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NOTE 3 5X
.181 4.60 .085±.003 2.15±0.08
.075 1.91 THIS AREA PRE-TINNED
Sn63Pb37 SOLDER
RP
2X
.085±.002 2.16±0.05
4X
MATERIAL:
.026 0.66
BODIES & CONTACT: BERYLLIUM COPPER PER ASTM B196, MIN
ALLOY No. UNS C17300, TD04.
INSULATORS: PTFE PER ASTM D1710, TYPE I, GRADE 1, CLASS B.
FINISH:
BODIES & CONTACT: GOLD PER ASTM B488, TYPE II, CODE C, CLASS 1.27
OVER NICKEL PER AMS-QQ-N-290, CLASS 1, .00005" MIN. 2X .0425±.0010 1.08±0.03 TABLE I
PERFORMANCE: PART NUMBER INTERFACE
.0160±.0015 0.41±0.04
1211-40170 SMOOTH BORE
IMPEDANCE: 50 OHMS
FREQ. RANGE: DC TO 26.5 GHz 1211-40171 LIMITED DETENT
RECOMMENDED MOUNTING HOLE PATTERN
1211-40172 FULL DETENT
NOTES: MATERIAL:
SEE NOTES DIMENSIONS ARE IN INCHES TOLERANCES:
UNLESS OTHERWISE SPECIFIED
FRACTIONAL: 1/64 ANGULAR: X 1 0'
X X' 15' 1) ALL DIMENSIONS ARE IN INCHES [MILLIMETERS]
1. DIMENSIONS APPLY PRIOR TO SOLDER DIPPING. FINISH:
SEE NOTES DECIMAL: .X .030
2) ALL DIMENSIONS ARE AFTER PLATING.
3) BREAK CORNERS & EDGES .005 R. MAX.
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