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2SD789

Silicon NPN Epitaxial

Application

• Low frequency power amplifier


• Complementary pair with 2SB740

Outline

TO-92MOD

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1. Emitter
2. Collector
3. Base

3
2
1

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2SD789

Absolute Maximum Ratings (Ta = 25°C)


Item Symbol Ratings Unit
Collector to base voltage VCBO 100 V
Collector to emitter voltage VCEO 50 V
Emitter to base voltage VEBO 6 V
Collector current IC 1 A
Collector power dissipation PC 0.9 W
Junction temperature Tj 150 °C
Storage temperature Tstg –55 to +150 °C

Electrical Characteristics (Ta = 25°C)


Item Symbol Min Typ Max Unit Test conditions
Collector to base breakdown V(BR)CBO 100 — — V I C = 10 µA, IE = 0
voltage
Collector to emitter breakdown V(BR)CEO 50 — — V I C = 1 mA, RBE = ∞
voltage
Emitter to base breakdown V(BR)EBO 6 — — V I E = 10 µA, IC = 0
voltage
Collector cutoff current I CBO — — 1 µA VCB = 80 V, IE = 0
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Emitter cutoff current I EBO — — 0.2 µA VEB = 6 V, IC = 0


1
DC current transfer ratio hFE* 100 — 800 VCE = 2 V, IC = 0.1A
Collector to emitter saturation VCE(sat) — — 0.3 V I C = 1 A, IB = 0.1 A
voltage
Gain bandwidth product fT — 100 — MHz VCE = 2 V, IC = 10 mA
Collector output capacitance Cob — 20 — pF VCB = 10 V, IE = 0, f = 1MHz
Note: 1. The 2SD789 is grouped by h FE as follows.
B C D E
100 to 200 160 to 320 250 to 500 400 to 800

2
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2SD789
Typical Output Characteristics
Maximum Collector Dissipation Curve
100
1.2 0.35
Collector Power Dissipation PC (W)

0.3

Collector Current IC (mA)


80
0.25
0.8 60 0.2

0.15
40
0.4 0.1

20 0.05 mA

IB = 0

0 50 100 150 0 2 4 6 8 10
Ambient Temperature Ta (°C) Collector to Emitter Voltage VCE (V)

Typical Output Characteristics Typical Transfer Characteristics


2.0 1,000
40 35
30
1.6 25 300
Collector Current IC (mA)
Collector Current IC (A)

20 VCE = 2 V
15 100
1.2
10
30
0.8 5 mA
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10
0.9
W
0.4
3
IB = 0
1
0 0.4 0.8 1.2 1.6 2.0 0 0.2 0.4 0.6 0.8 1.0
Collector to Emitter Voltage VCE (V) Base to Emitter Voltage VBE (V)

3
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2SD789

DC Current Transfer Ratio vs.


Collector Current Saturation Voltage vs. Collector Current

Collector to Emitter Saturation Voltage VCE(sat) (V)


10,000 1.0

Base to Emitter Saturation Voltage VBE(sat) (V)


Pulse VBE(sat)
DC Current Transfer Ratio hFE

3,000
VCE = 2 V
0.3
1,000

300 0.1

100
VCE(sat)
0.03
30 Pulse
IC = 10 IB
10 0.04
1 3 10 30 100 300 1,000 10 30 100 300 1,000
Collector Current IC (mA) Collector Current IC (mA)

Collector Output Capacitance vs.


Collector to Base Voltage
300
Collector Output Capacitance Cob (pF)

100

30

10 http://www.DataSheet4U.net/

f = 1 MHz
3 IE = 0

1.0

0.3
0.3 1.0 3 10 30 100 300
Collector to Base Voltage VCB (V)

4
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Unit: mm

4.8 ± 0.3 3.8 ± 0.3

8.0 ± 0.5
2.3 Max
0.65 ± 0.1
0.75 Max
10.1 Min
0.60 Max
0.7

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0.5 ± 0.1 0.5

1.27
2.54

Hitachi Code TO-92 Mod


JEDEC —
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Weight (reference value) 0.35 g


Cautions

1. Hitachi neither warrants nor grants licenses of any rights of Hitachi’s or any third party’s patent,
copyright, trademark, or other intellectual property rights for information contained in this document.
Hitachi bears no responsibility for problems that may arise with third party’s rights, including
intellectual property rights, in connection with use of the information contained in this document.
2. Products and product specifications may be subject to change without notice. Confirm that you have
received the latest product standards or specifications before final design, purchase or use.
3. Hitachi makes every attempt to ensure that its products are of high quality and reliability. However,
contact Hitachi’s sales office before using the product in an application that demands especially high
quality and reliability or where its failure or malfunction may directly threaten human life or cause risk
of bodily injury, such as aerospace, aeronautics, nuclear power, combustion control, transportation,
traffic, safety equipment or medical equipment for life support.
4. Design your application so that the product is used within the ranges guaranteed by Hitachi particularly
for maximum rating, operating supply voltage range, heat radiation characteristics, installation
conditions and other characteristics. Hitachi bears no responsibility for failure or damage when used
beyond the guaranteed ranges. Even within the guaranteed ranges, consider normally foreseeable
failure rates or failure modes in semiconductor devices and employ systemic measures such as fail-
safes, so that the equipment incorporating Hitachi product does not cause bodily injury, fire or other
consequential damage due to operation of the Hitachi product.
5. This product is not designed to be radiation resistant.
6. No one is permitted to reproduce or duplicate, in any form, the whole or part of this document without
written approval from Hitachi.
7. Contact Hitachi’s sales office for any questions regarding this document or Hitachi semiconductor
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products.

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