Developing the Stencil Printing Process for 01005 Lead-Free Assemblies

Yong-Won Lee1, Keun-Soo Kim2, Katsuaki Suganuma2 and Jong-Hoon Kim3

1
Mechanical & Manufacturing Technology Center, Samsung Electronics Co., Ltd.
416, Maetan-3Dong, Yeongtong-Gu, Suwon-Si, Gyeonggi-Do, 413-733, Korea
microjoining@naver.com, Tel. 82-31-200-6226
2
Institute of Science and Industrial Research, Osaka University
Mihogaoka 8-1, Ibaraki, Osaka 567, Japan
kskimm12@sanken.osaka-u.ac.jp, suganuma@sanken.osaka-u.ac.jp, Tel. 81-6-6879-8520
3
New & Renewable Energy Team, Korea Institute of Industrial Technology
35-3, Honcheon-Ri, Ibchang-Myon, Cheonan-Si, Chungnam, 330-825, Korea
kjhoon@kitech.re.kr, Tel. 82-41-5898-658

semiconductors and consumer products have been interested

Abstract
in using 0201 components. Recently, passive components
This paper presents the implementation of 01005
manufacturers are now introducing and offering low volume
components in a wireless module mass production. Several
quantities of 01005 components, and some early
modifications in processes, material, and equipment were
manufacturers are gearing up to develop and qualify assembly
required. A number of manufacturing related issues needed to
processes for their respective applications, while many
be addressed. One particularly significant issue for use of
manufacturers are still developing and optimizing 0201
01005 technologies is solder paste printing and the reason is
technologies.[2]
lack of manufacturing experience. Many manufacturers have
spent much time and money determining the optimum process
conditions for using 01005 components. All of the 01005
manufacturers recommended using an electroform stencil for
very small aperture size and fine pitches. This is required a
change from the standard manufacturing process that utilizes a
laser-cut stencil printing and it is also one of the more
expansive stencil fabrication processes. For some
manufacturing processes this may be difficult. However, the
current state of the art for laser-cut stencil technique of solder
paste is very limited for these extremely smallest components Figure 1. Size comparison for 01005, 0201 and
due to laser-cutting quality. 0402 components.
In right of this need, we carried out to evaluate if the
enhanced laser-cut stencil with post-treatment such as electro-
Ultra miniature 01005 sizes are just 0.4×0.2×0.2mm as
polishing can perform as good as or better than the
compared with the current 0201 sizes (0.6×0.3×0.3mm).
electroform stencil. The designed experiments are conducted
Figure 1 shows an optical image of a 01005 component
to determine the effect of electro-polishing on the print
placed next to 0201 component. Although miniature sized
performance of enhanced stencil for 01005 small apertures.
components, such as 01005s, enable the effective use of the
The results showed that the standard laser-cut stencils could
limited real estate to form complex circuitry, their
be strengthened through optimized electro-polishing treatment
introduction has posed new challenge during assembly
after laser-cutting process. This enhanced laser-cut stencil
processes. These challenges must be solved in order to gain
showed acceptable paste release performance and it is low-
acceptance as an option for high speed and high yield
cost alternative to electroform stencil for 01005 small
assembly.
apertures.
The work described in this paper also examines the release
The solder stencil printing process is the crucial point of
performance of type-3 and type-4 pastes from electroform and
SMT process. Additional attention needed to be paid to
enhanced laser-cut stencils. Results of this test showed that
assembly yield and quality related issues. Studies have shown
paste release performance is significantly better for type-4
that about 60~70% of defects identified after reflow
comparing to type-3 pastes.
originated during the solder paste printing process in general,
hence improving this process is an important way of
Introduction increasing assembly yield. [3-5] To achieve a high-yield and
Passive components comprise anywhere from 85 to 95% of high-quality soldering process, a sufficient amount solder
the components on a common circuit board assembly. Due to paste is needed and variation in paste volume must be
size considerations, there has been a constant evolution of minimized. If we print unequal amounts of solder paste we
passives in order to decrease the overall real estate the passive will experience a number of problems including tombstoning.
component takes up. [1] It seems like just a short time ago, the The key consideration is consistently printing the correct
0201 size was introduced and many manufacturers of amount of solder paste quality onto each pad of the 01005

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components. [4, 6] Since the 01005 components have been 01005 test vehicle (TV). TV is an 8×8 laminated SiP module,
introduced but it is still very little, publicly available details composed of 5×6×2 matrix. A fully populated test vehicle
on assembling small components and solder stencil printing contains 2,160 components for 01005. All 01005 component
techniques. Previous experience and earlier studies have pads in this design were fixed at 0.175mm(L) × 0.175mm(W)
shown that electroform stencils with a lower thickness (3mil), × 0.150mm(S), and all solder pads are solder mask defined
and finer powder size (Type-4 or 5) could potentially pad on three sides.(See Figure 3) The components used in this
outperform the described stencil. [1-2], [7-8], [10-11] experiment were 01005, 0201 and 0402 sizes and all provided
However, in actual manufacturing applications, electroform by Murata Co. The component was fed in tape and reel
stencils are considerably more expansive [9] and longer packaging.
processing times to fabricate than conventional laser-cut
stencils. Moreover, electroform stencil technology thus far are
non-standard process in the normal wireless module lines of
high-volume manufacturing (HVM). Additional tools such as
special squeegee blade for using electroform stencils [10] and
standard process changes are required for achieving good
release qualities. On the other hand the laser-cutting has the
advantage of high-flexibility, high-speed, and is able to cut
very small apertures, but the problem with conventional laser-
cutting is poor aperture quality. It needs a post-treatment to
clean the stencil and remove burrs on the backside. The Figure 2. Photograph of 01005 Test Vehicle.
electro-polishing are used to further smooth surface walls and
improve solder paste release. [11] In the electro-polishing, in L
which the solutions used commonly acide, anodic currents or
potentials lead to dissolution and passivation of the metal,
promoting the leveling of the metal surface. In the literature, W

there are some studies comparing the performance of

electroform and laser-cut stencils for same aperture size.[7-
12] For example, Mattsson et al. [9] studied stencil aperture S
performance, and the 4mil thick laser-cut and electro-polished Figure 3. Component pad dimension.
stainless steel stencil was evaluated as a low-cost option for
01005 volume manufacturing. Other researcher recently have
All solder paste printing for the experiment was conducted
reported the effect of stencil fabrication techniques on solder
using 3mil thick stencils with 1:1 opening for 01005 pads.
print qualities such as Iyer et al. [12] There findings are very
Two types of stencil were manufactured for the evaluations.
useful data in the stencil selection, the optimum stencil
(Electroform stencil and laser-cut stencil) The electroform
aperture design, solder paste selection, and paste printing
stencil was manufactured with the standard electroforming
process for small apertures such as 01005 and0201 and the
process and it was used for comparing with a laser-cut stencil.
factors impacting assembly quality. All the researchers
For a laser-cut stencil, standard stencil was designed for the
mentioned laser-cut stencil with electro-polishing was shown
aperture experiment. Five different apertures with electro-
potentially outperform in solder print quality. However, it still
polishing times were has been tested. For the electro-polishing
remains to be answered about allows 01005 component while
conditions, the electrolyte was made of chemicals of
still showing good printing results for 0201 or larger
analytical quality and it consisted of 95wt% phosphoric acid
components.
and 5wt% sulphuric acid. This solution was optimized
It is motivation of this work to challenge the previous
electrolytes from stencil manufacturer and capable of giving a
literature results and lesson learned from previous 0201
smooth a bright surface finish. A complete stencil consists of
technology development and manufacturing implementation,
a square rigid frame to which the stencil is attached. The
and prove or disprove that the electro-polished laser-cut
frame design is specific to the printer to be used, and is most
stencil can be performed successfully for 01005 components.
commonly fabricated from square aluminum tube for the
In this research work, one of low-cost assembly solution was
optimum combination of rigidity and lightness, although cast
successfully developed to have mixed 01005, 0201 and 0402
aluminum frames are used for small printer. The frame size is
components for SiP module and mobile phone applications.
736mm × 736mm and the metal stencil is 530mm × 530mm.
This paper discusses preliminary results from the solder
Tensioning is also required in this case to ensure a taut, flat
stencil printing process investigations for 01005 small
surface. A summary of the stencil fabrication for electro-
components.
polishing testing are shown in Table 1. The evaluations by
visual inspection of the quality of the surface polish for the
Experimental aperture wall was checked by scanning electron microscopy
Materials and Procedure (SEM) at magnification of 800X.
A test board with 01005, 0201 and 0402 components was
designed for the experiment. Figure 2 is a photograph of the

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 Table 1. Laser-Cut Stencil Fabrication Variables.
Laser Cutting Machine LPKF (Micro Cutting)
Laser-Beam Size 20mm
Laser Type YAG
E/P Solution Phosphoric Acid: 95wt%
Sulphuric Acid: 5wt%
E/P Time 0, 5, 8, 15 and 20sec
Stencil Mesh Tension 0.55mm – 0.70mm
Stencil Thickness 3mil(80um)
A commercially available solder pastes supplied from
Alpha Metal Co., water-soluble (WS609 flux), 95Sn/5Sb
solder paste was used throughout the study. The metal content
is 90% and the solder melting point was proximately
232~240°C as specified in the supplier’s specification.
Since the solder paste is stored at 4°C it has to be brought
up to room temperature before being used in the screen printer
for the experiments. Screen printing was carried out using
Speedline MPM AP Excel printer with metal squeegees
angles at 60° were fitted to the printer. The stencil was
cleaned before use. A stencil is mounted on the printer frame.
A stencil is placed on the PCB substrate, and after vision
alignment, a squeegee travels at a certain pressure and speed
to push the solder paste through the stencil apertures. The
following screen printing parameters were used for all stencil
printing: Print speed = 8mm/sec, squeegee type = metal
blades, print force = 5.3, balance = 50:50 and print gap = 0(on
contact). The solder deposited PCB substrate was inspected in
a microscope equipped with a digital camera and documented
photographically. The next step in the assembly process is the
component pick and place. The pick and place machine from
Siemens HS60 was used and programming was carried out
with same mounting speeds and forces. Pick-up nozzle is 906
and it is currently in used for 0201 components.
All solder paste reflow was performed in a Heller 1800
convection oven. The reflow system contained 8 heating and
1 cooling zone. The populated PCB substrates were reflowed
under nitrogen atmosphere via a Heller convection reflow
oven. The nitrogen environment was controlled at less than
400 oxygen ppm level. Peak temperature is 251°C for 38.8
seconds at above 232°C of solder melting point and the belt
speed is 16 inch/minutes. Figure 4 is the thermal profile that
was used to reflow all boards assembled during the
experiments. The final process step was deflux cleaning and a
Trek machine was employed for cleaning of flux residues. All
boards were visually inspected after stencil printing, after pick
and place, and after reflow processes. Component shear test
was performed using a Dage-series 4000 shear tester.
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Figure 4. Thermal reflow profile.
Experiment Design
To determine the best condition of electro-polishing for
enhanced laser-cut stencil fabrications, test stainless steel
sheets were designed with five levels of times; 0, 5, 8, 15 and
20s in this experiments. A stencil was designed based on the
results from this experiment. Only one electro-polishing time
was selected for the enhanced laser-cut stencil fabrication.
Two variants of stencil types (electroform stencil and
enhanced laser-cut stencil) are evaluated for the paste release
performance comparison purposes when the aperture volumes
to be deposited are kept constant. The variable held constant
are stencil thickness (3mil), stencil design (1:1 opening), paste
type (type-3 and type-4 particle sizes) and equipments used.
Results and Discussion
Results of the different evaluation steps are described in
the following section. The data gathered from the
experimentation was arranged and the data was analyzed
using JMP ® data statistical software.
Effect of Electro-Polishing on Aperture Quality
In this study, initially the effect of electro-polishing times
on the aperture wall quality of the surface polish was
investigated. For such, electro-polishing time was varied: 0, 5,
8, 15 and 20sec. As soon as each electro-polished stencil
surface was obtained, its polish quality was evaluated by
visual inspection. Figure 5 - (a) and (b) shows the SEM
images of laser-cut stencil’s aperture wall with different
electro-polishing times, and electroform stencil’s aperture
wall for comparison purpose. No electro-polished aperture
shows the effects of poor aperture quality as a result of the
laser-cutting process. ((a)-①, (b)-①) From the Figure 5 - ②,
③, ④, and ⑤ show the improved aperture quality and an
electro-polished aperture significantly has smoother surfaces
than no electro-polished aperture (0sec). The best quality of
aperture was achieved for electro-polishing times of 8sec and
its polish quality was improved with increasing electro-
polishing times in general. But, for electro-polishing times of
15 and 20sec, the good aperture quality could not be realized
and the corner inside of aperture was more ragged than times
of 8sec. It should be pointed out that suitable processing time
will improve the surface quality but the excessive processing
time will lead to quite lower surface quality. This result
therefore that it is desirable to consider process efficiency for
high surface quality. Up to now, no optimization of the
electro-polishing parameters for many laser-cut stencil
manufacturing has been made in industry.
 (a)
Laser-Cut Electroform
① 0sec ② 5sec ③8sec ④15sec ⑤20sec (Control)

(b)
Laser-Cut Electroform
① 0sec ② 5sec ③8sec ④15sec ⑤20sec (Control)

Figure 5. SEM images of laser-cut apertures with different electro-polishing times. (a) Top view at 410X, (b) Angled view
at 410X.

However, aperture quality has a direct influence on paste improved surface quality of aperture wall by electro-
release and because of this, electro-polishing process is polishing process.
necessary to achieve the smoother surface. In addition, the (a) (b)
laser-cut aperture size must be adjusted to the electro-
polishing employed since the aperture size will change
during the processing. [7] For this study, we did not measure
the each aperture size after electro-polishing processing at
this moment.

Comparison between Different Stencil Fabrication

Techniques
Firstly, it is important to evaluate a stencil printing Figure 6. Solder deposition on 01005 and 0402 pads for
performance for different fabrication techniques. As the most each of stencil types. Type-4 paste and 3mil thick stencil.
important part of the printing process is the solder volume (a) Electroform , (b) Laser-cut
delivered to the pads. Figure 6 show some representative
photographs from solder print deposited for the 175um
01005 aperture arrays. Both stencils were used type-4 solder
paste. From the figures, it was observed that there is no
significant difference in print qualities between electroform
and laser-cut stencils. Therefore, it was assumed that
enhanced laser-cut stencils will behave similarly to
electroform stencils.
The paste thickness for each stencil type graphically
shown in Figure 7 and it was statistically analyzed using a
paired t-test. The p-value of less than 0.05 indicates that the
factor has statistically significant effect at the 95%
confidence level. It shows the result that there is statistically
significant difference on solder paste thickness between
electroform and laser-cut stencils. From the graph, the values
plotted are often called the stencil printed “release” values.
Release is defined as the volume of the stencil printed deposit Figure 7. Comparison of electroform vs. enhanced laser-
divided by the volume of the apertures. [8] The graph shows cut stencil. This result was statistically significant. (p-
us that the enhanced laser-cut stencil demonstrates better value = 0.0034)
paste release for the 01005 solder pads. The better
performance of enhanced laser-cut stencils could be due to

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 Secondly, the repeat printing experiment was performed
on 30 boards for each of the stencil. The objective of this
experiment is to determine the print frequency and stencil
cleaning interval for each stencil types. Figure 8 and Figure 9
shows paste thickness by repeat printing without wiping for
the 0402, 0201, and 01005 components for each of the
stencils. From the graphs, it is seen that there was no
significant drop in repeat printing for both electroform and
laser-cut stencils. However, the paste thickness and print
stability for enhanced laser-cut stencil is better than
electroform stencil. Visual inspection was performed on 7
boards of the 30 boards printed for each of the stencils. The
1st, 5th, 10th, 15th, 20th, 25th, and 30th print are used in the
visual inspection test. There is no significant difference in
visual inspection between electroform and enhanced laser-cut
stencils.
Figure 8. Effect of repeat printing without wiping for
electroform stencil. Type-4 paste and 3mil thick stencil.
Figure 9. Effect of repeat printing without wiping for
enhanced laser-cut stencil. Type-4 paste and 3mil thick
stencil.
Effect of Solder Paste Powder Size
Figure 10-(a) shows some representative photographs from
solder deposition on 01005 pads with different paste types
for electroform stencil. Paste depositions on pads are
significantly better for a type-4 paste compare to a type-3
pastes. When a type-3 paste was used, several insufficient
solder pastes in pad deposited were observed and paste
release was worse for both electroform and enhanced laser-
cut stencils. (See Figure 10 (a) - ①) This is in agreement
with some article published on 01005 solder printing studies.
[2, 8] A type-4 paste has smaller particle size which will give
better paste release performance, and will aid in depositing
more solder volume in pads. Figure 10-(b) show the
photographs from solder deposition on 01005 pads with
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different paste types for enhanced laser-cut stencil. Similar
print deposition results were observed as when electroform
stencil was used. However, enhanced laser-cut stencil
showed better paste coverage than the electroform stencil
used for a type-4 paste.
(a)
① Type-3 Paste ② Type-4 Paste
(b)
① Type-3 Paste ② Type-4 Paste
Figure 10. Solder deposition on 01005 and 0201pads with
enhanced laser-cut stencil. (a) Electroform, (b) Laser-cut
Figure 11. Optical image showing fracture area of 01005
solder joint.
After all boards had completed the reflow soldering,
component shear test was performed for each of solder types.
Ten components for each type (01005, 0201 and 0402 sizes)
on each boards were sheared for each experimental trials. For
fracture modes, most of the samples fractured at the solder
joint as shown in Figure 11. The result of shear test is shown
in Figure 12. A type-3 paste provided an average shear forces
of 290gf and 255gf for electroform and enhanced laser-cut
stencils respectively. It was a lower shear performance than
type-4 paste which conform the notion that finer paste sizes
are required for tiny 01005 components. It is clear from the
print images that a type-4 paste gives a more consistent,
higher volume print than type-3 paste. However, it is
interesting to note that enhanced laser-cut stencil has lower
shear force than electroform stencil, but highest paste
thickness for a type-4 paste as Figure 7. From the graph,
enhance laser-cut stencil and type-4 paste combinations had
only average shear force of 239gf even though it had average
relative paste thickness of 0.105mm. On the other hand the
electroform stencil had average shear force of 319gf and
average paste thickness of 0.095mm for 01005 components.
Figure 12. Shear force comparisons: Type-3 vs. Type-4
pastes and Electroform vs. Laser-cut stencils.
The visual inspection of the test vehicles was done
manually using a low-power optical micro scope. Defects
encountered among the varieties of components (01005,
0201 and 0402 sizes) were analyzed after the production run.
The graph in Figure 13 contains process yield information. In
general, a comparison between a type-3 and a type-4 pastes
shows that type-4 paste have better yield performance for
both electroform and laser-cut stencils. The graph note that
the electroform stencil / type-4 paste combination’s process
yield (97.9%) is greater than the enhanced laser-cut stencil /
type-4 paste combination’s process yield (97.5%). In
addition, 0201 and 0402 defects were not encountered during
this experiment. For the defect counting, 5 defects including
1 tombstone and 4 misplacements were occurred at the
electroform stencil / type 4 paste combinations, and 6 defects
including 2 tombstones and 4 misplacements were also
observed at the enhanced laser-cut stencil / type-4 paste
combinations. It should be noted that only two defect modes
were observed during the visual inspection. An example of
these defects is presented in Figure 14. Tombstone is caused
by differences in initial wetting of the solder between both
joints of a component during the reflow soldering, and it is
mainly due to unequal amount of printed paste on pads. [13]
Preliminary test suggests that paste type (powder size) has an
effect on yield and quality of the solder joints after reflow
soldering. However, more data are needed to make definitive
conclusion for shear force and yield differences between
electroform and enhanced laser-cut stencils.
Conclusions
We emphasize that the results discussed in this paper are
very preliminary, especially given the relatively small sample
size. Due to the limited sample size, we did not attempt to
compute defects in terms of parts per million (PPM), which is
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Figure 13.Yield comparisons: Type 3 vs. Type 4 pastes and
Electroform vs. Laser-cut stencils.
(a) (b)
Figure 14. Images of SMT defects. (a) Tombstone, (b)
Misplacement
the standard unit used in industry. Further study is needed
and it is will be reported in a subsequent paper. The study has
also proven that the process can be developed that allows
01005 stencil printing with acceptable yields. The results of
the evaluation suggest that recommending the stencil printing
technique, along with the electro-polishing post treatment is
the significant factor associated with fine-pitch and small
aperture such as 01005 components. Some of the critical
inferences from experiment are summarized below.
When comparing the five different electro-polishing
times for the aperture wall the time of 8sec provided best
surface quality of any in the group and it was currently used
in the enhanced laser-cut stencil fabrications for our 01005
high volume manufacturing (HVM).
Enhanced laser-cut stencil showed better printing
performance and it is low-cost alternative to non standard
process such as electroform stencil printing for 01005 small
components.
Paste thickness for 01005 components is significantly
better for the enhanced laser-cut stencil compared to
electroform stencil.
Paste coverage for 01005 pads is better for the enhanced
laser-cut stencil when a type-4 paste was used.
Paste depositions on pads are significantly better for a
type-4 paste comparing to a type-3 pastes.
Highest shear force was achieved for electroform stencil
when a type-4 paste was used.
These some advantages of enhanced laser-cut stencil with
electro-polishing technique over the electroform stencil
including excellent solder paste release, solder volume
increased, durable long stencil life, good manufacturability,
fast delivery time and more cost reduction opportunities.

Acknowledgements
All work was performed at ASE Korea Inc. The authors
would like to thanks their colleagues and management team
at the Packaging Engineering Team of ASE Korea Inc.

References
1. Paul N. Houston. et al, “Processing Strategies for High
Speed 0201 Implementation”, IEMT2002, Proc 27th
Annual IEEE/SEMI International, San Jose, CA, June.
2002, pp. 166-172
2. Roy Jarvina. et al, “01005 SMT Component Assembly
for Wireless SiP Modules”, Proc 50th Electronic
Components and Technology Conf, Orlando, FL, May.
2005, pp. 1502-1505
3. T. A. Nguty. et al, “Understating the Process Window
for Printing Lead-Free Solder Pastes”, Proc 50th
Electronic Components and Technology Conf, Las
Vegas, NV, May. 2000, pp. 1426-1434
4. W. Steplewski. et al, “Stencil Design for Lead-Free
Reflow Process” Proc 30th International Spring Seminar
on Electronics technology, Cluj-Napoca, Romania,
2007, pp. 330-334
5. Leila J. Ladani. et al, “Effect of Selected Process
Parameters on Durability and Defects in Surface-Mount
Assemblies for Portable Electronics”, IEEE Trans-
CPMT, Vol. 31, No. 1(2008), pp. 51-60
6. Joe Belmonte. et al, “Consideration in the Development
of the 01005 Component Assembly Process”, Proc
SMTA International Conf, Chicago, IL, Sept. 2005
7. William E. Coleman, “Stencil Print Performance
Studies”, Proc SMTA International Conf, Chicago, IL,
Sept. 2005, pp. 94-101
8. Vatsal Shah. et al, “Process Development for 01005
Lead-free Passive Assembly; Stencil Printing”, Proc
APEX’07, Los Angeles, CA, Feb. 2007
9. Fredrik Mattsson. et al, “Design and Assembly of 01005
Passives Using Pb-free Solder”, Circuit Assembly, May.
2005
10. Michael R. Burgess. et al, “Electroformed vs. Laser-cut:
A Stencil Performance Study”, SMT Magazine, June.
2007
11. William E. Coleman. et al, “Choosing a Stencil”, SMT
Magazine, July. 2006
12. Satyanarayan Iyer. et al, “Implementing 0201s on High-
Density Lead-Free Memory Modules”, IEEE Trans-
CPMT, Vol. 31, No. 1(2008), pp. 41-50
13. Harry Trip, “The persistent Problem of Tombstoning”,
Circuit Assembly, June. 2003, pp.20-22

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