COHERENT TRAINING/CLASS SIGN-IN RECORD

Course Level of Evaluation:

Class Title: Tiéu chuån kiém Wafer 150/ Wafer 150 inspection standard Location: FQA
Start Date 17-Feb-2023 End Date 17-Feb-2023 Total Training Hours: Hr(s)
Class Descri tion and/or Procedure:
l. Kiöm loi måu vit tu•wafer / Wafercolor inspection.
Dit lot hing trén trén carier / Put wafers vertical located in carrier
Sir dung dén huynh quang •inh sång tring (dén B) kiem måu / Use white light source
(lapnp B)
Kiem måu wafer (chti trqng conh chåm), thay dbi nhicu g6c nhin xem con hång co bi åm
måu hay khöng / Visual watch wafer (especially the edge) through different angle, to check if
clear or color
Chi chap n hip wafer trong suot, lopi wafer co måu / Onlyclear wafers are accepted, color
M'afersare rejected
2. Kiem ngopi quan, chat Itrqng be mit wafer / Wafer Visual Inspection.
Sti dung dén 9W inh sing vång, ncn den / Use 9Wyellow light source, black background
condition
Kicm ngoqi quan con hing dig, chip, / Do visual inspection to check scratch, dig,
chip etc.
Tiéu chuan dånh giå nhtr sau / Key requirement:
o Scracth dig: 60-40
o Chip: 0.1 mm
o Bubble: size < 0.13mm, Qty 10
O Crack: Khöng cho phép / not allow
o Fog: mit trong su6t, khöng dec strong / Nofog is allow.

Trainer/Facilitator: Nguyen Dinh Cuong Internal O External

Trainer/FaciIitator
Signature;
By my signature below I indicate that I Training Type:
agree to thefollowing:
J. Training session/class was conducted O Induction O Engineering
per the information in the box above, O DepartmentGeneral Training a safety
2. Attendance at the session. a PQS O Environment
3. Learning objectives are fully O OJT a Others
understood. ØQuality
4. To apply knowledge, skills to perform O CompanyTraining
job duties. O Cross-Dept Training

Reference document: /002 Page I of I Date: to-Nov-22, ECN# 25940

 No. Emp. ID Name Department Signature
Qualified?
YIN

10

11

12

13

14

15

16

17

Reference document: Page 2 of I Date: 10-Nov-22, ECN# 25940