Professional Documents
Culture Documents
Dr. SC Bose
scbose@iitj.ac.in
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Human Brain has 1011 neurons, each with ~103
synapses switching ~103 times per second.
New Architectures
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Aspects of Hardware Description
Bottom-up Approach
Desired complex behaviour of a hardware
(of reasonable complexity) is achieved by Given Parts/components
suitable selection and interconnection of
parts/components with known behaviours
available in standard cell library of TTL
gates.
Carry = a b + b c + c a = b (c + a) + a b
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VLSI design involves translating the
given specification into geometrical
patterns that are used for fabricating
chips.
It is accomplished through a
succession of translation steps of
manageable complexity.
One to many mapping.
Transistor layout
Cell layout
Block Layouts
Physical Domain 9
DE/DS Behavioural Level DV Simulation
DE—Design Entry
No DS—Design Synthesis
OK ?
Design output
DV—Design Verification
yes
DE/DS RT Level DV Simulation
OK ?
No
yes Design output
Synthesis is defined as
DE/DS Logic/Gate Level DV Simulation
translation from behavioural
description to structural
No
description. Also known as
OK ?
yes
Design output Design Refinement.
DE/DS Tran/Circuit Level DV Simulation
No Verification
OK ? Bugs or Mistakes are
Design output
yes preferred to be found at the
DE/DS Layout/Physical Level DV Simulation early stages, otherwise cost
No and time to market will
increase.
ok
yes Design output
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The majority of design cycle time is devoted for achieving desired level
of performance (speed, power consumption, precision etc) at an
acceptable cost(economical cost, design time and verification time,
capturing the market window etc).
Every two years, the technology node changes. The application(s) should
garner the maximum benefit (RoI—Return on Investment).
The design cycle time of next generation overlaps with the production time of
current technology.
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Boolean Algebra led to the concept of digital logic.
There are eight major families of logic :
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How is VLSI ? Specification
Number of ground plane, power plane, bonding pads and the distance
between the pads affect the behaviour of the chip
The distance (wire length) between the pad and the package pin determines
the inductive voltage drop.
Thermal aspect
Quad Flat Packs (QFP): SMT type, Pin count is very high (around
512)
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• Increasingly, the most interesting work is being
done at the interfaces between chemistry,
biology, physics, engineering, geology, and other
disciplines. That has the effect of blurring the
boundaries between traditional disciplines.
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