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.066 ±.003
1.68 ±0.08
.075 ±.008 2 PLACES
F 1.90 ±0.20 F
.065 ±.008
1.65 ±0.20 2 PLACES
E .035 REF E
0.89
.230 REF 2 PLACES
5.84
.355 REF
6 PLACES
9.02
.028 REF
0.71 ⌀ .038 REF
D 2 PLACES D
0.97
2 PLACES
.440
.103 REF GOLD (1µ-in MIN) OVER GOLD (5µ-in MIN) OVER
11.18 73251-1153 TRAY (80 PIECES)
2.62 NICKEL (50µ-in MIN) NICKEL (50µ-in MIN)
REF .270
C 6.86 GOLD (10µ-in MIN) OVER GOLD (10µ-in MIN) OVER C
73251-1152 TRAY (20 PIECES)
REF .090 NICKEL (50µ-in MIN) NICKEL (100µ-in MIN)
.250 2.29
GOLD (10µ-in MIN) OVER GOLD (10µ-in MIN) OVER
6.35 REF 73251-1151 ONE 73251-1150 PER BAG
.385 NICKEL (50µ-in MIN) NICKEL (100µ-in MIN)
9.78 REF
.170 REF GOLD (10µ-in MIN) OVER GOLD (10µ-in MIN) OVER
REF 73251-1150 TRAY (80 PIECES)
4.32 NICKEL (50µ-in MIN) NICKEL (100µ-in MIN)
BODY CONTACT DESCRIPTION
B PART NO. B
PLATING PACKAGING
SYMBOLS THIS DRAWING CONTAINS INFORMATION THAT IS PROPRIETARY TO MOLEX ELECTRONIC TECHNOLOGIES, LLC AND SHOULD NOT BE USED WITHOUT WRITTEN PERMISSION
DIMENSION UNITS SCALE CURRENT REV DESC: SEE ECM
⌀ .018 REF = 0
INCH NTS
.018 REF 0.46 = 0 GENERAL TOLERANCES
0.46 PLATED THRU (UNLESS SPECIFIED)
= 0 MM INCH
2 PLACES 2 PLACES EC NO: 172847 SMA JACK, EDGE MOUNT
4 PLACES ± ±
= 0 DRWN: LMEIER 2018/02/23 50 OHMS, EWR-11795 SMA-J/PCB
3 PLACES ± ± 0.005
PCB PAD (FOR REFERENCE ONLY) = 0 CHK'D: SSSHAH 2018/03/01
2 PLACES ± 0.13 ± 0.01
APPR: AROBERTSON 2018/03/01
A PS-89675-3460 PRODUCT SPECIFICATION = 0 1 PLACE ± 0.25 ± INITIAL REVISION:
PRODUCT CUSTOMER DRAWING A
BOARD THICKNESS: .062 [1.57] DOCUMENT NUMBER DOC TYPE DOC PART REVISION
MIL-STD-348B, FIG. 310-2 INTERFACE BOARD MATERIAL: FR4 WITH 1.0 OZ (28 g) COPPER = 0 0 PLACES ± ± DRWN: TEF 2002/06/27
12
REVISION: C
DATE: 2018/01/18 11 10 9 8 7 6 5 4 3 2 1