Engineering Manual

Global Distributor of Henkel LOCTITE

(800) 888-0698 info@ellsworth.com

LOCTITE GC 10 Solder Paste

Suitable for use with: Standard SAC Alloys

GC 10 – The Game Changer

Contents
1.  Performance Summary
2.  Introduction: Properties, Features & Benefits
3.  Operating Parameters
•  Printing: Process Window
•  Printing: Continuous and Abandon Time Testing
•  Slump Testing
•  Tack-Life Force
•  Reflow Process Window
•  Reflow Performance Testing
•  Voiding Data
4.  Reliability and Specification Testing
5.  Operating Parameters: Storage
•  Printing & Reflow Performance
6.  Product Summary

2 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Contents
1.  Performance Summary
2.  Introduction: Properties, Features & Benefits
3.  Operating Parameters
•  Printing: Process Window
•  Printing: Continuous and Abandon Time Testing
•  Slump Testing
•  Tack-Life Force
•  Reflow Process Window
•  Reflow Performance Testing
•  Voiding Data
4.  Reliability and Specification Testing
5.  Operating Parameters: Storage
•  Printing & Reflow Performance
6.  Product Summary

3 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

GC 10: Performance Summary

Flux
•  Halogen-free flux: passes IC with pretreatment IPC-TM-650
2.3.34/EN14582
•  Halogen-free flux classification: ANSI/J-STD-004 Rev. B for
a type ROL0 classification

Paste
•  Suitable for fine pitch, high speed printing up to 125mm/s (5”/s)
•  Optimized for long hot soak reflow profiles
•  Excellent fine pitch coalescence in air & nitrogen atmosphere
•  Excellent humidity resistance
•  Excellent solderability on challenging surface finishes,
including CuNiZn
•  Colorless residues for easy post-reflow inspection
•  Long 12month shelf-life when stored below 26.5°C

4 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Contents
1.  Performance Summary
2.  Introduction: Properties, Features & Benefits
3.  Operating Parameters
•  Printing: Process Window
•  Printing: Continuous and Abandon Time Testing
•  Slump Testing
•  Tack-Life Force
•  Reflow Process Window
•  Reflow Performance Testing
•  Voiding Data
4.  Reliability and Specification Testing
5.  Operating Parameters: Storage
•  Printing & Reflow Performance
6.  Product Summary

5 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Introduction
Basic Solder Paste Properties

Flux Description GC 10
Alloy SAC305
Henkel Powder Size Type 4
Powder Size range, µm 38-20
Metal Content, % 88.5
Malcom Viscosity, 10rpm Pa.s 190
TI 0.50
IPC slump @182°C (0.33mm x 2.03mm) 0.20
first space no bridge
IPC Solder Balling preferred

6 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Introduction
GC 10 Features & Benefits

Product Attribute Process Benefit

Halogen Free •  No added halogen
•  Measured <900ppm chlorine and bromine and <1,500ppm total by
oxygen (O2) bomb test
Halide Free •  Flux classification ROL0 in accordance to J-STD-004B
Application •  Designed for printing and pin-in-paste
•  Excellent wetting to a broad range of metallisations, even through
long hot soak profiles in an air atmosphere
•  Compatible with existing halogen free solutions
•  Suitable for medium to large board assemblies
•  Designed for long 12 month shelf-life stability without impact to
printing or reflow

7 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Introduction
GC 10 Features & Benefits

Product Attribute Process Benefit

Technology Printing •  Wide process window for printing and minimal slump
Advantages •  Fine pitch abandon time of up to 2 hours; work life > 16 hours
•  Fine pitch capability and reduction in solder bridging
•  Suited for high throughput production, where yield consistency on print
deposits is key
•  Improved paste transfer efficiency
•  Allows on line paste utilisation protocols to be re-written
Technology Reflow •  Optimised for long hot soak reflow processes
Advantages •  Very shiny Pb-free solder joints over wide range of reflow
•  Excellent fine pitch coalescence
•  Excellent humidity resistance
•  Excellent solderability on challenging surface finishes (ENIG, Copper OSP,
CuNiZn and Imm Ag)
Low Voiding •  Low void levels increases solder joint reliability
•  New chemistries allow pursuit of class 3 void levels in accordance to IPC7095B
on industry surface finishes: ENIG, Copper OSP, CuNiZn and Imm Ag
•  Low voiding in CSP
Residues •  Clear, transparent and colourless
•  Pin testable after 5x reflows

8 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Contents
1.  Performance Summary
2.  Introduction: Properties, Features & Benefits
3.  Operating Parameters
•  Printing: Process Window
•  Printing: Continuous and Abandon Time Testing
•  Slump Testing
•  Tack-Life Force
•  Reflow Process Window
•  Reflow Performance Testing
•  Voiding Data
4.  Reliability and Specification Testing
5.  Operating Parameters: Storage
•  Printing & Reflow Performance
6.  Product Summary

9 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Operating Parameters
Print Process Window
(LOCTITE GC 10 SAC305 T4 885V)
•  Excellent printing in the Contour Plot of 0.8mmBGA Cpk Contour Plot of 0.4mmCSP56 (300um aperture) Cpk
range 25 – 125mm/s 0.8mmBGA 0.4mmCSP56
Cpk Cpk
< 1.33 < 1.33
1.33 – 1.67 1.33 – 1.67
0.04 1.67 – 2.00 0.04 1.67 – 2.00
> 2.00 > 2.00

Pressure kg/mm

Pressure kg/mm
0.03 0.03

0.02 0.02

40 60 80 100 120 40 60 80 100 120

Speed mm/s Speed mm/s

Contour Plot of 0.5mmBGA (266um aperture) Cpk Contour Plot of 0201 Cpk
0.5mmBGA 0201 Cpk
Cpk < 1.33
< 1.33 1.33 – 1.67
1.33 – 1.67 1.67 – 2.00
0.04 1.67 – 2.00 0.04 > 2.00
> 2.00
Pressure kg/mm

Pressure kg/mm
0.03 0.03

0.02 0.02

40 60 80 100 120 40 60 80 100 120

Speed mm/s Speed mm/s

0.8mm, 0.5mm & 0.4mm round apertures, 0201 (100µm stencil)

10 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Operating Parameters
Print Process Window
(LOCTITE GC 10 SAC305 T4 885V)
•  Excellent printing in the Contour Plot of 0.22mm diam Cpk Contour Plot of 0.20mm diam Cpk
range 25 – 125mm/s, 0.22mm 0.20mm
diam Cpk diam Cpk
0.18-0.22mm round < 1.33
1.33 – 1.67
< 1.33
1.33 – 1.67

apertures 0.04 1.67 – 2.00

> 2.00
0.04 1.67 – 2.00
> 2.00

Pressure kg/mm

Pressure kg/mm
0.03 0.03

0.02 0.02

40 60 80 100 120 40 60 80 100 120

Speed mm/s Speed mm/s

Contour Plot of 0.18mm diam Cpk Contour Plot of 0.15mm diam Cpk
0.18mm 0.15mm
diam Cpk diam Cpk
< 1.33 < 1.33
1.33 – 1.67 1.33 – 1.67
0.04 1.67 – 2.00 0.04 1.67 – 2.00
> 2.00 > 2.00
Pressure kg/mm

Pressure kg/mm
0.03 0.03

0.02 0.02

40 60 80 100 120 40 60 80 100 120

Speed mm/s Speed mm/s

0.22mm – 0.15mm round apertures, (100µm stencil)

11 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Operating Parameters – Separation Speed
Print Process Window
(LOCTITE GC 10 SAC305 T4 885V)
•  Excellent printing in the
range down to 0.18mm Separation Speed, Cpk
round apertures. Loctite GC10 T4
•  Fast separation speed is
preferable. 5 Variable
Fast
Medium
4 Slow

3
Cpk
2
1.67 ref
1.33 ref
1

A ) ) m m m m
G ap ap dia di a dia di a
8B
0. mm mm m m m m
30 66 2m 0m 8m 5m
( 0. .2 0.2 0. 2 0.1 0.1
56 (0
A
SP G
mC 5B
0.
4m
0.

Component_Cpk
0.8mm BGA – 0.15mm round apertures, (100µm stencil) 100µm stencil thickness,
60mm/s

12 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Operating Parameters
Continuous Print and Abandon Stability Assessment

Henkel Board 0.8mm BGA to 0.15mm diameter circles Process flow for Henkel print test as shown below

Paste Paste Dry under Print 15 PCBs,

added to stencil kneaded stencil wipe dry wipe every 5

Print 5 PCBs 2hr pause Print 5 PCBs 1hr pause

Blank stencil
Volumes Print 15 PCBs, Volumes
1000 or 2000
Measured dry wipe every 5 Measured
cycles

•  Printing •  250mm, 60° squeegee

•  DEK Europa •  60mm/s squeegee speed
•  Stainless steel, laser cut •  20mm/s separation speed
•  100µm thickness •  Conditions Typical, 22C, 40% RH
•  Vacuum tooling •  Koh Young KY-8020T volume measurement

13 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Operating Parameters
Printing

•  GC 10 solder pastes show exceptional print quality

•  On 0.18mm diameter fine pitch devices only one knead stroke is required after 2hour machine down times
•  On coarser pitch deposits it is expected that the first print after abandon can in normal circumstances be
perfectly acceptable for production quality

0402 0201 01005

0.4mm TQFP120 0.5mm CSP56 0.4mm BGA432

14 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Operating Parameters
– Abandon Stability 22°C/40%RH
Print Process Window (LOCTITE GC 10 SAC305 T4 885V)
•  Excellent printing in the
range down to 0.18mm Abandon Time 1hr, 2hr, 2hr +1 knead
round apertures GC10 T4
•  Single knead cycle required
5 Variable
after 2hr abandon at
initial
0.18mm round apertures 1hr
4 2hr
2hr + 1 knead
Cpk 3

2
1.67 ref
1.33 ref
1

0
A ) )
BG ap ap am am am a m
8 di di di di
0. m
m
m
m m m m m
30 66 m m m m
(0
. . 2 22 20 18 15
6 (0 0. 0. 0. 0.
P5 A
CS 5BG
m 0.
4m
0.

0.8mm BGA – 0.15mm round apertures, (100µm stencil)

100µm stencil thickness, 60mm/s, Fast separation, 250mm squeegee, 8kg

15 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Operating Parameters
– Abandon Stability 30°C/50%RH
Print Process Window (LOCTITE GC 10 SAC305 T4 885V)
•  Excellent abandon time
resistance Abandon Time 1hr, 2hr, 2hr + 1 knead
•  No knead cycle required GC10 T4 30C/50%RH
after 2hrs abandon down to
5
0.20mm round apertures. Variable
•  Single knead stroke
4
initial
1hr
required after 2hr abandon 2hr
at 0.18mm round apertures 2hr + 1 knead
Cpk 3

2
1.67 ref
1.33 ref
1

0
A ) )
BG ap ap am am am am
8 di di di di
0. m
m
m
m m m m m
. 30 266 2m 0m 8m 5m
(0 . 2 2 1 1
6 (0 0. 0. 0. 0.
P5 A
G
CS 5B
m 0.
4m
0.

0.8mm BGA – 0.15mm round apertures, (100µm stencil)

100µm stencil thickness,60mm/s, Fast separation, 250mm squeegee, 8kg

16 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Operating Parameters
– Continuous Print Stability
Print Process Window (LOCTITE GC 10 SAC305 T4 885V)
•  No impact on print
performance after 4 hours Continuous Print Stability 1000 cycles, 2000 cycles
(1000 cycles) and 8 hours GC10 T4
(2000 cycles) printing
5 Variable
initial
1000 cycles
4
2000 cycles

Cpk 3

2
1.67 ref
1.33 ref
1

0
A ) )
BG ap ap am am am am
8 di di di di
0. m
m
m
m
m m m m
. 30 266 22
m
20m 18
m
15
m
(0 (0
. 0. 0. 0. 0.
6
S P5 BG
A
C 5
m 0.
4m
0.

0.8mm BGA – 0.15mm round apertures, (100µm stencil)

100µm stencil thickness, 60mm/s, Fast separation, 250mm squeegee, 8kg

17 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Operating Parameters
Paste Properties After Continuous Printing

Viscosity after Continuous Print TI Change After Continuous Print

300 1.0
Conditions Conditions
22°C, 30%RH 22°C, 30%RH
30°C, 40-50%RH 30°C, 40-50%RH
250
0.8

200
10rpm (Pa.s)

0.6

150

TI
0.4
100

0.2
50

0 0.0
0 1000 2000 0 1000 2000
Cycles Cycles

IPC Slump @ 182C After Continuous Printing IPC Slump @ 182C After Continuous Printing
0.33mm x 2.03mm, 200um stencil thickness 0.63mm x 2.03mm, 200um stencil thickness
0.4 Conditions
Conditions 0.38
22°C, 30%RH
22°C, 30%RH
30°C, 40-50%RH
Minimum Gap not Bridged (mm)

30°C, 40-50%RH
Minimum Gap not Bridged (mm)

0.36
0.3

0.34

0.2
0.32

0.1 0.30

0.28
0.0
0 1000 2000 0 1000 2000
Cycles Cycles

18 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Operating Parameters
Slump
•  Slump evaluation was performed in accordance with J-STD-005A, IPC-TM-650 2.4.35
•  First spacing with no bridge recorded after 10 minutes at 182°C (35°C below melting point 217°C)

Stencil A 21 A 20
Design/ 200µm 100µm
thickness

Aperture 0.63 x 0.33 x 0.33 x 0.20 x

2.03mm 2.03mm 2.03mm 2.03mm

Pass
0.63mm 0.30mm 0.30mm 0.25mm
mark

GC 10
0.33mm 0.10mm 0.08mm 0.075mm
25°C

GC 10
0.33mm 0.20mm 0.15mm 0.125mm
182°C

A21 A20
200µm 100µm

19 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Operating Parameters
Tack Force
•  Slump Tackiness evaluation was performed in accordance with
J-STD-005A, IPC-TM-650 2.4.44
•  GC 10 tack-life >48hours

Malcom TK1 Tackiness Tester

Preload 300g

Preload time 5 secs

Retraction Speed 2.5mm/sec

Deposit diameter 5.1mm

Deposit height 0.25mm

20 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Operating Parameters
Solder Balling
•  Solder balling performance as been assessed in accordance with
an extended version of IPC-TM-650 2.4.4.3
•  Clear and colourless residues observed post-reflow

Initial 24hrs 25°C 50% RH

Preferred Pass Preferred Pass

21 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Operating Parameters
Reflow Process Window (Air)
•  LOCTITE GC 10 solder paste offers halogen containing reflow performance in a
truly halogen free formulation
•  GC 10 shows excellent coalescence onto a range of PCB and component finishes
especially during long-hot profiles
•  There is no single profile that works for all applications and each process should be
assessed individually, under laboratory conditions the following profiles have been
found to give good results
•  These process window guidelines are suitable for Type 4 SAC powder

Reflow Profiles Profile 1 2 3 4

300
Profile 1

250
Profile
Profile
2
3 Peak Temp (°C) 244 254 260 255
Profile 4
217°C
Time to Peak (min) 3.3 4.5 5.1 6.0
Temperature (°C)

200

150 (No
Soak Time (150-200°C) (min) Soak) 2.35 2.80 3.44
100
1.0
50
Time above Liquidus (min) 0.62 1.46 1.75 1.45
0
0 1 2 3 4
Time (minutes)
5 6 7 Time above Liquidus (sec) 37.2 87.6 105.0 87.0

22 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

 Operating Parameters (Reflow)

Reflow Profiles

Reflow Profile
300
Profile 1
Profile 2
250 Profile 3
Profile 4
217°C

Temperature (°C)
200

1 2 3 4
150

100

50
0.5mm CSP56

0
0 1 2 3 4 5 6 7
Time (minutes)
0201
0402

23 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

 Operating Parameters (Reflow)

Reflow Profiles

Reflow Profile
300
Profile 1
Profile 2
250 Profile 3
Profile 4
217°C

Temperature (°C)
200

1 2 3 4
150

100

50

0
0 1 2 3 4 5 6 7
Time (minutes)
Overprinted
0.4mm TQFP120
0.4mm TQFP120

24 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

 Operating Parameters (Reflow)

Reflow Profiles

Reflow Profile
300
Profile 1
Profile 2
250 Profile 3
Profile 4
217°C

Temperature (°C)
200

1 2 3 4
150

100

50

0
0 1 2 3 4 5 6 7
0.5mm CSP56

Time (minutes)
0.4mm TQFP120
0.4mm TQFP120

25 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

 Operating Parameters (Reflow)

Reflow Profiles

Reflow Profile
300
Profile 1
Profile 2
250 Profile 3
Profile 4
217°C

Temperature (°C)
200

1 2 3 4
150

100

50
01005 Capacitors

0
0 1 2 3 4 5 6 7
Time (minutes)
01005 Resistors

26 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

 Operating Parameters (Reflow)
Paste Properties After Continuous Printing
Profile 2

1,000 cycles 2,000 cycles 1,000 cycles 300

250

22°C, 30%RH 22°C, 30%RH 30°C, 40-50%RH 217°C

Temperature (°C)
200

150

100

50

0
0.5mm CSP

0 1 2 3 4 5 6
Time (min)
6.5mm Overprint

•  No change to reflow performance after 8hours

printing (2000 print cycles)

27 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

 Operating Parameters (Reflow – GC10)

Reflow Profiles

Reflow Profile
Profile 1
250 Profile 2

217°C
200

Temperature (°C)
1 2
150

100

50
01005 Resistors

0 1 2 3 4 5 6
Time (minutes)
01005 Resistors
0.5mm CSP & 0.4mm QFP

28 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Operating Parameters
Voiding
•  Void performance assessed using 4 different reflow profiles
•  GC 10 shows low levels of voiding over a range of profiles
Reflow Profiles
300
Profile 1
Profile 2
250 Profile 3

•  Void Percentage analysed in accordance with IPC7095B

Profile 4
217°C

Temperature (°C)
200

150

100

50

0
0 1 2 3 4 5 6 7
Time (minutes)

Boxplot of IPC Voiding Percentage Boxplot of Void Size

0.50
20 Class 1

15 Class 2 0.45

Average Diameter (mm)

IPC Voiding %

10 Class 3 0.40

5 0.35

0 0.30
Profile 1 Profile 2 Profile 3 Profile 4 Profile 1 Profile 2 Profile 3 Profile 4

GC 10 meets IPC7095B class 3

29 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Operating Parameters
Pin Testing
Reflow Profiles
300

Before After
Profile 1
Profile 2
250 Profile 3
Profile 4
217°C

Test Test

Temperature (°C)
200

150

100

50

0
0 1 2 3 4 5 6 7
Time (minutes)

Board
Stencil 100µm

Pads 500 pads per board, 2 boards tested

Probe 0.9mm 4 point plain crown light spring probe 100g spring force

Profiles 4 reflow profiles

No. of reflow 1, 2, 3 & 4 passes through oven

Atmosphere Air & 1000ppm O2

Time after reflow 1 day, 1 week

30 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

 Operating Parameters
Pin Testing
Reflow Profiles

Reflow Profile (% after 1000 tests)

300
Profile 1
Profile 2
250 Profile 3
Profile 4
217°C

Temperature (°C)
200

1 2 3 4
150

100

50

100% 100% 100% 99.5% 0

0 1 2 3 4 5 6 7
1 reflow

Time (minutes)

100% 100% 99.6% 99.9%

2 reflows

99.9% 100% 100% 98.9%

3 reflows

99.9% 100% 100% 98.5%

4 reflows

31 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

 Operating Parameters
Pin Testing
Reflow Profiles

Reflow Profile (% after 1000 tests)

300
Profile 1
Profile 2
250 Profile 3
Profile 4
217°C

Temperature (°C)
200

1 2 3 4
150

100

50

100% 100% 100% 100% 0

Reflowed in N2

0 1 2 3 4 5 6 7
Time (minutes)

100% 99.9% 99.8% 99.6%

1 day after reflow

100% 99.8% 99.3% 99.6%

1 week after reflow

32 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

 Operating Parameters
Surface Finish
Reflow Profiles

Reflow Profile (0.5mm CSP56)

300
Profile 1
Profile 2
250 Profile 3
Profile 4
217°C

Temperature (°C)
200

1 2 3 4
150

100

50

0
0 1 2 3 4 5 6 7
Time (minutes)
OSP Finish
Silver Finish
Tin Finish

33 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

 Operating Parameters
Surface Finish
Reflow Profiles

Reflow Profile (0201)

300
Profile 1
Profile 2
250 Profile 3
Profile 4
217°C

Temperature (°C)
200

1 2 3 4
150

100

50

0
0 1 2 3 4 5 6 7
Time (minutes)
OSP Finish
Silver Finish
Tin Finish

34 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

 Operating Parameters
Surface Finish
Reflow Profiles

Reflow Profile (0402)

300
Profile 1
Profile 2
250 Profile 3
Profile 4
217°C

Temperature (°C)
200

1 2 3 4
150

100

50

0
0 1 2 3 4 5 6 7
Time (minutes)
OSP Finish
Silver Finish
Tin Finish

35 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

 Operating Parameters
Surface Finish
Reflow Profiles

Reflow Profile (6.5mm overprint)

300
Profile 1
Profile 2
250 Profile 3
Profile 4
217°C

Temperature (°C)
200

1 2 3 4
150

100

50

0
0 1 2 3 4 5 6 7
Time (minutes)
OSP Finish
Silver Finish
Tin Finish

36 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Operating Parameters
Voiding Different Surface Finishes 0.5mm CSP56
•  Void performance on OSP Cu and Immersion Sn surface finishes assessed using 4 Reflow Profiles

different reflow profiles

300
Profile 1
Profile 2
250 Profile 3
Profile 4
217°C

Temperature (°C)
200

150

100

50

0
0 1 2 3 4 5 6 7
Time (minutes)

Boxplot of IPC Voiding Percentage Boxplot of Void Size

0.50
20 Class 1

0.45

Average Diameter (mm)

15 Class 2
IPC Voiding %

10 Class 3 0.40

5
0.35

0
0.30
Profile Profile 1 Profile 2 Profile 3 Profile 4 Profile 1 Profile 2 Profile 3 Profile 4 Profile Profile 1 Profile 2 Profile 3 Profile 4 Profile 1 Profile 2 Profile 3 Profile 4
Finish Imm Sn OSP Cu Finish Imm Sn OSP Cu

GC 10 meets IPC7095B class 3

37 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Contents
1.  Performance Summary
2.  Introduction: Properties, Features & Benefits
3.  Operating Parameters
•  Printing: Process Window
•  Printing: Continuous and Abandon Time Testing
•  Slump Testing
•  Tack-Life Force
•  Reflow Process Window
•  Reflow Performance Testing
•  Voiding Data
4.  Reliability and Specification Testing
5.  Operating Parameters: Storage
•  Printing & Reflow Performance
6.  Product Summary

38 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Reliability and Specification Testing
Head- in Pillow Test
•  Print solder paste on a Cu plate, 0402 pad, stencil thickness 125µm. Head In Pillow

•  When the solder paste starts to melt, place a solder sphere (SAC305, 18
Time to First Defect

0.76mm diameter) on the printed solder paste 16

14

Average Time (s)

•  Place another sphere after 3sec, 6 sec, 9sec… until the solder sphere 12
10

no-longer coalesces 8
6
4
2
0
al °C A B C D E F G
iti 40 st
e te st
e
st
e st
e
st
e
st
e
In s
10 th pa pa pa pa pa pa pa
GC 1m ce ce ce ce ce ce ce
10 en en en en en en en
er er fe
r
fe
r er er fe
r
GC re
f
re
f
re re re
f
re
f
re
Paste

Place a solder
sphere onto
printed paste

250+/-5˚C
…..
…..
250+/-5˚C
Copper plate Initial 10sec 20sec First
Solder paste 1st sphere 2nd sphere 3rd sphere Defect
Solder sphere

39 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Reliability and Specification Testing
Head- in Pillow Test

Standard Test Result

Pass
Cu Corrosion

GC 10 Control
ANSI/ Pass
Cu Mirror
J-STD-004B

Halogen Pass (no added halogen)

6.0x1011 Ohms after 7days

Surface Insulation Resistance Pass

Electromigration Pass 5.0x1010 Ohms after 21days

GC 10 J-STD-004B classification ROL0

40 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Reliability and Specification Testing
3rd Party Testing
•  SGS report for GC 10
•  Sample reflowed flux residue
•  Reference EN14582/IC Analysis
•  To meet halogen free requirements
•  Br<900ppm, Cl <900ppm, and combined <1500ppm

•  Halogen – Fluorine - ND
•  Halogen – Chorine - ND
•  Halogen – Bromine – ND
•  Halogen – Iodine – ND

GC 10 has no detectable halogen and is designated as halogen free

41 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Reliability and Specification Testing
IPC J-STD 004B
Reflow Profiles
Profile 1
250 Profile 2

217°C
200

Temperature (°C)
150

100

50

0 1 2 3 4 5 6
Time (minutes)

42 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Contents
1.  Performance Summary
2.  Introduction: Properties, Features & Benefits
3.  Operating Parameters
•  Printing: Process Window
•  Printing: Continuous and Abandon Time Testing
•  Slump Testing
•  Tack-Life Force
•  Reflow Process Window
•  Reflow Performance Testing
•  Voiding Data
4.  Reliability and Specification Testing
5.  Operating Parameters: Storage
•  Printing & Reflow Performance
6.  Product Summary

43 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Operating Parameters: Storage
Printing After Storage 1month 40°C

•  Excellent print capability

after storage for 1 month @ Continuous Print & Abandon Time After Storage
40°C GC10 T4 1 month 40C
•  No knead cycle required
after 2hrs abandon down to Variable
5 initial
0.20mm round apertures 1000 cy cles
1hr abandon
4 2hr abandon

3
Cpk

2
1.67 ref
1.33 ref
1

0
Abandon Time Continuous
Test

0.4mm BGA ,100µm stencil thickness, 60mm/s, Fast separation,

250mm squeegee, 8kg

44 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Operating Parameters: Storage
Printing After Storage 6months 25°C

•  Excellent print capability

after storage for 6 months Continuous Print & Abandon Time After Storage
@ 25°C GC10 T4 6 month 25C
•  No knead cycle required
after 2hrs abandon down to Variable
5 initial
0.20mm round apertures 1000 cycles
1hr abandon
4 2hr abandon

3
Cpk

2
1.67 ref
1.33 ref
1

0
Abandon Time Continuous
Test

0.4mm BGA ,100µm stencil thickness, 60mm/s, Fast separation,

250mm squeegee, 8kg

45 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Operating Parameters: Storage
Printing After Storage 12months 25°C

•  Excellent print capability

after storage for 12 months Continuous Print & Abandon Time After Storage
@ 25°C GC10 T4 12 month 25C
•  No knead cycle required
after 2hrs abandon down to Variable
5 initial
0.20mm round apertures 1000 cycles
1hr abandon
4 2hr abandon

3
Cpk

2
1.67 ref
1.33 ref
1

0
Abandon Time Continuous
Test

0.4mm BGA ,100µm stencil thickness, 60mm/s, Fast separation,

250mm squeegee, 8kg

46 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

 Operating Parameters: Storage

Profile 2

After Paste storage 300

250

217°C

Temperature (°C)
200

Initial 1m 40°C 6m 25°C

150

100

50

0
0 1 2 3 4 5 6
0.5mm CSP

Time (min)
0201
0402

47 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

 Operating Parameters: Storage
After storage and 2nd side/pre-reflow
Profile 3

0.5mmCSP 0201
300

250

217°C

Temperature (°C)
200

Initial 1 Month 40°C Initial 1 Month 40°C

150

100

50

0
0 1 2 3 4 5 6
Time (min)
Fresh PCB
Pre-reflowed PCB

48 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

Contents
1.  Performance Summary
2.  Introduction: Properties, Features & Benefits
3.  Operating Parameters
•  Printing: Process Window
•  Printing: Continuous and Abandon Time Testing
•  Slump Testing
•  Tack-Life Force
•  Reflow Process Window
•  Reflow Performance Testing
•  Voiding Data
4.  Reliability and Specification Testing
5.  Operating Parameters: Storage
•  Printing & Reflow Performance
6.  Product Summary

49 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

GC 10: Performance Summary

Flux
•  Halogen-free flux: passes IC with pretreatment IPC-TM-650
2.3.34/EN14582
•  Halogen-free flux classification: ANSI/J-STD-004 Rev. B for
a type ROL0 classification

Paste
•  Suitable for fine pitch, high speed printing up to 125mm/s (5”/s)
•  Optimized for long hot soak reflow profiles
•  Excellent fine pitch coalescence in air & nitrogen atmosphere
•  Excellent humidity resistance
•  Excellent solderability on challenging surface finishes,
including CuNiZn
•  Colorless residues for easy post-reflow inspection
•  Long 12month shelf-life when stored below 26.5°C

50 Februar 23, 2015 Engineering Manual GC 10 Solder Paste

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(800) 888-0698 info@ellsworth.com