Assignment Unit 12

Amogh Zadbuke

Purpose
Assume that you are beginning your last semester of college before graduating. Using
information about your education, work experience, and so on, prepare a résumé in an effective
format.
Process
1. How will you word your name at the top of your résumé—for example, with or without any
initials?
Answer: I will clearly write my name at the Top “Amogh Zadbuke”. I will not include my
initials.

2. What is the title of your degree? The name of your college? The location of the college? Your
major and minor? Your expected date of graduation (month and year)?
Answer:
Degree Name of College Major Location Graduation
Project March 2019-
Master of Science Harrisburg University Harrisburg PA
Management Present
Arizona State Mechanical Aug 2014-
Master of Science Tempe, AZ
University Engineering May2016
Bachelors of Vishwakarma Institute Mechanical Aug 2008-
Pune, India
Science of Technology Engineering May2012

3. What is your grade-point average overall and in your major? Is either one high enough to be
considered a selling point?

Answer:
Degree Name of College GPA
Master of Science Harrisburg University 3.5/4

Arizona State
Master of Science 3.88/4
University
Bachelors of Vishwakarma Institue
9.04/10
Science of Technology

Yes, some of the companies have requirement on GPA, so if we miss it in resume then there is
probability that we will miss the opportunity. I will recommend on including the GPA in the
resume.

4. Have you received any academic honors, such as scholarships or being named to the dean’s
list? If so, list them.
Answer: I have not received any scholarship in any of the schools.

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 Assignment Unit 12
Amogh Zadbuke
5. Did you take any elective courses that are relevant to the job and that might differentiate you
from other applicants? If so, list them.
Answer: Yes, I have taken courses that are relevant to my job search.
Harrisburg University Course work: Introduction to Project Management, Professional
Communication
Arizona State University Course work: FEA, Advanced CAE, Design Optimization,
Microelectronic Packaging, Material Science
Vishwakarma Institute of Technology Course work: Design of Machine Elements,
Manufacturing Processes, Thermodynamics, Heat Transfer

6. List in reverse chronological order (most recent job first) the following information for each
job you’ve held during college: company name, job title, location (city and state), and dates of
employment. Describe your specific responsibilities in each position. Use short phrases,
beginning each responsibility with and action verb, and showing, where possible, specific
evidence of the results you achieved.
Answer:

Current Job: Analog Devices, Greensboro, NC Aug 2016- Present

Position: Packaging / Process Development Engineer- iSensor
Job Responsibilities:
-Expertise in Design, Prototyping & High Volume Manufacturing of SiP, PoP, SOC Packages and
Modules
-Cross-functioning with MEMS Die stack, Laminate design, Electrical design & System
Simulations team to work out substrate design activity
-Research, Development & Characterization of material sets to solve extremely challenging
design requirements for safety critical automotive applications
-Spearheaded unique DOE and FMEA to fully optimize the process and highlighted areas where
material or equipment improvements can offer the most benefit
-Applied knowledge of design simulation analysis in ANSYS/COMSOL/LS-DYNA and relating
this knowledge to laboratory derived empirical validation data sets
-Worked closely with our Assembly Subcontractors in South East Asia to establish process flows,
manage build volumes through factory and lead cross functional teams to fix any assembly or
reliability issues
-Established Manufacturability specifications to ensure new package technologies meet Yield,
Cost and Quality targets

Internship: Peregrine Semiconductor, San Diego, CA June 2015- Aug 2015

Position: Packaging Design Intern- Assembly & Packaging Engineering department
Job Responsibilities
-Provided mechanical guidance to design and manufacturing teams to design robust & reliable
packages in consumer electronics
-Performed mechanical modeling (FEA) to recommend package architectures and material sets
which are aggressive, reliable and competitive from cost perspective
-Developed analysis methodologies for Flip-Chip, CSP & BGA packages to help risk assess
package for thermomechanical stresses, surface mount capability and solder joint reliability

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 Assignment Unit 12
Amogh Zadbuke
-Hands-on experience on device packaging and assembly techniques for Flip-Chip, Lead Frames,
QFN, WB, BGA

Full Time job in India: L&T-Chiyoda Limited, Mumbai, India Aug 2012- July 2014
Role: Mechanical Design Engineer- Rotating Machinery department
Job Responsibilities:
-Project lead for design of pumps & Turbines– examined & modified project, piping layout as
per ASME design standards
-Developed PFMEA by on-site testing of mechanical equipment to validate process parameters
in operating conditions
-Timely execution of projects by coordinating with Clients, Vendors and commissioning team

Internship: Siddheshwar Industries Pvt., Ltd, Pune, India May 2011- July 2011
Position: Engineering Intern- Manufacturing unit
-Responsibilities:
-Designed an efficient layout and work flow for manufacturing of gears which reduced the
process cycle time
-Developed process control techniques to improve quality of gearbox at every manufacturing &
assembly stage

7. What additional information might you include, such as special skills, extracurricular
activities, volunteer work, languages spoken, and so on?
Answer: I will include Summary, Skills, Work Experience, Education in my Resume.

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 Assignment Unit 12
Amogh Zadbuke

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