Q08CMI00J Q08CMI00K Q08CMI00L

6773 6773 1654

6773 6773 1654
6759 6765 1652
99.79% 99.88% 99.88% J
real reject over reject
0 2 1 Bad Pad [Bad Die Rotation]
0 1 0 Die scratches
0 0 0 Chipped Die
3 0 0 Others 3 (die rotation) 0
11 6 0 Foreign Material 1 (FM of bonded wires) 10 (fm on die)
0 1 0 Damage Wire
0 0 0 Double bond
0 0 0 Missing Wire
0 0 0 Bond off pad
0 0 0 Bond off lead
0 0 1 Lead scratch
0 0 0 Lifted ball
0 0 1 Lifted stitch
0 0 0 Cracked die
0 0 0 Wrong bond
0 0 0 KNS defult
0 0 0 Not Enough Die

14 8 2
14 8 2
1 1 1
 K L
real reject over reject real reject over reject
2 1 (die rotation)

0 6
1 (scratch on die) 0

1 (die rotation)
 WRONG DIE FOREIGN
LOT ORIENTATION OTHERS MATERIAL DAMAGE WIRE

3
REJECT (DIE ROTATION) 1 (FM ON WIRE)
J
OVER REJECT 10 (FM ON DIE)

1
REJECT 2
(SCRATCH ON DIE)
K
OVER REJECT 6 (FM ON DIE)

REJECT 1
L
OVER REJECT
LIFTED STICH TOTAL OVER REJECT %

10

3
70.8%
6

1 1

TOTAL 24