SMI Catalogue 2015

List of products
QUARTZ CRYSTAL UNITS
XTAL 11SMX Page XTAL 21SMX Page XTAL 22SMX Page
1.2 2.0
1.6
Package 0.3 0.5
XTAL
0.45
1.6 2.0 2.5
Frequency 24.000 MHz ～ 80.000 MHz 20.000 MHz ～ 80.000 MHz 16.000MHz ～ 80.000 MHz
Freq. Tolerance (+25゜
C) ±30 ppm ±30 ppm ±30 ppm
Freq. Stability / O.T. ±30 ppm ±30 ppm ±30 ppm
Load Capacitane (CL) 7 pF, Typical 8 pF, Typical 8 pF, Typical
CLK OSC
Ope. Temperature (O.T.) C ～ +70゜

-20゜ C C ～ +70゜
-20゜ C C ～ +70゜
-20゜ C
Custom Specs. Custom designed 11SMX Custom designed 21SMX Custom designed 22SMX
XTAL 32SMX(A) Page XTAL 32SMX(B) Page XTAL 53SMX(B) Page
2.5 2.5 3.2

Package 0.85
0.65 0.8
3.2 3.2 5.0

VCXO
C) ±30 ppm ±30 ppm ±50 ppm
-20゜ C C ～ +70゜
-20゜ C C ～ +70゜
-20゜ C
Custom Specs. Custom designed 32SMX(A) n.a. Custom designed 53SMX(B)
TCXO
XTAL 53SMX(C) Page XTAL 53SMX(D) Page XTAL 97SMX(A) Page
3.2 3.5
3.2
Package 1.3 / 1.5 1.1
1.0
6.0
5.0 5.0
Frequency 8.000MHz ～ 60.000 MHz 10.000MHz ～ 50.000 MHz 9.000MHz ～ 150.000 MHz
C) ±50 ppm ±50 ppm ±50 ppm
VCTCXO

-20゜ C C ～ +70゜
-20゜ C C ～ +70゜
-20゜ C
Custom Specs. n.a. n.a. n.a.
XTAL 97SMX(B) Page XTAL 97SMX(C) Page XTAL 94SMX(B) Page

MCF
3.5 3.5 5.0

Package 0.9 1.2 1.1
6.0 6.0 7.0 / 7.5
C) ±50 ppm ±50 ppm ±50 ppm
-20゜ C C ～ +70゜
-20゜ C C ～ +70゜
-20゜ C
Custom Specs. n.a. n.a. Custom designed 94SMX(B)
2
STANDARD SMD CRYSTALS
XTAL 94SMX(C) Page XTAL 94SMX(D) Page XTAL 93SMX Page
5.0 5.0 4.5

Package 1.1 1.1 1.8
XTAL
7.0 / 7.5 7.0 / 7.5 8.0
Frequency 6.000 MHz ～ 70.000 MHz 6.000 MHz ～ 70.000 MHz 4.000 MHz ～ 50.000 MHz

C) ±50 ppm ±50 ppm ±50 ppm
CLK OSC
-20゜ C C ～ +70゜
-20゜ C C ～ +70゜
-20゜ C
XTAL 92SMX(CN) Page XTAL 92SMX(D) Page XTAL 86SMX(LPN) Page
5.5 5.0 4.3

Package 1.5 / 1.8 2.1 3.6
11.8 11.0 12.4
VCXO

C) ±50 ppm ±50 ppm ±50 ppm

-20゜ C C ～ +70゜
-20゜ C C ～ +70゜
-20゜ C
TCXO
XTAL 86SMX(MC) Page XTAL 86SMX(MM) Page XTAL 4HLB Page
4.7 4.7 4.3

Package 4.2 4.2
12.4
13.0 13.0
4.7
VCTCXO
C) ±50 ppm ±50 ppm ±50 ppm
Freq. Stability / O.T. ±50 ppm ±50 ppm ±50 ppm (AT) ±100 ppm (BT)

C ～ +70゜
-20゜ C (AT)
-20゜ C C ～ +70゜
-20゜ C C ～ +60゜
-10゜ C (BT)
XTAL 3HLB Page XTAL 25HLB Page XTAL HC-49/U-2H Page

2.1
MCF
2.6
Package 3.1
12.4 12.4 11.35

5.0
4.7 4.7 10.5

C) ±50 ppm ±50 ppm ±50 ppm
Freq. Stability / O.T. ±50 ppm (AT) ±100 ppm (BT) ±50 ppm (AT) ±100 ppm (BT) ±50 ppm

C ～ +70゜
-20゜ C (AT) C ～ +70゜
-20゜ C (AT)
-10゜ C (BT) C ～ +60゜
-10゜ C (BT) C ～ +70゜
-20゜ C
3
List of products
QUARTZ CRYSTAL UNITS
UM-1(MJ)
XTAL HC-49/U-3H Page XTAL HC-49/U-4H Page XTAL UM-1S(MJ) Page
2.5 3.5 8.0
Package 3.1 / 2.8
XTAL
11.35 11.35
5.0 7.8
5.0
2.5
10.5 10.5

C) ±50 ppm ±50 ppm ±5 ppm ～ ±20 ppm
Freq. Stability / O.T. ±50 ppm ±50 ppm ±10 ppm ～ ±30 ppm

CLK OSC

-20゜ C C ～ +70゜
-20゜ C C ～ +70゜
-20゜ C
UM-5(MJ) UM-4(MJ) UM-1

XTAL UM-5S(MJ) Page XTAL UM-4S(MJ) Page XTAL UM-1S Page
8.0 8.0
Package 3.1 / 2.8 8.0 7.9
3.1 / 2.8
3.2 / 2.7
5.8 4.4
2.5 2.5 7.1
VCXO
1.000 MHz ～ 1.200 MHz


C) ±5 ppm ～ ±20 ppm ±5 ppm ～ ±20 ppm ±3 ppm ～ ±50 ppm
Freq. Stability / O.T. ±10 ppm ～ ±30 ppm ±10 ppm ～ ±30 ppm ±10 ppm ～ ±100 ppm

C ～ +60゜
-10゜ C (SL-Cut)
-20゜ C C ～ +70゜
-20゜ C C ～ +70゜
-20゜ C (AT-Cut)
TCXO
UM-5 UM-4 HC-49/U(MJ)

XTAL UM-5S Page XTAL UM-4S Page XTAL HC-49/UT(MJ) Page
11.5
Package 6.0 7.9
4.5
4.9
7.9
3.2 / 2.7 13.5 / 11.5
3.2 / 2.7
7.1 7.1 4.0
VCTCXO

Freq. Stability / O.T. ±10 ppm ～ ±50 ppm ±10 ppm ～ ±50 ppm ±10 ppm ～ ±50 ppm

C ～ +60゜
-10゜ C
-20゜ C C ～ +70゜
-20゜ C
C ～ +70゜
-20゜ C
HC-49/U
XTAL HC-49/UT Page
MCF
11.3
Package 4.9
13.5 / 11.2
Frequency 1.84320 MHz ～ 200.000 MHz

C) ±5 ppm ～ ±50 ppm
Freq. Stability / O.T. ±10 ppm ～ ±50 ppm
Load Capacitane (CL) 20 pF, Typical

C ～ +60゜
-10゜ C
-20゜ C
4
List of products
QUARTZ CRYSTAL UNITS 32.768 kHz STANDARD SMD CRYSTALS
1.0 1.2 1.5

Package 0.55 0.8
XTAL
0.5
2.0 3.2
1.6
Frequency 32.768 kHz 32.768 kHz 32.768 kHz

Freq. Stability / O.T. - - -
Load Capacitane (CL) 9.0 or 12.5 pF 6.0, 7.0, 9.0 or 12.5 pF 6.0, 9.0 or 12.5 pF
CLK OSC
C ～ +85゜
-40゜ C (Standard)
-40゜ C C ～ +85゜
-40゜ C C ～ +105゜
-40゜ C (Option)
C ～ +125゜
-40゜ C (Option)
1.5 1.8 1.5

Package 0.9 1.0 1.4
4.1 4.9 7.0
VCXO
Load Capacitane (CL) 7.0, 9.0 or 12.5 pF 7.0, 9.0 or 12.5 pF 3.7, 4.4, 6.0, 7.0 or 12.5 pF

-40゜ C C ～ +85゜
-40゜ C C ～ +85゜
-40゜ C
TCXO
XTAL 90SMX(N) Page XTAL 90SMX(S) Page XTAL 95SMX Page
3.7 3.7
Package 2.4 2.4
7.9 7.9
Frequency 32.768 kHz 32.768 kHz 30.000 kHz ～ 100.000 kHz

VCTCXO
Load Capacitane (CL) 6.0 or 12.5 pF 6.0 or 12.5 pF 12.5 pF

-40゜ C C ～ +85゜
-40゜ C C ～ +85゜
-40゜ C
XTAL 26(LF)MJ Page XTAL 26(LF) Page XTAL 1.2x4.7 mm Page

MCF
1.2
Package 2.2
8.3 9.0 4.7
2.3 3.0
2.5 2.0 2.54
2.54

Load Capacitane (CL) 12.5 pF 8.0, 10.0 or 12.5 pF 8.0 pF

-40゜ C C ～ +85゜
-40゜ C C ～ +60゜
-20゜ C
5
List of products
QUARTZ CRYSTAL UNITS 32.768 kHz
XTAL 1.4x5 mm Page XTAL 2x6 mm Page XTAL 3x8 mm Page

1.4 1.9 3.0
Package
XTAL
5.0 6.0 8.0

Load Capacitane (CL) 8.0 pF 12.5 pF 12.5 pF
CLK OSC

-20゜ C C ～ +70゜
-20゜ C C ～ +70゜
-20゜ C
XTAL 1.2x4.7 mm Page XTAL 2x6 mm Page
1.2 1.9
Package
4.7 6.0
VCXO
Frequency 30.000 kHz ～ 100.000 kHz 30.000 kHz ～ 100.000 kHz

C) ±20 ppm ～ ±100 ppm ±20 ppm ～ ±100 ppm
Freq. Stability / O.T. - -
Load Capacitane (CL) Series or 10 pF 12.5 pF

-20゜ C C ～ +70゜
-20゜ C
TCXO
VCTCXO
MCF
6
List of products
CRYSTAL CLOCK OSCILLATORS STANDARD SMD CRYSTALS
CLK OSC 21SMO Page CLK OSC 22SMO Page CLK OSC 32SMO Page
1.6 2.0 2.5

Package 0.75 0.9 1.0
XTAL
2.0 2.5 3.2
Output CMOS CMOS CMOS

Freq. Stability (overall) ±20 ppm ～ ±100 ppm ±20 ppm ～ ±100 ppm ±20 ppm ～ ±100 ppm
Supply Voltage (VDD) +1.8V ～ +3.3V +1.8V ～ +3.3V +1.8V ～ +3.3V
C ～ +70゜C (Standard) C ～ +70゜C (Standard)
CLK OSC
-20゜ -20゜
C ～ +70゜
-10゜ C (Standard)
C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
-20゜ C (Standard)
C ～ +105゜
-40゜ C (Option) C ～ +105゜
-40゜ C (Option)
C ～ +85゜
-40゜ C (Option)
C ～ +125゜
-40゜ C (Option) C ～ +125゜
-40゜ C (Option)
CLK OSC 21SMOLC Page CLK OSC 22SMOLC Page CLK OSC 32SMOLC Page
1.6 2.0 2.5

Package
0.75 0.9 1.0
2.5 2.5 3.2
VCXO
Supply Voltage (VDD) +1.8V +0.8V ～ +1.5V +0.8V ～ +1.5V
C ～ +70゜
-20゜ C (Standard) C ～ +70゜
-20゜ C (Standard) C ～ +70゜
-20゜ C (Standard)
-40゜ C (Option) C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
CLK OSC 99SMO Page CLK OSC 97SMO Page CLK OSC 22SMOHG Page
TCXO
3.2 5.0 2.0
Package 1.2 1.3 0.9
5.0 7.0 2.5

VCTCXO
C ～ +70゜
-20゜ C (Standard) C ～ +70゜
-20゜ C (Standard)
-40゜ C (Standard)
C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
CLK OSC 32SMOHG Page CLK OSC 99SMOHG Page CLK OSC 97SMOHG Page
MCF
2.5 3.2 5.0

Package
1.0 1.05 1.3
3.2 5.0 7.0


-40゜ C (Standard) C ～ +85゜
-40゜ C (Standard) C ～ +85゜
-40゜ C (Standard)
7
List of products
CRYSTAL CLOCK OSCILLATORS
CLK OSC 97SMOHGU Page CLK OSC 99SMOHGU Page CLK OSC 32SMOHGU Page
5.0 3.2 2.5

Package 1.3 1.05
XTAL
1.0
7.0 5.0 3.2

Frequency 55 MHz ～ 160.000 MHz 55 MHz ～ 160.000 MHz 55 MHz ～ 160.000 MHz
CLK OSC

-40゜ C (Standard) C ～ +85゜
-40゜ C (Standard) C ～ +85゜
-40゜ C (Standard)
CLK OSC 57SMO Page CLK OSC 32SMO-LVP Page CLK OSC 99SMO-LVP Page
5.0 2.5 3.2

Package 1.5 0.9 1.2
7.0 3.2 5.0
Output LVPECL LVPECL LVPECL

VCXO
Supply Voltage (VDD) +2.5V or +3.3V +2.5V or +3.3V +2.5V or +3.3V
C ～ +70゜
-20゜ C (Standard) C ～ +70゜
-20゜ C (Standard) C ～ +70゜
-20゜ C (Standard)
-40゜ C (Option) C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
C ～ +105゜
-40゜ C (Option) C ～ +105゜
-40゜ C (Option) C ～ +105゜
-40゜ C (Option)
CLK OSC 67SMO Page CLK OSC 32SMO-LVD Page CLK OSC 99SMO-LVD Page
TCXO
5.0 2.5 3.2

Package 1.5 0.9 1.2
7.0 3.2 5.0
Output LVDS LVDS LVDS

VCTCXO
C ～ +70゜
-20゜ C (Standard) C ～ +70゜
-20゜ C (Standard) C ～ +70゜
-20゜ C (Standard)
-40゜ C (Option) C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
C ～ +105゜
-40゜ C (Option) C ～ +105゜
-40゜ C (Option) C ～ +105゜
-40゜ C (Option)
CLK OSC 77SMO Page XTAL 32SMO-HCS Page XTAL 99SMO-HCS Page
MCF
5.0 2.5 3.2

Package 0.9
1.5 1.2
7.0 3.2 5.0
Output HCSL HCSL HCSL

C ～ +70゜
-20゜ C (Standard) C ～ +70゜
-20゜ C (Standard) C ～ +70゜
-20゜ C (Standard)
-40゜ C (Option) C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
C ～ +105゜
-40゜ C (Option) C ～ +105゜
-40゜ C (Option) C ～ +105゜
-40゜ C (Option)
8
List of products
CRYSTAL CLOCK OSCILLAORS 32.768 kHz STANDARD SMD CRYSTALS
CLK OSC 327SMO(E) Page CLK OSC 327SMO(J) Page CLK OSC 327SMO(C) Page
2.5 1.5 2.0

Package 0.9
1.0 0.9
XTAL
3.2 3.2 2.5

Freq. Stability +30 ppm ～ -10 ppm at +25゜
C +28 ppm ～ -18 ppm at +25゜
C ±20 ppm ～ ±30 ppm overall
CLK OSC
Input Current 1.5 μA max. 0.8 μA max. 160 μA max.
-40゜ C (Standard) C ～ +85゜
-40゜ C (Standard) C ～ +85゜
-40゜ C (Standard)
CLK OSC 327SMO(D) Page CLK OSC 327SMO(F) Page CLK OSC 327SMO(G) Page
2.5 3.2 5.0

Package 1.0 1.3
1.2
3.2 5.0 7.0
VCXO
Input Current 100 μA max. 80 μA max. 80 μA max.
-40゜ C (Standard) C ～ +85゜
-40゜ C (Standard) C ～ +85゜
-40゜ C (Standard)
TCXO
VCTCXO
MCF
9
List of products
VOLTAGE CONTROLLED CRYSTAL OSCILLATOR
VCXO 22SMOV Page VCXO 32SMOVD Page VCXO 32SMOVF Page
2.0 2.0 2.5

Package
XTAL
0.9 1.0 0.9
2.5 3.2 3.2

Frequency 1.3 MHz ～ 100.000 MHz 1.300 MHz ～ 55.000 MHz 1.250 MHz ～ 62.000 MHz 62.000 MHz ～ 170.000 MHz
Pulling Range ±90 ppm min. ±90 ppm min. ±90 ppm min. ±100 ppm min.
Supply Voltage (VDD) +1.8V ～ +3.3V +1.8V ～ +3.3V +3.3V

CLK OSC
C ～ +70゜
-20゜ C (Standard) C ～ +70゜
-20゜ C (Standard) C ～ +70゜
-20゜ C (Standard)
Ope. Temperature C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
VCXO 99SMOVD Page VCXO 99SMOVF Page VCXO 97SMOVD Page
3.2 3.2 5.0

Package
1.2 1.2 1.7
5.0 5.0 7.0

VCXO

Frequency 1.000 MHz ～ 55.000 MHz 1.000 MHz ～ 62.000 MHz 62.000 MHz ～ 170.000 MHz 1.250 MHz ～ 170.000 MHz
Pulling Range ±110 ppm min. ±110 ppm min. ±100 ppm min. ±100 ppm min.
Supply Voltage (VDD) +1.8V ～ +3.3V +3.3V +3.3V
C ～ +70゜
-20゜ C (Standard) C ～ +70゜
-20゜ C (Standard) C ～ +70゜
-20゜ C (Standard)
-40゜ C (Option) C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
TCXO
VCXO 97SMOVH Page VCXO 57SMOVH Page VCXO 55SMOVH Page
5.0 5.0 3.2

Package
1.6 1.5 1.2
7.0 7.0 5.0
Output CMOS LVPECL LVPECL

VCTCXO
Pulling Range ±100 ppm min. ±80 ppm min. ±80 ppm min.
Supply Voltage (VDD) +3.3V +3.3V +3.3V

C ～ +70゜
-20゜ C (Standard)
C ～ +70゜
-20゜ C (Standard) C ～ +70゜
-20゜ C (Standard)
-40゜ C (Option)
C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
C ～ +105゜
-40゜ C (Option)
VCXO 53SMOVH Page VCXO 67SMOVH Page VCXO 65SMOVH Page

MCF
2.5 5.0 3.2

Package
0.9 1.7 1.2
3.2 7.0 5.0
Output LVPECL LVDS LVDS

Pulling Range ±70 ppm min. ±80 ppm min. ±80 ppm min.
Supply Voltage (VDD) +3.3V +2.5V or +3.3V +2.5V or +3.3V
C ～ +70゜
-20゜ C (Standard)
C ～ +70゜
-20゜ C (Standard) C ～ +70゜
-20゜ C (Standard)
-40゜ C (Option)
C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
C ～ +105゜
-40゜ C (Option)
10
VCXO 63SMOVH Page
2.5
Package
XTAL
0.9
3.2
Output LVDS
Freq. Stability (overall) ±20 ppm ～ ±50 ppm
Pulling Range ±70 ppm min.
Supply Voltage (VDD) +3.3V
CLK OSC
C ～ +70゜
-20゜ C (Standard)
Ope. Temperature
C ～ +85゜
-40゜ C (Option)
VCXO
TCXO
VCTCXO
MCF
11
List of products
TEMPERATURE COMPENSATED CRSYTAL OSCILLATORS
TCXO SXO-1612 Page VC-TCXO SXO-1612V Page TCXO SXO-1612HG Page

Vcontrol
1.25 1.25 1.25
Package
XTAL
0.6 0.6 0.6
1.65 1.65 1.65
Output CLIPPED SINE CLIPPED SINE CLIPPED SINE

Freq. Stability / O.T. ±2.0 ppm ±2.0 ppm ±0.5 ppm
C ～ +85゜
-30゜ C (Standard) C ～ +85゜
-30゜ C (Standard) C ～ +85゜
-30゜ C (Standard)
Ope. Temperature (O.T.)
CLK OSC
C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
Voltage Control (VDD) n.a. ±8.0 ppm ～ ±15 ppm (1/2 VDD ±0.8V or ±1V) n.a.
VC-TCXO SXO-1612HGV Page TCXO SXO-2016 Page VC-TCXO SXO-2016V Page

Vcontrol Vcontrol
1.25 1.6 1.6
Package
0.6 0.7 0.7
1.65 2.0 2.0

VCXO

C ～ +85゜
-30゜ C (Standard) C ～ +85゜
-30゜ C (Standard) C ～ +85゜
-30゜ C (Standard)
C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
Voltage Control (VDD) ±8.0 ppm ～ ±15 ppm (1/2 VDD ±0.8V or ±1V) n.a. ±8.0 ppm ～ ±15 ppm (1/2 VDD ±0.8V or ±1V)
TCXO
TCXO SXO-2016HG Page VC-TCXO SXO-2016HGV Page TCXO SXO-2016ED Page

Vcontrol E/D control
1.6 1.6 1.6
Package
0.7 0.7 0.7
2.0 2.0 2.0

VCTCXO

C ～ +85゜
-30゜ C (Standard) C ～ +85゜
-30゜ C (Standard) C ～ +85゜
-30゜ C (Standard)
C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
TCXO SXO-2016HGED Page TCXO SXO-2200 Page VC-TCXO SXO-2200V Page

E/D control Vcontrol
MCF
1.6 2.0 2.0

Package
0.7 0.8 0.8
2.0 2.5 2.5

C ～ +85゜
-30゜ C (Standard) C ～ +85゜
-30゜ C (Standard) C ～ +85゜
-30゜ C (Standard)
C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
Voltage Control (VDD) n.a. n.a. ±8.0 ppm ～ ±15 ppm (1/2 VDD ±0.8V or ±1V)
12
TCXO SXO-2200HG Page VC-TCXO SXO-2200HGV Page TCXO SXO-2200HGED Page

Vcontrol E/D control
2.0 2.0 2.0
Package
XTAL
0.8 0.8 0.8
2.5 2.5 2.5

C ～ +85゜
-30゜ C (Standard) C ～ +85゜
-30゜ C (Standard) C ～ +85゜
-30゜ C (Standard)
CLK OSC
C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
VC-TCXO SXO-2200HGEDV Page TCXO SXO-3200 Page VC-TCXO SXO-3200V Page

E/D contro + Vcontroll Vcontrol
2.0 2.5 2.5
Package
0.8 0.9 0.9
2.5 3.2 3.2
VCXO
C ～ +85゜
-30゜ C (Standard) C ～ +75゜
-30゜ C (Standard) C ～ +75゜
-30゜ C (Standard)
C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
Voltage Control (VDD) ±8.0 ppm ～ ±15 ppm (1/2 VDD ±0.8V or ±1V) n.a. ±8.0 ppm ～ ±15 ppm (1/2 VDD ±1V)
TCXO
TCXO SXO-3200HG Page VC-TCXO SXO-3200HGV Page TCXO SXO-5200 Page
Vcontrol
2.5 2.5 3.2
Package
0.9 0.9 1.05
3.2 3.2 5.0

VCTCXO
C ～ +85゜
-30゜ C (Standard) C ～ +85゜
-30゜ C (Standard) C ～ +75゜
-30゜ C (Standard)
C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
VC-TCXO SXO-5200V Page TCXO SXO-7100 Page VC-TCXO SXO-7100V Page

Vcontrol Vcontrol
5.0
MCF
3.2 5.0
Package 1.65
1.05 1.65
7.0 7.0
5.0

C ～ +75゜
-30゜ C (Standard) C ～ +75゜
-30゜ C (Standard) C ～ +85゜
-30゜ C (Standard)
C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
Voltage Control (VDD) ±8.0 ppm min. (±1.5V ±1V) n.a. ±8.0 ppm min. (±1.5V ±1V)
13
List of products
TCXO SXO-2520 Page TCXO SXO-3225 Page TCXO SXO-5032 Page

2.0 2.5 3.2
Package 0.9 1.0 1.05

XTAL
2.5 3.2 5.0

C ～ +85゜
-30゜ C (Standard) C ～ +85゜
-30゜ C (Standard) C ～ +75゜
-30゜ C (Standard)
CLK OSC
C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
Voltage Control (VDD) n.a. n.a. n.a.
TCXO SXO-7050 Page TCXO SXO-4053CS Page VC-TCXO SXO-4053CSV Page

Vcontrol
5.0 3.2 3.2
Package
1.3 1.5 1.5
7.0 5.0 5.0

VCXO
Output CMOS CLIPPED SINE CLIPPED SINE

Freq. Stability / O.T. ±2.5 ppm ±0.5 ppm ～ ±2.5 ppm ±0.5 ppm ～ ±2.5 ppm
C ～ +75゜
-30゜ C (Standard) C ～ +75゜
-30゜ C (Standard)
C ～ +85゜
-30゜ C (Standard)
-30゜ C (Standard) C ～ +85゜
-30゜ C (Standard)
C ～ +85゜
-40゜ C (Option)
C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
TCXO
TCXO SXO-4053CSED Page TCXO SXO-4053CM Page VC-TCXO SXO-4053CMV Page

3.2 3.2 3.2
Package
1.5 1.5 1.5
5.0 5.0 5.0
Output CLIPPED SINE CMOS CMOS

VCTCXO
Freq. Stability / O.T. ±0.5 ppm ～ ±2.5 ppm ±0.5 ppm ～ ±2.5 ppm ±0.5 ppm ～ ±2.5 ppm
C ～ +75゜
-30゜ C (Standard) C ～ +75゜
-30゜ C (Standard) C ～ +75゜
-30゜ C (Standard)
-30゜ C (Standard) C ～ +85゜
-30゜ C (Standard) C ～ +85゜
-30゜ C (Standard)
C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
TCXO SXO-4053CMED Page TCXO SXO-4075CS Page VC-TCXO SXO-4075CSV Page

MCF
3.2 5.0 5.0

Package
1.5 1.6 1.6
5.0 7.0 7.0

C ～ +75゜
-30゜ C (Standard) C ～ +75゜
-30゜ C (Standard) C ～ +75゜
-30゜ C (Standard)
-30゜ C (Standard) C ～ +85゜
-30゜ C (Standard) C ～ +85゜
-30゜ C (Standard)
C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
Voltage Control (VDD) n.a. n.a. ±9.0 ppm ～ ±15 ppm (1/2 VDD ±0.8V or 1V)
14
TEMPERATURE COMPENSATED CRSYTAL OSCILLATORS STANDARD SMD CRYSTALS
TCXO SXO-4075CM Page VC-TCXO SXO-4075CMV Page TCXO SXO-9000C-CS Page

Vcontrol
5.0 5.0 5.0
Package
XTAL
1.6 1.6 1.7
7.0 7.0 7.0
Output CMOS CMOS CLIPPED SINE

Frequency 10.000 MHz ～ 40.000 MHz 10.000 MHz ～ 40.000 MHz 10 MHz ～ 40.000 MHz
C ～ +75゜
-30゜ C (Standard) C ～ +75゜
-30゜ C (Standard)
C ～ +70゜
-10゜ C (Standard)
C (Standard) C ～ +85゜
C (Standard)
CLK OSC
-30゜ -30゜
C ～ +85゜
-40゜ C (Standard)
C ～ +85゜
-40゜ C (Option) C ～ +85゜
-40゜ C (Option)
VC-TCXO SXO-9000C-CSV Page TCXO SXO-9000C-CM Page VC-TCXO SXO-9000C-CMV Page

Vcontrol Vcontrol
5.0 5.0 5.0
Package
1.7 1.7 1.7
7.0 7.0 7.0
VCXO
Output CLIPPED SINE CMOS CMOS
C ～ +70゜
-10゜ C (Standard) C ～ +70゜
-10゜ C (Standard) C ～ +70゜
-10゜ C (Standard)
C ～ +85゜
-40゜ C (Standard) C ～ +85゜
-40゜ C (Standard) C ～ +85゜
-40゜ C (Standard)
Voltage Control (VDD) ±5.0 ppm ～ ±20 ppm (+1.65V ±1.65V) n.a. ±5.0 ppm ～ ±15 ppm (+1.65V ±1.65)
TCXO
TCXO SXO-9000D-CS Page VC-TCXO SXO-9000D-CSV Page TCXO SXO-9000D-CM Page
Vcontrol
5.0 5.0 5.0
Package
1.7 1.7 1.7
7.0 7.0 7.0
Output CLIPPED SINE CLIPPED SINE CMOS

VCTCXO
C ～ +70゜
-10゜ C (Standard) C ～ +70゜
-10゜ C (Standard) C ～ +70゜
-10゜ C (Standard)
C ～ +85゜
-40゜ C (Standard) C ～ +85゜
-40゜ C (Standard) C ～ +85゜
-40゜ C (Standard)
Voltage Control (VDD) n.a. ±5.0 ppm ～ ±20 ppm (+1.65V ±1.65V) n.a.
VC-TCXO SXO-9000D-CMV Page TCXO SXO-9000E-CS Page VC-TCXO SXO-9000E-CSV Page

Vcontrol Vcontrol
MCF
5.0 3.2 3.2

Package
1.7 1.7 1.7
7.0 5.0 5.0

C ～ +70゜
-10゜ C (Standard) C ～ +70゜
-10゜ C (Standard) C ～ +70゜
-10゜ C (Standard)
C ～ +85゜
-40゜ C (Standard) C ～ +85゜
-40゜ C (Standard) C ～ +85゜
-40゜ C (Standard)
Voltage Control (VDD) ±5.0 ppm ～ ±15 ppm (+1.65V ±1.65V) n.a. ±5.0 ppm ～ ±20 ppm (+1.65V ±1.65V)
15
List of products
TCXO SXO-9000E-CM Page VC-TCXO SXO-9000E-CMV Page

Vcontrol
3.2 3.2
Package
XTAL
1.7 1.7
5.0 5.0
Output CMOS CMOS

Frequency 10 MHz ～ 40.000 MHz 10 MHz ～ 40.000 MHz
Freq. Stability / O.T. ±0.1 ppm ～ ±0.28 ppm ±0.1 ppm ～ ±0.28 ppm
Supply Voltage (VDD) +2.7V ～ +5.5V +2.7V ～ +5.0V
C ～ +70゜
-10゜ C (Standard) C ～ +70゜
-10゜ C (Standard)
CLK OSC
C ～ +85゜
-40゜ C (Standard) C ～ +85゜
-40゜ C (Standard)
Voltage Control (VDD) n.a. ±5.0 ppm ～ ±15 ppm (+1.65V ±1.65V)
VCXO
TCXO
VCTCXO
MCF
16
OVEN CONTROLLED CRYSTAL OSCILLATOR STANDARD SMD CRYSTALS
OCXO SXO-8000K Page

Vcontrol
9.7
Package
XTAL
6.5
14.6
Output CMOS
Freq. Stability / O.T. ±10 ppb ～ ±50 ppb
Supply Voltage (VDD) +3.3V
C ～ +70゜
-20゜ C (Standard)
CLK OSC
C ～ +85゜
-40゜ C (Option)
Voltage Control (VDD) ±5.0 ppm min. (+1.65V ±1.65V)
VCXO
TCXO
VCTCXO
MCF
17
List of products
MONOLITHIC CRYSTAL OSCILLATORS
MCF 96SMF Page MCF 96SMF Page MCF 38SMF Page
5.0 5.0 3.8

Package 0.8
XTAL
1.35 1.0
7.0 7.0 3.8
Frequency (MHz) 14.575 MHz ～ 150.000 MHz 21.400 MHz ～ 90.000 MHz 45 or 46.350 MHz
No. of Pole 2-pole 4-pole 2-pole

CLK OSC
VCXO
TCXO
VCTCXO
MCF
18
Quartz Crystal Units
11SMX STANDARD SMD CRYSTALS
11SMX STANDARD SPECIFICATIONS 11SMX STANDARD FREQUENCIES

Item Specifications Frequency Max. Equivalent
Frequency Designator Series Resistance
XTAL
XTAL
Package type 11SMX MHz Ohms (Ω) ESR
Frequency range 24.000 MHz to 80.000 MHz 24.000000 240 150
Frequency tolerance ±30 ppm at +25゜ C ±3゜C 26.000000 260 150
Temperature stability (referred to +25゜
C) ±30 ppm over -20゜
C to +70゜
C 32.000000 320 100
Load capacitance (CL) 7 pF, Typical 36.000000 360 100
Actual size
Shunt capacitance (C0) 5 pF max.
CLK OSC
CLK OSC
0.0018 gm (wt.) 38.400000 384 80
Drive level (P) 100 μW max. (10 μW for testing) 40.000000 400 80
11SMX
1.6±0.1
Aging ±5 ppm max. at +25゜C ±3゜C per year 48.000000 480 80
#4 #3
Cut / Oscillation mode AT-Cut / Fundamental
Reflow condition C ±10゜
10 seconds max. at +250゜ C
1.2±0.1
#1 #2
PART NUMBERING GUIDE
0.3±0.05
11 M 260 - 7
VCXO
VCXO
Package type Load capacitance (CL)
0.575 0.45 0.575 <Top View>
#1 #2 #4 #3
Circuit calibration condition Frequency designator

0.475
0.475 0.25
Example
#4 #3 #1 #2 SMI Part No. Package Circuit Calibration Condition Frequency

<#2&#4 : Grounded to metal lid>
M = Parallel resonance
SOLDERING PATTERN 11M260-7 11 = 11SMX 260 = 26.000 MHz
CL= 7 pF
TCXO
TCXO
1.05
11S384 11 = 11SMX S = Series resonance 384 = 38.400 MHz

0.65
PACKAGE DATA
0.75
Package
Item 11SMX
0.75
Lid Metal
AT-CUT Base Ceramic
(ppm)
Sealing Seam
OCXO
OCXO
+100
+80
+60
+40
Terminal Tungsten (metalized)
+20
Gold / Nickel
Terminal plating
∆f/f 0
-20
(surface) / (under)
-40
-60
RoHS Compliant (Pb-free)
-80
-100
-45 -30 -15 0 +15 +30 +45 +60 +75 +90 (゜
C)
TYPICAL TEMPERATURE CHARACTERISTICS
MCF
MCF
TAPE SPECIFICATIONS
4.0±0.1
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
D
C
A
M B F
J
A B C D F J L M Reel Dia. Qty/Reel

3000pcs
1.84 1.55 8.0 3.5 4.0 0.5 0.25 0.45 180
(1000pcs)
22 23

Item Specifications Frequency Max. Equivalent
Frequency Designator Series Resistance
XTAL
XTAL
Package type 21SMX MHz Ohms (Ω) ESR
C to +70゜
C 25.000000 250 80
Actual size
CLK OSC
CLK OSC
0.00568 gm (wt.) 27.000000 270 60
21SMX
2.0±0.1
#4 #3
30.000000 300 60
1.6±0.1
32.000000 320 60
#1 #2
PART NUMBERING GUIDE 36.000000 360 60
38.400000 384 60
0.4±0.1
21 M 400 - 8
VCXO
VCXO
40.000000 400 50
0.65 0.7 0.65 <Top View>
#1 #2 #4 #3
Circuit calibration condition Frequency designator 42.000000 420 50

0.55
44.545000 44545 50
0.5
Example
0.55
#4 #3 #1 #2
SMI Part No. Package Circuit Calibration Condition Frequency 48.000000 480 50
<#2 & #4 : Grounded to metal lid>
SOLDERING PATTERN 21M400-8 21 = 21SMX 400 = 40.000 MHz
CL= 8 pF
TCXO
TCXO
1.35
21S270 21 = 21SMX S = Series resonance 270 = 27.000 MHz

0.75
PACKAGE DATA
1.05
Package
Item 21SMX
0.85
Lid Metal
AT-CUT Base Ceramic
(ppm)
OCXO
OCXO
Sealing Seam
+100
+80

+60
+40
+20
Gold / Nickel
∆f/f 0
Terminal plating
-20
(surface) / (under)
-40
-60
-80
-100
-45 -30 -15 0 +15 +30 +45 +60 +75 +90 (゜
C)
MCF
MCF
TAPE SPECIFICATIONS
4.0±0.1
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
D
C
A
M B F
J

3000pcs
2.25 1.85 8.0 3.5 4.0 1.05 0.25 0.65 180
(1000pcs)
24 25

Item Specifications Frequency Frequency Max. Equivalent
Series Resistance
XTAL
XTAL
Package type 22SMX MHz Designator Ohms (Ω) ESR
C to +70゜
C 18.000000 180 80
Actual size
Shunt capacitance (C0) 5 pF max. 20.000000 200 60
CLK OSC
CLK OSC
0.00953 gm (wt.)
22SMX
2.5±0.1
Cut / Oscillation mode AT-Cut / Fundamental 22.579200 2257 60
#4 #3

10 seconds max. at +250゜ C 24.000000 240 60
2.0±0.1
24.545400 2454 60
#1 #2
24.576000 245 60
0.5±0.1
22 M 480 - 8
VCXO
VCXO
25.000000 250 60
0.8 0.8 <Top View>
#1 #2 #4 #3
26.000000 260 60
Circuit calibration condition Frequency designator
0.65
27.000000 270 60
0.7
Example
27.120000 271 60
0.65
#4 0.9 #3 #1 #2 SMI Part No. Package Circuit Calibration Condition Frequency

28.636360 2863636 60
SOLDERING PATTERN 22M480-8 22 = 22SMX 480 = 48.000 MHz 30.000000 300 50
CL= 8 pF
TCXO
TCXO
1.7
22S320 22 = 22SMX S = Series resonance 320 = 32.000 MHz 32.000000 320 50

33.000000 330 50
1.0
PACKAGE DATA
1.3
33.868800 338 50
Package
Item 22SMX 36.000000 360 40
1.2
Lid Metal 38.400000 384 40
AT-CUT Base Ceramic
(ppm) 40.000000 400 40
OCXO
OCXO
+100
+80
Sealing Seam 44.000000 440 40
+60
+40
Terminal Tungsten (metalized) 45.000000 450 40
+20
Gold / Nickel 48.000000 480 40
Terminal plating
(surface) / (under)
∆f/f 0
52.000000 520 40
-20

-40
54.000000 540 40
-60
-80
-100
-45 -30 -15 0 +15 +30 +45 +60 +75 +90 (゜
C) 74.100000 741 40
80.000000 800 40
MCF
MCF
TAPE SPECIFICATIONS
4.0±0.1
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
D
C
A
M B F
J

3000pcs
2.8 2.3 8.0 3.5 4.0 1.05 0.25 0.75 180
(1000pcs)
26 27
32SMX(A) STANDARD SMD CRYSTALS
32SMX(A) STANDARD SPECIFICATIONS 32SMX(A) STANDARD FREQUENCIES

Item Specifications Max. Equivalent Max. Equivalent
Frequency Frequency Series Frequency Frequency Series
XTAL
XTAL
Package type 32SMX(A) MHz Designator Resistance MHz Designator Resistance
Ohms(Ω) ESR Ohms(Ω) ESR
9.843 MHz to 60.000 MHz (Fundamental)
Frequency range 60.000 MHz to 150.000 MHz (3rd overtone) 12.000000 120 100 25.400000 254 50
12.288000 122 100 25.804800 258 50
Frequency tolerance ±30 ppm at +25゜
C ±3゜
C
12.500000 125 100 26.000000 260 50
C to +70゜
C
12.679170 126 100 27.000000 270 50
Actual size 10 pF, Typical (Fundamental)
Load capacitance (CL)
CLK OSC
13.000000 130 80 27.120000 271 50
CLK OSC
0.0165 gm (wt.) Series resonance (3rd overtone)
13.08148 1308 80 27.456000 2745 50
32SMX(A) Shunt capacitance (C0) 5 pF max.
13.500000 135 80 28.224000 2822 50
3.2±0.1
Drive level (P) 100 μW max. (10 μW for testing)
13.560000 1356 80 28.375000 283 50
#4 #3
Aging ±5 ppm max. at +25゜C ±3゜C per year

14.318180 143 80 28.636360 2863636 50
2.5±0.1
AT-Cut / Fundamental / 9.843MHz to 60.000MHz

#1 #2
Cut / Oscillation mode AT-Cut / 3rd overtone / 60.000MHz to 150.000MHz
14.745600 147 80 30.000000 300 50
15.360000 153 80 32.000000 320 50
C ±10゜
0.65±0.1
Reflow condition 10 seconds max. at +250゜ C

16.000000 160 80 32.256000 3225 50
VCXO
VCXO
1.0 1.2 1.0 <Top View>

#1 #2 #4 #3
16.368000 16368 80 32.736000 3273 50
0.9
32 M 130 - 10 (A) 16.369000 16369 80 32.768000 32768 50

0.7
0.9
#4 #3 #1 #2
Package type Package type 16.384000 163 80 33.000000 330 50
Circuit calibration condition Load capacitance (CL) 16.670000 1667 80 33.330000 3333 50
SOLDERING PATTERN
2.3
Frequency designator 16.756990 1675 80 33.333300 333333 50
Example
16.920000 1692 80 33.600000 336 50
1.1
TCXO
TCXO
16.934400 1693 80 33.750000 337 50
SMI Part No. Package Circuit Calibration Condition Frequency
1.9
17.634160 1763 80 33.868800 338 50

32M130-10(A) 32(A) = 32SMX(A) 130 = 13.000 MHz 18.432000 184 80 36.000000 360 50
1.3 CL = 10 pF
18.870000 188 80 36.480000 3648 50
AT-CUT PACKAGE DATA 19.069928 19069928 80 38.000000 380 50
(ppm)
+100 Package
32SMX(A) 19.200000 192 80 38.400000 384 50
+80
Item
+60
Lid Metal 19.440000 194 80 39.000000 390 50
OCXO
OCXO
19.500000 195 80 40.000000 400 50
+40
+20 Base Ceramic
∆f/f 0
19.660800 196 80 40.500000 405 50
-20 Sealing Seam
-40 19.680000 1968 80 40.659300 4065 50
-60 Terminal Tungsten (metalized)
-80 19.800000 198 80 41.000000 410 50
Gold / Nickel
Terminal plating
-100
-45 -30 -15 0 +15 +30 +45 +60 +75 +90 (゜
C) 20.000000 200 50 41.600000 416 50
TYPICAL TEMPERATURE CHARACTERISTICS (surface) / (under)
20.480000 2048 50 44.000000 440 50
TAPE SPECIFICATIONS RoHS Compliant (Pb-free)
20.500000 205 50 48.000000 480 50
MCF
MCF
4.0±0.1
21.948718 2194 50 49.152000 491 50

1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
22.000000 220 50 50.000000 500 50
22.118400 221 50 52.000000 520 50
D
C
A
22.579200 2257 50 54.000000 540 50

M B F
J
23.104000 23104 50 55.466700 5546 50

3.5 2.8 8.0 3.5 4.0 1.05 0.25 1.0 180

3000pcs
(1000pcs) 24.000000 240 50 67.500000 675 140 (3rd OT)
24.190660 2419 50 114.285000 114.285 100 (3rd OT)
24.545400 2454 50 141.302083 141.302 100 (3rd OT)
24.576000 245 50
25.000000 250 50
28 29
53SMX FAMILY STANDARD SMD CRYSTALS
53SMX(B) STANDARD SPECIFICATIONS SOLDERING PATTERN 53SMX STANDARD FREQUENCIES

53SMX(B) & 53SMX(D)
Item Specifications 3.7
Max.
Equivalent
Max.
Equivalent
Max.
Equivalent
Frequency Frequency Frequency Frequency Frequency Frequency
XTAL
XTAL
Package type 53SMX(B) 53SMX(C) 53SMX(D) MHz Designator Series
Resistance MHz Designator Series
Resistance MHz Designator Series
Resistance
1.3
Ohms (Ω) ESR Ohms (Ω) ESR Ohms (Ω) ESR
Frequency range 10.0 MHz to 300.0 MHz 8.0 MHz to 60.0 MHz 8.0 MHz to 50.0 MHz
8.000000 080 300 19.312500 193125 50 40.000000 400 50
2.2
C ±3゜
C 9.000000 090 300 19.440000 194 50 40.500000 405 50
C to +70゜
C 1.6 9.519200 09519 100 19.500000 195 50 41.600000 416 50
Actual size 9.600000 096 100 19.660800 196 50 41.850000 418 50
Load capacitance (CL) 14 pF, Typical 53SMX(C)
0.0238 gm (wt.) 3.8 9.830400 098 100 19.680000 1968 50 42.000000 420 50
Shunt capacitance (C0) 5 pF max. 9.843750 0984 100 19.800000 198 50 44.000000 440 50
53SMX(C) Drive level (P) 100 μW max. (10 μW for testing) 10.000000 100 100 20.000000 200 50 45.000000 450 50
CLK OSC
CLK OSC
2.4
10.178125 1017 100 20.250000 2025 50 45.158400 451 50
Aging ±5 ppm max. at +25゜
C ±3゜
C per year 1.8
11.059200 1105 100 20.480000 2048 50 48.000000 480 50
AT-Cut / Fundamental / 8.000 MHz to 70.000 MHz 11.289600 1128 100 20.500000 205 50 49.152000 491 50
AT-CUT
Cut / Oscillation mode AT-Cut / 3rd overtone / 70.000 MHz to 170.000 MHz (ppm)
12.000000 120 100 20.945000 20945 50 50.000000 500 50
12.272700 1227 100 21.250000 2125 50 52.902500 529 50
AT-Cut / 5th overtone / 170.000 MHz to 300.000 MHz
+100
+80 12.288000 122 100 22.000000 220 50 54.000000 540 50

Actual size Reflow condition C ±10゜
10 seconds max. at +250゜ C +60
12.500000 125 100 22.118400 221 50
+40
12.504000 12504 100 22.168000 2216 50
0.0413 gm (wt.)
+20
∆f/f 0 12.600000 126 100 22.579200 225 50

53SMX(D) -20
12.731930 1273 100 22.579600 225796 50
VCXO
VCXO
53 M 143 - 14 (C) -40
12.800000 128 100 23.104000 23104 50
-60
Package type Package type -80 13.000000 130 100 24.000000 240 50
Circuit calibration condition Load capacitance (CL) -100
-45 -30 -15 0 +15 +30 +45 +60 +75 +90 (゜
C)
13.081480 1308 100 24.288000 242 50
Frequency designator TYPICAL TEMPERATURE CHARACTERISTICS 13.225625 1322562 100 24.504200 24504 50
13.440000 1344 100 24.545450 2454545 50
Example TAPE SPECIFICATIONS 13.500000 135 100 24.553500 2455 50
4.0±0.1
Actual size SMI Part No. Package Circuit Calibration Condition Frequency 13.560000 1356 100 24.576000 245 50
1.75±0.1
∅
L 1.5 +
0
-0 .1
2.0±0.1
14.187500 1418 100 25.000000 250 50
0.0564 gm (wt.) M = Parallel resonance
53M320-16(B) 53(B) = 53SMX(B) 320 = 32.000 MHz 14.296875 1429 100 25.140000 2514 50
TCXO
TCXO
CL = 16 pF
53SMX(B) 14.300000 143 100 25.400000 254 50
D
C
A
53M143-14(C) 53(C) = 53SMX(C) 143 = 14.31818 MHz 14.318180 1431 100 26.000000 260 50
5.0±0.2
CL = 14 pF
#4 #3
14.400000 144 100 26.973100 2697 50
53S184(D) 53(D) = 53SMX(D) S = Series resonance 184 = 18.432 MHz M B F
J
14.745600 147 100 27.000000 270 50
3.2±0.2
53SMX(B) 15.000000 150 50 27.120000 271 50

#1 #2
PACKAGE DATA A
5.4
B
3.5
C
12.0
D
5.5
F
8.0
J
1.6
L
0.25
M
1.0
Reel Dia.
180
Qty/Reel
1000pcs 15.360000 153 50 27.648000 276 50
0.85±0.15
15.600000 156 50 27.820800 2782 50

Package 53SMX(C)
1.2 2.6 1.2 <Top View> Item 53SMX(B) 53SMX(C) 53SMX(D) A B C D F J L M Reel Dia. Qty/Reel 15.968000 159 50 28.224000 282 50
#1 #2 #4 #3
15.974400 1597 50 28.322000 2832 50
OCXO
Lid Metal Ceramic Ceramic 5.5 3.7 12.0 5.5 8.0 1.5 0.3 1.65 180 1000pcs
OCXO
0.9
53SMX(D) 15.978000 15978 50 28.375000 283 50

Base Ceramic Ceramic Ceramic
1.4
A B C D F J L M Reel Dia. Qty/Reel 16.000000 160 50 28.500000 285 50

0.9
#4 #3 #1 #2
Sealing Seam Glass Glass 5.5 3.5 12.0 5.5 8.0 1.5 0.3 1.4 180 1000pcs
16.050000 1605 50 28.636360 2863636 50
Terminal Tungsten (metalized) Tungsten (metalized) Tungsten (metalized) 16.367000 16367 50 28.636363 2863 50
53SMX(C) Gold / Nickel Gold / Nickel Gold / Nickel
16.368000 16368 50 29.491200 294 50
5.0±0.2 Terminal plating (surface) / (under) (surface) / (under) (surface) / (under) 16.369000 16369 50 29.498900 294989 50
16.370000 1637 50 30.000000 300 50
RoHS Compliant (Pb-free) Compliant Compliant
16.384000 163 50 30.080000 3008 50
3.2±0.2
16.500000 165 50 32.000000 320 50

MCF
MCF
Package
53SMX(1.3C)
Height(H)
1.3 mm max.
53SMX(D) 16.670000 1667 50 32.110000 321 50
16.800000 168 50 32.720000 327 50
H
53SMX(1.1C) 1.1 mm max. 5.0±0.2

#4 #3
<53SMX(1.5C)> 16.900000 169 50 32.768000 32768 50
1.3 2.4 1.3
16.920000 1692 50 33.000000 330 50
3.2±0.2
<Top View>
16.934400 1693 50 33.231000 332 50
#1 #2
17.328000 173 50 33.330000 3333 50
2.0
1.1±0.2
17.581400 175 50 33.333000 33333 50

or 1.2 2.6 1.2 <Top View> 17.734475 1773 50 33.750000 3375 50
#1 #2 #4 #3
<53SMX(1.3C)> 18.000000 180 50 33.868800 338 50
0.9
1.0 3.0 1.0

18.414000 1841 50 34.368000 343 50
1.4
<Top View>
18.432000 184 50 35.280000 3528 50

0.9
#4 #3 #1 #2
19.069928 19069928 50 35.328000 353 50
1.4
<#2 & #4 : NC>
19.069929 1906 50 35.468950 354 50

19.200000 192 50 36.000000 360 50
19.312000 193 50 36.864000 368 50
30 31
97SMX(A) STANDARD SPECIFICATIONS SOLDERING PATTERN 97SMX STANDARD FREQUENCIES

97SMX(A) & 97SMX(B)
Item Specifications 4.4 Max. Equivalent Max. Equivalent
XTAL
XTAL
Package type 97SMX(A) 97SMX(B) 97SMX(C) Resistance Resistance
MHz Designator MHz Designator
1.4
Frequency range 9.0 MHz to 150.0 MHz 12.0 MHz to 50.0 MHz 10.0 MHz to 67.0 MHz Ohms(Ω）ESR Ohms(Ω）ESR
2.5
C ±3゜
C 9.84375000 0984 60 19.800000 198 40
1.8 10.000000 100 60 20.000000 200 40
C to +70゜
C
Actual size 97SMX(C) 10.368000 103 60 20.400000 204 40
Load capacitance (CL) 16 pF, Typical 5.3
10.752000 1075 60 20.480000 2048 40
0.0585 gm (wt.)
Shunt capacitance (C0) 5 pF max. 11.059200 1105 50 20.600000 206 40
1.8
97SMX(B) 11.289600 1128 50 20.657500 2065 40
CLK OSC
CLK OSC
Drive level (P) 100 μW max. (10 μW for testing) 1.7

C ±3゜
C per year 11.298000 11298 50 20.945000 20945 40
AT-CUT 12.000000 120 40 21.250000 2125 40
AT-Cut / Fundamental / 9.000 MHz to 54.000 MHz
Cut / Oscillation mode (ppm)
12.288000 122 40 21.700000 217 40
AT-Cut / 3rd overtone / 44.000 MHz to 150.000 MHz +100
12.504000 12504 40 22.000000 220 40
+80

10 seconds max. at +250゜ C +60 12.582910 125 40 22.118400 221 40
Actual size
+40
12.600000 126 40 23.920000 2392 40
+20
∆f/f 0 12.750000 1275 40 24.000000 240 40

0.0531 gm (wt.)
-20
12.779520 1277 40 24.545400 2454 40
97 M 240 - 16 (C) -40
97SMX(C) 12.800000 128 40 24.553500 2455 40
VCXO
VCXO
-60
Package type Package type -80 12.989690 129 40 24.576000 245 40
Circuit calibration condition Load capacitance (CL) -100
-45 -30 -15 0 +15 +30 +45 +60 +75 +90 (゜
C) 13.000000 130 40 25.000000 250 40
Frequency designator TYPICAL TEMPERATURE CHARACTERISTICS
13.248000 132 40 25.488330 2548 40
Example 13.400000 134 40 25.808400 258 40
TAPE SPECIFICATIONS
SMI Part No. Package Circuit Calibration Condition Frequency 4.0±0.1 13.454880 1345 40 26.000000 260 40
13.500000 135 40 26.195833 2619 40
1.75±0.1
∅
Actual size M = Parallel resonance L 1.5 +
0
2.0±0.1
97M120-10(A) 97(A) = 97SMX(A) 120 = 12.000 MHz -0 .1
13.514400 1351 40 27.000000 270 40
CL = 10 pF
0.0549 gm (wt.) 13.560000 1356 40 27.820800 2782 40
97S250(B) 97(B) = 97SMX(B) S = Series resonance 250 = 25.000 MHz
TCXO
TCXO
D
28.636363 2863 40
C
13.567000 13567 40
A
97SMX(A) M = Parallel resonance
97M240-16(C) 97(C) = 97SMX(C) 240 = 24.000 MHz 13.567200 135672 40 28.800000 288 40
6.0±0.2 CL = 16 pF M B F
29.498928 2949892 40
J
#4 #3
13.568750 13568 40
97SMX(A)
PACKAGE DATA 13.700200 137 40 30.000000 300 40
3.5±0.2

6.4 4.0 12.0 5.5 8.0 1.5 0.3 2.0 178 1000pcs 13.824000 138 40 32.000000 320 40
#1 #2
Package 97SMX(A) 97SMX(B) 97SMX(C) 97SMX(B) & 97SMX(C) 14.318180 143 40 32.768000 32768 40
Item
Lid Metal Ceramic Ceramic
14.400000 144 40 33.333300 333333 40
1.0±0.2
6.4 3.9 12.0 5.5 8.0 1.5 0.3 1.5 178 1000pcs
14.725000 14725 40 36.000000 360 40
OCXO
OCXO
1.5 3.0 1.5 <Top View> 14.745600 147 40 38.880000 388 40
Sealing Seam Epoxy Epoxy 39.000000 390 40
#1 #2 #4 #3
14.850000 1485 40
1.0
Terminal Tungsten (metalized) Tungsten (metalized) Tungsten (metalized) 14.900000 149 40 40.000000 400 40
1.5
Gold / Nickel Gold / Nickel Gold / Nickel 15.000000 150 40 44.000000 440 100 (3rd OT)
Terminal plating
1.0
#4 #3 #1 #2 (surface) / (under) (surface) / (under) (surface) / (under) 15.360000 153 40 44.545000 445 100 (3rd OT)
RoHS Compliant (Pb-free) Compliant (Pb-free) Compliant (Pb-free) 15.600000 156 40 48.000000 480 100 (3rd OT)
97SMX(B) 16.000000 160 40 49.152000 491 40
6.0±0.2 97SMX(C) 16.367000 16367 40 50.000000 500 40
52.074000 5207 100 (3rd OT)
#4 #3
16.368000 16368 40
6.0±0.2
MCF
MCF
16.384000 163 40 54.000000 540 40
3.5±0.2
70.933300 7093 100 (3rd OT)

3.5±0.2
16.524800 1652 40
#1 #2
16.800000 168 40 78.587500 7858 100 (3rd OT)
17.792000 1779 40 78.737500 7873 100 (3rd OT)
1.1±0.1
1.2±0.2
18.000000 180 40 78.780000 7878 100 (3rd OT)

1.5 3.0 1.5 <Top View>
18.08000 1808 40 87.395000 8739 100 (3rd OT)
#1 #2 #4 #3 1.0 4.0 1.0
<Top View>
18.414000 1841 40 106.250000 106.25 100 (3rd OT)
1.0
18.432000 184 40 125.000000 125 100 (3rd OT)

1.5
1.4
19.069900 1906 40
1.0
#4 #3 #1 #2
<#2 & #4 : NC> 19.200000 192 40
19.440000 194 40
19.660800 196 40
19.680000 1968 40
32 33
94SMX(B) STANDARD SPECIFICATIONS SOLDERING PATTERN 94SMX STANDARD FREQUENCIES

94SMX(B) & 94SMX(C)
XTAL
XTAL
Package type 94SMX(B) 94SMX(C) 94SMX(D) MHz Designator Resistance MHz Designator Resistance
1.4
Frequency range
Ohms(Ω)ESR Ohms(Ω)ESR
2.5
8.0 MHz to 100.0 MHz 6.0 MHz to 70.0 MHz 6.0 MHz to 70.0 MHz
6.000000 060 80 40.000000 400 50
C ±3゜
C 2.0
6.144000 061 80 45.555000 455 50
C to +70゜
C 94SMX(D)
Actual size 5.8 7.372800 073 80 49.152000 491 50
0.1213 gm (wt.)
Load capacitance (CL) 16 pF, Typical 7.600000 076 80 56.448000 564 80 (3rd OT)
Shunt capacitance (C0) 5 pF max. 8.000000 080 80 56.500000 565 80 (3rd OT)
2.8
94SMX(C) 9.216000 092 80 57.645000 576 80 (3rd OT)
CLK OSC
CLK OSC
Drive level (P) 100 μW max. (10 μW for testing) 1.8
±5 ppm max. at +25゜

9.830400 098 80 61.440000 614 80 (3rd OT)
Aging C ±3゜
C per year
AT-CUT 9.843750 0984 80 64.000000 640 80 (3rd OT)
Cut / Oscillation mode
(ppm)
10.000000 100 60 70.537600 705 80 (3rd OT)
+100
AT-Cut / 3rd overtone / 30.000 MHz to 100.000 MHz +80 10.245000 10245 60 72.303330 723 80 (3rd OT)
10 seconds max. at +250゜ C +60 10.368000 103 60 72.837500 728 80 (3rd OT)
+40
Actual size 11.059200 1105 60 76.210000 762 80 (3rd OT)
+20
∆f/f 0 12.000000 120 60 77.500000 775 80 (3rd OT)

0.1266 gm (wt.) -20
12.288000 122 60 78.555000 7855 80 (3rd OT)
94 M 800 - 16 (D) 3OT -40
94SMX(D) 12.800000 128 60 78.587500 7858 80 (3rd OT)
VCXO
VCXO
-60
Package type Oscillation mode -80 13.000000 130 60 80.000000 800 80 (3rd OT)
Circuit calibration condition Package type -100
-45 -30 -15 0 +15 +30 +45 +60 +75 +90 (゜
C) 13.500000 135 60 80.910000 809 80 (3rd OT)
Frequency designator Load capacitance (CL) TYPICAL TEMPERATURE CHARACTERISTICS
13.560000 1356 60 81.840000 818 80 (3rd OT)
Example TAPE SPECIFICATIONS 13.567200 135672 60 85.250000 852 80 (3rd OT)
4.0±0.1 13.824000 138 60 86.784000 867 80 (3rd OT)
SMI Part No. Package Circuit Calibration Condition Frequency Oscillation mode
14.318180 143 60 94.500000 945 80 (3rd OT)
1.75±0.1
∅
L 1.5 + 2.0±0.1
Actual size 94S945(B)3OT 94(B) = 94SMX(B) S = Series resonance 945 = 94.500 MHz 3OT = 3rd Overtone 0
-0 .1
14.725000 14725 60 100.000000 100.0 80 (3rd OT)
0.1249 gm (wt.) M = Parallel resonance Fundamental 14.745600 147 60
94M160-18(C) 94(C) = 94SMX(C) CL = 18 pF 160 = 16.000 MHz (No indication with P/N)
TCXO
TCXO
D
C
15.360000 153 60
A
94SMX(B) 94M800-16(D)3OT 94(D) = 94SMX(D)
800 = 80.000 MHz 3OT = 3rd Overtone
7.0±0.2 CL = 16 pF M B F
16.000000 160 50
J
#4 (7.5±0.2) #3
16.368000 16368 50
94SMX(B)
PACKAGE DATA 16.384000 163 50
5.0±0.2
Package
7.3 5.3 16.0 7.5 8.0 1.5 0.3 1.9 178 1000pcs 16.670000 1667 50
94SMX(B) 94SMX(C) 94SMX(D) 94SMX(C) & 94SMX(D)
#1 #2 Item 18.000000 180 50
Lid Metal Ceramic Ceramic A
7.4
B C D F J L M Reel Dia. Qty/Reel
18.432000 184 50
1.1±0.2
5.4 16.0 7.5 8.0 1.5 0.3 1.8 178 1000pcs

19.660800 196 50
(7.9)
OCXO
OCXO
1.2 4.6 1.2
<Top View> Sealing Seam Epoxy Epoxy 20.000000 200 50
20.480000 2048 50
0.73
#1 #2 #4 #3
Terminal Tungsten (metalized) Tungsten (metalized) Tungsten (metalized)
20.945000 20945 50
1.0 1.54 1.0
Gold / Nickel Gold / Nickel Gold / Nickel

Terminal plating
(surface) / (under) (surface) / (under) (surface) / (under)
21.245000 2124 50
#4 #3 #1 #2 23.421000 234 50
RoHS Compliant (Pb-free) Compliant (Pb-free) Compliant (Pb-free)
0.73

23.670833 2367 50
94SMX(C) 24.576000 245 50
94SMX(D)
7.0±0.2 7.0±0.2
25.000000 250 50
#4 (7.5±0.2) #3 (7.5±0.2)
27.000000 270 50
MCF
MCF
28.224000 282 50
5.0±0.2
5.0±0.2
28.600000 286 50
#1 #2 28.636363 2863 50
29.498928 2949892 50
1.1±0.2
1.1±0.2
1.25 4.5 1.25 30.000000 300 50

1.2 4.6 1.2
<Top View>
<Top View>
31.914800 319 50
0.73
33.333000 33333 50
1.5
#1 #2 #4 #3
33.553000 335 50
2.0
1.0 1.54 1.0
1.5
35.328000 353 50
#4 #3 #1 #2 35.468950 354 50
0.73
<#2 & #4 : NC>

36.000000 360 50
36.864000 368 50
39.600000 396 50
34 35
93SMX(A) STANDARD SPECIFICATIONS 93SMX STANDARD FREQUENCIES

Specifications
Max. Equivalent Max. Equivalent Max. Equivalent Max. Equivalent Max. Equivalent
Item Frequency
MHz
Frequency
Designator
Series
Resistance
Frequency
MHz
Frequency
Designator
Series
Resistance
Frequency
MHz
Frequency
Designator
Series
Resistance
Frequency
MHz
Frequency
Designator
Series
Resistance
Frequency
MHz
Frequency
Designator
Series
Resistance
XTAL
XTAL
Ohms (Ω) ESR Ohms (Ω) ESR Ohms (Ω) ESR Ohms (Ω) ESR Ohms (Ω) ESR
Package type 93SMX(A) 93SMX(B) 4.000000 040 300 13.500000 135 50 17.258400 1725 50 24.557200 2455 50 35.468800 354688 50
Frequency range 4.000 MHz to 50.000 MHz 4.000 MHz to 8.000 MHz 5.000000 050 250 13.560000 1356 50 17.262700 172 50 24.576000 245 50 35.637500 356 50
5.175000 0517 250 13.564980 13564 50 17.664000 176 50 24.858900 248 50 35.795500 357 50
C ±3゜
C 5.845000 0584 250 13.567178 135671 50 17.734475 1773 50 25.000000 250 50 36.000000 360 50

C to +70゜
C 6.000000 060 250 13.567200 135672 50 18.000000 180 50 25.140000 2514 50 36.200000 362 50
6.750000 0675 250 13.568750 135687 50 18.080000 1808 50 25.670000 2567 50 36.818178 36818178 50
Load capacitance (CL) 16 pF, Typical 7.200000 072 250 13.568800 13568 50 18.105600 181 50 25.804800 258 50 36.818200 368182 50
Actual size
Shunt capacitance (C0) 5 pF max. 7.372800 073 250 13.570300 1357 50 18.300000 183 50 26.000000 260 50 36.864000 3686 50
CLK OSC
CLK OSC
0.1667 gm (wt.) 7.500000 075 250 13.570313 135703 50 18.355000 1835 50 26.800000 268 50 37.500000 375 50
Drive level (P) 300 μW max. (10 μW for testing) 8.000000 080 200 13.574000 13574 50 18.425200 1842 50 26.973050 26973 50 38.000000 380 50
93SMX(B)
C ±3゜
C per year 8.192000 08192 200 13.575600 13575 50 18.432000 184 50 26.973100 2697 50 38.035000 3803 50
8.664000 086 200 13.575630 135756 50 18.437500 18437 50 26.980000 2698 50 38.352000 3835 50
Cut / Oscillation mode AT-Cut / Fundamental 9.000000 090 200 13.577000 13577 50 18.544000 18544 50 27.000000 270 50 38.400000 384 50

10 seconds max. at +250゜ C 9.185183 091 200 13.577400 135774 50 18.937500 1893 50 27.120000 271 50 40.000000 400 50
9.216000 092 200 13.577500 135775 50 19.000000 190 50 27.500000 275 50 40.190000 401 50
PART NUMBERING GUIDE 9.509375

9.510000
095
0951
120
120
13.580000
13.580600
1358
135806
50
50
19.069920
19.069929
1906992
19069929
50
50
27.700000
27.823900
277
27823
50
50
40.320000
40.500000
403
405
50
50
93 M 100 - 16 (A) 9.830400 098 120 13.580625 1358062 50 19.138600 1913 50 27.870000 2787 50 40.737600 407 50
VCXO
VCXO
9.843750 0984 120 13.585500 13585 50 19.170000 1917 50 28.000000 280 50 41.600000 416 50
Package type Package type 9.845310 09845 120 13.750000 1375 50 19.176000 19176 50 28.125000 281 50 42.954540 4295 50
Actual size
Circuit calibration condition Load capacitance (CL) 9.859380 0985 120 13.824000 138 50 19.200000 192 50 28.224000 282 50
0.208 gm (wt.) Frequency designator 9.861818 098618 120 13.912800 139 50 19.247000 1924 50 28.244000 2824 50
9.861820 09861 120 14.000000 140 50 19.260000 1926 50 28.322000 2832 50
93SMX(A) Example 9.864375 0986437 120 14.129688 1412 50 19.390000 193 50 28.350000 2835 50
8.0±0.2
9.864380 09864 120 14.187500 1418 50 19.500000 195 50 28.375000 283 50
SMI Part No. Package Circuit Calibration Condition Frequency
9.874380 0987 120 14.237500 1423 50 19.660800 196 50 28.496100 284 50
M = Parallel resonance 10.000000 100 100 14.250000 142 50 19.670000 1967 50 28.500000 285 50
93M100-16(A) 93 = 93SMX 100 = 10.000 MHz
4.5±0.2
TCXO
TCXO
CL = 16 pF 10.000500 100005 100 14.264000 1426 50 19.687500 19687 50 28.604900 28604 50
10.178000 1017 100 14.284800 1428 50 19.800000 198 50 28.625000 2862 50
93S360(A) 93 = 93SMX S = Series resonance 360 = 36.000 MHz
10.178125 101781 100 14.318180 143 50 19.968000 199 50 28.636363 2863 50
1.8±0.2
M = Parallel resonance 10.250000 1025 100 14.464063 1446 50 19.990000 1999 50 28.724000 287 50
93M040-8(B) 93(B) = 93SMX(B) 040 = 4.000 MHz
1.5 5.0 1.5 CL =8 pF 10.260000 1026 100 14.721000 1472 50 19.993700 19993 50 28.900000 289 50
<Top View>
11.000000 110 100 14.745600 147 50 20.000000 200 50 29.000000 290 50
PACKAGE DATA
1.5
11.059200 1105 100 14.750000 1475 50 20.250000 2025 50 29.491200 294 50

2.0
11.150000 1115 100 15.000000 150 50 20.480000 2048 50 29.498900 294989 50

Package
93SMX(A) 93SMX(B)
1.5
11.250000 1125 100 15.360000 153 50 20.499800 2049 50 29.498928 2949892 50

OCXO
OCXO
Item
93SMX(B) Lid Ceramic Ceramic 11.289600 1128 100 15.954500 1595 50 20.500000 205 50 29.700000 297 50
8.0±0.2 11.298000 11298 100 15.968000 1596 50 20.736000 2073 50 30.000000 300 50
Base Ceramic Ceramic 11.894400 11894 100 15.974400 1597 50 20.945000 20945 50 30.275000 3027 50
11.895100 11895 100 15.992000 1599 50 21.000000 210 50 30.720000 307 50
Sealing Glass Glass
4.5±0.2
11.895104 118951 100 16.000000 160 50 21.047200 2104 50 31.000000 310 50

Terminal Tungsten (metalized) Tungsten (metalized) 11.968000 1196 100 16.069900 1606 50 21.047236 21047 50 31.104000 31104 50
11.980800 1198 100 16.110000 1611 50 21.120000 211 50 31.400000 314 50
Gold / Nickel Gold / Nickel
2.0±0.2
Terminal plating 11.995200 1199 100 16.128000 1612 50 21.213000 2121 50 31.948800 31948 50
3.7 0.6 3.7 (surface) / (under) (surface) / (under)
<Top View> 12.000000 120 80 16.200000 162 50 21.250000 2125 50 31.987500 3198 50
RoHS Compliant Compliant
MCF
MCF
12.288000 122 80 16.384000 163 50 21.477270 2147 50 32.000000 320 50
1.5
12.331800 1233 80 16.500000 165 50 21.544400 215 50 32.223200 3222 50

1.4
1.5
AT-CUT TAPE SPECIFICATIONS 12.500000 125 80 16.647300 1664 50 21.544415 2154 50 32.720000 327 50
(ppm) 4.0±0.1 12.580000 1258 80 16.656000 1665 50 21.667000 216 50 32.768000 32768 50
SOLDERING PATTERN
1.75±0.1
+100
L
∅
1.5 +
0
2.0±0.1 13.000000 130 50 16.666000 1666 50 22.118400 221 50 33.000000 330 50
93SMX(A) +80 -0 .1
13.083600 130836 50 16.667000 166 50 22.450000 224 50 33.145300 331 50
6.6 +60
+40 13.083840 1308384 50 16.670000 1667 50 22.579200 2257 50 33.231000 332 50

D
+20
13.125000 1312 50 16.777000 1677 50 22.909088 229 50 33.333000 33333 50
A
2.8
∆f/f 0
13.225000 13225 50 16.777200 167 50 23.000000 230 50 33.333333 33333333 50
-20
2.4 M B F
13.225600 132256 50 16.900000 169 50 23.040000 2304 50 33.528000 3352 50
J
-40
93SMX(B) -60 A B C D F J L M Reel Dia. Qty/Reel
13.225625 1322562 50 16.915000 1691 50 24.000000 240 50 33.868800 338 50
4.7 8.4 4.8 16.0 7.5 8.0 1.5 0.3 2.0 330 1000pcs
-80
13.333300 133333 50 16.920000 1692 50 24.000100 240001 50 34.560000 345 50
-100
-45 -30 -15 0 +15 +30 +45 +60 +75 +90 (゜
C) 13.333333 13333333 50 16.934400 1693 50 24.545400 245454 50 35.328000 3532 50
1.6

4.3 13.400000 134 50 17.177600 171 50 24.545454 24545454 50 35.468750 354687 50
36 37
92SMX(CN) STANDARD SPECIFICATIONS SOLDERING PATTERN 92SMX STANDARD FREQUENCIES

92SMX(CN)
XTAL
XTAL
Package type 92SMX(CN) 92SMX(D)* MHz Designator Resistance MHz Designator Resistance
2.1
Frequency range 3.579545 MHz to 30.0 MHz 3.579545 MHz to 40.0 MHz
3.579545 035 200 24.000000 240 50
4.1
C ±3゜
C 3.648000 0364 200 24.576000 245 50
C to +70゜
C 2.4 3.686400 0368 200 25.000000 250 40
92SMX(D) 4.000000 040 150 26.540000 2654 40
Load capacitance (CL) 16 pF, Typical 5.0 4.032000 0403 150 27.000000 270 40
Actual size
Shunt capacitance (C0) 5 pF max. 4.096000 0409 150 28.636363 2863 40
CLK OSC
CLK OSC
0.2568 gm (wt.)
1.8
4.194304 041 150 29.491200 294 40
3.2
92SMX(D) 4.433619 044 150 30.000000 300 40
C ±3゜
C per year 4.800000 048 150 32.000000 320 40
2.6
Cut / Oscillation mode AT-Cut / Fundamental 4.915200 049 150 33.000000 330 40
AT-CUT 5.000000 050 150 35.468950 354 40
10 seconds max. at +250゜ C (ppm) 5.333000 05333 150 36.864000 368 40
* F or m er ly 49S MX- C B( N ) +100
+80
5.699623 056 150 37.745000 377 40
6.000000 060 100 39.000000 390 40
PART NUMBERING GUIDE +60
+40
6.144000 061 100 40.000000 400 40
VCXO
VCXO
+20
92 M 040 - 16 (CN) ∆f/f 0
6.176000 0617 100
7.372800 073 100
Package type Package type
-20
Actual size
-40
7.600000 076 100
0.2355 gm (wt.) Circuit calibration condition Load capacitance (CL) -60
7.680000 0768 100
-80
92SMX(CN) Frequency designator -100

-45 -30 -15 0 +15 +30 +45 +60 +75 +90 (゜
C) 8.000000 080 100
11.8±0.2
Example
8.192000 08192 100
#4 #3
8.400000 084 100
SMI Part No. Package Circuit Calibration Condition Frequency TAPE SPECIFICATIONS
5.5±0.2
9.000000 090 100

TCXO
TCXO
4.0±0.1
M = Parallel resonance 9.216000 092 100

92M040-16(CN) 92(CN) = 92SMX(CN) 040 = 4.000 MHz
1.75±0.1
#1 #2 ∅
L 1.5 + 2.0±0.1
CL = 16pF
0
-0 .1
Package Height (H) Sealing RoHS 9.600000 096 100
9.830400 098 100
Compliant
92SMX(1.5C) 1.5±0.1mm max. Epoxy (Pb-free)
H
92SMX(1.8C) 1.8±0.2mm max. Glass Compliant

92M060-20(D) 92(D) = 92SMX(D) 060 = 6.000 MHz
D
CL = 20pF 10.000000 100 80
C
A
2.0 3.0 2.0
<Top View>
10.202000 102 80
1.5
#1 #2 #4 #3
PACKAGE DATA
M B F
10.245000 10245 80
J
92SMX(CN)
2.5
11.059200 1105 80
#4 5.08 #3 #1 #2
Package
92SMX(CN) 92SMX(D) A B C D F J L M Reel Dia. Qty/Reel
12.000000 120 80
1.5
Item 12.2 5.8 24.0 11.5 12.0

-
0.3 2.0 330
2000pcs
OCXO
OCXO
(2.1) 1000pcs
Lid / Cover Ceramic Metal 12.288000 122 80
92SMX(D) 92SMX(D)
13.000000 130 80
11.0 max. Base Ceramic Glass on Metal A
11.3
B
5.3
C
24.0
D
11.5
F
12.0
J
1.7
L
0.3
M
2.7
Reel Dia.
330
Qty/Reel
1000pcs 13.248000 132 80
Insulator n.a. n.a. 13.500000 135 80
5.0 max.
Sealing See drawing Resistance 14.000000 140 50

14.318180 143 50
2.1 max.
Terminal Tungsten (metalized) Alloy (FeNiCo)

14.400000 144 50
Gold / Nickel Gold / Nickel 14.745600 147 50
2.0 3.0 2.0
Terminal plating
<Top View>
(surface) / (under) (surface) / (under)
1.0
MCF
MCF
15.000000 150 50
RoHS Compliant (Pb-free) Compliant (Pb-free)
1.8
15.360000 153 50
16.000000 160 50
1.0
5.0
16.384000 163 50
17.700000 177 50
17.734475 1773 50
18.000000 180 50
18.432000 184 50
19.660800 196 50
20.000000 200 50
20.480000 2048 50
22.118400 221 50
23.000000 230 50
38 39
86SMX(LPN) STANDARD SPECIFICATIONS AT-CUT 86SMX STANDARD FREQUENCIES

(ppm)
Item Specifications +100
+80
Max. Equivalent Max. Equivalent
XTAL
XTAL
Package type 86SMX(LPN) 86SMX(CSM) +60
MHz Designator Resistance MHz Designator Resistance
+40
Frequency range 3.579545 MHz to 32.000 MHz +20
∆f/f 0 3.579545 035 200 18.543000 18543 50

C ±3゜ C -20
3.600000 036 200 19.200000 192 50
-40
Actual size
C to +70゜
C -60
3.686400 0368 200 19.660800 196 50
0.344 gm (wt.) -80 4.000000 040 150 20.000000 200 40
Load capacitance (CL) 16 pF, Typical -100
-45 -30 -15 0 +15 +30 +45 +60 +75 +90 (゜
C) 4.032000 0403 150 20.480000 2048 40
86SMX(CSM) Shunt capacitance (C0) 5 pF max. TYPICAL TEMPERATURE CHARACTERISTICS
4.096000 0409 150 20.940000 2094 40
CLK OSC
CLK OSC
4.194304 041 150 21.425660 214 40
Drive level (P) 100 μW max. (10 μW for testing) TAPE SPECIFICATIONS
4.433619 044 150 22.118400 221 40
±5 ppm max. at +25゜C ±3゜
4.0±0.1
Aging C per year 4.608000 046 150 23.438000 234 40
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
Cut / Oscillation mode AT-Cut / Fundamental 4.800000 048 150 23.961600 239 40
4.915200 049 150 24.000000 240 40
Reflow condition 10 seconds max. at +250゜
C ±10゜
C
D
5.000000 050 120 24.576000 245 40
C
A
Actual size
5.068800 0506 120 25.000000 250 40
0.6703 gm (wt.) PART NUMBERING GUIDE M B F
J
5.120000 0512 120 27.000000 270 40
86SMX(LPN)
86SMX(LPN) 86 M 0368 -16 (LPN) 5.256200 0525 120 28.224000 282 40
VCXO
VCXO
12.4±0.1 12.8 4.8 24.0 11.5 12.0 2.2 0.4 3.9 330 1000pcs 6.000000 060 100 29.491200 294 40
#4 #3 Package type Package type 86SMX(CSM) 6.144000 061 100 30.000000 300 40
Circuit calibration condition Load capacitance (CL)
4.3±0.3

6.400000 064 100 32.000000 320 40
Frequency designator
13.1 5.3 24.0 11.5 12.0 2.2 0.4 5.4 300 1000pcs
#1 #2
6.650000 0665 100
7.372800 073 80
3.6±0.1
Example
7.441400 074 80
0.8 0.8
<Top View> SMI Part No. Package Circuit Calibration Condition Frequency 7.621000 0762 80
7.680000 0768 80
#1 #2 #4 #3
TCXO
TCXO
86M0368-16(LPN) 86(LPN) = 86SMX(LPN) 0368 = 3.68640 MHz 8.000000 080 80
CL = 16pF
#4
9.4
#3 #1 #2
8.192000 08192 80
<#2 & #3 : NC>
86M073-18(CSM) 86(CSM) = 86SMX(CSM) 073 = 7.37280 MHz 9.216000 092 60
86SMX(CSM) CL = 18pF
9.537500 095 60
12.8 max.
9.600000 096 60
#4 #3
PACKAGE DATA 9.830400 098 60
5.1 max.
#2 #1
Package
86SMX(LPN) 86SMX(CSM) 10.000000 100 60
Item
10.240000 1024 60
Outer Package /
OCXO
OCXO
Package Height(H)
86SMX(5.1CSM) 5.1 mm max.
Plastic Metal 10.752000 1075 60
H
Cover
86SMX(4.2CSM) 4.2 mm max.
<Top View> 11.000000 110 60

1.3 1.3
Base n.a. Metal
1.2
#1 #2 #4 #3
11.059200 1105 60
2.7 max.
12.000000 120 60
Insulator n.a. 46 nylon
#4
9.0
#3 #1 #2
12.288000 122 60
1.2
<#2 & #3 : NC>

Press-fit 12.296000 1229 60
Sealing Resistance
SOLDERING PATTERN (3x10mm built-in) 12.800000 128 60
86SMX(LPN) Terminal lead frame 42 alloy 42 alloy 13.105000 131 50
9.4
13.500000 135 50
Tin / Nickel
MCF
MCF
Terminal plating Tin 13.560000 1356 50
(surface) / (under)
1.8
14.250000 142 50
3.5
RoHS Compliant Compliant (Pb-free) 14.318180 143 50

1.8
14.745600 147 50
86SMX(CSM) 15.000000 150 50
2.2
15.360000 153 50
16.000000 160 50
1.8
16.384000 163 50
3.5
16.588000 1658 50
9.0 16.667000 166 50
16.934400 1693 50
17.734475 1773 50
18.432000 184 50
40 41
LB FAMILY STANDARD SMD CRYSTALS
4HLB STANDARD SPECIFICATIONS AT-CUT LB STANDARD FREQUENCIES

(ppm)
Item Specifications +100 Max.

Equivalent
Max.
Equivalent
Max.
Equivalent
+80 Frequency Frequency Frequency Frequency Frequency Frequency
Series Series Series
Package type 4HLB 3HLB 25HLB
XTAL
XTAL
+60
MHz Designator Resistance MHz Designator Resistance MHz Designator Resistance
+40

3.579545 035 200 13.410000 1341 50 30.800000 308 40
0 3.580000 0358 200 13.500000 135 50 31.708000 317 40
±50 ppm at +25゜
C ±3゜
∆f/f
Frequency tolerance C -20 3.648000 0364 200 13.544375 1354 50 32.000000 320 40
-40 3.686400 0368 200 13.560000 1356 50 32.110000 321 40
Actual size ± 50 ppm over -20゜
C to +70゜
C (AT-Cut)
C) ±100 ppm over -10゜
-60 3.840000 0384 200 13.567200 135672 50 32.768000 32768 40
0.5722 gm (wt.) C to +60゜
C (BT-Cut) -80
3.932160 039 200 13.577000 13577 50 33.000000 330 40
-100
4.000000 040 150 14.000000 140 50 33.177600 3317 40
Load capacitance (CL) 18 pF, Typical +90 (゜
-45 -30 -15 0 +15 +30 +45 +60 +75 C)
3HLB TYPICAL TEMPERATURE CHARACTERISTICS 4.032000 0403 150 14.316000 14316 50 33.333000 33333 40
CLK OSC
CLK OSC
BT-CUT 4.194304 041 150 14.400000 144 50 35.468950 354 40
Drive level (P) 100 μW max. (10 μW for testing) (ppm) 4.433000 0443 150 14.580000 1458 50 36.000000 360 40
20
4.433619 044 150 14.745600 147 50 36.864000 368 40
C ±3゜
C per year 0
-20 4.500000 045 150 15.000000 150 50 37.745000 377 40
-40
AT-Cut / Fundamental / 3.579545 MHz to 40.000 MHz -60
4.608000 046 150 15.360000 153 50 38.000000 380 40
-80 4.800000 048 150 15.980000 1598 50 40.000000 400 40
Actual size Cut / Oscillation mode BT-Cut / Fundamental /28.636363 MHz to 54.000 MHz -100
4.906250 04906 150 16.000000 160 50 40.685000 4068 40
∆f/f -120
AT-Cut / 3rd overtone / 26.690000 MHz to 80.000 MHz -140
4.915200 049 150 16.384000 163 50 40.750000 4075 40
0.5434 gm (wt.) -160
-180 5.000000 050 120 16.588000 1658 50 43.391670 4339 40
10 seconds max. at +250゜ C -200
5.089062 0508 120 16.934400 1693 50 45.000000 450 40 (BT-Cut)
25HLB
VCXO
VCXO
-220
-240
-40 -25 -10 +20 +35 +50 +65 +80 +95 +110 (゜
C) 5.333000 05333 120 17.700000 177 50 48.000000 480 40 (BT-Cut)
+5
TYPICAL TEMPERATURE CHARACTERISTICS 5.333333 053 120 17.734470 1773447 50 49.860000 4986 40 (BT-Cut)
5.699623 056 120 17.734475 1773 50 50.000000 500 40 (BT-Cut)
3HLB 1105 - 18 TAPE SPECIFICATIONS 6.000000 060 100 18.000000 180 50 50.032000 50032 40 (BT-Cut)
6.144000 061 100 18.432000 184 50 50.803200 508 40 (BT-Cut)
4.0±0.1
6.176000 0617 100 19.069929 19069929 50 54.000000 540 40 (BT-Cut)
1.75±0.1
∅
L 1.5 + 2.0±0.1
Frequency designator
0
-0 .1 6.480000 0648 100 19.200000 192 50 61.000000 610 40 (BT-Cut)
6.745800 0674 100 19.260000 1926 50
Actual size
Example 6.764300 067643 100 19.312000 193 50
C
A
0.402 gm (wt.) 6.764380 0676 100 19.440000 194 50
TCXO
TCXO
SMI Part No. Package Circuit Calibration Condition Frequency 6.776170 0677 100 19.608000 19608 50
M B F
4HLB Parallel resonance
J
6.783600 0678 100 19.660800 196 50
4HLB400-16 4HLB 400 = 40.00000 MHz
CL = 16pF 4HLB 7.372800 073 80 19.680000 1968 50
12.4±0.3
A B C D F J L M Reel Dia. Qty/Reel 7.500000 075 80 20.000000 200 40

Parallel resonance
4.8±0.1
15.4 5.3 24.0 11.5 12.0 1.7 0.4 4.4 300 1000pcs
7.680000 0768 80 20.250000 2025 40
3HLB1105-18 3HLB 1105 = 11.05920 MHz
CL = 18pF 3HLB & 25HLB 8.000000 080 80 20.250800 202508 40
8.190000 0819 80 20.476000 20476 40
4.2 max.
25HLB360S 25HLB S = Series resonance 360 = 36.00000 MHz 15.4 5.3 24.0 11.5 12.0 1.7 0.4 3.4 300 1000pcs
8.192000 08192 80 20.480000 2048 40
11.4±0.1
8.400000 084 80 20.945000 20945 40
PACKAGE DATA 9.000000 090 60 22.118400 221 40
OCXO
OCXO
9.031600 0903 60 22.425000 22425 40
4.4 Package 9.216000 092 60 22.525000 22525 40
0.65
4HLB 3HLB 25HLB

0.95
Item
9.600000 096 60 22.787500 227875 40
3HLB Cover Metal Metal Metal 9.690900 096909 60 22.887500 22887 40
9.690990 0969099 60 23.000000 230 40
12.4±0.3
Base Metal Metal Metal 9.718750 0971 60 23.600000 236 40
Insulator PPS PPS PPS
4.7±0.1
9.830400 098 60 23.975000 23975 40

9.843750 0984 60 24.000000 240 40
Sealing Resistance Resistance Resistance 10.000000 100 60 24.576000 245 40
3.2max
10.111000 101 60 25.000000 250 40

Terminal lead Alloy (FeNiCo) Alloy (FeNiCo) Alloy (FeNiCo) 10.202000 102 60 26.500000 265 40
MCF
MCF
11.4±0.1
Terminal plating SnCu SnCu SnCu 10.245000 10245 60 26.540000 2654 40
10.368000 103 60 26.800000 268 40
RoHS Compliant (Pb-free) Compliant (Pb-free) Compliant (Pb-free) 10.781200 1078 60 26.998435 26998 40
0.65
0.95
4.4 11.000000 110 60 27.000000 270 40

11.059200 1105 60 27.145000 27145 40
SOLDERING PATTERN
25HLB 11.290000 1129 60 27.586000 2758 40
12.4±0.3 4HLB, 3HLB & 25HLB 12.000000 120 60 28.000000 280 40
9.0
12.270000 1227 60 28.224000 282 40
4.8±0.1
12.288000 122 60 28.636000 28636 40

1.5
12.296000 1229 60 28.636300 286363 40

5.0
2.6 max.
12.334375 12334 60 28.636363 2863 40

11.4±0.1 13.000000 130 50 28.920000 2892 40
13.234370 1323 50 29.000000 290 40
13.248000 132 50 29.491200 294 40
4.4
13.401560 13401 50 29.498900 294989 40
0.65
0.95
13.406250 13406 50 30.000000 300 40
42 43
HC-49/U-2H, HC-49/U-3H & HC-49/U-4H FAMILY STANDARD THROUGH-HOLE CRYSTALS
HC-49/U-2H STANDARD SPECIFICATIONS AT-CUT HC-49/U-2H, 3H & 4H STANDARD FREQUENCIES

(ppm)
Max. Max. Max.
Item Specifications +100
+80 Frequency Frequency Equivalent Frequency Frequency Equivalent Frequency Frequency Equivalent
Series Series Series
XTAL
XTAL
Designator Designator Designator
Holder type HC-49/U-2H, HC-49/U-3H & HC-49/U-4H +60
MHz Resistance MHz Resistance MHz Resistance
+40
3.579545 035 200 13.410000 1341 50 30.800000 308 40
3.580000 0358 200 13.500000 135 50 31.708000 317 40
∆f/f 0

C ±3゜ C -20 3.648000 0364 200 13.544375 1354 50 32.000000 320 40
-40 3.686400 0368 200 13.560000 1356 50 32.110000 321 40
C to +70゜
C -60
3.840000 0384 200 13.567200 135672 50 32.768000 32768 40
-80
3.932160 039 200 13.577000 13577 50 33.000000 330 40
Load capacitance (CL) 16 pF, Typical -100
-45 -30 -15 0 +15 +30 +45 +60 +75 +90 (゜
C) 4.000000 040 150 14.000000 140 50 33.177600 3317 40
Actual size
CLK OSC
CLK OSC
0.336 gm (wt.) 4.096000 0409 150 14.318180 143 50 33.868800 338 40
Drive level (P) 100 μW max. (10 μW for testing) BT-CUT 4.194304 041 150 14.400000 144 50 35.468950 354 40
HC-49/U-3H (ppm) 4.433000 0443 150 14.580000 1458 50 36.000000 360 40
Aging ±5 ppm max. at +25゜C ±3゜C per year 20
4.433619 044 150 14.745600 147 50 36.864000 368 40
0
AT-Cut / Fundamental / 3.579545 MHz to 40.000 MHz -20 4.500000 045 150 15.000000 150 50 37.745000 377 40
-40
4.608000 046 150 15.360000 153 50 38.000000 380 40
Cut / Oscillation mode BT-Cut / Fundamental / 28.636363 MHz to 50.000 MHz
-60
-80 4.800000 048 150 15.980000 1598 50 40.000000 400 40
-100
AT-Cut / 3rd overtone / 26.690000 MHz to 61.000 MHz ∆f/f -120 4.906250 04906 150 16.000000 160 50 40.685000 4068 40 (BT-Cut)
-140
-160
4.915200 049 150 16.384000 163 50 40.750000 4075 40 (BT-Cut)
PART NUMBERING GUIDE 5.000000 050 120 16.588000 1658 50 43.391670 4339 40 (BT-Cut)
-180
-200
5.089062 0508 120 16.934400 1693 50 45.000000 450 40 (BT-Cut)
VCXO
-220
VCXO
-240 5.333000 05333 120 17.700000 177 50 48.000000 480 40 (BT-Cut)
4H 080 -16 -40 -25 -10 +5 +20 +35 +50

+65 +80 +95 +110 (゜
C)
5.333333 053 120 17.734470 1773447 50 49.860000 4986 40 (BT-Cut)

Actual size Holder type Load capacitance (CL) 5.699623 056 120 17.734475 1773 50 50.000000 500 40 (BT-Cut)
6.000000 060 100 18.000000 180 50 50.032000 50032 40 (BT-Cut)
0.4432 gm (wt.) Frequency designator 6.144000 061 100 18.432000 184 50 50.803200 508 40 (BT-Cut)
Example 6.176000 0617 100 19.069929 19069929 50 54.000000 540 40 (BT-Cut)
HC-49/U-4H 6.480000 0648 100 19.200000 192 50 61.000000 610 40 (BT-Cut)
SMI Part No. Holder Circuit Calibration Condition Frequency 6.745800 0674 100 19.260000 1926 50
6.764300 067643 100 19.312000 193 50
Parallel resonance 6.764380 0676 100 19.440000 194 50
2H221-18 2H = HC-49/U-2H 221 = 22.1184 MHz
TCXO
TCXO
CL = 18 pF 6.776170 0677 100 19.608000 19608 50
6.783600 0678 100 19.660800 196 50
3H450S 3H = HC-49/U-3H S = Series resonance 450 = 45.000 MHz 7.372800 073 80 19.680000 1968 50
7.500000 075 80 20.000000 200 40
Parallel resonance
4H080-16 4H = HC-49/U-4H 080 = 8.000 MHz 7.680000 0768 80 20.250000 2025 40
CL = 16 pF 8.000000 080 80 20.250800 202508 40
8.190000 0819 80 20.476000 20476 40
Actual size
HOLDER DATA 8.192000 08192 80 20.480000 2048 40
0.535 gm (wt.) 8.400000 084 80 20.945000 20945 40
Holder 9.000000 090 60 22.118400 221 40
HC-49/U-2H HC-49/U-3H HC-49/U-4H
OCXO
OCXO
HC-49/U-2H Item 9.031600 0903 60 22.425000 22425 40
Cover Metal Metal Metal 9.216000 092 60 22.525000 22525 40
2.1 max.
10.5 max. 3.8 max. 9.600000 096 60 22.787500 227875 40

Base Metal Metal Metal 9.690900 096909 60 22.887500 22887 40
9.690990 0969099 60 23.000000 230 40
Sealing Resistance Resistance Resistance 9.718750 0971 60 23.600000 236 40
12.0 min.
Φ0.43
9.830400 098 60 23.975000 23975 40

Terminal lead Alloy (FeNiCo) Alloy (FeNiCo) Alloy (FeNiCo)
9.843750 0984 60 24.000000 240 40
Terminal plating SnCu SnCu SnCu
4.88
10.000000 100 60 24.576000 245 40
10.111000 101 60 25.000000 250 40
5.0 max.
RoHS Compliant (Pb-free) Compliant (Pb-free) Compliant (Pb-free) 10.202000 102 60 26.500000 265 40
MCF
MCF
11.35 max. 10.245000 10245 60 26.540000 2654 40
HC-49/U-4H 10.368000 103 60 26.800000 268 40
HC-49/U-3H 10.781200 1078 60 26.998435 26998 40
3.5 max.
10.5 max. 3.8 max. 11.000000 110 60 27.000000 270 40

2.5 max.
10.5 max. 3.8 max.

11.059200 1105 60 27.145000 27145 40
11.290000 1129 60 27.586000 2758 40
12.000000 120 60 28.000000 280 40
12.0 min.
Φ0.43
12.0 min.
Φ0.43
12.270000 1227 60 28.224000 282 40
12.288000 122 60 28.636000 28636 40
4.88
4.88 12.296000 1229 60 28.636300 286363 40
12.334375 12334 60 28.636363 2863 40
5.0 max.
5.0 max.
13.000000 130 50 28.920000 2892 40

11.35 max.
11.35 max.
13.234370 1323 50 29.000000 290 40
13.248000 132 50 29.491200 294 40
13.401560 13401 50 29.498900 294989 40
13.406250 13406 50 30.000000 300 40
44 45
UM(MJ) FAMILY STANDARD SMD CRYSTALS
UM-1(MJ) UM-5(MJ) STANDARD SPECIFICATIONS

Item Symbol Specifications
Package type UM-1(MJ), UM-1S(MJ), UM-4(MJ), UM-4S(MJ), UM-5(MJ), UM-5S(MJ)
XTAL
6.000 MHz to 200.000 MHz (UM-1 & UM-1S)

Frequency range F 10.000 MHz to 200.000 MHz (UM-5 & UM-5S)
20.000 MHz to 200.000 MHz (UM-4 & UM-4S)
J : ±5 ppm
Q : ±15 ppm
C ±3゜
Frequency tolerance (at +25゜ C) ∆f/F
O : ±10 ppm
0.41 gm (wt.) 0.336 gm (wt.) R : ±20 ppm
C) T Tiii : ±30 ppm over -20゜ C to +70゜
C
UM-4(MJ) ACTUAL SIZE RRiii : ±20 ppm over -20゜ C to +70゜
C
CLK OSC
Note : Contact for other temperature stabilities QQiii : ±15 ppm over -20゜ C to +70゜
C
UM-1(MJ) and operating temperature ranges. OOiii : ±10 ppm over -20゜ C to +70゜
C
Load capacitance CL 16 pF, Typical
Equivalent series resistance ESR
UM-5(MJ)
UM-1(MJ) & UM-1S(MJ)
Fundamental 3rd overtone 5th overtone
UM-4(MJ) 6 to 10 MHz 10 to 60 MHz 24 to 60 MHz 60 to 180 MHz 80 to 120 MHz 120 to 200 MHz
0.31 gm (wt.) 40 Ω max. 25 Ω max. 60 Ω max. 40 Ω max. 80 Ω max. 70 Ω max.
UM-1(MJ), UM-5(MJ), UM-4(MJ)
VCXO
UM-1S(MJ), UM-5S(MJ), UM-4S(MJ)

10 to 20 MHz 20 to 60 MHz 24 to 30 MHz 30 to 60 MHz 60 to 180 MHz 80 to 120 MHz 120 to 200 MHz
Holder A B H
UM-1(MJ) 7.8±0.2mm 11.5±0.3mm 3.1±0.2mm 30 Ω max. 25 Ω max. 80 Ω max. 60 Ω max. 40 Ω max. 100 Ω max. 80 Ω max.
UM-5(MJ) 5.8±0.2mm 9.7±0.3mm 3.1±0.2mm
UM-4(MJ) 4.4±0.2mm 8.3±0.3mm 3.1±0.2mm
2.0±0.1
UM-1S(MJ) 7.8±0.2mm 11.5±0.3mm 2.8±0.2mm

UM-5S(MJ) 5.8±0.2mm 9.7±0.3mm 2.8±0.2mm
0.35±0.05
3.2 UM-4S(MJ) 4.4±0.2mm 8.3±0.3mm 2.8±0.2mm

A
20 to 60 MHz 60 to 90 MHz 90 to 180 MHz 100 to 200 MHz
2.5±0.3 8.0 max.
30 Ω max. 80 Ω max. 60 Ω max. 100 Ω max.
4.0 max.
Shunt capacitance C0 7.0 pF max.

H
1.5
1.45±0.15
B
1.2±0.2
3.75±0.2 Drive level P 1 mW max. (10 μW for testing)
Aging (for first year) ∆f/F ±3 ppm max. at +25゜
C ±3゜ C per year
TCXO
SOLDERING PATTERN Cut AT-Cut

2.2

2.0
Holder W
0.75
3.75

UM1(MJ) / 12.288M - 16 / Q / TTiii
2.4
10.0
UM-5(MJ) & UM-5S(MJ) 8.0
UM-4(MJ) & UM-4S(MJ) 6.6
W Package type Temperature stability

0.75
Frequency Frequency tolerance

AT-CUT Load capacitance (CL)
OCXO
(ppm)
+100
Example
+80
+60
+40
SMI Part No. Package Circuit Calibration Condition Frequency Frequency Tolerance Temperature Stability
+20 Parallel resonance
UM1(MJ)/12.2880M-16/Q/TTiii UM1(MJ) = UM-1(MJ) 12.288 MHz Q = ±15 ppm TTiii = ±30 ppm
∆f/f 0 CL = 16pF
-20
Parallel resonance
-40
UM5S(MJ)/10.0000M-12/R/OOiii UM5S(MJ) = UM-5S(MJ) 10.000 MHz R = ±20 ppm OOiii = ±10 ppm
-60 CL = 12pF
-80
-100
UM4(MJ)/22.57920M-S/J/QQiii UM4(MJ) = UM-4(MJ) S = Series resonance 22.5792 MHz J = ±5 ppm QQiii = ±15 ppm
-45 -30 -15 0 +15 +30 +45 +60 +75 +90 (゜
C)
PACKAGE DATA
TAPE SPECIFICATIONS Package
MCF
Item UM-1(MJ)/1S(MJ), UM-5(MJ)/5S(MJ) & UM-4(MJ)/4S(MJ)

4.0±0.1
Cover Metal
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
Base Metal
Sealing Resistance
D
Metal clamp C7521R-0

C
A
Tin / Copper
Metal clamp plating
M B F (surface) / (under)
J
UM-1(MJ) & UM-1S(MJ) Terminal lead Alloy (FeNiCo)

Terminal lead plating Gold
12.4 8.2 24.0 11.5 12.0 1.5 0.4 3.3 330 1000pcs
10.6 8.2 24.0 11.5 12.0 1.5 0.4 3.3 330 1000pcs

9.2 8.2 16.0 7.5 12.0 1.5 0.4 3.3 330 1000pcs
46
UM FAMILY STANDARD THROUGH-HOLE CRYSTALS
UM-1 STANDARD SPECIFICATIONS

Holder type UM-1, UM-1S, UM-4, UM-4S, UM-5 & UM-5S
XTAL
1.000 MHz to 1.200 MHz (UM-1)
6.000 MHz to 200.000 MHz (UM-1 & UM-1S)
Frequency range F
10.000 MHz to 200.000 MHz (UM-5 & UM-5S)
20.000 MHz to 200.000 MHz (UM-4 & UM-4S)
Actual size F : ±3 ppm
J : ±5 ppm
0.354 gm (wt.) O : ±10 ppm
C ±3゜
Q : ±15 ppm
UM-5 R : ±20 ppm
CLK OSC
X : ±50 ppm
CC1ggg : ±100 ppm over -10゜ C to +60゜
C
C) TTiii : ± 30 ppm over -20゜ C to +70゜
C
Note : Contact for other temperature stabilities RRiii : ± 20 ppm over -20゜ C to +70゜
C
and operating temperature ranges. QQiii : ± 15 ppm over -20゜ C to +70゜
C
OOiii : ± 10 ppm over -20゜ C to +70゜
C
Actual size Shunt capacitance C0 7.0 pF max.
Drive level P 1 mW max. (10 μW for testing)
0.295 gm (wt.)
±5 ppm max. at +25゜ C ±3゜C per year (SL-Cut)
UM-4 Aging (for first year) ∆f/F ±3 ppm max. at +25゜ C ±3゜C per year (AT-Cut)
VCXO
SL-Cut / 1.000 MHz to 1.200 MHz
Cut
AT-Cut / 6.000 MHz to 200.000 MHz
Frequency UM-1 & 1S UM-5 & 5S UM-4 & 4S
Fundamental 1.000 to 1.200 MHz 5k Ω max. n.a. n.a.
Fundamental 6.000 MHz+ 40 Ω max. n.a. n.a.
Fundamental 10.000 MHz+ 25 Ω max. 30 Ω max. n.a.
Actual size Fundamental 20.000 MHz+ 25 Ω max. 25 Ω max. 30 Ω max.
3rd overtone 24.000 MHz+ 60 Ω max. 80 Ω max. 30 Ω max. (fund.)
0.254 gm (wt.) Equivalent series resistance ESR
3rd overtone 30.000 MHz+ 60 Ω max. 60 Ω max. 30 Ω max. (fund.)
3rd overtone 60.000 MHz+ 40 Ω max. 40 Ω max. 80 Ω max.
TCXO
UM-1, UM-5 & UM-4 5th overtone 80.000 MHz+ 80 Ω max. 100 Ω max. 80 Ω max.
7.1 max. 2.4 max. 5th overtone 90.000 MHz+ 80 Ω max. 100 Ω max. 60 Ω max.
5th overtone 100.000 MHz+ 80 Ω max. 100 Ω max. 100 Ω max.
5th overtone 120.000 MHz+ 70 Ω max. 80 Ω max. 100 Ω max.
H
3.2 max.
7.9 max.
Φ0.3±0.05
15 min.
Holder H
UM-1 8.0 mm max.
UM-5
UM-4
6.0 mm max.
4.5 mm max.
UM1 / 15.360M - 16 / J / OOiii
3.73±0.2 Holder type Temperature stability
OCXO
UM-1S, UM-5S & UM-4S Load capacitance (CL)
7.1 max. 2.0 max.
Example
H
SMI Part No. Holder Circuit Calibration Condition Frequency Frequency Tolerance Temperature Stability
2.7 max.
Parallel resonance
7.9 max. UM1/15.360M-16/J/OOiii UM1 = UM-1 15.360 MHz J = ±5 ppm OOiii = ±10 ppm
CL = 16pF
Φ0.3±0.05
15 min.
Holder H
UM-1 8.0 mm max. Parallel resonance
UM-5 6.0 mm max. UM5S/20.945M-30/Q/QQiii UM5S = UM-5S 20.945 MHz Q = ±15 ppm QQiii = ±15 ppm
UM-4 4.5 mm max. CL = 30pF
Parallel resonance
3.75±0.2
UM4S/21.480M-20/O/RRiii UM4S = UM-4S 21.480 MHz O = ±10 ppm RRiii = ±20 ppm
CL = 20pF
MCF
AT-CUT
(ppm) SL-CUT HOLDER DATA
+100
Holder
+80
Item UM-1/1S, UM-5/5S & UM-4/4S
+60
Cover Metal
+40
+20 Base Metal

∆f/f 0
Sealing Resistance
-20
-40
Terminal lead Alloy (FeNiCo)
-60 Terminal lead plating Gold
RoHS
-80
-100
Compliant (Pb-free)
-45 -30 -15 0 +15 +30 +45 +60 +75 +90 (゜
C)
47
HC-49/U(MJ) & HC-49/UT(MJ) FAMILY STANDARD SMD CRYSTALS
HC-49/U(MJ) & HC-49/UT(MJ) STANDARD SPECIFICATIONS

Package type HC-49 / U(MJ) & HC-49 / UT(MJ)
XTAL
Frequency range F 1.8432 MHz to 200.000 MHz

J : ±5 ppm
O : ±10 ppm
Q : ±15 ppm
C ±3゜
R : ±20 ppm
T : ±30 ppm
X : ±50 ppm
XXggg : ±50 ppm over -10゜ C to +60゜C
Actual size Temperature stability (referred to +25゜
C) TTiii : ±30 ppm over -20゜ C to +70゜C
CLK OSC
1.275 gm (wt.)…HC-49/U(MJ) Note : Contact for other temperature stabilities RRiii : ±20 ppm over -20゜ C to +70゜C
and operating temperature ranges. QQiii : ±15 ppm over -20゜ C to +70゜C
1.13 gm (wt.)…HC-49/UT(MJ) OOiii : ±10 ppm over -20゜ C to +70゜C
HC-49/U(MJ) & HC-49/UT(MJ) Load capacitance CL 20 pF, Typical
Shunt capacitance (Typical) C0 7.0 pF max.
Drive level P 3 mW max.
0.45±0.05
Aging ∆f/F ±5 ppm max. at +25゜ C ±3゜ C per year

Cut AT-Cut
3.0±0.1
4.5
A 1.8432 MHz+ : 500 Ω max.
2.000 MHz+ : 400 Ω max.
2.500 MHz+ : 250 Ω max.
VCXO
3.0±0.3 11.5 max.

3.000 MHz+ : 180 Ω max.
3.500 MHz+ : 100 Ω max.
4.000 MHz+ : 80 Ω max.
5.3±0.3
4.8±0.2
3.2±0.2
Equivalent Series Fundamental

1.2±0.2 4.500 MHz+ : 60 Ω max.
1.4±0.2
B 4.88±0.2 Resistance ESR 5.000 MHz+ : 50 Ω max.
6.000 MHz+ : 40 Ω max.
Holder
HC-49/U(MJ)
A B
13.5 mm max. 18.4 mm max. 7.000 MHz+ : 30 Ω max.
HC-49/UT(MJ) 11.1 mm max. 16.1 mm max. 9.000 MHz+ : 25 Ω max.
13.000 MHz+ : 20 Ω max.
SOLDERING PATTERN 3rd overtone 20.000 to 120.000 MHz : 60 Ω max.
3.2
5th overtone 80.000 to 200.000 MHz : 80 Ω max.
TCXO
2.6
Holder W
4.88
4
HC-49/U(MJ) 16.7
1.8
HC-49/UT(MJ) 14.7
W 49 M 1.8432M - 13 / X / XXggg (MJ)

Package type Package type
AT-CUT Circuit calibration condition Temperature stability
(ppm)
+100
+80 Load capacitance (CL)
+60
OCXO
+40 Example
+20
∆f/f 0
SMI Part No. Package Circuit Calibration Condition Frequency Frequency Tolerance Temperature Stability
-20
49M1.8432M-13/X/XXggg(MJ) 49(MJ) = HC-49/U(MJ) 1.8432 MHz X = ±50 ppm XXggg = ±50 ppm
-40 CL = 13 pF
-60 M = Parallel resonance
49M4.000M-20/T/XXggg(MJ) 49(MJ) = HC-49/U(MJ) 4.000 MHz T = ±30 ppm XXggg = ±50 ppm
-80 CL = 20 pF
-100 49S15.000M/O/QQiii(MJ) 49(MJ) = HC-49/U(MJ) S = Series resonance 15.000 MHz O = ±10 ppm QQiii = ±15 ppm
-45 -30 -15 0 +15 +30 +45 +60 +75 +90 (゜
C)
PACKAGE DATA
MCF
4.0±0.1 Item HC-49/U(MJ) & HC-49/UT(MJ)

Cover Metal
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
Base Metal
Sealing Resistance
D
Metal clamp C7521R-0

C
A
Tin / Copper
Metal clamp plating
J
HC-49/U(MJ) Terminal lead Alloy (FeNiCo)

A B C D F J L M Reel Dia. Qty/Reel Terminal lead plating SnCu
19.0 12.0 24.0 11.5 16.0 1.5 0.4 6.0 330 1000pcs
HC-49/UT(MJ)
17.8 12.0 24.0 11.5 16.0 2.0 0.4 5.6 330 1000pcs
48
HC-49/U & HC-49/UT FAMILY STANDARD THROUGH-HOLE CRYSTALS
HC-49 / U STANDARD SPECIFICATIONS

Holder type HC-49/U HC-49/UT
XTAL
Holder height 13.5 mm max. 11.2 mm max.
Frequency range F 1.8432 MHz to 200.000 MHz
J : ±5 ppm
O : ±10 ppm
Q : ±15 ppm
C ±3゜
R : ±20 ppm
T : ±30 ppm
X : ±50 ppm
Actual size
XXggg : ±50 ppm over -10゜ C to +60゜C
CLK OSC
0.975 gm (wt.) Temperature stability (referred to +25゜
C) TTiii : ±30 ppm over -20゜ C to +70゜C
Note : Contact for other temperature stabilities ±
RRiii : 20 ppm over -20゜ C to +70゜C
HC-49 / UT and operating temperature ranges. QQiii : ±15 ppm over -20゜ C to +70゜C
OOiii : ±10 ppm over -20゜ C to +70゜C
Shunt capacitance C0 7.0 pF max.
Drive level P 3 mW max.
Aging (for first year) ∆f/F ±5 ppm max. at +25゜ C ±3゜ C per year
Cut AT-Cut
1.8432 MHz+ : 500 Ω max.
2.000 MHz+ : 400 Ω max.
VCXO
2.500 MHz+ : 250 Ω max.
3.000 MHz+ : 180 Ω max.
Actual size 3.500 MHz+ : 100 Ω max.
4.000 MHz+ : 80 Ω max.
0.9075 gm (wt.) Equivalent Series Fundamental
4.500 MHz+ : 60 Ω max.
Resistance ESR 5.000 MHz+ : 50 Ω max.
HC-49 / U, HC-49 / UT 6.000 MHz+ : 40 Ω max.
10.5 max. 3.8 max. 7.000 MHz+ : 30 Ω max.
9.000 MHz+ : 25 Ω max.
13.000 MHz+ : 20 Ω max.
3rd overtone 20.000 to 120.000 MHz : 60 Ω max.
TCXO
5th overtone 80.000 to 200.000 MHz : 80 Ω max.
H

11.3 max. 4.9 max.
49 M 2.4576M - 16 / T / XXggg
Holder type Temperature stability
12 min.
0.43
+0.05
-0.03
Circuit calibration condition Frequency tolerance
Frequency Load capacitance (CL)
OCXO
4.88±0.2 Example
Holder H
SMI Part No. Holder Circuit Calibration Condition Frequency Frequency Tolerance Temperature Stability
HC-49/U 13.5 mm max. M = Parallel resonance
HC-49/UT 11.2 mm max. 49M2.4576M-16/T/XXggg 49 = HC-49/U 2.4576 MHz T = ±30 ppm XXggg = ±50 ppm
CL = 16pF
AT-CUT M = Parallel resonance
49M9.84375M-20/Q/TTiii 49 = HC-49/U 9.84375 MHz Q = ±15 ppm TTiii = ±30 ppm
(ppm)
CL = 20pF
+100 49TS19.6608M/O/QQiii 49T = HC-49/UT S = Series resonance 19.6608 MHz O = ±10 ppm QQiii = ±15 ppm
+80
+60
+40
HOLDER DATA MCF
+20 Holder
∆f/f 0 Item HC-49/U & HC-49/UT
-20 Cover Metal
-40
Base Metal
-60
-80 Sealing Resistance

-100
-45 -30 -15 0 +15 +30 +45 +60 +75 +90 (゜
C) Terminal lead Alloy (FeNiCo)
Terminal lead plating
SnCu
49
11SMX CUSTOM CUSTOM-DESIGNED HIGH SPEC SMD CRYSTALS
11SMX CUSTOM SPECIFICATIONS

Item Specifications
Package type 11SMX
XTAL
Frequency range 24.000 MHz to 80.000 MHz

O : ±10 ppm
C ±3゜
Frequency tolerance (at +25゜ C) Q : ±15 ppm
R : ±20 ppm
C)
Temp. Stability(ppm) ±3.0 ±5.0 ±7.5 ±10.0 ±15.0 ±20.0 ±30.0 ±50.0 ±100.0 ±150.0
Ope. Temperature Range FF JJ LL OO QQ RR TT XX CC1 GG1
Actual size 0゜
C to +45゜
C (edd) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
CLK OSC
0゜
C to +50゜
C (eee) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
0.0018 gm (wt.)
0゜
C to +60゜
C (egg) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
0゜
C to +70゜
C (eii) ○ ○ ○ ○ ○ ○ ○ ○ ○
11SMX C to
-10゜ +50゜
C (gee) ○ ○ ○ ○ ○ ○ ○ ○ ○
1.6±0.1
#4 #3
C to
-10゜ +60゜
C (ggg) ○ ○ ○ ○ ○ ○ ○ ○ ○
C to
-10゜ +70゜
C (gii) ○ ○ ○ ○ ○ ○ ○ ○ ○
C to
-10゜ +75゜
C (gjj) ○ ○ ○ ○ ○ ○ ○ ○
1.2±0.1
C to
-20゜ +70゜
C (iii) ○ ○ ○ ○ ○ ○ ○ ○
C
-20゜ to +75゜
C (ijj) ○ ○ ○ ○ ○ ○ ○
#1 #2
C
-30゜ to +75゜C (kjj) ○ ○ ○ ○ ○ ○ ○
C
-30゜ to +80゜C (kkk) ○ ○ ○ ○ ○ ○ ○
0.3±0.05
C
-30゜ to +85゜C (kll) ○ ○ ○ ○ ○ ○ ○
VCXO
C
-35゜ to +80゜C (lkk) ○ ○ ○ ○ ○ ○
0.575 0.45 0.575 <Top View> C
-40゜ to +85゜C (mll) ○ ○ ○ ○ ○ ○
#1 #2 #4 #3
C
-40゜ to +90゜C (mmm) ○ ○ ○ ○ ○ ○
0.475
C
-40゜ to +105゜
C (mpp) ○ ○ ○ ○ ○ ○
C
-40゜ to +125゜
C (mtt) ○ ○ ○ ○
0.475 0.25
○ : Available (The extremes depend on actual frequencies.)

#4 #3 #1 #2 150 Ω max. / 24.000 MHz to 32.000 MHz
<#2&#4 : Grounded to metal lid> Equivalent series resistance (ESR) 100 Ω max. / 32.000 MHz to 38.000 MHz
80 Ω max. / 38.000 MHz to 80.000 MHz
SOLDERING PATTERN Shunt capacitance (C0) 5 pF max.
TCXO
1.05
Aging ±2 ppm max. at +25゜C ±3゜ C for first year
0.65

0.75
Reflow condition 10 seconds max. at +250゜C ±10゜ C
0.75
AT-CUT 38.400MHz 11SMX O / OO / iii / 7
(ppm)
OCXO
+100
+80
Package type Operating temperature range
+60
+40 Frequency tolerance Temperature stability

+20
∆f/f 0 Example
-20
Frequency Temperature Operating
-40
SMI Part No. Frequency Package Tolerance Stability Temperature Range Load Capacitance
-60 38.400MHz 11SMX O/OO/iii/7 38.400 MHz 11SMX O = ±10 ppm OO = ±10 ppm C to +70゜
iii = -20゜ C CL = 7 pF
-80
PACKAGE DATA
-100
-45 -30 -15 0 +15 +30 +45 +60 +75 +90 (゜
C)
MCF
Package
Item 11SMX
TAPE SPECIFICATIONS Lid Metal
4.0±0.1
Base Ceramic
1.75±0.1
∅
1.5 +
Sealing Seam
L 2.0±0.1
0
-0 .1

Gold / Nickel
D
Terminal plating
C
A
(surface) / (under)
M B F
J

3000pcs
1.84 1.55 8.0 3.5 4.0 0.5 0.25 0.45 180
(1000pcs)
50

Item Specifications
Package type 21SMX
XTAL
O : ±10 ppm
C ±3゜
R : ±20 ppm
C)
Actual size Ope. Temperature Range FF JJ LL OO QQ RR TT XX CC1 GG1
Actual size 0゜
C to +45゜
C (edd) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
CLK OSC
0゜
C to +50゜
C (eee) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
0.00568 gm (wt.)
0゜
C to +60゜
C (egg) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
0゜
C to +70゜
C (eii) ○ ○ ○ ○ ○ ○ ○ ○ ○
21SMX C to
-10゜ +50゜
C (gee) ○ ○ ○ ○ ○ ○ ○ ○ ○
2.0±0.1
#4 #3
C to
-10゜ +60゜
C (ggg) ○ ○ ○ ○ ○ ○ ○ ○ ○
C to
-10゜ +70゜
C (gii) ○ ○ ○ ○ ○ ○ ○ ○ ○
C to
-10゜ +75゜
C (gjj) ○ ○ ○ ○ ○ ○ ○ ○
1.6±0.1
C to
-20゜ +70゜
C (iii) ○ ○ ○ ○ ○ ○ ○ ○
C
-20゜ to +75゜
C (ijj) ○ ○ ○ ○ ○ ○ ○
C
-30゜ to +75゜C (kjj) ○ ○ ○ ○ ○ ○ ○
#1 #2
C
-30゜ to +80゜C (kkk) ○ ○ ○ ○ ○ ○ ○
0.4±0.1
C
-30゜ to +85゜C (kll) ○ ○ ○ ○ ○ ○ ○
VCXO
C
-35゜ to +80゜C (lkk) ○ ○ ○ ○ ○ ○
0.65 0.7 0.65 <Top View> C
-40゜ to +85゜C (mll) ○ ○ ○ ○ ○ ○
#1 #2 #4 #3
C
-40゜ to +90゜C (mmm) ○ ○ ○ ○ ○ ○
0.55
C
-40゜ to +105゜
C (mpp) ○ ○ ○ ○ ○ ○
C
-40゜ to +125゜
C (mtt) ○ ○ ○ ○
0.5

0.55
#4 #3 #1 #2 100 Ω max. / 20.000 MHz to 24.000 MHz

<#2 & #4 : Grounded to metal lid> 80 Ω max. / 24.000 MHz to 26.000 MHz
Equivalent series resistance (ESR)
60 Ω max. / 26.000 MHz to 40.000 MHz
SOLDERING PATTERN 50 Ω max. / 40.000 MHz to 80.000 MHz
TCXO
1.35

0.75
Aging ±2 ppm max. at +25゜ C ±3゜C for first year

1.05

0.85

AT-CUT
(ppm) 27.000MHz 21SMX R / TT / iii / 8
OCXO
+100
+80
+60 Package type Operating temperature range
Frequency tolerance Temperature stability
+40
+20
∆f/f 0
Example
-20
-40
-60
-80 27.000MHz 21SMX R/TT/iii/8 27.000 MHz 21SMX R = ±20 ppm TT = ±30 ppm C to +70゜
iii = -20゜ C CL = 8 pF
-100
+90 (゜
PACKAGE DATA
-45 -30 -15 0 +15 +30 +45 +60 +75 C)
MCF
Package
TAPE SPECIFICATIONS Item 21SMX
4.0±0.1 Lid Metal
Base Ceramic
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
Sealing Seam
D
Gold / Nickel
C
A
Terminal plating
(surface) / (under)
M B F RoHS Compliant (Pb-free)
J

3000pcs
2.25 1.85 8.0 3.5 4.0 1.05 0.25 0.65 180
(1000pcs)
51

Item Specifications
Package type 22SMX
XTAL

O : ±10 ppm
C ±3゜
R : ±20 ppm
C)
Ope. Temperature Range FF JJ LL OO QQ RR TT XX CC1 GG1
Actual size 0゜
C to +45゜
C (edd) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
CLK OSC
0゜
C to +50゜
C (eee) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
0.00953 gm (wt.)
0゜
C to +60゜
C (egg) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
0゜
C to +70゜
C (eii) ○ ○ ○ ○ ○ ○ ○ ○ ○
22SMX C to
-10゜ +50゜
C (gee) ○ ○ ○ ○ ○ ○ ○ ○ ○
2.5±0.1
C to
-10゜ +60゜
C (ggg) ○ ○ ○ ○ ○ ○ ○ ○ ○
#4 #3
C to
-10゜ +70゜
C (gii) ○ ○ ○ ○ ○ ○ ○ ○ ○
C to
-10゜ +75゜
C (gjj) ○ ○ ○ ○ ○ ○ ○ ○
2.0±0.1
C to
-20゜ +70゜
C (iii) ○ ○ ○ ○ ○ ○ ○ ○
C
-20゜ to +75゜
C (ijj) ○ ○ ○ ○ ○ ○ ○
#1 #2
C
-30゜ to +75゜C (kjj) ○ ○ ○ ○ ○ ○ ○
C
-30゜ to +80゜C (kkk) ○ ○ ○ ○ ○ ○ ○
○ ○ ○ ○ ○ ○ ○
0.5±0.1
C
-30゜ to +85゜C (kll)
VCXO
C
-35゜ to +80゜C (lkk) ○ ○ ○ ○ ○ ○
0.8 0.8 <Top View> C
-40゜ to +85゜C (mll) ○ ○ ○ ○ ○ ○
#1 #2 #4 #3 C
-40゜ to +90゜C (mmm) ○ ○ ○ ○ ○ ○
C to +105゜
C (mpp) ○ ○ ○ ○ ○ ○
0.65
-40゜
C
-40゜ to +125゜
C (mtt) ○ ○ ○ ○
0.7

0.65
#4 0.9 #3 #1 #2 80 Ω max. / 16.000 MHz to 20.000 MHz

<#2 & #4 : Grounded to metal lid> 60 Ω max. / 20.000 MHz to 30.000 MHz
50 Ω max. / 30.000 MHz to 35.000 MHz
SOLDERING PATTERN 40 Ω max. / 35.000 MHz to 80.000 MHz
TCXO
1.7

±2 ppm max. at +25゜C ±3゜
1.0
Aging C for first year

1.3

1.2

AT-CUT
(ppm)
48.000MHz 22SMX Q / TT / mll / 8
OCXO
+100
+80
+60 Package type Operating temperature range
+40
+20
∆f/f 0
Example
-20
-40 SMI Part No. Frequency Package Tolerance Stability Temperature Range Load Capacitance
-60
48.000MHz 22SMX Q/TT/mll/8 48.000 MHz 22SMX Q = ±15 ppm TT = ±30 ppm C to +85゜
mll = -40゜ C CL = 8 pF
-80
-100 18.000MHz 22SMX R/JJ/egg/10 18.000 MHz 22SMX R = ±20 ppm JJ = ±5.0 ppm C to +60゜
egg = 0゜ C CL = 10 pF
-45 -30 -15 0 +15 +30 +45 +60 +75 +90 (゜
C)
MCF
PACKAGE DATA
4.0±0.1 Item 22SMX
Lid Metal
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
Base Ceramic
Sealing Seam
D

C
A
Gold / Nickel
Terminal plating
J
A B C D F J L M Reel Dia. Qty/Reel RoHS Compliant (Pb-free)

3000pcs
2.8 2.3 8.0 3.5 4.0 1.05 0.25 0.75 180
(1000pcs)
52
32SMX(A) CUSTOM CUSTOM-DESIGNED HIGH SPEC SMD CRYSTALS
32SMX(A) CUSTOM SPECIFICATIONS

Item Specifications
Package type 32SMX(A)
XTAL
O : ±10 ppm
C ±3゜
R : ±20 ppm
C)

Actual size 0゜
C to +45゜
C (edd) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
CLK OSC
0゜
C to +50゜
C (eee) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
0.0165 gm (wt.)
0゜
C to +60゜
C (egg) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
0゜
C to +70゜
C (eii) ○ ○ ○ ○ ○ ○ ○ ○ ○
32SMX(A) C to
-10゜ +50゜
C (gee) ○ ○ ○ ○ ○ ○ ○ ○ ○
○ ○ ○ ○ ○ ○ ○ ○ ○
3.2±0.1
#4 #3
C to
-10゜ +60゜
C (ggg)
C to
-10゜ +70゜
C (gii) ○ ○ ○ ○ ○ ○ ○ ○ ○
C to
-10゜ +75゜
C (gjj) ○ ○ ○ ○ ○ ○ ○ ○
2.5±0.1
C to
-20゜ +70゜
C (iii) ○ ○ ○ ○ ○ ○ ○ ○
C
-20゜ to +75゜
C (ijj) ○ ○ ○ ○ ○ ○ ○
#1 #2
C
-30゜ to +75゜C (kjj) ○ ○ ○ ○ ○ ○ ○
○ ○ ○ ○ ○ ○ ○
0.65±0.1
C
-30゜ to +80゜C (kkk)
C
-30゜ to +85゜C (kll) ○ ○ ○ ○ ○ ○ ○
VCXO
1.0 1.2 1.0 <Top View>
#1 #2 #4 #3 C
-35゜ to +80゜C (lkk) ○ ○ ○ ○ ○ ○
C
-40゜ to +85゜C (mll) ○ ○ ○ ○ ○ ○
0.9
C
-40゜ to +90゜C (mmm) ○ ○ ○ ○ ○ ○
0.7
C
-40゜ to +105゜
C (mpp) ○ ○ ○ ○ ○ ○
○ ○ ○ ○
0.9
C
-40゜ to +125゜
C (mtt)
#4 #3 #1 #2
<#2 & #4 : Grounded to metal lid> ○ : Available (The extremes depend on actual frequencies.)
300 Ω max. / 10.000 MHz to 12.000 MHz (Fundamental)
SOLDERING PATTERN 100 Ω max. / 12.000 MHz to 13.000 MHz (Fundamental)
2.3 80 Ω max. / 13.000 MHz to 20.000 MHz (Fundamental)
140 Ω max. / 40.000 MHz to 100.000 MHz (3rd overtone)
1.1
TCXO
1.9

1.3 Aging ±2 ppm max. at +25゜ C ±3゜ C for first year
Cut / Oscillation mode
AT-CUT AT-Cut / 3rd overtone / 40.000 MHz to 150.000 MHz
(ppm)
Reflow condition 10 seconds max. at +250゜ C ±10゜ C
+100

+80
+60
OCXO
+40
+20 24.576MHz 32SMX(A) R / TT / ijj / 8
∆f/f 0
-20 Frequency Load capacitance (CL)

-40
-60
-80
-100
-45 -30 -15 0 +15 +30 +45 +60 +75 +90 (゜
C)
Example
TAPE SPECIFICATIONS 24.576MHz 32SMX(A) R/TT/ijj/8 24.576 MHz 32SMX(A) R = ±20 ppm TT = ±30 ppm C to ±75゜
ijj = -20゜ C CL = 8 pF
MCF
4.0±0.1
PACKAGE DATA
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
Package
Item 32SMX(A)
D
Lid Metal
C
A
Base Ceramic
M B F
Sealing Seam
J
A B C D F J L M Reel Dia. Qty/Reel Terminal Tungsten (metalized)

3000pcs
3.5 2.8 8.0 3.5 4.0 1.05 0.25 1.0 180
(1000pcs) Gold / Nickel
Terminal plating
(surface) / (under)
53
53SMX(B) CUSTOM CUSTOM-DESIGNED HIGH SPEC SMD CRYSTALS
53SMX(B) CUSTOM SPECIFICATIONS

Item Specifications
Package type 53SMX(B)
XTAL

O : ±10 ppm
Q : ±15 ppm
C ±3゜
Frequency tolerance (at +25゜ C)
R : ±20 ppm
T : ±30 ppm
C)
CLK OSC
0゜
C to +45゜
C (edd) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
0.0238 gm (wt.) 0゜
C to +50゜
C (eee) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
0゜
C to +60゜
C (egg) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
53SMX(B) 0゜
C to +70゜
C (eii) ○ ○ ○ ○ ○ ○ ○ ○ ○
5.0±0.2
C to
-10゜ +50゜
C (gee) ○ ○ ○ ○ ○ ○ ○ ○ ○
#4 #3 C to
-10゜ +60゜
C (ggg) ○ ○ ○ ○ ○ ○ ○ ○ ○
C to
-10゜ +70゜
C (gii) ○ ○ ○ ○ ○ ○ ○ ○ ○
C to
-10゜ +75゜
C (gjj) ○ ○ ○ ○ ○ ○ ○ ○
3.2±0.2
C to
-20゜ +70゜
C (iii) ○ ○ ○ ○ ○ ○ ○ ○
C to
-20゜ +75゜
C (ijj) ○ ○ ○ ○ ○ ○ ○
#1 #2
C
-30゜ to +75゜C (kjj) ○ ○ ○ ○ ○ ○ ○
C to +80゜C (kkk) ○ ○ ○ ○ ○ ○ ○
0.85±0.15
-30゜
VCXO
C
-30゜ to +85゜C (kll) ○ ○ ○ ○ ○ ○ ○
C
-35゜ to +80゜C (lkk) ○ ○ ○ ○ ○ ○
1.2 2.6 1.2 <Top View> C
-40゜ to +85゜C (mll) ○ ○ ○ ○ ○ ○
#1 #2 #4 #3
C
-40゜ to +90゜C (mmm) ○ ○ ○ ○ ○ ○
0.9
C
-40゜ to +105゜
C (mpp) ○ ○ ○ ○ ○ ○
C to +125゜
C (mtt) ○ ○ ○ ○
1.4
-40゜
0.9
#4 #3 #1 #2
<#2 & #4 : Grounded to metal lid> 60 Ω max. / 10.000 MHz to 11.000 MHz (Fundamental)
SOLDERING PATTERN Equivalent series resistance (ESR) 40 Ω max. / 12.000 MHz to 70.000 MHz (Fundamental)
TCXO
3.7
120 Ω max. / 170.000 MHz to 300.000 MHz (5th overtone)
1.3

2.2
Aging ±3 ppm max. at +25゜ C ±3゜C for first year

1.6 AT-Cut / Fundamental / 10.000 MHz to 70.000 MHz
Cut / Oscillation mode AT-Cut / 3rd overtone / 60.000 MHz to 170.000 MHz
AT-CUT AT-Cut / 5th overtone / 170.000 MHz to 300.000 MHz
C ±10゜
(ppm)
+100
Reflow condition 10 seconds max. at +250゜ C
OCXO
+80
+60
+40
+20
13.000MHz 53SMX(B) O / OO / kkk / 10
∆f/f 0
-20 Frequency Load capacitance (CL)

-40
-60
-80
-100
-45 -30 -15 0 +15 +30 +45 +60 +75 +90 (゜
C) Example
MCF
TAPE SPECIFICATIONS 13.000MHz 53SMX(B) O/OO/kkk/10 13.000 MHz 53SMX(B) O = ±10 ppm OO = ±10 ppm kkk = -30゜
C to +80゜
C CL = 10 pF
4.0±0.1 15.360MHz 53SMX(B) Q/LL/ggg/9 15.360 MHz 53SMX(B) Q = ±15 ppm LL = ±7.5 ppm ggg = -10゜
C to +60゜
C CL = 9 pF
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
PACKAGE DATA
Package
D
53SMX(B)
A
Item
Lid Metal
M B F
Base Ceramic
J
A B C D F J L M Reel Dia. Qty/Reel Sealing Seam

5.4 3.5 12.0 5.5 8.0 1.6 0.25 1.0 180 1000pcs
Gold / Nickel
Terminal plating
(surface) / (under)
54
94SMX(B) CUSTOM CUSTOM-DESIGNED HIGH SPEC SMD CRYSTALS
94SMX(B) CUSTOM SPECIFICATIONS

Item Specifications
Package type 94SMX(B)
XTAL
O : ±10 ppm
Q : ±15 ppm
C ±3゜
Frequency tolerance (at +25゜ C)
R : ±20 ppm
Actual size T : ±30 ppm
C)
0.1213 gm (wt.)
94SMX(B) Ope. Temperature Range FF JJ LL OO QQ RR TT XX CC1 GG1
CLK OSC
7.0±0.2 0゜
C to +45゜
C (edd) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
#4 (7.5±0.2) #3 0゜
C to +50゜
C (eee) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
0゜
C to +60゜
C (egg) ○ ○ ○ ○ ○ ○ ○ ○ ○ ○
○ ○ ○ ○ ○ ○ ○ ○ ○
5.0±0.2
0゜
C to +70゜
C (eii)
C to
-10゜ +50゜
C (gee) ○ ○ ○ ○ ○ ○ ○ ○ ○
#1 #2
C to
-10゜ +60゜
C (ggg) ○ ○ ○ ○ ○ ○ ○ ○ ○
C to
-10゜ +70゜
C (gii) ○ ○ ○ ○ ○ ○ ○ ○ ○
C to
-10゜ +75゜
C (gjj) ○ ○ ○ ○ ○ ○ ○ ○
1.1±0.2
C to
-20゜ +70゜
C (iii) ○ ○ ○ ○ ○ ○ ○ ○
C to
-20゜ +75゜
C (ijj) ○ ○ ○ ○ ○ ○ ○
1.2 4.6 1.2
○ ○ ○ ○ ○ ○ ○
<Top View>
C
-30゜ to +75゜C (kjj)
0.73
#1 #2 #4 #3
C
-30゜ to +80゜C (kkk) ○ ○ ○ ○ ○ ○ ○
VCXO
○ ○ ○ ○ ○ ○ ○
1.0 1.54 1.0
C
-30゜ to +85゜C (kll)
C
-35゜ to +80゜C (lkk) ○ ○ ○ ○ ○ ○
C
-40゜ to +85゜C (mll) ○ ○ ○ ○ ○ ○
#4 #3 #1 #2 C
-40゜ to +90゜C (mmm) ○ ○ ○ ○ ○ ○
0.73

C
-40゜ to +105゜
C (mpp) ○ ○ ○ ○ ○ ○
C
-40゜ to +125゜
C (mtt) ○ ○ ○ ○
SOLDERING PATTERN ○ : Available (The extremes depend on actual frequencies.).
6.2

1.4

2.5
TCXO
2.0
AT-CUT
(ppm)
Aging ±2 ppm max. at +25゜ C ±3゜ C for first year
+100
Cut / Oscillation mode AT-Cut / Fundamental / 8.000 MHz to 40.000 MHz
+80
+60
AT-Cut / 3rd overtone / 30.000 MHz to 100.000 MHz
+40 Reflow condition 10 seconds max. at +250゜ C ±10゜ C
+20
∆f/f 0
-20
OCXO
-40
-60 90.000MHz 94SMX(B) Q / CC1 / mpp / 12

-80
-100
+90 (゜
-45 -30 -15 0
+15 +30 +45 +60 +75 C)
TAPE SPECIFICATIONS Example
4.0±0.1
SMI Part No. Frequency Package
1.75±0.1
L
∅
1.5 + 2.0±0.1 Tolerance Stability Temperature Range Load Capacitance
0
-0 .1
90.000MHz 94SMX(B) Q/CC1/mpp/12 90.000 MHz 94SMX(B) Q = ±15 ppm CC1 = ±100 ppm mpp = -40゜
C to +105゜
C CL = 12 pF
MCF
16.9344MHz 94SMX(B) R/TT/iii/16 16.934 MHz 94SMX(B) R = ±20 ppm TT = ±30 ppm iii = -20゜
C to +70゜
C CL = 16 pF
D
C
A
M B F
PACKAGE DATA
J
Package
A B C D F J L M Reel Dia. Qty/Reel Item 94SMX(B)
7.3 5.3 16.0 7.5 8.0 1.5 0.3 1.9 178 1000pcs
Lid Metal
Base Ceramic
Sealing Seam
Gold / Nickel
Terminal plating
(surface) / (under)
55
110SMX STANDARD 32.768kHz SMD CRYSTALS
110SMX STANDARD SPECIFICATIONS

XTAL
Part number P/N 110M327*

Package type 110SMX
Nominal frequency F 32.768 kHz
AA : ±10 ppm
A : ±15 ppm
Frequency tolerance (at +25゜
C) ∆f/F
Actual size
B : ±20 ppm
C : ±30 ppm (Standard)
CLK OSC
0.003 gm (wt.)
12.5 pF : 110M327 (Standard)
110SMX Load capacitance CL 9.0 pF : 110M327-9
1.6±0.1 7.0 pF : 110M327-7
Equivalent series resistance ESR 90 kΩ max.
1.0±0.1
Drive level P 0.1 μW (0.5 μW for max.)

Turnover temperature Tt +25゜ C ±5゜C
0.5 max.
0.5
Temperature coefficient β C2, Typical.
-0.035 ppm / ゜
0.5 0.6
VCXO
<Top View>
Aging (for first year) ∆f/F ±3 ppm max. at +25゜C ±3゜ C
Insulation resistance Ri 500 MΩ min. at 100V DC ±15V
Cut XY-Cut
SOLDERING PATTERN
1.1 Operating temperature range To C to +85゜
-40゜ C
Storage temperature range Ts C to +125゜
-55゜ C
Shock resistance ∆f/F ±5 ppm max.
1.0
TCXO
0.5 Vibration resistance ∆f/F ±5 ppm max.

IR reflow resistance ∆f/F ±10 ppm max.
XY-CUT
(ppm) Reflow condition C ±10゜
0
( * ) N o pat t er n path under neath the 110SMX
-20
PACKAGE DATA
-40
-60
-80
Package
∆f/f
-100
Item 110SMX
OCXO
Lid Metal
-120
-140
-160
-40 -25 -10 +5 +20 +35 +50 +65 +80 +110 (゜
C) Base Ceramic
Sealing Seam
TAPE SPECIFICATIONS Terminal Tungsten (metalized)
4.0±0.1
Gold / Nickel
1.75±0.1
Terminal plating
L 1.5 + 2.0±0.1
0
-0 .1
(surface) / (under)
MCF
C
A
M B F
J

3000pcs
1.85 1.25 8.0 3.5 4.0 0.5 0.25 0.65 180
5000pcs
58

XTAL
Package Type 212SMX
AA : ±10 ppm
A : ±15 ppm
C) ∆f/F
Actual size
Actual size
B : ±20 ppm
CLK OSC
0.0055 gm (wt.)
12.5 pF : 212M327 (Standard)
212SMX Load capacitance CL 9.0 pF : 212M327-9
2.0±0.05 7.0 pF : 212M327-7
Equivalent series resistance ESR 90k Ω max. (To : -40゜C to +85゜
C)
Drive level P 0.1 μW (0.5 μW for max.)
1.2±0.05

Package Height(H)
212SMX 0.55±0.05 mm Standard
Temperature coefficient β C2, Typical
-0.034 ppm / ゜
H
212SMXL 0.30±0.05 mm Option
VCXO
Quality factor Q 20000 min.
0.5 1.0 0.5
Shunt capacitance C0 1.2 pF, Typical

<Top View>
Motional capacitance C1 0.003 pF, Typical

Capacitance ratio γ 400, Typical
SOLDERING PATTERN Aging (for first year) ∆f/F ±3 ppm max. at +25゜ C ±3゜
C
1.4
TCXO
Cut XY-Cut
1.3
Operating temperature range To C to +85゜

-40゜ C
0.8
-55゜ C
XY-CUT Shock resistance ∆f/F ±5 ppm max.
±5 ppm max.
(ppm)
0 Vibration resistance ∆f/F
-20
-40
OCXO
-60
-80
∆f/f
-100 ( * ) N o pat t er n pat h under neath the 212SMX
-120
-140 PACKAGE DATA

-160
+110 (゜
-40 -25 -10 +5 +20 +35 +50 +65 +80 C)
Package
TYPICAL TEMPERATURE CHARACTERISTICS Item 212SMX
Lid Metal
TAPE SPECIFICATIONS
4.0±0.1 Base Ceramic
1.75±0.1
∅
MCF
L 1.5 + 2.0±0.1
0
-0 .1 Sealing Seam
D
C
A
Gold / Nickel
Terminal plating
J

2.25 1.45 8.0 3.5 4.0 1.0 0.25 0.75 180 3000pcs
59

XTAL

Package Type 31SMX
AAA : ± 5 ppm
AA : ±10 ppm
Actual size Frequency tolerance (at +25゜
C) ∆f/F A : ±15 ppm
B : ±20 ppm
CLK OSC
0.0125 gm (wt.)
31SMX 12.5 pF : 31M327 (Standard)
9.0 pF : 31M327-9
Load capacitance CL
3.2±0.2
7.0 pF : 31M327-7
6.0 pF : 31M327-6
1.5±0.1
70k Ω max. (To : -40゜ C to +85゜ C) (Standard)

Package Height (H)
80k Ω max. (To : -40゜ C to +105゜C) (Option)
31SMX 0.8±0.1 mm Standard
80k Ω max. (To : -40゜ C to +125゜C) (Option)
H
31SMXL 0.6±0.1 mm Option
0.75 0.75
<Top View> 50k Ω max. (To : -40゜ C to +85゜ C) (R = Option)
VCXO
Drive level P 0.1 μW (0.5 μW max.)

1.7 Turnover temperature Tt +25゜ C ±5゜C
-0.034 ppm / ゜
SOLDERING PATTERN
2.5 Quality factor Q 20000 min.
Shunt capacitance C0 1.05 pF, max.
1.8

TCXO

1.0
XY-CUT Aging (for first year) ∆f/F ±3 ppm max. at +25゜

C ±3゜
C
(ppm)
0 Insulation resistance Ri 500 MΩ min. at 100V DC ±15V
-20
-40 Cut XY-Cut

-60
-40゜C to +85゜
C (Standard)
C (W = Option)
-80
∆f/f -40゜
C to +125゜
-100
-40゜ C (WW = Option)
OCXO
-120
-140
-160
Storage temperature range Ts -55゜C to +125゜
C
-40 -25 -10 +20 +35 +50 +65 +80 +110 (゜
C)
±5 ppm max.
+5
TYPICAL TEMPERATURE CHARACTERISTICS Shock resistance ∆f/F

TAPE SPECIFICATIONS Vibration resistance ∆f/F ±5 ppm max.
4.0±0.1
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
( * ) For m el y 31M327( C )
( * ) N o pat t er n path under neath the 31SMX
D
MCF
C
A
M B F
PACKAGE DATA
J
A B C D F J L M Reel Dia. Qty/Reel Package

3.4 1.7 12.0 5.5 4.0 1.0 0.3 1.2 180 3000pcs Item 31SMX
Lid Metal
Base Ceramic
Sealing Seam
Gold / Nickel
Terminal plating
(surface) / (under)
60

XTAL
Package type 415SMX
B : ±20 ppm
C) ∆f/F
Actual size 12.5 pF : 415M327 (Standard)
Actual size
Load capacitance CL 9.0 pF : 415M327-9
CLK OSC
0.017 gm (wt.)
7.0 pF : 415M327-7
415SMX Equivalent series resistance ESR 70 kΩ max.
4.1±0.2
Drive level P 1 μW max.
Turnover temperature Tt C ±5゜
+25゜ C
1.5±0.1

-0.034 ppm / ゜
0.9
0.7 2.7 0.7

<Top View>
VCXO
SOLDERING PATTERN Capacitance ratio γ 550, Typical
3.4
Aging (for first year) ∆f/F ±3 ppm max. at +25゜
C ±3゜
C
1.7
1.0 Cut XY-Cut

-40゜ C
TCXO
XY-CUT
(ppm) Storage temperature range Ts C to +125゜
-55゜ C
0
-20 Shock resistance ∆f/F ±5 ppm max.

-40
-60 Vibration resistance ∆f/F ±5 ppm max.

-80
∆f/f
-100
-120
-140
( * ) N o pat t er n pat h under neath the 415SMX
OCXO
-160
-40 -25 -10 +5 +20 +35 +50 +65 +80 +110 (゜
C)

PACKAGE DATA
4.0±0.1 Item 415SMX
Lid Metal
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
Base Ceramic
D
Sealing AuSn
C
A

MCF
M B F
J

Gold / Nickel
4.5 1.9 12.0 5.5 4.0 1.0 0.24 1.0 178 3000pcs
Terminal plating
(surface) / (under)
61

XTAL

Package Type 52SMX
B : ±20 ppm
C) ∆f/F C : ±30 ppm (Standard)
Actual size
D : ±50 ppm
12.5 pF : 52M327 (Standard)
CLK OSC
0.0257 gm (wt.)
Load capacitance CL 9.0 pF : 52M327-9
52SMX 7.0 pF : 52M327-7
4.9±0.15
Equivalent series resistance ESR 70k Ω max. (To : -40゜
C to +85゜
C)
1.8±0.15

+25゜ C
1.0 max.

-0.034 ppm / ゜
0.85 0.85
<Top View> Quality factor Q 40000 min.
VCXO

3.2

SOLDERING PATTERN Capacitance ratio γ 619, Typical
4.2
Aging (for first year) ∆f/F ±3 ppm max. at +25゜C ±3゜C

2.2
1.3
Cut XY-Cut
TCXO
XY-CUT Operating temperature range To C to +85゜

-40゜ C
(ppm)
0 Storage temperature range Ts C to +125゜
-55゜ C
-20
-40
-60
Vibration resistance ∆f/F ±5 ppm max.
-80
∆f/f
-100
-120
-140 Reflow condition C ±10゜

OCXO
-160
-40 -25 -10 +5 +20 +35 +50 +65 +80 +110 (゜
C) ( * ) N o pat t er n path under neath the 52SMX
PACKAGE DATA
TAPE SPECIFICATIONS
Package
4.0±0.1
Item 52SMX
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1 Lid Metal
Base Ceramic
D
C
A
Sealing AuSn
MCF

M B F
J

5.3 2.1 12.0 5.5 4.0 1.0 0.3 1.1 180 3000pcs
Gold / Nickel
Terminal plating
(surface) / (under)
62

XTAL
Part number P/N 124M327*1
Package Type 124SMX*2
AAA : ±5 ppm
AA : ±10 ppm
Actual size
C) ∆f/F A : ±15 ppm
B : ±20 ppm
CLK OSC
0.0295 gm (wt.) C : ±30 ppm (Standard)
124SMX 12.5 pF : 124M327 (Standard)
7.0 max. 9.0 pF : 124M327-9
7.0 pF : 124M327-7(Standard)
Load capacitance CL
0.55
#4 #3
6.0 pF : 124M327-6
1.5max.
#1 #2
4.4 pF : 124M327-4.4
0.1 6.7 0.1 3.7 pF : 124M327-3.7
65k Ω max. / To : -40゜ C to +85゜
C (Standard)
1.4 max.
50k Ω max. / To : -40゜ C to +85゜

C (R = Option)
VCXO
Drive level P 0.1 μW (1 μW max.)
0.55 0.6
<Top View>
0.55
0.3
#1 #2 #4 #3

#4 #3 #1 #2
1.05
0.3
<#2 & #3 : NC>

-0.035 ppm / ゜
1.2
SOLDERING PATTERN Quality factor Q 40000 min.

6.3
0.6

0.9
TCXO
1.2
(※)#2 & #3 : Open or floating

Aging (for first year) ∆f/F ±3 ppm max. at +25゜ C ±3゜
C
XY-CUT
(ppm) Insulation resistance Ri 500 MΩ min. at 100V DC ±15V
0
-20 Cut XY-Cut

-40
-60 Operating temperature range To C to +85゜

-40゜ C
C
-80
∆f/f
-100
-55゜
OCXO
-120
-140
-160
-40 -25 -10 +5 +20 +35 +50 +65 +80 +110 (゜
C) Vibration resistance ∆f/F ±5 ppm max.
TAPE SPECIFICATIONS Reflow condition C ±10゜
10 seconds max. at +250゜ C (2 times)
4.0±0.1
( * 1 ) N o pat t er n pat h under neath the 124SMX.
1.75±0.1
∅
L 1.5 +
0
2.0±0.1 ( * 2 ) T he c r y s t al m et al b ody may be v i s i bl e i ns i de the m ol d. It does not affec t the c r y s tal per for m anc e.
-0 .1
PACKAGE DATA
MCF
D
C
A
Package
Item 124SMX
M B
Outer package Epoxy
F
J

7.2 1.55 16.0 7.5 4.0 1.0 0.3 1.5 180 3000pcs
Sealing Press-fit (1.2 x 4.7 mm built in)
Terminal 42 alloy
Terminal plating Sn
RoHS Compliant
63
90SMX FAMILY STANDARD 32.768kHz SMD CRYSTALS
90SMX(N) STANDARD SPECIFICATIONS

XTAL
Part number P/N 90M327(N) 90M327(S)

Package type 90SMX(N) 90SMX(S)
AAA : ±5 ppm
AA : ±10 ppm
C) ∆f/F A : ±15 ppm
Actual size
B : ±20 ppm
CLK OSC
0.125 gm (wt.) 12.5 pF : 90M327(N) & 90M327(S) (Standard)

Load capacitance CL
6.0 pF : 90M327-6(N) & 90M327-6(S)
90SMX(S)
Equivalent series resistance ESR 50 kΩ max. (To : -40゜C to +85゜
C)
+25゜ C
-0.034 ppm / ゜ C2, Typical
-0.035 ppm / ゜
Shunt capacitance C0 1.35 pF, Typical 1.0 pF, Typical
VCXO
Motional capacitance C1 0.003 pF, Typical 0.0019 pF, Typical

Actual size Capacitance ratio γ 450, Typical 520, Typical
0.121 gm (wt.) Aging (for first year) ∆f/F ±3 ppm max. at +25゜
C ±3゜
C
90SMX(N) Insulation resistance Ri 500 MΩ min. at 100V DC ±15V
Cut XY-Cut
7.9±0.1
#4 #3

-40゜ C
3.7±0.1
TCXO
#1 #2
-55゜ C
0.9

2.4±0.1
0.5 5.0 0.5

<Top View>
#1 #2 #4 #3 Reflow condition C ±10゜
#4 #3 #1 #2
PACKAGE DATA
OCXO
5.5
<#2 & #3 : NC>
Package
Item 90SMX(N) 90SMX(S)
90SMX(S) Outer package Epoxy compound Plastic
8.7 max.
0.3 #4 #3 0.3
Sealing Press-fit (2x6 mm built in) Press-fit (2x6 mm built in)
3.7 max.
Terminal lead frame Brass (CuZn) 42 alloy

#1 #2 Terminal plating SnAg Sn
RoHS Compliant Compliant
2.5 max.
MCF
0.5 5.0 0.5

<Top View> XY-CUT TAPE SPECIFICATIONS
#1 #2
(ppm) 4.0±0.1
1.75±0.1
0 ∅
L 1.5 + 2.0±0.1
0
-20 0 .1
#4 5.5 #3 -40
-60
D
C
A
-80
SOLDERING PATTERN ÏI
-100
90SMX(N) & 90SMX(S) -120 M B F
J
5.5
-140
90SMX(N)
-160
-40 -25 -10 +5 +20 +35 +50 +65 +80 C)
+110 (゜ A B C D F J L M Reel Dia. Qty/Reel
1.9
8.3 4.0 16.0 7.5 8.0 1.6 0.3 2.7 330 3000pcs
3.2
90SMX(S)
8.7 3.9 16.0 7.5 8.0 - 0.4 2.7 330 3000pcs
1.3
64
26(LF)MJ STANDARD 32.768kHz SMD CRYSTALS
26(LF)MJ STANDARD SPECIFICATIONS

XTAL
Part number P/N 26(LF)327MJ*1
Package Type 26(LF)MJ*2
A : ±15 ppm
B : ±20 ppm
Actual size
D : ±50 ppm
CLK OSC
0.079 gm (wt.)
Load capacitance CL 12.5 pF
26(LF)MJ Equivalent series resistance ESR 50k Ω max. (To : -40゜
C to +85゜
C)
8.3
6.0
2.54±0.3

+25゜ C
ĭ
1.0
2.5
0.2 0.2
2.3±0.3 Temperature coefficient β C2, Typical
-0.034 ppm / ゜
4.3

2.2
VCXO
2
2.7 max. 0.85 1.3±0.3

SOLDERING PATTERN
6.75 Capacitance ratio γ 480, Typical
4.5
Aging (for first year) ∆f/F ±5 ppm max. at +25゜C ±3゜C
1.0

2.54
2.5 2.0
Cut XY-Cut
C
TCXO
XY-CUT -40゜
C
(ppm)
0
-55゜
-20
-40
-60
-80
ÏI
-100 IR reflow resistance ∆f/F ±10 ppm max.
-120
-140 Reflow condition C ±10゜

-160
OCXO
-40 -25 -10 +5 +20 +35 +50 +65 +80 C)
+110 (゜ ( * 1 ) F or m er ly 26S TF 327( LF ) M J N
(* 2 ) F or m er ly 2x 6( L F ) M J N
TAPE SPECIFICATIONS PACKAGE DATA

4.0±0.1
Package
26(LF)MJ
1.75±0.1
∅
L 1.5 +
0
2.0±0.1 Item
0 .1
Cover Metal
Base Glass
D
C
A
M B
Sealing Press-fit
MCF
F
J
A B C D F J L M Reel Dia. Qty/Reel Metal clamp CuSn

3000pcs
Metal clamp plating Gold
4.5
9.5 16.0 9.2 8.0 - 0.3 2.5 330 2000pcs
3.0
1000pcs
Terminal lead Kovar

Terminal lead
Sn-90Pb
plating
RoHS Compliant
65
26(LF) STANDARD 32.768kHz SMD CRYSTALS
26(LF) STANDARD SPECIFICATIONS

XTAL
Part number P/N 26(LF)327*1

Package Type 26(LF)*2
A : ±15 ppm
B : ±20 ppm
Actual size
D : ±50 ppm
CLK OSC
0.0535 gm (wt.) 12.5 pF : 26(LF)327 (Standard)

26(LF) Load capacitance CL 10.0 pF : 26(LF)327-10

8.0 pF : 26(LF)327-8

Equivalent series resistance ESR 50k Ω max. (To : -40゜C to +85゜

C)


PD[
ĭ

+25゜ C

Temperature coefficient β C2, Typical.

-0.034 ppm / ゜

VCXO




SOLDERING PATTERN
6.0 1.75 2.5
Aging (for first year) ∆f/F ±5 ppm max. at +25゜ C ±3゜
C
1.0 1.54 1.0
2.5

TCXO
XY-CUT Cut XY-Cut

(ppm)
0 Operating temperature range To C to +85゜
-40゜ C
-20
-40 Storage temperature range Ts -55゜C to +125゜

C
-60
-80

ÏI
-100
-120
-140
-160
OCXO

-40 -25 -10 +5 +20 +35 +50 +65 +80 C)
+110 (゜
( * ) For m er l y 26ST F 327( LF ) H

1
TAPE SPECIFICATIONS (* 2 ) For m er l y 2x 6( LF ) H
PACKAGE DATA
4.0±0.1
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
0 .1
Package
Item 26(LF)
Cover Metal
D
C
A
M B F Base Glass
MCF
A B C D F J L M Reel Dia. Qty/Reel Sealing Press-fit

4.0 2000pcs
9.7 16.0 7.5 8.0 - 0.3 2.15 330
Terminal lead Kovar
3.5 1000pcs
Terminal lead
Sn-90Pb
plating
RoHS Compliant
66
32.768 kHz FAMILY STANDARD THROUGH-HOLE CRYSTALS
1.2 x 4.7 mm STANDARD SPECIFICATIONS

Part number P/N 1247STF327 145STF327 26STF327 38STF327
XTAL
Package Type 1.2x4.7 mm 1.4x5 mm 2x6 mm 3x8 mm
AA : ±10 ppm
A : ±15 ppm
C) ∆f/F
Actual size B : ±20 ppm (Standard)
C : ±30 ppm
0.015 gm (wt.)
Load capacitance CL 8.0 pF, Typical 12.5 pF, Typical
1.4 x 5.0 mm Equivalent series resistance ESR 50k Ω max. 40k Ω max. 35k Ω max.
CLK OSC
Turnover temperature Tt +25゜ C to ±5゜C
Temperature coefficient (Typical) β C2
-0.035 ppm / ゜ -0.034 ppm / ゜ C2
Quality factor (Typical) Q 60000 85000 70000 85000
Shunt capacitance (Typical) C0 0.8 pF 1.0 pF 1.3 pF 1.6 pF
Motional capacitance (Typical) C1 0.002 pF 0.0025 pF 0.003 pF 0.0035 pF
Actual size
Capacitance ratio (Typical) γ 400 400 450 460
0.026 gm (wt.) Aging (for first year) ∆f/F ±3 ppm max. at +25゜ C ±3゜C
2.0 x 6.0 mm Insulation resistance Ri 500 MΩ min. at 100V DC ±15V
VCXO
Cut XY-Cut
Operating temperature range To -20゜ C to +60゜C -20゜C to +70゜ C
Storage temperature range Ts -30゜ C to +70゜C -40゜C to +85゜ C
Shock resistance* 1 ∆f/F ±5 ppm max.
(*1) Shock is defined "three drops from a hight of 75cm onto hardwood."
Actual size
0.05 gm (wt.)
PACKAGE DATA
TCXO
Package
Item 1247STF327 145STF327 26STF327 38STF327
3.0 x 8.0 mm
Cover Metal Metal Metal Metal
Base Glass Glass Glass Glass
Sealing Press-fit Press-fit Press-fit Press-fit
Terminal lead Alloy (FeNiCo) Alloy (FeNiCo) Alloy (FeNiCo) Alloy (FeNiCo)
Terminal plating SnCu SnCu SnCu SnCu
Actual size RoHS Compliant (Pb-free) Compliant (Pb-free) Compliant (Pb-free) Compliant (Pb-free)
OCXO
0.143 gm (wt.)
1.2x4.7mm 2.0x6.0 mm
XY-CUT 4.7 max. 5.0 min. 6.0±0.2 5.0 min.
0.7±0.2
(ppm)
0.3
Φ1.2 max.
0
Φ2.1 max.
Φ2.1 max.
-20
Φ0.18
Φ1.2 max.
-40
Φ0.26±0.05
-60
-80
∆f/f
-100
1.4x5.0 mm 3.0x8.0 mm
-120
MCF
5.0±0.1 4.0 max. 8.0±0.2 9.8 min.
-140
1.1±0.2
0.45
Φ1.5 max.
-160
Φ3.1 max.
-40 -25 -10 +20 +35 +50 +65 +80 +110 (゜

C)
Φ3.1 max.
+5

Φ1.5 max.
Φ0.2±0.05
Φ0.35±0.05
67
Crystal Clock Oscillators SPXO 1.5 to 80 MHz 2.0x1.6 mm CMOS
21SMO (+1.8V, +2.5V, +3.0V or +3.3V FIXED MODELS) 2.0x1.6 mm STANDARD SMD CLOCK OSCILLATORS
21SMO STANDARD SPECIFICATIONS ● CMOS OUTPUT

● PACKAGE SIZE 2.0x1.6 mm
Item Specifications
General part number 21SMO*1
XTAL

21SMO(A) : ±100 ppm over -10゜ C to +70゜
C
21SMO(B) : ±50 ppm over -10゜ C to +70゜
C
21SMO(C) : ±30 ppm over -10゜ C to +70゜
C
Frequency stability
21SMO(D) : ±25 ppm over -10゜ C to +70゜
C
(over all conditions)
21SMO(E) : ±20 ppm over -10゜ C to +70゜
C
Actual size
21SMO(AW) : ±100 ppm over -40゜ C to +85゜
C
21SMO(BW) : ±50 ppm over -40゜ C to +85゜
C
CLK OSC
0.008 gm (wt.) -10゜ C to +70゜ C (Standard)

Operating -20゜ C to +70゜ C (SW = Standard)
21SMO temperature -40゜ C to +85゜ C (W = Option)
2.05±0.1 Operating -40゜ C to +105゜ C (WW = Option)
#4 #3
Conditions
Supply voltage (VDD) +1.8V, +2.5V, +3.0V or +3.3V DC ±5%
Stand-by control VIH : 70% VDD min.
1.65±0.1
voltage (Pin#1) VIL : 30% VDD max.*2

Absolute Supply voltage -0.3V to +4.0V DC
#1 #2 Max. Ratings Storage temperature -55゜ C to +100゜C
Frequency
VCXO
0.85±0.1
VDD
1.5M+ 10M+ 20M+ 30M+ 40M+ 50M+ 60M+ 70M+
Input current (max. mA) +1.8V 1.8 2.1 2.5 3.5 4.0 4.5 6.0 6.5
0.675 0.95 0.675 (Pin#1 = Open or VIH)
+2.5V 2.5 3.0 3.5 4.5 5.0 5.5 6.5 7.0
#1 #2
No load
+3.0V 3.0 3.5 4.0 5.0 5.5 6.0 7.5 8.5
0.575
+3.3V 3.5 4.0 4.5 5.5 6.0 6.5 8.0 9.0

0.45
PIN CONNECTION
1
2
“ L”
GND
OPEN or “H”
Stand-by current*2 10 μA max. (Pin#1 = VIL)
0.575
Symmetry 45% to 55% at 1/2 VDD level

3 Z OUTPUT
4 VDD
#4 #3 Z : high impedance
Rise and fall times 6 ns max. (10% VDD to 90% VDD level)
Output "0" Level VOL : 10% VDD max.
TCXO
SOLDERING PATTERN (-40゜C to +85゜

C)
0.8 "1" Level VOH : 90% VDD min.
Load 15 pF max. (CMOS)
Disable delay time 150 ns max.
0.7
0.01μF
～
0.1μF
Enable delay time 10 ms max.
Start-up time 10 ms max.
1.3
SSB phase noise -143 dBc/Hz, Typical at 1 kHz offset
(at VDD = +3.3V & 40.000 MHz) -157 dBc/Hz, Typical at 100 kHz offset
OUTPUT WAVEFORM ±5 ppm max. at +25゜
Aging C ±3゜ C for first year
OCXO
+250゜C ±10゜ C for 10 seconds

Reflow condition
+170゜C ±10゜C for 1 to 2 minutes (preheating)
( * 1 ) F inal par t number to be as s i gned w i th pac k age ty pe, i nput v ol tage, fr equenc y s tabi l i ty, oper ati ng tem pe rat ure and f requency.
e. g. 21S M O( 2.5VC ) 10.000MH z
( * 2 ) I nt er nal c r ys tal os c i l l ati on to be hal ted ( Pi n#1 = V IL )
PACKAGE DATA TAPE SPECIFICATIONS

4.0±0.1
Package
1.75±0.1
Item 21SMO L
∅
1.5 +
0
2.0±0.1
-0 .1
Lid Metal
MCF
TEST CIRCUIT Base Ceramic

D
C
A
Sealing Seam
Terminal Tungsten (metalized) M B F
J
Gold / Nickel A B C D F J L M Reel Dia. Qty/Reel

Terminal plating
(surface) / (under) 2.2 1.8 8.0 3.5 4.0 1.0 0.25 1.0 180
3000pcs
1000pcs
70
QuartzClock
Crystal Crystal Units
Oscillators SPXO Wide Freq. 1.5 to 170 MHz 2.5x2.0 mm CMOS
22SMO STANDARD SPECIFICATIONS ● WIDE FREQUENCY RANGE

● CMOS OUTPUT
Specifications
XTAL
Item
22SMO(A) : ±100 ppm over -20゜ C to +70゜
C
22SMO(B) : ±50 ppm over -20゜ C to +70゜
C
22SMO(C) : ±30 ppm over -20゜ C to +70゜
C
22SMO(D) : ±25 ppm over -20゜ C to +70゜
C
Frequency stability
22SMO(E) : ±20 ppm over -20゜ C to +70゜
C
Actual size (over all conditions)
C
CLK OSC
0.014 gm (wt.) 22SMO(BW) : ±50 ppm over -40゜ C to +85゜
C
22SMO(CW) : ±30 ppm over -40゜ C to +85゜
C
22SMO 22SMO(DW) : ±25 ppm over -40゜ C to +85゜
C
2.5±0.1
C to +70゜
-20゜ C (Standard)
#4 #3
Operating C to +85゜
-40゜ C (W = Option)
temperature C to +105゜
-40゜ C (WW = Option) 1.500 MHz to 80.000 MHz
Operating C (WWW = Option) 1.500 MHz to 80.000 MHz
C to +125゜
-40゜
2.0±0.1
Conditions Supply voltage (VDD) +1.8V , +2.5V , +3.0V or +3.3V DC ±5% +2.5V , +3.0V or +3.3V DC ±5%
#1 #2
0.9±0.1
VCXO
Max. Ratings Storage temperature -55゜ C to +125゜
C
0.775 0.95 0.775
Frequency
#1 #2
VDD
Input current (max. mA) 1.0M+ 10M+ 40M+ 75M+ 85M+ 101M+ 135M+
0.675
(Pin#1 = Open or VIH) +1.8V 1.5 2.0 5.0 7.0 7.5 10 n.a.
PIN CONNECTION
No load
0.65
1 “ L” OPEN or “H” +2.5V 2.0 2.3 6.0 8.0 8.5 12 25.5

2 GND
+3.3V 2.4 3.5 7.0 9.0 10.5 15 29.5
0.675
3 Z OUTPUT
4 VDD
10 μA max. (Pin#1 = VIL) … -40゜ C to +85゜ C
Stand-by current*2
20 μA max. (Pin#1 = VIL) … -40゜ C to +105゜ C / +125゜
C
SOLDERING PATTERN Symmetry 45% to 55% at 1/2 VDD level
TCXO
1.0
6 ns max. 3 ns max.
Rise and fall times
Output (10% VDD to 90% VDD level) (10% VDD to 90% VDD level)
0.9
(-40゜
C to +85゜
C) "0" Level VOL : 10% VDD max.
1.5
0.01μF
～
"1" Level VOH : 90% VDD min.
0.1μF
1.8
OUTPUT WAVEFORM Start-up time 10 ms max.
OCXO
SSB phase noise -140 dBc / Hz, Typical at 1 kHz offset
(at VDD = +3.3V & 40.000 MHz) -160 dBc / Hz, Typical at 1 MHz offset
RMS jitter (12 kHz to 20.000 MHz band) 500 fs max. (180 fs, Typical at 40.000 MHz)
Reflow condition
+170゜ C ±10゜C for 1 to 2 minutes (preheating)
( * 1 ) F inal par t num ber to be as s i gned w i th pac k age ty pe, i nput v ol tage, fr equenc y s tabi l i ty, oper ati ng temper atur e and f requency.
e. g. 22S M O ( 2. 5V BW) 27.000MH z
( * 2 ) I nt er nal c r y s t al os c i l l ati on to be hal ted ( Pi n#1 = V IL )

MCF
TEST CIRCUIT
4.0±0.1
Package
1.75±0.1
Item 22SMO L
∅
1.5 +
0
2.0±0.1
-0 .1
Lid Metal
Base Ceramic
D
C
A
Sealing Seam
J

Terminal plating
(surface) / (under)
1000pcs
2.7 2.3 8.0 3.5 4.0 1.1 0.25 1.1 180 2000pcs
3000pcs
71
Crystal Clock Oscillators SPXO Wide Freq. 1.5 to 170 MHz 3.2x2.5 mm CMOS
32SMO STANDARD SPECIFICATIONS ● WIDE FREQUENCY RANGE

● CMOS OUTPUT
Item Specifications
XTAL

32SMO(A) : ±100 ppm over -20゜ C to +70゜
C
32SMO(B) : ±50 ppm over -20゜ C to +70゜
C
32SMO(C) : ±30 ppm over -20゜ C to +70゜
C
32SMO(D) : ±25 ppm over -20゜ C to +70゜
C
Frequency stability
32SMO(E) : ±20 ppm over -20゜ C to +70゜
C
C
C
CLK OSC
0.025gm (wt.)
C
C
3.2±0.2 C to +70゜
-20゜ C (Standard)
#4 #3 Operating C to +85゜
-40゜ C (WW = Option) 1.500 MHz to 80.000 MHz
Operating C (WWW = Option) 1.500 MHz to 80.000 MHz
C to +125゜
-40゜
Conditions
2.5±0.2
Supply voltage (VDD) +1.8V, +2.5V, +3.0V or +3.3V DC ±5% +2.5V, +3.0V or +3.3V DC ±5%
#1 #2
Supply voltage -0.3V to +4.0V DC
Absolute
VCXO
1.0±0.2
Max. Ratings Storage temperature C to +125゜

-55゜ C
1.0 1.2 1.0
Frequency
#1 #2
VDD
Input current (max. mA) 1.0M+ 10M+ 40M+ 75M+ 85M+ 101M+ 135M+
0.75
(Pin#1 = Open or VIH) +1.8V 1.5 2.0 5.0 7.0 7.5 10 n.a.
No load +2.5V 2.0 2.3 6.0 8.0 8.5 12 25.5
1.0
PIN CONNECTION
1 “ L” OPEN or “H”
2 GND +3.3V 2.4 3.5 7.0 9.0 10.5 15 29.5
0.75
3 Z OUTPUT
4 VDD
10 μA max. (Pin#1 = VIL) … -40゜ C to +85゜ C
Stand-by current*2
20 μA max. (Pin#1 = VIL) … -40゜ C to +105゜ C / +125゜
C
TCXO

1.3
6 ns max. 3 ns max.
Rise and fall times
Output (10% VDD to 90% VDD level) (10% VDD to 90% VDD level)
(-40゜
C to +85゜
1.1

1.9
0.01μF
～
0.1μF Load 15 pF max. (CMOS)
2.3
OCXO
OUTPUT WAVEFORM
RMS jitter (12 kHz to 20.000 MHz band) 500 fs max. (80 fs, Typical at 133.000 MHz)
Reflow condition
e. g. 32S M O( 1.8VD ) 24.000MH z
MCF
TEST CIRCUIT PACKAGE DATA TAPE SPECIFICATIONS

4.0±0.1
Package
1.75±0.1
Item 32SMO L
∅
1.5 +
0
2.0±0.1
-0 .1
Lid Metal
Base Ceramic
D
C
A
Sealing Seam
J

Terminal plating
(surface) / (under)
1000pcs
3.5 2.8 8.0 3.5 4.0 1.0 0.25 1.4 180
2000pcs
72
QuartzClock
Oscillators SPXO VDD = +0.8 to +1.8V 1.25 to 50 MHz 2.5x2.0 & 3.2x2.5 mm LOW POWER CMOS
22SMOLC & 32SMOLC (+0.8V, +1.2V, +1.5V or +1.8V FIXED MODELS) 2.5x2.0 mm
3.2x2.5 mm STANDARD SMD CLOCK OSCILLATORS
22SMOLC STANDARD SPECIFICATIONS ● CMOS OUTPUT

● LOW VOLTAGE OPERATION
● LOW POWER CONSUMPTION
● PACKAGE SIZE 2.5x2.0 mm & 3.2x2.5 mm
XTAL
Item Specifications
General part number 22SMOLC*1 32SMOLC*1
22SMOLC(A) & 32SMOLC(A) : ±100 ppm over -20゜ C to +70゜
C
Actual size 22SMOLC(B) & 32SMOLC(B) : ±50 ppm over -20゜ C to +70゜
C
0.014 gm (wt.)
22SMOLC(C) & 32SMOLC(C) : ±30 ppm over -20゜ C to +70゜
C
22SMOLC(D) & 32SMOLC(D) : ±25 ppm over -20゜ C to +70゜
C
Frequency stability
22SMOLC(E) & 32SMOLC(E) : ±20 ppm over -20゜ C to +70゜
C
32SMOLC (over all conditions)
22SMOLC(AW) & 32SMOLC(AW) : ±100 ppm over -40゜ C to +85゜
C
CLK OSC
22SMOLC(BW) & 32SMOLC(BW) : ±50 ppm over -40゜ C to +85゜
C
22SMOLC(CW) & 32SMOLC(CW) : ±30 ppm over -40゜ C to +85゜
C
22SMOLC(DW) & 32SMOLC(DW) : ±25 ppm over -40゜ C to +85゜
C
Operating -20゜ C to +70゜ C (Standard)
temperature -40゜ C to +85゜ C (W = Option)
Operating
Supply voltage (VDD) +0.8V, +1.2V, +1.5V or +1.8V DC ±5%
Conditions
Actual size Stand-by control VIH : 70% VDD min.
0.025 gm (wt.)
22SMOLC 32SMOLC Max. Ratings Storage temperature -55゜ C to +100゜C
VCXO
2.5±0.1 3.2±0.2
1.4 mA max. (VDD = +0.8V)
#4 #3 #4 #3 Input current (no load)
2 mA max. (VDD = +1.2V)
(Pin#1 = Open or VIH)
3 mA max. (VDD = +1.5V & +1.8V)
2.0±0.1

2.5±0.2

#1 #2 Rise and fall times 4 ns max. (20% VDD to 80% VDD level)
Output
#1 #2
(-40゜C to +85゜
C)
"0" Level VOL : 20% VDD max.
0.9±0.1

1.0±0.2
TCXO
0.775 0.95 0.775
#1 #2 1.0 1.2 1.0
#1 #2 Disable delay time 50 μs max.
0.675

0.75
0.65

1.0
Aging ±5 ppm max. at +25゜ C ±3゜C for first year.

0.675
#4 #3
SSB phase noise
0.75
-130 dBc / Hz, Typical at 1 kHz offset

PIN
1
CONNECTION
“ L” OPEN or “H”
#4 #3 (at VDD = +1.2V & 48.000 MHz)
2 GND
PIN CONNECTION C ±10゜
+250゜ C for 10 seconds
3 Z OUTPUT
“ L” OPEN or “H” Reflow condition
C ±10゜
1
4 VDD
Z : high impedance
2
Z
GND
OUTPUT
+170゜ C for 1 to 2 minutes (preheating)
3
OCXO
4 VDD ( * 1 ) F inal par t num ber to be as s i gned w i th pac k age ty pe, i nput v ol tage, fr equenc y s tabi l i ty, oper ati ng tem per atur e a nd f requency.
Z : High impedance
e. g. 22S M O LC ( 1. 2 VD ) 27.000M H z
SOLDERING PATTERN
22SMOLC 32SMOLC PACKAGE DATA TAPE SPECIFICATIONS
1.0 1.3 4.0±0.1
Package
1.75±0.1
∅
L 1.5 + 2.0±0.1
22SMOLC & 32SMOLC 0
0.9
-0 .1
1.1
Item
1.5
0.01 μF
Lid Metal
1.9
0.01 μF
～～
0.1 μF 0.1 μF
Base Ceramic
D
1.8 2.3
C
A
Sealing Seam
MCF
OUTPUT WAVEFORM M B F
J
22SMOLC
Gold / Nickel
Terminal plating
(surface) / (under) A B C D F J L M Reel Dia. Qty/Reel
1000pcs
RoHS Compliant (Pb-free) 2.7 2.3 8.0 3.5 4.0 1.1 0.25 1.1 180 2000pcs
3000pcs
32SMOLC
TEST CIRCUIT A B C D F J L M Reel Dia. Qty/Reel
1000pcs
3.5 2.8 8.0 3.5 4.0 1.0 0.3 1.4 180
2000pcs
73
Crystal Clock Oscillators SPXO Wide Freq. 1 to 220 MHz 5.0x3.2 mm CMOS

● WIDE FREQUENCY RANGE
Item Specifications
XTAL
General part number 99SMO*1*2

Frequency range 1.600 MHz to 165.000 MHz 1.600 MHz to 220.000 MHz 1.600 MHz to 220.000 MHz 1.000 MHz to 60.000 MHz
99SMO(A) : ±100 ppm over -20゜

C to +70゜
C
99SMO(B) : ±50 ppm over -20゜C to +70゜
C
99SMO(C) : ±30 ppm over -20゜C to +70゜
C
99SMO(D) : ±25 ppm over -20゜C to +70゜
C
Frequency stability*2 : ±20 ppm over -20゜
99SMO(E) C to +70゜
C
Actual size (over all conditions) : ±100 ppm over -40゜
99SMO(AW) C to +85゜
C
: ±50 ppm over -40゜C to +85゜
C
CLK OSC
0.052 gm (wt.) 99SMO(BW)

99SMO(CW) : ±30 ppm over -40゜C to +85゜
C
99SMO 99SMO(DW) : ±25 ppm over -40゜C to +85゜
C
-20゜C to +70゜C (Standard)
#4
5.0±0.2
#3
Operating -40゜C to +85゜C (W = Option)
temperature -40゜ C (WW = Option)...1.6 MHz to 133.0 MHz
C to +105゜
Operating
Conditions Supply voltage (VDD) +1.8V DC ±5% +2.5V DC ±5% +3.3V DC ±5% +5.0V DC ±10%
3.2±0.2

#1 #2
Absolute Supply voltage -0.3V to +4.0V DC -0.5V to +7.0V DC
Max. Ratings
1.2±0.2
Storage temperature C to +100゜

-55゜ C
VCXO
Frequency
1.2 1.34 1.2
VDD
#1 #2 1.0M+ 20M+ 35M+ 45M+ 80M+ 100M+ 110M+ 155M+
Input current (max.mA) +1.8V 1.5 2.0 2.5 7.5 15 25 35 45
1.0
PIN CONNECTION (Pin#1 = Open or VIH)

+2.5V 2.0 2.5 3.0 9.5 20 30 40 70
No load
1.2
2 GND
3 Z OUTPUT +3.3V 2.5 3.5 8.5 14 30 40 50 90
1.0
4 VDD
Z : high impedance
+5.0V 15 20 30 52 n.a. n.a. n.a. n.a.
#4 2.54 #3
Stand-by current*3 10 μA max. (Pin #1 = VIL) … -40゜

C to +85゜
C
SOLDERING PATTERN 45% to 55% at 1/2 VDD level
Symmetry 40% to 60% at 1/2 VDD level (VDD = +1.8V / F = 135.000 MHz to 165.000 MHz)
TCXO
1.4
Output Rise and fall times 5 ns max. (10% VDD to 90% VDD level)
1.2
(-40゜
C to +85゜
C)
2.2
0.01μF
～ "1" Level VOH : 90% VDD min.
0.1μF
Load 15 pF max. (CMOS, VDD = +5.0V / 30 pF max.)
2.54
OUTPUT WAVEFORM Enable delay time 10 ms max.
OCXO

Reflow condition
( * 1 ) F or m er ly 99SM OM
e. g. 99S MO( 2.5VC ) 20.000M H z

4.0±0.1
Package
1.75±0.1
TEST CIRCUIT Item 99SMO L

∅
1.5 +
0
2.0±0.1
-0 .1
Lid Metal
MCF
Base Ceramic
D
C
A
Sealing Seam
J

Terminal plating
(surface) / (under)
5.4 3.5 12.0 5.5 8.0 1.5 0.3 1.4 180 1000pcs
74
QuartzClock
Oscillators SPXO Wide Freq. 1 to 220 MHz 7.0x5.0 mm CMOS
97SMO (+1.8V, +2.5V, +3.3 V or +5.0V FIXED MODELS) 7.0x5.0 mm STANDARD SMD CLOCK OSCILLATORS

Item Specifications
XTAL
General part number 97SMO*1*2
Frequency range 1.600 MHz to 165.000 MHz 1.600 MHz to 220.000 MHz 1.600 MHz to 220.000 MHz 1.000 MHz to 60.000 MHz
97SMO(A) : ±100 ppm over -20゜

C to +70゜
C
97SMO(B) : ±50 ppm over -20゜C to +70゜
C
97SMO(C) : ±30 ppm over -20゜C to +70゜
C
97SMO(D) : ±25 ppm over -20゜C to +70゜
C
Frequency stability
97SMO(E) : ±20 ppm over -20゜C to +70゜
C
97SMO(AW) : ±100 ppm over -40゜C to +85゜
C
C
CLK OSC
0.157 gm (wt.)
C
C
7.0±0.2 Operating -20゜C to +70゜
C (Standard)
#4 #3 temperature -40゜C to +85゜
C (W = Option)
Operating +1.8V DC ±5% +2.5V DC ±5% +3.3V DC ±5% +5.0V DC ±10%
Supply voltage (VDD)
Conditions
5.0±0.2

Absolute Supply voltage -0.3V to +4.0V DC -0.5V to +7.0V DC
#1 #2
-55゜ C
1.35±0.2
VCXO
Frequency
VDD
3.68 1.0M+ 20M+ 35M+ 45M+ 80M+ 100M+ 110M+ 155M+
Input current (max. mA)
1.4 1.4
#1 #2 +1.8V 1.5 2.0 2.5 7.5 15 25 35 45
+2.5V 2.0 2.5 3.0 9.5 20 30 40 70
1.2
No load
PIN CONNECTION +3.3V 2.5 3.5 8.5 14 30 40 50 90
2.6
2 GND +5.0V 15 20 30 52 n.a. n.a. n.a. n.a.
3 Z OUTPUT
Stand-by current*3 10 μA max. (Pin#1 = VIL) … -40゜
C to +85゜
C
1.2
4 VDD
#4 5.08 #3 Z : high impedance
45% to 55% at 1/2 VDD level
Symmetry 40% to 60% at 1/2 VDD level (VDD = +1.8V / F = 135.000 MHz to 165.000 MHz)
SOLDERING PATTERN Rise and fall times 5 ns max. (10% VDD to 90% VDD level)
TCXO
1.8 Output
(-40゜
C to +85゜
2.0
Load 15 pF max. (CMOS, VDD = +5.0V / 30 pF max.)

4.2
0.01μF Disable delay time 200 ns max.

～
0.1μF Enable delay time 10 ms max.
5.08 Start-up time 10 ms max.
OUTPUT WAVEFORM +250゜C ±10゜ C for 10 seconds
OCXO
Reflow condition
( * 1 ) For m er l y 97S M O ( K )
( * 2 ) Fi nal par t num ber to be as s i gned w i th pac k age ty pe, i nput v ol tage, fr equenc y s tabi l i ty, oper ati ng temper atur e and f requency.
e. g. 97S M O ( 3. 3V CW) 16.000M H z
( * 3 ) I nt er nal c r y s t al osc i l l ati on to be hal ted ( Pi n#1 = V IL )

4.0±0.1
Package
1.75±0.1
Item 97SMO L
∅
1.5 +
0
2.0±0.1
-0 .1
Lid Metal MCF
Base Ceramic
D
TEST CIRCUIT
C
A
Sealing Seam
J

Terminal plating
(surface) / (under)
7.4 5.4 16.0 7.5 8.0 1.5 0.3 1.9 180 1000pcs
75
Crystal Clock Oscillators SPXO ±8 to ±15 ppm 4 to 55 MHz 2.5x2.0 mm CMOS
22SMOHG (+1.8V, +2.5V, +3.0V or +3.3V HIGH STABILITY FIXED MODELS) 2.5x2.0 mm STANDARD SMD CLOCK OSCILLATORS
22SMOHG STANDARD SPECIFICATIONS ● HIGH STABILITY CMOS OUTPUT

Item Specifications
General part number 22SMOHG*1
XTAL

Standard frequencies (MHz) 5.000, 10.000, 12.000, 16.000, 20.000, 24.000, 32.000, 40.000, 44.000
22SMOHG(F) : ±15 ppm over -40゜ C to +85゜C
Frequency stability*2
22SMOHG(G) : ±10 ppm over -40゜ C to +85゜C
22SMOHG(H) : ±8 ppm over -40゜ C to +85゜C
Operating
C to +85゜
-40゜ C (Standard)
Actual size temperature
Operating
CLK OSC
0.014 gm (wt.) Supply voltage (VDD) +1.8V, +2.5V, +3.0V or +3.3V DC ±10%
Conditions
22SMOHG voltage (Pin#1) VIL : 30% VDD max.*3
#4
2.5±0.1
#3 Absolute Supply voltage -0.3V to +4.0V DC
C
Input current (Pin#1 = Open or VIH) 6 mA max. (no load)
2.0±0.1

#1 #2 Symmetry 45% to 55% at 1/2 VDD level
0.9±0.1
Output
VCXO
(-40゜C to +85゜
C)
0.775 0.95 0.775 "1" Level VOH : 90% VDD min.
#1 #2
0.675

CONNECTION
PIN
0.65
2 GND
0.675
3 Z OUTPUT
4 VDD
SOLDERING PATTERN
RMS jitter (12 kHz to 20.000 MHz band) 181 fs, Typical (at VDD = +2.5V & 48.000 MHz)
TCXO
1.0
Reflow condition
+170゜ C ±10゜ C for 1 to 2 minutes (preheating)
0.9
1.5
0.01μF
e. g. 22S M OH G( 3.0VF ) 20.000MH z
～ ( * 2 ) T he f r eque nc y s tabi l i ty i s i nc l us i v e of fr equenc y tol er anc e ( + 25 ゜
C) , tem per atur e s tabi l i ty ( -40゜
C to + 85゜
C),
0.1μF input v olt a ge c hange, l oad c hange, r efl ow fr equenc y s hi ft and agi ng ( 1s t y ear at + 25 ゜ C).
1.8
PACKAGE DATA
OUTPUT WAVEFORM Package
OCXO
Item 22SMOHG
Lid Metal
Base Ceramic
Sealing Seam
Gold / Nickel
Terminal plating
(surface) / (under)
MCF
TEST CIRCUIT
TAPE SPECIFICATIONS
4.0±0.1
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
D
C
A
M B F
J

1000pcs
2.7 2.3 8.0 3.5 4.0 1.1 0.25 1.1 180 2000pcs
3000pcs
76
QuartzClock
Oscillators SPXO ±8 to ±15 ppm 4 to 55 MHz 3.2x2.5 mm CMOS

Item Specifications
XTAL
32SMOHG(F) : ±15 ppm over -40゜ C to +85゜
C
32SMOHG(G) : ±10 ppm over -40゜ C to +85゜
C
32SMOHG(H) : ±8 ppm over -40゜ C to +85゜
C
Operating
Actual size C to +85゜
-40゜ C (Standard)
temperature
Operating
CLK OSC
0.025 gm (wt.) Supply voltage (VDD) +1.8V , +2.5V , +3.0V or +3.3V DC ± 10%
Conditions
3.2±0.2
#4 #3 Absolute
C
Input current
7 mA max. (no load)
2.5±0.2

#1 #2 Symmetry 45% to 55% at 1/2 VDD level
VCXO
Output
1.0±0.2
(-40゜C to +85゜
C)
1.0 1.2 1.0
#1 #2
0.75

1.0
PIN CONNECTION
2 GND Start-up time 10 ms max.
0.75
3 Z OUTPUT
#4 #3
4 VDD
Z : high impedance
TCXO
SOLDERING PATTERN RMS jitter (12 kHz to 20.000 MHz band) 168 fs, Typical (at VDD = +3.3V & 48.000 MHz)
1.3 +250゜C ±10゜ C for 10 seconds
Reflow condition
( * 1 ) Fi nal par t num ber to be as s i gned w i th pac k age ty pe, i nput v ol tage, fr equenc y s tabi l i ty, oper ati ng temper atur e and f requency.
1.1
e. g. 32S M O H G ( 3. 0 VG) 44.000MH z

( * 2 ) The f r equenc y s t a bi l i ty i s i nc l us i v e of fr equenc y tol er anc e ( + 25 ゜
C) , temper atur e s tabi l i ty ( -40 ゜
C to + 85゜
C) ,
1.9
0.01μF
～ i nput v ol t age c hange, l oad c hange, r efl ow fr equenc y s hi ft and agi ng ( 1s t y ear at + 25 ゜ C).
0.1μF
PACKAGE DATA
2.3
Package
OCXO
OUTPUT WAVEFORM Item 32SMOHG
Lid Metal
Base Ceramic
Sealing Seam
Gold / Nickel
Terminal plating
(surface) / (under)
RoHS Compliant (Pb-free) MCF
TEST CIRCUIT TAPE SPECIFICATIONS

4.0±0.1
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
D
C
A
M B F
J

1000pcs
3.5 2.8 8.0 3.5 4.0 1.0 0.25 1.4 180
2000pcs
77
Crystal Clock Oscillators SPXO ±8 to ±15 ppm 4 to 55 MHz 5.0x3.2 mm CMOS

Item Specifications
XTAL

99SMOHG(F) : ±15 ppm over -40゜ C to +85゜
C
99SMOHG(G) : ±10 ppm over -40゜ C to +85゜
C
99SMOHG(H) : ±8 ppm over -40゜ C to +85゜
C
Operating
C to +85゜
-40゜ C (Standard)
Actual size temperature
Operating
CLK OSC
0.052 gm (wt.) Supply voltage (VDD) +1.8V, +2.5V, +3.0V or +3.3V DC ±10%
Conditions
5.0±0.2
#4 #3
Absolute
-40゜ C
3.2±0.2
Input current (Pin#1 = Open or VIH) 7.5 mA max. (no load)

#1 #2
1.05±0.1
VCXO

1.2 2.6 1.2 (-40゜C to +85゜
C)
#1 #2 "1" Level VOH : 90% VDD min.
0.8
PIN CONNECTION
1.6

2 GND
3 Z OUTPUT
0.8
4 VDD
#4 #3 Z : high impedance Start-up time 10 ms max.
SOLDERING PATTERN (at VDD = +1.8V & 48.000 MHz) -162 dBc / Hz, Typical at 1 MHz offset
1.3 2.6 1.3
TCXO

1.0
Reflow condition
1.6
0.01μF
～
0.1μF ( * 1 ) Fi nal par t n umber to be as s i gned w i th pac k age ty pe, i nput v ol tage, fr equenc y s tabi l i ty, oper ati ng tem pe rat ure and f requency.
1.0
3.9 e. g. 99S M OH G( 3.0VF ) 40.000M H z

( * 2 ) The f r equenc y s tabi l i ty i s i nc l us i v e of fr equenc y tol er anc e ( + 25 ゜
C) , temper atur e s tabi l i ty ( -40 ゜
C to + 85゜
C),
i nput v ol t age c hange, l oad c hange, r efl ow fr equenc y s hi ft and agi ng ( 1s t y ear at + 25 ゜ C).
3
OUTPUT WAVEFORM ( * ) I nt er nal c r y s tal os c i l l ati on to be hal ted ( Pi n#1 = V )
IL
PACKAGE DATA
Package
OCXO
Item 99SMOHG
Lid Metal
Base Ceramic
Sealing Seam
Gold / Nickel
Terminal plating
TEST CIRCUIT (surface) / (under)
MCF
TAPE SPECIFICATIONS
4.0±0.1
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
D
C
A
M B F
J

5.4 3.5 12.0 5.5 8.0 1.5 0.3 1.4 180 1000pcs
78
QuartzClock
Oscillators SPXO ± 10 to ± 15 ppm 4 to 55 MHz 7.0x5.0 mm CMOS

Item Specifications
XTAL
Frequency stability*2 97SMOHG(F) : ±15 ppm over -40゜ C to +85゜
C
(over all conditions) 97SMOHG(G) : ±10 ppm over -40゜ C to +85゜
C
Operating
C to +85゜
-40゜ C (Standard)
temperature
Actual size Operating
Supply voltage (VDD) +1.8V, +2.5V, +3.0V or +3.3V DC ± 10%
Conditions
CLK OSC
0.157 gm (wt.) Stand-by control VIH : 70% VDD min.
97SMOHG Absolute Supply voltage -0.3V to +4.0V DC
Max. Ratings Storage temperature
7.0±0.2
#4 #3
-40゜ C to +85゜
C
Input current
8 mA max. (no load)
5.0±0.2

#1 #2
1.35±0.2
VCXO
(-40゜C to +85゜
C)
1.4 3.68 1.4
#1 #2 Load 15 pF max. (CMOS)
1.2
PIN CONNECTION
2.6
2
3 Z
GND
OUTPUT
1.2
4 VDD
#4 5.08 #3 Z : high impedance
SOLDERING PATTERN
TCXO
+250゜ C ±10゜ C for 10 seconds
1.8 Reflow condition
( * 1 ) F inal par t num ber to be as s i gned w i th pac k age ty pe, i nput v ol tage, fr equenc y s tabi l i ty, oper ati ng tem per atur e a nd f requency.
2.0
e. g. 97S M O H G ( 3. 0VF ) 40.000M H z

( * 2 ) T he f r equenc y s t abi l i ty i s i nc l us i v e of fr equenc y tol er anc e ( + 25 ゜
C to + 85゜
C) ,
4.2
input v olt age c han ge, l oad c hange, r efl ow fr equenc y s hi ft and agi ng ( 1s t y ear at + 25 ゜ C).
0.01μF ( * 3 ) I nt er nal c r y s t al os c i l l ati on to be hal ted ( Pi n#1 = V IL )
～
0.1μF
5.08 PACKAGE DATA

Package
97SMOHG
OUTPUT WAVEFORM Item
OCXO
Lid Metal
Base Ceramic
Sealing Seam
Gold / Nickel
Terminal plating
(surface) / (under)
MCF
TEST CIRCUIT TAPE SPECIFICATIONS
4.0±0.1
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
D
C
A
M B F
J

7.4 5.4 16.0 7.5 8.0 1.5 0.3 1.9 180 1000pcs
79
Crystal Clock Oscillators SPXO ± 8 to ± 15 ppm 55 to 160 MHz 7.0x5.0, 5.0x3.2 & 3.2x2.5 mm CMOS
3.2x2.5 mm
97 / 99 / 32SMOHGU (+1.8V to +3.3V HIGH STABILITY FIXED MODELS) 5.0x3.2 mm
7.0x5.0 mm
STANDARD SMD CLOCK OSCILLATORS
97SMOHGU STANDARD SPECIFICATIONS ● HIGH FREQUENCY

● HIGH STABILITY CMOS OUTPUT
● PACKAGE SIZE 7.0x5.0, 5.0x3.2 & 3.2x2.5 mm
Item Specifications
XTAL
General part number*1 97SMOHGU 99SMOHGU 32SMOHGU

97 / 99 / 32SMOHGU(F) : ±15 ppm over -40゜
C to +85゜
C
97 / 99 / 32SMOHGU(G) : ±10 ppm over -40゜
C to +85゜
C
97 / 99 / 32SMOHGU(H) : ±8 ppm over -40゜C to +85゜
C
0.157 gm (wt.) Operating
C to +85゜
-40゜ C (Standard)
temperature
99SMOHGU Operating
Supply voltage (VDD) +1.8V , +2.5V, +3.0V or +3.3V DC ±10%
CLK OSC
Conditions
Absolute
-40゜ C
Input current 30 mA max. (Pin#1 = Open or VIH)
Actual size
0.052 gm (wt.) Symmetry 45% to 55% at 1/2 VDD level
32SMOHGU Output
VCXO
(-40゜C to +85゜
C)
Actual size SSB phase noise
(at VDD = +3.3V & 80.000 MHz)
0.025 gm (wt.)
C ±10゜
Reflow condition
TCXO
97SMOHGU 99SMOHGU C ±10゜

7.0±0.2 5.0±0.2 ( * 1 ) F inal par t number to be as s i gned w i th pac k age ty pe, i nput v ol tage, fr equenc y s tabi l i ty, oper ati ng tem pe rat ure and f requency.
#4 #3
#4 #3 e. g. 97S M OH GU ( 3.0VF ) 80.000MH z
( * 2 ) T he f r eque nc y s tabi l i ty i s i nc l us i v e of fr equenc y tol er anc e ( + 25 ゜
C to + 85゜
C),
input v olt a ge c hange, l oad c hange, r efl ow fr equenc y s hi ft and agi ng ( 1s t y ear at + 25 ゜ C).
3.2±0.2
5.0±0.2
3
( * ) I nt er nal c r y s tal os c i l l ati on to be hal ted ( Pi n#1 = V IL )
#1 #2
#1 #2
1.05±0.1
1.35±0.2
4.0±0.1
Package
1.75±0.1
1.4 3.68 1.4 1.2 2.6 1.2 Item 97 / 99 / 32SMOHGU L
∅
1.5 +
0
2.0±0.1
#1 #2 #1 #2 -0 .1
Lid Metal
OCXO
0.8
1.2
Base Ceramic
1.6
2.6
C
A
Sealing Seam
0.8
1.2
5.08 #4 #3
#4 #3
PIN CONNECTION Terminal Tungsten (metalized) M B F
J
PIN CONNECTION 1 “ L” OPEN or “H”

1 “ L” OPEN or “H” 2 GND
Gold / Nickel 97SMOHGU
2 GND 3 Z OUTPUT
Terminal plating
3
4
Z
VDD
OUTPUT 4 VDD
Z : high impedance (surface) / (under) A B C D F J L M Reel Dia. Qty/Reel
Z : high impedance 7.4 5.4 16.0 7.5 8.0 1.5 0.3 1.9 180 1000pcs
32SMOHGU SOLDERING 99SMOHGU
3.2±0.2 PATTERN TEST CIRCUIT 5.4 3.5 12.0 5.5 8.0 1.5 0.3 1.4 180 1000pcs
MCF
#4 #3
97SMOHGU 32SMOHGU
1.8
2.5±0.2

1000pcs
2.0
3.5 2.8 8.0 3.5 4.0 1.0 0.25 1.4 180

2000pcs
4.2
#1 #2 0.01μF
～
0.1μF
5.08
OUTPUT WAVEFORM
1.0±0.2
1.0 1.2 1.0

99SMOHGU
#1 #2 1.3 2.6 1.3
0.75
1.0 1.6 1.0
0.01μF
～
1.0
0.1μF
3.9
0.75
#4 #3
32SMOHGU
1.3
PIN CONNECTION
1.1
2 GND
3 Z OUTPUT 0.01μF
1.9
4 VDD ～
Z : high impedance 0.1μF
2.3
80
Crystal Clock Oscillators SPXO 13.5 to 400 MHz 7.0x5.0 mm LVPECL
57SMO (+2.5V or +3.3V FIXED LVPECL MODELS) 7.0x5.0 mm STANDARD SMD CLOCK OSCILLATORS
57SMO STANDARD SPECIFICATIONS ● LVPECL OUTPUT

Item Specifications
XTAL
57SMO(A) : ±100 ppm over -20゜ C to +70゜
C
57SMO(B) : ±50 ppm over -20゜ C to +70゜
C
57SMO(C) : ±30 ppm over -20゜ C to +70゜
C
57SMO(D) : ±25 ppm over -20゜ C to +70゜
C
Frequency stability
57SMO(E) : ±20 ppm over -20゜ C to +70゜
C
Actual size
C
C
CLK OSC
0.175 gm (wt.) 57SMO(CW) : ±30 ppm over -40゜ C to +85゜
C
57SMO(DW) : ±25 ppm over -40゜ C to +85゜
C
57SMO -20゜C to +70゜ C (Standard)
Operating
7.0±0.2
-40゜C to +85゜ C (W = Option)
temperature
C to +105゜ C (WW = Option)
#6 #5 #4
Operating -40゜
Conditions Supply voltage (VDD) +2.5V DC ±5% +3.3V DC ±5%
5.0±0.2

#1 #2 #3
Absolute
1.5±0.15
Max. Ratings Storage C to +125゜

-50゜ C
temeperature
VCXO
1.4 1.4 1.4
Input current (Pin#1 = Open or VIH) 88 mA max. (55mA, Typical)

1.2
#1 #2 #3 Stand-by current*2 (Pin#1 = VIL) 30 μA max.

PIN CONNECTION
Symmetry 45% to 55% ( 13.500 MHz to 350.000 MHz)
2.6
#6 #5 #4 2 GND
3 Z OUTPUT (at crossing point) 40% to 60% (350.000 MHz to 400.000 MHz)
1.2
4 VDD
Rise and fall times

2.54 2.54 Z : high impedance
5.08 Output (20% to 80% of amplitude)

0.7 ns max. (0.3 ns, Typical)
(-40゜C to +85゜
C)
"0" Level VOL : +0.67V to +1.195V VOL : +1.47V to +1.745V
SOLDERING PATTERN "1" Level VOH : +1.415V to +1.760V VOH : +2.215V to +2.42V
1.6 1.6 1.6
TCXO
Load 50 Ω into VDD -2V
1.6
SSB phase noise

2.2
0.01μF -147 dBc / Hz, Typical at 100 kHz offset

～
(at VDD = +3.3V & 155.520 MHz)
1.6
0.1μF
2.54 2.54
RMS jitter (12 kHz to 20.000 MHz band) 0.5 ps max.
5.08
(at VDD = +3.3V & 155.520 MHz)
TEST CIRCUIT
Differential output voltage 0.4Vp-p min.
OCXO
C ±10゜
Reflow condition
e. g. 57S M O ( 3. 3V BW) 155.520M H z
PACKAGE DATA
OUTPUT WAVEFORM
Package
Item 57SMO MCF
Lid Metal
Base Ceramic
Sealing Seam
TAPE SPECIFICATIONS Gold / Nickel
Terminal plating
4.0±0.1 (surface) / (under)
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
D
C
A
M B F
J

7.4 5.4 16.0 7.5 8.0 1.5 0.3 1.9 180 1000pcs
81
Crystal Clock Oscillators SPXO 6 to 175 MHz 2.5x2.0mm LVPECL
22SMO-LVP (+2.5V or +3.3V FIXED LVPECL MODELS) 2.5x2.0 mm STANDARD SMD CLOCK OSCILLATORS
22SMO-LVP STANDARD SPECIFICATIONS ● LVPECL OUTPUT

Item Specifications
General part number 22SMO-LVP*1
XTAL

22SMO-LVP(A) : ±100 ppm over -20゜
C to +70゜
C
22SMO-LVP(B) : ±50 ppm over -20゜C to +70゜
C
22SMO-LVP(C) : ±30 ppm over -20゜C to +70゜
C
22SMO-LVP(D) : ±25 ppm over -20゜C to +70゜
C
Frequency stability 22SMO-LVP(E) : ±20 ppm over -20゜C to +70゜
C
(over all conditions) 22SMO-LVP(AW) : ±100 ppm over -40゜
C to +85゜
C
22SMO-LVP(BW) : ±50 ppm over -40゜C to +85゜
C
Actual size : ±30 ppm over -40゜
22SMO-LVP(CW) C to +85゜
C
CLK OSC
0.015 gm (wt.) 22SMO-LVP(DW) : ±25 ppm over -40゜C to +85゜

C
-20゜ C (Standard)
22SMO-LVP temperature C to +85゜
Operating
2.5±0.1
Supply voltage (VDD) +2.5V DC ±5% +3.3V DC ±5%
Conditions
#6 #5 #4
2.0±0.1
Absolute
-50゜ C
#1 #2 #3
temeperature
Input current (Pin#1 = Open or VIH) 45 mA, Typical. (70 mA max.)
VCXO
Stand-by current*2 (Pin#1 = VIL) 15 μA max.

0.9±0.1
Symmetry 45% to 55% at crossing point

0.6 0.5 0.6 Rise and fall times 0.25 ns, Typical / 0.5 ns max.
(20% to 80% of amplitude)
Output
"0" Level VOL : VDD -1.810V to VDD -1.620V
0.7
PIN CONNECTION (-40゜C to +85゜

C)
2 N.C. "1" Level VOH : VDD -1.025V to VDD -0.88V
0.6
3 GND
4 Z OUTPUT
0.7
5 Z C-OUTPUT
6 VDD
Z : high impedance Start-up time 10 ms max.
SSB phase noise
TCXO
SOLDERING PATTERN (at VDD = +3.3V & 155.520 MHz)

0.75
0.85

1.35
0.01 μF
～
0.1 μF Aging ±5 ppm max. at +25゜ C ±3゜ C for first year
0.6
C ±10゜
2.1 Reflow condition
OUTPUT WAVEFORM ( * 1 ) Fi nal par t n umber to be as s i gned w i th pac k age ty pe, i nput v ol tage, fr equenc y s tabi l i ty, oper ati ng tem pe rat ure and f requency.
e. g. 22S M O -LVP( 3.3VD W) 156.250MH z
OCXO

4.0±0.1
Package
1.75±0.1
Item 22SMO-LVP L
∅
1.5 +
0
2.0±0.1
-0 .1
Lid Metal
Base Ceramic
D
C
A
TEST CIRCUIT Sealing Seam

J
MCF

Terminal plating
(surface) / (under) 2.7 2.3 8.0 3.5 4.0 1.1 0.25 1.1 180
1000pcs
2000pcs
3000pcs
82
Crystal Clock Oscillators SPXO 5 to 250 MHz 3.2x2.5 & 5.0x3.2mm LVPECL
32SMO-LVP & 99SMO-LVP (+2.5V or +3.3V FIXED LVPECL MODELS) 3.2x2.5 mm

5.0x3.2 mm
STANDARD SMD CLOCK OSCILLATORS
32SMO-LVP STANDARD SPECIFICATIONS ● LVPECL OUTPUT

● PACKAGE SIZE 3.2x2.5 & 5.0x3.2 mm
Item Specifications
General part number 32SMO-LVP*1 99SMO-LVP*1
XTAL
32SMO-LVP(A) & 99SMO-LVP(A) : ±100 ppm over -20゜
C to +70゜
C
32SMO-LVP(B) & 99SMO-LVP(B) : ±50 ppm over -20゜C to +70゜
C
32SMO-LVP(C) & 99SMO-LVP(C) : ±30 ppm over -20゜C to +70゜
C
32SMO-LVP(D) & 99SMO-LVP(D) : ±25 ppm over -20゜C to +70゜
C
Frequency stability 32SMO-LVP(E) & 99SMO-LVP(E) : ±20 ppm over -20゜C to +70゜
C
(over all conditions) 32SMO-LVP(AW) & 99SMO-LVP(AW) C to +85゜
: ±100 ppm over -40゜ C
Actual size 32SMO-LVP(BW) & 99SMO-LVP(BW) : ±50 ppm over -40゜C to +85゜
C
CLK OSC
0.024 gm (wt.) 32SMO-LVP(CW) & 99SMO-LVP(CW) : ±30 ppm over -40゜C to +85゜
C
32SMO-LVP(DW) & 99SMO-LVP(DW) : ±25 ppm over -40゜C to +85゜
C
-20゜ C (Standard)
99SMO-LVP temperature C to +85゜
Operating
Conditions
Absolute
-50゜ C
temeperature
VCXO
Input current (Pin#1 = Open or VIH) 70 mA max.
Actual size Symmetry 45% to 55% at crossing point
Rise and fall times 0.5 ns max. (0.25 ns, Typical)
0.051 gm (wt.) (20% to 80% of amplitude)
Output
(-40゜C to +85゜
C) "0" Level VOL : VDD -1.81V to VDD -1.62V
32SMO-LVP 99SMO-LVP "1" Level VOH : VDD -1.025V to VDD -0.88V
3.2±0.2 5.0±0.2
#6 #5 #4 #6 #5 #4 Load 50 Ω into VDD -2V
2.5±0.2
3.2±0.2
TCXO
SSB phase noise
#1 #2 #3
(at VDD = +3.3V & 156.250 MHz)
#1 #2 #3
1.2±0.2
0.9±0.1

0.64
0.8 1.6 0.8
#1 #2 #3 Enable delay time 4 ms max.
Differential output voltage 0.4Vp-p min.
0.6
1.0
#1 #2 #3

1.2
1.3
#6 #5 #4
C ±10゜
1.0

0.6
#6 #5 #4
Reflow condition
0.6 2.54
OCXO
PIN CONNECTION PIN CONNECTION
1 “ L” OPEN or “H” 1 “ L” OPEN or “H” ( * 1 ) F inal par t num ber to be as s i gned w i th pac k age ty pe, i nput v ol tage, fr equenc y s tabi l i ty, oper ati ng tem per atur e a nd f requency.
2 N.C. 2 N.C. e. g. 99S M O - LV P (3.3VD W) 156.250MH z
3 GND 3 GND ( * 2 ) I nt er nal c r y s t al os c i l l ati on to be hal ted ( Pi n#1 = V IL )
4 Z OUTPUT 4 Z OUTPUT
5 Z C-OUTPUT 5 Z C-OUTPUT
PACKAGE DATA
6 VDD 6 VDD
Z : high impedance Z : high impedance TAPE SPECIFICATIONS
4.0±0.1
Package
1.75±0.1
SOLDERING PATTERN Item 32SMO-LVP & 99SMO-LVP L

∅
1.5 +
0
2.0±0.1
-0 .1
32SMO-LVP 99SMO-LVP
Lid Metal
1.0 0.8 1.0 0.85x6 Base Ceramic
D
C
A
Sealing Seam
1.0 0.9 1.0
MCF
1.2 1.0 1.2
0.01 μF 0.01μF
～～
0.1 μF
0.1μF Terminal Tungsten (metalized) M B F
J
0.26 0.26
1.27 1.27
Gold / Nickel
2.32
32SMO-HCS
Terminal plating
1000pcs
3.5 2.8 8.0 3.5 4.0 1.0 0.25 1.4 180
TEST CIRCUIT 2000pcs
99SMO-HCS
OUTPUT WAVEFORM A
5.4
B
3.5
C
12.0
D
5.5
F
8.0
J
1.5
L
0.3
M
1.4
Reel Dia.
180
Qty/Reel
1000pcs
83
Crystal Clock Oscillators SPXO 13.5 to 350 MHz 7.0x5.0 mm LVDS
67SMO (+2.5V or +3.3V FIXED LVDS MODELS) 7.0x5.0 mm STANDARD SMD CLOCK OSCILLATORS
67SMO STANDARD SPECIFICATIONS ● LVDS OUTPUT

Item Specifications
XTAL

67SMO(A) : ±100 ppm over -20゜ C to +70゜
C
67SMO(B) : ±50 ppm over -20゜ C to +70゜
C
67SMO(C) : ±30 ppm over -20゜ C to +70゜
C
67SMO(D) : ±25 ppm over -20゜ C to +70゜
C
Frequency stability
67SMO(E) : ±20 ppm over -20゜ C to +70゜
C
Actual size
C
C
CLK OSC

C
C
67SMO Operating -20゜C to +70゜ C (Standard)
7.0±0.2
temperature -40゜C to +85゜ C (W = Option)
#6 #5 #4
Operating
Conditions
5.0±0.2

#1 #2 #3 Absolute
-50゜ C
1.5±0.15
temeperature
VCXO
1.4 1.4 1.4 Input current (Pin#1 = Open or VIH) 70 mA max.

1.2
PIN CONNECTION
#1 #2 #3
1
2
“ L”
N.C.
OPEN or “H”
2.6
Rise and fall times

3 GND
#6 #5 #4 4
5
Z
Z
OUTPUT
C-OUTPUT (20% to 80% of amplitude)
0.7 ns max. (0.3 ns, Typical)
Output
1.2
6 VDD
(-40゜C to +85゜
C) "0" Level VOL : +1.10V, Typical (+0.9V min.)
"1" Level VOH : +1.43V, Typical (+1.6V max.)
5.08
Load 100 Ω (OUT-OUTN)

SOLDERING PATTERN
TCXO
1.6 1.6 1.6
SSB phase noise

(at VDD = +3.3V & 125.000 MHz)
1.6
RMS jitter (12 kHz to 20.000 MHz band)

2.2
0.01μF
～ (at VDD = +3.3V & 125.000 MHz)
1 ps max.
1.6
0.1μF
2.54 2.54
5.08
OUTPUT WAVEFORM Differential output voltage +0.33Vp-p, Typical (+0.25Vp-p min.)
OCXO
Reflow condition
e. g. 67S M O( 3.3VC ) 164.355MH z

4.0±0.1
Package
TEST CIRCUIT
1.75±0.1
Item 67SMO L
∅
1.5 +
0
2.0±0.1
-0 .1
Lid Metal
Base Ceramic
D
MCF
C
A
Sealing Seam
J

Terminal plating
(surface) / (under) 7.4 5.4 16.0 7.5 8.0 1.5 0.3 1.9 180 1000pcs
84
Crystal Clock Oscillators SPXO 6 to 175 MHz 2.5x2.0mm LVDS
22SMO-LVD (+2.5V or +3.3V FIXED LVDS MODELS) 2.5x2.0 mm STANDARD SMD CLOCK OSCILLATORS
22SMO-LVD STANDARD SPECIFICATIONS ● LVDS OUTPUT

Item Specifications
General part number 22SMO-LVD*1
XTAL
22SMO-LVD(A) : ±100 ppm over -20゜
C to +70゜
C
22SMO-LVD(B) : ±50 ppm over -20゜C to +70゜
C
22SMO-LVD(C) : ±30 ppm over -20゜C to +70゜
C
22SMO-LVD(D) : ±25 ppm over -20゜C to +70゜
C
Frequency stability 22SMO-LVD(E) : ±20 ppm over -20゜C to +70゜
C
(over all conditions) 22SMO-LVD(AW) : ±100 ppm over -40゜
C to +85゜
C
22SMO-LVD(BW) : ±50 ppm over -40゜C to +85゜
C
Actual size
22SMO-LVD(CW) : ±30 ppm over -40゜C to +85゜
C
CLK OSC
0.015 gm (wt.) 22SMO-LVD(DW) : ±25 ppm over -40゜C to +85゜
C
-20゜ C (Standard)
22SMO-LVD temperature C to +85゜
Operating
2.5±0.1
Conditions
#6 #5 #4
2.0±0.1
Absolute
-50゜ C
#1 #2 #3 temeperature
VCXO
0.9±0.1

0.6 0.5 0.6
Rise and fall times 0.4 ns max.
Output
0.7
PIN CONNECTION
2 N.C. (-40゜C to +85゜
0.6
3 GND
4
5
Z
Z
OUTPUT
C-OUTPUT
"1" Level VOH : +1.43V, Typical (+1.6V max.)
0.7
6 VDD
Z : high impedance Load 100 Ω (OUT-OUTN)
SOLDERING PATTERN SSB phase noise
-155 dBc / Hz, Typical at 10 MHz offset
TCXO
(at VDD = +3.3V & 156.25 MHz)
0.75
RMS jitter (12 kHz to 20.000 MHz band) 500 fs max. (100 fs, Typical at VDD = +3.3V & 156.25 MHz)
0.85

1.35
0.01 μF
～
0.1 μF Enable delay time 4 ms max.
0.6
2.1
Differential output voltage +0.33Vp-p, Typical (+0.25Vp-p min.)
OUTPUT WAVEFORM +250゜ C ±10゜ C for 10 seconds
Reflow condition
+175゜C ±10゜ C for 1 to 2 minutes (preheating)
OCXO
( * 1 ) Fi nal par t num ber to be as s i gned w i th pac k age ty pe, i nput v ol tage, fr equenc y s tabi l i ty, oper ati ng tem per atur e a nd f requency.
e. g. 22S M O - LV D ( 2.5VC ) 164.355M H z

4.0±0.1
Package
1.75±0.1
Item 22SMO-LVD L
∅
1.5 +
0
2.0±0.1
-0 .1
TEST CIRCUIT Lid Metal
Base Ceramic
D
C
A
Sealing Seam MCF

J

Terminal plating
(surface) / (under) 2.7 2.3 8.0 3.5 4.0 1.1 0.25 1.1 180
1000pcs
2000pcs
3000pca
85
Crystal Clock Oscillators SPXO 5 to 250 MHz 3.2x2.5 & 5.0x3.2mm LVDS
32SMO-LVD & 99SMO-LVD (+2.5V or +3.3V FIXED LVDS MODELS) 3.2x2.5 mm

32SMO-LVD STANDARD SPECIFICATIONS ● LVDS OUTPUT

Item Specifications
General part number 32SMO-LVD*1 99SMO-LVD*1
XTAL
32SMO-LVD(A) & 99SMO-LVD(A) : ±100 ppm over -20゜
C to +70゜
C
32SMO-LVD(B) & 99SMO-LVD(B) : ±50 ppm over -20゜C to +70゜
C
32SMO-LVD(C) & 99SMO-LVD(C) ±
: 30 ppm over -20゜ C to +70゜
C
Frequency stability 32SMO-LVD(D) & 99SMO-LVD(D) : ±25 ppm over -20゜C to +70゜
C
32SMO-LVD(E) & 99SMO-LVD(E) : ±20 ppm over -20゜C to +70゜
C
(over all conditions) 32SMO-LVD(AW) & 99SMO-LVD(AW) : ±100 ppm over -40゜
C to +85゜
C
32SMO-LVD(BW) & 99SMO-LVD(BW) : ±50 ppm over -40゜C to +85゜
C
Actual size 32SMO-LVD(CW) & 99SMO-LVD(CW) : ±30 ppm over -40゜C to +85゜
C
: ±25 ppm over -40゜
CLK OSC
32SMO-LVD(DW) & 99SMO-LVD(DW) C to +85゜

C
0.025 gm (wt.)
Operating -20゜C to +70゜ C (Standard)
99SMO-LVD temperature -40゜C to +85゜ C (W = Option)
Operating
Supply voltage (VDD) +2.5V DC ±5% or +3.3V DC ±5%
Conditions
Absolute
Max. Ratings Storage
C to +125゜
-50゜ C
temeperature
40 mA max. (32SMO-LVD)
Input current (Pin#1 = Open or VIH)
75 mA max. (99SMO-LVD)
VCXO

Actual size Symmetry 45% to 55% at crossing point
0.051 gm (wt.) Rise and fall times 0.4 ns max.
Output
32SMO-LVD 99SMO-LVD (-40゜C to +85゜
3.2±0.2 5.0±0.2 "1" Level VOH : +1.43V, Typical (+1.6V max.)
#6 #5 #4 #6 #5 #4
Load 100 Ω (OUT-C OUT)
2.5±0.2
3.2±0.2
TCXO
SSB phase noise

#1 #2 #3 #1 #2 #3
(at VDD = +3.3V & 133.000 MHz)
1.2±0.2
0.9±0.1
(at VDD = +3.3V & 133.000 MHz)

500 fs max. (125 fs, Typical)
0.8 1.6 0.8 0.64
#1 #2 #3
0.6
1.0
#1 #2 #3 Enable delay time 4 ms max.

1.2
Differential output voltage +0.33Vp-p Typical (+0.25Vp-p min.)

1.3
#6 #5 #4
1.0

0.6
#6 #5 #4
0.6 2.54
C ±10゜
Reflow condition
OCXO
PIN CONNECTION
C ±10゜
PIN CONNECTION
1 “ L” OPEN or “H” 1
2
“ L”
N.C.
OPEN or “H” +170゜ C for 1 to 2 minutes (preheating)
2 N.C.
3 GND 3
4 Z
GND
OUTPUT
4 Z OUTPUT
5 Z C-OUTPUT 5 Z C-OUTPUT e. g. 99S M O -LVD ( 2.5VC ) 164.355M H z
6 VDD 6 VDD ( * 2 ) I nt er nal c r ys tal os c i l l ati on to be hal ted ( Pi n#1 = V IL )
Z : high impedance Z : high impedance
SOLDERING PATTERN PACKAGE DATA TAPE SPECIFICATIONS

4.0±0.1
Package
1.75±0.1
32SMO-LVD 99SMO-LVD Item 32SMO-LVD & 99SMO-LVD L

∅
1.5 + 2.0±0.1
0
1.0 0.8 1.0 -0 .1
Lid Metal
1.0 0.9 1.0
Base Ceramic
D
0.01μF
～
C
A
MCF
0.1μF
0.26 0.26 Sealing Seam
M B F
J
OUTPUT WAVEFORM
Gold / Nickel 32SMO-LVD
Terminal plating
1000pcs
3.5 2.8 8.0 3.5 4.0 1.0 0.25 1.4 180
RoHS Compliant (Pb-free) 2000pcs
99SMO-LVD
TEST CIRCUIT 5.4 3.5 12.0 5.5 8.0 1.5 0.3 1.4 180 1000pcs
86
Crystal Clock Oscillators SPXO 13.5 to 220 MHz 7.0x5.0 mm HCSL
77SMO (+2.5V or +3.3V FIXED HCSL MODELS) 7.0x5.0 mm STANDARD SMD CLOCK OSCILLATORS
77SMO STANDARD SPECIFICATIONS ● HCSL OUTPUT

Item Specifications
77SMO*1
XTAL
General part number
77SMO(A) : ±100 ppm over -20゜ C to +70゜
C
77SMO(B) : ±50 ppm over -20゜ C to +70゜
C
77SMO(C) : ±30 ppm over -20゜ C to +70゜
C
77SMO(D) : ±25 ppm over -20゜ C to +70゜
C
Frequency stability
77SMO(E) : ±20 ppm over -20゜ C to +70゜
C
Actual size
C
C
CLK OSC
C
C
77SMO Operating -20゜C to +70゜ C (Standard)
7.0±0.2
temperature -40゜C to +85゜ C (W = Option)
#6 #5 #4
Operating
Conditions
5.0±0.2

#1 #2 #3 Absolute
-50゜ C
1.5±0.15
temeperature
VCXO
1.4 1.4 1.4 Input current (Pin#1 = Open or VIH) 60 mA max.
1.2
PIN CONNECTION
#1 #2 #3 1
2
“ L”
N.C.
OPEN or “H”
2.6
Rise and fall times

3 GND
#6 #5 #4 4
5
Z
Z
OUTPUT
C-OUTPUT (+0.175 V to +0.525 V DC level)
0.5 ns max.
Output
1.2
6 VDD
(-40゜C to +85゜
C) "0" Level VOL : -150mV to +150mV
5.08
"1" Level VOH : +580mV to +850mV
SOLDERING PATTERN Load 50 Ω
1.6 1.6 1.6 Start-up time 10 ms max.
TCXO
SSB phase noise
(at VDD = +3.3V & 155.520 MHz)
1.6

2.2
0.01μF
～
(at VDD = +3.3V & 155.520 MHz)
500 fs max. (85 fs, Typical)
1.6
0.1μF
2.54 2.54
5.08
OUTPUT WAVEFORM Differential output voltage +0.60Vp-p min. +0.65Vp-p min.
C ±10゜
OCXO
Reflow condition
e. g. 77S M O ( 3. 3V BW) 100.000M H z
PACKAGE DATA
Package
TEST CIRCUIT Item 77SMO
Lid Metal
Base Ceramic
MCF
Sealing Seam
Gold / Nickel
Terminal plating
(surface) / (under)
TAPE SPECIFICATIONS
4.0±0.1
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
D
C
A
M B F
J

7.4 5.4 16.0 7.5 8.0 1.5 0.3 1.9 180 1000pcs
87
Crystal Clock Oscillators SPXO 13.5 to 220 MHz 3.2x2.5 & 5.0x3.2mm HCSL
32SMO-HCS & 99SMO-HCS (+2.5V or +3.3V FIXED HCSL MODELS) 3.2x2.5 mm

32SMO-HCS STANDARD SPECIFICATIONS ● HCSL OUTPUT

Item Specifications
General part number 32SMO-HCS*1 99SMO-HCS*1
XTAL
32SMO-HCS(A) & 99SMO-HCS(A) : ±100 ppm over -20゜
C to +70゜
C
32SMO-HCS(B) & 99SMO-HCS(B) : ±50 ppm over -20゜C to +70゜
C
32SMO-HCS(C) & 99SMO-HCS(C) : ±30 ppm over -20゜C to +70゜
C
32SMO-HCS(D) & 99SMO-HCS(D) : ±25 ppm over -20゜C to +70゜
C
Frequency stability 32SMO-HCS(E) & 99SMO-HCS(E) : ±20 ppm over -20゜C to +70゜
C
(over all conditions) 32SMO-HCS(AW) & 99SMO-HCS(AW) : ±100 ppm over -40゜
C to +85゜
C
32SMO-HCS(BW) & 99SMO-HCS(BW) : ±50 ppm over -40゜C to +85゜
C
Actual size 32SMO-HCS(CW) & 99SMO-HCS(CW) : ±30 ppm over -40゜C to +85゜
C
: ±25 ppm over -40゜
CLK OSC
0.025 gm (wt.) 32SMO-HCS(DW) & 99SMO-HCS(DW) C to +85゜

C
-20゜C to +70゜ C (Standard)
Operating
99SMO-HCS -40゜C to +85゜ C (W = Option)
temperature
Operating -40゜C to +105゜ C (WW = Option)
Conditions Supply voltage (VDD) +2.5V DC ±5% +3.3V DC ±5%
C
Input current*2 (Pin#1 = Open or VIH) 60 mA max.
VCXO
Stand-by current (Pin#1 = VIL) 15 μA max.

Actual size
Rise and fall times 0.5 ns max.
(+0.175V to +0.525V DC level)
0.051 gm (wt.) Output
(-40゜C to +85゜
C) "0" Level VOL : -150mV to +150mV
32SMO-HCS 99SMO-HCS "1" Level VOH : +580mV to +850mV
#6
3.2±0.2
#5 #4 #6
5.0±0.2
#5 #4
Load 50 Ω
2.5±0.2
3.2±0.2
SSB phase noise

TCXO
(at VDD = +3.3V & 155.520 MHz)

#1 #2 #3
#1 #2 #3
RMS jitter (12 kHz to 20.000 MHz band) 500 fs max.
(at VDD = +3.3V & 155.520 MHz) (107 fs, Typical)
1.2±0.2
0.9±0.1
0.8 1.6 0.8 0.64 Disable delay time 200 ns max.

#1 #2 #3
0.6
1.0
Differential output voltage +0.4Vp-p min.

#1 #2 #3
1.2
1.3
#6 #5 #4
1.0
0.6
C ±10゜
#6 #5 #4
0.6 2.54
Reflow condition
OCXO
PIN CONNECTION PIN CONNECTION

1 “ L” OPEN or “H” 1 “ L” OPEN or “H”
2 N.C. 2 N.C. ( * 1 ) F inal par t number to be as s i gned w i th pac k age ty pe, i nput v ol tage, fr equenc y s tabi l i ty, oper ati ng tem pe rat ure and f requency.
3 GND 3 GND e. g. 99S M O -H C S( 2.5VC ) 164.355MH z
4 Z OUTPUT 4
5
Z
Z
OUTPUT
C-OUTPUT
5 Z C-OUTPUT
6 VDD 6 VDD
PACKAGE DATA
Z : high impedance Z : high impedance
TAPE SPECIFICATIONS
4.0±0.1
SOLDERING PATTERN Package
1.75±0.1
Item 32SMO-HCS & 99SMO-HCS L

∅
1.5 +
0
2.0±0.1
32SMO-HCS 99SMO-HCS -0 .1
1.0 0.8 1.0 0.85x6 Lid Metal
Base Ceramic
1.0 0.9 1.0
D
1.2 1.0 1.2
C
A
0.01μF 0.01μF
～
0.1μF ～
Sealing Seam
MCF
0.1μF
0.26 0.26
1.27 1.27
J
OUTPUT WAVEFOR Gold / Nickel 32SMO-HCS

Terminal plating
1000pcs
RoHS Compliant (Pb-free) 3.5 2.8 8.0 3.5 4.0 1.0 0.25 1.4 180
2000pcs
99SMO-HCS
TEST CIRCUIT A
5.4
B
3.5
C
12.0
D
5.5
F
8.0
J
1.5
L
0.3
M
1.4
Reel Dia.
180
Qty/Reel
1000pcs
88
Crystal Clock Oscillators SPXO Low Power 32.768 kHz 3.2x2.5 & 3.2x1.5 mm CMOS
327SMO(E) & 327SMO(J) (+1.5V to +5.0V 32.768 kHz MODELS) 3.2x2.5 mm

327SMO(E) STANDARD SPECIFICATIONS ● 32.768 kHz CMOS OUTPUT

● LOW POWER CONSUMPTION
● TUNING FORK CRYSTAL BUILT-IN
XTAL
Item Specifications
General part number*1 327SMO(E)*1 327SMO(J)*1

Output frequency 32.768 kHz
Frequency tolerance (at +25゜C) +30 ppm to -10 ppm (VDD = +1.5V to +5.5V) +28 ppm to -18 ppm (VDD = +1.5V to +3.6V)
Frequency vs. supply voltage change ±0.5 ppm max. (VDD = +1.5V to +5.5V) ±2.0 ppm max. (VDD = +1.5V to +3.6V)
A : +10 ppm to -120 ppm (-20゜ C to +70゜ C ref. to +25゜ C)
Temperature stability
Actual size
B : +10 ppm to -150 ppm (-40゜ C to +85゜ C ref. to +25゜ C)
Operating
CLK OSC
0.022 gm (wt.) -40゜ C to +85゜ C (Standard)

temperature
Operating
Supply voltage (VDD) +1.5V to +5.5V DC +1.5V to +3.6V DC
327SMO(J) Conditions
Supply voltage -0.3V to +7.0V DC -0.3V to +4.0V DC
Absolute
Max. Ratings Storage temperature -55゜ C to +125゜ C -55゜ C to +125゜ C
1 μA, Typical (1.5 μA max.) at VDD = +3.3V 0.8 μA, Typical (1.5 μA max.) at VDD = +3.3V
C to +85゜
Input current (-40゜ C) no load (Pin #1 = VIH) no load (Pin #1 = VIH)
Stand-by current*2 250 nA max. (no load) 0.35 μA, Typical (no load)
VCXO
Symmetry (1/2 VDD level) 40% to 60% 45% to 55%

Actual size Rise and fall times 200 ns max. (CL = 15 pF at +25゜
C) 100 ns max. (CL = 15 pF at +25゜
C)
(10% VDD to 90% VDD level)
Output
0.015 gm (wt.) (-40゜
C to +85゜
C) "0" Level (CL = 15 pF) VOL : 10% VDD max.
"1" Level (CL = 15 pF) VOH : 90% VDD min.
327SMO(E) 327SMO(J)
3.2±0.2 3.2±0.2
#4 #3 #4 #3
Enable delay time 1 sec max. (VDD = +3.3V at +25゜ C)
1.5±0.2
Start-up time (-40゜ C to +85゜ C) 1 sec max. (VDD = +3.3V)

2.5±0.2
TCXO
#1 #2
Aging (at +25゜ C ±3゜ C for first year) ±5 ppm max. ±3 ppm max.
1.0±0.2
#1 #2
Reflow condition
2.4
1.0±0.2
( * 1 ) Fi nal par t n um ber to be as s i gned w i th pac k age ty pe, i nput v ol tage and fr equenc y s tabi l i ty.
#1 #2 e. g. 327S M O( 1.8VE) A
0.6 0.3 0.6
( * 2 ) I nt er nal c r y s tal os c i l l ati on to be hal ted ( Pi n#1 = V IL )

1.0 1.2 1.0
PACKAGE DATA
#1 #2 #4 #3
0.4 0.4 TAPE SPECIFICATIONS
0.75
4.0±0.1
Package
1.75±0.1
PIN CONNECTION 327SMO(E) & 327SMO(J) ∅
OCXO
Item L 1.5 + 2.0±0.1

1 Open or “ L” “H” 0
-0 .1
Lid Metal
2 GND
3 Z OUTPUT
0.75
4 VDD
#4 #3
Z : high impedance
Base Ceramic
D
C
A
PIN
1
CONNECTION
“ L” “H”
Sealing Seam
2 GND M B F
J
3 Z OUTPUT
4 VDD
Z : high impedance Gold / Nickel 327SMO(E)
Terminal plating
SOLDERING PATTERN 3.4 2.7 8.0 3.5 4.0 1.0 0.25 1.4 178 1000pcs
RoHS Compliant (Pb-free) 327SMO(J)
327SMO(E) 327SMO(J)
MCF
1.3 3.0 A B C D F J L M Reel Dia. Qty/Reel

#4 #3 TEST CIRCUIT 3.4 1.7 8.0 3.5 4.0 1.0 0.25 1.4 180 3000pcs
1.1
0.8
1.9
0.01μF
1.1
～
0.1μF #1 #2
0.6
2.3 0.01μF
～
0.1μF
OUTPUT WAVEFORM
92
QuartzClock
Oscillators SPXO ± 25 to ± 30 ppm 32.768 kHz 2.5x2.0 & 3.2x2.5 mm CMOS
327SMO(C) & 327SMO(D) (+1.8V to +5.0V 32.768 kHz MODELS) 2.5x2.0 mm

327SMO(C) STANDARD SPECIFICATIONS ● 32.768 kHz CMOS OUTPUT

● HIGH STABILITY
● AT-CUT CRYSTAL BUILT-IN
● PACKAGE SIZE 2.5x2.0 mm & 3.2x2.5 mm
XTAL
Item Specifications
General part number*1 327SMO(C)* 1
327SMO(D)*1
Frequency stability 327SMO(C)C or 327SMO(D)C : ± 30 ppm over -40゜
C to +85゜
C
(over all conditions) 327SMO(C)D or 327SMO(D)D : ± 25 ppm over -40゜
C to +85゜
C
Operating
C to +85゜
-40゜ C (Standard)
temperature
Actual size Operating
Supply voltage (VDD) +1.8V, +2.5V, +3.0V, +3.3V or +5.0V DC ±5%
Conditions
CLK OSC
0.014 gm (wt.) Stand-by control VIH : 90% VDD min.
327SMO(D) Supply voltage -0.3V to +7.0V DC
Absolute
-55゜ C
Input current 327SMO(C) : 125 μA, Typical (160 μA max.) / -40゜ C to +85゜
C
(Pin#1 = Open or VIH) 327SMO(D) : 80 μA, Typical (100 μA max.) / -40゜ C to +85゜
C
Stand-by current*2 10 μA max. (Pin #1 = VIL)
VCXO
(-40゜
C to +85゜
C)
Actual size "1" Level VOH : 90% VDD min.
0.025 gm (wt.) Load 30 pF max. (CMOS)
Disable delay time 2 μs max.
327SMO(C) 327SMO(D) Enable delay time 0.5 ms max.
2.5±0.1 3.2±0.2
#4 #3 #4 #3

Reflow condition
2.0±0.1
2.5±0.2
TCXO
( * 1 ) F inal par t num ber to be as s i gned w i th pac k age ty pe, i nput v ol tage and fr equenc y s tabi l i ty.
#1 #2 #1 #2 e. g. 327S M O ( 3. 0V C ) D
0.9±0.1
1.0±0.2

4.0±0.1
0.775 0.95 0.775 1.0 1.2 1.0
Package
1.75±0.1
#1 #2 #1 #2
Item 327SMO(C) & 327SMO(D) L
∅
1.5 +
0
2.0±0.1
-0 .1
0.75
0.675
Lid Metal
Base Ceramic
0.65
1.0
OCXO
C
A
Sealing Seam
0.675
0.75
#4 #3
#4 #3 M B F
J
PIN CONNECTION
1 “ L” OPEN or “H” PIN CONNECTION
1 “ L” OPEN or “H” Gold / Nickel 327SMO(C)
Terminal plating
2 GND
2 GND
3
4
Z
VDD
OUTPUT
3 Z
VDD
OUTPUT (surface) / (under) A B C D F J L M Reel Dia. Qty/Reel
Z : high impedance 4 1000pcs
Z : high impedance
3000pcs
SOLDERING PATTERN 327SMO(D)

327SMO(C) 327SMO(D)
TEST CIRCUIT A B C D F J L M Reel Dia. Qty/Reel
1000pcs
1.3
3.5 2.8 8.0 3.5 4.0 1.0 0.25 1.4 180
1.0 2000pcs
MCF
0.9
1.1
1.5
1.9
0.01μF 0.01μF
～～
0.1μF 0.1μF
1.8 2.3
OUTPUT WAVEFORM
93
Crystal Clock Oscillators SPXO ± 25 to ± 30 ppm 32.768 kHz 5.0x3.2 & 7.0x5.0 mm CMOS
327SMO(F) & 327SMO(G) (+1.8V to +5.0V 32.768 kHz MODELS) 5.0x3.2 mm

327SMO(F) STANDARD SPECIFICATIONS ● 32.768 kHz CMOS OUTPUT

● HIGH STABILITY
● AT-CUT CRYSTAL BUILT-IN
XTAL
Item Specifications
General part number*1 327SMO(F)*1 327SMO(G)*1
Frequency stability 327SMO(F)C or 327SMO(G)C : ± 30 ppm over -40゜
C to +85゜
C
(over all conditions) 327SMO(F)D or 327SMO(G)D : ± 25 ppm over -40゜
C to +85゜
C
Operating
C to +85゜
-40゜ C (Standard)
Actual size
temperature
Operating
Supply voltage (VDD) +1.8V, +2.5V, +3.0V,+3.3V or +5.0V DC ±5%
CLK OSC
0.0586 gm (wt.) Conditions

327SMO(G) voltage (Pin#1) VIL : 10% VDD max.*2
Max. Ratings Storage temperature -55゜ C to +100゜C
Input current (Pin#1 = Open or VIH) 60 μA, Typical (80 μA max.) / -40゜ C to +85゜ C
Stand-by current*2 10 μA max. (Pin #1 = VIL)
(-40゜
C to +85゜
C)
VCXO

Actual size
Disable delay time 2 μs max.
0.151 gm (wt.)
Enable delay time 0.5 ms max.
327SMO(F) 327SMO(G) Start-up time 1 ms max.
5.0±0.2 7.0±0.2 Aging ±5 ppm max. at +25゜ C ±3゜ C for first year
#4 #3 #4 #3
Reflow condition
3.2±0.2
5.0±0.2
( * 1 ) F inal par t number to be as s i gned w i th pac k age ty pe, i nput v ol tage and fr equenc y s tabl i ty.
TCXO
e. g. 327S MO( 3.0VF ) E

#1 #2
#1 #2

1.2±0.1
1.35±0.2
4.0±0.1
Package
1.75±0.1
1.2 1.2 1.4 3.68 1.4
Item 327SMO(F) & 327SMO(G) L
∅
1.5 +
0
2.0±0.1
#1 #2 #1 #2 -0 .1
Lid Metal
1.2
1.0
Base Ceramic
D
1.2
C
2.6
Sealing Seam
1.0
OCXO
1.2
#4 #3
2.54 Terminal Tungsten (metalized) M B F
J
#4 5.08 #3
Gold / Nickel 327SMO(F)

PIN CONNECTION Terminal plating
PIN
1
CONNECTION
“ L” OPEN or “H”
1
2
“ L”
GND
OPEN or “H” (surface) / (under) A B C D F J L M Reel Dia. Qty/Reel
2 GND 5.4 3.5 12.0 5.5 8.0 1.5 0.3 1.4 180 1000pcs
Z OUTPUT
3
3 Z OUTPUT 4 VDD
4 VDD Z : high impedance 327SMO(G)
Z : high impedance
TEST CIRCUIT 7.65 5.75 16.0 7.5 8.0 2.0 0.3 1.9 180 1000pcs
SOLDERING PATTERN
327SMO(F) 327SMO(G)
1.4 1.8
MCF
1.2
2.0
2.2
0.01μF
～
4.2
0.1μF 0.01μF
～
0.1μF
5.08
OUTPUT WAVEFORM
94
Quartz Crystal
Voltage Units
Controlled Crystal Oscillators VCXO WIDE FREQ. RANGE 1.3 to 100 MHz 2.5x2.0 mm CMOS
22SMOV (+1.8V, +2.5V, +2.8V or +3.3V FIXED MODELS) 2.5x2.0 mm STANDARD SMD VCXO
22SMOV STANDARD SPECIFICATIONS ● WIDE FREQUENCY RANGE

● CMOS OUTPUT
Item Specifications
XTAL
General part number 22SMOV*1

22SMOV(B) : ±50 ppm over -20゜ C to +70゜C
22SMOV(C) : ±30 ppm over -20゜ C to +70゜C
22SMOV(D) : ±25 ppm over -20゜ C to +70゜C
Frequency stability 22SMOV(E) : ±20 ppm over -20゜ C to +70゜C
(over all conditions) : ±
22SMOV(BW) 50 ppm over -40゜ C to +85゜C
: ±
22SMOV(CW) 30 ppm over -40゜ C to +85゜C
Actual size 22SMOV(DW) : ±25 ppm over -40゜ C to +85゜C
Vcon = 1/2 VDD
CLK OSC
0.014 gm (wt.) VDD = +1.8V ±120 ppm min. n.a.

Vcon = +0.9V ±0.9V
22SMOV VDD = +2.5V
2.5±0.1 Frequency pulling Vcon = +1.25V ±1.25V ±120 ppm min. n.a.
#4 #3 range
VDD = +2.8V ±130 ppm min. ±90 ppm
Vcon = +1.4V ±1.4V
2.0±0.1
VDD = +3.3V ±130 ppm min. ±90 ppm

Vcon = +1.65V ±1.65V
Frequency change vs. input voltage ±2 ppm max. (VDD ±10%)
#1 #2
Operating temperature
Operating -40゜C to +85゜ C (W = Option)
0.9±0.1
VCXO
Conditions Supply voltage (VDD) +1.8V (Max. 55 MHz), +2.5V, +2.8V DC ±5% or +3.3V DC ±10%
Control voltage (Vcon = Pin#1) 1/2 VDD ±1/2 VDD DC
0.775 0.95 0.775
#1 #2 Supply voltage -0.5V to +5.0V DC
Absolute
Vcontrol voltage -0.5V to VDD +0.5V DC
0.675
Max. Ratings
Storage temperature -40゜ C to +100゜C
0.65
2 mA max. (VDD = +1.8V)

0.675
Input current (no load) 3 mA max. (VDD = +2.5V) 14 mA max. (VDD = +2.8V)
#3 #4
5 mA max. (VDD = +3.3V) 19 mA max. (VDD = +3.3V)
PIN CONNECTION
1 Vcontrol Symmetry 45% to 55% at 1/2 VDD level
2 GND
Rise and fall times 6 ns max. (VDD = +1.8V) n.a.
TCXO
3 OUTPUT
4 VDD
Output (20% VDD to 80% VDD level) 4 ns max. (VDD = +2.5V & +3.3V) 4.5 ns max. (VDD = +2.8V & +3.3V)
(-40゜ C to +85゜C) "0" Level VOL : 20% VDD max.
SOLDERING PATTERN
1.0 "1" Level VOH : 80% VDD min.
0.9
Frequency linearity 10 % max.

1.5
0.01μF
～ Frequency slope Positive
0.1μF
Modulation bandwidth (-3 dB) 20 kHz, Typical (15 kHz min.)
1.8 SSB phase noise
OCXO

(at VDD = +3.3V & 27.000 MHz)
OUTPUT WAVEFORM Vcon input impedance (Vcon-GND) 10 MΩ min. 5 MΩ min.
+250゜
C ±10゜ C for 10 seconds
Reflow condition +170゜ C ±10゜C for 1 to 2 minutes (preheating)
e. g. 22S M OV( 3.3VB) 27.000MH z

4.0±0.1
Package
22SMOV
1.75±0.1
∅
MCF
Item L 1.5 + 2.0±0.1

0
-0 .1
Lid Metal
Base Ceramic
D
TEST CIRCUIT
C
A
Sealing Seam
J

Terminal plating
(surface) / (under) 1000pcs
2.7 2.3 8.0 3.5 4.0 1.1 0.25 1.1 180 2000pcs
RoHS Compliant (Pb-free) 3000pcs
98
Quartz Controlled
Voltage Crystal Units
Crystal Oscillators VCXO WIDE FREQ. RANGE 1.3 to 170 MHz VDD = +1.8V to +3.3V 3.2x2.5 mm CMOS
32SMOVD (+1.8V, +2.5V or +3.3V FIXED MODELS) 3.2x2.5 mm STANDARD SMD VCXO
32SMOVD STANDARD SPECIFICATIONS ● CMOS OUTPUT

Item Specifications
XTAL
General part number 32SMOVD*1
32SMOVD(B) : ±50 ppm over -20゜ C to +70゜C
32SMOVD(C) : ±30 ppm over -20゜ C to +70゜C
32SMOVD(D) : ±25 ppm over -20゜ C to +70゜C
Frequency stability 32SMOVD(E) : ±20 ppm over -20゜ C to +70゜C
(over all conditions) 32SMOVD(BW) : ±50 ppm over -40゜ C to +85゜C
32SMOVD(CW) : ±30 ppm over -40゜ C to +85゜C
Actual size 32SMOVD(DW) : ±25 ppm over -40゜ C to +85゜C
CLK OSC
0.025 gm (wt.) Vcon = 1/2 VDD
VDD = +1.8V ±100 ppm min. n.a.
32SMOVD Vcon = +0.9V ±0.9V
Frequency pulling
VDD = +2.5V ±110 ppm min.
3.2±0.2
range n.a.
#4 #3 Vcon = +1.25V ±1.25V
VDD = +3.3V ±130 ppm min. ±90 ppm min.
Vcon = +1.65V ±1.65V
2.5±0.2

C to +70゜
-20゜ C (Standard)
#1 #2
Conditions Supply voltage (VDD) +1.8V, +2.5V DC ±5% or +3.3V DC ±10% +3.3V DC ±10%
1.0±0.2
Control voltage (Vcon = Pin#1) 1/2 VDD ± 1/2 VDD DC
VCXO
1.0 1.2 1.0 Supply voltage -0.3V to +5.0V DC
Absolute
#1 #2
Max. Ratings
0.75
Storage temperature -40゜ C to +100゜ C

2 mA max. (VDD = +1.8V) n.a.
1.0
Input current (no load) 3 mA max. (VDD = +2.5V) n.a.

0.75
#4 #3
PIN CONNECTION
1
2
Vcontrol
GND Rise and fall times 6 ns max. (VDD = +1.8V) n.a.
3 OUTPUT
Output (20% VDD to 80% VDD level) 5 ns max. (VDD = +2.5V & +3.3V) 4 ns max. (VDD = +3.3V)
TCXO
4 VDD
(-40゜C to +85゜C) "0" Level VOL : 20% VDD max.
SOLDERING PATTERN "1" Level VOH : 80% VDD min.
1.3 Load 15 pF max. (CMOS)
1.1
Frequency slope Positive

1.9
0.01μF
～
0.1μF Modulation bandwidth (-3 dB) 20 kHz min.
-130 dBc / Hz, Typical at 1 kHz offset (at 27.000 MHz & VDD = +3.3V)
SSB phase noise
2.3 -125 dBc / Hz, Typical at 1 kHz offset (at 122.880 MHz & VDD = +3.3V)
Vcon input impedance (Vcon-GND) 10 MΩ min.
OCXO
OUTPUT WAVEFORM Aging ±5 ppm max. at +25゜ C ±3゜ C for first year
Reflow condition +170゜C ±10゜ C for 1 to 2 minutes (preheating)
e. g. 32S M O V D ( 1. 8VC ) 54.000 MH z

4.0±0.1
Package
32SMOVD
1.75±0.1
Item ∅
L 1.5 + 2.0±0.1
0
-0 .1
Lid Metal
MCF
Base Ceramic
D
C
A
Sealing Seam
TEST CIRCUIT
J
Gold / Nickel
Terminal plating A B C D F J L M Reel Dia. Qty/Reel
(surface) / (under) 1000pcs
3.5 2.8 8.0 3.5 4.0 1.0 0.25 1.4 180
2000pcs
99
Quartz Crystal
Voltage Units
Controlled Crystal Oscillators VCXO HIGH FREQ. WIDE FREQ. RANGE 1.25 to 170 MHz VDD = +3.3V 3.2x2.5 mm CMOS
32SMOVF (+3.3V FIXED MODELS) 3.2x2.5 mm STANDARD SMD VCXO
32SMOVF STANDARD SPECIFICATIONS ● CMOS OUTPUT

Item Specifications
XTAL
General part number 32SMOVF*1

32SMOVF(3.3VB) : ±50 ppm over -20゜ C to +70゜ C
32SMOVF(3.3VC) : ±30 ppm over -20゜ C to +70゜ C
32SMOVF(3.3VD) : ±25 ppm over -20゜ C to +70゜ C
Frequency stability 32SMOVF(3.3VE) : ±20 ppm over -20゜ C to +70゜ C
(over all conditions) 32SMOVF(3.3VBW) : ±50 ppm over -40゜ C to +85゜ C
32SMOVF(3.3VCW) : ±30 ppm over -40゜ C to +85゜ C
Actual size 32SMOVF(3.3VDW) : ±25 ppm over -40゜ C to +85゜ C
CLK OSC
0.024 gm (wt.) Vcon = 1/2 VDD

Frequency pulling VDD = +3.3V ±120 ppm min. ( 1.250 MHz to 40.000 MHz)
±90 ppm min. (VDD = +1.65V ±1.65V)
32SMOVF range Vcon = +1.65V ±1.65V ±110 ppm min. (40.000 MHz to 62.000 MHz)
3.2±0.2 Frequency change vs. input voltage ±2 ppm max. (VDD ±5%) ±2 ppm max. (VDD ±10%)
#6 #5 #4
-20゜ C to +70゜ C (Standard)
-40゜ C to +85゜ C (W = Option)
Operating Supply voltage (VDD) +3.3V DC ±10%
2.5±0.2
Conditions Control voltage (Vcon = Pin#1) 1/2 VDD ±1/2 VDD DC +1.65V ±1.65V DC
Stand-by control voltage VIH : 70% VDD min.
#1 #2 #3
(Pin#2) VIL : 30% VDD max.*2
Supply voltage -0.3V to +5.0V DC -0.5V to +5.0V DC
0.9±0.1
Absolute
VCXO

Max. Ratings
0.8 1.6 0.8
Input current (no load) 5 mA max. (VDD = +3.3V) 25 mA max.
0.6
#1 #2 #3
Stand-by current (Pin#2 = "L") 10 μA max.
1.3
Symmetry 45% to 55% at 1/2 VDD level 45% to 55% at 1/2 VDD level
#6 #5 #4
Rise and fall times 6 ns max. (1.25 MHz to 40.000 MHz) 4 ns max. (62.000 MHz to 100.000 MHz)
0.6
0.6 Output (10% VDD to 90% VDD level) 5 ns max. (40.000 MHz to 62.000 MHz) 2.4 ns max. (100.000 MHz to 170.000 MHz)
(-40゜ C to +85゜ C) "0" Level VOL : 10% VDD max. VOL : 10% VDD max.
PIN CONNECTION
1 Vcontrol "1" Level VOH : 90% VDD min. VOH : 90% VDD min.
3 GND Load 15 pF max. (CMOS) 15 pF max. (CMOS)
TCXO
4 Z OUTPUT
5 N.C. Start-up time 10 ms max.
6 VDD
Z : high impedance Frequency linearity 10 % max.
SOLDERING PATTERN Modulation bandwidth (-3 dB) 15 kHz min. (25 kHz, Typical) 20 kHz min. (40 kHz, Typical)
1.0 0.8 1.0
SSB phase noise -135 dBc / Hz, Typical at 1 kHz offset (40.000 MHz) -125 dBc / Hz, Typical at 1 kHz offset (155.520 MHz)
(at VDD = +3.3V) -160 dBc / Hz, Typical at 10.000 MHz offset (40.000 MHz) -158 dBc / Hz, Typical at 10.000 MHz offset (155.520 MHz)
1.0

0.9
0.01 μF
～
0.1 μF Enable delay time 2 ms max.
1.0
10MΩ min. (62.000 MHz to 100.000 MHz)

0.26 0.26
OCXO
2.32
5 MΩ min. (100.000 MHz to 170.000 MHz)
OUTPUT WAVEFORM +250゜ C ±10゜ C for 10 seconds
Reflow condition +170゜ C ±10゜ C for 1 to 2 minutes (preheating)
e. g. 32S M OVF ( 3.3VD ) 122.880 M H z
( * 2 ) I nt er nal c r ys tal os c i l l ati on to be hal ted ( Pi n#2= V IL ) .

4.0±0.1
Package
32SMOVF
1.75±0.1
∅
Item L 1.5 + 2.0±0.1
0
-0 .1
MCF
Lid Metal
Base Ceramic
D
C
A
TEST CIRCUIT Sealing Seam

J

Terminal plating
(surface) / (under) 3.5 2.8 8.0 3.5 4.0 1.0 0.25 1.4 180
1000pcs
2000pcs
100
Quartz Controlled
Crystal Oscillators VCXO WIDE FREQ. RANGE 1 to 170 MHz 5.0x3.2 mm CMOS
99SMOVD (+1.8V, +2.5V, +2.8V or +3.3V FIXED MODELS) 5.0x3.2 mm STANDARD SMD VCXO
99SMOVD STANDARD SPECIFICATIONS ● CMOS OUTPUT

Item Specifications
XTAL
General part number 99SMOVD*1
99SMOVD(B) : ±50 ppm over -20゜ C to +70゜C
99SMOVD(C) : ±30 ppm over -20゜ C to +70゜C
99SMOVD(D) : ±25 ppm over -20゜ C to +70゜C
Frequency stability 99SMOVD(E) : ±20 ppm over -20゜ C to +70゜C
(over all conditions) 99SMOVD(BW) : ±50 ppm over -40゜ C to +85゜C
99SMOVD(CW) : ±30 ppm over -40゜ C to +85゜C
Actual size 99SMOVD(DW) : ±25 ppm over -40゜ C to +85゜C
Vcon = 1/2 VDD
CLK OSC
0.052 gm (wt.)
VDD = +1.8V ±110 ppm min. n.a.
Vcon = +0.9V ±0.9V
99SMOVD VDD = +2.5V ±110 ppm min. n.a.
Frequency pulling Vcon = +1.25V ±1.25V
5.0±0.2
#4 #3
range VDD = +2.8V ±110 ppm min. n.a.
Vcon = +1.4V ±1.4V
3.2±0.2
VDD = +3.3V ±110 ppm min. ±90 ppm min.

#1 #2
Vcon = +1.65V ±1.65V
1.05±0.1
-20゜ C to +70゜ C (Standard)

1.2
#1
2.6 1.2
#2 Operating -40゜ C to +85゜ C (W = Option)
VCXO
Conditions Supply voltage (VDD) +1.8V, +2.5V, +2.8V, +3.3V DC ±10% +3.3V DC ±10%
0.8
Control voltage (Vcon = Pin#1) 1/2 VDD ± 1/2 VDD DC

1.6

0.8
Absolute
#4 #3 Vcontrol voltage -0.3V to VDD +0.5V DC
Max. Ratings
PIN
1
CONNECTION
Vcontrol
2
3
GND
OUTPUT
2 mA max. (VDD = +1.8V) n.a.
4 VDD Input current (no load) 3 mA max. (VDD = +2.5V & +2.8V) n.a.
1.3 2.6 1.3
Rise and fall times 6 ns max. (VDD = +1.8V) n.a.
TCXO
Output (20% VDD to 80% VDD level) 4 ns max. (VDD = +2.5V, +2.8V & +3.3V) 4 ns max. (VDD = +3.3V)
1.0
(-40゜C to +85゜C) "0" Level VOL : 20% VDD max.

1.6
0.01μF
～
0.1μF
1.0

3.9
OUTPUT WAVEFORM Frequency slope Positive
Modulation bandwidth (-3 dB) 20 kHz min.
SSB phase noise
OCXO
e. g. 99S M O V D ( 3. 3VD ) 27.000 MH z

4.0±0.1
Package
99SMOVD
1.75±0.1
∅
Item L 1.5 + 2.0±0.1
MCF
0
-0 .1
Lid Metal
Base Ceramic
D
C
A
Sealing Seam
J

Terminal plating
101
Quartz Crystal
Voltage Units
Controlled Crystal Oscillators VCXO HIGH FREQ. WIDE FREQ. RANGE 1 to 170 MHz 5.0x3.2 mm CMOS
99SMOVF (+3.3V FIXED MODELS) 5.0x3.2 mm STANDARD SMD VCXO
99SMOVF STANDARD SPECIFICATIONS ● CMOS OUTPUT

XTAL
Item Specifications
General part number 99SMOVF*1
99SMOVF(3.3VB) : ±50 ppm over -20゜C to +70゜C
99SMOVF(3.3VC) : ±30 ppm over -20゜C to +70゜C
99SMOVF(3.3VD) : ±25 ppm over -20゜C to +70゜C
Frequency stability 99SMOVF(3.3VE) : ±20 ppm over -20゜C to +70゜C
(over all conditions) 99SMOVF(3.3VBW) : ±50 ppm over -40゜ C to +85゜C
Actual size 99SMOVF(3.3VCW) : ±30 ppm over -40゜ C to +85゜C
99SMOVF(3.3VDW) : ±25 ppm over -40゜ C to +85゜C
CLK OSC
0.058 gm (wt.) Vcon = 1/2 VDD

Frequency pulling VDD = +3.3V ±110 ppm min. ±90 ppm min.
99SMOVF range Vcon = +1.65V ±1.65V
5.0±0.2
Frequency change vs. input voltage ±2 ppm max. (VDD ±5%) ±2 ppm max. (VDD ±10%)
#6 #5 #4
C to +70゜
-20゜ C (Standard)
C to +85゜
+3.3V DC ±10%
3.2±0.2

Operating
Conditions Control voltage (Vcon = Pin#1) 1/2 VDD ±1/2 VDD DC +1.65V ±1.65V DC
#1 #2 #3
1.2±0.2
VCXO

0.64 Absolute
Vcontrol voltage -0.3 to VDD +0.3V DC
#1 #2 #3 Max. Ratings
Storage temperature -40゜ C to +100゜
C
1.0
Input current (no load) 5 mA max. 25 mA max.

1.2

1.0
#6 #5 #4
2.54 Rise and fall times 6 ns max. (1.000 MHz to 40.000 MHz) 4 ns max. (62.000 MHz to 100.000 MHz)
PIN CONNECTION
Output (10% VDD to 90% VDD level) 5 ns max. (40.000 MHz to 62.000 MHz) 2.4 ns max. (100.000 MHz to 170.000 MHz)
1 Vcontrol
2 “ L” OPEN or “H” (-40゜C to +85゜C)
3 GND "0" Level VOL : 10% VDD max.
TCXO
4 Z OUTPUT
5 N.C. "1" Level VOH : 90% VDD min.
6 VDD
Z : high impedance Load 15 pF max. (CMOS)
SOLDERING PATTERN Frequency linearity 10 % max.
0.85x6
Modulation bandwidth (-3 dB) 15 kHz min. (25 kHz, Typical) 20 kHz min. (40 kHz, Typical)
1.2
-135 dBc / Hz, Typical at 1 kHz offset (40.000MHz) -125 dBc / Hz, Typical at 1 kHz offset (155.520 MHz)
1.0
0.01 μF
～
0.1 μF
SSB phase noise (at VDD = +3.3V) -160 dBc / Hz, Typical at 10 MHz offset (40.000MHz) -158 dBc / Hz, Typical at 10 MHz offset (155.520 MHz)
1.2
1.27 1.27 Disable delay time 200 ns max.

OCXO
OUTPUT WAVEFORM Vcon input impedance (Vcon-GND) 10 MΩ min.

+250゜
Reflow condition +170゜C ±10゜C for 1 to 2 minutes (preheating)
e. g. 99S M OVF ( 3.3VC W) 74.250 M H z
( * 2 ) I nt er nal c r ys tal os c i l l ati on to be hal ted. ( Pi n#2 = V IL )

4.0±0.1
Package
99SMOVF
1.75±0.1
∅
MCF
Item L 1.5 + 2.0±0.1

0
-0 .1
Lid Metal
D
C
A
Sealing Seam
J

Terminal plating
102
Quartz Controlled
Crystal Oscillators VCXO WIDE FREQ. RANGE 1.25 to 170 MHz 7.0x5.0 mm CMOS
97SMOVH (+3.3V FIXED MODELS) 7.0x5.0 mm STANDARD SMD VCXO
97SMOVH STANDARD SPECIFICATIONS ● CMOS OUTPUT

Item Specifications
XTAL
General part number 97SMOVH*1
97SMOVH(3.3VB) : ±50 ppm over -20゜
C to +70゜
C
97SMOVH(3.3VC) : ±30 ppm over -20゜
C to +70゜
C
97SMOVH(3.3VD) : ±25 ppm over -20゜
C to +70゜
C
Frequency stability 97SMOVH(3.3VE) : ±20 ppm over -20゜
C to +70゜
C
(over all conditions) 97SMOVH(3.3VBW) : ±50 ppm over -40゜C to +85゜
C
97SMOVH(3.3VCW) : ±30 ppm over -40゜C to +85゜
C
Actual size 97SMOVH(3.3VDW) : ±25 ppm over -40゜C to +85゜
C
Vcon = 1/2 VDD
CLK OSC
0.182 gm (wt.)
Frequency pulling VDD = +3.3V ±100 ppm min.
range Vcon = +1.65V ±1.65V
97SMOVH Frequency change vs. input voltage ±2 ppm max. (VDD ±10%)
7.0±0.2
#6 #5 #4
-40゜C to +85゜ C (W = Option)
5.0±0.2
Conditions Control voltage (Vcon = Pin#1) +1.65V ±1.65V DC

#1 #2 #3 (Pin#2) VIL : 30% VDD max.*2
1.6±0.2
Absolute
VCXO
1.4 1.4 1.4 Max. Ratings
C
Input current (no load) 25 mA max.
1.2
#1 #2 #3
2.6
#6 #5 #4 Symmetry 45% to 55% at 1/2 VDD level

Rise and fall times
1.2
5 ns max.
2.54 2.54
Output (10% VDD to 90% VDD level)
5.08
(-40゜ C to +85゜ C) "0" Level VOL : 10% VDD max.
PIN CONNECTION "1" Level VOH : 90% VDD min.
1 Vcontrol
2 “ L” OPEN or “H” Load 15 pF max. (CMOS)
3 GND
TCXO
4
5
Z
N.C.
OUTPUT Start-up time 10 ms max.
6 VDD
Z : high impedance
SOLDERING PATTERN 10 kHz, Typical : 1.250 MHz to 30.000 MHz
Modulation bandwidth (-3 dB)
1.6 1.6 1.6
20 kHz, Typical (15 kHz min.) : 30.000 MHz to 170.000 MHz
SSB phase noise
(at VDD = +3.3V & 155.520 MHz)
1.6 2.2 1.6
0.01 μF
～ Disable delay time 200 ns max.
0.1 μF
2.54 2.54
5.08
5 MΩ min. ( 1.250 MHz to 30.000 MHz)
Vcon input impedance (Vcon-GND)
OCXO
10 MΩ min. (30.000 MHz to 170.000 MHz)
OUTPUT WAVEFORM Aging ±5 ppm max. at +25゜ C ±3゜ C for first year
e. g. 97S M O V H ( 3. 3VBW) 27.000 MH z
( * 2 ) I nt er nal c r y s t al os c i l l ati on to be hal ted ( Pi n#2 = V IL ) .

4.0±0.1
Package
97SMOVH
1.75±0.1
∅
Item L 1.5 + 2.0±0.1
0
-0 .1
MCF
Lid Metal
Base Ceramic
TEST CIRCUIT
D
C
A
Sealing Seam
J

Terminal plating
103
QuartzVoltage
Low Crystal Units
Positive Emitter Coupled Logic VCXO VCXO WIDE FREQ. RANGE 30 to 200 MHz 7.0x5.0 mm LVPECL
57SMOVH (+3.3V FIXED LVPECL VCXO) 7.0x5.0 mm STANDARD SMD VCXO
57SMOVH STANDARD SPECIFICATIONS ● LVPECL VCXO

Item Specifications
XTAL

C to +70゜
C
C to +70゜
C
C to +70゜
C
C to +70゜
C
C
C
C
Vcon = 1/2 VDD
CLK OSC
0.175 gm (wt.)
57SMOVH Frequency change vs. input voltage ±2 ppm max. (VDD ± 10%)
7.0±0.2
#6 #5 #4 C to +70゜
-20゜ C (Standard)
C to +85゜
5.0±0.2

57SMOVH-HE
PIN
1
CONNECTION
Vcontrol
#1 #2 #3
2 “ L” OPEN or “H” (Pin#2) VIL : 30% VDD max.*2
3 GND
1.6±0.2
4 Z OUTPUT
5 Z C-OUTPUT Absolute
VCXO
6 VDD
1.4 1.4 1.4 HE : high enable Z : high impedance Max. Ratings
C
Input current (Pin#2 = HE or LE) 90 mA max.
57SMOVH-LE
1.2
PIN CONNECTION
1 Vcontrol
#1 #2 #3
2 “ L” OPEN or “H” Stand-by current (Pin#2 = LD or HD)*2 5.0 mA max.
2.6
3 GND
#6 #5 #4 4 OUTPUT Z Symmetry 45% to 55% at crossing point
5 C-OUTPUT Z
Rise and fall times
1.2
6 VDD
1.0 ns max.
2.54 2.54 LE : low enable Z : high impedance
5.08
Output "0" Level ( 0゜ C to +85゜
C) VOL : +1.68V max. (+1.49V min.)
(-40゜ C to +85゜ C) "1" Level ( 0゜ C to +85゜
C) VOH : +2.42V max. (+2.275V min.)
SOLDERING PATTERN "0" Level (-40゜ C to + 0゜C) VOL : +1.745V max. (+1.49V min.)
TCXO
1.6 1.6 1.6

"1" Level (-40゜ C to + 0゜C) VOH : +2.42V max. (+2.215V min.)
1.6

2.2
0.01μF
～ Frequency linearity 10 % max.
1.6
0.1μF
2.54 2.54 Frequency slope Positive
5.08 Modulation bandwidth (-3 dB) 20 kHz min.
SSB phase noise
OUTPUT WAVEFORM (at VDD = +3.3V & 122.880 MHz)
OCXO
Enable delay time 20 μs max.

Differential output voltage +0.4V min.
+250゜
e. g. 57S M OVH-H E( 3.3VC W) 156.250 MH z
TEST CIRCUIT ( * 2 ) I nt er nal c r ys tal os c i l l ati on to be hal ted.
LD : Low di s abl e
H D : H igh d i s abl e
MCF

4.0±0.1
Package
1.75±0.1
Item 57SMOVH L
∅
1.5 +
0
2.0±0.1
-0 .1
Lid Metal
Base Ceramic
D
C
A
Sealing Seam
J

Terminal plating
104
Quartz
Low Crystal
Voltage UnitsEmitter Coupled Logic VCXO
Positive VCXO WIDE FREQ. RANGE 30 to 170 MHz 5.0x3.2 mm LVPECL

Item Specifications
XTAL
C to +70゜
C
C to +70゜
C
C to +70゜
C
C to +70゜
C
C
C
C
CLK OSC
0.051 gm (wt.) Vcon = 1/2 VDD
55SMOVH range Vcon = +1.65V ±1.65V
5.0±0.2 Frequency change vs. input voltage ±2 ppm max. (VDD ±10%)
#6 #5 #4
-40゜C to +85゜ C (W = Option)
Supply voltage (VDD) +3.3V DC ±10%
3.2±0.2
Operating
55SMOVH-HE
PIN CONNECTION
#1 #2 #3 1 Vcontrol Stand-by control voltage VIH : 70% VDD min.
2
3
“ L”
GND
OPEN or “H” (Pin#2) VIL : 30% VDD max.*2
1.2±0.2
4 Z OUTPUT
5 Z C-OUTPUT
Absolute
VCXO
6 VDD
0.64
HE : high enable Z : high impedance Max. Ratings
#1 #2 #3 Storage temperature -40゜ C to +100゜
C
55SMOVH-LE
PIN CONNECTION Input current (Pin#2 = HE or LE) 90 mA max.
1.0
1 Vcontrol
2 “ L” OPEN or “H” Stand-by current (Pin#2 = LD or HD)*2 5.0 mA max.
1.2
3 GND
4 OUTPUT Z Symmetry 45% to 55% at crossing point
5 C-OUTPUT Z
1.0
6 VDD Rise and fall times

LE : low enable Z : high impedance 1.0 ns max.
#6 #5
2.54
#4
Output "0" Level ( 0゜ C to +85゜
C) VOL : +1.68V max. (+1.49V min.)
SOLDERING PATTERN (-40゜ C to +85゜ C) "1" Level ( 0゜ C to +85゜
C) VOH : +2.42V max. (+2.275V min.)
0.85x6 "0" Level (-40゜ C to 0゜ C) VOL : +1.745V max. (+1.49V min.)
TCXO
"1" Level (-40゜ C to 0゜ C) VOH : +2.42V max. (+2.215V min.)
1.2

1.0
0.01μF
～
0.1μF
1.2
1.27 1.27 Frequency linearity 10 % max.

OUTPUT WAVEFORM Modulation bandwidth (-3 dB) 20 kHz min.
SSB phase noise
(at VDD = +3.3V & 122.880 MHz)
OCXO
Enable delay time 20 μs max.
+250゜
TEST CIRCUIT
e. g. 55S M O V H- H E( 3.3VE) 155.520 MH z
( * 2 ) I nt er nal c r y s t al os c i l l ati on to be hal ted.
LD : Low di s abl e
H D : H i gh di s abl e
MCF
PACKAGE DATA
Package
Item 55SMOVH
Lid Metal
Base Ceramic
TAPE SPECIFICATIONS
4.0±0.1 Sealing Seam
1.75±0.1
L
∅
1.5 +
0
2.0±0.1 Terminal Tungsten (metalized)
-0 .1
Gold / Nickel
Terminal plating
(surface) / (under)
D
C
A

M B F
J

5.4 3.5 12.0 5.5 8.0 1.5 0.3 1.4 180 1000pcs
105
QuartzVoltage
Low Crystal Units
Positive Emitter Coupled Logic VCXO VCXO WIDE FREQ. RANGE 10 to 170 MHz 3.2x2.5 mm LVPECL

Item Specifications
XTAL

C to +70゜
C
C to +70゜
C
C to +70゜
C
C to +70゜
C
C
C
C
Vcon = 1/2 VDD
CLK OSC
0.025 gm (wt.)
Frequency pulling VDD = +3.3V ± 80 ppm min.
53SMOVH Frequency change vs. input voltage ± 2 ppm max. (VDD ± 10%)
3.2±0.2
#6 #5 #4 -20゜C to +70゜ C (Standard)
-40゜C to +85゜ C (W = Option)
2.5±0.2

#1 #2 #3 (Pin#2) VIL : 30% VDD max.*2
0.9±0.1
Absolute
VCXO
Max. Ratings
0.8 1.6 0.8 Storage temperature -40゜ C to +100゜
C
0.6
#1 #2 #3
PIN
1
CONNECTION
Vcontrol
1.3
3 GND
#6 #5 #4 4 Z OUTPUT
5 Z C-OUTPUT Rise and fall times
0.5 ns max.
0.6
6 VDD
0.6 Z : high impedance Output (20% to 80% of amplitude)
(-40゜ C to +85゜ C)
"0" Level VOL : +1.68V max. (+1.49V min.)
SOLDERING PATTERN "1" Level VOH : +2.42V max. (+2.275V min.)
1.0 0.8 1.0
TCXO

1.0

0.9
0.01μF
～
0.1μF Frequency slope Positive
1.0
0.26
2.32
0.26 Modulation bandwidth (-3 dB) 15 kHz min.
SSB phase noise
(at VDD = +3.3V & 155.520 MHz)
OUTPUT WAVEFORM
RMS jitter (12 kHz to 20.000 MHz band) 1 ps max. (155.520 MHz)
OCXO

( * 1 ) Fi nal par t n um ber to be as s i gned w i th pac k age ty pe, i nput v ol tage, fr equenc y s tabi l i ty, oper ati ng temperat ure and f requency.
e. g. 53S M OVH ( 3.3VBW) 155.520 M H z
TEST CIRCUIT ( * 2 ) I nt er nal c r y s tal os c i l l ati on to be hal ted ( Pi n#2 = V IL ) .

4.0±0.1
MCF
Package
1.75±0.1
Item 53SMOVH L
∅
1.5 +
0
2.0±0.1
-0 .1
Lid Metal
Base Ceramic
D
C
A
Sealing Seam
J

Terminal plating
(surface) / (under) 3.5 2.8 8.0 3.5 4.0 1.0 0.25 1.4 180
1000pcs
2000pcs
106
Quartz
Low Crystal
Voltage Units Signaling VCXO
Differential VCXO WIDE FREQ. RANGE 30 to 170 MHz 7.0x5.0 mm LVDS
67SMOVH (+2.5V or +3.3V FIXED LVDS VCXO) 7.0x5.0 mm STANDARD SMD VCXO
67SMOVH STANDARD SPECIFICATIONS ● LVDS VCXO

Item Specifications
XTAL
C to +70゜
C
C to +70゜
C
C to +70゜
C
C to +70゜
C
C
C
C
CLK OSC
0.182 gm (wt.) Vcon = 1/2 VDD
67SMOVH range Vcon = +1.65V ± 1.65V
#6 #5 #4
Operating temperature -40゜C to +85゜ C (W = Option)
-40゜C to +105゜ C (WW = Option)
5.0±0.2
Operating Supply voltage (VDD) +2.5V DC ±10% +3.3V DC ±10%

Conditions
67SMOVH-HE
PIN
1
CONNECTION
Vcontrol
Control voltage (Vcon = Pin#1) +1.25V ±1.25V DC +1.65V ±1.65V DC
#1 #2 #3 2
3
“ L”
GND
OPEN or “H”
1.5±0.15
4
5
Z
Z
OUTPUT
C-OUTPUT
VCXO
VDD
1.4 1.4 1.4
6
HE : High enable Z : High impedance Supply voltage -0.3V to +5.0V DC
Absolute
67SMOVH-LE Max. Ratings
1.2
PIN
1
CONNECTION
Vcontrol
C
#1 #2 #3
2.6
3 GND
#4
#6 #5 4
5
OUTPUT
C-OUTPUT
Z
Z
Stand-by current (Pin#2 = "LD or HD") 7 mA max.
1.2
2.54 2.54
6 VDD
LE : Low enable Z : High impedance
Rise and fall times
5.08
0.7 ns max.
Output (20% to 80% of amplitude)
SOLDERING PATTERN (-40゜ C to +85゜ C) "0" Level VOL : +1.1V, Typical (+0.9 V min.)
1.6 1.6 1.6 "1" Level VOH : +1.43V, Typical (+1.6 V max.)
TCXO
1.6

2.2
0.01μF
～
1.6
0.1μF
2.54 2.54
5.08
SSB phase noise
(at VDD = +3.3V & 122.880 MHz)
OUTPUT WAVEFORM RMS jitter (12 kHz to 20.000 MHz band) 0.3 ps max. (90 fs, Typical at 122.880 MHz)
OCXO
Differential output voltage +0.35V, Typical
Offset voltage +1.25V, Typical
Reflow condition +170゜
TEST CIRCUIT C ±10゜C for 1 to 2 minutes (preheating)
e. g. 67S M O V H ( 3. 3VC W) 164.355 MH z
( * 2 ) I nt er nal c r y s t al os c i l l ati on to be hal ted.
LD : Low di s abl e
H D : H igh dis able
MCF
PACKAGE DATA
Package
Item 67SMOVH
Lid Metal
TAPE SPECIFICATIONS Base Ceramic
4.0±0.1
Sealing Seam
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1 Terminal Tungsten (metalized)
Gold / Nickel
Terminal plating
(surface) / (under)
D
C
A

M B F
J

7.4 5.4 16.0 7.5 8.0 1.5 0.3 1.9 180 1000pcs
107
QuartzVoltage
Low Crystal Units
Differential Signaling VCXO VCXO WIDE FREQ. RANGE 30 to 170 MHz 5.0x3.2 mm LVDS
65SMOVH (+2.5V or +3.3V FIXED LVDS VCXO) 5.0x3.2 mm STANDARD SMD VCXO

Item Specifications
XTAL

C to +70゜
C
C to +70゜
C
C to +70゜
C
C to +70゜
C
C
C
C
Vcon = 1/2 VDD
CLK OSC
0.051 gm (wt.)
65SMOVH Frequency change vs. input voltage ±2 ppm max. (VDD ±10%)
5.0±0.2
#6 #5 #4
-40゜C to +85゜ C (W = Option)
Operating Supply voltage (VDD) +2.5V DC ±10% +3.3V DC ±10%
3.2±0.2
Conditions Control voltage (Vcon = Pin#1) +1.25V ±1.25V DC +1.65V ±1.65V DC

#1 #2 #3 (Pin#2) VIL : 30% VDD max.*2
1.2±0.2
Absolute
VCXO
Max. Ratings
0.64 Storage temperature -40゜ C to +100゜
C
#1 #2 #3
PIN CONNECTION
1.0
1
“ L”
Vcontrol Stand-by current (Pin#2 = "L") 7 mA max.
2 OPEN or “H”
1.2
3 GND
4 Z OUTPUT
5 Z C-OUTPUT
1.0
6 VDD Rise and fall times

0.7 ns max.
#6 #5 #4 Z : high impedance
2.54
(-40゜ C to +85゜ C)
"0" Level VOL : +1.1V, Typical (+0.9V min.)
SOLDERING PATTERN "1" Level VOH : +1.43V, Typical (+1.6V max.)
TCXO
0.85x6

1.2

1.0
0.01μF
～
0.1μF Frequency slope Positive
1.2
1.27 1.27
SSB phase noise
OUTPUT WAVEFORM (at VDD = +3.3V & 122.880 MHz)
RMS jitter (12 kHz to 20.000 MHz band) 0.3 ps max. (90 fs, Typical at 122.880 MHz)
OCXO

TEST CIRCUIT +250゜C ±10゜ C for 10 seconds
Reflow condition
e. g. 65S M OVH ( 3.3VE) 160.000 M H z
( * 2 ) I nt er nal c r ys tal os c i l l ati on to be hal ted ( Pi n#2 = V IL ) .
PACKAGE DATA
MCF
Package
Item 65SMOVH
Lid Metal
TAPE SPECIFICATIONS Base Ceramic

4.0±0.1 Sealing Seam
1.75±0.1
∅
1.5 +
L
0
-0 .1
2.0±0.1
Gold / Nickel
Terminal plating
(surface) / (under)
D
C
A

M B F
J

1000pcs
5.4 3.5 12.0 5.5 8.0 1.5 0.3 1.4 180
2000pcs
108
Quartz
Low Crystal
Voltage Units Signaling VCXO
Differential VCXO WIDE FREQ. RANGE 40 to 170 MHz 3.2x2.5 mm LVDS
63SMOVH (+3.3V FIXED LVDS VCXO) 3.2x2.5 mm STANDARD SMD VCXO

Item Specifications
XTAL
C to +70゜
C
C to +70゜
C
C to +70゜
C
C to +70゜
C
C
C
C
CLK OSC
0.025 gm (wt.) Vcon = 1/2 VDD
63SMOVH range Vcon = +1.65V ±1.65V
#6 #5 #4
-40゜C to +85゜ C (W = Option)
Supply voltage (VDD) +3.3V DC ±10%
2.5±0.2
Operating
#1 #2 #3
0.9±0.1
Absolute
VCXO
0.8 1.6 0.8 Max. Ratings
0.6
PIN CONNECTION
#1 #2 #3 1
2 “ L”
Vcontrol
OPEN or “H”
1.3
#6 #5 #4
3
4 Z
GND
OUTPUT
5 Z C-OUTPUT
Rise and fall times
0.6
6 VDD 0.4 ns max.

0.6 Z : high impedance
(-40゜ C to +85゜ C) "0" Level VOL : +1.1V, Typical (+0.9V min.)
SOLDERING PATTERN "1" Level VOH : +1.43V, Typical (+1.6V max.)
1.0 0.8 1.0 Load 100 Ω (OUT-OUTN)
TCXO
1.0

0.9
0.01 μF
～
0.1 μF
1.0
0.26 0.26 Modulation bandwidth (-3 dB) 15 kHz min.

2.32
SSB phase noise (at VDD = +3.3V & 155.520 MHz) -120 dBc / Hz, Typical at 1 kHz offset
RMS jitter (12 kHz to 20.000 MHz band) 1 ps max. (155.520 MHz)
OUTPUT WAVEFORM
OCXO
TEST CIRCUIT ( * 1 ) F inal par t num ber to be as s i gned w i th pac k age ty pe, i nput v ol tage, fr equenc y s tabi l i ty, oper ati ng tem per atur e a nd f requency.
e. g. 63S M O V H ( 3. 3VBW) 160.000 MH z
( * 2 ) I nt er nal c r y s t al os c i l l ati on to be hal ted ( Pi n#2 = V IL ) .
PACKAGE DATA MCF

Package
Item 63SMOVH
Lid Metal
Base Ceramic
Sealing Seam
TAPE SPECIFICATIONS
4.0±0.1
Gold / Nickel
1.75±0.1
∅
L 1.5 +
0
2.0±0.1
Terminal plating
-0 .1 (surface) / (under)
D
C
A
M B F
J

1000pcs
3.5 2.8 8.0 3.5 4.0 1.0 0.25 1.4 180
2000pcs
109
Temperature Compensated Crystal Oscillators TCXO or VC-TCXO ±2.0 ppm 19.2 to 52 MHz 1.6x1.2 mm +1.8 to +3.3V CLIPPED SINE
SXO-1612 SERIES (+1.8V to +3.3V FIXED MODELS) 1.6x1.2 mm STANDARD SMD TCXO
SXO-1612 STANDARD SPECIFICATIONS ● CLIPPED SINE WAVEFORM

Item Specifications
General part number SXO-1612*1 SXO-1612V*1
XTAL

C ±2゜
Initial frequency tolerance at +25゜ C ±1.5 ppm max.*2 ±1.5 ppm max.(Vcon = 1/2 VDD)*2
TCXO or VC-TCXO TCXO VC-TCXO
Temperature range ±2 ppm max. over -30゜C to +85゜ C)*3
C (referred to +25゜
Frequency Input voltage change ±0.2 ppm max. at VDD ±5% DC
Stability Output load change ±0.2 ppm max.at 10 kΩ ±10% with 10 pF ±10%
Actual size
Aging ±1 ppm max. per year at +25゜ C ±3゜C
CLK OSC
0.005 gm (wt.)
Operating -30゜ C to +85゜C (Standard)
SXO-1612 temperature -40゜ C to +85゜C (W = Option, frequency dependent)
Operating Supply voltage (VDD) D = +1.8V, F = +2.5V, H = +2.8V (Standard), J = +3.0V, K = +3.3V DC ±5%
Conditions
1.65±0.1
+0.9V ±0.8V (VDD = +1.8V)

#4 #3
Control voltage (Vcon) n.a.

1/2 VDD ±1V DC (VDD = +2.5V to +3.3V)
1.25±0.1

Absolute Vcontrol voltage (Vcon) n.a. -0.6V to VDD +0.6V DC
#1 #2 Max. Ratings
1.5 mA max. (19.200 MHz to 30.000 MHz)
0.6±0.1
Input current
VCXO
1.7 mA max. (30.000 MHz to 52.000 MHz)

0.375 0.9 0.375 Level 0.8 Vp-p min.
#1 #2
Output Load 10 kΩ // 10 pF
(-40゜
C to +85゜
C)
0.425
CONNECTION
PIN TCXO
SXO-1612
VC‟TCXO
SXO-1612V
Waveform Clipped sine wave (DC-coupling)
±8 ppm to ±13 ppm
0.4
1 GND Vcontrol
2 GND
Frequency adjustment (VDD = +1.8V)
0.425
3 OUTPUT
4 VDD n.a.
#4 #3 voltage control (Vcon) ±9 ppm to ±15 ppm
(VDD = +2.5V to +3.3V)
SOLDERING PATTERN Frequency slope n.a. Positive
TCXO
0.5
Harmonic distortion -5 dBc max.
Start-up time 2 ms max. (Vout ≧ 90%Vp-p)
0.95
IR reflow resistance ±1 ppm max. (referred to frequency before reflow)

0.55

Reflow conditioon
1.4
Standard frequencies (MHz) 19.200, 26.000, 38.400, 52.000
OUTPUT WAVEFORM Optional Operating Low limit / Symbol C/g
-10゜ -15゜C/h -20゜C/i C/j
-25゜ C/k
-30゜ -35゜C/l C/m
-40゜
Temperature*4 High limit / Symbol +55゜
C / ff +60゜
C / gg +65゜C / hh +70゜
C / ii +75゜
C / jj +80゜C / kk +85゜
C / ll
OCXO
( * 1 ) F inal par t number to be as s i gned w i th pac k age ty pe, T C XO or VC - T C XO, i nput v ol tage, oper ati ng temper a t ure and f requency.
e. g. S X O- 1612V -J-S-38.400M H z
( * 2 ) R ef er r ed t o nomi nal fr equenc y befor e r efl ow s ol der i ng.
( * 3 ) A t V c on = 1/ 2 V DD D C for SXO -1612V.
( * 4 ) S elec t " l ow l imi t" and "hi gh l i mi t" for new oper ati ng tem per atur e c om bi nati on fr om the l i s ts .

4.0±0.1
Package
SXO-1612
1.75±0.1
SXO-1612 Item L
∅
1.5 +
0
2.0±0.1
0 .1
Lid Metal
Base Ceramic
MCF
C
A
Sealing Seam
J

Terminal plating
(surface) / (under) 1.84 1.55 8.0 3.5 4.0 0.5 0.25 0.9 180
2000pcs
1000pcs

SXO-1612V
112
Quartz Crystal
Temperature Units
Compensated Crystal Oscillators TCXO or VC-TCXO ± 0.5 ppm 19.2 to 52 MHz 1.6x1.2 mm +1.8 to +3.3V CLIPPED SINE
SXO-1612HG SERIES (+1.8V to +3.3V FIXED MODELS) 1.6x1.2 mm STANDARD SMD TCXO
SXO-1612HG STANDARD SPECIFICATIONS ● CLIPPED SINE WAVEFORM

Item Specifications
XTAL
General part number SXO-1612HG*1 SXO-1612HGV*1
C ±2゜
Temperature range ±0.5 ppm max. over -30゜ C to +85゜ C)*3
Actual size Stability Output load change ±0.1 ppm max. at 10 kΩ ±10% with 10 pF ±10%
Aging ±1 ppm max. per year at +25゜ C ±3゜ C
CLK OSC
0.005 gm (wt.)
Operating -30゜ C to +85゜ C (Standard)
SXO-1612HG temperature -40゜ C to +85゜C (W = Option, frequency dependent)
1.65±0.1
Operating Supply voltage (VDD) D = +1.8V, F = +2.5V, H = +2.8V (Standard), J = +3.0V, K = +3.3V DC ±5%
#4 #3 Conditions
+0.9V ± 0.8V (VDD = +1.8V)
1/2 VDD ± 1V DC (VDD = +2.5V to +3.3V)
1.25±0.1

#1 #2 Max. Ratings
1.5 mA max. (19.200 MHz to 30.000 MHz)
0.6±0.1
Input current
VCXO
1.7 mA max. (30.000 MHz to 52.000 MHz)
0.375 0.9 0.375 Level 0.8 Vp-p min.
#1 #2
0.425
CONNECTION (-40゜
C to +85゜
C)
PIN TCXO VC‟TCXO
SXO-1612HG SXO-1612HGV Waveform Clipped sine wave (DC-coupling)
0.4
1
2
GND
GND
Vcontrol
±8 ppm to ±13 ppm
(VDD = +1.8V)
0.425
Frequency adjustment
3 OUTPUT
4 VDD
n.a.
#4 #3
voltage control (Vcon) ±9 ppm to ±15 ppm
(VDD = +2.5V to +3.3V)
OUTPUT WAVEFORM Frequency slope n.a. Positive
TCXO
Start-up time 2 ms max. (Vout ≧ 90%Vp-p)
Reflow condition
SOLDERING PATTERN +170゜ C ±10゜C for 1 to 2 minutes (preheating)
0.5 Standard frequencies (MHz) 19.200, 26.000, 38.400, 52.000
Optional Operating Low limit / Symbol C/g
-10゜ -15゜C/h -20゜C/i C/j
-25゜ C/k
-30゜ -35゜C/l C/m
-40゜
Temperature*4
OCXO
High limit / Symbol +55゜
C / ff +60゜
C / gg +65゜C / hh +70゜
C / ii +75゜
C / jj +80゜C / kk +85゜
C / ll
( * 1 ) Fi nal par t num ber t o be as s i gned w i th pac k age ty pe, T C XO or VC - T C XO, i nput v ol tage, oper ati ng tem per atur e an d f requency.
0.95
e. g. S X O- 1612H G - D- S -26MH z
( * 2 ) R ef er r ed t o nom inal fr equenc y befor e r efl ow s ol der i ng.
0.55
( * 3 ) A t V c on = 1/ 2 V DD D C for SXO -1612H GV.

1.4 ( * 4 ) S el ec t " low li m it " and "hi gh l i m i t" for new oper ati ng temper atur e c ombi nati on fr om the l i s ts .

4.0±0.1
SXO-1612HG Package
SXO-1612HG
1.75±0.1
∅
Item L 1.5 + 2.0±0.1
0
0 .1
Lid Metal
Base Ceramic
MCF
D
C
A
Sealing Seam
J

Terminal plating
SXO-1612HGV RoHS Compliant (Pb-free)
113
Temperature Compensated Crystal Oscillators TCXO or VC-TCXO ± 2.0 ppm 13 to 52 MHz 2.0x1.6 mm +1.8 to +3.3V CLIPPED SINE

Item Specifications
XTAL

C ±2゜
Temperature range ±2 ppm max. over -30゜ C to +85゜ C)*3
Frequency Input voltage change ±0.2 ppm max. at VDD ± 5% DC
Stability Output load change ±0.2 ppm max. at 10 kΩ ±10% with 10 pF ±10%
Actual size
Aging ±1 ppm max. per year at +25゜C ±3゜ C
CLK OSC
0.0086 gm (wt.)
-30゜ C (Standard)
-40゜ C (W = Option, frequency dependent)
SXO-2016 Operating Supply voltage (VDD) D = +1.8V, F = +2.5V, H = +2.8V, J = +3.0V, K = +3.3V DC ±5%
2.0±0.1
Conditions
+0.9V ±0.8V (VDD = +1.8V)
#4 #3

1/2 VDD ±1V (VDD = +2.5V to +3.3V)
1.6±0.1

Max. Ratings
#1 #2

0.7±0.1
1.5 mA max. (13.000 MHz to 30.000 MHz)

VCXO
Input current 1.7 mA max. (30.000 MHz to 40.000 MHz)

2 mA max. (40.000 MHz to 52.000 MHz)
1.2±0.05
CONNECTION
Level 0.8 Vp-p min.
0.6±0.1 0.4 0.6±0.1
#1 #2 TCXO VC-TCXO
PIN
1
SXO-2016
GND
SXO-2016V
Vcontrol Output Load 10 kΩ // 10 pF
2 GND (-40゜
C to +85゜
C)
#4 #3 3 OUTPUT
4 VDD
0.4±0.1 0.4±0.1
±8 ppm to ±13 ppm
Frequency (VDD = +1.8V)
SOLDERING PATTERN Voltage control (Vcon) n.a.
Adjustment ±9 ppm to ±15 ppm
(VDD = +2.5V to +3.3V)
0.6
TCXO
Frequency slope n.a. Positive

1.15

SSB phase noise (26.000 MHz) -135 dBc / Hz, Typical at 1 kHz offset
0.8
1.8
Short-term frequency stability ±1 ppb max. (Allan variance Tau = 0.1 sec.)
OUTPUT WAVEFORM +250゜C ±10゜ C for 10 seconds
Reflow condition
Standard frequencies (MHz) 16.368, 16.369, 19.200, 26.000, 27.456, 33.600, 38.400, 52.000
OCXO

-10゜ -15゜C/h -20゜C/i C/j
-25゜ C/k
-30゜ -35゜C/l C/m
-40゜
C / ff +60゜
C / gg +65゜C / hh +70゜
C / ii +75゜
C / jj +80゜C / kk +85゜
C / ll
( * 1 ) F inal par t number to be as s i gned w i th pac k age ty pe, T C XO or VC - T C XO, i nput v ol tage, oper ati ng temper a t ure and f requency.
e. g. S X O- 2016V -H -16.368MH z
TEST CIRCUIT ( * 2 ) R ef er r ed t o nomi nal fr equenc y befor e r efl ow s ol der i ng.
SXO-2016 ( * 4 ) S elec t " l ow l imi t" and "hi gh l i mi t" for new oper ati ng tem per atur e c om bi nati on fr om the l i s ts .

4.0±0.1
Package
SXO-2016
1.75±0.1
∅
1.5 +
MCF
Item L 2.0±0.1
0
0 .1
Lid Metal
Base Ceramic
D
C
A
Sealing Seam
J
SXO-2016V
Terminal plating
114
Quartz Crystal
Temperature Units
Compensated Crystal Oscillators TCXO or VC-TCXO ± 0.5 ppm GPS 13 to 52 MHz 2.0x1.6 mm +1.8 to +3.3V CLIPPED SINE
SXO-2016HG SERIES (+1.8V to +3.3V MODELS) 2.0x1.6 mm STANDARD SMD TCXO
SXO-2016HG STANDARD SPECIFICATIONS ● GPS APPLICATION

● CLIPPED SINE WAVEFORM
Item Specifications
XTAL
C ± 2゜
Initial frequnecy tolerance at +25゜ C ±1.5 ppm max.*2 ±1.5 ppm max. (Vcon = 1/2 VDD)*2
Temperature range ±0.5 ppm max. over -30゜
C to +85゜ C)*3
Actual size Stability ±0.1 ppm max. at 10 kΩ ±10% with 10 pF ±10%
Output load change
CLK OSC
0.0086 gm (wt.) Aging ±1.0 ppm max. per year at +25゜
C ±3゜C
-30゜ C (Standard)
SXO-2016HG temperature C to +85゜
#4
2.0±0.1
#3
Operating Supply voltage (VDD) D = +1.8V, F = +2.5V, H = +2.8V, J = +3.0V, K = +3.3V DC ±5%
Conditions
+0.9V ± 0.8V (VDD = +1.8V)
1.6±0.1
1/2 VDD ± 1V (VDD = +2.5V to +3.3V)

#1 #2
Max. Ratings
Storage temperature C to +85゜ C
0.7±0.1
-40゜
1.5 mA max. (13.000 MHz to 30.000 MHz)
VCXO
1.2±0.05
CONNECTION
2 mA max. (40.000 MHz to 52.000 MHz)
0.6±0.1 0.4 0.6±0.1
#1 #2 TCXO VC-TCXO
PIN
Level 0.8 Vp-p min.
SXO-2016HG SXO-2016HGV
1 GND Vcontrol
#4 #3
2
3
GND
OUTPUT
4 VDD (-40゜
C to +85゜
C)
0.4±0.1 0.4±0.1
±8 ppm to ±13 ppm
SOLDERING PATTERN Frequency (VDD = +1.8V)
Voltage control (Vcon) n.a.
0.6
(VDD = +2.5V to +3.3V)
TCXO
1.15
2 ms max. (Vout ≧ 90%Vp-p)

0.8
Start-up time
1.8
2 ms max. (within ±0.5 ppm)
OUTPUT WAVEFORM ±0.1 ppm / ゜ C max. : (-20゜ C to +75゜C)
Frequency slope vs. temperature
±0.3 ppm / ゜ C max. : (-30゜ C to +85゜C)
OCXO
Reflow condition
TEST CIRCUIT Optional Operating Low limit / Symbol C/g
-10゜ -15゜C/h -20゜C/i C/j
-25゜ C/k
-30゜ -35゜C/l C/m
-40゜
SXO-2016HG Temperature*4 High limit / Symbol +55゜
C / ff +60゜
C / gg +65゜C / hh +70゜
C / ii +75゜
C / jj +80゜C / kk +85゜
C / ll
( * 1 ) Fi nal par t num ber t o be as s i gned w i th pac k age ty pe, T C XO or VC - T C XO, i nput v ol tage, oper ati ng tem per atur e an d f requency.
e. g. S X O- 2016H G - J - S-16.369MH z
3
( * ) A t V c on = 1/ 2V DD D C for SXO- 2016H GV
( * 4 ) S el ec t " low li m it " and "hi gh l i m i t" for new oper ati ng temper atur e c ombi nati on fr om the l i s ts .
MCF

4.0±0.1
Package
SXO-2016HG
1.75±0.1
∅
Item L 1.5 + 2.0±0.1
0
0 .1
SXO-2016HGV Lid Metal
Base Ceramic
D
C
A
Sealing Seam
J

Terminal plating
115
Temperature Compensated Crystal Oscillators TCXO TRI-STATE ± 2.0 ppm 13 to 52 MHz 2.0x1.6 mm +1.8 to +3.3V CLIPPED SINE
SXO-2016ED (+1.8V to +3.3V FIXED MODELS) 2.0x1.6 mm STANDARD SMD TCXO
SXO-2016ED STANDARD SPECIFICATIONS ● ENABLE / DISABLE OUTPUT CONTROL

Item Specifications
XTAL
General part number SXO-2016ED*1

C ±2゜
Initial frequency tolerance at +25゜ C ± 1.5 ppm max.*2
Temperature range ±2 ppm max. over -30゜C to +85゜C (referred to +25゜
C)
Actual size
CLK OSC
0.0086 gm (wt.)
-30゜ C (Standard)
SXO-2016ED Operating
Supply voltage (VDD) D = +1.8V, F = +2.5V, H = +2.8V, J = +3.0V, K = +3.3V DC ±5%
2.0±0.1 Conditions
#4 #3
E/D control voltage VIH : 80% VDD min. (Enable)
(Pin#1) VIL : 20% VDD max. (Disable)
1.6±0.1

Absolute E/D Vcontrol voltage
#1 #2 -0.6V to VDD +0.6V (+4.6V max.)
Max. Ratings (Pin#1)
0.7±0.1
1.5 mA max. (13.000 MHz to 30.000 MHz)

VCXO
1.2±0.05 Input current 1.7 mA max. (30.000 MHz to 40.000 MHz)

2 mA max. (40.000 MHz to 52.000 MHz)
0.6±0.1 0.4 0.6±0.1
#1 #2
PIN
1
CONNECTION
“ L” Open or “H”
Disable current 2 μA max. (Pin#1 = VIL)
#4 #3
2
3 Z
GND
OUTPUT Level 0.8 Vp-p min.
0.4±0.1 0.4±0.1
4 VDD
Z : high impedane
(-40゜
C to +85゜
C)
SOLDERING PATTERN Harmonic distortion -5 dBc max.
0.6
TCXO

Short-term frequency stability ± 1 ppb max. (Allan variance Tau = 0.1 sec.)
1.15
IR reflow resistance ± 1 ppm max. (referred to frequency before reflow)

0.8
Reflow condition
1.8 +170゜C ±10゜ C for 1 to 2 minutes (preheating)
OUTPUT WAVEFORM Optional Operating Low limit / Symbol C/g
-10゜ -15゜C/h -20゜C/i C/j
-25゜ C/k
-30゜ -35゜C/l C/m
-40゜
C / ff +60゜
C / gg +65゜C / hh +70゜
C / ii +75゜
C / jj +80゜C / kk +85゜
C / ll
( * 1 ) Fi nal par t n umber to be as s i gned w i th pac k age ty pe, i nput v ol tage, oper ati ng temper atur e and fr equency.
OCXO
e. g. S X O- 2016ED -H -16.368M H z
( * 2 ) R ef er r ed t o nom i nal fr equenc y befor e r efl ow s ol der i ng.
( * 3 ) S el ec t " low l i mi t" and "hi gh l i mi t" for new oper ati ng tem per atur e c om bi nati on fr om the l i s ts .

TEST CIRCUIT Package
4.0±0.1
SXO-2016ED
1.75±0.1
∅
Item L 1.5 + 2.0±0.1
0
-0 .1
Lid Metal
Base Ceramic
D
C
A
Sealing Seam
MCF

J

Terminal plating
116
Quartz Crystal
Temperature Units
Compensated Crystal Oscillators TCXO TRI-STATE ± 0.5 ppm GPS 13 to 52 MHz 2.0x1.6 mm +1.8 to +3.3 V CLIPPED SINE
SXO-2016HGED (+1.8V to +3.3V FIXED MODELS) 2.0x1.6 mm STANDARD SMD TCXO
SXO-2016HGED STANDARD SPECIFICATIONS ● ENABLE / DISABLE OUTPUT CONTROL

● GPS APPLICATION
XTAL
Item Specifications
General part number SXO-2016HGED*1
C ±2゜
Initial frequnecy tolerance at +25゜ C ±1.5 ppm max.*2
Temperature range ±0.5 ppm max. over -30゜C to +85゜C (referred to +25゜
C)
Actual size
CLK OSC
0.0086 gm (wt.)
Operating -30゜C to +85゜C (Standard)
SXO-2016HGED temperature -40゜C to +85゜C (W = Option, frequency dependent)
Operating D = +1.8V, F = +2.5V, H = +2.8V, J = +3.0V, K = +3.3V DC ±5%
#4
2.0±0.1
#3 Conditions
1.6±0.1

Absolute E/D control voltage
#1 #2
-0.6V to VDD +0.6V (+4.6V max.)
Max. Ratings (Pin#1)
0.7±0.1
-40゜
1.5 mA max. (13.000 MHz to 30.000 MHz)
VCXO
1.2±0.05
2 mA max. (40.000 MHz to 52.000 MHz)
0.6±0.1 0.4 0.6±0.1
#1 #2
PIN
1
CONNECTION
“ L” OPEN or “H” Disable current 2 μA max. (Pin#1 = VIL)
2 GND
#4 #3 3 Z OUTPUT Level 0.8 Vp-p min.
0.4±0.1 0.4±0.1
4 VDD
Z : high impedance Output Load 10 kΩ // 10 pF
(-40゜
C to +85゜
C)
0.6
TCXO
1.15

0.8

Reflow condition
C ±10゜
1.8
OUTPUT WAVEFORM
-10゜ -15゜C/h -20゜C/i C/j
-25゜ C/k
-30゜ -35゜C/l C/m
-40゜
C / ff +60゜
C / gg +65゜C / hh +70゜
C / ii +75゜
C / jj +80゜C / kk +85゜
C / ll
( * 1 ) Fi nal par t num ber to be as s i gned w i th pac k age ty pe, i nput v ol tage, oper ati ng temper atur e and fr equenc y.
OCXO
e. g. S X O- 2016H GED -F -W- 26M H z
( * 3 ) S el ec t " low li m it " a nd "hi gh l i m i t" for new oper ati ng temper atur e c ombi nati on fr om the l i s ts .

TEST CIRCUIT Package
4.0±0.1
SXO-2016HGED
1.75±0.1
∅
Item L 1.5 + 2.0±0.1
0
-0 .1
Lid Metal
Base Ceramic
D
C
A
Sealing Seam
MCF
J

Terminal plating
117
Temperature Compensated Crystal Oscillators TCXO or VC-TCXO ± 2.0 ppm 13 to 52 MHz 2.5x2.0 mm +1.8 to +3.3 V CLIPPED SINE

Item Specifications
XTAL

C ±2゜
Temperature range ±2 ppm max. over -30゜
C to +85゜ C)*3
Frequency Input voltage change ±0.2 ppm max. at VDD ± 5% DC
CLK OSC
Aging ±1 ppm max. per year at +25゜

C ±3゜C
0.014 gm (wt.)
-30゜ C (Standard)
SXO-2200 temperature C to +85゜
2.5±0.2
Operating Supply voltage (VDD) D = +1.8V, F = +2.5V, H = +2.8V, J = +3.0V, K = +3.3V DC ± 5%
#6 #5 #4 Conditions
+0.9V ± 0.8V (VDD = +1.8V)
1/2 VDD ±1V (VDD = +2.5V to +3.3V)
2.0±0.2

Absolute n.a.
Vcontrol voltage (Vcon) -0.6V to VDD +0.6V DC
#1 #2 #3 Max. Ratings
0.8±0.1
1.5 mA max. (13.000 MHz to 30.000 MHz)

VCXO
0.35 0.15X0.15 0.35

#1 #2 #3 CONNECTION 2 mA max. (40.000 MHz to 52.000 MHz)
PIN TCXO VC-TCXO
Level 0.8 Vp-p min.
0.7
SXO-2200 SXO-2200V
1
2
GND Vcontrol
NC or GND Output Load 10 kΩ // 10 pF
(-40゜
C to +85゜
C)
0.6
3 GND
4
5
OUTPUT
NC or GND Waveform Clipped sine wave (DC-coupling)
0.7
±8 to ±13 ppm
0.3
6 VDD
#6 #5 #4
0.5
1.8
Adjustment ±9 to ±15 ppm

SOLDERING PATTERN (VDD = +2.5V to +3.3V)
TCXO
0.5 0.55
1.4
0.95
0.4
0.7 IR reflow resistance ±1 ppm max. (referred to frequency before reflow)

2.3
Reflow condition
OUTPUT WAVEFORM
OCXO
-10゜ -15゜C/h -20゜C/i C/j
-25゜ C/k
-30゜ -35゜C/l C/m
-40゜
C / ff +60゜
C / gg +65゜C / hh +70゜
C / ii +75゜
C / jj +80゜C / kk +85゜
C / ll
( * 1 ) Fi nal par t n umber to be as s i gned w i th pac k age ty pe, T C XO or VC - T C XO, i nput v ol tage, oper ati ng temperat ure and f requency.
e. g. S X O- 2200 -F -W-26MH z
3
( * ) A t V c on = 1 /2 V DD D C for SXO -2200V
( * 4 ) S elec t " l ow l i mi t" and "hi gh l i mi t" for new oper ati ng tem per atur e c om bi nati on fr om the l i s ts .
TEST CIRCUIT
SXO-2200 PACKAGE DATA TAPE SPECIFICATIONS
4.0±0.1
Package
SXO-2200
1.75±0.1
MCF
∅
Item L 1.5 + 2.0±0.1
0
-0 .1
Lid Metal
Base Ceramic
D
C
A
Sealing Seam
J

Terminal plating
SXO-2200V (surface) / (under) 2.85 2.35 8.0 3.5 4.0 1.0 0.25 0.9 180 2000pcs
118
Quartz Crystal
Temperature Units
Compensated Crystal Oscillators TCXO or VC-TCXO ± 0.5 ppm GPS 13 to 52 MHz 2.5x2.0 mm +1.8 to +3.3 V CLIPPED SINE
SXO-2200HG SERIES (+1.8V to +3.3 V FIXED MODELS) 2.5x2.0 mm STANDARD SMD TCXO

Item Specifications
XTAL
C ±2゜
Initial frequnecy tolerance at +25゜ C ±1.5 ppm max.*2 ±1.5 ppm max. (VCON = 1/2 VDD)*2
Temperature range ±0.5 ppm max. over -30゜C to +85゜ C)*3
Actual size Stability Output load change ±0.2 ppm max. at 10 kΩ ±10% with10 pF ±10%
CLK OSC
0.014 gm (wt.) Aging ±1 ppm max. per year at +25゜ C ±3゜ C
-30゜ C (Standard)
SXO-2200HG temperature C to +85゜
#6
2.5±0.2
#5 #4
Conditions
+0.9V ±0.8V (VDD = +1.8V)
1/2 VDD ±1V (VDD = +2.5V to +3.3V)
2.0±0.2

Max. Ratings
#1 #2 #3

0.8±0.1
1.5 mA max. (13.000 MHz to 30.000 MHz)
VCXO
0.35 0.15x0.15 0.35 Input current 1.7 mA max. (30.000 MHz to 40.000 MHz)
#1 #2 #3
PIN TCXO
CONNECTION
VC-TCXO 2 mA max. (40.000 MHz to 52.000 MHz)
0.7
Level 0.8 Vp-p min.

SXO-2200HG SXO-2200HGV
1 GND Vcontrol
2 NC or GND
0.6
3 GND
4 OUTPUT (-40゜
C to +85゜
C)
5 NC or GND
0.7
0.3
6 VDD
#6 #5 0.5
1.8
#4
±8 ppm to ±13 ppm
Frequency Voltage control (VDD = +1.8V)
n.a.
SOLDERING PATTERN Adjustment (Vcon) ±9 ppm to ±15 ppm
(VDD = +2.5V to +3.3V)
TCXO
0.5 0.55

1.4
0.95
±1 ppb max. (Allan variance Tau = 0.1 sec.)

0.4
0.7
Short-term frequency stability
Reflow condition
OUTPUT WAVEFORM +170゜ C ±10゜C for 1 to 2 minutes (preheating)
OCXO
-10゜ -15゜C/h -20゜C/i C/j
-25゜ C/k
-30゜ -35゜C/l C/m
-40゜
C / ff +60゜
C / gg +65゜C / hh +70゜
C / ii +75゜
C / jj +80゜C / kk +85゜
C / ll
( * 1 ) F inal par t num ber to be as s i gned w i th pac k age ty pe, T C XO or VC - T C XO, i nput v ol tage, oper ati ng temper atur e and f requency.
e. g. S X O- 2200H G -H- 38.4MH z
( * 2 ) R ef er r ed t o nom i n al fr equenc y befor e r efl ow s ol der i ng.
( * 3 ) A t V c on = 1/ 2 V DD D C for SXO -2200H GV.
TEST CIRCUIT ( * 4 ) S elec t " l ow l im i t " and "hi gh l i m i t" for new oper ati ng temper atur e c ombi nati on fr om the l i s ts .
SXO-2200HG
4.0±0.1
MCF
Package
SXO-2200HG
1.75±0.1
∅
Item L 1.5 + 2.0±0.1
0
-0 .1
Lid Metal
Base Ceramic
D
C
A
Sealing Seam
J
SXO-2200HGV Gold / Nickel A B C D F J L M Reel Dia. Qty/Reel

Terminal plating
119
Temperature Compensated Crystal Oscillators TCXO or VC-TCXO TRI-STATE ± 0.5 ppm GPS 13 to 52 MHz 2.5x2.0 mm +1.8 to +3.3 V CLIPPED SINE
SXO-2200HGED SERIES (+1.8V to +3.3V FIXED MODELS) 2.5x2.0 mm STANDARD SMD TCXO
SXO-2200HGED STANDARD SPECIFICATIONS ● ENABLE / DISABLE OUTPUT CONTROL

● GPS APPLICATION
XTAL
Item Specifications
General part number SXO-2200HGED*1 SXO-2200HGEDV*1
C ±2゜
Actual size
CLK OSC
0.014 gm (wt.)
SXO-2200HGED Operating C to +85゜
-30゜ C (Standard)
2.5±0.2 temperature C to +85゜
Supply voltage (VDD) D = +1.8V, F = +2.5V, H = +2.8V, J = +3.0V, K = +3.3V DC ±5%
#6 #5 #4
Operating
+0.9V ±0.8V (VDD = +1.8V)
Conditions Control voltage (Vcon) n.a.
2.0±0.2
1/2 VDD ±1V (VDD = +2.5V to +3.3V)

#1 #2 #3
0.8±0.1
VCXO
Vcontrol voltage (Vcon) n.a. -0.6V to VDD +0.6V DC

0.35 0.15x0.15 0.35 Absolute
Max. Ratings E/D control voltage
#1 #2 #3 CONNECTION
-0.6V to VDD +0.6V (+4.6V max.)
PIN TCXO VC-TCXO
(Pin#2)
0.7
SXO-2200HGED SXO-2200HGEDV
1
Storage temperature C to +85゜C
GND Vcontrol
2 “ L” OPEN or “H” “ L” OPEN or “H” -40゜
0.6
3 GND
4
5
“Z” OUTPUT
NC or GND
“Z” OUTPUT
1.5 mA max. (13.000 MHz to 30.000 MHz)
0.7
6 VDD
0.3
2 mA max. (40.000 MHz to 52.000 MHz)

#6 #5 0.5 #4 Z : high impedance
1.8
Disable current 2 μA max. (Pin#2 = ViL)

SOLDERING PATTERN Level 0.8 Vp-p min.
Output
TCXO
0.5 0.55
(-40゜
C to +85゜
C)
Load 10 kΩ. // 10 pF
Frequency Voltage control ±8 ppm to ±13 ppm (VDD = +1.8V)
n.a.
1.4
Adjustment (Vcon) ±9 ppm to ±15 ppm (VDD = +2.5V to +3.3V)

0.95
0.4
0.7 Harmonic distortion -5 dBc max.

2.3
OUTPUT WAVEFORM ±0.1 ppm / ゜C max. (-20゜ C to +75゜C)
OCXO
Frequency slope vs. temperature ±0.3 ppm / ゜C max. (-30゜ C to +85゜C)

Reflow condition
TEST CIRCUIT Standard frequencies (MHz) 16.368, 16.369, 19.200, 26.000, 27.456, 33.600, 38.400, 52.000
SXO-2200HGED Optional Operating Low limit / Symbol C/g
-10゜ -15゜C/h -20゜C/i C/j
-25゜ C/k
-30゜ -35゜C/l C/m
-40゜
C / ff +60゜
C / gg +65゜C / hh +70゜
C / ii +75゜
C / jj +80゜C / kk +85゜
C / ll
MCF
e. g. S X O- 2200H GED -J -52MH z

( * 3 ) A t V c on = 1/2 V DD D C for SXO -2200H GED V.

4.0±0.1
Package
SXO-2200HGED
1.75±0.1
∅
Item L 1.5 + 2.0±0.1
SXO-2200HGEDV 0
-0 .1
Lid Metal
Base Ceramic
D
C
A
Sealing Seam
J

Terminal plating
120
Quartz Crystal
Temperature Units
Compensated Crystal Oscillators TCXO or VC-TCXO ±2.5 ppm 10 to 40MHz 3.2x2.5 mm +1.8 to +3.3 V CLIPPED SINE

Item Specifications
XTAL
C ±2゜
Initial frequnecy tolerance at +25゜ C ± 1.5 ppm max.*2 ± 1.5 ppm max. (Vcon = 1/2 VDD)*2
Aging ±1 ppm max. per year at +25゜ C ± 3゜C
CLK OSC
0.024 gm (wt.)
-30゜ C (Standard)
3.2±0.2 Operating Supply voltage (VDD) D = +1.8V, F = +2.5V, H = +2.8V, J = +3.0V, K = +3.3V DC ±5%
#4 #3 Conditions
1/2 VDD ±0.8V (VDD = +1.8V)
1/2 VDD ±1V (VDD = +2.5V to +3.3V)
2.5±0.2

Absolute n.a.
Vcontrol voltage (Vcon) -0.6V to VDD +0.6V DC
#1 Max. Ratings
#2
-40゜
1.5 mA max. (10.000 MHz to 30.000 MHz)
0.9±0.1
Input current
VCXO
1.7 mA max. (30.000 MHz to 40.000 MHz)
0.48 2.24 0.48
#1 #2 Level 0.8 Vp-p min.
Output Load 10 kΩ. // 10 pF
0.9
CONNECTION
(-40゜
C to +85゜
C)
PIN TCXO VC-TCXO
SXO-3200 SXO-3200V
0.7
1 GND (recommended) Vcontrol
±8 ppm to ±13 ppm

or NC
2 GND
0.9
3 OUTPUT
4 VDD Frequency (VDD = +1.8V)
#4 #3 Voltage control n.a.
0.6 Frequency slope n.a. positive
TCXO
1.7
1.2

Reflow condition
TEST CIRCUIT +170゜ C ±10゜C for 1 to 2 minutes (preheating)
SXO-3200 10.000, 12.000, 12.288, 12.800, 13.000, 14.000, 14.7456, 15.000, 15.360,
Standard frequencies (MHz) 16.000, 16.384, 16.639, 16.800, 18.000, 19.000, 19.440, 19.680, 20.000,
OCXO
21.250, 22.400,24.000, 24.576, 25.000, 26.000, 38.400, 40.000
-10゜ -15゜C/h -20゜C/i C/j
-25゜ C/k
-30゜ -35゜C/l C/m
-40゜
C / ff +60゜
C / gg +65゜C / hh +70゜
C / ii +75゜
C / jj +80゜C / kk +85゜
C / ll
( * 1 ) Fi nal par t num ber to be as s i gned w i th pac k age ty pe, T C XO or VC -T C XO, i nput v ol tage, oper ati ng temper atur e and f requency.
e. g. S X O- 3200V -K-40MH z
PACKAGE DATA
SXO-3200V
TAPE SPECIFICATIONS
MCF
Package
Item SXO-3200 4.0±0.1
1.75±0.1
∅
Lid Metal L 1.5 +
0
-0 .1
2.0±0.1
Base Ceramic
Sealing Seam
D
C
A

M B F
Gold / Nickel
J
Terminal plating
(surface) / (under) A
3.6
B
2.9
C
8.0
D
3.5
F
4.0
J
1.0
L
0.25
M
1.1
Reel Dia.
180
Qty/Reel
2000pcs
121
Temperature Compensated Crystal Oscillators TCXO or VC-TCXO ± 0.5 ppm GPS 10 to 40 MHz 3.2x2.5 mm +1.8 to +3.3 V CLIPPED SINE
SXO-3200HG SERIES (+1.8 V to +3.3 V FIXED MODELS) 3.2x2.5 mm STANDARD SMD TCXO

Specifications
XTAL
Item
C ±2゜
Initial frequnecy tolerance at +25゜ C ± 1.5 ppm max.*2 ± 1.5 ppm max. (VCON = 1/2 VDD)*2
Actual size
CLK OSC
0.024 gm (wt.) ±1 ppm max. per year at +25゜

Aging C ±3゜ C
SXO-3200HG Operating C to +85゜
-30゜ C (Standard)
3.2±0.2
#4 #3 Operating Supply voltage (VDD) D = +1.8V, F = +2.5V, H = +2.8V, J = +3.0V, K = +3.3V DC ±5%
Conditions
1/2 VDD ±0.8V (VDD = +1.8V)
1/2 VDD ± 1V (VDD = +2.5V to +3.3V)
2.5±0.2

Absolute
#1 #2 Vcontrol voltage (Vcon) n.a. -0.6V to VDD +0.6V DC
Max. Ratings
0.9±0.1
VCXO
1.5 mA max. (10.000 MHz to 30.000 MHz)

Input current
0.48 2.24 0.48 1.7 mA max. (30.000 MHz to 40.000MHz)
#1 #2
Level 0.8 Vp-p min.
Output
0.9
CONNECTION
PIN TCXO
SXO-3200HG
VC-TCXO
SXO-3200HGV (-40゜
C to +85゜
C)
Load 10 kΩ // 10 pF
0.7
1
2
GND (recommended)
or NC
GND
Vcontrol
3 OUTPUT
±8 ppm to ±13 ppm
0.9
4 VDD
#4 #3
TCXO
0.6
1.7
1.2
2.65
OUTPUT WAVEFORM Reflow condition
10.000, 13.000, 16.367667, 16.368, 16.369, 16.800, 19.200, 20.000,
OCXO
Standard frequencies (MHz)

23.104, 24.5536, 25.000, 26.000, 38.400
-10゜ -15゜C/h -20゜C/i C/j
-25゜ C/k
-30゜ -35゜C/l C/m
-40゜
C / ff +60゜
C / gg +65゜C / hh +70゜
C / ii +75゜
C / jj +80゜C / kk +85゜
C / ll
( * 1 ) F inal par t num ber to be as s i gned w i th pac k age ty pe, T C XO or VC -T C XO, i nput v ol tage, oper ati ng tem p erat ure and f requency.
e. g. S X O-3200H G -B -26MH z
TEST CIRCUIT ( * 2 ) R ef er r ed t o nom i nal fr equenc y befor e r efl ow s ol der i ng.
( * 3 ) A t V c on = 1 /2 V DD D C for SXO -3200H GV.
SXO-3200HG ( * 4 ) S elec t " l ow l i m i t" and "hi gh l i m i t" for new oper ati ng temper atur e c ombi nati on fr om the l i s ts .

4.0±0.1
MCF
Package
SXO-3200HG
1.75±0.1
∅
Item L 1.5 + 2.0±0.1
0
-0 .1
Lid Metal
Base Ceramic
D
C
A
Sealing Seam
SXO-3200HGV Terminal Tungsten (metalized) M B F
J

Terminal plating
122
Quartz Crystal
Temperature Units
Compensated Crystal Oscillators TCXO or VC-TCXO ± 2.5 ppm 6 to 45 MHz 5.0x3.2 mm +2.8 to +5 V CLIPPED SINE
SXO-5200 SERIES (+2.8 V to +5.0 V FIXED MODELS) 5.0x3.2 mm STANDARD SMD TCXO

Item Specifications
XTAL
C ±2゜
Initial frequnecy tolerance at +25゜ C ±0.5 ppm max.*2 ± 0.5 ppm max.(VCON = ±1.5V)*2
Temperature range ±2.5 ppm max. over -30゜C to +75゜ C)*3
Actual size
CLK OSC
0.06 gm (wt.)
-30゜ C (Standard)
Operating temperature C to +85゜
SXO-5200
5.0±0.2
Conditions Supply voltage (VDD) H = +2.8V, J = +3.0V, K = +3.3V, N = +5.0V DC ±5%
#4 #3
Control voltage (Vcon) n.a. +1.5V ±1V
Absolute
3.2±0.2

Max. Ratings
#1 #2
1.5 mA max. ( 6.000 MHz to 20.000 MHz)
Input current 2 mA max. (20.000 MHz to 32.000 MHz)
1.05±0.1
2.5 mA max. (32.000 MHz to 45.000 MHz)
VCXO
1.2 2.6 1.2 Level 0.8 Vp-p min.
#1 #2 Output Load 10 kΩ // 10 pF
(-40゜
C to +85゜
C)
0.8
CONNECTION
PIN TCXO
SXO-5200
VC-TCXO
SXO-5200V
1.6
1 GND Vcontrol
Frequency Voltage control ±8 ppm min.
2 GND
n.a.
3 OUTPUT
Adjustment (+1.5V ±1V)
0.8
4 VDD
#4 #3
1.3 Start-up time 2 ms max.
TCXO
2.6

1.0
Reflow condition
3.9 +170゜ C ±10゜C for 1 to 2 minutes (preheating)
8.000, 10.000, 12.000, 12.800, 13.000, 14.400, 16.368, 19.200, 19.800,
OUTPUT WAVEFORM 20.000, 25.5535, 26.000, 40.000
-10゜ -15゜C/h -20゜C/i C/j
-25゜ C/k
-30゜ -35゜C/l C/m
-40゜
C / ff +60゜
C / gg +65゜C / hh +70゜
C / ii +75゜
C / jj +80゜C / kk +85゜
C / ll
OCXO
( * 1 ) F inal par t num ber to be as s i gned w i th pac k age ty pe, T C XO or VC - T C XO, i nput v ol tage, oper ati ng temper atur e and f requency.
e. g. S X O- 5200V -N -W-26M H z
( * 2 ) R ef er r ed t o nom i n al fr equenc y befor e r efl ow s ol der i ng.
( * 3 ) A t V c on = + 1. 5V DC for SXO -5200V
( * 4 ) S elec t " l ow l im i t " and "hi gh l i m i t" for new oper ati ng temper atur e c ombi nati on fr om the l i s ts .
TEST CIRCUIT
SXO-5200 PACKAGE DATA TAPE SPECIFICATIONS
4.0±0.1
Package
SXO-5200
1.75±0.1
∅
Item L 1.5 + 2.0±0.1
0
-0 .1
Lid Metal
Base Ceramic
MCF
D
C
A
Sealing Seam
J

Terminal plating
SXO-5200V (surface) / (under) 5.3 3.5 12.0 5.5 8.0 1.5 0.3 1.5 180 1000pcs
123
Temperature Compensated Crystal Oscillators TCXO or VC-TCXO ± 2.5 ppm 10 to 26 MHz 7.0x5.0 mm +2.8 to +5 V CLIPPED SINE
SXO-7100*1 SERIES (+2.8V to +5.0V FIXED MODELS) 7.0x5.0 mm STANDARD SMD TCXO

Item Specifications
XTAL

C ±2゜
Initial frequnecy tolerance at +25゜ C ±0.5 ppm max.*3 ±0.5 ppm max. (VCON = +1.5V)*3
C (referred to + 25゜
Actual size
CLK OSC
0.165 gm (wt.)
-30゜ C (Standard)
Operating temperature C to +85゜
SXO-7100
7.0±0.2
Conditions Supply voltage (VDD) H = +2.8V, J = +3.0V, K = +3.3V, N = +5.0V DC ±5%
#4 #3
Control voltage (Vcon) n.a. +1.5V ±1V DC
Absolute
5.0±0.2

Max. Ratings
#1 #2
Input current 2 mA max.
Level 0.8 Vp-p min.
1.65±0.1
VCXO
1.4 3.68 1.4 (-40゜
C to +85゜
C)
#1 #2 Waveform Clipped sine wave (DC-cut)
1.0
A CONNECTION
Frequency adjustment ±8 ppm min.
PIN TCXO VC-TCXO
n.a.
D B SXO-7100 SXO-7100V
Voltage control (+1.5V ±1V)
3.0
1 GND Vcontrol
C
2
3
GND
OUTPUT Frequency slope n.a. Positive
1.0
4 VDD
#4 5.08 #3 Harmonic distortion -5 dBc max.
＊The terminals (A,B,C &D) Not to be connected.
＊No pattern path underneath the package.
SOLDERING PATTERN Short-term frequency stability ±1 ppb max. (Allan variance Tau = 0.1 sec.)
TCXO
1.5
Reflow condition
4.2

-10゜ -15゜C/h -20゜C/i C/j
-25゜ C/k
-30゜ -35゜C/l C/m
-40゜
1.2
5.08
C / ff +60゜
C / gg +65゜C / hh +70゜
C / ii +75゜
C / jj +80゜C / kk +85゜
C / ll
( * 1 ) For m er l y S XO-7100AV( B)
OUTPUT WAVEFORM e. g. S X O- 7100 -K-15.36M H z
OCXO

( * 4 ) A t V c on = + 1.5 V D C for SXO -7100V.

4.0±0.1
Package
SXO-7100
1.75±0.1
∅
Item L 1.5 + 2.0±0.1
0
-0 .1
TEST CIRCUIT Lid Metal
SXO-7100 Base Ceramic
D
C
A
Sealing Seam
MCF

J

Terminal plating
SXO-7100V
124
Quartz Crystal
Temperature Units
Compensated Crystal Oscillators TCXO TRI-STATE ± 2.5 ppm 4 to 54 MHz 2.5x2.0 mm +1.8 to +3.3 V CMOS
SXO-2520 (+1.8V to +3.3V FIXED MODELS) 2.5x2.0 mm STANDARD SMD TCXO
SXO-2520 STANDARD SPECIFICATIONS ● ENABLE / DISABLE OUTPUT CONTROL

● CMOS OUTPUT
Item Specifications
XTAL
General part number SXO-2520*1
C ±2゜
Initial frequnecy tolerance at +25゜ C ±1 ppm max.
Stability Output load change ±0.2 ppm max. at 15 pF ±10%
Actual size Aging ±1 ppm max. per year at +25゜ C ±3゜ C
CLK OSC
0.014 gm (wt.) Operating -30゜ C to +75゜ C (Standard)
temperature -40゜ C to +85゜ C (W = Option, frequency dependent)
SXO-2520 Operating
Supply voltage (VDD) D = +1.8V*2, F = +2.5V, H = +2.8V, J = +3.0V, K = +3.3V DC ±5%
Conditions
#4
2.5±0.1
#3
Stand-by VIH : 80% VDD min.
control voltage (Pin#1) VIL : 20% VDD max.*2
2.0±0.1
Max. Ratings Storage temperature -55゜ C to +100゜ C

4 to 10 MHz 10 to 20 MHz 20 to 30 MHz 30 to 40 MHz 40 to 54 MHz
#1 #2
+1.8V*2 3.1 3.7 4.2 4.6 5.5

0.9±0.1
Input current (max. mA) +2.5V 3.1 3.7 4.2 4.6 5.5
VCXO
0.775 0.95 0.775
+2.8V 3.4 4.1 4.7 5.2 6.0
#1 #2 +3.3V 4.0 4.8 5.5 6.0 7.0
0.675
Stand-by current*3 10 μA max. (Pin#1 = VIL)…-40゜ C to +85゜ C

PIN CONNECTION
0.65
2 GND
0.675
3 Z OUTPUT
VDD
Output
4
(-40゜
C to +85゜
C)
"0" level VOL : 10% VDD max.
SOLDERING PATTERN "1" level VOH : 90% VDD min.
TCXO
1.0

0.9

1.5
0.01μF
～
0.1μF SSB phase noise (24.000 MHz) -145 dBc / Hz, Typical at 10 kHz offset
Reflow condition
C ±10゜
1.8
OUTPUT WAVEFORM
OCXO
e. g. S X O- 2520 - F -24MH z
( * 2 ) V DD = + 1. 8 V is av a i l abl e for onl y al l ov er ±5ppm max . of fr equenc y s tabi l i ty.

4.0±0.1
Package
SXO-2520
1.75±0.1
∅
Item L 1.5 + 2.0±0.1
0
-0 .1
Lid Metal
Base Ceramic
D
C
A
Sealing Seam
TEST CIRCUIT
MCF
J

Terminal plating
(surface) / (under) 2.7 2.25 8.0 3.5 4.0 1.1 0.25 1.1 180
1000pcs
2000pcs
125
Temperature Compensated Crystal Oscillators TCXO TRI-STATE ± 2.5 ppm 4 to 54 MHz 3.2x2.5 mm +1.8 to +3.3 V CMOS
SXO-3225 (+1.8V to +3.3V FIXED MODELS) 3.2x2.5 mm STANDARD SMD TCXO
SXO-3225 STANDARD SPECIFICATIONS ● ENABLE / DISABLE OUTPUT CONTROL

● CMOS OUTPUT
Item Specifications
XTAL

C ±2゜
Initial frequnecy tolerance at +25゜ C ±1.0 ppm max.
C to +75゜ C)*2
Stability Output load change ±0.2 ppm max. at 15 pF ±10%
Actual size Aging ±1 ppm max. per year at +25゜C ±3゜ C
CLK OSC
0.025 gm (wt.) Operating C to +75゜

-30゜ C (Standard)
Operating
SXO-3225
Conditions Supply voltage (VDD) D = +1.8V*2, F = +2.5V, H = +2.8V, J = +3.0V, K = +3.3V DC ±5%
#4
3.2±0.2
#3
Stand-by VIH : 80% VDD min. 2
control voltage(Pin#1) VIL : 20% VDD max.*
Absolute Supply voltage -0.5V to +4V DC
Max. Ratings
2.5±0.2

C
#1 #2 +1.8V*2 3.1 3.7 4.2 4.6 5.5
VCXO
1.0±0.2
+2.8V 3.4 4.1 4.7 5.2 6.0

+3.3V 4.0 4.8 5.5 6.0 7.0
1.0 1.2 1.0
#1 #2 Stand-by current*3 10 μA max. (Pin#1 = VIL)…-40゜ C to +85゜C
0.75
1.0
PIN
1
CONNECTION
“ L” OPEN or “H” Output "0" level VOL : 10% VDD max.
2 GND (-40゜
C to +85゜
C)
"1" level VOH : 90% VDD min.
0.75
3 Z OUTPUT
4 VDD
TCXO
SOLDERING PATTERN Disable delay time 200 ns max.

1.3 Enable delay time 10 ms max.
SSB phase noise (26.000MHz) -145 dBc / Hz, Typical at 10 kHz offset
1.1

1.9
0.01μF
Reflow condition
～
0.1μF +170゜ C ±10゜C for 1 to 2 minutes (preheating)
2.3
( * 1 ) Fi nal par t n umber to be as s i gned w i th pac k age ty pe, i nput v ol tage, oper ati ng temper atur e and fr equency.
e. g. S X O- 3225 -K-W- 40M H z
OCXO
OUTPUT WAVEFORM ( * 2 ) V DD = + 1. 8V av ai l abl e for onl y al l ov er ±5 ppm m ax . of fr equenc y s tabi l i ty.


4.0±0.1
Package
SXO-3225
1.75±0.1
∅
Item L 1.5 + 2.0±0.1
0
-0 .1
Lid Metal
Base Ceramic
D
C
A
Sealing Seam
MCF

TEST CIRCUIT Terminal plating
126
Quartz Crystal
Temperature Units
Compensated Crystal Oscillators TCXO TRI-STATE ±2.5 ppm 4 to 54 MHz 5.0x3.2 mm +1.8 to +3.3 V CMOS
SXO-5032 (+1.8V, +2.5V, +2.8V & +3.3V FIXED MODELS) 5.0x3.2 mm STANDARD SMD TCXO
SXO-5032 STANDARD SPECIFICATIONS ● CMOS OUTPUT

● HIGH STABILITY TCXO
Item Specifications
XTAL
Frequency torelance ±1 ppm max. (1 hour after reflow soldering)
at +25゜C ±2゜C
Frequency Temperature range ±2.5 ppm max. over -30゜

C to +75゜ C)*2
Stability Input voltage change ±0.2 ppm max. at VDD ±5% DC
Actual size Output load change ±0.2 ppm max. at 15 pF ±10%
CLK OSC
0.052 gm (wt.) Aging ±1 ppm max. per year at +25゜C ±3゜ C
-30゜ C (Standard)
Operating
5.0±0.2
Conditions Supply voltage (VDD) D = +1.8V*2, F = +2.5V, H = +2.8V, K = +3.3V DC ±5%
#4 #3
3.2±0.2

C
#1 #2
+1.8V*2 3.1 3.7 4.2 4.6 5.5
1.05±0.1
VCXO
1.2 2.6 1.2
+2.8V 3.4 4.1 4.7 5.2 6.0
#1 #2
+3.3 V 4.0 4.8 5.5 6.0 7.0
0.8
PIN CONNECTION Stand-by current*3 10 μA max. (Pin#1 = VIL)

1.6
2 GND Symmetry 40% to 60% at 50% VDD level
3 Z OUTPUT
0.8
4 VDD
Output

(-40゜
C to +85゜
C)
1.3 2.6 1.3
TCXO
1.0

1.6
0.01μF
～
0.1μF
1.0
3.9
OUTPUT WAVEFORM Reflow condition
OCXO
e. g. S X O- 5032 - H -S-32MH z
( * 2 ) V DD = + 1. 8V i s av ai l abl e for onl y al l ov er ±5 ppm max . of fr equenc y s tabi l i ty.
3
( * ) I nt er nal c r y s t al os c i l l ati on to be hal ted ( Pi n#1 = V IL )

4.0±0.1
Package
SXO-5032
1.75±0.1
∅
Item L 1.5 + 2.0±0.1
0
-0 .1
Lid Metal
D
C
A
Sealing Seam
MCF
J

Terminal plating
127
Temperature Compensated Crystal Oscillators TCXO TRI-STATE ±2.5 ppm 4 to 54 MHz 7.0x5.0 mm +1.8 to +3.3 V CMOS
SXO-7050 (+1.8V, +2.5V, +2.8V & +3.3V FIXED MODELS) 7.0x5.0 mm STANDARD SMD TCXO
SXO-7050 STANDARD SPECIFICATIONS ● CMOS OUTPUT

● HIGH STABILITY TCXO
Item Specifications
XTAL

Frequency torelance ±1.5 ppm max. (1 hour after reflow soldering)
at +25゜C ±2゜C
C to +75゜ C)*2
Frequency
Stability Input voltage change ±0.2 ppm max. at VDD ±5% DC
Actual size Output load change ±0.2 ppm max. at 15 pF ±10%
CLK OSC
0.157 gm (wt.) Aging ±1 ppm max. per year at +25゜

C ±3゜
C
-30゜ C (Standard)
Operating
7.0±0.2
Conditions Supply voltage (VDD) D = +1.8V*2, F = +2.5V, H = +2.8V, K = +3.3V DC ±5%
#4 #3
5.0±0.2

C
#1 #2 4 to 10 MHz 10 to 20 MHz 20 to 30 MHz 30 to 40 MHz 40 to 54 MHz
+1.8V*2 3.1 3.7 4.2 4.6 5.5
1.35±0.2
VCXO
1.4 3.68 1.4
+2.8V 3.4 4.1 4.7 5.2 6.0
#1 #2
+3.3 V 4.0 4.8 5.5 6.0 7.0
1.2
PIN CONNECTION Stand-by current*3 10 μA max. (Pin#1 = VIL)

2.6
OPEN or “H”
Symmetry 45% to 55% at 50% VDD level
1 “ L”
2 GND
OUTPUT
3 Z
1.2
4 VDD
#4 5.08 #3 Z : high impedance Output "0" level VOL : 10% VDD max.
(-40゜
C to +85゜
C)
SOLDERING PATTERN
TCXO
1.8
2.0

4.2
0.01μF SSB phase noise -145 dBc / Hz, Typical at 10 kHz offset
～
0.1μF +250゜C ±10゜ C for 10 seconds
Reflow condition
5.08 +175゜ C ±10゜C for 1 to 2 minutes (preheating)
OUTPUT WAVEFORM ( * 1 ) Fi nal par t n um ber to be as s i gned w i th pac k age ty pe, i nput v ol tage, oper ati ng tem per atur e and fr equenc y.
OCXO
e. g. S X O- 7050 -K- S-44MH z

( * 2 ) V DD = + 1. 8V av ai l abl e for onl y al l ov er ±5 ppm m ax . of fr equenc y s tabi l i ty.
3
( * ) I nt er nal c r ys tal os c i l l ati on to be hal ted ( Pi n#1 = V IL )

4.0±0.1
Package
SXO-7050
1.75±0.1
∅
Item L 1.5 + 2.0±0.1
0
-0 .1
Lid Metal
Base Ceramic
D
C
A
Sealing Seam
MCF
TEST CIRCUIT Terminal Tungsten (metalized) M B F

J

Terminal plating
128
Quartz Crystal
Temperature Units
Compensated Crystal Oscillators TCXO or VC-TCXO TRI-STATE ± 0.5 to ± 2.0 ppm 13 to 52 MHz 5.0x3.2 mm +1.8 to +3.3 V CLIPPED SINE
SXO-4053CS SERIES (+1.8V to +3.3V FIXED MODELS) 5.0x3.2 mm STANDARD SMD TCXO
SXO-4053CS STANDARD SPECIFICATIONS ● CLIPPED SINE WAVEFORM

Item Specifications
General part number SXO-4053CS*1 SXO-4053CSV*1 SXO-4053CSED*1
XTAL
C ±2゜
Initial frequnecy tolerance at +25゜ C ±1.5 ppm max.*2*3
TCXO or VC-TCXO TCXO VC-TCXO TCXO
DD/kjj : ±2 ppm max. : over -30゜ C to +75゜ C)*3
CC/kll : ±1.5 ppm max. : over -30゜ C to +85゜ C)*3
Temperature range
BB/kll : ± 1 ppm max. : over -30゜ C to +85゜ C)*3
Actual size Frequency AA/kll : ±0.5 ppm max. : over -30゜ C to +85゜ C (referred to +25゜C)*3
Stability ± 0.2 ppm max. at VDD ±5% DC
CLK OSC
0.043 gm (wt.) Input voltage change
Output load change ± 0.2 ppm max. at 10 kΩ ±10% with 10 pF ±10%
SXO-4053CS Aging ± 1 ppm max. per year at +25゜ C ±3゜C
5.0±0.2
-30゜C to +75゜ C (S1 = Standard 1)
#4 #3
Operating
-30゜C to +85゜ C (S2 = Standard 2)
temperature
-40゜ C to +85゜ C (W = Option, frequency dependent)
3.2±0.2
#1 #2 Conditions 0.9V ±0.8V (V = +1.8V)
Control voltage (Pin#1) n.a. 1/2 V ±1V (V = +2.5V to +3.3V)
DD DD
DD
n.a.
1.5±0.2

n.a. n.a.
1.2 2.6 1.2
CONNECTION voltage (Pin#1) VIL : 20% VDD max.
VCXO
#1 #2
Supply voltage -0.5V to +4V DC

PIN TCXO VC-TCXO TCXO
SXO-4053CS SXO-4053CSV SXO-4053CSED
1 NC or GND Vcontrol “ L”
Absolute
n.a. -0.6V to VDD +0.6V DC n.a.
OPEN or “H”
2 GND Vcontrol voltage (Pin#1)

3 OUTPUT OUTPUT Z OUTPUT Max. Ratings
0.8
#4 #3
4 VDD
Z : high impedance
-40゜
1.5 mA max. (13.000 MHz to 30.000 MHz)
SOLDERING PATTERN Input current 1.7 mA max. (30.000 MHz to 40.000 MHz)
1.3 2 mA max. (40.000 MHz to 52.000 MHz)
Stand-by current (Pin#1 = ViL) n.a. n.a. 10μA max.
Level 0.8 Vp-p min.
2.6
1.0
TCXO
3.9
(-40゜
C to +85゜
C)
Waveform Clipped sine wave (DC-cut)
OUTPUT WAVEFORM ±8 ppm to ±13 ppm
Voltage control n.a. n.a.
(VDD = +2.5V to +3.3V)
Frequency slope n.a. positive n.a.
Disable delay time n.a. n.a. 200 ns max.
TEST CIRCUIT
Enable delay time n.a. n.a. 10 ms max.
SXO-4053CS
OCXO
Reflow condition
-10゜ -15゜C/h -20゜C/i C/j
-25゜ C/k
-30゜ -35゜C/l C/m
-40゜
C / ff +60゜
C / gg +65゜C / hh +70゜
C / ii +75゜
C / jj +80゜C / kk +85゜
C / ll
SXO-4053CSV
( * 1 ) Fi nal par t num ber to be as s i gned w i th pac k age ty pe, T C XO or VC - T C XO, fr equenc y s tabi l i ty, i nput v ol tage,
MCF
oper at i ng t em per a tur e and fr equenc y.
e. g. S X O- 4053C SED -BB/k l l -K-S2 -26MH z
( * 3 ) A t V c on = 1/ 2 V DD D C for SXO -4053C SV.

4.0±0.1
Package
SXO-4053CS
1.75±0.1
∅
Item L 1.5 + 2.0±0.1
0
-0 .1
SXO-4053CSEV Cover Epoxy Resin

Base Glass Epoxy
D
C
A
Sealing Seam (Built-in crystal)

Terminal Copper (metalized) M B F
J

Terminal plating
129
Temperature Compensated Crystal Oscillators TCXO or VC-TCXO TRI-STATE ± 0.5 to ± 2.0 ppm 13 to 52 MHz 5.0x3.2 mm +1.8 to +3.3 V CMOS
SXO-4053CM SERIES (+1.8 V to +3.3 V FIXED MODELS) 5.0x3.2 mm STANDARD SMD TCXO
SXO-4053CM STANDARD SPECIFICATIONS ● CMOS OUTPUT

Item Specifications
General part number SXO-4053CM*1 SXO-4053CMV*1 SXO-4053CMED*1
XTAL

C ±2゜
Initial frequnecy tolerance at +25゜ C ± 1.5 ppm max.*2*3
TCXO or VC-TCXO TCXO VC-TCXO TCXO
DD/kjj : ±2 ppm max. : over -30゜ C to +75゜ C)*3
CC/kll : ±1.5 ppm max. : over -30゜ C to +85゜ C)*3
Temperature range
±
BB/kll : 1 ppm max. : over -30゜ C to +85゜ C)*3
Frequency AA/kll : ±0.5 ppm max. : over -30゜ C to +85゜ C)*3
Actual size Stability
Input voltage change ±0.2 ppm max. at VDD ±5% DC
CLK OSC
0.043 gm (wt.) Output load change ±0.2 ppm max. at 15 pF ±10%

SXO-4053CM -30゜ C to +75゜C (S1 = Standard 1)
5.0±0.2 Operating temperature -30゜ C to +85゜C (S2 = Standard 2)
#4 #3
-40゜ C to +85゜C (W = Option, frequency dependent)
Operating Supply voltage (VDD) D = +1.8V, F = +2.5V, H = +2.8V, J = +3.0V, K = +3.3V ±5% DC
3.2±0.2
Conditions 0.9V ±0.8V (VDD = +1.8V)

Control voltage (Pin#1) n.a. 1/2 VDD ±1V (VDD = +2.5V to +3.3V)
n.a.
#1 #2
Stand-by VIH : 80% VDD min.
n.a. n.a.
control voltage (Pin#1) VIL : 20% VDD max.
1.6±0.2
Supply voltage -0.5V to +4V DC

Absolute
VCXO
1.2 2.6 1.2

Vcontrol voltage (Vcon) n.a. -0.6V to VDD +0.6V DC n.a.
#1 #2 CONNECTION
Max. Ratings
PIN TCXO VC-TCXO TCXO
0.8
SXO-4053CM SXO-4053CMV SXO-4053CMED

1 NC or GND Vcontrol “ L”
4 mA max. (13.000 MHz to 30.000 MHz)
OPEN or “H”
1.6
2 GND
3 OUTPUT OUTPUT Z OUTPUT
Input current 5 mA max. (30.000 MHz to 40.000 MHz)
0.8
4 VDD
#4 #3 Z : high impedance 6 mA max. (40.000 MHz to 52.000 MHz)
Stand-by current n.a. n.a. 10 μA max.
1.3
Output
(-40゜
C to +85゜
C)
2.6
TCXO

1.0
3.9
±8 ppm to ±13 ppm
n.a. n.a.
OUTPUT WAVEFORM Voltage control
n.a. n.a.
(VDD = +2.5V to +3.3V)
Frequency slope n.a. Positive n.a.
Disable delay time n.a. n.a. 200 ns max.
Enable delay time n.a. n.a. 10 ms max..
OCXO
TEST CIRCUIT Short-term frequency stability ±1 ppb max. (Allan variance Tau = 0.1 sec.)
SXO-4053CM Reflow condition
-10゜ -15゜C/h -20゜C/i C/j
-25゜ C/k
-30゜ -35゜C/l C/m
-40゜
C / ff +60゜
C / gg +65゜C / hh +70゜
C / ii +75゜
C / jj +80゜C / kk +85゜
C / ll
( * 1 ) F inal par t num ber to be as s i gned w i th pac k age ty pe, T C XO or VC - T C XO, fr equenc y s tabi l i ty, i nput v ol ta ge,
oper at ing t em per atur e and fr equenc y.
e. g. S X O- 4053C MED -BB/k l l -K-S2 -26M H z
2
( * ) R ef er r ed t o nom i nal fr equenc y befor e r efl ow s ol der i ng.
MCF
( * 3 ) A t V c on = 1 /2 V DD D C for SXO -4053C MV.

SXO-4053CMV ( * 4 ) S elec t " l ow l i m i t" and "hi gh l i m i t" for new oper ati ng temper atur e c ombi nati on fr om the l i s ts .

4.0±0.1
Package
1.75±0.1
Item SXO-4053CM L
∅
1.5 + 2.0±0.1
0
-0 .1
Cover Epoxy Resin
Base Glass epoxy
D

C
A
Terminal Copper (metalized)

SXO-4053CMED Gold / Nickel M B F
Terminal plating
J
130
Quartz Crystal
Temperature Units
Compensated Crystal Oscillators TCXO or VC-TCXO ± 0.5 to ± 2.0 ppm 10 to 40 MHz 7.0x5.0 mm +1.8 to +3.3 V CLIPPED SINE
SXO-4075CS SERIES (+1.8V to +3.3V FIXED MODELS) 7.0x5.0 mm STANDARD SMD TCXO
SXO-4075CS STANDARD SPECIFICATIONS ● CLIPPED SINE WAVEFORM

Item Specifications
General part number SXO-4075CS*1 SXO-4075CSV*1
XTAL
Initial frequnecy tolerance ±1.5 ppm max.*2 ±1.5 ppm max.*2 *3
at +25゜ C ± 2゜
C
DD/kjj : ±2 ppm max. over -30゜ C to +75゜ C)*3
CC/kll : ±1.5 ppm max. over -30゜ C to +85゜ C)*3
Actual size
Temperature range BB/kll : ±1 ppm max. over -30゜ C to +85゜ C)*3
Frequency AA/kll : ±0.5 ppm max. over -30゜ C to +85゜ C)*3
CLK OSC
0.13 gm (wt.) Stability Input voltage change ±0.2 ppm max. at VDD ±5% DC
SXO-4075CS Output load change ±0.2 ppm max. at 10 kΩ ±10% with 10 pF ±10%
7.0±0.2 Aging ±1 ppm max. per year at +25゜ C ±3゜ C
#4 #3
-30゜ C to +75゜ C (S1 = Standard 1)
Operating
-30゜ C to +85゜ C (S2 = Standard 2)
temperature
5.0±0.2
Operating -40゜ C to +85゜ C (W = Option, frequency dependent)

Conditions Supply voltage (VDD) D = +1.8V, F = +2.5V, H = +2.8V, J = +3.0V, K = +3.3V DC ±5%
#1 #2
Control voltage (Pin#1) n.a. 0.9V ± 0.8V (VDD = +1.8V)
1/2 VDD ±1V (VDD = +2.5V to +3.3V)
1.7±0.2
VCXO
Absolute
1.66 3.68 1.66
#1 #2 Max. Ratings
CONNECTION Storage temperature -40゜ C to +85゜ C
PIN TCXO VC‟TCXO
1.5 mA max. (10.000 MHz to 30.000 MHz)
Input current
SXO‟4075CS SXO-4075CSV
2.6
1
2
NC or GND
GND
Vcontrol
1.7 mA max. (30.000 MHz to 40.000 MHz)
3 OUTPUT
Level 0.8 Vp-p min.
1.2
4 VDD
#4 5.20 #3
(-40゜
C to +85゜
C)
SOLDERING PATTERN Waveform Clipped sine wave (DC-cut)
±8 ppm to ±13 ppm
TCXO
Voltage control n.a.
1.8 Adjustment ±9 ppm to ±15 ppm
3.8
(VDD = +2.5V to +3.3V)

1.6
5.3
OUTPUT WAVEFORM Start-up time 10 ms max.
OCXO
Reflow condition
10.000, 13.000, 16.367667, 16.369, 16.800, 19.200, 20.000, 23.104
TEST CIRCUIT Standard frequencies (MHz)
24.5536, 25.000, 26.000, 38.400
SXO-4075CS Optional Operating Low limit / Symbol C/g
-10゜ -15゜C/h -20゜C/i C/j
-25゜ C/k
-30゜ -35゜C/l C/m
-40゜
C / ff +60゜
C / gg +65゜C / hh +70゜
C / ii +75゜
C / jj +80゜C / kk +85゜
C / ll
( * 1 ) Fi nal par t num ber t o be as s i gned w i th pac k age ty pe, T C XO or VC - T C XO, fr equenc y s tabi l i ty, i nput v ol tage,
oper at ing t em per at u r e and fr equenc y.
e. g. S X O- 4075C S V -C C /k l l-K-S2 -19.2MH z
MCF
( * 3 ) A t V c on = 1/ 2 V DD D C for SXO -4075C SV.

( * 4 ) S el ec t " low li m it " and "hi gh l i m i t" for new oper ati ng temper atur e c ombi nati on fr om the l i s ts .

4.0±0.1
SXO-4075CSV Package
SXO-4075CS
1.75±0.1
∅
Item L 1.5 + 2.0±0.1
0
0 .1
Cover Epoxy Resin
Base Glass Epoxy
D
C
A

J

Terminal plating
131
Temperature Compensated Crystal Oscillators TCXO or VC-TCXO ± 0.5 to ± 2.0 ppm 10 to 40 MHz 7.0x5.0 mm +1.8 to +3.3 V CMOS
SXO-4075CM SERIES (+1.8 V to +3.3 V FIXED MODELS) 7.0x5.0 mm STANDARD SMD TCXO
SXO-4075CM STANDARD SPECIFICATIONS ● CMOS OUTPUT

Item Specifications
General part number SXO-4075CM*1 SXO-4075CMV*1
XTAL

C ±2゜
Initial frequnecy tolerance at +25゜ C ±1.5 ppm max.*2 ±1.5 ppm max. (VCON = 1/2 VDD)*2 *3
DD/kjj : ±2 ppm max. over -30゜ C to +75゜ C)*3
CC/kll : ±1.5 ppm max. over -30゜
C to +85゜ C)*3
Temperature range BB/kll : ±1 ppm max. over -30゜ C to +85゜ C)*3
Actual size Frequency AA/kll : ±0.5 ppm max. over -30゜
C to +85゜ C)*3
Stability
CLK OSC

0.13 gm (wt.)
Output load change ±0.2 ppm max. at 10 kΩ ±10% with 10 pF ±10%
SXO-4075CM Aging ±1 ppm max. per year at +25゜C ±3゜ C
7.0±0.2
-30゜ C to +75゜ C (S1 = Standard 1)
#4 #3 Operating
-30゜ C to +85゜ C (S2 = Standard 2)
temperature
Operating -40゜ C to +85゜ C (W = Option, frequency dependent)
5.0±0.2
Conditions Supply voltage (VDD) D = +1.8V, F = +2.5V, H = +2.8V, J = +3.0V, K = +3.3V DC ±5%
0.9V ±0.8V (VDD = +1.8V)
Control voltage (Pin#1) n.a.
1/2 VDD ±1V (VDD = +2.5V to +3.3V)
#1 #2

1.7±0.2
VCXO

1.66 3.68 1.66 Max. Ratings
#1 #2 Storage temperature -40゜ C to +85゜ C
CONNECTION
4 mA max. (10.000 MHz to 30.000 MHz)
PIN TCXO VC-TCXO Input current
SXO-4075CM SXO-4075CMV 6 mA max. (30.000 MHz to 40.000 MHz)
2.6
1 NC or GND Vcontrol
2
3
GND
OUTPUT Symmetry 40% to 50% at 1/2 VDD level
1.2
4 VDD
#4 5.08 #3
Output "0" level VOL : 10% VDD max.
(-40゜
C to +85゜
C)
TCXO
±8 ppm to ±13 ppm

1.8
(VDD = +1.8V)
3.8
Frequency
Voltage control n.a.
1.6
5.3 (VDD = +2.5V to +3.3V)

Frequency Slope n.a. Positive
OUTPUT WAVEFORM Disable delay time n.a. 200 ns max.
Enable delay time n.a. 10 ms max.
OCXO
Reflow condition
TEST CIRCUIT 10.000, 13.000, 16.367667, 16.368, 16.369, 16.800, 19.200, 20.000,
SXO-4075CM 23.104, 24.5536, 25.000, 26.000, 38.400
-10゜ -15゜C/h -20゜C/i C/j
-25゜ C/k
-30゜ -35゜C/l C/m
-40゜
C / ff +60゜
C / gg +65゜C / hh +70゜
C / ii +75゜
C / jj +80゜C / kk +85゜
C / ll
( * 1 ) F inal par t number to be as s i gned w i th pac k age ty pe, T C XO or VC - T C XO, fr equenc y s tabi l i ty, i nput v ol tage,
oper at ing t emper atur e and fr equenc y.
MCF
e. g. S X O- 4075C M V -C C /k l l-K-S2 -19.2MH z

( * 3 ) A t V c on = 1 /2 V DD D C for SXO- 4075C MV.
( * 4 ) S elec t " l ow l i mi t" and "hi gh l i mi t" for new oper ati ng tem per atur e c om bi nati on fr om the l i s ts .
SXO-4075CMV PACKAGE DATA TAPE SPECIFICATIONS

4.0±0.1
Package
SXO-4075CM
1.75±0.1
∅
Item L 1.5 + 2.0±0.1
0
-0 .1
Cover Epoxy Resin
Base Glass Epoxy
D
C
A

J

Terminal plating
132
Quartz Crystal
Temperature Units
Compensated Crystal Oscillators TCXO or VC-TCXO ±0.1 or ±0.28 ppm 10 to 40 MHz 5.0x3.2 & 7.0x5.0 mm +2.7 to +5.5 V CMOS or CLIPPED SINE
SXO-9000 SERIES (+2.7V to +5.0V FIXED MODELS) 5.0x3.2 mm

7.0x5.0 mm
STANDARD SMD TCXO
SXO-9000C STANDARD SPECIFICATIONS ● FEMTOCELL APPLICATION

● CMOS or CLIPPED SINE WAVEFORM
● PACKAGE SIZE 5.0x3.2 mm or 7.0x5.0 mm
Item Specifications
XTAL
SXO-9000C-CS*1 SXO-9000C-CSV*1 SXO-9000C-CM*1 SXO-9000C-CMV*1
General part number SXO-9000D-CS SXO-9000D-CSV SXO-9000D-CM SXO-9000D-CMV
SXO-9000E-CS SXO-9000E-CSV SXO-9000E-CM SXO-9000E-CMV
C ±2゜
Initial frequnecy tolerance at +25゜ C ±1.5 ppm max. (after 2 times of reflow soldering)
Actual size Output waveform Clipped Sine OUTPUT CMOS OUTPUT
0.125 gm (wt.) TCXO or VC-TCXO TCXO VC-TCXO TCXO VC-TCXO
KK2 : ±0.1 ppm max. over -10゜ C to +70゜ C (referred to +25゜ C)*2
Temperature range
SXO-9000D QQ2 : ±0.28 ppm max. over -40゜ C to +85゜ C (referred to +25゜ C)*2
CLK OSC
Frequency
Stability
Output load change ±0.1 ppm max. at load ±10%
Aging (Stratum 3) ±4.6 ppm max. at +40゜C for 20 years including overall freq. stability
-10゜C to +70゜C (S1 = Standard 1)
Operating -40゜C to +85゜C (S2 = Standard 2)
Conditions Supply voltage (VDD) +2.7V to +5.5V DC ±5%
Control voltage (Vcon) n.a. +1.65V ± 1.65V n.a. +1.65V ± 1.65V
Actual size
0.125 gm (wt.) Absolute -0.6V to VDD +0.6V -0.6V to VDD +0.6V
Vcontrol voltage (Vcon) n.a. n.a.
Max. Ratings DC DC
SXO-9000E Storage temperature -40゜C to +85゜C
VCXO
Input current 3 mA max. 5 mA max.
Symmetry n.a. 45% to 55% at 1/2 VDD level
Rise and fall times n.a. 5 ns max. (10% to 90% VDD level)
Output
Level 0.8 Vp-p min. VOL = 10% VDD max. VOH = 90% VDD min.
(-40゜ C to +85゜)
Load 10 kΩ // 10 pF 15 pF max.
Waveform Clipped sine wave*3 CMOS
Actual size Frequency adjustment
n.a. ±5 ppm to ±20 ppm n.a. ±5 ppm to ±15 ppm
voltage control (1/2 VDD ±1/2 VDD )
0.07 gm (wt.) Holdover ±5 ppb / day, ±20 ppb / 168 hours (7 days)
TCXO
Frequency slope n.a. Positive n.a. Positive
SXO-9000C SXO-9000D Harmonic distortion -5 dBc max.
(4-pads) (10-pads) Start-up time 3.5 ms max.
7.0±0.2 7.0±0.2
#4 #3 #8 #7 #6 SSB phase noise (20.000 MHz) -140 dBc / Hz, Typical at 1 kHz offset
#9 #5 Vcon input impedance n.a. 100 kΩ min. n.a. 100 kΩ min.
5.0±0.2
5.0±0.2
Marking Marking
#10 #4 IR reflow resistance ±1 ppm max. (referred to frequency before reflow)

#1 #2 #1 #2 #3
Reflow condition
1.7 max.
1.7 max.
OCXO
1.4 3.68 1.4 1.0 0.6 Optional Operating Low limit / Symbol C/g
-10゜ -15゜C/h -20゜C/i C/j
-25゜ C/k
-30゜ -35゜C/l C/m
-40゜
#1 #2 #1 #2 #3
C / ff +60゜
C / gg +65゜C / hh +70゜
C / ii +75゜
C / jj +80゜C / kk +85゜
C / ll
0.9
#4
#10
( * 1 ) Fi nal par t num ber to be as s i gned w i th pac k age ty pe, T C XO or VC - T C XO, fr equenc y s tabi l i ty, i nput v ol tage and f requency.
0.8
Bottom View Bottom View e. g. S X O- 9000C M V -QQ2 -3.3V -26M H z

3.2
2.54
#9 #5
( * 2 ) V con = 1/ 2V DD D C f or SXO-9000C /D /E- C SV & C MV.
( * 3 ) D C - c ut f or S X O - 90 00C & SXO- 9000D . D C c oupl i ng for SXO- 9000E.
0.9
0.8
#4 5.08 #3 1.27 #8 #7 #6 ( * 4 ) S el ec t " low li m it " a nd "hi gh l i m i t" for new oper ati ng temper atur e c ombi nati on fr om the l i s ts .
5.08
PIN CONNECTION
SXO-9000E SXO-9000C
CONNECTION
4.0±0.1
(10-pads)
Package
1.75±0.1
PIN TCXO VC-TCXO SXO-9000 ∅

Item L 1.5 + 2.0±0.1
MCF
0
1 NC or GND Vcon -0 .1
5.0±0.2 2 GND GND Lid Metal
3 OUTPUT OUTPUT
#9 #8 #7 #6
4 +V DC +V DC Base Ceramic
D
SXO-9000D
Sealing Seam
C
A
CONNECTION
3.2±0.2
#10 Marking #5 PIN

1
TCXO
NC or GND
VC-TCXO
NC or GND Terminal Tungsten (metalized)
2 NC or GND NC or GND
Gold / Nickel M B F
Terminal plating
J
#1 #2 #3 #4 4 GND GND (surface) / (under)
5 OUTPUT OUTPUT SXO-9000C & SXO-9000D
1.7max
7 NC or GND NC or GND A B C D F J L M Reel Dia. Qty/Reel

8 E/D E/D
1000pcs
9 +V DC +V DC 8.2 5.8 16.0 7.5 8.0 1.6 0.3 2.16 254
(100pcs)
OUTPUT WAVEFORM
#1 #2 #3 #4 10 NC or GND Vcon
SXO-9000E
CONNECTION
SXO-9000E
#10 Bottom View #5
PIN
TCXO VC-TCXO Clipped Sine Output CMOS Output A B C D F J L M Reel Dia. Qty/Reel
2.2
1 NC or GND Vcon
NC or GND NC or GND
1000pcs
2 5.9 3.7 12.0 5.5 8.0 1.6 0.3 2.00 254
(100pcs)
3 E/D E/D
#8 4 GND GND
#9 1.2 #7 #6
4.15 6 OUTPUT OUTPUT
Option : Vc Filter Option : Vc Filter
7 (0.033 μF) (0.033 μF)
9 +V DC +V DC
133
Oven Controlled Crystal Oscillators OCXO ± 0.01 to ± 0.05 ppm 5 to 40 MHz 14.3x9.4 mm CMOS
SXO-8000K SERIES (+3.3V FIXED MODELS) 14.3x9.4 mm STANDARD SMD OCXO
SXO-8000K STANDARD SPECIFICATIONS ● CMOS OUTPUT

Item Specifications
XTAL
General part number SXO-8000K*1

±0.5 ppm max.
C ±2゜
Initial frequency tolerance at +25゜ C
(VDD = +3.3V, Vcon = +1.65V, CL = 15 pF & 1 hour after warm-up time)
AA2 / iii : ±10 ppb max. over -20゜ C to +70゜C (referred to +25゜
C)
BB2 / iii : ±20 ppb max. over -20゜ C to +70゜C (referred to +25゜
C)
CC2 / iii : ±30 ppb max. over -20゜ C to +70゜C (referred to +25゜
C)
Actual size Frequency
Temperature range EE2 / iii : ±50 ppb max. over -20゜ C to +70゜C (referred to +25゜
C)
Stability
BB2 / mll : ±20 ppb max. over -40゜
CLK OSC
C to +85゜C (referred to +25゜

C)
1.27 gm (wt.)
CC2 / mll : ±30 ppb max. over -40゜ C to +85゜C (referred to +25゜
C)
EE2 / mll : ±50 ppb max. over -40゜ C to +85゜C (referred to +25゜
C)
SXO-8000K
Input voltage change ±10 ppb max. at VDD = +3.3V ±5% DC
14.3±0.3
Output load change ±10 ppb max. at CL = 15 pF ±10%
±5 ppb max. per day
C ±2゜
Aging (after 30 days) at +25゜ C ±500 ppb max. per year
9.4±0.3
-20゜C to +70゜C (Standard)

Operating -40゜C to +85゜C (W = Option)
Conditions Supply voltage (VDD) +3.3V DC ±5%
Control voltage (Vcon) +1.65V DC ±1.65V
6.5±0.2
VCXO

Absolute
5.08 Control voltage -0.6V to VDD +0.6V DC
1.0
Max. Ratings
#1 #2 #3
Storage temperature -55゜C to +85゜ C
600 mA (during warm-up)
Input current (max.)
6.4±0.1
200 mA (steady state at +25゜C)

#6 #5 #4
Pin Connection Pin Connection Rise and fall times 4 ns max. (10% VDD to 90% VDD level)
1
2
Vcon
NC*
4
5
Output
NC*
3 GND 6 VDD (-40゜
C to +85゜
C)
(*) #2 & #5 : Pulled up internally and connected to #6 / +V DC.
TCXO
Connect #2, #5 & #6 to outer NC’s.

SOLDERING PATTERN Frequency Voltage control ±5 ppm min.
1.27 Adjustment (+0.2V to +2.8V)
Linearity 5% max.
SSB phase noise 10 Hz 100 Hz 1 kHz 10 kHz
(at 19.200 MHz & +25゜
C) -94 dBc / Hz, Typical -124 dBc / Hz, Typical -145 dBc / Hz, Typical -155 dBc / Hz, Typical
8.8
Warm-up time 5 minutes to ±20 ppb of final frequency at +25゜C

OCXO
Vcon input impedance 1 MΩ max.

3.0

Reflow condition +170゜
2.54 2.54
C ±10゜ C for 1 to 2 minutes (preheating)
10.000, 12.800, 13.000, 16.384, 19.200, 20.000, 25.000, 26.000, 30.720,
OUTPUT WAVEFORM Standard frequencies (MHz)
38.400, 38.880, 40.000
( * 1 ) Fi nal par t n um ber to be as s i gned w i th pac k age ty pe, fr equenc y s tabi l i ty and fr equenc y.
e. g. S X O- 8000K -C C 2/i i i- 13.000M H z

4.0±0.1
MCF
Package
1.75±0.1
Item SXO-8000K L
∅
1.5 + 2.0±0.1
0
-0 .1
Lid Metal
Base PCB
D
C
A
Sealing Reflow soldering (4 corners)

J
Gold / Nickel A B C D F J L M ReelDia. Qty/Reel

Terminal plating
(surface) / (under) 14.7 10 24.0 11.5 16 2.0 0.5 7.0 330 500pcs

( * ) C leani ng i s not r ec ommended.
136
Monolithic Crystal Filters SINGLE PACKAGE 7.0x5.0 mm 2-POLE Monolithic Crystal Filters SINGLE PACKAGE 7.0x5.0 mm 2-POLE
96SMF SERIES (2-POLE MCF IN SINGLE 7.0x5.0 mm PACKAGE) STANDARD SMD MCF 96SMF SERIES (2-POLE MCF IN SINGLE 7.0x5.0 mm PACKAGE) STANDARD
STANDARDSMD
SMDMCF
MCF
STANDARD SPECIFICATIONS ● 2-POLE FILTERS

● 21.4 MHz, 21.7 MHz & 45 MHz STANDARD SPECIFICATIONS ● 2- POLE FILTERS
● OTHER FREQUENCIES
● PACKAGE SIZE 7.0x5.0 mm ● PACKAGE SIZE 7.0x5.0 mm
Nominal Attenuation Ripple Terminating Operating Nominal Attenuation Ripple Terminating Operating
XTAL
XTAL
Frequency Oscillation Passband min. Stopband max. Guaranteed min. max. Loss max. Impedance Temperature No. of Frequency Oscillation Passband min. Stopband max. Guaranteed min. max. Loss max. Impedance Temperature No. of
Part Number fo Mode
Part Number fo Mode Pole
Pole
(MHz) (dB) (kHz) (dB) (kHz) (dB) (kHz) (dB) (dB) (Ω // pF) C)
(゜ (MHz) (dB) (kHz) (dB) (kHz) (dB) (kHz) (dB) (dB) (Ω // pF) C)
(゜
96SMF214A7.5A 21.4 FUND 3 ±3.75 18 ±25.0 70 -910 1.0 2.0 850 // 6.0 -30 to +80 2 ・
96SMF145A15 14.575 FUND 3.0 ±7.50 13 ±20.0 50 -910 0.5 2.0 2500 // 1.0 -30 to +80 2
96SMF214A7.5B 21.4 FUND 3 ±3.75 18 ±14.0 70 -910 1.0 2.0 870 // 6.0 -30 to +80 2 96SMF204A5 20.480 FUND 3.0 ±2.50 15 ±10.0 70 -910 1.0 2.0 850 // 8.0 -30 to +80 2
96SMF214A7.5C 21.4 FUND 3 ±3.75 15 ±12.5 60 -900 1.0 2.0 870 // 6.0 -30 to +80 2 96SMF212A15 21.250 FUND 3.0 ±7.5 19 ±25.0 70 -910 1.0 2.0 1500 // 2.5 -30 to +80 2 ・
96SMF214A12 21.4 FUND 3 ±6.0 15 ±20.0 70 -910 0.5 1.5 1200 // 2.0 -30 to +80 2 96SMF213A15 21.300 FUND 3.0 ±7.50 18 ±25.0 45 -150 1.0 2.0 1500 // 2.5 -30 to +80 2 ・
96SMF214A15A 21.4 FUND 3 ±7.5 18 ±25.0 70 -910 1.0 2.0 1500 // 1.5 -30 to +80 2 ・
96SMF2132A15 21.325 FUND 3.0 ±7.50 18 ±25.0 45 -150 1.0 2.0 1500 // 2.5 -30 to +80 2 ・
96SMF214A15B 21.4 FUND 3 ±7.5 18 ±25.0 70 1.0 2.0 1500 // 2.0 -30 to +80 2 96SMF218A7.5 21.800 FUND 3.0 ± 3.75 15 ±12.5 70 -910 1.0 2.0 850 // 6.0 -30 to +80 2
CLK OSC
CLK OSC
-910
96SMF214A15C 21.4 FUND 3 ±7.5 18 ±25.0 70 -910 0.5 1.5 1500 // 2.5 -30 to +80 2 ・
96SMF241A20 24.100 FUND 3.0 ±10.00 10 ±25.0 70 -910 1.0 2.0 1350 // 1.5 -30 to +80 2 ・
96SMF214A20 21.4 FUND 3 ±10.0 15 ±30.0 70 -910 1.0 2.0 1800 // 1.0 -30 to +80 2 96SMF245A20 24.555 FUND 3.0 ±10.00 10 ±25.0 70 -910 1.0 2.0 1350 // 1.5 -30 to +80 2 ・
96SMF214A30A 21.4 FUND 3 ±15.0 15 ±45.0 70 -910 1.0 2.0 2000 // 0.5 -30 to +80 2 ・
96SMF246A47 24.600 FUND 3.0 ±23.50 - - 40 -910 1.0 1.5 5000 // 0.0 -30 to +80 2
96SMF214A30B 21.4 FUND 3 ±15.0 15 ±45.0 60 -910 1.0 2.0 2000 // 0.5 -30 to +80 2 ・
96SMF256A20 25.655 FUND 3.0 ±10.00 10 ±25.0 70 -910 1.0 2.0 1350 // 1.5 -30 to +80 2 ・
96SMF217A7.5A 21.7 FUND 3 ±3.75 20 ±18.0 70 -910 1.0 2.0 850 // 6.0 -30 to +80 2 96SMF260A20 26.000 FUND 1.5 ±10.00 10 ±25.0 75 -910 1.0 2.0 1300 // 1.5 -30 to +80 2
96SMF217A7.5B 21.7 FUND 3 ±3.75 18 ±14.0 70 -910 1.0 2.0 870 // 6.0 -30 to +80 2 96SMF264A15 26.450 FUND 3.0 ±7.50 15 ±25.0 70 -910 1.0 2.0 1500 // 3.0 -30 to +80 2
96SMF217A7.5C 21.7 FUND 3 ±3.75 15 ±12.5 70 -910 1.0 2.0 850 // 3.5 -30 to +80 2 96SMF270A24 27.000 FUND 3.0 ±12.00 10 ±25.0 70 -910 1.0 3.0 1000 // 1.6 -30 to +80 2
96SMF217A7.5D 21.7 FUND 3 ±3.75 18 ±12.5 50 -910 1.0 2.0 1500 // 6.0 -30 to +80 2 ・
96SMF292A20 29.250 FUND 3.0 ±10.00 10 ±25.0 70 -910 1.0 1.5 1800 // 1.5 -30 to +80 2
96SMF217A7.9 21.7 FUND 3 ±3.95 18 ±12.5 70 -910 1.0 2.0 850 // 8.0 -30 to +80 2 96SMF300A40 30.000 FUND 1.0 ±20.00 15 ±125.0 30 -910 1.0 3.0 3800 // -0.4 -30 to +80 2
VCXO
VCXO
・
96SMF217A15A 21.7 FUND 3 ±7.5 18 ±25.0 70 -910 1.0 2.0 1500 // 2.5 -30 to +80 2 ・
96SMF451A15 45.100 FUND 3.0 ±7.50 15 ±25.0 65 -910 1.0 2.0 560 // 6.0 -30 to +80 2 ・
96SMF217A15B 21.7 FUND 3 ±7.5 18 ±25.0 70 -910 0.5 2.0 1500 // 1.5 -30 to +80 2 96SMF4515A15 45.150 FUND 3.0 ±7.50 13 ±25.0 70 -910 1.0 3.0 1000 // 4.0 -30 to +80 2
96SMF217A15C 21.7 FUND 3 ±7.5 15 ±25.0 70 -910 1.0 2.0 1500 // 2.0 -30 to +80 2 96SMF499A20 49.950 FUND 3.0 ±10.00 13 ±45.0 70 -910 1.0 3.0 800 // 2.0 -30 to +80 2
96SMF450A7.5A 45.0 FUND 3 ±3.75 10 ±12.5 70 -910 1.0 2.0 200 // 4.0 -30 to +80 2 96SMF499A25 49.950 FUND 3.0 ±12.50 13 ±50.0 70 -910 1.0 3.0 800 // 1.5 -30 to +80 2
96SMF450A7.5B 45.0 FUND 3 ±3.75 20 ±25.0 70 -910 1.5 2.0 650 // 3.5 -30 to +80 2 ・
96SMF500A5 50.000 FUND 3.0 ±2.50 15 ±10.0 40 -1000 1.0 5.0 200 // 0.9 -30 to +80 2
96SMF450A12 45.0 FUND 3 ±6.0 15 ±20.0 70 -910 1.0 2.0 650 // 5.0 -30 to +80 2 ・
96SMF768A8 76.800 3rd 3.0 ±4.00 15 ±13.0 50 -910 1.0 2.0 2000 // 0.4 -30 to +80 2
96SMF450A15A 45.0 FUND 3 ±7.5 15 ±25.0 70 -910 1.0 2.0 560 // 6.0 -30 to +80 2 ・
96SMF800A24 80.000 3rd 3.0 ±12.00 15 ±35.0 50 -910 1.0 2.0 2500 // -0.8 -30 to +80 2
96SMF450A15B 45.0 FUND 3 ±7.5 15 ±25.0 70 -910 1.0 2.0 650 // 3.0 -30 to +80 2 96SMF900A30A 90.000 3rd 3.0 ±15.00 16 ±50.0 30 -910 0.5 3.0 3000 // -0.5 -30 to +80 2
TCXO
TCXO
96SMF450A15C 45.0 FUND 3 ±7.5 15 ±25.0 70 -910 1.0 2.0 650 // 4.0 -30 to +80 2 96SMF921A6A 92.160 3rd 3.0 ±3.00 30 ±30.0 50 -910 1.0 3.0 2000 // 0.4 -30 to +80 2
96SMF450A15D 45.0 FUND 3 ±7.5 15 ±25.0 70 -910 1.0 2.0 650 // 3.5 -30 to +80 2 96SMF921A6B 92.160 3rd 3.0 ±3.00 30 ±30.0 50 -910 1.0 3.0 1000 // -0.2 -30 to +80 2
96SMF450A15E 45.0 3rd 3 ±7.5 15 ±25.0 60 -910 0.5 1.5 2700 // 1.7 -30 to +80 2 96SMF100A20 100.000 3rd 3.0 ±10.00 10 ±28.0 50 -910 1.0 3.0 1500 // -0.8 -30 to +80 2
96SMF450A20 45.0 FUND 3 ±10.0 15 ±35.0 70 -910 1.0 2.0 800 // 3.0 -30 to +80 2 96SMF1001A14 100.100 3rd 3.0 ±7.00 13 ±28.0 50 -910 1.0 3.0 1500 // -0.3 -30 to +80 2
96SMF450A30A 45.0 FUND 3 ±15.0 16 ±60.0 70 -910 1.0 2.0 1100 // 0.0 -30 to +80 2 96SMF105A14 105.000 3rd 3.0 ±7.00 13 ±28.0 50 -910 1.0 3.0 1500 // -1.0 -30 to +80 2
96SMF450A30B 45.0 FUND 3 ±15.0 15 ±60.0 65 -910 1.0 2.0 1200 // 1.8 -30 to +80 2 ・
96SMF109A15 109.650 3rd 3.0 ±7.50 18 ±25.0 50 -910 1.0 3.0 1500 // -0.6 -30 to +80 2
OCXO
OCXO
96SMF450A48 45.0 FUND 3 ±24.0 - - 40 -910 1.0 2.0 1000 // 0.7 -30 to +80 2 96SMF110A15 110.000 3rd 3.0 ±7.50 18 ±25.0 50 -910 1.0 3.0 1500 // -1.0 -30 to +80 2
96SMF122A7 122.880 3rd 6.0 ±3.75 30 ±40.0 50 -910 2.0 3.0 1000 // 1.6 -30 to +80 2
96SMF 96SMF PACKAGE DATA 96SMF150A7 150.000 3rd 3.0 ±3.50 15 ±15.0 50 -910 1.0 7.0 1000 // 1.8 -30 to +80 2
<Top View>
7.0±0.2
GND
PACKAGE DATA
GND Package
IN / OUT
#5
GND IN / OUT
#5
GND
Item 96SMF 96SMF 96SMF
#6 #4 #6 #4 Lid Metal 7.0±0.2
<Top View>
GND
5.0±0.2
GND Package
#1 #3 #1 #3 Base Ceramic
#5 #5
Item 96SMF
IN / OUT GND IN / OUT GND
GND OUT / IN
GND OUT / IN
Sealing Seam
#6 #4 #6 #4
Lid Metal
5.0±0.2
#2 #2
GND GND
Terminal Tungsten (metalized) Base Ceramic
#1 #3 #1 #3
1.35±0.15
GND OUT / IN
GND OUT / IN
MCF
MCF
Gold / Nickel #2 #2
1.2 1.0 1.2
Terminal plating
GND GND Sealing Seam
(surface) / (under)
1.35±0.15
RoHS Compliant (Pb-free) 1.2 1.0 1.2
1.0
Actual size Gold / Nickel

2.54
Terminal plating
1.2
(surface) / (under)
1.0
0.116 gm (wt.)
1.0
Actual size
2.54
1.2
1.0
SOLDERING PATTERN TAPE SPECIFICATIONS 0.116 gm (wt.)
1.4 4.0±0.1
1.75±0.1
2.2 ∅
L 1.5 +
-0 0.1
2.0±0.1 SOLDERING PATTERN TAPE SPECIFICATIONS
1.4
1.4 4.0±0.1
1.75±0.1
2.2
2.4
3.8
∅
D
L 1.5 + 2.0±0.1
C
-0 0.1
A
2.2
1.4
5.8
2.4
3.8
M B F
J
D
C
A
2.2
7.4 5.4 16.0 7.5 8.0 1.5 0.3 1.9 178 1000pcs 5.8 M B F
J
7.4 5.4 16.0 7.5 8.0 1.5 0.3 1.9 178 1000pcs
140 141
Monolithic Crystal Filters SINGLE PACKAGE 7.0x5.0 mm 4-POLE
96SMF SERIES (4-POLE MCF IN SINGLE 7.0x5.0 mm PACKAGE) STANDARD SMD MCF

Nominal Attenuation Ripple Loss Terminating Coupling Operating

XTAL
Frequency Oscillation Passband min. Stopband max. Guaranteed min. max. max. Impedance Capacitor Temperature No. of
(MHz) (dB) (kHz) (dB) (kHz) (dB) (kHz) (dB) (dB) (Ω // pF) Zc (pF) C)
(゜
96SMF214A7.5-4P 21.400 FUND 3 ±3.75 30 ±12.5 80 -910 1.0 4.0 1800 // 2.0 6.0 -30 to +80 4
96SMF214A12-4P 21.400 FUND 3 ±6.00 30 ±22.0 80 -910 1.0 4.0 1800 // 2.0 5.5 -30 to +80 4
96SMF217A7.5-4P 21.700 FUND 3 ±3.75 31 ±12.5 75 -910 1.0 4.0 1800 // 2.0 6.0 -30 to +80 4
96SMF217A15-4P 21.700 FUND 3 ±7.50 30 ±25.0 70 -910 1.0 4.0 1750 // 0.35 5.0 -30 to +80 4 ・
96SMF388A7.5-4P 38.850 FUND 3 ±3.75 40 ±18.0 80 -910 1.0 4.0 480 // 5.5 15.0 -30 to +80 4
96SMF388A10-4P 38.850 FUND 3 ±5.00 40 ±20.0 80 -910 1.0 4.0 610 // 3.0 14.0 -30 to +80 4
CLK OSC
96SMF388A12-4P 38.850 FUND 3 ±6.00 35 ±25.0 70 -910 1.0 4.0 610 // 3.0 13.0 -30 to +80 4 ・
96SMF448A15-4P 44.850 FUND 3 ±7.50 35 ±25.0 70 -910 1.0 4.0 650 // 3.0 8.0 -30 to +80 4
96SMF449A16 - 4P 44.9725 FUND 3 ±8.00 20 ±30.0 80 -910 1.0 4.0 800 // 1.7 8.0 -30 to +80 4 ・
96SMF450A7.5-4P 45.000 FUND 3 ±3.75 30 ±12.5 80 -910 1.0 4.0 350 // 6.5 18.0 -30 to +80 4 ・
96SMF450A10-4P 45.000 FUND 3 ±5.00 40 ±20.0 80 -910 1.0 4.0 610 // 3.0 14.0 -30 to +80 4 ・
96SMF450A15A-4P 45.000 FUND 3 ±7.50 30 ±25.0 80 -910 1.0 4.0 650 // 3.0 9.0 -30 to +80 4 ・
96SMF450A15B-4P 45.000 FUND 3 ±7.50 35 ±26.0 80 -910 1.0 3.0 800 // 1.7 8.0 -30 to +80 4
96SMF450A15C-4P 45.000 FUND 3 ±7.50 30 ±25.0 80 -910 1.0 3.0 650 // 2.5 8.0 -30 to +80 4
96SMF450A15D-4P 45.000 FUND 3 ±7.50 30 ±25.0 70 -910 1.0 4.0 600 // 3.0 9.5 -30 to +80 4
VCXO
96SMF450A15E-4P 45.000 FUND 3 ±7.50 25 ±22.0 80 -910 1.0 4.0 800 // 2.0 8.0 -30 to +80 4 ・
96SMF450A15F-4P 45.000 FUND 3 ±7.50 30 ±25.0 80 -910 1.0 3.0 650 // 3.0 9.0 -30 to +80 4 ・
96SMF450A30A-4P 45.000 FUND 3 ±15.00 30 ±45.0 70 -910 1.0 3.0 1000 // 1.0 5.0 -30 to +80 4 ・
96SMF450A30B-4P 45.000 FUND 3 ±15.00 30 ±50.0 80 -910 1.0 3.0 800 // 1.7 6.0 -30 to +80 4
96SMF450A30C-4P 45.000 FUND 3 ±15.00 30 ±45.0 70 -910 1.0 3.0 1000 // 1.0 15 -30 to +80 4 ・
96SMF451A12-4P 45.100 FUND 3 ±6.00 25 ±22.0 80 -910 1.0 4.0 500 // 4.5 11.5 -30 to +80 4
96SMF451A15-4P 45.100 FUND 3 ±7.50 30 ±25.0 80 -910 1.0 4.0 800 // 2.0 8.0 -30 to +80 4 ・
96SMF453A7.5-4P 45.300 FUND 3 ±3.75 30 ±12.5 80 -910 1.0 5.0 350 // 6.5 18.0 -30 to +80 4
TCXO
96SMF453A12-4P 45.300 FUND 3 ±6.00 30 ±20.0 80 -910 1.0 4.0 650 // 3.0 9.0 -30 to +80 4
96SMF453A15-4P 45.300 FUND 3 ±7.50 30 ±25.0 80 -910 1.0 4.0 650 // 2.5 8.5 -30 to +80 4
96SMF463A12-4P 46.350 FUND 3 ±6.00 30 ±20.0 75 -900 1.0 3.0 490 // 4.0 13.0 -30 to +80 4
96SMF472A10-4P 47.250 FUND 3 ±5.00 40 ±18.0 80 -910 1.0 3.5 430 // 6.5 14.5 -30 to +80 4 ・
96SMF474A7.5-4P 47.400 FUND 3 ±3.75 20 ±12.5 80 -910 1.5 6.0 350 // 6.5 17.0 -30 to +80 4
96SMF484A15-4P 48.425 FUND 3 ±7.50 20 ±25.0 80 -910 1.0 5.0 470 // 4.5 12.0 -30 to +80 4
96SMF494A7.5-4P 49.455 FUND 3 ±3.75 30 ±15.0 80 -910 1.0 4.0 300 // 7.5 20.0 -30 to +80 4
96SMF499A10-4P 49.950 FUND 3 ±5.00 40 ±20.0 80 -910 1.0 4.0 350 // 6.0 15.5 -30 to +80 4
OCXO
96SMF700A20-4P 70.000 3rd 3 ±10.00 35 ±40.0 70 -910 1.0 4.0 3000 // -0.6 -0.8 -30 to +80 4
96SMF742A10-4P 74.250 FUND 3 ±5.00 40 ±18.0 80 -910 1.0 3.5 430 // 6.5 14.5 -30 to +80 4 ・
96SMF900A7.5-4P 90.000 3rd 3 ±3.75 30 ±12.5 80 -910 1.0 4.0 1200 // 0.0 0.7 -30 to +80 4
96SMF 96SMF
<Top View>
PACKAGE DATA
7.0±0.2
ZC ZC
#5 Package
IN / OUT
#5
GND IN / OUT GND Item 96SMF
#6 #4 #6 #4
Lid Metal
5.0±0.2
#1
GND
#3
OUT / IN
#1
GND
#3
OUT
Base Ceramic
MCF
Sealing Seam
#2 #2
ZC ZC

1.35±0.15
Gold / Nickel
1.2 1.0 1.2
Terminal plating
#2 (surface) / (under)
GND IN/OUT
Actual size #1
#3 RoHS Compliant (Pb-free)
1.0
2.54
0.154 gm (wt.) #4
1.0
#6
IN/OUT GND
#5
1.2
SOLDERING PATTERN TAPE SPECIFICATIONS

1.4 4.0±0.1
1.75±0.1
2.2 ∅
L 1.5 + 2.0±0.1
-0 0.1
1.4
2.54
3.8
D
C
A
2.2
5.8
M B F
J

142 7.4 5.4 16.0 7.5 8.0 1.5 0.3 1.9 178 1000pcs
Monolithic Crystal Filters SINGLE PACKAGE 3.8x3.8 mm 2-POLE
38SMF SERIES (2-POLE MCF IN SINGLE 3.8x3.8 mm PACKAGE) STANDARD

STANDARDSMD
SMDMCF
MCF

Nominal Attenuation Ripple Terminating Operating
XTAL
Frequency Oscillation Passband min. Stopband max. Guaranteed min. max. Loss max. Impedance Temperature No. of
(MHz) (dB) (kHz) (dB) (kHz) (dB) (kHz) (dB) (dB) (Ω // pF) C)
(゜
38SMF450A15 45.000 FUND 3 ±7.5 13 ±25.0 60 -910 1.0 3.0 560 // 4.5 -30 to +80 2
38SMF450A30 45.000 FUND 3 ±15 15 ±60.0 60 -900 1.0 2.5 1100 // 1.0 -30 to +80 2
38SMF463A15 46.350 FUND 3 ±7.5 15 ±25.0 70 -910 1.0 2.0 470 // 6.0 -30 to +80 2
38SMF 38SMF PACKAGE DATA

3.8±0.1
CLK OSC
<Top View>
#8 Package
#8
Item 38SMF
#1 #7 #1 #7
Lid Metal
3.8±0.1
#2 #6 #2 #6
#3 #5 #3 #5 Base Ceramic
Sealing Seam
#4 #4
1.0±0.2

Gold / Nickel
1.0 0.6 1.0 PIN CONNECTION Terminal plating
#4
1
2
INPUT
GND
(surface) / (under)
#3 3
Actual size #5
4
GND
GND
5 OUTPUT
2.54
#2 #6
0.6
0.042 gm (wt.) 6 GND
VCXO
0.9
7 GND
#7
#1 8 GND
#8
0.6 0.6
SOLDERING PATTERN TAPE SPECIFICATIONS

0.8 4.0±0.1
1.2 1.2
1.75±0.1
∅
L 1.5 + 2.0±0.1
0
-0 .1
0.8
1.27
0.8
1.27
C
A
0.8
TCXO
2.8
M B F
J

4.25 4.25 12.0 5.5 8.0 1.5 0.3 1.35 180 1000pcs
OCXO
MCF
143

SMI Catalogue 2015

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SMI Catalogue 2015

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List of products

QUARTZ CRYSTAL UNITS

XTAL 11SMX Page XTAL 21SMX Page XTAL 22SMX Page

1.6 2.0 2.5

Ope. Temperature (O.T.) C ～ +70゜

XTAL 32SMX(A) Page XTAL 32SMX(B) Page XTAL 53SMX(B) Page

2.5 2.5 3.2

3.2 3.2 5.0

XTAL 53SMX(C) Page XTAL 53SMX(D) Page XTAL 97SMX(A) Page

Freq. Stability / O.T. ±50 ppm ±50 ppm ±50 ppm

XTAL 97SMX(B) Page XTAL 97SMX(C) Page XTAL 94SMX(B) Page

3.5 3.5 5.0

6.0 6.0 7.0 / 7.5

XTAL 94SMX(C) Page XTAL 94SMX(D) Page XTAL 93SMX Page

5.0 5.0 4.5

Freq. Tolerance (+25゜

Freq. Stability / O.T. ±50 ppm ±50 ppm ±50 ppm

Load Capacitane (CL) 16 pF, Typical 16 pF, Typical 16 pF, Typical

XTAL 92SMX(CN) Page XTAL 92SMX(D) Page XTAL 86SMX(LPN) Page

5.5 5.0 4.3

11.8 11.0 12.4

Freq. Tolerance (+25゜

Freq. Stability / O.T. ±50 ppm ±50 ppm ±50 ppm

Load Capacitane (CL) 16 pF, Typical 16 pF, Typical 16 pF, Typical

Ope. Temperature (O.T.) C ～ +70゜

4.7 4.7 4.3

Load Capacitane (CL) 16 pF, Typical 16 pF, Typical 18 pF, Typical

XTAL 3HLB Page XTAL 25HLB Page XTAL HC-49/U-2H Page

12.4 12.4 11.35

4.7 4.7 10.5

Freq. Tolerance (+25゜

Load Capacitane (CL) 18 pF, Typical 18 pF, Typical 16 pF, Typical

Freq. Tolerance (+25゜

Load Capacitane (CL) 16 pF, Typical 16 pF, Typical 16 pF, Typical

Ope. Temperature (O.T.) C ～ +70゜

UM-5(MJ) UM-4(MJ) UM-1

1.000 MHz ～ 1.200 MHz

Freq. Tolerance (+25゜

Load Capacitane (CL) 16 pF, Typical 16 pF, Typical 16 pF, Typical

UM-5 UM-4 HC-49/U(MJ)

Freq. Tolerance (+25゜

Load Capacitane (CL) 16 pF, Typical 16 pF, Typical 20 pF, Typical

Frequency 1.84320 MHz ～ 200.000 MHz

Freq. Tolerance (+25゜

Freq. Stability / O.T. ±10 ppm ～ ±50 ppm

Load Capacitane (CL) 20 pF, Typical

XTAL 110SMX Page XTAL 212SMX Page XTAL 31SMX Page

1.0 1.2 1.5

Frequency 32.768 kHz 32.768 kHz 32.768 kHz

XTAL 415SMX Page XTAL 52SMX Page XTAL 124SMX Page

1.5 1.8 1.5

4.1 4.9 7.0

Ope. Temperature (O.T.) C ～ +85゜

Frequency 32.768 kHz 32.768 kHz 30.000 kHz ～ 100.000 kHz

Ope. Temperature (O.T.) C ～ +85゜

XTAL 26(LF)MJ Page XTAL 26(LF) Page XTAL 1.2x4.7 mm Page

8.3 9.0 4.7

Frequency 32.768 kHz 32.768 kHz 32.768 kHz

Ope. Temperature (O.T.) C ～ +85゜

XTAL 1.4x5 mm Page XTAL 2x6 mm Page XTAL 3x8 mm Page

5.0 6.0 8.0

Frequency 32.768 kHz 32.768 kHz 32.768 kHz

Ope. Temperature (O.T.) C ～ +60゜