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TO-252
D-PAK Bottom View D
Top View
D
S G S
G S
Absolute Maximum Ratings T A=25°C unless otherwise noted
Parameter Symbol Maximum Units
Drain-Source Voltage VDS -30 V
Gate-Source Voltage VGS ±25 V
Continuous Drain TC=25°C -40
Current F TC=100°C ID -30 A
C
Pulsed Drain Current IDM -70
Continuous Drain TA=25°C -9
IDSM A
Current TA=70°C -7
TC=25°C 50
PD W
Power Dissipation B TC=100°C 25
TA=25°C 2.3
PDSM W
Power Dissipation A TA=70°C 1.5
Junction and Storage Temperature Range TJ, TSTG -55 to 175 °C
Thermal Characteristics
Parameter Symbol Typ Max Units
Maximum Junction-to-Ambient A t ≤ 10s 18 22 °C/W
RθJA
Maximum Junction-to-Ambient A Steady-State 44 55 °C/W
Maximum Junction-to-Case B Steady-State RθJC 2.4 3 °C/W
THIS PRODUCT HAS BEEN DESIGNED AND QUALIFIED FOR THE CONSUMER MARKET. APPLICATIONS OR USES AS CRITICAL
COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS ARE NOT AUTHORIZED. AOS DOES NOT ASSUME ANY LIABILITY ARISING
OUT OF SUCH APPLICATIONS OR USES OF ITS PRODUCTS. AOS RESERVES THE RIGHT TO IMPROVE PRODUCT DESIGN,
FUNCTIONS AND RELIABILITY WITHOUT NOTICE
70 25
60 VDS=-5V
-10V 125°C
20
50
40 15
ID(A)
ID(A)
30 -5V
10
20 -4.5V
5 25°C
10 VGS=-4V
0 0
0 1 2 3 4 5 2 2.5 3 3.5 4 4.5 5
VDS (Volts) VGS(Volts)
Figure 1: On-Region Characteristics Figure 2: Transfer Characteristics
40.0 1.8
ID=-20A
Normalized On-Resistance
30.0 1.6
VGS=-10V
VGS=-5V
RDS(ON) (mΩ )
1.4
20.0
1.2 VGS=-5V
10.0
VGS=-10V
1
0.0
0 5 10 15 20 25 0.8
0 50 100 150 200
ID (A)
Figure 3: On-Resistance vs. Drain Current and Gate Temperature (°C)
Voltage Figure 4: On-Resistance vs. Junction Temperature
50 1.0E+02
ID=-20A
1.0E+01
40 125°C
125°C 1.0E+00
RDS(ON) (mΩ )
30 1.0E-01 25°C
IS (A)
TC=100°C
TA=25°C 1.0E-02
20
1.0E-03
-55 to 175
10
25°C 1.0E-04
0 1.0E-05
0 5 10 15 20 0.0 0.2 0.4 0.6 0.8 1.0
VSD (Volts)
VGS (Volts)
Figure 6: Body-Diode Characteristics
Figure 5: On-Resistance vs. Gate-Source Voltage
10 2500
VDS=-15V Ciss
8 ID=-20A 2000
Capacitance (pF)
VGS (Volts)
6 1500
4 1000
Coss
2 500
Crss
0 0
0 5 10 15 20 25 30 35 0 5 10 15 20 25
Qg (nC) VDS (Volts)
Figure 7: Gate-Charge Characteristics Figure 8: Capacitance Characteristics
1000 100
TJ(Max)=175°C
100 TC=25°C
10µs 80
RDS(ON)
limited 100µs
Power (W)
ID (Amps)
10
1ms 60
DC
1 10ms
TJ(Max)=175°C 40
0.1
TC=25°C
0.01 20
0.01 0.1 1 10 100 0.0001 0.001 0.01 0.1 1 10 100
VDS (Volts) Pulse Width (s)
Figure 9: Maximum Forward Biased Safe Figure 10: Single Pulse Power Rating Junction-to-
Operating Area (Note F) Case (Note F)
10
D=T on/T In descending order
TJ,PK=T A+PDM.ZθJC.RθJC D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
Zθ JC Normalized Transient
RθJC=3°C/W
Thermal Resistance
TC=100°C
TA=25°C
PD
0.1
-55 to 175
Ton
T
Single Pulse
0.01
0.00001 0.0001 0.001 0.01 0.1 1 10 100
Pulse Width (s)
Figure 11: Normalized Maximum Transient Thermal Impedance (Note F)
60 50
45
50
40
Power Dissipation (W)
10 10
5
0 0
0 25 50 75 100 125 150 175 0 25 50 75 100 125 150 175
TCASE (°C) TCASE (°C)
Figure 13: Power De-rating (Note B) Figure 14: Current De-rating (Note B)
100
80
Power (W)
60
40
20
0
0.01 0.1 1 10 100 1000
Pulse Width (s)
Figure 15: Single Pulse Power Rating Junction-to-
Ambient (Note H)
10
D=T on/T In descending order
Zθ JA Normalized Transient
TJ,PK=T A+PDM.ZθJA.RθJA D=0.5, 0.3, 0.1, 0.05, 0.02, 0.01, single pulse
Thermal Resistance
1 RθJA=55°C/W
0.1
PD
0.01
Ton
Single Pulse T
0.001
0.00001 0.0001 0.001 0.01 0.1 1 10 100 1000
Pulse Width (s)
Figure 16: Normalized Maximum Transient Thermal Impedance (Note H)
Ig
Charge
td(on) tr t d(off) tf
Vgs
-
Vgs D UT VDC
Vdd 90%
Rg
+
Vgs 10%
Vds
Vds + Q rr = - Idt
DUT
Vgs
t rr
Vds - L -Isd -I F
Isd dI/dt
+ Vdd -I RM
Vgs VDC
Vdd
Ig
- -Vds