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  • SAML21 Xplained Pro PCB Stackup Rev4

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    nelepag194
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    The document describes the layer structure of a printed circuit board with multiple copper layers of varying thicknesses used for signal routing. Key layers include top and bottom layers of 35um copper, with inner layers consisting of 114um copper laminated between 180-200-180um thick FR-4 layers designed for differential impedances of 90 ohms and 45 ohms for single ended signals.

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    SAML21_Xplained_Pro_PCB_stackup_rev4

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    The document describes the layer structure of a printed circuit board with multiple copper layers of varying thicknesses used for signal routing. Key layers include top and bottom layers of 35um copper, with inner layers consisting of 114um copper laminated between 180-200-180um thick FR-4 layers designed for differential impedances of 90 ohms and 45 ohms for single ended signals.

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    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
    Flag for inappropriate content
    2 views1 page

    SAML21 Xplained Pro PCB Stackup Rev4

    Uploaded by

    nelepag194
    The document describes the layer structure of a printed circuit board with multiple copper layers of varying thicknesses used for signal routing. Key layers include top and bottom layers of 35um copper, with inner layers consisting of 114um copper laminated between 180-200-180um thick FR-4 layers designed for differential impedances of 90 ohms and 45 ohms for single ended signals.

    Copyright:

    © All Rights Reserved
    Download as PDF, TXT or read online from Scribd
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    of 1

    Finished copper thickness on outer layers: 35µm LY-Top SIG

    Plating 23.5 µm
    Copper 11.5µm
    180-200-180 µm d 90 Ω 210 µm s 45 Ω
    S1000B 114µm 2116

    Copper 35µm LY-2 GND

    S1000 1130µm DRth 1-4

    Copper 35µm LY-3 VCC

    S1000B 114µm 2116


    180-200-180 µm d 90 Ω 210 µm s 45 Ω
    Copper 11.5µm
    Plating 23.5 µm
    LY-Bot SIG
    Legend

    Track width

    Track width
    Spacing
    Core, FR4
    Prepreg, FR4 xxx-xxx-xxx µm
    Copper d = differential impedance
    Plated s = single ended impedance
    Impedance Control xxx-xxx-xxx µm d 100 Ω xxx µm

    Track width

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