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FEATURES DESCRIPTION
• High-speed access times: 8, 10, 20 ns The ISSI IS61WV10248ALL/BLL and
• High-performance, low-power CMOS process IS64WV10248BLL are very high-speed, low
• Multiple center power and ground pins for greater power, 1M-word by 8-bit CMOS static RAM. The
noise immunity IS61WV10248ALL/BLL and IS64WV10248BLL are fab-
ricated using ISSI's high-performance CMOS technol-
• Easy memory expansion with CE and OE options
ogy. This highly reliable process coupled with innovative
• CE power-down circuit design techniques, yields higher performance
• Fully static operation: no clock or refresh and low power consumption devices.
required When CE is HIGH (deselected), the device assumes
• TTL compatible inputs and outputs a standby mode at which the power dissipation can be
• Single power supply reduced down with CMOS input levels.
– Vdd 1.65V to 2.2V (IS61WV10248ALL) The IS61WV10248ALL/BLL and IS64WV10248BLL
speed = 20ns for Vcc = 1.65V to 2.2V operate from a single power supply and all inputs are
TTL-compatible.
– Vdd 2.4V to 3.6V (IS61/64WV10248BLL)
speed = 10ns for Vcc = 2.4V to 3.6V The IS61WV10248ALL/BLL and IS64WV10248BLL are
available in 48 ball mini BGA and 44-pin TSOP (Type
speed = 8ns for Vcc = 3.3V + 5%
II) packages.
• Packages available:
– 48-ball miniBGA (9mm x 11mm)
– 44-pin TSOP (Type II)
• Industrial and Automotive Temperature Support
• Lead-free available
FUNCTIONAL BLOCK DIAGRAM
1M X 8
A0-A19 DECODER MEMORY ARRAY
VDD
GND
I/O
I/O0-I/O7 DATA COLUMN I/O
CIRCUIT
CE
CONTROL
OE CIRCUIT
WE
Copyright © 2019 Integrated Silicon Solution, Inc. All rights reserved. ISSI reserves the right to make changes to this specification and its products at any time without
notice. ISSI assumes no liability arising out of the application or use of any information, products or services described herein. Customers are advised to obtain the latest
version of this device specification before relying on any published information and before placing orders for products.
Integrated Silicon Solution, Inc. does not recommend the use of any of its products in life support applications where the failure or malfunction of the product can reason-
ably be expected to cause failure of the life support system or to significantly affect its safety or effectiveness. Products are not authorized for use in such applications
unless Integrated Silicon Solution, Inc. receives written assurance to its satisfaction, that:
a.) the risk of injury or damage has been minimized;
b.) the user assume all such risks; and
c.) potential liability of Integrated Silicon Solution, Inc is adequately protected under the circumstances
PIN CONFIGURATION
1 2 3 4 5 6
NC 1 44 NC
NC 2 43 NC
A0 3 42 NC
A1 4 41 A18
A2 5 40 A17
A NC OE A0 A1 A2 NC A3 6 39 A16
A4 7 38 A15
B NC NC A3 A4 CE I/O0 CE 8 37 OE
I/O0 9 36 I/O7
C NC NC A5 A6 I/O1 I/O2
I/O1 10 35 I/O6
D GND NC A17 A7 I/O3 VDD VDD 11 34 GND
GND 12 33 VDD
E VDD NC NC A16 I/O4 GND I/O2 13 32 I/O5
F NC NC A14 A15 I/O5 I/O6 I/O3 14 31 I/O4
WE 15 30 A14
G NC NC A12 A13 WE I/O7 A5 16 29 A13
A6 17 28 A12
H A18 A8 A9 A10 A11 A19
A7 18 27 A11
A8 19 26 A10
A9 20 25 A19
NC 21 24 NC
NC 22 23 NC
PIN DESCRIPTIONS
A0-A19 Address Inputs
CE Chip Enable Input
OE Output Enable Input
WE Write Enable Input
I/O0-I/O7 Data Input / Output
Vdd Power
GND Ground
NC No Connection
TRUTH TABLE
Mode WE CE OE I/O Operation Vdd Current
Not Selected X H X High-Z Isb1, Isb2
(Power-down)
Output Disabled H L H High-Z Icc
Read H L L Dout Icc
Write L L X Din Icc
CAPACITANCE(1,2)
Symbol Parameter Conditions Max. Unit
Cin Input Capacitance Vin = 0V 6 pF
CI/O Input/Output Capacitance Vout = 0V 8 pF
Notes:
1. Tested initially and after any design or process changes that may affect these parameters.
2. Test conditions: Ta = 25°C, f = 1 MHz, Vdd = 3.3V.
AC TEST LOADS
319 Ω
ZO = 50Ω 3.3V
50Ω
OUTPUT 1.5V
OUTPUT
30 pF
Including 353 Ω
jig and 5 pF
Including
scope jig and
scope
Figure 1. Figure 2.
AC WAVEFORMS
READ CYCLE NO. 1(1,2) (Address Controlled) (CE = OE = Vil)
t RC
ADDRESS
t AA
t OHA
t OHA
DOUT PREVIOUS DATA VALID DATA VALID
READ1.eps
t RC
ADDRESS
t AA t OHA
OE
t DOE t HZOE
CE t LZOE
t ACE
t LZCE t HZCE
HIGH-Z
DOUT DATA VALID
CE_RD2.eps
Notes:
1. WE is HIGH for a Read Cycle.
2. The device is continuously selected. OE, CE = Vil.
3. Address is valid prior to or coincident with CE LOW transitions.
AC WAVEFORMS
WRITE CYCLE NO. 1(1,2) (CE Controlled, OE = HIGH or LOW)
t WC
VALID ADDRESS
ADDRESS
t SA t SCE t HA
CE
t AW
t PWE1
WE t PWE2
t HZWE t LZWE
HIGH-Z
DOUT DATA UNDEFINED
t SD t HD
DIN DATAIN VALID
CE_WR1.eps
AC WAVEFORMS
WRITE CYCLE NO. 2(1,2) (WE Controlled: OE is HIGH During Write Cycle)
t WC
ADDRESS VALID ADDRESS
t HA
OE
CE LOW
t AW
t PWE1
WE
t SA t HZWE t LZWE
HIGH-Z
DOUT DATA UNDEFINED
t SD t HD
DIN DATAIN VALID
CE_WR2.eps
Notes:
1. The internal write time is defined by the overlap of CE LOW and WE LOW. All signals must be in valid states to initiate a Write,
but any one can go inactive to terminate the Write. The Data Input Setup and Hold timing are referenced to the rising or falling
edge of the signal that terminates the Write.
2. I/O will assume the High-Z state if OE > Vih.
AC WAVEFORMS
WRITE CYCLE NO. 3 (WE Controlled: OE is LOW During Write Cycle)
t WC
ADDRESS VALID ADDRESS
t HA
OE LOW
CE LOW
t AW
t PWE2
WE
t SA t HZWE t LZWE
HIGH-Z
DOUT DATA UNDEFINED
t SD t HD
DIN DATAIN VALID
CE_WR3.eps
VDD
1.65V
1.4V
VDR
CE ≥ VDD - 0.2V
CE
GND
ORDERING INFORMATION
08/21/2008
2. Reference document : JEDEC MO-207
1. CONTROLLING DIMENSION : MM .
NOTE :
1. CONTROLLING DIMENSION : MM
2. DIMENSION D AND E1 DO NOT INCLUDE MOLD PROTRUSION.
3. DIMENSION b DOES NOT INCLUDE DAMBAR PROTRUSION/INTRUSION.
06/04/2008
Package Outline
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