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An Undergrad Course of Southeast University

Fundamentals and Applications


of MEMS
(English, Wuxi Campus)
Course ID: B3060221
Instructor: Prof. Liyi Li (李力一)

School of Electronic Science and Engineering,


Southeast University
An Undergrad Course of Southeast University

Lecture 1
Introduction to MEMS
Course ID: B3060221
Instructor: Prof. Liyi Li (李力一)

School of Electronic Science and Engineering,


Southeast University
Contact Information
Lecture time: Every Friday, 08:00 AM-09:35 PM (5 min break at 08:45 PM)
Classroom: 博雅A Building, Room 405
Email: liyi_li@seu.edu.cn
Phone: 18052023621
Office Hours: 三江A Building , Room 406 (by appointment only)
-Notification will be sent through Wechat group.
-Couse materials will be shared through SEU cloud share.

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Policy
Scores:
1. Total=100 points(pts);
2. Final Exam = 40 pts. Both are closed-book tests. 1 hour each. Examples of questions will be shown in the class.
3. Presentation: 50 pts. 10 slides for 10 minutes in English.
4. Attendance: 10 pts total. You will lose 1 pt for absence of each class.
Prohibition:
1. All course-related materials, including textbooks, lecture notes, exam questions and answers, are not allowed
to be shared outside of this class.
2. Presentation should be prepared by yourself. No plagiarism is allowed.
Violation will lead to the fail of this course.

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Policy
Presentation:
1. Topics:
(1) XXX Process for MEMS Fabrication;
(2) Applications of MEMS in XXX area.
The title must be in either format. You are free to choose either one. Examples will be given at mid-term.
2. Please review at least 5 research papers published after 2016. Recommended source: Nature Nanotech., Adv.
Mater., JMEMS, Sensors & Actuators, J. Micromech. Microeng.
3. Using Endnote to add reference is recommended. Download here;
4. Total 50 pts. Judging criterion: format, 10 pts; language, 10 pts; content, 30 pts;
5. PPT slides and oral presentation are all in English.
6. Presentation will be held in class at the end of the term.

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Policy
Presentation:
1. Contents are based on your term paper.

Expectation:
Through writing the term paper and preparing for the presentation, you learn the key skills for your future career-
no matter working in industry or conducting research in college.

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Reading Materials
Textbook (Required):
T1: Principles of Microelectromechanical Systems, Ki Bang Lee: Click here to read the book (you may need to find
it through SEU Library website->Wiley);
T2: MEMS: A Practical Guide to Design, Analysis, and Applications, J. G. Korvink and Oliver Paul: Click here to read
the book;
T3: Fundamentals of Microfabrication and Nanotechnology, Vol. II, Marc J. Madou: Click here to read the book.

Mathematics References (Optional):


M1: Schaum‘s Outline of College Mathematics, Frank Ayres Jr., Philip Schmidt: Click here to read the book
M2: Basic College Mathematics, Richard N. Aufmann: Click here to read the book
M3: Basic Engineering Mathematics, John Bird: Click here to read the book
M4: Fundamental Engineering Mathematics, Neil Challis and Harry Gretton: Click here to read the book

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Course Overview

What are MEMS?


Under microscope

• Small “chips”
• Complicated
• Designed and Made by Ref.:
human beings (1) https://www.raconteur.net/microchip-implants-like-chip-vein-brain/
(2) https://www.ifixit.com/Teardown/iPhone+4+Gyroscope+Teardown/3156

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Course Overview

MEMS: Micro(微米)-Electro-Mechanical System (微机电系统)

How are they made? Microfabrication

Multi-Physical Domains:
• Mechanical
• Electrical
How does it work?
• Optical
MEMS • Magnetic
=Microsystem (Europe)
=Micromachine (Japan)
• Biological

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Schedules
Lecture# Content Reading Assignment
L01 Introduction to MEMS T1, Ch1
L02 Microfabrication: Substrates, Lithography, Deep Etch T2, Ch2; T3, Ch1-2
L03 Microfabrication: Film Deposition and Etch T3, Ch3-4, Ch7
L04 Statics T1, Ch3
L05 Statics of Microstructures T1, Ch4
L06 Dynamics T1, Ch5
L07 Electromagnetics T1, Ch7
L08 Electro-Mechanical Actuators T1, Ch8-9
L09 Mechanical Sensors T1, Ch10; T2, Ch1
L10 Thermal Applications T2, Ch5
L11 Microfluidics T1, Ch6; T2, Ch12
L12 Optical Applications T2, Ch6-8
L13 Magnetic Applications T2, Ch9
L14 Presentation
L15 Final Exam

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Ice Breakers

Please introduce yourself:


Your name: Chinese and English (if any)
Your hometown: City, Province;
Your favorite sports/movies/books/music/….

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Where are MEMS?
Now in the year of 2022, MEMS are everywhere: every smartphones, every cars;
MEMS has a huge area of applications which is still expanding fast:
Environmental Consumer Devices Vehicle Industrial Biomedical
Temperature Microphones Navigation Robotics Health monitor
Humidity Motion sensors Safety Image sensor Implant devices
Flow rate Fingerprint sensor Autonomous Driving Infrared light sensor Wearables

That means lots of job opportunities in Giant companies and start-ups:


US Broadcom, Qorvo, Texas Instruments, HP, Honeywell, Knowles, GE, Analog Devices…
Europe Infineon, Bosch, ST, NXP, Silex…
Korea/Japan Sony, Samsung, TDK, Panasonic, Murata, Omron…
China 中芯国际,歌尔,瑞声,华润微,敏芯,西人马,美泰电子,美新半导体,纳芯微

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MEMS: Multi-Physical-Domain Coupled Systems

A MEMS device by Nathanson in 1960s.


Cantilever: (悬臂梁)
a beam (梁) with one end fixed.

𝐶𝐶𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜
Mechanical Electrical

Ref.: T01, Fig. 1.1

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MEMS: Coupled Systems

Flexure: a flexible part working as a spring;


Pull-in voltage: the critical voltage beyond
which the movable plate collapses and
sticks to the stationary plate

𝐶𝐶𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜
Mechanical Electrical

Ref.: T01, Fig. 1.2

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MEMS: Coupled Systems

Transducer (换能器): convert energy


between different forms

A thermal actuator (致动器): beam


expands upon heating by the voltage

𝐶𝐶𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜
Mechanical Electrical
𝐶𝐶𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜
Thermal
Ref.: T01, Fig. 1.3

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MEMS-Coupled Systems

A piezoelectric (压电) layer deforms under


electric field.

𝐶𝐶𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜
Mechanical Electrical

Ref.: T01, Fig. 1.4

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MEMS-Coupled Systems

A magnetic relay (继电器) controls the on


and off of a circert.

𝐶𝐶𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜
Mechanical Electrical
轴 𝐶𝐶𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜𝑜
Magnetic

Ref.: T01, Fig. 1.5

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MEMS-Coupled Systems

Ref.: T01, Fig. 1.5

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The 24 Greek Alphabet Letters

Upper Case Lower Case Name English Upper Case Lower Case Name English
Α α Alpha a Ν ν Nu n
Β β Beta b Ξ ξ Xi x
Γ γ Gamma g Ο ο Omicron o
Δ δ Delta d Π π Pi p
Ε ε Epsilon e Ρ ρ Rho r
Ζ ζ Zeta z Σ σ,ς * Sigma s
Η η Eta h Τ τ Tau t
Θ θ Theta th Υ υ Upsilon u
Ι ι Iota i Φ φ Phi ph
Κ κ Kappa k Χ χ Chi ch
Λ λ Lambda l Ψ ψ Psi ps
Μ μ Mu m Ω ω Omega o

Ref.: https://www.rapidtables.com/math/symbols/greek_alphabet.html

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How to Read Math
Equation Reading Note
1+2=3 one plus two equals three 3 is the "sum" "+",plus or addition sign
3−2=1 three minus two equals one 1 is the "difference" "-" minus or subtraction sign
2×3=6 two times three equals six 6 is the "product" "x", times or multiplication sign
6÷2=3 six divided by two equals 3 3 is the "quotient" "÷", division sign
one plus two in brackets times "(", open bracket or
")", close bracket or parentheses
three equals nine parentheses;
1+2 ×3=9 open bracket, one plus two,
close bracket, times three equals
nine
1≠3 one is not equal to three
𝑥𝑥 > 3 x is greater/larger than three
𝑥𝑥 < 3 x is less/smaller than three
2
two fifths 2 is the "numerator"
5 two over five 5 is the "denominator"
two divided by five

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How to Read Math
Equation Reading Note
82.77 eighty two point seven seven ".", decimal point
"√", radical or square
2 square root of two
root sign
3
2 cube root of two Practice:
5
2 fifth root of two
32 three squared 2 is the "exponent" 𝑎𝑎2 + 𝑏𝑏 2 = 𝑐𝑐 2
33 three cubed
three to the power of five
35
three to the fifth 𝑏𝑏 2 − 4𝑎𝑎𝑎𝑎
𝑥𝑥 = −𝑏𝑏 ±
log 𝑎𝑎 𝑥𝑥 log base a of x 2𝑎𝑎
lim 𝑓𝑓 𝑥𝑥 limit as x approaches zero of f
𝑥𝑥→0
of x
𝑑𝑑 𝑑𝑑𝑑𝑑 𝑑𝑑2 𝑦𝑦 ddx of dydx equalx d sqaure y
= 2
𝑑𝑑𝑑𝑑 𝑑𝑑𝑑𝑑 𝑑𝑑𝑥𝑥 over dx square
𝑓𝑓 𝑛𝑛 𝑥𝑥 f nth derivative of x
1
� 𝑡𝑡𝑡𝑡𝑡𝑡
0
integral from zero to one of tdt

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Dimensional Analysis
Dimensional analysis (量纲分析):
Analysis of the relationships between different physical quantities (dimensions)
by identifying their base quantities and units of measure
and tracking these dimensions during calculations or comparison.

Incommensurable: different dimensions, not comparable

Dimensions Length, L Time, T


meter second
Units millimeter minute Commensurable
micrometer day

中文参考书:《工程研究基础》,P135,点此阅读

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Dimensional Analysis
Dimensional analysis is very useful to in MEMS
find the relationship between measurable quantities for scaled or complicated system and
experiment design.
The key is to find the dimensionless number.

“In recent years, however, the feasible way has been to conduct small-scale
The relationship can guide
experimentation that should be accompanied by rigorous dimensional
experiments in very large, analysis, making it possible to extract empirical law from experimental
results. This way has also been effective in the practice of scientific research
very small systems or in Mechanics in the past half century”
-Hsue-Shen Tsien, 1980
complicated systems.

Find the book “Dimensional


Analysis” here. Ref.: https://blog.csdn.net/weixin_45386909/article/details/107807633

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Dimensional Analysis
Assume we have a cylinder,
l the radius of the top surface: r; diameter: d;
the thickness: t.
Then the perimeter of top surface:
𝑙𝑙 = 2𝜋𝜋𝑟𝑟 = 𝜋𝜋𝑑𝑑
Area of top surface:
𝜋𝜋 2
𝐴𝐴 = 𝜋𝜋𝑟𝑟 2 = 𝑑𝑑
4
Volume of the cylinder:

2
𝜋𝜋 2
𝑉𝑉 = 𝜋𝜋𝑟𝑟 𝑡𝑡 = 𝑑𝑑 𝑡𝑡
4
Ref.: T01, Fig. 1.7(a)

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Dimensional Analysis

l We consider d as the characteristic length, a


quantities serving as the “base”.
Dimensionless number of perimeter:

𝑙𝑙
= 𝜋𝜋
𝑑𝑑
For the Area:
𝐴𝐴 𝐴𝐴 𝜋𝜋
= 𝜋𝜋 or =
𝑟𝑟 2 𝑑𝑑 2 4

For the Volume:


𝑉𝑉 𝜋𝜋 𝑉𝑉 𝜋𝜋 𝑡𝑡
= or =
𝑑𝑑 2 𝑡𝑡 4 𝑑𝑑 3 4 𝑑𝑑
Ref.: T01, Fig. 1.7(a)

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Dimensional Analysis-Function of Dimensionless Numbers
We define Functions of Dimensionless Numbers
l as:

𝑙𝑙 𝑙𝑙
𝑓𝑓1 = − 𝜋𝜋 = 0
𝑑𝑑 𝑑𝑑

For the Area:

𝐴𝐴 𝐴𝐴 𝜋𝜋
𝑓𝑓2 = 2− =0
𝑑𝑑 2 𝑑𝑑 4

For the Volume:

𝑉𝑉 𝑡𝑡 𝑉𝑉 𝜋𝜋 𝑡𝑡
𝑓𝑓3 , = 3− =0
𝑑𝑑 3 𝑑𝑑 𝑑𝑑 4 𝑑𝑑
Ref.: T01, Fig. 1.7(a)

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Dimensional Analysis-Function of Dimensionless Numbers
Why do we use dimensionless numbers?
l
𝑉𝑉 𝑡𝑡 𝑉𝑉 𝜋𝜋 𝑡𝑡
𝑓𝑓3 3
, = 3
− =0
𝑑𝑑 𝑑𝑑 𝑑𝑑 4 𝑑𝑑

• The coefficient is independent of the units of


quantities;
• The relationship reflects the core of physical
model;
• The number of variables is reduced.

Ref.: T01, Fig. 1.7(a)

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Dimensional Analysis
Similarly, for the rectangular column,
Perimeter of top surface:
𝑙𝑙 = 2 𝑎𝑎 + 𝑏𝑏
Area of top surface:
𝐴𝐴 = 𝑎𝑎𝑎𝑎
Volume of the cylinder:
𝑉𝑉 = 𝑎𝑎𝑎𝑎𝑎

Ref.: T01, Fig. 1.7(b)

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Dimensional Analysis
And the functions of dimensionless number are
Perimeter of top surface:

𝑙𝑙 𝑏𝑏 𝑙𝑙 𝑏𝑏
𝑓𝑓4 , = −2 1+ =0
𝑎𝑎 𝑎𝑎 𝑎𝑎 𝑎𝑎

Area of top surface:

𝐴𝐴 𝑏𝑏 𝐴𝐴 𝑏𝑏
𝑓𝑓5 2
, = 2
− =0
𝑎𝑎 𝑑𝑑 𝑎𝑎 𝑑𝑑

Volume:

𝑉𝑉 𝑏𝑏 ℎ 𝑉𝑉 𝑏𝑏 ℎ
𝑓𝑓6 , , = 3− =0
Ref.: T01, Fig. 1.7(b)
𝑎𝑎3 𝑑𝑑 𝑑𝑑 𝑎𝑎 𝑑𝑑 𝑑𝑑

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Dimensional Analysis
The geometric relationships for the irregular structure
l are unknown:
Perimeter of top surface:
𝑓𝑓7 𝑎𝑎, 𝑙𝑙, ℎ = 0
Area of outer surface:
𝑓𝑓8 𝐴𝐴, 𝑎𝑎, 𝑙𝑙, ℎ = 0
Volume:
𝑓𝑓9 𝑉𝑉, 𝑎𝑎, 𝑙𝑙, ℎ = 0

Ref.: T01, Fig. 1.7(c)

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Dimensional Analysis
The functions of dimensionless can be written as
l Perimeter of top surface:

𝑎𝑎 ℎ
𝑓𝑓10 , =0
𝑙𝑙 𝑙𝑙

Area of outer surface:

𝐴𝐴 𝑎𝑎 ℎ
𝑓𝑓11 , , =0
𝑙𝑙 2 𝑙𝑙 𝑙𝑙

Volume:

𝑉𝑉 𝑎𝑎 ℎ
𝑓𝑓12 , , =0
𝑙𝑙 3 𝑙𝑙 𝑙𝑙
Ref.: T01, Fig. 1.7(c)

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Dimensional Analysis
After certain transform, they can be written as:
l Perimeter of top surface:

𝑎𝑎 ℎ
= 𝑓𝑓13
𝑙𝑙 𝑙𝑙

Area of outer surface:

𝐴𝐴 𝑎𝑎 ℎ
= 𝑓𝑓14 ,
𝑙𝑙 2 𝑙𝑙 𝑙𝑙

Volume:

𝑉𝑉 𝑎𝑎 ℎ
= 𝑓𝑓15 ,
𝑙𝑙 3 𝑙𝑙 𝑙𝑙
Ref.: T01, Fig. 1.7(c)

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Dimensional Analysis
During scaling of the structure, h/l and a/l are constant, so:
l Perimeter of top surface:

𝑎𝑎 ℎ
= 𝑓𝑓13 = constant
𝑙𝑙 𝑙𝑙

Area of outer surface:

𝐴𝐴 𝑎𝑎 ℎ
= 𝑓𝑓14 , = constant
𝑙𝑙 2 𝑙𝑙 𝑙𝑙

Volume:

𝑉𝑉 𝑎𝑎 ℎ
= 𝑓𝑓15 , = constant
𝑙𝑙 3 𝑙𝑙 𝑙𝑙
Ref.: T01, Fig. 1.7(c)

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Dimensional Analysis
Example 1.1 A real prototype of chocolate has following geometry:
Perimeter of top surface:
𝑙𝑙p = 𝑐𝑐1 𝑑𝑑
Area of outer surface:
𝐴𝐴p = 𝑐𝑐2 𝑑𝑑 2
Volume:
𝑉𝑉p = 𝑐𝑐3 𝑑𝑑 3

Ref.: T01, Fig. 1.8

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Dimensional Analysis
Example 1.1 The company wants a model enlarged by n times from
the prototype, so its geometry should be:
Perimeter of top surface:
𝑙𝑙m = 𝑐𝑐1 𝑛𝑛𝑛𝑛
Area of outer surface:
2
𝐴𝐴m = 𝑐𝑐2 𝑛𝑛𝑛𝑛
Volume:
3
𝑉𝑉m = 𝑐𝑐3 𝑛𝑛𝑛𝑛

Ref.: T01, Fig. 1.8

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Dimensional Analysis
Example 1.1 Therefore the geometry of the model can be calculated
from that of the protype without known c1, c2 and c3:
Perimeter of top surface:
𝑙𝑙m = 𝑛𝑛𝑙𝑙p
Area of outer surface:
𝐴𝐴m = 𝑛𝑛2 𝐴𝐴p
Volume:
𝑉𝑉m = 𝑛𝑛3 𝑉𝑉p

Ref.: T01, Fig. 1.8

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Dimensional Analysis

• Force (F), length (L) and time (T)


are most commonly used
fundamental quantities;
• Other fundamental quantities
include temperature (ϴ), charge
(Q);
• From those fundamental
quantities more quantities can be
derived:
Velocity=L/T=LT-1 (unit in m/s,
km/h…)

Ref.: T01, Table 1.1

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Dimensional Analysis

Practice: Find the dimension of Voltage in FLQ system

Consider a element charge of q in an electric field, E


the voltage within the distance d is V,
therefore the electric field strength is
𝑉𝑉 +q +
𝐸𝐸 =
𝑑𝑑
the electrical force applied on the charge is
𝑉𝑉
𝐹𝐹 = 𝑞𝑞𝑞𝑞 = 𝑞𝑞 d
𝑑𝑑
therefore the voltage can be expressed as
𝐹𝐹𝐹𝐹
𝑉𝑉 = = [𝐹𝐹𝐹𝐹𝑄𝑄 −1 ]
𝑞𝑞

Ref.: T01, Table 1.1

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Dimensional Analysis-FL System
Cantilever has width b, thickness t, length l.
Define modulus as “spring constant”, with dimension of
FL-2 (unit of N·m-2).
Question: what will be the displacement at the right end
reacting to a downward force Fa?
Answer: Assume the function of dimensionless number
is 𝑓𝑓 𝐹𝐹𝑎𝑎 , 𝐸𝐸, 𝛿𝛿, 𝑏𝑏, 𝑡𝑡, 𝑙𝑙 = 0

Ref.: T01, Fig. 1.9

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Dimensional Analysis-FL System
Dimensions of the variables are:
𝐹𝐹𝑎𝑎 = 𝐹𝐹
𝐸𝐸 = 𝐹𝐹𝐿𝐿−2
𝛿𝛿 = 𝐿𝐿 , 𝑏𝑏 = 𝐿𝐿 , 𝑡𝑡 = 𝐿𝐿 , 𝑙𝑙 = 𝐿𝐿
Then Fa and E can be eliminated to:

𝐹𝐹𝑎𝑎
= 𝐿𝐿−2
𝐸𝐸
Converting it to a dimensionless number:

𝐹𝐹𝑎𝑎
= 0
𝐸𝐸𝑙𝑙 2

Ref.: T01, Fig. 1.9

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Dimensional Analysis-FL System
Then the function of dimensionless numbers are

𝐹𝐹𝑎𝑎 𝛿𝛿 𝑏𝑏 𝑡𝑡
𝑓𝑓 2
, , , =0
𝐸𝐸𝑙𝑙 𝑙𝑙 𝑙𝑙 𝑙𝑙

which may be expressed as

𝛿𝛿 𝐹𝐹𝑎𝑎 𝑏𝑏 𝑡𝑡
= 𝑓𝑓1 , ,
𝑙𝑙 𝐸𝐸𝑙𝑙 2 𝑙𝑙 𝑙𝑙

Details of the relationship can be found through


experiments or numerical analysis:

𝛿𝛿 𝐹𝐹 𝛿𝛿 𝑏𝑏 −1 𝛿𝛿 𝑡𝑡 −3
= 𝑐𝑐1 𝑎𝑎2 , = 𝑐𝑐2 , = 𝑐𝑐3
𝑙𝑙 𝐸𝐸𝑙𝑙 𝑙𝑙 𝑙𝑙 𝑙𝑙 𝑙𝑙
Ref.: T01, Fig. 1.9

Liyi Li: Fund. & Appl. of MEMS Page: 41


Dimensional Analysis-FL System
Then the function of dimensionless numbers are

𝐹𝐹𝑎𝑎 𝛿𝛿 𝑏𝑏 𝑡𝑡
𝑓𝑓 2
, , , =0
𝐸𝐸𝑙𝑙 𝑙𝑙 𝑙𝑙 𝑙𝑙

which may be expressed as

𝛿𝛿 𝐹𝐹𝑎𝑎 𝑏𝑏 𝑡𝑡
= 𝑓𝑓1 , ,
𝑙𝑙 𝐸𝐸𝑙𝑙 2 𝑙𝑙 𝑙𝑙

Details of the relationship can be found through


experiments or numerical analysis (as shown in Fig. (b)):

𝛿𝛿 𝐹𝐹 𝛿𝛿 𝑏𝑏 −1 𝛿𝛿 𝑡𝑡 −3
= 𝑐𝑐1 𝑎𝑎2 , = 𝑐𝑐2 , = 𝑐𝑐3
𝑙𝑙 𝐸𝐸𝑙𝑙 𝑙𝑙 𝑙𝑙 𝑙𝑙 𝑙𝑙
Ref.: T01, Fig. 1.9

Liyi Li: Fund. & Appl. of MEMS Page: 42


Buckingham’s π-Theorem
If a physical problem can be described by n variables of
N fundamental units using the function:
𝑓𝑓 𝑣𝑣1 , 𝑣𝑣2 , 𝑣𝑣3 , … 𝑣𝑣𝑛𝑛 = 0
Then the functions for dimensionless number has n-N
variables
𝑔𝑔 𝜋𝜋1 , 𝜋𝜋2 , 𝜋𝜋3 , … 𝜋𝜋𝑛𝑛−𝑁𝑁 = 0
For example, in the beam equation
𝑓𝑓 𝐹𝐹𝑎𝑎 , 𝐸𝐸, 𝛿𝛿, 𝑏𝑏, 𝑡𝑡, 𝑙𝑙 = 0
n=6, N=2 (F and L)

Ref.: T01, Fig. 1.9

Liyi Li: Fund. & Appl. of MEMS Page: 43


Buckingham’s π-Theorem
Then there should be n-N=4 variables in g:
𝑔𝑔 𝜋𝜋1 , 𝜋𝜋2 , 𝜋𝜋3 , 𝜋𝜋4 = 0
The 4 variables should be independent with each other,
we first find the dimensionless number from those
variables with same fundamental dimension:
𝜋𝜋1 = 𝛿𝛿/𝑙𝑙, 𝜋𝜋2 = 𝑏𝑏/𝑙𝑙, 𝜋𝜋3 = 𝑡𝑡/𝑙𝑙
Since Fa, E are left out, they must be combined into
𝜋𝜋4 = 𝐹𝐹𝑎𝑎 𝐸𝐸 𝑎𝑎 𝑙𝑙 𝑏𝑏 = 𝐹𝐹 𝐹𝐹/𝐿𝐿2 𝑎𝑎
𝐿𝐿 𝑏𝑏
= 𝐹𝐹1+𝑎𝑎 𝐿𝐿−2𝑎𝑎+𝑏𝑏 = 0
Then
1 + 𝑎𝑎 = 0
Ref.: T01, Fig. 1.9 −2𝑎𝑎 + 𝑏𝑏 = 0

Liyi Li: Fund. & Appl. of MEMS Page: 44


Buckingham’s π-Theorem
So
𝑎𝑎 = −1
𝑏𝑏 = −2
𝜋𝜋4 = 𝐹𝐹𝑎𝑎 𝐸𝐸 −1 𝑙𝑙 −2
So we reach the same equation as that in Page 38:

𝐹𝐹𝑎𝑎 𝛿𝛿 𝑏𝑏 𝑡𝑡
𝑔𝑔 2
, , , =0
𝐸𝐸𝑙𝑙 𝑙𝑙 𝑙𝑙 𝑙𝑙

Ref.: T01, Fig. 1.9

Liyi Li: Fund. & Appl. of MEMS Page: 45


Dimensional Analysis-FLQ System
Example 1.2 A voltage is applied to a pair of parallel plates.
Question: what will be the force between the plates?
Answer:
Identify variables:
Top Plate
width l1 and length l1 of the top plate;
distance between the plates h;
voltage V;
Bottom Plate
permeability of the gap (“dielectric constant”) ε;
the force between the plates Fe.

Ref.: T01, Fig. 1.10

Liyi Li: Fund. & Appl. of MEMS Page: 46


Dimensional Analysis-FLQ System
Example 1.2 Find the dimension of each variable:
𝐹𝐹𝑒𝑒 = 𝐹𝐹
𝜀𝜀 = 𝑄𝑄2 /𝐹𝐹𝐿𝐿2
𝑉𝑉 = 𝐹𝐹𝐹𝐹/𝑄𝑄
Top Plate
𝑙𝑙1 = 𝑙𝑙2 = ℎ = 𝐿𝐿
Here we have N=3 (F, L, Q), n=6.
Then the function of dimensionless variables are
Bottom Plate
𝑔𝑔 𝜋𝜋1 , 𝜋𝜋2 , 𝜋𝜋3 = 0

Ref.: T01, Fig. 1.10

Liyi Li: Fund. & Appl. of MEMS Page: 47


Dimensional Analysis-FLQ System
Example 1.2 Using l1 as characteristic length, then
𝜋𝜋1 = 𝑙𝑙2 /𝑙𝑙1 , 𝜋𝜋2 = ℎ/𝑙𝑙1
And π3 must contain what are left out, F, V and ε:

𝑐𝑐 𝑑𝑑
Top Plate 𝑐𝑐 𝑑𝑑 𝑒𝑒
𝑄𝑄 𝐹𝐹𝐹𝐹 𝑒𝑒
𝜋𝜋3 = 𝐹𝐹𝑒𝑒 𝜀𝜀 𝑉𝑉 𝑙𝑙1 = 𝐹𝐹 𝐹𝐹 = [0]
𝐹𝐹𝐿𝐿2 𝑄𝑄

So
Bottom Plate 1−c+d=0
−2c + d + e = 0
2c − d = 0

Ref.: T01, Fig. 1.10

Liyi Li: Fund. & Appl. of MEMS Page: 48


Dimensional Analysis-FLQ System
Example 1.2 which gives c=-1, d=-2, e=0.
Then

𝐹𝐹𝑒𝑒
𝜋𝜋3 = 2
𝜀𝜀𝑉𝑉
Top Plate And

𝑙𝑙2 ℎ 𝐹𝐹𝑒𝑒
𝑔𝑔 , , 2 =0
𝑙𝑙1 𝑙𝑙1 𝜀𝜀𝑉𝑉
Bottom Plate
Or

𝐹𝐹𝑒𝑒 𝑙𝑙2 ℎ
= 𝑔𝑔1 ,
𝜀𝜀𝑉𝑉 2 𝑙𝑙1 𝑙𝑙1
Ref.: T01, Fig. 1.10

Liyi Li: Fund. & Appl. of MEMS Page: 49


Dimensional Analysis-FLQ System
Example 1.2 From experimental data, we have

2
𝐹𝐹𝑒𝑒 𝑙𝑙2 ℎ
=𝑐𝑐 /
𝜀𝜀𝑉𝑉 2 1 𝑙𝑙1 𝑙𝑙1

Top Plate 𝜀𝜀𝑉𝑉 2 × 𝑙𝑙1 𝑙𝑙2


𝐹𝐹𝑒𝑒 = 𝑐𝑐1
ℎ2

Bottom Plate

Ref.: T01, Fig. 1.10

Liyi Li: Fund. & Appl. of MEMS Page: 50


Dimensional Analysis
For irregular structures, if taking a as characteristic
length, then similar relationship is retained

𝐹𝐹𝑒𝑒 ℎ 𝑏𝑏 𝑐𝑐 𝑑𝑑
2
= 𝑔𝑔 , , , ,…
𝜀𝜀𝑉𝑉 𝑎𝑎 𝑎𝑎 𝑎𝑎 𝑎𝑎

In most cases for MEMS devices, only h can be varied


under working state, therefore all other geometric
quantities, such as a, b, c, d, are held constant, so we
have the form:

𝐹𝐹𝑒𝑒 ℎ
= 𝑔𝑔1
𝜀𝜀𝑉𝑉 2 𝑎𝑎
Ref.: T01, Fig. 1.11

Liyi Li: Fund. & Appl. of MEMS Page: 51


Dimensional Analysis
Example 1.3 In experiments, we can measure the force at variation of
h. As shown in Fig. b, the plot appears to be a linear
curve and we have

𝐹𝐹𝑒𝑒 𝑎𝑎 ℎ
log = 𝑐𝑐1 × + 𝑐𝑐2
𝜀𝜀𝑉𝑉 2 𝑐𝑐 𝑎𝑎

And from slope and intercept of the curve we get


𝑐𝑐1 = −1.8990
𝑐𝑐2 = −0.1084
So after rearrangement we have

𝑐𝑐 𝑎𝑎 1.8990
2
𝐹𝐹𝑒𝑒 = 0.7791𝜀𝜀𝑉𝑉
Ref.: T01, Fig. 1.12 𝑎𝑎 ℎ

Liyi Li: Fund. & Appl. of MEMS Page: 52


Dimensional Analysis-FLT System
Example 1.4 In a parallel-plate system, the top plate moves downward at
the velocity of u. It encounters a resistant force (“damping”
force) which slows its movement.
Question: find the damping force Fd.
Answer:
Identify variables:
width w and length l of the top plate;
distance between the plates h;
velocity u;
viscosity of the media in the gap µ;
Ref.: T01, Fig. 1.13

Liyi Li: Fund. & Appl. of MEMS Page: 53


Dimensional Analysis-FLT System
Example 1.4 Identify the dimensions of each variable:

𝜇𝜇 = 𝐹𝐹𝐹𝐹/𝐿𝐿2
𝑢𝑢 = 𝐿𝐿/𝑇𝑇
𝑙𝑙 = 𝑤𝑤 = ℎ = 𝐿𝐿
We have n=6 and N=3.
Then the function of dimensionless variables are
𝑔𝑔 𝜋𝜋1 , 𝜋𝜋2 , 𝜋𝜋3 = 0

Ref.: T01, Fig. 1.13

Liyi Li: Fund. & Appl. of MEMS Page: 54


Dimensional Analysis-FLT System
Example 1.4 Using l as characteristic length, then
𝜋𝜋1 = 𝑤𝑤/𝑙𝑙1 , 𝜋𝜋2 = ℎ/𝑙𝑙1
And π3 must contain what are left out, F, V and ε:

𝑐𝑐 𝑑𝑑
𝑐𝑐 𝑑𝑑 𝑒𝑒
𝐹𝐹 𝐿𝐿 𝑒𝑒
𝜋𝜋3 = 𝐹𝐹𝑑𝑑 𝜇𝜇 𝑢𝑢 𝑙𝑙 = 𝐹𝐹 2 𝐿𝐿 = [0]
𝐿𝐿 𝑇𝑇

So
1+c=0
−2c + d + e = 0
c−d=0

Ref.: T01, Fig. 1.13

Liyi Li: Fund. & Appl. of MEMS Page: 55


Dimensional Analysis-FLT System
Example 1.4 which gives c=-1, d=-1, e=-1.
Then

𝐹𝐹𝑑𝑑
𝜋𝜋3 =
𝜇𝜇𝜇𝜇𝜇𝜇
And

𝑤𝑤 ℎ 𝐹𝐹𝑑𝑑
𝑔𝑔 , , =0
𝑙𝑙 𝑙𝑙 𝜇𝜇𝜇𝜇𝜇𝜇

Or

𝐹𝐹𝑑𝑑 𝑤𝑤 ℎ
= 𝑔𝑔1 ,
𝜇𝜇𝜇𝜇𝜇𝜇 𝑙𝑙 𝑙𝑙
Ref.: T01, Fig. 1.13

Liyi Li: Fund. & Appl. of MEMS Page: 56


Dimensional Analysis with Known Governing Equation
Sometimes we have a known governing equation but
not an analytical solution, e.g.:

𝑑𝑑 2 𝑦𝑦
𝐸𝐸𝐸𝐸 2 = 𝑀𝑀
𝑑𝑑𝑥𝑥
Quiz: how to read the differential equation?

EI, second derivative of y with respect to x, equals M.


EI, d square y over d x square, equals M.

I is moment of inertia (a geometric quantity):


𝐼𝐼 = 𝑏𝑏𝑡𝑡 3

Ref.: T01, Fig. 1.9

Liyi Li: Fund. & Appl. of MEMS Page: 57


Dimensional Analysis with Known Governing Equation
We try to convert the equation into a dimensionless
form. First the x and are converted to dimensionless
number:
𝑥𝑥
𝑋𝑋 =
𝑙𝑙
𝑦𝑦
𝑌𝑌 =
𝛿𝛿
where l and δ are taken as characteristic length.
Using the chain rule of differentiation,

𝑑𝑑𝑦𝑦 𝑑𝑑𝑑𝑑 𝑑𝑑𝑋𝑋 1 𝑑𝑑 𝛿𝛿𝑌𝑌 𝛿𝛿 𝑑𝑑𝑌𝑌


= = =
𝑑𝑑𝑑𝑑 𝑑𝑑𝑑𝑑 𝑑𝑑𝑥𝑥 𝑙𝑙 𝑑𝑑𝑋𝑋 𝑙𝑙 𝑑𝑑𝑑𝑑
Ref.: T01, Fig. 1.9

Liyi Li: Fund. & Appl. of MEMS Page: 58


Dimensional Analysis with Known Governing Equation

𝑑𝑑 2 𝑦𝑦 𝑑𝑑 𝑑𝑑𝑑𝑑 𝛿𝛿 𝑑𝑑 𝑑𝑑𝑌𝑌 𝛿𝛿 𝑑𝑑 𝑑𝑑𝑑𝑑 𝛿𝛿 𝑑𝑑 2 𝑌𝑌


= = = 2 = 2
𝑑𝑑𝑥𝑥 2 𝑑𝑑𝑥𝑥 𝑑𝑑𝑑𝑑 𝑙𝑙 𝑑𝑑𝑑𝑑 𝑑𝑑𝑋𝑋 𝑙𝑙 𝑑𝑑𝑋𝑋 𝑑𝑑𝑑𝑑 𝑙𝑙 𝑑𝑑𝑋𝑋 2

Then the governing equation becomes

𝑑𝑑 2 𝑦𝑦 𝛿𝛿 𝑑𝑑 2 𝑌𝑌
𝐸𝐸𝐸𝐸 2 = 𝐸𝐸𝐸𝐸 2 = 𝑀𝑀
𝑑𝑑𝑥𝑥 𝑙𝑙 𝑑𝑑𝑋𝑋 2
Also it is known that
𝑀𝑀 = 𝐹𝐹𝑎𝑎 𝑙𝑙 − 𝑥𝑥 = 𝐹𝐹𝑎𝑎 1 − 𝑋𝑋
Therefore the dimensionless form of the governing equation
is

𝛿𝛿 𝑑𝑑 2 𝑌𝑌
Ref.: T01, Fig. 1.9 𝐸𝐸𝐸𝐸 2 = 𝐹𝐹𝑎𝑎 1 − 𝑋𝑋
𝑙𝑙 𝑑𝑑𝑋𝑋 2
Liyi Li: Fund. & Appl. of MEMS Page: 59
Dimensional Analysis with Known Governing Equation
Or

𝑑𝑑 2 𝑌𝑌
2
= 𝐺𝐺 1 − 𝑋𝑋
𝑑𝑑𝑋𝑋
where G is a dimensionless number

𝐹𝐹𝑎𝑎 𝑙𝑙 3
𝐺𝐺 =
𝐸𝐸𝐸𝐸𝛿𝛿
Then the solution to the differential equation can be written
as
𝑓𝑓 𝐺𝐺, 𝑌𝑌, 𝑋𝑋 = 0
Or

Ref.: T01, Fig. 1.9 𝑌𝑌 = 𝑔𝑔(𝐺𝐺, 𝑋𝑋)

Liyi Li: Fund. & Appl. of MEMS Page: 60


Dimensional Analysis with Known Governing Equation
From experimental data we find Y and G are linear, so:
𝑌𝑌 = 𝐺𝐺𝑔𝑔1 (𝑋𝑋)
This relationship will lead us to design experiments to find
the relationship between Y and X.

Ref.: T01, Fig. 1.9

Liyi Li: Fund. & Appl. of MEMS Page: 61


Dimensional Analysis with Known Governing Equation
Example 1.5 In a vibrating system with a damper, the governing equation
is

𝑑𝑑 2 𝑦𝑦 𝑑𝑑𝑦𝑦
𝑚𝑚 2 + 𝑐𝑐 + 𝑘𝑘𝑘𝑘 = 𝑓𝑓0 sin 𝜔𝜔𝜔𝜔
𝑑𝑑𝑡𝑡 𝑑𝑑𝑡𝑡
where m is the mass, c is the damping coefficient, k is the
spring constant. F, ω t denotes the force amplitude, angular
frequency and time, respectively.
Let
𝑦𝑦 𝑡𝑡
𝑌𝑌 = , 𝑇𝑇 =
𝑦𝑦𝑐𝑐 𝜏𝜏

Ref.: T01, Fig. 1.14

Liyi Li: Fund. & Appl. of MEMS Page: 62


Dimensional Analysis with Known Governing Equation
Example 1.5 Then

𝑑𝑑𝑑𝑑 𝑑𝑑𝑑𝑑 𝑑𝑑𝑇𝑇 𝑦𝑦𝑐𝑐 𝑑𝑑𝑌𝑌


= =
𝑑𝑑𝑑𝑑 𝑑𝑑𝑇𝑇 𝑑𝑑𝑡𝑡 𝜏𝜏 𝑑𝑑𝑇𝑇

𝑑𝑑 2 𝑦𝑦 𝑑𝑑 𝑑𝑑𝑑𝑑 𝑦𝑦𝑐𝑐 𝑑𝑑 𝑑𝑑𝑑𝑑 𝑦𝑦𝑐𝑐 𝑑𝑑 2 𝑌𝑌


= = = 2 2
𝑑𝑑𝑡𝑡 2 𝑑𝑑𝑡𝑡 𝑑𝑑𝑑𝑑 𝜏𝜏 𝑑𝑑𝑑𝑑 𝑑𝑑𝑑𝑑 𝜏𝜏 𝑑𝑑𝑇𝑇

Then the governing equation is converted to

𝑚𝑚 𝑑𝑑 2 𝑌𝑌 𝑐𝑐 𝑑𝑑𝑑𝑑 𝑓𝑓0
2 2
+ + 𝑌𝑌 = sin 𝜔𝜔𝜔𝜔𝜔𝜔
𝑘𝑘𝜏𝜏 𝑑𝑑𝑇𝑇 𝑘𝑘𝜏𝜏 𝑑𝑑𝑇𝑇 𝑘𝑘𝑦𝑦𝑐𝑐

Let 𝑦𝑦𝑐𝑐 = 𝑓𝑓0 /𝑘𝑘,𝜏𝜏 = 𝑚𝑚/𝑘𝑘 = 1/𝜔𝜔𝑛𝑛 ,

Ref.: T01, Fig. 1.14

Liyi Li: Fund. & Appl. of MEMS Page: 63


Dimensional Analysis with Known Governing Equation
Example 1.5 Then

𝑑𝑑 2 𝑌𝑌 1 𝑑𝑑𝑑𝑑
+ + 𝑌𝑌 = sin Ω𝑇𝑇
𝑑𝑑𝑇𝑇 2 𝑄𝑄 𝑑𝑑𝑇𝑇

Where ,𝑄𝑄 = 𝑚𝑚𝑘𝑘/𝑐𝑐, called Quality factor; Ω is the


dimensionless frequency.
Therefore Y is a function of Q, Ω, and T.

Ref.: T01, Fig. 1.14

Liyi Li: Fund. & Appl. of MEMS Page: 64

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