Finite Element Modeling in

Thermal Simulation
PART – II

By:
Ravi Kanaparthi, M.Eng, OCT
 Overview
• Advantages of Thermal Modeling in the
Design Process
• Introduction to FEA - Thermal
• Heat Transfer
• Thermal Simulation
• Simulation of Standard Packaging
Designs

2
Advantages of Including Thermal
Modeling in the Design Process

3
 Why Simulate Thermals?
• No prototyping required
• No inventory required
• Saves on chamber time
• Limitless number of temperature probes
• Can identify susceptible locations in the pack‐out
• Accelerates the design process
• Multiple variations can be tested and compared
• Graphic rendering for customers

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Introduction to FEA ‐ Thermal

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A Wide Variety of Applications

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What is “FEA ‐ Thermal”?
• A computational method for performing analysis
of a physical system.
• A FEA tool is used to simulate mechanical,
thermal, rheological, electronic or other
response of a system.
• Involves the division of a body into smaller
domains or “elements”.
• The applicable equations describing the physics
of the system can then be evaluated for each of
the elements.
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 A Simple Example in 2‐D: I
10 W/m2

40 C

10 C

10 W/m2

An odd‐shaped sheet of HDPE is A CAD model of the sheet is divided into

subjected to a heat input and output, as smaller components by meshing.
well as constant temperatures at two
places.

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 A Simple Example in 2‐D: II
10 W/m2

40 C

10 C

10 W/m2

Constraints such as fixed temperatures The simulation algorithm runs with

are defined in the simulation set‐up. multiple iterations and calculates the
resulting temperature throughout the
object.

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Heat Transfer

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 Heat Transfer: I
• There are three methods of heat transfer between
two objects:
– Conduction
• Transfer of thermal energy through direct contact
• Fourier’s Law: q = kAΔT/Δx
– Convection
• Transfer of thermal energy through a fluid
• Can be free or forced
• q = hcA∆T
– Radiation
• Transfer of energy through electromagnetic radiation emitted by all objects
with temperature > 0 K (‐273 C)
• Hotter objects emit more power: P = σT4

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 Heat Transfer: II
• In thermal packaging, the primary method of
heat transfer is conduction
• Free convection by air cells in a packaging
configuration also have a significant effect
• To properly treat both mechanisms of heat
transfer, a hybrid thermal‐fluid solver is
required

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Thermal Simulation

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 Thermal Simulation: I
• In order for thermal simulation to be an
integral part of the design process, simulation
results must be validated.
• In thermal/flow simulation, there are multiple
user parameters and options that govern the
thermodynamics of the modelled system.
• Many of these can be measured directly,
however many must be determined through
simulated experiment

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 Thermal Simulation: II
• Finding the correct simulation parameters and
making the appropriate geometric
approximations present the biggest challenges
in obtaining simulation results that accurately
replicate test results.
• A standard set of processes, options and
parameters has been developed leading to
acceptable simulation results for existing and
new thermal packaging designs.

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Models of Individual Components
•Database of part drawings
•Can be used as
components in assembly
models and simulations.
•Geometry is generally
simplified for simulation

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 Simulation Parameters and Options

• Density, specific heat capacity, and thermal

conductivity
• Convective heat transfer multiplier
• Radiative and convective thermal coupling to ambient
environment
• Conductive contact between tangent faces
• Solver parameters
• Others

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 Parameterization Simulation

Effect of Convective Heat Transfer Multiplier (TS‐48 Large Canadian

with ATP Summer 48H Profile)
12

11

10

9
Temperature (C)

8 Test ‐ Probe 7
Test ‐ Probe10
7
Simulation ‐ CHTM=1
6
Simulation ‐ CHTM=0.5
5 Simulation ‐ CHTM=0.25

4 Simulation ‐CHTM=0.125

2
0 12 24 36 48

Time(h)
The extent to which the convective heat transfer multiplier affects results can be readily seen here.

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 Materials: I
• For valid simulation results, accurate values of several
physical properties of each material are required:
– Density (ρ)
– Specific heat capacity (cp)
– Thermal conductivity (k)
• For PCMs, values for these properties are required both
above and below the phase‐change temperature, as well
as:
– Latent heat capacity (L)
– Phase change temperature (TPC)
• Some of these material properties exhibit a significant
variation over the temperature range of interest and
must be programmed as temperature‐dependent tables.
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 Materials: II
• PCMs • Insulators
– Water‐based Cryogels – Expanded Polystyrene
– Phase‐5 (EPS)
– Phase‐22 – Low, medium and high
density
– Phase‐27
– 20‐Below Gel – Polyurethane (PUR)
– Dry Ice – Polyisocyanurate (PIR)
• Containers – Vacuum Insulated Panels
– Corrugated Cardboard • Others
– HDPE/LDPE

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Simulation of Standard Designs

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Simulations of Standard Packaging
Designs.

• TimeSaver 24 Small (US)

• TimeSaver 48 Premium Medium (US)
• TimeSaver 48 Large (Canada)
• TimeSaver 96 PUR Small (US)

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TimeSaver‐24 Small

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Design Details
• 12 CG1181 gel packs.
• Was simulated both with and
without a convective heat
transfer coefficient multiplier to
effectively model the
configuration with and without
bubble wrap.
• Gel packs were modeled with
a simplified geometry and with
an averaged conductive heat
transfer coefficient.

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 Summer Simulation Results
40

35

30

25
Temperature (°C)

20

15

10

0
0 6 12 18 24
Time(h)

Test#1 Test#2 Test#3 Solution 1 SIM (with HTCM=1/8) Solution 3SIM ISTA Summer 24H
“w/bubble‐wrap” “w/obubble‐wrap”

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 Winter Simulation Results
20

15

10

5
Temperature (°C)

0
0 6 12 18 24

‐5

‐10

‐15

Time(h)

Test#1 Test#2 Test#3 Solution 2 SIM (with HTCM=1/8) Solution 4SIM ISTA Winter24H
“w/bubble‐wrap” “w/obubble‐wrap”

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TimeSaver‐48 Medium Premium

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 Model Details
Cut‐away view of 48H Winter Simulation
•Presence of two different PCMs, Phase‐5 and
water‐based gels, presents additional
challenges in obtaining accurate simulation
results.
•To account for attenuated convective heat
transfer due to blockage from bubble‐wrap, a
convective heat transfer coefficient multiplier
was used.
•Conduction assumed perfect between EPS
layers
•Effective conductive transfer coefficient
used for other surface‐to‐surface contact
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 Simulation Results ‐ Winter
TimeSaver 48 Medium Premium ‐ Winter Minimum Load
20

15

10
Temperature (C)

5
0.61 C

0
0 12 24 36 48

‐5

‐10

‐15
Time(h)

Qualification Test #1 Qualification Test #2 Qualification Test #3 Simulation PayloadT ISTA Winter48H

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TimeSaver‐48 Large Canadian

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 Model Details
Final Temperature ‐ Winter
Final Temperature ‐ Summer
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•Customer expressed interest in using
the design but as concerned about the
performance against their own
temperature profile.
•In order to facilitate the conversation
the shipper was modeled and tested
against the profile in question.
•Gel packs are the sole PCMs. Modeled
geometry was idealized.
•Effective conductive heat transfer
coefficient used
•Effect of convective heat transfer
multiplier was extensively investigated
with this model.
 Simulation Results ‐ Summer
Timesaver‐48 Large Canadian Assembly 001 – Summer – SIM 001:
Solution 10 ‐ ATP Canadian Summer48H
40

35

30
Temperature (C)

25

20 Payload Test Temperature

Payload Simulation Temperature
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Temperature Profile

10

0
0 2 4 6 8
1 2 3
Time(h) 4

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 Simulation Results ‐ Winter
Timesaver‐48 Large Canadian Assembly 001 ‐ SIM 001:
Solution 2 ‐ ATP Canadian Winter 48H
25

20

15

10
Temperature (C)

0
0 6 12 18 24 30 36 42 48
‐5

‐10

‐15

‐20

‐25
Time(h)

Temp Probe 1(C) Temp Probe 2(C) Payload Simulation(C) External ProfileTemperature

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 Simulation Results – Winter
(Customer‐supplied profile)
Timesaver‐48 Large Canadian Assembly 001 ‐ SIM 001:
Solution 3 ‐ Lynden Winter51H
25

20

15

10

5
Temperature (C)

0
0 12 24 36 48
‐5

‐10

‐15

‐20

‐25
‐30
Time(h)

External Temperature Profile Payload Center Temperature

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TimeSaver‐96 Small PUR

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Model Details
•PCMs are Phase‐5
bottles and gel
bottles.
•Again, effective
conductive heat
transfer coefficient
used to model
imperfect
conduction
between surfaces

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 Simulation Results
TimeSaver‐96 Small PUR ‐ Winter
20

15

10
Temperature (C)

0
0 12 24 36 48 60 72 84 9
6

‐5

‐10

‐15
Time(h)

Qualification Test #1 Qualification Test #2 Qualification Test #3

Payload (Sol'n 1) Payload (Sol'n 3) ISTA Winter 96H

Convection Heat Transfer Multiplier : 1/8 (sol’n 1) & 1/16 (sol’n 3)

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