip on Glass STN, CSTN, COG900 /
(COG) TFT and COG902 /
12” Wafer

Equipment
AD9212 COG930
Handling other types

Display
Flip Chip of Glass FOG900 /
AD8312FC Flex on Glass
(FOG) Panel FOG902 /
8” Wafer FOG930
AD838FC
Handling Panel Touch Panel
GEMINI Series
AD8312 / Lamination Bonding
AD8312R
12” Wafer
Handling ISLinDA Materials
Process Model
Handling
MCM12
Strip Form
TWIN832 Reflow Oven SR902 Series
Substrate

Curing
Oven
AD838 / Strip / Reel PC139 Series
Snap Curing
AD838P
Oven
Form
8” Wafer Substrate COE139 Series
AD838R
Epoxy DA Handling
AD838L /
AD838LM Materials
Process Model
Die Attach Equipment

Handling
IS898GA
TwinEagle Xtreme GoCu
TWIN833 Harrier Xtreme GoCu
Au / Cu / CuPd
iHawk Xtreme GoCu
AD830 Plus / Ball Bond
6” Wafer Eagle Xtreme GoCu
AD830R Plus
Wire Bondiing Equipment

Handling Eagle Xpress GoCu

AD210 Thermosonic
Wire Bond iHawk Xpress Opto
iHawk Xtreme
AD880 Series Au
Harrier Xtreme
Ball Bond
TWIN830UR Xpress-LB
iHawk-V
AD830U /
AD830UR
Heavy
AL501
Eutectic DA Aluminum Wire
8” Wafer AD211 Plus / Ultrasonic
AD212 TwinPhonon
Handling Wedge
Wire Bond Fine
AD220 AB589 Series
Aluminum Wire
SD832D AB530
Soft Solder DA
SD890A
Solder Paste Materials
Misc eClip Process Model
DA / Clip Attach Handling
Other DA

AD881 Series Advanced 4” Wafer

ES101
Epoxy DA Optical Handling
6” Wafer AD100 Series Inspection Strip Form
Handling VIM300
(AOI)
Equipment

PD & LD Substrate
AOI / FOL

AD819-PD /
Eutectic DA AD819-LD Chip Probing
6” Wafer CP100
Lens Holder Attach IS868LA3 Handling
Die Sorting AS899
DI-Wafer Cleaning
ISCM868
CIS Equipment

System Wafer MS100 Plus

Map Sorting
Waterless Base CMOS Form MS109
ISCM139B
Cleaning System Camera
Module
Lens Holder Alignment IS600G2
Camera Module
Auto Focusing & IS300-AF
Electrical-Test

1
ASM Semiconductor Equipment Products
Index

Materials Materials
Process Model Process Model
Handling Handling
Dispensing All kinds of IC and
DS86 Laser Mark
+ Testing Power Device LS1000

Other Equipment
Handler
+ Compensating Matrix Leadframes
Dispensing
Equipment

Glob-top DS830 CSBGA / PBGA,

Strip Form Ball Placement BP2000
flex BGA & etc.
Glob-top, Dam & Fill Substrate DS530H CSBGA, MLP,
Tape Sorting CS900
Potting DS520V QFN, SiP & etc.
Lead Frame Reel Form
Glob-top DS830LB LFC130 Series
Cutting Substrate

Materials Materials
Process Model Process Model
Handling Handling
Strip Form SIPLACE SX-Series
Transfer Molding OSPREY
Substrate

Equipment
Placement
SMT SIPLACE X-Series
Equipment

SMT
12” Wafer WLP300 SMD Components
Molding

Compression Molding Placement

Bonding SIPLACE Di-Series
IDEALcompress™
Strip Form SIPLACE CA
IDEALmold™
Transfer Molding Substrate
IDEALab™

Materials
Process Model
Handling
Form System

Saw and Pick & Place iSAP

Singulation,
Trim &

Strip Form MPHENIX

Mechanical Press Substrate
Trim / Form
MP-TAB

Materials
Process Model
Handling

FT2026
Test & Finish

Discrete
Handling
System

Turret Based Test Package

FT2018
Handler
Mini-Discrete
FT-Mini
Package

Materials
Process Model
Handling

Panel Testing MCPCB, PT86

Ceramic
Taping System

LED Testing,

Testing & Sorting SLS230 Series

Sorting &

SMD Type
Taping LED SLT400 Plus

Testing & Sorting IP360 Series

HP LED
Taping AT410

2
 AD9312 AD9212
12” Thermocompression 12” Dual Head Flip Chip System
Flip Chip System

HIGH TC BONDING HIGH

PRECISION PROCESS PRECISION

Features
 Individually controlled dual bond head with shared
up/down-look inspection
 Equipping with pre-dispensing station for TC NCP
process (option)
 Suitable for 2.5D / 3D IC packaging
Features
 Providing dual flip chip head bonding process
 Advanced PR inspection system for high precision
bonding
 Thin dice handling capability

Applications Applications
 Singulated BGA  Singulated BGA
 BGA  BGA
 Ceramic panel  Ceramic panel
 Singulated substrate on carrier  Singulated substrate on carrier
 Lead frame  Lead frame
 And more……  And more……

3 *Remark: All performance is package dependent

 FLIP CHIP
SOLUTIONS

AD8312FC AD838FC
12” High Speed Flip Chip System 8” High Speed Flip Chip System

HIGH THIN DIE HIGH FLUX

HD LF
SPEED HANDLING SPEED DISPENSING

Features
 Supporting both flip chip and direct die bonding
processes
 Up to 100 mm substrate width handling
 Flux dipping and dual flux dispensing capability
 ASM in-house developed Archerfish dispensing system
 In-lining with oven for solder reflow
 Optional for thin die handling
Features
 Supporting both flip chip and direct die bonding
processes
 Dual flux dispensing capability
 ASM in-house developed Archerfish dispensing system
 In-lining with oven for reflow process
 Machine cascade for multi-die handling

Applications Applications
 QFN / DFN  QFN / DFN
 SOIC  SOIC
 SO  SO
 And more……  And more……

*Remark: All performance is package dependent 4

 AD8312
12” Epoxy Die Attach System
(For Strip Form Substrate Handling)

AD8312R ISLinDA
12” Epoxy Die Attach System 12” Thin Die Attach System
(For Reel Form Substrate Handling)

HIGH HD LF for THIN DIE CLASS 100

HD LF
SPEED AD8312 HANDLING STANDARD

Features
 World’s first 12” dual dispensing die bonding series
 AD8312: High density lead frame (100 x 300 mm²)
handling and universal workholder design for various
packages
 AD8312R: strategic designs for handling backside
plated substrates
 In-lining with curing oven (option)
Features
 High density lead frame (100 x 300 mm²) handling
 World’s first 12” dual dispensing die bonding series
 Individual pick and bond system
 Thin die handling capability with patented design
 Panel bonding capability

Applications Applications
 Mini-BGA  PLCC  Mini-BGA  PLCC
 Flex BGA  MEMS  Flex BGA  Image sensor
 CSPBGA  PDIP  CSPBGA  And more……
 MLP/QFN  Smartcard (AD8312R)  MLP/QFN
 QFP  And more……  QFP
 TQFP  TQFP

5 *Remark: All performance is package dependent

 12” EPOXY DA
SOLUTIONS

MCM12
12” Multi-Chip System

X-LARGE
HD LF
SUBSTRATE

Features
 Working range up to 330 x 210 mm²
 Up to 14 types of picking tools handling capability
 Up to 5 types of ejecting kits installation
 SMD bonding capability
 Direct die attach / flip chip bonding capability
 Supporting auxiliary dispensing system

Applications
 BGA
 Wafer submount
 MLP/QFN
 Metal can
 And more……

*Remark: All performance is package dependent 6

 AD838
8” Epoxy Die Attach System

TWIN832 AD838P AD838R

8” Dual Epoxy 8” Epoxy Die Attach System 8” Epoxy Die Attach System
Die Attach System (for High Precision Placement) (for Reel Form Substrate)

DUAL HIGH HD LF HIGH

HD LF HD LF
WAFERS SPEED for AD838 SPEED

Features Features Features

 Highest throughput per footprint
 Single machine for dual dice packages
 High density lead frame (100 x 300 mm²)
handling
 Patented bond head and dispensing
system
 AD838: up to 100 mm substrate width
 AD838P: high precision placement
 Patented bond head design
 Dual dispensing system
 Providing graphical SPC data with latest
IQC system
 High density reel form substrate up to
100 mm width
 Patented bond head design
 Dual dispensing system
 Providing graphical SPC data with IQC
system
 In-lining with curing oven or pressing
system (option)

Applications Applications Applications

 QFN / DFN  SOT  QFN / DFN  SOT  Smartcard
 TQFP  And more HD  TQFP  And more HD  RFID package
 PLCC lead frames……  PLCC lead frames……  Any reel form substrate
 TSSOP  TSSOP
 TSOP  TSOP
 SOIC  SOIC

7 *Remark: All performance is package dependent

 8” EPOXY DA
SOLUTIONS

AD838L
8” Epoxy Die Attach System
(for Direct Substrate Indexing)

AD838LM IS898GA
8” Epoxy Die Attach System 8” Epoxy Glass Attach System
(for Vibration Boat Inputting)

DIRECT CERAMIC VIBRATION BOAT CLASS 100 UV SNAP

HANDLING FEEDER INPUT STANDARD CURE

Features
 Direct ceramic substrate indexing
 Anvil block with clamp force self-compensation design
 Panel bonding capability with intelligent global
substrate alignment
 Dual stamping/ dispensing process
 AD838LM with input vibration boat feeding system
Features
 Various cleaning modules during glass attach process
 Dual glue writing capability
 Suitable for strip form substrate or boat carrier
 Supporting glass presentation on mylar / waffle pack
 UV snap curing system (option)

Applications Applications
 Ceramic  BT
 MCPCB  CLCC
 MLP/QFN  PLCC
 QFP  Singulated lens holder
 TQFP  And more……

*Remark: All performance is package dependent 8

 AD830 Plus
6” Epoxy Die Attach System

TWIN833 AD830R Plus

6” Dual Epoxy 6” Epoxy Die Attach System
Die Attach System (for Reel Form Substrate)

DUAL HIGH OPTICS

HD LF HD LF
WAFERS SPEED ARRAY

Features
 Single machine for dual-die packages
 High density lead frame (100 x 300 mm²) handling
 Highest throughput with smallest footprint
 Patented bond head design
 8” wafer handling (option)
Features
 Patented bond head design
 High density lead frame (100 x 300 mm²) handling
 Optics array system enhancing bonding cycle time
 True color camera with white LED lighting for handling
various materials
 AD830R Plus with reel form substrate handling
 8” wafer handling (option)

Applications Applications
 SMD LED  SMD LED
 Pre-molded lead frame  Chip LED
 EMC lead frame  Top LED
 High Power LED  EMC lead frame
 And more HD lead frames……  Side view LED
 And more……

9 *Remark: All performance is package dependent

 6” EPOXY DA
SOLUTIONS

AD210 AD880 Series

6” Epoxy Die Attach System Epoxy Die Attach System

X-LARGE UV SNAP X-LARGE

SUBSTRATE CURE SUBSTRATE

Features
 Achieving ±5 µm @ 3 sigma XY placement
 Up to 8” x 8” bonding area
 Individual control of pick and bond process
 Patented bond head design
 UV snap curing system (option)
Features
 Up to 8” x 8” substrate handling
 DDR rotary bond arm system
 Dual loading system for automatic materials handling,
substrate & wafer loading (option)

Applications Applications
 Silicon wafer submount  Silicon wafer submount
 Large PCB substrate  PCB
 High precision photonics device  Ceramic
 And more……  And more……

*Remark: All performance is package dependent 10

 AD830U
Eutectic Die Attach System

TWIN830UR AD830UR
Dual Eutectic Die Attach System Eutectic Die Attach System
(for Reel Form Substrate) (for Reel Form Substrate)

HIGH DUAL HIGH

SPEED WAFERS SPEED

Features
 Single machine for dual dice packages
 Highest throughput per footprint
 Patented bond head design
 Forming gas supply during process
 In-lining with lead frame cutting system and automatic
wire bonding system
Features
 Independent temperature control in each heating zone
 Patented bond head design
 Forming gas supply during process
 Dispensing system for flux eutectic (option)
 AD830UR: in-lining with lead frame cutting system and
automatic wire bonding system

Applications Applications
 SOD  SOD
 SOIC  SOIC
 SOT  SOT
 And more……  And more……

11 *Remark: All performance is package dependent

 EUTECTIC DA
SOLUTIONS

AD211 Plus / AD212 AD220

Direct Eutectic Direct Eutectic
Die Attach System Die Attach System

HEATED PANEL FORM X-LARGE HEATED STRIP FORM

COLLET B/H SUBSTRATE SUBSTRATE COLLET B/H SUBSTRATE

Features
 Direct ceramic substrate handling
 Patented process and modules design
 Individual control pick and bond system
 Graphical SPC data with IQC system
 Anti-thermal shock design for eutectic process
 Forming gas supply during process
 AD212: up to 8” x 8” substrate handling
Features
 Patented process and designs
 Individual control pick and bond system
 Up to 300 mm long lead frame handling
 Graphical SPC data with IQC system
 Providing 8 (heating zones) + 3 (cooling zones)
eutectic bonding environment
 Forming gas supply during process

Applications Applications
 Ceramic based high power LED  Strip form high power LED
 Silicon based high power LED  Premold lead frame

*Remark: All performance is package dependent 12

 SD832D SD890A eClip
Soft Solder Soft Solder Clip Bonding System
Die Attach System Die Attach System

PATENTED LEADING XY B/H ALL-IN-ONE PATENTED

HD LF
DESIGN THROUGHPUT SHUTTLING SOLUTION DESIGN

Features Features Features

 Industry’s leading throughput
 Up to 100 x 300 mm² HD lead frame
handling
 Patented bond head system
 Patented solder writing technology
 AB dice handling with rotary collet bond
arm design
 Oxygen level control with forming gas
supply
 Matrix lead frame handling with XY
shuttling bond head system
 Motorized solder wire feeding and
spanking system
 AB dice handling with rotary collet bond
arm design
 Automatic die theta alignment
 Oxygen level control with forming gas
supply
 All-in-one bonding solution from die
bonding, clip bonding to reflow process
 Patented bond head design
 Supporting dual dispensing system
 Array clip bonding capability
 Supporting independent temperature
controlling regions for reflow process
 Optional configurations with
 12” wafer handling
 Flip chip bonding
 Multi-die bonding

Applications Applications Applications

 High power device  High power device  High power discrete package
 TO-220  TO-220  DPAK matrix
 SOT  SOT  Power SO
 DPAK  DPAK  And more……
 DPAK matrix  DPAK matrix
 PowerSO  PowerSO
 And more HD high power lead frame……  And more high power lead frame……

13 *Remark: All performance is package dependent

 OTHER DA
SOLUTIONS

AD819-PD
Photo Diode Epoxy
Die Attach System

AD881 Series AD100 Series AD819-LD

Flexible Epoxy Vertical LED Epoxy Laser Diode Eutectic
Die Attach System Die Attach System Die Attach System

MULTI NON-STOP PATENTED PRECISION METAL CAN

WAFER OPERATION DESIGN PLACEMENT HANDLING

Features Features Features

 DDR rotary bond arm system
 AD881 with 8” x 5” dual workholders
system
 AD881H with automatic substrate load/
unload system
 AD881M with up to 3 wafers handling
 AD881MH with up to 3 wafers handling
and automatic substrate loading /
unloading system
 Dual stacks loading system
 Dual clamps indexing algorithm
 Pre-bond and post-bond inspections
simultaneously
 Providing different algorithms for die
alignments
 AD100MM with automatic input magazine
system
 Carrier free design for materials handling
 AD819-PD with “Two-in-One stamp and
bond system”
 AD819-LD with “Moving Temperature
Control Profile” for eutectic process
 AD819-LD with submount and top dice
handling

Applications Applications Applications

 Top LED  Vertical lead frame  Metal can handling
 Chip LED
 PCB
 Bent lead frame
 And move......

*Remark: All performance is package dependent 14

 IS868LA3 ISCM868 ISCM139B
Lens Holder DI-Water Cleaning System Waterless Base
Attach System Cleaning System

CLASS 10 QUAD-EPOXY PRECISION CLASS 100 DI-WATER

STANDARD WRITING PLACEMENT STANDARD SPRAY

Features Features Features

 World’s first quad dispensing system for
CIS bonding process
 Strategic module design for FM control
 ULPA filter implementation
 Multiple rotary clean bath
 High resolution up-look and bond optics
 Spraying of DI-water cleaning with dual  In-lining cleaning system with
air atomizing nozzles programmable air blowing
 Programmable motion of swing spray arm  Achieving factory automation by fully
and spinner table automatic materials handling
 High speed centrifugal drying
 In-line capability with ASM’s AOI system
and lens holder bonding system
 ISCM868 + VIM300 + IS868LA3

Applications Applications Applications

 CLCC  CLCC  CLCC
 PLCC  PLCC  PLCC
 BGA  BGA  BGA
 PCB  PCB  PCB
 Singulated unit  And more......  And more strip form substrate for
 And more...... cleaning process……

15 *Remark: All performance is package dependent

 IMAGE SENSOR
SOLUTIONS

IS600G2 IS300-AF
Active Alignment Camera Module Auto Focusing &
Lens Holder Attach System Electrical-Test System

CLEAN 10 NON-STOP DUAL SETS OF

STANDARD OPERATION TEST STATIONS

Features
 Class 10 cleanliness
 Active alignment of camera module
 Leading throughput among same type of bonders
 Equipping with four dispensing and active alignment
(AA) stations
 Utilization of relay lens for smaller machine footprint
 In-line capability with multiple IS600G2 for mass
production (option)
Features
 Supporting both FPC type and non-FPC type of CMOS
camera module
 Providing open/short test and current test
 Dual test charts for auto-focusing (AF) station with
built-in backlight illumination
 In-line capability with dispensing and UV pre-curing
station (option)

Applications Applications
 CLCC  CLCC
 PLCC  PLCC
 BGA  BGA
 PCB  PCB
 And more……  And more singulated image sensor packages……

*Remark: All performance is package dependent 16

 DISPLAY
SOLUTIONS

COG900 / COG902 / COG930 FOG900 / FOG902 / FOG930 GEMINI Series

Chip on Glass (COG) Flex on Glass (FOG) Panel Lamination System
Bonding System Bonding System

QUAD-EPOXY FLEX on FILM (FoF) NAKED EYE PATENTED

WRITING SOLUTION 3D SOLUTION DESIGN

Features Features Features

 True colour LED inspection
 Supporting belt input/output system and
tray handling system
 COG930: up to 13.4” glass handling
 COG902 for high speed bonding for
mobile phone application
 COG900 for all round COG application
 In-line capability with glass edge cleaning
system and FOG system
 True colour LED inspection
 Supporting belt input/output system and
tray handling system
 FOG930: up to 13.4” glass handling
 FOG902 for high speed bonding for
mobile phone application
 FOG900 for all round FOG application
 In-line capability with COG system
 Supporting pre-defined computer aid
dispensing patterns
 Up to 310 x 190 mm glass handling
 Gemini-RTA provides real time alignment
for precision control
 UV line scan cure system covers full area
pre-curing after lamination

Applications Applications Applications

 STN  STN  Touch panel bonding
 CSTN  CSTN  Naked eye 3D application
 TFT  TFT
 And more types of glass and LSI for  And more types of glass and LSI for
COG bonding…… FOG bonding……

17 *Remark: All performance is package dependent

 CURING
SOLUTIONS

SR902 Series PC139 Series COE139 Series

Reflow Oven Snap Curing Oven Snap Curing Oven

CONVECTION + REEL FORM

RADIATION HEATING SUBSTRATE HANDLING

Features Features Features

 Independent temperature controlling
zones
 Combination of convection and radiation
heating modes
 SR902L with automatic off-loading system
 SR902W for manual loading wafer
substrate for reflow
 In-line capability with AD9212 (option)
 Independent temperature controlling zones
 PC139R-5Z: up to 5 temperature
controlling zones and reel form substrate
handling
 PC139R-10Z: up to 10 temperature
controlling zones and reel form substrate
handling
 In-line capability with AD838R, AD8312R,
etc. (option)
 Sophisticated oxygen level control
 Independent temperature controlling
zones
 COE139: strip form substrate handling
 COE139R: reel form substrate handling
 In-line capability with AD830 Plus, and
other die attach system (option)

Applications Applications Applications

 Reflowing process for high lead (> 85%  Smartcard  SOT
Pb) solder, lead free solder, flux reflow,  SOT  Top LED
etc..  And more strip / reel form substrates......  And more strip / reel form substrates......

*Remark: All performance is package dependent 18

 TwinEagle Xtreme GoCu Harrier Xtreme GoCu iHawk Xtreme GoCu
Dual Heads Dual Heads Ultra High Throughput Discrete /
Gold Wire Bonder Wire Bonder Opto Wire Bonder

PATENTED HIGH LOW LOOP Cu WIRE HIGHER OPTICS PR

AWRS AWRS AWRS
TECHNOLOGY RESOLUTION ~ 35 µm BONDING UPH SYSTEM

Features Features Features

 Auto Wire Rethreading System (AWRS)
 Fine pitch capability: 30 µm BPP
 Bond placement: 2 µm @ 3 sigma
 Extensive field knowledge & reliability
proven solutions for 2 N wires, ultra
low-k, 45 nm technology dies
 Auto Wire Rethreading System (AWRS)
 Up to 20% higher UPH compared to
Harrier
 User-friendly, intelligent Windows-based
interface
 Cu wire bonding & Cu BSOB
 Smart Skip – for skipping missing die
 Auto Wire Rethreading System (AWRS)
 Simple package conversion with fully
motorized material handling system
 Robust indexer to handle high density
discrete package

Bonding Capabilities Bonding Capabilities Bonding Capabilities

 Bonding method: thermosonic
 Cu wire size: 0.6 mil ~ 2.0 mils
 Wire length: max. 8 mm
 Bonding speed: 20 wires/sec for 2 mm
 Lead locator detection: 5 ms / lead
 Bonding method: thermosonic
 Cu wire size: 0.6 mil ~ 2.0 mils
 Wire length: max. 8 mm
 Bonding speed: 20 wires/sec for 2 mm
 Lead locator detection: 5 ms / lead
 Bonding method: thermosonic
 Cu wire size: 0.6 mil ~ 2.0 mils
 Wire length: max. 8 mm
 Bonding speed: 20 wires/sec for 2 mm
 Lead locator detection: 5 ms / lead

19 *Remark: All performance is package dependent

Eagle Xtreme GoCu Eagle Xpress GoCu
Model Based Wider Substrates
Wire Bonder Wire Bonder

AUTO AUTO FASTER

AWRS AWRS
PR LOOPING THAN Au

Features
 Auto Wire Rethreading System (AWRS)
 Bonding area: 56 x 70 mm @ LF < 80 mm
 Placement accuracy: 2.0 µm @ 3 sigma
 Eagle Xtreme is upgradable
Features
 Auto Wire Rethreading System (AWRS)
 Bonding area: 56 x 90 mm @ LF 100 x 300 mm
 Placement accuracy: 2.0 µm @ 3 sigma
 Revolutionary auto PRS
 Loop definition

Bonding Capabilities Bonding Capabilities

 Bonding method: thermosonic
 Cu wire size: 0.6 mil ~ 2.0 mils
 Wire length: max. 8 mm
 Bonding speed: 20 wires/sec for 2 mm
 Lead locator detection: 5 ms / lead
 Bonding method: thermosonic
 Cu wire size: 0.6 mil ~ 2.0mils
 Wire length: max. 8 mm
 Bonding speed: 20 wires/sec for 2 mm
 Lead locator detection: 5 ms / lead

*Remark: All performance is package dependent 20

 iHawk Xpress Opto iHawk Xtreme Harrier Xtreme
Wire Bonder Wire Bonder Dual Heads
Wire Bonder

WIDER
CERAMIC AWRS AWRS
SUBSTRATES

Features Features
 Auto Wire Rethreading System (AWRS)  Auto Wire Rethreading System (AWRS)
 Wider bonding area – 56 mm x 90 mm  Easy conversion from Au to non-Au wire handling
(substrate width < 102 mm) and vice versa
 Capable of handling 4” x 4” ceramic  Optional non-Au wire bonding upgrade kits
substrate (GoCAP)
 Optional non-Au wire bonding upgrade
kits (GoCAP)

Bonding Capabilities Bonding Capabilities

 Bonding method: thermosonic  Bonding method: thermosonic
 Copper wire bonding: option with  Cu Wire Bonding: option with conversion kit
conversion kit  Wire length: max. 8 mm
 Wire length: max. 8 mm  Bonding speed: 20 wires/sec for 2 mm
 Bonding speed: 20 wires/sec for 2 mm  Lead locator detection: 5 ms / lead
 Lead locator detection: 5 ms / lead

21 *Remark: All performance is package dependent

 LED OPTO
SOLUTIONS

Xpress - LB iHawk-V
Long Bar Lighting Application Wire Bonder
Wire Bonder

720 mm LONG HIGH

AWRS
LEAD FRAME PERFORMANCE

Features
 Auto Wire Rethreading System (AWRS)
 Up to 720 mm long magazine application
 Up to 100 mm width lead frame handling
 COB programming feature
 Easy loop control
 Optional non-Au wire bonding upgrade kits (GoCAP)
Features
 High speed wire bonding capability
 Pro-longing MTBA with latest input / output magazine
handling
 Extended workholder - support up to 2 strips in waiting

Bonding Capabilities Applications

 Bonding method: thermosonic  Vertical lead frame
 Cu wire size: 0.7 ~ 2.0 mils
 Wire length: max. 8 mm
 Bonding speed: 20 wires/sec for 2 mm
 Lead locator detection: 5 ms / lead

*Remark: All performance is package dependent 22

 AL501 TwinPhonon
Heavy Aluminum Dual Head Fine Aluminum
Wire Bonding System Wire Bonding System

DUAL PATENTED DUAL PATENTED

BOND HEAD DESIGN ROTARY TABLE DESIGN

Features Features
 5 – 20 mil aluminum wire handling  PATENTED dual workchucks design
 Hybrid wire bonding capability with dual bond  Achieving “non-stop" operation
heads system  Linear motor with DDR driven rotary worktable
 Implementing linear motor and DDR system
 “Smart BQM” system supervising bonding
quality
 Wire pull testing system integration (option)

Applications Applications
 TO-220  Toy
 DPAK matrix  Game
 And more power discrete packages……  Melody
 And more other COB packages……

23 *Remark: All performance is package dependent

 ALUMINUM
WIRE BONDING
SOLUTIONS

AB589 Series AB530

Rotary Head Fine Aluminum Rotary Table Fine Aluminum
Wire Bonding System Wire Bonding System

LARGE ROTARY HIGH HIGH LEAD

WORKTABLE BOND HEAD SPEED COUNT APP.

Features
 Fine pitch capability for advanced packages
 High precision rotary bond head design
 Patented “PR on the Fly” capability
 Standard 8” x 6” large effective bonding area
 Supporting universal carrier design for full range
application (option)
 Deep access bonding capability (option)
 Automatic material handling capability (option)
Features
 Fine pitch capability for advanced packages
 Widely implementing linear and DDR motor system
 Multi-unit / multi-PCB bonding capabilities
 Supporting various bonding requirements for different
products

Applications Applications
 Chip-on-board (COB)  Chip-on-board (COB)
 Multi-die  Multi-die/multi-PCB
 LED display  High lead count bonding
 Chip-on-flex (COF)  And more……
 Chip-on-glass (COG)
 Ceramic
 And more……

*Remark: All performance is package dependent 24

 INSPECTION
SOLUTIONS

ES101 VIM300 CP100

Automatic AOI System Automatic AOI System Automatic Chip Probing
(Wafer Level Inspection) (DIE / WIRE Inspection) System

Features Features Features

 True colour AOI capability
 Direct foton ring handling
 Dual wafers loading system
 Prolonging MTBA with up to 72 ring on
frame handling
 True colour AOI capability
 2D / 3D inspection
 Dual substrates loading system
 Individual control dual main stations
 Supporting X-Y motion
 Defect identification system with laser
marking for rejected units
 Probing area up to 6” diameter
 Supporting 2” ISP and PD handling
 Supporting ESD testing
 Built-in ASM in-house developed testing
system

Applications Applications Applications

 Automatic advanced optical inspection  Die bonded and wire bonded substrate  Blue LED wafer
system for die, e.g. LED die…… on either substrate / lead frame……  Green LED wafer

25 *Remark: All performance is package dependent

 DIE / MAP SORTING
SOLUTIONS

AS899 MS100 Plus MS109

Die Sorting System Map Sorting System Map Sorting System
(for 8.8” Picking Area)

CONVECTION + 200 80 x 80 MM 8.8” 100 x 100 MM

RADIATION HEATING O/P BIN BINNING AREA PICKING AREA BINNING AREA

Features Features Features

 Parallel pick, test and sort process with
rotary turret design
 Supporting various types of detectors and
testers integration
 Flexible bin block arrangement
 Supporting XYZ prober motions
 Simple “click & fit” bin block design”
 Dual bond arms design
 Up to 200 output bin frames
 Up to 80 x 80 mm binning area
 Supporting post-sort inspection
 Dual bond arms design
 Up to 8.8” picking area
 Up to 100 x 100 mm binning area
 Up to 200 output bin frames handling
 Supporting post-sort inspection

Applications Applications Applications

 Individual LED dice testing and sorting  Sorting die, e.g. blue LED, white LED,  Sorting die, e.g. blue LED, white LED,
solution laser diode, etc. based on wafer map laser diode, etc. based on wafer map
information information

*Remark: All performance is package dependent 26

 DS86 DS830
Automatic Dispensing System Automatic Dispensing System
(With Compensation)

3 – IN – 1 WHITE LED 8 DISPENSING

DISPENSING APPLICATION HEADS CONTROL

Features
 Dispensing + testing + compensating in one pass
 Enhancing production yield
 Automatic materials handling system
 Equipping with integrated sphere for light collection,
optional up to 8” integrated sphere handling
Features
 Up to 8 dispensing heads handling capability
 Automatic encapsulant compensation by inspection
feedback
 Implementing ASM in-house developed Archerfish
dispensing control system

Applications Applications
 MCPCB  Photo-coupler
 LED lighting module  Lead frame based substrate
 And more LED applications……  And more……

27 *Remark: All performance is package dependent

 DISPENSING
SOLUTIONS

DS530H DS520V DS830LB

Automatic Dispensing System Automatic Dispensing System Automatic Dispensing System
(for Horizontal Substrate Applications) (for Vertical LED Applications) (for Light Bar Applications)

4 – PUMP PHOSPHOR NON-STOP 650 MM

VERTICAL LED
DISPENSING APPLICATION OPERATION EXTRA LONG

Features Features Features

 Dual workholders with dual elevators
system
 Supporting “Left-in, Left-out; Right-in,
Right-out” operation
 Quad-pump dispensing implementation
 Phosphor handling capability
 Supporting various dispensing
technologies
 Engineered for vertical LED application  Tailor-made for LED light bar handling
 Automatic materials handling system  Automatic materials handling system
 Up to 18 magazines at once  Up to 650 mm length of substrate handling
 Supporting “Left-in, Left-out; Right-in,
Right-out” operation
 Dual pumps implementation (option)

Applications Applications Applications

 SMD LED  Vertical LED  LED light bar
 Ceramic
 MCPCB
 And more LED applications……

*Remark: All performance is package dependent 28

 OSPREY WLP300
Small Lot Molding System 12” Wafer Level Molding System

SMALLEST 12” WAFER LEVEL

SIZE MOLDING MOLDING

Features
 World smallest footprint automatic molding machine
 Built-in PGS™ molding capability
 Minimum tooling cost and shortest lead time
 Ideal for small lot, high product mix production
Features
 World’s first 12” automated WLP compression
encapsulation system
 Flexible to handle wafer size ranging from 4” to 12”
 Equipped with encapsulant weight compensation
 Optional for liquid epoxy, clear silicone and granular
powder handling

Applications Applications
 BGA  Wafer level packaging
 QFN  Wafer level LED
 SOT  Cu bump pillar WLP
 PDIP
 PoP

29 *Remark: All performance is package dependent

 MOLDING
SOLUTIONS

IDEALcompress™ IDEALmold™ IDEALab™

Automatic Molding System Automatic Molding System Manual Molding System
(Strip Form Substrate Handling) (Strip / Reel Form Substrate Handling)

FLEXIBLE DISPENSING PGS™

CONFIGURATION MOLDING

Features Features Features

 Ideal for ECO friendly manufacturing
 Various dispensing configuration,
including, liquid epoxy, clear silicone,
granular powder dispensing
 Suitable for standalone or in-line
configuration
 Flexible press configuration of 1 to 4
presses
 Input and output pattern recognition
features
 Vacuum and wedge molding capability
 High pre-heat temperature capability
 Pinnacle Gating System (PGS™) molding
capability (option)
 Manual molding system derived from
IDEALmold™
 Mold chase compability with IDEALmold™
 Process parameter portability to
IDEALmold™
 Suitable for R&D

Applications Applications Applications

 Up to 150 x 300 mm substrate  Mini-BGA  Taped / Tapeless QFN
molding  Flex BGA  Mini-BGA
 QFN  Flex BGA
 PLCC  SOT
 TSSOP  Punch type micro QFN
 PoP

*Remark: All performance is package dependent 30

 SINGULATION,
TRIM & FORM
SOLUTIONS

iSAP MPHENIX MP-TAB Series

Integrated Saw and Automatic Trim & Form System Automatic Trim & Form System
Pick & Place System

SMART BLADE PATENTED AUTO TUBE

HD IDF LF
HEIG HT CHECK DESIGN LOADER

Features Features Features

 Single chuck table with dual chuck tables
speed
 Robust chuck table design for warpage
handling & high saw speed
 Eagle View vision to overcome vision
stoppage during alignment
 Blade height check on each substrate
without affecting cycle time
 100 x 300 mm high density lead frame
handling
 High tonnage application
 Vision inspection for orientation and uncut
dam bar
 Cost effective discrete package
singulation platform
 Suitable for ultra high density lead frames
 Modular construction for various
integration

Applications Applications Applications

 BGA  QFP  SOT
 CSBGA  TQFP  SOD
 QFN  SOIC (IDF)  QFN
 Micro SD  QFN  DFN
 and more......  and more......  and more......

31 *Remark: All performance is package dependent

 TEST HANDLING
SOLUTIONS

FT2026 FT2018 FT-Mini

Turret-Based Test & Turret-Based Test & Turret-Based Test &
Finish Handler Finish Handler Finish Handler

HIGH SPEED HIGH AUTO UNIT

16 TEST SITES iCONTACT
WITH ARC ACCURACY REPLACEMENT

Features Features Features

 26 pick heads for multiple process steps
 Selectable for various onloading /
offloading system
 Supporting various vision inspection
technologies
 18 pick heads for multiple process steps
 iContact for double unit detection & good
testing yield
 Vacuum stopper to prevent chipping
 Best fit for small size IC/discrete packages
 Auto reel changer (ARC) (option)
 18 pick heads for multiple process steps
 High accuracy for mini package
 Vacuum stopper to prevent chipping
 Best fit for mini-discrete packages

Applications Applications Applications

 SOIC  SC70  SOD923
 TSSOP  SOT23 / 25 / 26  SOT113
 QFN / MLP  SOD123  DFN1006
 and more......  QFN (1 – 5 mm)  DFN0603
 SOIC / MSOP  and more......
 and more......

*Remark: All performance is package dependent 32

 PT86 SLS230 Series
Automatic Panel Testing System Automatic LED (SMD) Sorting
System

Features Features
 Testing packaged LED for both optical & electrical  Wide range of application
properties  SLS230: chip LED
 SLS230S: sideview LED
 Back-side probing capability
 SLS230T Plus: top LED
 Co-operating with dual workholders and dual materials
 Anti-bin mixing design with digital labeling design
handling system
 Compatible to integrate with various types of detectors
 Simple conversion with universal workholder design
and testers
 Built-in ASM in-house developed testing system
 Supporting 256 output bins
 Integrated sphere for light collection, up to 8” ISP
(option)

Applications Applications
 MCPCB  SLS230: chip LED, e.g. 0402, 0603, 0605, 0805,
 Ceramic LED substrate 1206, etc.
 SLS230S: sideview LED, e.g. 008, 010, 020, 215,
335, etc.
 SLS230T Plus: top LED, e.g. 3528, 5050, 5252, 5450,
5630, 6045, 7020, 7474, etc.

33 *Remark: All performance is package dependent

 TEST, SORT & TAPE
SOLUTIONS

IP360 Series SLT400 Plus AT410

Automatic LED Sorting System Automatic LED (SMD) Taping Automatic LED Taping System
System

Features Features Features

 One-stop solution from test, sort and
output with good traceability
 Materials handling
 Input system: wafer frame / bowl feeding
system
 Output system: tape-and-reel output, bin
frames and / or bins
 Wafer barcode scanning, unit map, label
printing and output file generation
package for good traceability of devices
(option)
 Applicable to wide range of top LED,
sideview LED and chip LED
 High throughput PPH: 45,000 +
 Built-in ASM in-house developed
checking system
 For checking Vf, Ir & POL and optical
parameters
 Advanced in-pocket inspection system
 Automatic repick package to ensure
good package in pocket
 Supporting automatic reel change
capability (option)
 Applicable for ceramic or silicon sawn
package
 All in one solution for inspection, checking
& taping
 High throughput
 8,000+ PPH*
 Up to 8” picking area
 Advanced inspection capability
 Package surface inspection
 Up-look inspection
 In-pocket inspection
 Automatic repick package to ensure good
package in pocket

Applications Applications Applications

 Ceramic based molded LED  Chip LED  Ceramic based molded LED
 Silicon based molded LED  Top LED  Silicon based molded LED
 Molded LED with lens  Sideview LED  Molded LED with lens
 And more……

*Remark: All performance is package dependent 34

 LS1000 BP2000
Laser Mark Handler Ball Placement System

Features
 Laser handling for mold body mark or 2D mark
 Experience with various third party laser gun integration
 In-line capability with trim/form system or standalone
system
Features
 High flexibility in material handling (e.g. strip, JEDEC
tray, carrier..)
 Fully modular design/construction
 Fine pitch capability: Ø0.2 mm/0.4 mm

Applications Applications
 All kinds of IC and power device lead  CSBGA / PBGA
frames  Flex BGA
 And more……

35 *Remark: All performance is package dependent

 OTHER
SOLUTIONS

CS900 LFC130 Series

High Speed Tape Sorting Lead Frame Cutter System
System

Features Features
 Pick and Place (PnP) from wafer ring to tube/tray  LFC130: standalone cutting system
offload  LFC130NU-P / LFC130NU-S: in-line capability with
 100% 4S-inspection + mark inspection without UPH other ASM die bonding systems, e.g. AD830UR,
deduction Twin830UR, etc.
 High throughput: up to 6 cutting cycles per minute
 Reliable cutting system with excellent accuracy and burr
control

Applications Applications
 CSBGA  Precision cutting reel form lead frame
 MLP into strip form
 QFN
 SiP
 And more……

*Remark: All performance is package dependent 36

 SIPLACE SX-Series SIPLACE X-Series
New Dimension of Flexibility and The Ultimate High-end SMT Solution
Maximum Speed for High Volume Production

Features Features
 High flexibility – a revolutionary placement solution that  New generation of the high speed SIPLACE X-Series sets
scales flexibility across the entire line new industry record
 Capacity on demand – machine’s performance adjusted  Excellent price-performance and
to the orders thanks to replaceable gantries and floorspace-performance ratio
intelligent placement heads  Features like SIPLACE Smart Pin Support, barcode
 Equipping with the SIPLACE MultiStar head – a wide reading and gantry exchange add more flexibility to the
range of components can be handled line
 State-of-the art software – fast and easy to use SIPLACE  Low dpm rate with set-up verification and sophfisticated
station software sensors

Facts and Figures Facts and Figures

 Placement performance: up to 60,000 cph (benchmark)  Placement performance: up to 120,000 cph (benchmark)
 Placement heads  Placement heads
 SIPLACE SpeedStar  SIPLACE SpeedStar
 SIPLACE MultiStar  SIPLACE MultiStar
 SIPLACE TwinStar  SIPLACE TwinStar
 Component spectrum: 01005 – 200 mm x 110 mm  Component spectrum: 01005 – 200 mm x 125 mm

37 *Remark: All performance is package dependent

 PLACEMENT
SOLUTIONS

SIPLACE Di-Series SIPLACE CA

High-Tech Innovations at an Direct placement of dies
Attractive Price-performance Ratio along with the SMD components

Features
 An extremely powerful placement machine with
maximal four gantries
 The high-speed SIPLACE Di-Series combines proven
technology with high-tech innovations, thus guarantees
fast return on investment
 With the digital SIPLACE Vision System even 01005
components can be placed with the highest accuracy
 Flexible SIPLACE Software with advanced functions
Features
 With the groundbreaking SIPLACE solution, the parallel
placement of bare dies and SMD components in single
pass mode during the same process, was made possible
 The SIPLACE CA with integrated wafer feeder, can
place bare dies directly from wafers via the “die attach”
or “flip chip” processes. In addition, the SMT placement
process is supported and can be implement on demand
 Dual conveyor system allows simultaneously assembly
of two various products in asynchronous mode

Facts and Figures Facts and Figures

 Placement performance: up to 66,000 cph (benchmark)  Placement performance:
 Placement heads  Flip Chip: 9,000 per SWS
 SIPLACE 12-Nozzle Collect&Place  Die Attach: 6,000 per SWS
 SIPLACE 6-Nozzle Collect&Place  SMD: 20.250 per head
 SIPLACE Pick&Place  SIPLACE Wafer System
 Component spectrum: 01005 – 200 mm x 125 mm  Horizontal system
 Automatic wafer exchange
 Wafer size: 4” – 12”

*Remark: All performance is package dependent 38

China 中國
ASM Microelectronics Technical
Services (Shanghai) Co Ltd
2/F, No. 55 Zu Chong Zhi Road Lot 1505
Shanghai Zhangjiang Hi-Tech Park
Shanghai 201203, China
Tel : 86-21-5080 5465
Fax : 86-21-5080 5467
ASM Microelectronics Technical
Services (Shanghai) Co Ltd
Room 704~706, Da An Building B
No. 41 You Yi Road, He Xi District
Tianjin 300211, China
Tel : 86-22-5881 3008
Fax : 86-22-5881 3009
ASM Microelectronics Technical
Services (Shanghai) Co Ltd
Room D348, Chengdu Hi-Tech Zone
Innovation Service Centre
Chengdu 611731, China
Tel : 86-28-8784 6551
Fax : 86-28-8784 6562
ASM Microelectronics Technical
Services (Shanghai) Co Ltd
Room B, 31/F, Bi Li Da Building
No. 22 Lv Ling Road
Xiamen 361009, China
Tel : 86-592-550 9125
Fax : 86-592-550 9121

ASM Microelectronics Technical ASM Microelectronics Technical ASM Microelectronics Technical ASM Microelectronics Technical
Services (Shanghai) Co Ltd Services (Shanghai) Co Ltd Services (Shanghai) Co Ltd Services (Shanghai) Co Ltd
Room 05-03/06, Block A Room 7-11, 4th Floor, Block A East Wing, 4/F, Block 2 Room 1402-4
No. 5 Xing Han Street Tai'an Square, Dongshen Road CATIC (Zhonghang) Shahe Industrial Zone Jiangxin Guoji Jiayuan Yinzuo
Suzhou Industrial Park Zhang Mu Tou Town Qiao Xiang Road, Nanshan District No. 85 Jiefangxi Road, Qingyunpu District
Suzhou 215021, China Dongguan 523620, China Shenzhen 518053, China Nanchang 330002, China
Tel : 86-512-6762 6278 Tel : 86-769-8712 5600 Tel : 86-755-8830 8533 Tel : 86-791-8820 1517
Fax : 86-512-6762 6378 Fax : 86-769-8712 5601 Fax : 86-755-8344 6245 Fax : 86-791-8820 7178

Hong Kong 香港 Japan 日本 Korea 韓國

ASM Pacific (Hong Kong) Ltd ASM Assembly Technology Co Ltd
4/F Watson Centre, 16-22 Kung Yip Street 5F, Tachikawa F-Bldg, 1-7-18
Kwai Chung, Hong Kong Nishiki-Cho, Tachikawa-Shi
Tel : 852-2619 2000 Tokyo 190-0022, Japan
Fax : 852-2619 2118/9 Tel : 81-42-521 7751
Fax : 81-42-521 7750
ASM Pacific (Hong Kong) Limited
Korea Branch
4F, 628-6, Deungchon-dong
Kangseo-gu, Seoul 157-030, Korea
Tel : 82-2-2659 4174
Fax : 82-2-2659 4216
ASM Pacific (Hong Kong) Limited
Korea Branch
Room 501, 5/F, Hi-Tech Center
958-14 Daechon-Dong, Buk-Gu
Gwangju 500-470, Korea
Tel : 82-62-973 4174
Fax : 82-62-973 4216

Taiwan 台灣
ASM Pacific (Holding) Limited ASM Pacific (Holding) Limited ASM Pacific (Holding) Limited ASM Pacific (Holding) Limited
Taiwan Branch Taiwan Branch Taiwan Branch Taiwan Branch
No. 4-2, East 3 Road Street 10F, No. 530, Sec. 2, Chung Shan Road 1F, No. 7, Lane 91, Dongmei Road 8F-1, No. 135, Sec 2
N.E.P.Z. Kaohsiung, Taiwan Chung Ho Dist, New Taipei City, Taiwan Hsinchu, Taiwan Chung Shan Road, Tantzu
Tel : 886-7-367 6300 Tel : 886-2-2227 3388 Tel : 886-3-573 3750 Taichung, Taiwan
Fax : 886-7-367 6399 Fax : 886-2-2227 3399 Fax : 886-3-573 3551 Tel : 886-4-2535 6390
Fax : 886-4-2535 6820

Malaysia 馬來西亞
ASM Assembly Equipment Malaysia ASM Assembly Equipment Malaysia ASM Assembly Equipment Malaysia ASM Assembly Equipment Malaysia
Sdn Bhd Sdn Bhd Sdn Bhd Sdn Bhd
Bayan Point, Block A, No. 15-1-23, 15-1-24 24A, Jalan Medan Ipoh 1B B-1-12, Jalan SS6/20, Dataran Glomac 1, Tingkat Satu, Jalan Warisan 1
Medan Kampung Relau Medan Ipoh Bistarli Pusat Bandar Kelana Jaya Taman Warisan Jalan Junid
11900 Penang, Malaysia 31400 Ipoh Perak, Malaysia 47301 Petaling Jaya, Malaysia 84000, Muar, Johor, Malaysia
Tel : 604-644 9490 Tel : 605-542 3991 Tel : 603-7806 4942 Tel : 606-951 5713
Fax : 604-645 1294 Fax : 605-542 3992 Fax : 603-7806 4943 Fax : 606-951 5786

Philippines 菲律賓 Singapore 新加坡 Thailand 泰國 Germany 德國

Edgeward Development Limited ASM Technology Singapore Pte Ltd ASM Assembly Equipment Bangkok ASM Assembly Systems GMBH & Co. KG
Philippines Branch 2 Yishun Avenue 7 Ltd ASMPT Europe
7th Floor, NOL Tower, Commerce Avenue Singapore 768924 51/3, Vibhavadi Tower, 18/2 Floor Rupert-Mayer-Street 44
Madrigal Business Park Tel : 65-6752 6311 Ngamwongwan Road, Ladyao, 81379 Munich
Barangay Ayala Alabang Fax : 65-6758 2287 Chathuchak, Bangkok 10900 Germany
Muntinlupa City, Philippines 1770 Thailand Tel : 49-89-20800-20900
Tel : 63-2-850 4543 Tel : 66-2-941 3181/2 Fax : 49-89-20800-41868
Fax : 63-2-850 4547 Fax : 66-2-941 3183 Email : sales.eu@asmpt.com

U.S.A. 美國
ASM Pacific Assembly Products Inc. ASM Pacific Assembly Products Inc.
3440 East University Drive, Phoenix (Western Regional Office)
Arizona 85034-7200 97 East Brokaw Road, Suite 100
U.S.A. San Jose, California 95112-4209
Tel : 1-602-437 4760 U.S.A.
Fax : 1-602-437 4630 Tel : 1-408-451 0800
Fax : 1-408-451 0808

http://www.asmpacific.com
NB3