Ata 20 Collins

instruction
book
Avionics Standard Shop

Practices
ATA 20-00-01
Export Control Classification Number (ECCN) for this document is

EAR99.
© 2015 Rockwell Collins. All rights reserved.
Esta hoja fue impresa desde la BTV y pertenece a la revisión del manual N° 03, de fecha 18/06/2015 - VERIFICAR SU VIGENCIA
Avionics Standard Shop Practices
instruction book
ATA 20-00-01
Printed in the United States of America Rockwell Collins

© 2015 Rockwell Collins All Rights Reserved. Cedar Rapids, Iowa 52498
523-0768039-0300000
1st Edition, 1 November 1985
()ASSP)IB)JUN)18/2015)) 3rd Edition 18 June 2015
T-1
ROCKWELL COLLINS
INSTRUCTION BOOK
Export Control Classification Number (ECCN) for this document is EAR99.
PROPRIETARY NOTICE
FREEDOM OF INFORMATION ACT (5 USC 552) AND DISCLOSURE OF CONFIDENTIAL INFORMATION

GENERALLY (18 USC 1905)
This document and the information disclosed herein are proprietary data of Rockwell Collins. Neither this
document nor the information contained herein shall be used, reproduced, or disclosed to others without the
written authorization of Rockwell Collins, except to the extent required for installation or maintenance of recipient’s
equipment. This document is being furnished in confidence by Rockwell Collins. The information disclosed herein
falls within the exemption (b) (4) of 5 USC 552 and the prohibitions of 18 USC 1905.
SOFTWARE COPYRIGHT NOTICE
© 2009-2015 ROCKWELL COLLINS. ALL RIGHTS RESERVED

All software resident in this equipment is protected by copyright.
We welcome your comments concerning this manual. Although every effort has been made to keep it free of
errors, some may occur. When reporting a specific problem, please describe it briefly and include the manual part
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T-2
523-0768039
INSERT LATEST CHANGED PAGES. DESTROY SUPERSEDED PAGES.

LIST OF EFFECTIVE PAGES NOTE: The portion of the text affected by the changes is indicated by a vertical line
in the outer margins of the page. Changes to illustrations are indicated by
shaded or screened areas, or by miniature pointing hands.
Dates of issue for original and changed pages are:
Original 0 . . . . . . . . . . . 18 June 2015
TOTAL NUMBER OF PAGES IN THIS PUBLICATION IS 278 CONSISTING OF THE FOLLOWING:
Page *Change Page *Change Page *Change

No. No. No. No. No. No.
T-1 - T-2 . . . . . . . . . . . . . . . . . . . . . . . 0 xxii Blank . . . . . . . . . . . . . . . . . . . . . . 0 5-138 Blank . . . . . . . . . . . . . . . . . . . . 0

A .............................0 1-1 - 1-20 . . . . . . . . . . . . . . . . . . . . . . 0 6-1 - 6-13 . . . . . . . . . . . . . . . . . . . . . . 0
B Blank . . . . . . . . . . . . . . . . . . . . . . . . 0 2-1 - 2-12 . . . . . . . . . . . . . . . . . . . . . . 0 6-14 Blank. . . . . . . . . . . . . . . . . . . . . . 0
i - ix . . . . . . . . . . . . . . . . . . . . . . . . . . . 0 3-1 - 3-13 . . . . . . . . . . . . . . . . . . . . . . 0 A-1 - A-32 . . . . . . . . . . . . . . . . . . . . . 0
x Blank. . . . . . . . . . . . . . . . . . . . . . . . . 0 3-14 Blank. . . . . . . . . . . . . . . . . . . . . . 0 B-1 - B-3 . . . . . . . . . . . . . . . . . . . . . . 0
xi - xiii . . . . . . . . . . . . . . . . . . . . . . . . 0 4-1 - 4-9 . . . . . . . . . . . . . . . . . . . . . . . 0 B-4 Blank . . . . . . . . . . . . . . . . . . . . . . 0
xiv Blank . . . . . . . . . . . . . . . . . . . . . . . 0 4-10 Blank. . . . . . . . . . . . . . . . . . . . . . 0 Glossary-1 - Glossary-7 . . . . . . . . . . 0
xv - xxi . . . . . . . . . . . . . . . . . . . . . . . . 0 5-1 - 5-137 . . . . . . . . . . . . . . . . . . . . . 0 Glossary-8 Blank . . . . . . . . . . . . . . . . 0
*Zero in this column indicates an original page.
A/(B Blank)
523-0768039
TABLE OF CONTENTS
Chapter/Para Page
LIST OF ILLUSTRATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . v
LIST OF TABLES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . viii
INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xi
SAFETY SUMMARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xv
1 MATERIALS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.1 INTRODUCTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.2 MATERIALS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.2.1 Chemicals. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1.2.2 Paints and Coatings.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11
1.2.3 Adhesives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-15
1.2.4 Lubricants. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-18
1.3 OTHER KNOWN OBSOLETE MATERIALS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-19
2 TOOLS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.1 INTRODUCTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.2 PREFERRED HAND TOOLS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2.2.1 Commercially Available Tools. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2
2.3 PREFERRED CRIMP TOOLS.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3
2.4 PREFERRED SOLDERING TOOL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11
2.5 PREFERRED ELECTROSTATIC DISCHARGE MATERIALS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11
3 CLEANING . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.1 INTRODUCTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.2 CLEANING MATERIALS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.3 PROCEDURES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.3.1 General Cleaning.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1
3.3.2 Special Cleaning of Circuit Cards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.3.3 Bearings (Unsealed, Sealed, and Porous Bronze). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.3.4 Cables, Covered.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.3.5 Castings (All Wiring and Electrical Circuit Cards/Components Removed). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2
3.3.6 Cathode Ray Tubes Optic Filters. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
3.3.7 Chassis, Wired. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
3.3.8 Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3
3.3.9 Covers and Shields. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
3.3.10 Dial Windows, Lighting Wedges, CRTs and Plastic Display Faces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-7
3.3.11 Gears: Metal, Composition, and Plastic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
3.3.12 Insulators, Ceramic and Plastic.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
3.3.13 Jacks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
3.3.14 LCDs and Elastomeric Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-8
3.3.15 Machined Metal Parts.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
3.3.16 Mechanical Metal Parts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
3.3.17 Mechanical Parts With Dry Film Lubrication. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
3.3.18 Meter Movement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-10
3.3.19 Molded Plastic Parts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11
3.3.20 Motors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11
3.3.21 Sliprings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12
3.3.22 Sockets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12
3.3.23 Hydraulic Fluid Contamination. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-13
4 CHECK. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
i
523-0768039
TABLE OF CONTENTS
Chapter/Para Page
4.1 INTRODUCTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.2 PROCEDURES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1
4.2.1 Bearings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
4.2.2 Capacitors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2
4.2.3 Cathode Ray Tubes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.2.4 Chassis, Dust Covers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.2.5 Connectors, Test Jacks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.2.6 Controls.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.2.7 Covers and Shields. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.2.8 Dry Film Type Lubrication. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.2.9 Gears, Metal. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4.2.10 Gear Trains. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
4.2.11 Indicators, Lamps. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
4.2.12 Insulators, Ceramic or Plastic. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
4.2.13 Jacks. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
4.2.14 Laminated Circuit Boards. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4
4.2.15 Machined Metal Parts.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4.2.16 Mechanical Metal Parts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4.2.17 Meter Mechanisms. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4.2.18 Molded Plastic Parts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4.2.19 Motors, Potentiometers, Synchros. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4.2.20 Resistors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4.2.21 Semiconductors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5
4.2.22 Sockets. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
4.2.23 Soldered Terminal Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
4.2.24 Solenoids.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
4.2.25 Springs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
4.2.26 Transformers and Reactors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
4.2.27 Wiring. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7
4.2.28 RF Assemblies. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8
4.2.29 Radar Flatplate Antenna.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8
4.2.30 Solder Station ESD Check.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8
4.2.31 Self-Adhesive Labels and Decals (General).. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-9
5 REPAIR . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
5.1 INTRODUCTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
5.2 REPAIR TOOLS AND SUPPLIES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1
5.3 REPAIR AND REPLACEMENT PROCEDURES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
5.3.1 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2
5.3.2 Replacement of Resistors, Diodes, Capacitors, and Wires. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6
5.3.3 Replacement of Multilead Components (Transistors, Transformers, Relays, Etc.).. . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11
5.3.4 Replacement of Integrated Circuits (Flatpacks, Thinfilms, and Dual-In-line Packages). . . . . . . . . . . . . . . . . . . . . . . 5-13
5.3.5 Replacement of Surface Mounted Devices.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-17
5.3.6 Replacement of Thinline Connector Contacts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-31
5.3.7 Replacement of Sideboard Connector Pins.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-33
5.3.8 Replacement of Blue-Line Connector Contacts.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-37
5.3.9 Crimping Solderless Connections. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-38
5.3.10 Replacement of Coaxial or High-Voltage, High-Current Contacts and Cable Preparation. . . . . . . . . . . . . . . . . . . . . 5-40
5.3.11 Backplane Removal. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-46
5.3.12 Backplane Disassembly. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-47
5.3.13 Replacement of Tuning Fork and Blade-Type Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-47
5.3.14 Backplane Reassembly. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-48
5.3.15 Backplane Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-48
5.3.16 Replacement of Blue-Line Plug Contact.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-48
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5.3.17 Replacement of I/O Connector Snap-In Contacts. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-51
5.3.18 Soldering High-Voltage Circuitry.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-52
5.3.19 Repair of Circuit Pads. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-53
5.3.20 Repair of Conductor Lines.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-54
5.3.21 Repair of Plated Holes With No Internal Connections (Two Layer Boards). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-57
5.3.22 Repair of Short Circuits. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-57
5.3.23 Repair of Open Thru-Holes. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-58
5.3.24 Repair of Internal Open Circuits (Conductors). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-59
5.3.25 Repair of Horizontal and Vertical Box Connectors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-61
5.3.26 HumiSeal 1B31 Postcoating. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-62
5.3.27 Nonplanar Card Repair Procedures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-70
5.3.28 Painting, Touchup. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-71
5.3.29 General Lubrication Procedures. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-72
5.3.30 Adhesives. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-73
5.3.31 Special Considerations for RF Circuit Card Repair. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-79
5.3.32 Circuit Board Modification Using Terminal Strip/Anyboard. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-85
5.3.33 Radar Flatplate Surface Finish Repair. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-87
5.3.34 Replacing Clear Windows On Edgelit Control Panels. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-87
5.3.35 Replacement of Aircraft Instrument Dial Windows. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-88
5.3.36 Repair of Threaded Holes in Cast or Wrought Materials. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-88
5.3.37 Knob Setscrew Torque Values. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-92
5.3.38 Application of Heat Sink Compound.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-92
5.3.39 Routing Wires, Wire Bundles, and Cables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-93
5.3.40 Binding and Restraining Wire Bundles and Cable Bundles. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-93
5.3.41 Inspection and Repair of Fiber Optic Cables. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-99
5.3.42 Rework and Repair of Ball Grid Arrays. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-122
5.4 OVERHAUL. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-130
5.4.1 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-130
5.4.2 Overhaul for Electronic Equipment. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-130
5.4.3 Overhaul for Mechanical Equipment.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-130
5.5 TEST AIDS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-130
5.5.1 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-130
5.5.2 Test Aid Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-131
5.6 self-adhesive labels and decals (removal and application). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-131
5.6.1 Label and Decal Application.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-131
5.6.2 Label and Decal Removal. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-131
5.7 LEAD-FREE SOLDERING. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-131
5.7.1 Lead-Free Product.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-131
5.7.2 General Requirements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-131
5.7.3 Solder Connection Appearance.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-132
5.7.4 Shrinkage Voids.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-133
5.7.5 Solder Fillet Lifting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-134
5.7.6 Surface Mount Solder Connection/Termination Appearance. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-135
6 ESDS DEVICES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
6.1 INTRODUCTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
6.2 GENERAL INFORMATION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
6.3 DEFINITION OF TERMS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1
6.4 STATIC SAFEGUARDED WORKSTATION.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3
6.5 REPAIR TOOLS AND SUPPLIES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5
6.6 HANDLING PROCEDURES/PRECAUTIONS.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5
6.6.1 General. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5
6.6.2 Material Handling. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5
6.6.3 Connection and Contact. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6
6.6.4 Paperwork.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-7
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6.7 TRANSPORTATION AND STORAGE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-7
6.7.1 Internal. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8
6.7.2 External. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8
6.7.3 Component Level. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-8
6.7.4 Assembly Level. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-9
6.7.5 ESD Protective Bags.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-9
6.7.6 Non-ESDS Protective Bags. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-9
6.7.7 ESD Protective Containers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-10
6.7.8 Non-ESD Protective Containers. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-10
6.8 ADDITIONAL PRECAUTIONS.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-10
6.9 ANTISTATIC DEVICE TEST AND CHECK.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-10
6.9.1 General Check. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-11
6.9.2 Surface Resistivity Test. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-13
Appendix A CONVERSION TABLES, METRIC FACTORS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-1
A.1 METRIC ESTIMATION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-1
A.2 METRIC PREFIXES AND SYMBOLS.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-1
A.3 CONVERSION TABLES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-2
A.4 OHM'S LAW. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-9
A.5 COAXIAL CABLE CHARACTERISTICS.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-10
A.6 GRASSHOPPER FUSES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-11
A.7 RESISTOR COLOR CODE. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-13
A.8 RESISTOR NETWORKS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-18
A.9 CAPACITORS.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-18
A.10 COILS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-22
A.11 DIODES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-22
A.12 LIGHT EMITTING DIODES.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-25
A.13 SILICON CONTROLLED RECTIFIERS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-25
A.14 TRANSISTORS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-26
A.15 RELAYS. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-30
A.16 SURFACE MOUNT DEVICE PACKAGES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-30
Appendix B EQUIPMENT SHELF LIFE/RECERTIFICATION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-1
B.1 INTRODUCTION. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-1
B.2 ROCKWELL COLLINS AIR TRANSPORT SYSTEMS/PASSENGER SYSTEMS GUIDELINES. . . . . . . . . . . . B-1
B.2.1 Scope. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-1
B.2.2 Definitions and Conditions. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-1
B.2.3 Shelf Life Guidelines for Product Types.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-1
B.2.4 Recertification. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-2
B.3 BUSINESS AND REGIONAL SYSTEMS GUIDELINES. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-2
B.3.1 Storage Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-2
B.3.2 Recertification Guidelines. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-2
GLOSSARY . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .Glossary-1
iv
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LIST OF ILLUSTRATIONS
Number Title Page

1 Electrostatic Discharge Label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xix
1-1 Chemical Hazard Label . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
3-1 ZIF Connector Cleaning Tool . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5
5-1 Two-Lead Component Removal Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-7
5-2 Ground Plane Lead Removal Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8
5-3 Strain-Relief Mounting Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-9
5-4 Ground Plane Lead Installation Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10
5-5 Wrap on Post Terminals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11
5-6 Two-Lead Component Installation Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11
5-7 Multilead Component Removal Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12
5-8 Multilead Component Installation Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-14
5-9 Flatpack Lead Forming Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-15
5-10 Flatpack and Thinfilm Soldering Sequence Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-16
5-11 Various SMDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-19
5-12 Typical SMD Footprint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-20
5-13 Example of Hot Air Funnel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-21
5-14 Chip Component Removal. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-23
5-15 Device Orientation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-24
5-16 Good LCC Solder Joint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-24
5-17 Good (SOIC, SOT) Solder Joint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-25
5-18 PLCC Solder Joint. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-27
5-19 Examples of Chip SMDs . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-29
5-20 Good (Chip) Rigid Solder Joint . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-30
5-21 Alternate Component Installation. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-31
5-22 Impact, Backup, and Insertion Tools Design . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-35
5-23 Sideboard Contact Extraction/Insertion Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-36
5-24 Terminal with Insulation Support . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-39
5-25 Terminal Without Insulation Support. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-39
5-26 Open-Ended Termination . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-40
5-27 Coaxial Cable Connector Preparation Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-42
5-28 Connector Trimming Preparation Diagram. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-45
5-29 Trim Cable Insertion . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-45
5-30 Coax Braid . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-46
5-31 Blue-Line Connector Snap-In Contact Extraction Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-49
5-32 Contact Extraction Tool, Fabrication Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-49
5-33 Blue-Line Connector Snap-In Contact Insertion Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-51
5-34 Overlap For Pad Repair of PWAs. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-53
5-35 Wire Insertion for Pad Repair Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-54
5-36 Repaired Conductor Overlap Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-56
5-37 Open Thru-Hole (Left) and Repair (Right) Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-58
5-38 Eyelet Insertion For Pad Repair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-59
5-39 External Jumper Wire Positioning Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-60
5-40 Repair Conductor in Place Over Open Circuit Diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-61
5-41 Components to be Free of Conformal Coating . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-64
5-42 Hot Melt Adhesive Application . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-76
5-43 Hot Melt Adhesive Repair . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-78
5-44 RF Current Flow . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-79
5-45 Area of Lossy Conduction . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-79
5-46 Part To Circuit Location . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-80
5-47 Axial/Radial Lead Mounting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-81
5-48 Measuring Soldering Iron Temperature. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-82
5-49 Leadless Part Placement. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-84
5-50 Round or Coined Lead Part Placement . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-85
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Number Title Page

5-51 Mounting of Repair Terminal Strip/Anyboard . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-86
5-52 Minimum Material Thickness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-89
5-53 Ferrule End Face Cleaner. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-101
5-54 Inspection Probe Illustration . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-102
5-55 FiberChek Screen (Dirty Fiber) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-103
5-56 Fiber Optic Cable Mated to Inspection Probe Barrel . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-104
5-57 CleanBlast System. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-105
5-58 Cleaning Tip Threaded Onto Handset . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-105
5-59 Solvent Reservoir . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-106
5-60 CleanBlast System Interior . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-107
5-61 Replacement of Filters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-108
5-62 Dust Cap Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-108
5-63 End Face Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-109
5-64 Drying of End Face . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-109
5-65 Sleeve Holder Removal . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-109
5-66 End Face Cleaning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-110
5-67 Drying of End Face . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-110
5-68 Fiber End Face Examples Showing Critical Core Area . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-111
5-69 Acceptable Fiber Optic: Clean, no debris or contamination on the core of the fiber end face. . . . . . . . . . . . . . . . . . . . . . . 5-111
5-70 Rejected Fiber Optic: Dust particles on fiber end face, potential contamination of the core. . . . . . . . . . . . . . . . . . . . . . . . 5-111
5-71 Rejected Fiber Optic: Powders, contamination on the fiber end face, including core. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-112
5-72 Rejected Fiber Optic: Oils, residue remaining on the fiber end face, including core.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-112
5-73 Rejected Fiber Optic: Alcohol, staining of the fiber end face. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-112
5-74 Acceptable Fiber Optic: Light polishing scratches across the surface of the fiber; however, light through the core is readily
visible. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-113
5-75 Rejected Fiber Optic: Residue, oil from bare hands while handling of the fiber optic cable. . . . . . . . . . . . . . . . . . . . . . . . 5-113
5-76 Rejected Fiber Optic: Foreign material in core area. Light through the core is not visible. . . . . . . . . . . . . . . . . . . . . . . . . 5-113
5-77 Rejected Fiber Optic: Scratches across face of fiber, typical of coarse polish. Light through the core is not visible. . . 5-114
5-78 Acceptable Fiber Optic: Very light or no scratches on the fiber end face surface although light polishing marks are visible
around the fiber. Light through the core is readily visible. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-114
5-79 Acceptable Fiber Optic: Smooth, no evidence of polishing marks or other deformation. Light through the core is readily
visible. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-114
5-80 Rejected Fiber Optic: Radial cracks are not acceptable. They may propagate into the core area. . . . . . . . . . . . . . . . . . . . 5-115
5-81 Rejected Fiber Optic: Damage from improperly inserting fiber end face contact into connector (too much force). . . . 5-115
5-82 Rejected Fiber Optic: A pit from leaving debris on the fiber end face and using a locking fiber connector. . . . . . . . . . . 5-115
5-83 Rejected Fiber Optic: Fiber end face surface pulverized. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-116
5-84 Rejected Fiber Optic: Severe chip and cracking.. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-116
5-85 Rejected Fiber Optic: Heavy cracks and chips. Core area damaged. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-116
5-86 Rejected Fiber Optic: Deep edge and surface cracks and chips. Core area damaged. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-117
5-87 Rejected Fiber Optic: Cracks and minor damage on surface. Light through the core is not visible. . . . . . . . . . . . . . . . . . 5-117
5-88 Contact Installation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-117
5-89 Connector Cavity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-118
5-90 Connector Keying Cavity. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-118
5-91 Minimum Bend Radius. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-119
5-92 Fiber Instrument Sales Pocket Fault Locator F19000 . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-120
5-93 Break in Fiber Optic Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-120
5-94 EXPO Visual Fault Locator . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-121
5-95 Microbend. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-121
5-96 Damaged Fiber Optic Cable Jacket . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-122
5-97 Stress Point . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-122
5-98 BGA Device . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-122
5-99 Air-Vac Onyx 29 Hot Gas Rework Station . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-123
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5-100 Air-Vac Machine Enclosure. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-124
5-101 Aluminum Foil Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-125
5-102 Board Substrate Heat Sink . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-125
5-103 Cooling Port at Low Velocity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-125
5-104 Acceptable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-132
5-105 Acceptable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-132
5-106 Acceptable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-133
5-107 Acceptable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-133
5-108 Acceptable Shrinkage Voids . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-134
5-109 Rejected Shrinkage Voids . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-134
5-110 Rejected Shrinkage Voids . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-134
5-111 Acceptable Solder Fillet Lifting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-135
5-112 Rejected Solder Fillet Lifting . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-135
5-113 Acceptable SMD Solder. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-136
5-116 Rejected SMD Solder . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-137
6-1 Static Safeguarded Workstation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-11
A-1 Memory Aid for Remembering Ohm's Law . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-10
A-2 Coaxial Cable . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-11
A-3 Grasshopper Fuse (Screw Down Type) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-11
A-4 Grasshopper Fuse (Plug-In Type) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-12
A-5 Carbon Composition Resistor Codes (Military Marking System) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-14
A-6 DOT - Band System . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-15
A-7 Metal Film Resistor Codes with Failure Rate Coding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-16
A-8 Wire Wound Resistor Codes with Failure Rate Coding . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-17
A-9 Resistive Networks - DIP and SIP . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-18
A-10 Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-19
A-11 Ceramic Capacitors . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-19
A-12 Dipped Tantalum Capacitor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-21
A-13 Coils. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-22
A-14 Diodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-23
A-15 Diode Bands . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-23
A-16 Typical Diode Polarity Guide . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-24
A-17 Light Emitting Diodes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-25
A-18 Silicon Controller Rectifier . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-25
A-19 Transistors. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-27
A-20 Field Effect Transistor . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-28
A-21 Transistor Diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-29
A-22 DIP and Metal Can . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-30
A-23 Relay . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-30
A-24 Surface Mount Device Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-31
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Number Title Page

1 Related Specifications. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .xi
1 Eliminated Class 2 Ozone Depleting Chemicals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . xvii
1-1 National Fire Protection Association Codes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-1
1-2 Non-Alcohol Solvents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2
1-3 Alcohols . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4
1-4 Obsolete Organic Solvents List and Preferred Rockwell Collins Part Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-5
1-5 Obsolete Alcohol References and Preferred Rockwell Collins Part Number . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-6
1-6 Flux Cleaning Chemicals . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
1-7 General Cleaning Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-7
1-8 Approved Fluxes and Pastes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-8
1-9 Approved Solder Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-9
1-10 Approved Lead Free Solder Materials. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
1-11 Fluxes For Use With Lead Free . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
1-12 De-Solder Braid . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-10
1-13 Conformal Coating Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-11
1-14 Chemical Conversion Coatings. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
1-15 Rockwell Collins Approved Paints . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-12
1-16 Adhesives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-16
1-17 Thread Locking Compounds . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-17
1-18 Preferred Lubricants . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-18
1-19 Aircraft Instrument Repair Material Replacements. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-19
2-1 Preferred Tools. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1
2-2 Crimp Tool Index . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4
2-3 Preferred Soldering Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11
2-4 Preferred Electrostatic Discharge Materials . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-11
4-1 Fixed Capacitor Inspection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3
4-2 Wire Nicked/Broken Strand Allowance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8
5-1 Cable Data (Part 1 is -001). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-43
5-2 Cable Data (Part 2 is -002). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-44
5-3 Contact, Wire, and Crimp Tool Data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-50
5-4 Crimp Tensile Strength. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-52
5-5 Uninsulated Wire Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-55
5-6 Uninsulated Wire Requirements . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-60
5-7 Common Adhesives . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-74
5-8 Minimum Material Thickness . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-89
5-9 Recommended Drill Size . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-90
5-10 Heli-coil Tap Part Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-90
5-11 Heli-coil Tooling Part Numbers . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-91
5-12 Camloc Tangless Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-91
5-13 Torque Requirements for Setscrews. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-92
5-14 Allowable Bend Radius for Repair of Wire, Cable, or Wire/Cable Bundle . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-93
5-15 List of Nylon Cable Ties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-94
5-16 List of Plastic Loop Clamps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-95
5-17 List of Cushioned Metal Loop Clamps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-96
5-18 List of Wire Routing Clamps. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-98
5-19 Fiber Optic Repair Tools . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-99
5-20 Fiber Optic Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-101
6-1 ESDS Workstation Test Equipment . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-11
A-1 Inches, Fractions, and Decimals to Millimeters . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-2
A-2 Temperature Conversion Chart . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-4
A-3 Conversion Formulas for Length, Area, Volume, Liquid Measure,Weight, Torque, and Pressure. . . . . . . . . . . . . . . . . . . . . A-5
A-4 Decimal Feet to Inches (Nearest 16th). . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-6
A-5 Inches and Fractions to Decimal Feet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-6
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523-0768039
LIST OF TABLES
Number Title Page

A-6 Standard Metal Gauges. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-7
A-7 Recommended Drill Sizes for Thread Forming Taps . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-8
A-8 Coaxial Cable Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-10
A-9 Grasshopper Fuse (Screw Down Type) Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-11
A-10 Grasshopper Fuse (Plug-In Type) Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-13
A-11 Ceramic Capacitor Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-20
A-12 Tantalum Capacitor Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-21
A-13 Banded Diodes that Exceed Four Bands Information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-24
ix/(x Blank)
523-0768039
INTRODUCTION
1. COMMENTS.
The Avionics Standard Shop Practices instruction book is prepared by Rockwell Collins and is primarily a reference publication.
This manual is applicable to Rockwell Collins Component Maintenance Manual (CMM)s used in the maintenance of Rockwell
Collins equipment.
a. This manual establishes the standards for workmanship acceptability criteria, inspection requirements, repair procedures, and
product modifications. The criteria in this publication can include industry standard acceptance criteria. Additional criteria has
been developed by Rockwell Collins when necessary.
b. Refer to Table 1 for a list of related industry specifications.
Table 1. Related Specifications
Specification Description
ANSI-J-STD-006 Requirements for Electronic Grade Solder Alloys and Fluxed & Non-Fluxed
Solid Solders for Electronic Applications
ANSI-J-STD-005 Requirements for Soldering Pastes
ATA Spec 300 Specification for Packaging of Airline Supplies
IPC-A-610 Acceptability of Electronic Assemblies
IPC-7711/7721 Rework of Electronic Assemblies/Repair and Modification of Printed Boards
and Electronic Assemblies
IPC/JEDEC J-STD-020C Moisture/Reflow Sensitivity Classification for Nonhermetic Solid State
Surface Mount Devices
IPC/EIA J-STD-001C, Class 3 Requirements for Soldered Electrical and Electronic Assemblies
STCI 037-0003-000 Sony Trans Com Process Specification
2. ACRONYMS AND ABBREVIATIONS.
ATR Air Transport Rack

AWG American Wire Gauge
B&S Brown & Sharp
BGA Ball Grid Array
C Centigrade
CAA Clean Air Act
CAS Chemical Abstract Services
CFC Chlorofluorocarbon
cm Centimeter
CMM Component Maintenance Manual
CMOS Complementary Metal-Oxide Semiconductor
COM Common
CONN Connector
CPN Rockwell Collins Part Number
CPU Central Processing Unit
CRT Cathode Ray Tube
DC Dow Corning
DIA Diameter
DIP Dual In-line Package
xi
introduction 523-0768039
E Voltage
E-stop Emergency Stop
EMI Electromagnetic Interference
EPA Environmental Protection Agency
ESD Electrostatic Discharge
ESDS Electrostatic Discharge Sensitive
ESH Environmental, Safety, and Health
F Fahrenheit
FET Field Effect Transistor
GA Gate Array
ga Gauge
GHz Gigahertz
HCFC Hydrochlorofluorocarbon
HEA High Efficiency Anti-Reflective
HFE Hydrofluoroethers
HMIS Hazardous Material Information System
I Current
I/O Input/Ouput
IC In-line Carrier
IC Integrated Circuit
IE Industrial Engineer
in Inch
INSUL Insulation
IPS Individual Part Specification
IR Infared
Isopropanol Isopropyl alcohol
KPa Kilo Paschal
kΩ kilohm
lb Pound
LCC Leadless Chip Carrier
LCD Liquid Crystal Display
LED Light Emitting Diode
LEN Length
LOC Locator
LRU Line Replaceable Unit
MB Megabyte
MEK Methyl Ethyl Ketone
MES Metal Semiconductor
MES Minimum Electrical Spacing
MM Multi-Mode
MOD Modulation
MOS Metal-Oxide Semiconductor
MPK Methyl Propyl Ketone
MTBR Mean Time Between Repairs
MΩ Megohm
NFPA National Fire Prevention Association
OD Outside Diameter
ODP Ozone Depleting Potential
ODS Ozone Depleting Substance
OSHA Occupational Safety and Health Administration
P Power
PC Personal Computer
PCA Printed Circuit Assembly
pfd Picofarad
PLCC Plastic Leaded Chip Carriers
POS Position
PROM Programmable Read-Only Memory
xii
introduction 523-0768039
PTFE Polytetrafluoroethylene
PTH Plated Through Hole
PWA Printed Wire Assembly
PWB Printed Wiring Board
QFP Quad Flat Pack
R Resistance
RAM Random Access Memory
RF Radio Frequency
RIB Ribbon
RT Room Temperature
RTV Room Temperature Vulcanizing
RWR Wire-Wound
SCR Silicon Controlled Rectifier
SL Shelf Life
SM Single Mode
SMD Surface Mount Device
SMT Surface-Mount Technology
SOIC Small Outline Integrated Circuits
SOT Small Outline Transistor
TFE Tetrafluoroethylene
TL Top Level
TTL Transistor-Transistor Logic
USB Universal Serial Bus
UUT Unit Under Test
V Voltage
V ac Volts alternating current
V dc Volts direct current
VFL Visual Fault Locator
ZIF Zero Insertion Force
To submit comments regarding this manual, please contact:
Rockwell Collins
350 Collins Rd NE, M/S 153-250
or send email to: pubstrain@rockwellcollins.com
xiii/(xiv Blank)
523-0768039
SAFETY SUMMARY
1. ADVISORIES INTRODUCTION.
The following are general cautions for the repair of electronics assemblies and the materials and processes used for such repairs.
Rockwell Collins is committed to sound Environmental, Safety, and Health (ESH) management wherever it does business around
the world. Rockwell Collins shares this commitment and has established environmental objectives and targets to prevent pollution
in the communities in which we operate. We continually strive to improve our environmental management processes to exceed
environmental regulatory requirements at our facilities worldwide.
2. HAZARDOUS MATERIALS.
Electronic equipment may have components that contain sealed materials (such as beryllium oxide, acids, lithium,
radioactive material, mercury, etc) that can be hazardous to your health. If the component enclosure seal is broken,
precautions must be taken against personal contact or inhalation, in accordance with Occupational Safety and
Health Administration (OSHA) requirements 49CFR 1910.1000, during equipment maintenance, disassembly, or
repair.
Hazardous material is any material or mixture of materials (solid, liquid, or gas) that can cause personal injury, illness or loss of
property even in the event that the injury or loss occurs from the mishandling or misuse of the material. This includes, but is not
restricted to, any materials that are toxic, carcinogenic, corrosive, irritant, combustible, flammable, or dangerously reactive. The
EPA-17 list of hazardous materials is provided in the following table.
EPA # MATERIAL
1 Benzene
2 Cadmium and Compounds
3 Carbon Tetrachloride
4 Chromium and Compounds
5 Chloroform (Trichloromethane)
6 Cyanides
7 Lead and Compounds
8 Mercury and Compounds
9 Methyl Ethyl Ketone (MEK, 2-Butanone)
10 Methyl Isobutyl Ketone (MIBK, Hexone, Hexaone)
11 Methylene Chloride (Dichloromethane)
12 Nickel and Compounds
13 Perchloroethylene (Tetrachloroethylene)
14 Toluene
15 Trichloroethane
16 Trichloroethylene
17 Xylene
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safety summary 523-0768039
3. OZONE DEPLETING CHEMICALS.

The following chemicals were declared as ozone-depleting Class-1 substances because of the U.S. Government Environmental Pro-
tection Agency (EPA) Clean Air Act (CAA). As a result, Chlorofluorocarbon (CFC) and Halon chemical production in the U.S.
ceased December 31, 1995. International customers are governed by their own laws. The London Amendment to the Montreal
Protocol for CFCs prohibits the manufacture of CFCs after December 31, 1999.
Group I (from section 602 of the CAA)

CFC-11 Trichlorofluoromethane
CFC-12 Dichlorodifluoromethane
CFC-113 1,1,1-Trichlorotrifluoroethane
1,1,2-Trichlorotrifluoroethane
CFC-114 Dichlorotetrafluoroethane
CFC-115 Monochloropentafluoroethane
Group II (from section 602 of the CAA)
Halon1211 Bromochlorodifluoromethane
Halon1301 Bromotrifluoromethane
Halon2402 Dibromotetrafluoroethane
Group III (from section 602 of the CAA)
CFC-13 Chlorotrifluoromethane
CFC-111 Pentachlorofluoroethane
CFC-112 Tetrachlorodifluoroethane
CFC-211 Heptachlorofluoropropane
CFC-212 Hexachlorodifluoropropane
CFC-213 Pentachlorotrifluoropropane
CFC-214 Tetrachlorotetrafluoropropane
CFC-215 Trichloropentafluoropropane
CFC-216 Dichlorohexafluoropropane
CFC-217 Chloroheptafluoropropane
Group IV (from section 602 of the CAA)
CCl4 - Carbon Tetrachloride
Group V (from section 602 of the CAA)
CFC-11 Trichlorofluoromethane Methyl Chloroform 1,1,1-Trichloroethane
Group VI (listed in the Accelerated Phaseout Final Rule)
C2H2F3Br C2H2F2Br2
C2H3F2Br C2H2FBr3
C2H3FBr2 C2HF2Br3
C2H3F2Br C2H2FBr3
C2H3FBr2 C2HF2Br3
xvi
C2H4Br C2HF3Br2
C3H2F2Br4 C2HF4Br
C3H2F3Br3 C2HFBr4
C3H2F4Br2 C3H3F4Br
C3H2F5Br C3H4F2Br2
C3H2FBr5 C3H4F3Br
C3H3F2Br3 C3H4FBr3
C3H3F3Br2 C3H5F2Br
C3H3FBr4 C3H5FBr2
C3HF2Br5 C3H6FBr
C3HF3Br4 C3HF4Br3
C3HFBr6 C3HF4Br3
CH2FBr C3HF5Br2
CHF2Br(HBFC-22B1) C3HF6Br
CHFBr2 C3HFBr6
CHF2Br(HBFC-22B1) C3HF6Br
3.1. Class 2 Ozone Depleting Chemicals.

Refer to Table 1 for a list of Class 2 Ozone Depleting Chemicals eliminated from Rockwell Collins.
Table 1. Eliminated Class 2 Ozone Depleting Chemicals
CHEMICAL NAME ODP1 CAS NUMBER

HCFC-21 (CHFC12) Dichlorofluo- 0.04 75-43-4
romethane
HCFC-22 (CHF2C1) Monochlorodiflu- 0.055 75-45-6
oromethane
HCFC-31 (CH2FC1) Monochlorofluo- 0.02 593-70-4
romethane
HCFC-121 (C2HFC14) 0.01-0.04 354-14-3
Tetrachlorofluoroethane
HCFC-122 (C2HF2C13) 0.02-0.08 354-21-2
Trichlorodifluoroethane
HCFC-123 (C2HF3C12) 0.02 306-83-2
Dichlorotrifluoroethane
HCFC-124 (C2HF4C1) 0.022 2837-89-0
Monochlorotetrafluoroethane
HCFC-131 (C2H2FC13) 0.007-0.05 359-28-4
Trichlorofluoroethane
HCFC-132b (C2HCFC212) 0.008-0.05 1649-08-7
Dichlorodifluoroethane
xvii
Table 1. Eliminated Class 2 Ozone Depleting Chemicals - Continued
HCFC-133a (C2H2F3C1) 0.02-0.06 75-88-7

Monochlorotrifluoroethane
HCFC-141b (C2H3FC12) 0.11 1717-00-6
Dichlorofluoroethane
HCFC-142b (C2H3F2C1) 0.065 75-68-3
Monochlorodifluoroethane
HCFC-221 (C3HFC16) 0.015-0.07 422-26-4
Hexachlorofluoropropane
HCFC-222 (C3HFC16) 0.01-0.09 422-49-1
Pentachlorodifluoropropane
HCFC-223 (C3HF3C14) 0.01-0.08 422-52-6
Tetrachlorotrifluoropropane
HCFC-224 (C3HF4C13) 0.01-0.09 422-54-8
Trichlorotetrafluoropropane
HCF-225ca (C3HF5C12) 0.025 422-56-0
Dichloropentafluoropropane
HCFC-225cb (C3HF5C12) 0.033 507-55-1
Dichloropentafluoropropane
HCFC-226 (C3HF6C1) 0.02-0.1 431-87-8
Monochlorohexafluoropropane
HCFC-231 (C3H2FC15) 0.05-0.09 421-94-3
Pentachlorofluoropropane
HCFC-232 (C3H2FC15) 0.008-0.1 460-89-9
Tetrachlorodifluoropropane
HCFC-233 (C3H2F3C13) 0.007-0.23 7125-84-0
Trichlorotrifluoropropane
HCFC-234 (C3H2F4C12) 0.01-0.28 425-94-5
Dichlorotetrafluoropropane
HCFC-235 (C3H2F5C1) 0.03-0.52 460-92-4
Monochloropentafluoropropane
HCFC-241 C3H3FC14) 0.004-0.09 666-27-3
Tetrachlorofluoropropane
HCFC-242 (C3H3F2C13) 0.005-0.13 460-63-9
Trichlorodifluoropropane
HCFC-243 (C3H3F2C13) 0.007-0.12 460-69-5
Dichlorotrufluoropropane
HCFC-244 (C3H3F2C1) 0.09-0.14 -
Monochlorotetrafluoropropane
HCFC-251 (C3H4FC13) 0.001-0.01 421-41-0
Trichlorofluoropropane
xviii
Table 1. Eliminated Class 2 Ozone Depleting Chemicals - Continued
HCFC-252 (C3H4F2C13) 0.005-0.04 819-00-1

Dichlorodifluoropropane
HCFC-253 (C3H4F3C1) 0.003-0.03 460-35-5
Monochlorotrifluoropropane
HCFC-261 (C3H5FC12) 0.002-0.02 420-97-3
Dichlorofluoropropane
HCFC-262 (C3H5F2C1) 0.002-0.02 421-02-03
Monochlorodifluoropropane
HCFC-271 (C3H6FC1) 0.001-0.03 430-55-7
Monochlorofluoropropane
1 Note: Refers to Ozone Depleting Potential (ODP) (lower is better).
4. SAFETY.
While performing maintenance procedures with the covers removed from a unit, service personnel are advised to
observe standard safety precautions, such as wearing safety glasses, to prevent personal injury.
5. FLAMMABILITY OF OIL.
The evaporation of some cleaning solutions, when in a confined space, can create enough heat to produce spon-
taneous combustion. Oil and solvent soaked rags should be stored in a closed metal container that is designed
specifically for that purpose.
6. ELECTROSTATIC DISCHARGE.
Electrostatic Discharge Sensitive (ESDS) devices are subject to damage by excessive levels of voltage and/or
current, just as are more conventional semiconductor devices such as bipolar transistors and Transistor-Transistor
Logic (TTL). However, the precautions normally used to protect semiconductors are not sufficient for the pro-
tection of ESDS components. Because of the very high electrical resistance of ESDS devices, these components
are susceptible to damage by electrical sources that cannot deliver enough energy to damage conventional semi-
conductors. The low-energy source that most commonly destroys ESDS devices is the human body which, in
conjunction with nonconductive garments and floor coverings, generates and retains static electricity. Assemblies
which are ESDS are so indicated using a label seen in Figure 1.
Figure 1. Electrostatic Discharge Label
xix
In order to adequately protect ESDS devices, the device and everything that contacts it must be brought to ground potential by
providing a conductive surface and discharge paths. Specifically, the following precautions must be followed:
a. De-energize or disconnect all power and signal sources and loads used with the unit.
b. Place the unit on grounded conductive work surface.
c. Ground the repair operator through a conductive wrist strap or other device using a 470 kilohm (kΩ) or 1 Megohm (MΩ) series
resistor to protect the operator.
d. Ground any tools, such as soldering equipment, which contacts the unit. Contact with the operator’s hand provides a sufficient
ground for tools that are otherwise electrically isolated.
e. When ESDS devices and assemblies are not in the unit, they should be on the conductive work surface or in conductive con-
tainers. When a device or assembly is inserted in or removed from a container, the operator should maintain contact with the
conductive portion of the container. Do not use plastic bags unless they have been impregnated with a conductive material.
7. EMI/RF SUSCEPTIBILITY.
It has been found that some programmable Integrated Circuit (IC) devices have experienced random errors due
to stray Radio Frequency (RF) and Electromagnetic Interference (EMI) fields. These programming errors occur
when the unit/assembly is without a dust cover and conductive connector cap. Refer to Table 2-4 for special
metallized bags that protect the uncovered unit from stray RF and EMI fields.
a. Do not handle ESDS devices unnecessarily or remove them from their packages until actually used or tested.
b. To prevent damage by transient voltages, only soldering irons having zero voltage potential at the tip should be used.
Many current solder stations do not meet ESDS requirements. Rockwell Collins Component Application Engi-
neering and Service Center Technical Support have defined a 50-volt spike as the maximum spike allowable for
solder stations used in the service centers. Refer to Paragraph 4.2.30 for the procedure to identify defective/unac-
ceptable solder stations. Soldering irons which meet the requirements of IPC J-STD-001 are acceptable.
8. CLEANING AGENTS.
Cleaning agents or processes must not functionally degrade materials or components. Isolated cases of unreadable markings are
acceptable.
9. FLUXES.
All cored wire solders, liquid fluxes, and paste fluxes must be approved Rockwell Collins materials (refer to Sec-
tion 1 (Materials)). These approved fluxes are all of the low solids (no clean) type. Stranded or braided wires or
solid wires with sleeving must be soldered with approved Rockwell Collins low solids (no clean) fluxes.
Flux residue may be left in place on a connection provided it does not interfere with inspection of the solder joint or does not bridge
to other conductors. The tops of all posts or terminals must be visibly clear of flux (for test purposes).
xx
10. LEAD FREE.
Assemblies processed with lead-free materials can only be reworked/repaired with Rockwell Collins approved
lead-free materials.
xxi/(xxii Blank)
523-0768039
CHAPTER 1
MATERIALS
1.1. INTRODUCTION.
This section contains lists of supplies necessary to perform any procedure contained in this manual. A description of what the
supplies are most generally used for is provided. When an item is listed as "or equivalent", it is the responsibility of the using party
to determine the equivalency of the material. Different container sizes of the same material as listed in the material specification
may be substituted and should not be considered nonconforming with this document.
1.2. MATERIALS.
This section contains a listing of the preferred, alternative, and obsolete parts number for materials used for Rockwell Collins ap-
proved rework/repair procedures.
1.2.1. Chemicals.
This section relates to various chemicals/solvents used for repair procedures. This section provides a cross reference of obsolete
Rockwell Collins Part Number (CPN)s for solvents to current preferred Rockwell Collins part numbers. Refer to Table 1-1 for a
listing of the National Fire Prevention Association (NFPA) Codes, with which all Rockwell Collins materials should be labeled.
As an alternative, the Hazardous Material Information System (HMIS) codes and labels may be used. See Figure 1-1 for a typical
chemical Hazard Label (example: 4-2-3 "4 for Health - 2 for Flammability - 3 for Reactivity").
Figure 1-1. Chemical Hazard Label
Table 1-1. National Fire Protection Association Codes
CODE BLUE RED YELLOW

HEALTH FLAMMABILITY REACTIVITY
4 Materials which on very short Materials which rapidly or completely Materials which are readily capable
exposure could cause death or vaporize at atmospheric pressure and of detonation or of explosive
major residual injury even though normal ambient temperature, or which decomposition or reaction at normal
prompt medical treatment were are readily dispersed in air and which temperatures and pressures.
given. burns readily.
1-1
MATERIALS 523-0768039
Table 1-1. National Fire Protection Association Codes - Continued
CODE BLUE RED YELLOW

HEALTH FLAMMABILITY REACTIVITY
3 Materials which on short exposure Liquids and solids that can be ignited Materials which are capable of
could cause death or major residual under almost all ambient temperature detonation but require a strong
injury even though prompt medical conditions. initiating source and which must
treatment were given. be heated under confinement before
initiation.
2 Materials which on intense or Materials that must be moderately heated Materials which readily undergo
continued exposure could cause or exposed to relatively high ambient violent chemical change.
temporary incapacitation or temperatures before ignition can occur.
possible residual injury unless
prompt medical treatment is given.
1 Materials which on exposure Materials that must be pre-heated before Materials which are normally stable
would cause irritation but only ignition can occur. which can become unstable in
minor residual injury even if no combination with other common
treatment is given. materials or at elevated temperatures
and pressures.
0 Materials which on exposure Materials that do not burn. Materials which are normally stable.
under fire conditions would offer
no hazard beyond that of ordinary
material.
1.2.1.1. Non-Alcohol Solvents. Refer to Table 1-2 for a listing of the non-alcohol solvents used for repair procedures. The Chem-
ical Abstract Services CAS designation refers to the number for the chemical. All pure chemicals have a designated CAS number
as a unique identifier. The "grade" refers to the overall purity of the solvent.
Table 1-2. Non-Alcohol Solvents
ITEM (PURITY) CAS1 ROCKWELL NFPA2 HAZARD DESCRIPTION

NUMBER COLLINS RATING
PART NUMBER
Acetone, Technical 67-64-1 005-2954-010 General cleaning solvent for flushing metal
Grade and electro-film gears.
Acetone, Spec 67-64-1 005-2954-130 Purer grade for critical cleaning

Grade applications.
Naphtha 8030-30-6 005-2954-060 Removes adhesive residue of tape and

stickers from plastic and painted surfaces.
Naphtha, VM & P 64742-89-8 005-2954-110 For use in critical cleaning applications

where a purer form of Naphtha is needed.
1-2
Table 1-2. Non-Alcohol Solvents - Continued

PART NUMBER
Hexane 110-54-3 005-2954-140 For use in critical cleaning applications.
Toluene 108-88-3 005-2954-090 Thinner and remover of Humiseal 1B31

and 1B73 acrylic conformal coating.
Xylene 1330-20-7 005-2954-100 Thinner and remover of Humiseal 1B31

and 1B73 acrylic conformal coating.
n-Heptane 142-82-5 005-2954-030 Cold cleaning, removes silicon based

greases. Also used on motor rotors
and brush rings and Liquid Crystal
Display (LCD)s.
Methyl Ethyl 78-93-3 005-2954-040 Used only for cleaning coating from metal
Ketone (MEK) chassis and metal mechanical parts.
HFE-7100 Blend 838-2545-020 Hydrofluoroether vapor degreasing solvent

163702-08-7
163702-07-6
Lacquer Thinner3 Mixture None Mixture of petroleum distillates used for
paint removal and thinning of coatings for
spray application
Stoddard Solvent4 64742-82-1 None Solvent very similar to Naphtha
Dry Cleaning 8052- 41- 3 None Fast evaporating solvent

Solvent
8042- 47- 5
Mineral Spirits 64742-88-7 005-2954-050 General use solvent
64742-95-6
1 Note: Refers to Chemical Abstract Services number. All pure chemicals have a designated CAS number as a unique identifier.
2 Note: National Fire Protection Association (example: 1-3-1 = Health - Flammability - Reactivity - Other)
3 Note: Lacquer thinner is a generic name for a blend of petroleum distillate solvents. All commercially available solvents
marketed as "lacquer thinner" have a varying composition.
4Note: Also known as "dry cleaning solvent" and has multiple CAS numbers. This is a complex combination of C9-C12
hydrocarbons, exact composition varies.
1-3
Table 1-2. Non-Alcohol Solvents - Continued

PART NUMBER
NOTE
The common solvent blends listed as lacquer thinner. Stoddard solvent, dry cleaning solvent and mineral spirits are all
blends of different petroleum distillate solvents and all vary in exact composition. For the purposes of this document, the
exact composition of the solvent is not critical.
NOTE
Water is also a solvent. When water is listed in any Rockwell Collins repair procedure, the purity of the water is important.
Tap water varies dramatically around the world, and often carries chemicals and minerals harmful to the long term reliability
of electronic assemblies. The minimum acceptable water purity is reverse-osmosis treated water (500 kilohm (kΩ)-Cen-
timeter (cm) or greater resistivity). The preferred water purity is deionized (1 Megohm (MΩ)-cm or greater resistivity) or
distilled water. For procedures requiring very pure water, distilled water is preferred.
1.2.1.2. Alcohol Solvents. Refer to Table 1-3 for a listing of the non-alcohol solvents used for repair procedures. The CAS desig-
nation refers to the Chemical Abstract Services number for the chemical. All pure chemicals have a designated CAS number as a
unique identifier. The "grade" refers to the overall purity of the solvent.
Table 1-3. Alcohols
ITEM CAS1 ROCKWELL NFPA2 HAZARD DESCRIPTION

(PURITY) NUMBER COLLINS RATING
PART
NUMBER
Alcohol, Methyl 67-56-1 005-2941-050 Used to remove surface dirt and oils from LCD
(Methanol) displays4.
Alcohol, 67-63-0 005-2941-080 Removes excess rosin flux, cleans variable

Isopropyl resistor contact surfaces, and relay and switch
(Isopropanol) contacts.
Alcohol, 64-17-5 005-2941-110 General alcohol solvent
Denatured3
67-56-1
141-78-6
108-10-1
64742-89-8
Alcohol, Butyl 71-36-3 005-2941-120 General alcohol solvent
Butanol
1 Note: Refers to Chemical Abstract Services number. All pure chemicals have a designated CAS number as a unique identifier.
2 Note: National Fire Protection Association (example: 1-3-1 = Health - Flammability - Reactivity - Other).
1-4
Table 1-3. Alcohols - Continued
ITEM CAS1 ROCKWELL NFPA2 HAZARD DESCRIPTION

(PURITY) NUMBER COLLINS RATING
PART
NUMBER
3 Note: Exact composition varies depending on chemicals used for denaturing.
4 Note: Refer to Section 2 (Tools), Paragraph 3.3.14.3 for cleaning procedures for Rockwell Collins LCD displays.
1.2.1.3. Obsolete Solvent References. Refer to Table 1-4 for a listing of obsolete Rockwell Collins solvent part numbers, along
with the preferred Rockwell Collins part number or material. Refer to Table 1-5 for a listing of obsolete Rockwell Collins part
numbers for various alcohols.
Table 1-4. Obsolete Organic Solvents List and Preferred Rockwell Collins Part Number
SOLVENT DESCRIPTION OBSOLETE PART NUMBER PREFERRED ROCKWELL

COLLINS PART NUMBER
Acetone, Technical Grade1 005-0198-000 005-2954-010
Acetone, Higher than Reagent Grade1 005-0198-000 005-2954-020
Heptane, Normal 005-1292-010 005-2954-030
Methyl Ethyl Ketone, Technical Grade 005-0771-000, 020 005-2954-040
Mineral Spirits 005-1928-010 005-2954-050
Depolarized Naptha2 005-1928-020 005-2954-060
Toluene, Electronic Grade 005-1401-010 005-2954-070
Toluene, Reagent Grade 005-1673-010 005-2954-080
Toluene, Technical Grade 005-1497-010 005-2954-090
838-2528-010/030
Xylene, Technical Grade 005-0896-000 005-2954-100
Naphtha, VM & P2 005-1259-000 005-2954-110
Methyl Propyl Ketone (MPK) - 005-2954-120
Acetone, Spectranalyzed Grade3 - 005-2954-130
Hexane, Spectranalyzed Grade3 - 005-2954-140
Freon TF (CFC) 4 None 005-2969-010 (Chemtronics Flux Off
HD)
Genesolv 2004 None 005-2970-010/020 (Microcare Vericlean)
Tech Spray 1676 None 005-3205-010 (Kyzen Cybersolve 141R)
Tech Spray 1663 005-2956-010/020 005-3205-010 (Kyzen Cybersolve 141R)
Tech Spray 1669 005-2957-010 005-3205-010 (Kyzen Cybersolve 141R)
AK-255 4 None 005-2956-020 (Tech Spray)
1 Note: For critical cleaning applications, -130 may be used as a drop-in replacement for -010 and -020.
1-5
Table 1-4. Obsolete Organic Solvents List and Preferred Rockwell Collins Part Number - Continued
SOLVENT DESCRIPTION OBSOLETE PART NUMBER PREFERRED ROCKWELL

COLLINS PART NUMBER
2 Note: For critical cleaning applications, -140 may be used as a drop-in replacement for -060 and -110.
3 Note: -130 and -140 materials are purchased in amber glass bottles, 1 liter size.
4 Note: Chlorofluorocarbon (CFC) and Hydrochlorofluorocarbon (HCFC) materials are banned substances. The suggested
replacements are Hydrofluoroethers (HFE)s.
Table 1-5. Obsolete Alcohol References and Preferred Rockwell Collins Part Number
DESCRIPTION OBSOLETE PART NUMBER PREFERRED ROCKWELL

COLLINS PART NUMBER
Solvent, Methyl Alcohol 005-0412-000 005-2941-010
Anhydrous Methyl Alcohol, Reagent, ACS 005-1351-010 005-2941-020
Higher than Reagent Grade Methanol 005-1378-010 005-2941-030
Higher than Reagent Grade Methanol 005-1378-030 005-2941-040
Reagent Grade Methanol 005-2396-010 005-2941-050
Reagent Grade Ethanol 005-2656-010 005-2941-060
Ethyl Alcohol 838-2527-010 005-2941-070
005-1694-010
Anhydrous Isopropyl Alcohol (Technical Grade) 005-0837-000 005-2941-080
Higher than Reagent Grade 2-Propanol (Isopropyl 005-1377-010 005-2941-090
Alcohol)
005-1377-020
005-3166-010
Reagent Grade Isopropyl Alcohol 838-2516-010 005-2941-100
005-1203-010
005-1345-010
Solox Anhydrous Denatured Alcohol 005-1413-010 005-2941-110
Butyl Alcohol 005-3172-010 005-2941-120
1.2.1.4. Flux Removal Agents. Refer to Table 1-6 for a listing of preferred Rockwell Collins flux removal chemicals by vendor
and formulation name. These materials are preferred for the fluxes and pastes described later. Toluene is NOT an acceptable flux
removal agent. The last column of Table 1-6 indicates whether the flux remover requires an Isopropyl alcohol (Isopropanol) rinse
or cleaning step following flux removal.
1-6
Table 1-6. Flux Cleaning Chemicals
ITEM ROCKWELL NFPA HAZARD DESCRIPTION ISO-

COLLINS PART RATING PROPANOL
NUMBER RINSE
Chemtronics Flux Off 005-2969-010/020 Flux Remover No
Microcare Vericlean 005-2970-010/020 Flux Remover No
Petroferm Bioact SC-10 838-2543-010/020 Flux Remover Yes
Kyzen Ionox BC 005-3508-030 Flux Remover Yes
Microcare Proclean 005-2892-010 Flux Remover Yes
Petroferm Bioact EC-7M, Distributed by 838-2038-010 Flux Remover Yes

Microcare
Kyzen Cybersolve 141R 005-3205-010 Flux Remover No
Electrolube Fluxclene Commercially Flux Remover No

Available
1.2.1.5. Detergents and General Cleaning Agents. Refer to Table 1-7 for a listing of preferred Rockwell Collins detergents and
general cleaning agents.
Table 1-7. General Cleaning Materials
ITEM ROCKWELL COLLINS NFPA HAZARD RATING DESCRIPTION

PART NUMBER
Alconox Alcojet® None Detergent
Alconox Liqui-Nox® 045-0053-049 Detergent
1-7
Table 1-7. General Cleaning Materials - Continued

PART NUMBER
Alconox Alconox® 005-1342-010 Detergent
S.C Johnson Blue Windex® None Generic glass cleaner (Not

recommended for LCD Displays)
Glissen 001-0012-000 Generic glass cleaner, 32 oz spray

bottle (Not recommended for LCD
Displays)
MICRO90 005-1679-010 Liquid Cleaner, Quart
1.2.1.6. LCD Cleaning System. For the cleaning of LCD displays, Rockwell Collins recommends the use of CPN 005-8414-010.
This is a set of three microfiber wipes, dampened with solvents. The first wipe is dampened with high purity isopropyl alcohol. The
second wipe is dampened with deionized/distilled water. The third wipe is dry. The microfiber wipes provide superior cleaning and
the solvents are all gentle enough to use on the sensitive LCD surfaces. Alternatively, the microfiber wipes can be obtained from
Miliken Micro-Fibre (part number 492265-606) and moistened with isopropyl alcohol and deionized/distilled water.
1.2.1.7. Soldering Materials. Refer to Table 1-8 through Table 1-12 for the solders, fluxes and pastes used on Rockwell Collins
products. No other solders, fluxes, or pastes are allowed. Flux thinners are not allowed.
Table 1-8. Approved Fluxes and Pastes
ITEM ROCKWELL COLLINS FORM NFPA J-STD-004 DESCRIPTION

PART NUMBER and HAZARD CLASSFICA-
VENDOR DESIGNATION RATING TION
Flux 005-3001-140 Liquid ROL0 Preferred
Alpha SM 351F
Flux 005-3001-160 Liquid ORL0 Preferred

Kester 958
Flux 005-3001-180 Liquid ROL0 Preferred

Kester 922CX
Flux 005-3001-240 Liquid ORL0 Preferred

Kester 959
Paste 005-3001-250/270 Paste ROL1 Preferred

Alpha UP78
1-8
Table 1-8. Approved Fluxes and Pastes - Continued

PART NUMBER and HAZARD CLASSFICA-
Paste 005-3001-210 Paste ROL0 Alternate
Alpha LR725LV
Table 1-9. Approved Solder Materials
J-STD-006 ROCKWELL COLLINS FORM NFPA J-STD-004 DIAMETER

CLASS PART NUMBER and HAZARD CLASSFICA- (inches)
SN63PB37 005-3000-070 Cored Wire ROL0 0.021 inch
Kester 245

Kester 245

Alpha Telecore Plus
SN62PB36AG02 005-3000-360 Cored Wire, ROL0 .031 inch

Silver
Kester 245
SN62PB36AG02 005-3000-720 Cored Wire, ROL0 .032 inch
Silver
Alpha Telecore Plus
Alpha Telecore Plus
SN63PB37 005-3003-250 Solder Paste ROL0 Type 3 paste

Indium NC-SMQ92J
SN63PB37 005-3003-220 Solder Paste ROL1 Type 3 paste

Alpha UP78M
1-9
Table 1-10. Approved Lead Free Solder Materials
J-STD-006 CLASS ROCKWELL COLLINS FORM NFPA HAZARD DIAMETER (inches)

PART NUMBER RATING
and VENDOR
DESIGNATION
SN96.5AG3.0CU0.5 005-4000-020 Cored Wire 0.015 inch
Indium 52363 Flux Percentage 3

Multicore Solders Flux Percentage 2
97SC CRYSTAL 502
MM02177
Multicore Solders Flux Percentage 2
97SC CRYSTAL 502
MM02179
Table 1-11. Fluxes For Use With Lead Free

PART NUMBER HAZARD CLASSFICA-
and VENDOR RATING TION
DESIGNATION
Flux, Tacky 005-3001-250/270 Flux Tacky ROL1 Preferred
Alpha UP78
Table 1-12. De-Solder Braid
ROCKWELL COLLINS PART NUMBER VENDOR PART NUMBER DESCRIPTION

005-3004-220 Techspray 1822-50F .075 inch wide x 50’ ESD safe spool
005-3004-100 Chemtronics 60-1-10 .030 inch wide x 10’ ESD safe spool
1-10
1.2.2. Paints and Coatings.

Refer to Table 1-13 for a listing of Rockwell Collins conformal coatings and conformal coat remover materials. Adhesives and
coatings should not be mixed, temporarily stored in, or placed on paper/cardboard pieces or containers. Refer to Table 1-14 for a
listing of approved chemical conversion coatings used to protect metal surfaces. Refer to Table 1-15 for a listing of Rockwell Collins
approved paints.
Table 1-13. Conformal Coating Materials
ITEM ROCKWELL COLLINS NFPA HAZARD DESCRIPTION

PART NUMBER RATING
Humiseal 1B31 821-0650-020/040 Pure acrylic coating in
toluene/xylene/MEK solvent
Acrylic Conformal Coating
Humiseal 1B73 821-0650-040 Pure acrylic coating in a MEK/t-butyl

acetate solvent
Humiseal 1H20AR1/S2 821-1669-010 Water based acrylic coating, thin

viscosity for spray application
Humiseal 1H20AR1/D2 821-1669-050 Water based acrylic coating, Thick

viscosity for repairs
Humiseal 1H20AR1-BOV2 821-1669-040 Water based acrylic coating,

pressurized spray can
Cytec Industries 821-0635-010 Two-part solvent based urethane

conformal coating
Conathane CE-115 (2 part kit)
Urethane Conformal Coating
Dow Corning 1-2577 821-0749-010/020 Silicone based conformal coating
Silicone Conformal Coating
Krylon 1301 005-0364-000 Clear acrylic conformal coating

Clear Acrylic Spray
Trace Technologies3 005-3512-030 For localized removal of Humiseal

1H20AR1 and 1B31 coatings
Conformal Coat Remover Pen (Pen)
Chemtronics 005-3512-010 For localized removal of Humiseal

1H20AR1 and 1B31 coatings
Conformal Coat Remover Pen (Pen)
Chemtronics 005-3512-020 For localized removal of Humiseal

1H20AR1 coating
Electro wash (two step)
1 Note: Throughout this document, the term "postcoat" refers to conformal coating.
1-11
Table 1-13. Conformal Coating Materials - Continued

PART NUMBER RATING
2 Note: Humiseal 1H20AR1 coating is obsolete and no longer manufactured. Patch coating with Humiseal 1B31 is acceptable.
3 Note: These items contain strong chemical odors. Chemtronics Electro Wash is the preferred chemical for removing
1H20AR1 coating.
Table 1-14. Chemical Conversion Coatings

PART NUMBER RATING
Henkel Surface Technologies 005-2985-010 (Pen) Chemical conversion coating used to
produce a protective coating to reduce
Touch-N-Prep Alodine 1132
corrosion on aluminum alloys
MacDermid Iridite NCP1 Mil-DTL-5541 Type II Non-hexavalent, non-trivalent,
chromium chemical conversion
Non-Chromate Conversion
coating used to produce a protective
Coating
coating to reduce corrosion on
aluminum alloys
1 Note: NCP non chromate passivation. This is a chemical process.
Table 1-15. Rockwell Collins Approved Paints
ROCK- COLOR ROCKWELL FEDERAL CONTAINER GLOSS (%)

WELL COLLINS CODE SIZE
COLLINS COLOR NUMBER
PART NUM- NUMBER
BER
005-8360-010 Gray 176 --- 16 oz Aerosol 15-25
005-8360-020 Gray 230 --- 16 oz Aerosol ---
005-8360-030 Gray 178 --- 16 oz Aerosol ---
005-8360-040 Gray 140 --- 16 oz Aerosol 55-65
005-8360-050 Black 301 27038-58 16 oz Aerosol 15-25
005-8360-060 Gray 283 36118 16 oz Aerosol 6 max
005-8360-070 Red 436 11136-61 16 oz Aerosol 80 min
005-8360-080 Black 302 37038-61 16 oz Aerosol 6 max
005-8360-090 Earth Gray 156 --- 16 oz Aerosol 20-35
005-8360-100 Earth Brown 489 --- 16 oz Aerosol 20-35
005-8360-110 White 106 37875-58 16 oz Aerosol 6 max
005-8360-120 Terra Cotta 477 --- 16 oz Aerosol ---
1-12
Table 1-15. Rockwell Collins Approved Paints - Continued

PART NUM- NUMBER
BER
005-8360-130 Gray 176 --- 1/2 Pint can 15-25
005-8360-140 Gray 230 --- 1/2 Pint can ---
005-8360-150 Gray 178 --- 1/2 Pint can ---
005-8360-160 Gray 140 --- 1/2 Pint can 55-65
005-8360-170 Black 301 27038-58 1/2 Pint can 15-25
005-8360-180 Gray 283 36118 1/2 Pint can 6 max
005-8360-190 Red 436 11136-61 1/2 Pint can 80 min
005-8360-200 Black 302 37038-61 1/2 Pint can 6 max
005-8360-210 Earth Gray 156 --- 1/2 Pint can 20-35
005-8360-220 Earth Brown 489 --- 1/2 Pint can 20-35
005-8360-230 White 106 37875-58 1/2 Pint can 6 max
005-8360-240 Terra Cotta 477 --- 1/2 Pint can ---
005-8360-250 Yellow Zinc Chromate N/A --- 16 oz Aerosol N/A
Primer
005-8360-260 Gray 127 26373-68 16 oz Aerosol 15-25
005-8360-270 Gray 127 26373-68 1/2 Pint can 15-25
005-8360-280 Gray 130 26307 16 oz Aerosol 20-35
005-8360-290 Gray 130 26307 1/2 Pint can 20-25
005-8360-310 Gray 283 36118 1/2 Pint can 6 max
005-8360-320 Green Formula 150 407 24272 16 oz Aerosol N/A
005-8360-330 Green Formula 150 407 24272 1/2 Pint can N/A
005-8360-340 Haze Gray Formula 151 183 26270 16 oz Aerosol 30 max
005-8360-350 Haze Gray Formula 151 183 26270 1/2 Pint can 30 max
005-8360-360 Dark Gray Formula 155 228 --- 16 oz Aerosol 30 max
005-8360-370 Dark Gray Formula 155 228 --- 1/2 Pint can 30 max
005-8360-380 Olive Drab 409 34098 16 oz Aerosol 1 max
005-8360-390 Olive Drab 409 34098 1/2 Pint can 1 max
005-8360-400 Gray 190 36231-61 16 oz Aerosol 6 max
005-8360-410 Gray 190 36231-61 1/2 Pint can 6 max
005-8360-420 Gray 191 36231-58 16 oz Aerosol 5-15
005-8360-430 Gray 191 36231-58 1/2 Pint can 5-15
1-13

PART NUM- NUMBER
BER
005-8360-440 Blue 470 - 16 oz Aerosol 5-12
005-8360-450 Blue 470 --- 1/2 Pint can 5-12
005-8360-460 White 101 --- 16 oz Aerosol 45-55
005-8360-470 White 101 --- 1/2 Pint can 45-55
005-8360-480 Green 383 411 34094 16 oz Aerosol 1.0
005-8360-490 Green 383 411 34094 1/2 Pint can 1.0
005-8360-500 White 138 17886 16 oz Aerosol 90 min
005-8360-510 White 138 17886 1/2 Pint can 90 min
005-8360-520 Olive Drab 410 34086 16 oz Aerosol 7.0
005-8360-530 Olive Drab 410 34086 1/2 Pint can 7.0 max
005-8360-540 Gray --- 26492 16 oz Aerosol 5-15
005-8360-550 Gray --- 26492 1/2 Pint can 5-15
005-8360-560 Boeing Gray 243-66 36118 16 oz Aerosol 6 max
005-8360-570 Boeing Gray 243-66 36118 1/2 Pint can 6max
005-8360-580 Boeing Brown 8328 474 --- 16 oz Aerosol 4 max
005-8360-590 Boeing Brown 8328 475 --- 1/2 Pint can 4 max
005-8360-600 Gray --- 26099 16 oz Aerosol 15-25
005-8360-610 Gray --- 26099 1/2 Pint can 15-25
005-8360-620 Beige 145 --- 1/2 Pint can 4 max
005-8360-630 Gray 182 --- 1/2 Pint can 6 max
005-8360-640 Gray 182 --- 16 oz Aerosol 6 max
005-8360-650 Gray --- 26081 1/2 Pint can 15-25
005-8360-660 Gray --- 26081 16 oz Aerosol 15-25
005-8360-670 Instrument Tan 167 --- 1/2 Pint can N/A
005-8360-680 Instrument Tan 167 --- 16 oz Aerosol N/A
005-8360-690 Silver Gray Metalic 290 --- 0.6 oz Brush-in- N/A
cap Bottle
005-8360- Silver --- --- 16 oz Aerosol N/A
7001
005-8360-710 Yellow Zinc Chromate N/A --- 1/2 Pint can N/A
Primer
005-8360-720 Gray (Semigloss) --- 26152 16 oz Aerosol 15-35
1-14

PART NUM- NUMBER
BER
005-8360-730 Gray (Semigloss) --- 26152 1/2 Pint can 15-35
005-8360-750 Biege 125 --- 16 oz Aerosol 4 max
005-8360-770 Gray 344 36373 1/2 Pint can 6 max
005-8360-790 Silver Gray Metalic 290 --- 12 oz Aerosol can N/A
005-8360-800 Boeing Brown 8924 479 --- 16 oz Aerosol 4 max
005-8360-810 Boeing Brown 8924 479 --- 1/2 Pint can 4 max
005-8360-830 Gray 186 --- 1/2 Pint can 4 max
005-8360-840 Boeing Gray 721 --- --- 1/2 Pint can 5 max
005-8360-850 Boeing Gray 721 --- --- 16 oz Aerosol 5 max
1 Note: This paint for use on test equipment product only.
1.2.3. Adhesives.
Adhesives and coatings should not be mixed, temporarily stored in, or placed on paper/cardboard pieces or containers. One or
two component adhesives and sealants packaged in bulk quantities are thoroughly mixed to a uniform consistency and appearance
before they are removed from that container for weighing, measuring, or application onto product. This is necessary to ensure that
the settled fillers are properly dispersed and that the hardener components have not crystallized or separated. When using two or
more components (example: Part A and Part B) to prepare an adhesive or sealant, the two or more components are mixed together
for 1 to 3 minutes to obtain a homogenous mixture (uniform appearance) before the mixture is applied. Unless otherwise indicated,
vigorous whipping action should be avoided to prevent introduction of substantial air into mixture. Refer to Table 1-16 for adhesives
and Table 1-17 for thread locking compounds.
1-15
Table 1-16. Adhesives
APPLICATION ITEM ROCKWELL COLLINS DESCRIPTION

PART NUMBER
Adhesive, Pad and Conductor Scotchweld 2214NMF 005-1942-030/0401 100% solids, non-metal filled,
Bonding for Soldering and thixotropic epoxy adhesive
Non-soldering Applications
Eccobond 285 w/catalyst 9 or 243-0045-010/020 Thermally conductive, filled,
11 high strength, 100% solids,
two part, elevated or room
temperature curing epoxy
adhesive
Potting/Encapsulation Hysol RE2039 with HD0242 821-0013-010 (resin)2 Two part, epoxy potting
Hardener compound
821-0015-000 (hardener)
General Plate Repair Parts Araldite 2040 A/B 005-2936-010 Two-component, urethane
Staking adhesive
General purpose epoxy paste Araldite 2012 005-3210-010 Two part fast curing epoxy
adhesive paste adhesive
Parts Staking Dow Corning EA-6054 005-2984-010 (50 mL dual Primerless, thixotropic, heat
pack) curing silicone adhesive
Adhesive, Conductive Eccobond 56C w/Catalyst 9, 005-1021-010/020 Low Resistance, electrically
(Plating Repair) 11 or 24LV Conductive Epoxy Adhesive
And Catalyst
Adhesive, (Connector Repair) Eccobond 285 w/Catalyst 9 or 243-0045-010/080 Thermally conductive, filled,
11 high strength, 100% solids,
two part, elevated or room
temperature curing epoxy
adhesive
Adhesive, Conductive Trabond 2106T 005-2434-010/020 Fast cure, thixotropic epoxy
(Plating Repair) adhesive
Adhesive, (Filling and/or Armstrong A12 005-2826-010 Two-component kit, epoxy
Redrilling) or Mix by weight 3:2 (3 part A resin based adhesive
Resin Technology Group resin to 2 part B hardener) Specification: A-A-56015
A-56015-I-2-KT
Adhesive, (Flex PWB Repair) Polyamide Eccobond 45/ 005-0530-000/010 (hardener) Flexible epoxy adhesive with
Catalyst 15 catalyst
005-0532-000/010
Adhesive, (High Composites One LLC, 005-2299-010 Rigid polyester adhesive
Frequency-Insulating)3 Polyester Collar Cement
Parts Staking Dow Corning SE-1700 005-3201-010 Two-part thermal cure silicone
adhesive
Adhesive, (Wire-Bonding) ITW Devcon, RT Fast Curing 005-2030-0104 Room Temperature (RT) fast
14240 curing epoxy adhesive gel
Adhesive, Hot Melt 3M 3789 838-0005-010 Single component hot melt
1-16
Table 1-16. Adhesives - Continued
APPLICATION ITEM ROCKWELL COLLINS DESCRIPTION

PART NUMBER
Adhesive, Underfill, Loctite 4527 821-1646-010, (supplied Blue, one-part, high-purity
non-reworkable frozen) (low ionic content) epoxy
flip-chip underfill
Adhesive, Underfill, Loctite 3568 821-1661-010, (supplied Reworkable, dark gray to
reworkable frozen) black, liquid, one part, high
purity (low ionic content)
epoxy liquid underfill
Adhesive, Wire Bonding Loctite Ultra TAK PAK 38240 005-0225-010 Cyanoacrylate instant bond
Adhesive, Translucent Dow Corning RTV3145 005-3167-030 (10.3 oz) High strength, thixotropic,
Silicone 005-3167-040 (3 oz) non-corrosive silicone rubber
adhesive/sealant. One
part room temperature
vulcanizing. MIL-A-46146
Primer, Silicone Adhesives Dow Corning PR1200 005-1210-060 (Red) Primer used to improve
005-1210-070 (Clear) adhesion of room temperature
vulcanizing silicone rubber.
1Note: Preferred adhesive for BGA & NLIC pad repairs and is used unless the PWA being repaired contains heat sensitive
components that cannot withstand 125°C bake cycle for one hour, then the 243-0045-020 adhesive is used in its place.
2 Note: Adhesive is not used unless solder connections/terminations of the repaired conductive PWB feature are visible
after soldering process is completed.
3 Note: Limit use for high frequency and high heat assembly applications only.
4 Note: Recommended adhesive for product cleaned by an automated cleaning process.
Table 1-17. Thread Locking Compounds

PART NUMBER
Loctite 222MS 005-2028-010 (low strength) Thread locker for hardware
diameter of 0.25 inch or less
Permabond LM113
Loctite 242 005-2028-020 (medium Thread locker for hardware

strength) diameter of 0.25 inch to 0.75
Permabond MM115
inch
Loctite 262 005-2028-030 (high strength) Thread locker for hardware
diameter of 0.75 inch or more
Permabond HM118
Loctite 42540 (blue) 005-8402-010 For plastic hardware

applications
1-17
1.2.4. Lubricants.
Refer to Table 1-18 for a listing of Rockwell Collins preferred lubricants.
Table 1-18. Preferred Lubricants
ITEM SPEC MATERIAL FORM LUBRICANT BASE LUBRICANT

NUMBER TYPE
005-0201-000 Dow Corning (DC 4), Silicone Grease Dielectric Silicone
005-0206-010 Lead Phosphite Liquid Dry Film N/A
005-0219-010 Molybdenum Disulfide Liquid Dry Film Molybdenum Disulfide
005-0273-000 DC 200, Dimethyl Polysiloxane Liquid Damping Fluid Silicone
005-0274-010 DC 33, Silicone, Medium Grease Low Temperature Silicone
Consistency
005-0300-010 N/A Grease Anti - Wear N/A
005-0304-000 DC 44, Silicone Grease General Purpose Silicone
005-0432-000 DC 20, Silicone Liquid Release Agent Silicone
005-0502-000 DC 33, Silicone, Light Consistency Grease Low Temperature Silicone
005-0534-000 DC 111, Silicone Grease Stopcock Silicone
005-0662-000 Molybdenum Disulfide Grease - Molybdenum Disulfide
005-0810-010 Aeroshell 7, Diester Grease Low Temperature Diester Oil
005-0985-000 Graphite In Mineral Liquid Anti - Wear Graphite
005-1370-010 Fluoroglide 200, PTFE Powder Dry Film Polytetrafluoroethy-
lene (PTFE)
005-1469-020 MS - 143DF, TFE Liquid Release Agent Tetrafluoroethy-
lene (TFE)
005-1556-020 Thermalloy 251, Silicone and Zinc Paste Heat Sink Compound Silicone
Oxide
005-1709-020 Tribolube - 2N, Siloxane Grease Anti - Wear Fluorosilicone
005-2228-010 Heatbath SOL - U - Dip Proprietary Oil, Emulsifiable Rust Inhibitor Proprietary
Emuls Oil
005-2290-010 Silicone, Silver Filled Grease Electrically Silicone
Conductive
005-2955-010 DC 55, Silicone Grease O - Ring Silicone
005-2975-010 Castrol Braycote 803, Synthetic Grease O - Ring Perfluoroalkylether
005-2976-010 Krytox 240AB, Synthetic Grease O - Ring Perfluoroalkylether
005-2993-010 MS - 122AD, TFE Aerosol Release Agent Tetrafluoroethylene
005-2993-020 MS - 145 Liquid Dry Film Polytetrafluoroethylene
005-3200-010 Mold Release 122S Grease Mold Release Silicone
1-18
1.3. OTHER KNOWN OBSOLETE MATERIALS.

Refer to Table 1-19 for materials commonly used to repair and maintain electromechanical aircraft instruments. Listed are chem-
icals and materials that are no longer procurable, have been replaced by something more desirable or Environmental Protection
Agency (EPA)/Occupational Safety and Health Administration (OSHA) regulations prohibit their use. When an undesirable item
is specified in the repair manual, use the approved replacement in this table. This table serves as an interim until specific overhaul
manuals/component maintenance manuals are updated to the latest requirements.
Table 1-19. Aircraft Instrument Repair Material Replacements
UNDESIRABLE ITEM APPROVED ITEMS

ITEM CPN ITEM CPN NFPA HAZARD COMMENTS
RATING
Glyptal thinner, 1505 005-0164-000 Xylene 005-2954-100 Thin liquid stake
and remove
Humiseal
Versilube G-300, 005-0564-000 G-321 005-2881-010 Silicone grease
G-322L
005-2444-010
Pro-Seal #247B-2 005-0605-000 PR-1425 class 838-0013-030 (2 Window glass
B-1/2 oz, 2 pt kit) sealant (12 hr cure
(accelerator) time). Application
life 1/2 hr.
RTV-737 838-0004-010 Seal instrument
Adhesive (black, 3 oz tube) dial windows
(resin)
EC-870 None Dow Corning 005-3167-030 Bonding (use
3145 RTV Color (10.3 oz) primer when
Silastic 732 005-0701-000
- translucent 005-3167-040 (3 required)
Silastic 140 005-0701-010 silicone MIL-A- oz)
RTV3145 Gray 005-1531-010 46146
F-50 Gear lubrication 005-0559-000 SF-1147 838-6000-010 Silicone lubricant

005-0948-000
Gray Paint 005-8182-000 Gray Paint 005-8360-XXX Case touch up

paint
838-3520-XXX
Loctite Retaining 005-1546-010 Loctite 609 005-1230-010 Liquid stake
Compound (See matchpak)
Mil-A-5092 Adhesive 005-0293-000 EC 847 005-9042-000 Bonding
1-19
Table 1-19. Aircraft Instrument Repair Material Replacements - Continued
UNDESIRABLE ITEM APPROVED ITEMS

ITEM CPN ITEM CPN NFPA HAZARD COMMENTS
RATING
1711 Adhesive 005-1794-000 3M 847 005-9042-000 Bonding
EC-1357 005-0474-XXX 3M EC 1357 005-0474-010 Bonding
Solvent mix: None Tech Spray 005-2957-010 General cleaning,

Methylene 1669-T except for circuit
chloride and cards
Perchloroethylene,
Drycleaning solvent
Turcosol or Stoddard None Depolarized 005-2954-060 General cleaning,
Solvent PD 680 Naphtha except for circuit
cards
1-20
523-0768039
CHAPTER 2
TOOLS
2.1. INTRODUCTION.
This section lists the recommended tools and materials used on Rockwell Collins products. Refer to Table 2-1 for preferred tools.
Refer to Table 2-2 for a crimp tool index. Refer to Table 2-3 for preferred soldering tools. Refer to Table 2-4 for preferred electrostatic
discharge materials.
2.2. PREFERRED HAND TOOLS.

Refer to Table 2-1 for a list of the basic hand tools that should be included in any technician’s tool kit. It is a starter list and should
not be construed as the only tools necessary. All items listed should be readily available on a local basis. Paragraph 2.2.1 is a list of
commercially available tools that do not have an established Rockwell Collins Part Number (CPN).
Table 2-1. Preferred Tools
TOOL DESCRIPTION or ROCKWELL COLLINS PART NUMBER

Cutter, Full Flush Microshear 4 inch and 6 inch
Driver, Nut 5/32, 3/16, 1/4, 9/32, 5/16, 11/32, 3/8, 7/16, 1/2, 9/16 inch
Hammer, Ball peen 4 oz
Pliers, Chain Nose Non serrated
Pliers, Flat Bill Non serrated
Pliers, Needle Nosed Thin, 4.5 inch
Punch, Center None
Punch, Pin 1/16 inch, 3/32 inch
Ruler, Steel 6-inch length, 1/32, 1/64 and 1/10, 1/100 inch decimal scales
Screwdriver, Flat Blade Small blade, 3 inch
Narrow blade, 3 inch
Medium blade, 4 inch
Long blade, 6
Jewelers set, sizes AA-E inch
Screwdriver, Phillips #1, 3 inch, 8 inch
#2, 4 inch, 8 inch
Square 12 inch decimally fractional head/blade
Tweezers Dumont style #2 and #7
Vise, Drill Press Any Style
Wrench, Allen Set, sizes 5/64 through ¼ inch
Wrench, Bristol Set, sizes 5/64 through ¼ inch
Wrench, Combination 5/32, 3/16, 7/32, 1/4, 5/16, 11/32, 3/8, 7/16, 1/2 inch
2-1
TOOLS 523-0768039
Table 2-1. Preferred Tools - Continued
TOOL DESCRIPTION or ROCKWELL COLLINS PART NUMBER

Wrench, Crescent 6 inch
Scriber Any Style
Artist's Brush, Soft Fine Tip Natural Bristled 007-0960-000, 006-1610-000/010 or equivalent. Bristles may be camel
hair, ox hair, sable. If stiffer bristles are desired, trim length to 1/4 inch.
Electric Rotary Drill, Miniature Hand Held 006-1217-000, 006-1218-000, & 006-1219-000 or equivalent
Files, Miniature 006-1434-000 (Flat), 006-0756-000 (Round), 006-0759-000 (Triangle)
or equivalent
Tape, Acrylic Electrical Insulating, one inch wide 014-3011-100 or equivalent
Tape, Silicone Electrical Insulating, .5 inch wide 014-3011-040 or equivalent
Ionized Air Blower Simco A300 or equivalent
Oven, curing Any forced air oven capable of holding a ±5 °C tolerance
Hot melt gun 3M polygun T.C. or equivalent
Compressed air canister 005-2866-010 (Micro Care Corp. MCC-DST or equivalent)
Aerosol coolant 005-2867-010 (Tech Spray Anti-Static Freeze Spray 1747 or equivalent)
Finger Cots, Antistatic 246-0230-XXX or equivalent
Tissue, lint-free Kimberly Clark Kim Wipes
Tissue, low lint Kimberly Clark Kim Wipes
Torque Screwdriver Sturtevant Richmont PM5, Range: 5-100 in-oz. Increments: 1 in-oz.
Hex drive 1/4 Female
Torque Screwdriver Snap-On QDRIVER Series, Range: 6 in-oz. to 40 in-lb. Hex drive 1/4
Female (Adjustable or Preset)
Torque Screwdriver Utica TS-30, Range: 6-30 in-lb. Increments: 1 in-lb. Hex drive 1/4
Female
Torque Screwdriver Utica TS-100, Range: 20-100 in-oz. Increments: 2 in-oz. Hex drive
1/4 Female
Torque Wrench Snap-on TQF25, Fixed, 50-250 ft.-lb., 1/2" drive
Torque Wrench Utica CHA-11, Single Setting (preset). Range: 20-100 in-lb.
2.2.1. Commercially Available Tools.

The following are commercially available tools that do not have an established Rockwell Collins part number.
• Craft Sticks, used for mixing adhesives.
• Drill Bits.
• X-Acto Knife.
• Tweezers without Teet.h
• Eraser Pencil, Rubber Tip Non Residue (Craytech).
• Eyelet Setting Tool, Hand.
• Eyelet Backing Tool, Flat Flange.
2-2
TOOLS 523-0768039
• Eyelet Backing Tool, Funnel Flange.

• Heat gun, Ungar 6966 or equivalent.
• Magnifying glass, preferred 3X.
• Shop rags, non-chemically treated.
• Syringe.
• Cotton tipped swabs.
• Tongue Depressor.
• Tooth Picks.
• Orange sticks.
• Gloves, nitrile.
• Fiber Stick.
• Emery Board.
• Microscope, 10X to 70X, 200X-400X for Fiber Optic examination.
• Milling Bits.
• Pliers, Flush Cutting.
• Pin Vise.
• Thermal Stripers, temperature controlled.
• Welder, Gap.
• Ultraviolet light (black light) for coating inspection.
• Pipe cleaners.
• Ultrasonic cleaners.
• Gloves, cotton.
2.3. PREFERRED CRIMP TOOLS.

Refer to Table 2-2 for a crimp tool index which lists electrical crimp contacts and associated tools most commonly used in Collins
commercial aviation equipment. There are a multitude of contact and connector types used by the Rockwell Collins that are not
shown here. Each contact or connector has a crimp and if applicable, an insertion/extraction tool designed specifically for it. When
performing repair procedures that require adding or replacing contacts, use the recommended tools for that contact to ensure relia-
bility of the connection. Contacts are listed in CPN order followed by columns containing the following information:
CODE Indicates if contact is a pin, female, machined, loose, tape, stamped, or asexual
CONNECTOR TYPE Describes the type of Connector (CONN) the contact is used in
CRIMP TOOL CPN Rockwell Collins part number of crimp tool
POSITION/LOCATOR Rockwell Collins part number of the contact Position (POS)/Locator (LOC) tool
CPN
CONTACT American Wire Gauge (AWG) is the range of wire size used with the contact
INFORMATION:
SIZE is the contact size
STRIP LENGTH is the insulation strip back Length (LEN)
INSUL-DIA Specifies the maximum Diameter (DIA) of the wire Insulation INSUL)
2-3
TOOLS 523-0768039
INSERTION TOOL Rockwell Collins part number of the tool(s) used to insert a contact into the connector shell
EXTRACTION TOOL Rockwell Collins part number of the tool(s) used to remove a contact from the connector shell
Table 2-2. Crimp Tool Index
CONTACT INFO IN-

CONTACT CONN CRIMP POS/LOC INSERTION EXTRACTION
CODE STRIP SUL
CPN TYPE TOOL CPN CPN AWG SIZE TOOL TOOL
LEN DIA.
359-0608-010, LMF CIRC 359-8102-010 359-8102-060 24-26 22M - None 359-8032-010 359-8032-010
Non-preferred, 38999
359-8026-010 359-8026-060
use 359-0608- SERIES II
110 370-8053-010 370-8053-010
359-0608-020 LMF CIRC 359-8102-010 359-8102-060 22-26 22 - None 359-8032-020 359-8032-020

38999
359-8026-020 359-8026-070
SERIES II
370-8053-010 370-8053-010
359-0608-030 LMF CIRC 359-8101-010 359-8101-040 20-24 20 - None 359-8032-030 359-8032-030

38999 OR 359-8102- OR 359-8102-
359-8026-030 359-8026-080
SERIES II 010 100
370-8053-020 370-8053-020
359-0608-040 LMF CIRC 359-8101-010 359-8101-040 16-20 16 - None 359-8032-040 359-8032-040

38999
359-8026-040 359-8026-090
SERIES II
370-8053-030 370-8053-030
359-0608-050 LMF CIRC 359-8101-010 359-8101-040 12-14 12 - None 359-8032-050 359-8032-050

38999
359-8026-050 359-8026-100
SERIES II
370-8053-030 370-8053-030
359-0608-060, LMP CIRC 359-8102-010 359-8102-070 24-26 22M .157- None 359-8032-010 359-8032-010
38999 I, II, .141
III
Non-preferred, 359-8026-010 359-8026-060
use
359-0608-120 370-8053-010 370-8053-010
359-0608-070 LMP CIRC 359-8102-010 359-8102-090 28-22 22 .157- None 359-8032-020 359-8032-020
38999 I, II, .141
III
359-8026-020 359-8026-070
370-8053-010 370-8053-010
359-0608-080 LMP CIRC 359-8101-010 359-8102-090 20-24 20 .229- None 359-8032-030 359-8032-030
38999 I, II, OR 359-8102- OR 359-8102- .209
III 010 100
359-8026-030 359-8026-080
370-8053-020 370-8053-020
2-4
TOOLS 523-0768039
Table 2-2. Crimp Tool Index - Continued
CONTACT INFO IN-

CODE STRIP SUL
LEN DIA.
359-0608-090 LMP CIRC 359-8101-010 359-8101-040 16-20 16 .229- None 359-8032-040 359-8032-040
38999 I, II, .209
III
359-8026-040 359-8026-090
370-8053-030 370-8053-030
359-0608-100 LMP CIRC 359-8101-010 359-8101-040 12-14 12 .229- None 359-8032-050 359-8032-050
38999 I, II, .209
III
359-8026-050 359-8026-100
370-8053-030 370-8053-030
359-0608-110 LMF CIRC 359-8102-010 359-8102-060 22-26 22D - None 359-8032-010 359-8032-010
38999 I, II,
359-8026-010 359-8026-060
III
370-8053-010 370-8053-010
359-0608-120 LMP CIRC 359-8102-010 359-8102-090 22-26 22D .157- None 359-8032-010 359-8032-010
38999 I, II, .141
III
359-8026-010 359-8026-060
370-8053-010 370-8053-010
359-0608-130 LMF CIRC 359-8102-010 359-8102-070 22-26 22D .157- None 359-8032-010 359-8032-010
38999 I, II, .141
III
359-8026-010 359-8026-060
370-8053-010 370-8053-010
359-0608-140 LMF CIRC 359-8101-010 359-8101-040 20-22 20 .229- None 359-8032-030 359-8032-030
38999 I, II, .209
III
359-8026-030 359-8026-080
370-8053-020 370-8053-020
359-0608-150 LMF CIRC 359-8101-010 359-8101-040 16-20 16 .229- None 359-8032-040 359-8032-040
38999 I, II, .209
III
359-8026-040 359-8026-090
370-8053-030 370-8053-030
359-0608-160 LMS CIRC 359-810-010 359-8101-040 12-14 12 .229- None 359-8032-050 359-8032-050
38999 I, II, .209
III
359-8026-050 359-8026-100
370-8053-030 370-8053-030
359-0608-170, LMF
Obsolete, use
359-0608-110
2-5
TOOLS 523-0768039
CONTACT INFO IN-

CODE STRIP SUL
LEN DIA.
359-0608-180, LMF
Obsolete, use
359-0608-040
359-0608-200, LMF
Obsolete, use
359-0608-050
359-0608-210, LMF
Obsolete, use
359-0608-120
359-0608-220, LMF
Obsolete, use
359-0608-080
359-0608-230, LMF
Obsolete, use
359-0608-090
359-0608-240, LMF
Obsolete, use
359-0608-100
359-0608-250, LMF
Obsolete, use
359-0608-130
359-0608-260, LMF
Obsolete, use
359-0608-140
359-0608-270, LMF
Obsolete, use
359-0608-150
359-0608-280, LMF
Obsolete, use
359-0608-160
359-1001-010 - M39029 359-8102-010 359-8102-080 26-20 - - - 359-8032-030 359-8032-030
359-8032-020 359-8032-020
359-1001-020 - M39029 359-8102-010 359-8102-080 26-20 - - - 359-8032-030 359-8032-030
359-8032-020 359-8032-020
370-0033-080, LSA ZIF 860-2506-010 None 24-26 - 0.125 - None 370-0036-080

for 28-30
wire use
860-0009-010
370-0033-100 LSA ZIF 860-2506-010 None 20-22 - 0.125 - None 370-0036-080
2-6
TOOLS 523-0768039
CONTACT INFO IN-

CODE STRIP SUL
LEN DIA.
370-0036-040, LSA ZIF - - - - - - - -

Obsolete, use
370-0033-080
370-0045-010 TMP - 359-8102-010 359-8102-130 22 - .135- None 370-8053-010 370-8053-010

.165
370-0045-020 TMP - 359-8102-010 359-8102-080 26-30 - .150- None 370-8053-020 370-8053-020

.190
370-0045-030 LMP - 359-8102-010 359-8102-130 22 - .135- None 370-8053-010 370-8053-010

.165
370-0045-040 LMP - 359-8102-010 359-8102-080 26-30 - .150- None 370-8053-020 370-8053-020

.190
370-0045-050 LMP - 359-8102-010 359-8102-080 24-30 - .150- None 370-8053-020 370-8053-020

.190
370-0045-060 LMP - 359-8102-010 359-8102-080 30-26 - .150- None 370-8053-020 370-8053-020

.190
370-0045-070 LMP - 359-8101-010 359-8101-020 16-20 - .250- None 370-8053-030 370-8053-030

.290
370-0045-080, LMP - - - - - - - - -
Obsolete
370-0057-060 LSA ZIF 860-2506-010 None 20-22 - 0.125 - None 370-0057-130
370-0057-090, LSA ZIF 860-2506-010 None 24-26 - 0.125 - None 370-0057-130

for 28-30
wire, use
860-0009-010
370-0066-060 LMP ARINC 600 359-8102-010 359-8102-130 22-26 22 .130- None 371-8445-020 371-8445-020
.110
370-0066-070 LMF ARINC 600 359-8102-010 359-8102-080 20-22 20 .167- None 371-8445-040 371-8445-040
.147
370-0066-080 LMF ARINC 600 359-8101-010 359-8101-020 16-20 16 .270- None 371-8445-080 371-8445-080
.230
370-0066-090 LMF ARINC 600 359-8101-010 359-8101-120 12-14 12 .270- None 371-8445-100 371-8445-100
.230
370-0066-160 LMP ARINC 600 359-8102-010 359-8102-130 22-26 22 .130- None 371-8445-020 371-8445-020
.110
370-0066-170 LMP ARINC 600 359-8102-010 359-8102-130 22-26 22 .130- None 371-8445-020 371-8445-020
.110
370-0067-100 LMP ARINC 600 359-8102-010 359-8102-080 2-022 20 - None 371-8445-040 371-8445-040
370-0067-110 LMP ARINC 600 359-8101-010 359-8101-020 16-20 16 - None 371-8445-080 371-8445-080
2-7
TOOLS 523-0768039
CONTACT INFO IN-

CODE STRIP SUL
LEN DIA.
370-0067-120 LMP ARINC 600 359-8101- 359-8101-120 12-14 12 - None 371-8445-100 371-8445-100
010, Black
Dot
370-0067-130 LMF ARINC 600 359-8102-010 359-8102-130 22-26 22 .130- None 371-8445-020 371-8445-020
.110
370-0067-140 LMF ARINC 600 359-8102- 359-8102-130 22-26 22 .130- None 371-8445-020 371-8445-020
010, Yellow .110
Dot
370-0067-200 LMF ARINC 600 359-8102-010 359-8102-130 22-26 22 .130- None 371-8445-020 371-8445-020
.110
370-0067-230 LMF ARINC 600 359-8102-010 359-8102-130 22-26 22 .130- None 370-0067-290 370-0067-290
.110
370-0067-360 COAX ARINC 600 - 359-8102-130 16-20 5 - - - --
370-5390-010 LMP DPX 359-8102-010 359-8102-020 22-24 - .147- .080 - 371-8445-070

.167
370-5390-020 LMF DPX 359-8102-010 359-8102-020 22-24 - .147- .082 - 371-8445-070

.167
370-5390-030 LMF DPX 359-8102-010 359-8102-- 22-24 - .147- .070 - 371-8445-040

080 .167
370-5452-010 LMP 39029 359-8102-010 359-8102-130 22-26 - - None 370-8053-010 370-8053-010
370-5452-020 LMF 39029 359-8102-010 359-8102-130 22 - - None 370-8053-010 370-8053-010
370-5452-030 LMP 39029 359-8102-010 359-8102-080 20-24 - - None 370-8053-020 370-8053-020
367-1885-090 TBA
370-5452-040 LMF 39029 359-8102-010 359-8102-080 20-24 - - None 370-8053-020 370-8053-020
367-1885-090 TBA
370-5452-050 LMP 39029 359-8102-010 359-8101-020 16-20 - - None 370-8053-030 370-8053-030
367-1885-090 TBA
370-5452-060 LMF 39029 359-8102-010 359-8101-020 16-20 - - None 370-8053-030 370-8053-030
367-1885-090 TBA
371-0213-110 LMF "D" 359-8102-010 - 20-24 - - None 371-8445-010 371-8445-010
371-0373-020 LMP "D" 359-8102-010 - 20-24 - - None 371-8445-010 371-8445-010
371-0373-100 TSP "D" 359-8108-010 - 20-30 - - - - -
371-0373-110 LMP "D" 359-8102-010 - 26-30 - - None 371-8445-010 371-8445-010
371-0373-120, "D" - - - - - None - -

Obsolete
2-8
TOOLS 523-0768039
CONTACT INFO IN-

CODE STRIP SUL
LEN DIA.
371-0379-020, NLMP "D" 359-8102-010 359-8102-010 20-24 - - None - -

Non-preferred,
use 371-0373-
020
371-0379-050, NLMP "D" 359-8102-010 359-8102-010 26-30 - - None - -

Non-preferred,
use 371-0373-
110
371-0379-080, LMF "D" - - 20-24 - - None - -

Non-preferred,
use 371-0946-
040
371-0379-100 TSP "D" 372-8108-000 - - - - - - -
371-0379-110, LMP "D" - - 18 - - None - -

Obsolete
371-0379-130 TSF "D" 372-8108-000 - 20-28 - - - - -
371-0379-140 LMF "D" - - 26-30 - - None -
371-0379-150 LMF "D" VPN 995- - 18 - - None - -

0002-206
371-0379-510 TSF "D" VPN 995- - 18-22 - - - - -

0001-870
371-0946-040 LMF "D" 359-8102-010 359-8102-020 20-24 - .188- None 371-8445-010 371-8445-010
.208
371-0946-060 TSF "D" 372-8108-010 - 20-28 - .188- - 371-8445-010 371-8445-010

.208
371-0946-070 LMF "D" 359-8102-010 359-8102-020 26-30 - .188- None - -

.208
372-2255-010 LTSF Box, blue 372-8092-010 - 22-20 - .172 - None 372-8093-010,

line Obsolete, refer
to Figure 5-32
372-2255-020 LTSF Box, blue 372-8092-010 - 24-30 - .156 - None 372-8093-010,

line Obsolete, refer
to Figure 5-32
372-2510-040 LSF Box, PCB 372-8092-010 - 24-20 - .172 None 372-2501-170
372-2510-050 LSF Box, PCB 372-8092-010 - 26-30 - .140 - None 372-2501-170
372-2510-060 LSF Box, PCB 372-8092-010 - 26-30 - .156 .048 None 372-2501-170
372-2510-090 LSF Box, PCB 372-8092-010 - 20-24 - .172 - None 372-2501-170
372-2510-100 LSP Pin to box 372-8092-010 - 22-26 - .140 .061 None 372-2501-170
2-9
TOOLS 523-0768039
CONTACT INFO IN-

CODE STRIP SUL
LEN DIA.
372-2510-130 TSF Box, PCB 372-8092-010 - 20-24 - .172 - None 372-2501-170
372-2510-210, TSF Box, PCB - - - - .156 - None -

Obsolete
372-2510-240 LSF Box, PCB 372-8092-010 - 20-24 - .172 - None 372-2501-170
372-2510-250 LSF Box, PCB 372-8092-010 - 26-30 - .172 - None 372-2501-170
372-2514-010 LSF Tune Fork 359-0697-010 - 20-26CU - 0.125 .060 359-0697-050 359-0697-020
for thin line l1. for thin line
ll only. Use
372-2514-030 372-8091-070
359-0697-060
372-2514-110 623-8579- 22&26FE/CU 359-8029-010 for thin line l.
000, Alternate Alternate 372-8091-010 is
372-2514-130 alternate for thin
line l.
372-2514-080 LSF Tune Fork 359-0697-010 - 20-24 0.125 .060 359-0697-050 359-0697-060
372-2514-180 623-8580-000 359-8029-010 359-0697-020

Alternate Alternate Alternate
372-2519-030 Male Coax 372-8091-050 - RG-58 - Refer - None 370-8040-030

to Table
359-8018-080
5-1
372-2519-040 Fem 357-8622-160 RG-58,
RG-400
372-2519-050 Male Coax 359-8018-040 - T-209A - Refer - None 370-8040-030

to Table
357-8622-120
5-1
372-2519-060 Fem

to Table
359-8018-090 RG-142
5-1
372-2519-100 Fem 357-8622-160

to Table
359-8018-030 RG-316
5-1
372-2519-220 Fem 357-8622-110
372-5909-030 - Molex 372-8102-020 - 18-24 - .125- - None Molex HT-2285

.250
860-0009-010 - Zif 860-2506-020 - 28-32 - 0.125 - None 370-0036-080
860-2905-010 - "D" 359-8102-010 359-8102-080 26-30 - .188- - 371-8445-010 371-8445-090

.208
860-2905-020 - "D" 359-8102-010 359-8102-080 26-30 - .188- - 371-8445-010 371-8445-090

.208
2-10
TOOLS 523-0768039
CONTACT INFO IN-

CODE STRIP SUL
LEN DIA.
859-3478-050 Male ARINC 860-2578-050 860-2578-040 20 1mm - - None 860-2578-010

608, Test
859-3478-080
Equip
859-2778-050 Fem
859-3478-070 Male ARINC 860-2578-060 - RG-316 - - - None 860-2578-030

608, Coax,
859-2778-070 Fem
Test Equip
372-2501-260, LSF Box, PCB - - 22-26 - - - None -

Obsolete, use
372-2501-060
2.4. PREFERRED SOLDERING TOOL.

Refer to Table 2-3 for a list of preferred soldering tools.
Table 2-3. Preferred Soldering Tools
ITEM ROCKWELL COLLINS PART DESCRIPTION / WHERE USED

NUMBER
Soldering Iron, desoldering systems, No specific vendor Any temperature controlled soldering iron with
or hot tweezers a 500°Fahrenheit (F) setting or solder tip
Soldering Iron Tips No specific vendor Appropriate to soldering iron system used
Soldering Iron Sponge No specific vendor -
Soldering Iron Tip Tinner99999999 None Hakko 599b - Cleaning soldering iron tips
Hot Air Pen None JBC hot air soldering system or equivalent
1 Note: Chemical tip tinners may NOT be used on Rockwell Collins products.
2.5. PREFERRED ELECTROSTATIC DISCHARGE MATERIALS.

Refer to Table 2-4 for a list of preferred Electrostatic Discharge (ESD) materials.
Table 2-4. Preferred Electrostatic Discharge Materials
ITEM CPN AND VENDOR WHERE USED

Grounding strap cord 024-0837-340 Light weight strap cord 5-foot long with 1 Megohm (MΩ)
3M 2240 or equivalent inline resistance.
Grounding strap cord 024-0837-350 Light weight strap cord 10-foot long with 1 MΩ inline
3M 2220 or equivalent resistance.
2-11
TOOLS 523-0768039
Table 2-4. Preferred Electrostatic Discharge Materials - Continued
ITEM CPN AND VENDOR WHERE USED

Grounding table mat 024-0837-020 Blue conductive table mat 2 ft. x 4 ft.
3M 8210 or equivalent
Grounding cord 024-0837-050 Insulated 15 ft. copper wire with 1 MΩ inline resistance.
Workstation grounding No CPN Provides basic items needed to create a static-safe
kit 3M 8020 or equivalent work environment. Kit includes: table mat, floor mat,
ground cord, wrist strap/table mat grounding system,
CHARGE-GUARD ® wrist strap
Shoe grounding strap 024-0837-090 Provides conductive ground path to floor.
Conductive foam sheets No CPN Used to provide electrostatic protection for sensitive
3M 2803 or equivalent microelectronic parts.
Bag; RF, EMI and 025-0181-XXX, Metalized bags used for Radio Frequency (RF),
static shielding, metal Electromagnetic Interference (EMI), and static electricity
Richmond 3600 Series or equivalent
laminated, RCAS protection of units/assemblies when not enclosed by the
unit cover and conductive connector cap. Refer to the
caution in the Safety Summary section.
Bag, static-shielding 169-5034-XXX Antistatic bag for electrostatic shielding of any unit that is
3M Static Shielding bags or equivalent moved or stored. In addition, connector cap covers may
be used if available.
Antistatic connector 000-0146-XXX On some unit connectors for protection when units are
cover 841-7018-020 moved or stored.
Olympic Plastic Company CaPlug se-
ries
2-12
523-0768039
CHAPTER 3
CLEANING
3.1. INTRODUCTION.
This section presents instructions for cleaning disassembled subassemblies and component parts. These procedures are written to
cover the general requirements of all equipments. It is only necessary to perform the procedures that are applicable to the equipment
being cleaned. To determine what procedures apply, refer to the procedure headings. Parts similar enough to permit identical clean-
ing are grouped together. Equipments with parts requiring special methods of cleaning are covered in the appropriate component
maintenance or overhaul manual.
3.2. CLEANING MATERIALS.
Use cleaning solvent under a ventilated hood. Avoid breathing solvent vapor and fumes. Avoid continuous contact
with solvent. Use goggles, gloves, and apron to prevent irritation from prolonged contact. Change clothing upon
which solvents have been spilled. Observe all fire precautions for flammable materials. Use these materials in a
hood provided with explosion-proof electrical equipment and an exhaust fan with spark-proof blades. Warn other
persons to keep away from hazardous area or working enclosure.
Wear goggles when using an air jet to blow dust and dirt from equipment. Warn other persons to keep away from
hazardous area or work enclosure.
Do not smoke tobacco products in or near a cleaning area. The burning tobacco can be a source of ignition of
flammable products and unseen vapors. The by-products of burning tobacco are a source of contamination for
freshly cleaned avionics parts.
Units contaminated with aircraft hydraulic fluid (Skydrol) may have metal assemblies, such as chassis and dust
covers cleaned. Circuit boards and assemblies may be spot cleaned. DO NOT clean units soaked/covered with
hydraulic fluid. They must be replaced. HFE-7100 (Novec 7100 or Novec 7200) are recommended for cleaning
of Skydrol materials.
The cleaning materials are listed in Section 1 (Materials). Air jet refers to a hand-operated air nozzle supplied with clean, dry,
compressed air at a maximum of 193 Kilo Paschal (KPa) (28 Pound (lb)/Inch (in)2 Gauge (ga)).
3.3. PROCEDURES.
Items to be cleaned and the cleaning procedures are provided in the following paragraphs.
3.3.1. General Cleaning.
Perform the following steps for general cleaning.
a. Perform periodic cleaning and inspection at intervals as established by the repair shop’s preventative maintenance schedule or
as indicated in the equipment instruction book.
3-1
CLEANING 523-0768039
b. Clean thoroughly with an air jet and a soft-bristled brush. In some instances it may be necessary to use a solvent to remove
heavy deposits.
c. Inspect assemblies for obvious hot spots or any other known abnormal deterioration of components and connecting points.
3.3.1.1. Cleaning Tools. It is important to keep all cleaning tools free of contaminants. Perform the following when handling
solvents and brushes.
a. Use cleaning brushes made of nontreated natural fibers. Many standard brushes have arabic gum sizing added to keep the
bristles straight. The arabic gum can be attacked by solvents and contaminates the cleaning process. The handle of a brush
should be unpainted.
b. Do not use one brush in several different solvents.
c. Dip only one half of a brush’s bristles in solvent.
d. Do not store cleaning brushes in a solvent when not in use.
e. Solvent is placed in small glass jars for use at workstations. The solvent is replaced on a daily basis.
f. Do not use cotton swabs with solvent, as the solvent can attack the adhesive used to hold the cotton to the stick and contaminate
the cleaning process.
3.3.2. Special Cleaning of Circuit Cards.
Perform the following steps for cosmetic cleaning and removal of deposited foreign material and corrosive elements such as elec-
trolytic capacitor leakage, tobacco/coffee residues, trapped carpet/upholstery fibers, and flux contamination.
NOTE
The detergent must be a type that completely dissolves in water and leaves no residue after rinsing. Alconox, and
Alcojet brand names are available in the United States. Refer to Section 1 (Materials), Table 1-7, for detergent
information.
a. Clean the entire board, brushing with a detergent (specified in this manual) and warm water.
b. Rinse the area with distilled/deionized water.
c. Be sure the board is thoroughly dry before placing equipment in operation.
3.3.3. Bearings (Unsealed, Sealed, and Porous Bronze).
Perform the following steps to check bearings.
a. Bearings are prelubricated by the bearing manufacturers. Cleaning any of the bearings by any method may remove the lubricant.
b. Perform the bearing check procedures (refer to Section 4 (Check)). If a bearing appears questionable, it is probably best to
replace it rather than attempt any type of cleaning.
3.3.4. Cables, Covered.
Perform the following steps to clean covered cables.
a. Wipe clean all outer surfaces of conduit with lintless cloth or tissue moistened with solvent.
b. Wipe dry with a clean, dry, lintless cloth or tissue.
c. Treat connector terminals as instructed in Paragraph 3.3.8. Wipe lug terminals clean with a lintless cloth or tissue moistened
with solvent. Dry with a clean, dry, lintless cloth or tissue.
3.3.5. Castings (All Wiring and Electrical Circuit Cards/Components Removed).
NOTE
If the casting contains pressed in bearings, do not immerse the casting in solvent. Instead, use a rag or brush dipped
in solvent and scrub the casting, keeping solvent away from all bearings.
Perform the following steps to clean castings.
3-2
a. Remove surface grease with rags.

b. Blow dust from surfaces, holes, and recesses using air jet.
c. Immerse casting in solvent and scrub until clean. Work solvent over surfaces and into holes and recesses with nonmetallic
brush. (Flat wood-backed brushes with fiber bristles are recommended for surfaces. Round bottle or test tube brushes are
recommended for holes and recesses.)
d. Lift casting from solvent and drain.
e. Immerse in clean solvent, rinse, and lift from solvent. Position casting so solvent is not trapped in holes or recesses and drain
until dry. If positioning does not permit complete draining, use air jet to blow out any trapped solvent.
f. When dry, touch up minor damage to finish. Major damage may require refinishing of casting.
g. Protect casting from dust and moisture pending inspection.
3.3.6. Cathode Ray Tubes Optic Filters.
Refer to Paragraph 3.3.10.
3.3.7. Chassis, Wired.
Refer to Electrostatic Discharge Sensitive (ESDS) handling caution in Safety Summary section of the manual.
Avoid air blasting small coils, leads, and other delicate parts by holding air jet nozzle too close. Use brushes
carefully on delicate parts.
NOTE
When it becomes necessary to disturb the dress of wiring and cables, note dress of wiring and cables and restore
to dress after cleaning.
Perform the following steps to clean wired chassis.

a. Remove dust and dirt using soft-bristled brushes and air jet.
b. Clean jacks as instructed in Paragraph 3.3.13.
c. With minimum disturbance of wiring, clean connectors as instructed in Paragraph 3.3.8.
d. Clean ceramic or plastic insulators as instructed in Paragraph 3.3.12.
e. Finish cleaning chassis by wiping finished surfaces with a lintless cloth or tissue moistened with solvent.
f. Dry with a clean, dry, lintless cloth or tissue.
g. Protect chassis from dust, moisture, and damage pending inspection.
3.3.8. Connectors.
Do not permit solvent to run into sleeves or conduit that covers wires connected to insert terminals.
Perform the following paragraphs for connector cleaning.

3.3.8.1. General Connectors.
a. Wipe dust and dirt from bodies, shells, and cable clamps using lintless cloth or tissue moistened with solvent.
b. Wipe dry with a clean, dry, lintless cloth or tissue.
c. Remove dirt and lubricant from inserts, insulation, and terminals using small soft-bristled brush moistened with solvent.
3-3
d. Dry insert with air jet.

3.3.8.2. Card Edge Finger Cleaning.
NOTE
If electrical integrity is suspected, inspect the contact fingers for foreign materials such as solder mask speckles
(green colored) or spots of adhesive (clear) of the type used to tack down wires. Low-power magnification is
helpful in this inspection. The following cleaning procedures does not remove these two types of contaminants.
a. Using a lint-free cloth lightly moistened with toluene, rub the edge card fingers in the direction parallel to the edge of the card.
Keep the cloth moistened.
If required to rub perpendicular to the edge of the card, care must be exercised not to smear conformal coat (post-
coat) or other contaminants onto the contact surface.
b. Each edge should be cleaned twice; first with multiple strokes (approximately four to six) to remove the majority of the con-
taminants and second, with a renewed section of the cloth applied as before, as a final cleanup.
c. The cloth may be used until lightly soiled. Remoisten as necessary, but take care not to use an excess of cleaning solution which
could squeeze out and run across the card.
d. After the card edge fingers are cleaned, remove any stray cloth fibers with air jet or by wiping the length of fingers using a
dry lint-free cloth after the solvent has evaporated. If stray fibers remain adhered to postcoat and are long enough to reach the
contact area, they must be removed.
3.3.8.3. Zero Insertion Force (ZIF) Connector Cleaning.
a. Select the appropriate cleaning tool as shown in Figure 3-1, and apply a piece of lint-free cloth to the working edge as shown.
Lightly moisten the cloth to at least 0.25 inch from working edge.
b. Insert tool into open connector in a direction perpendicular to normal circuit insertion, close contacts onto cloth and with con-
tacts closed, withdraw tool and cloth from connector. Repeat procedure one to two times.
c. Clean all the unit connectors of one size using the same cloth (unless it becomes heavily soiled) and then repeat the cleaning
procedure using a new cloth surface (can be other side of same cloth).
d. Continue cleaning procedure until all Zero Insertion Force (ZIF) connectors are cleaned. Remove any stray cloth fibers with
air jet.
e. With the contacts in a closed position, sight along the rows of contacts to assure that the gap between opposing contacts is
consistent. This is a check for damaged contacts.
3.3.8.3.1. Ultrasonic Cleaning of ZIF Connectors.
3.3.8.3.1.1. Equipment and Supplies.
a. A class 10 000 filtering system and/or a dust-free area.
b. At least one, preferably two, ultrasonic cleaning devices.
c. Deionized water or distilled water.
d. Oil filtered air supply with ionized nozzle or with the equivalent antistatic attachment.
e. Low-power microscope.
f. Ultraviolet light source.
g. Solvents: Toluene or Microcare Vericlean (refer to Section 1 (Materials), Table 1-4).
h. Microclean nonionic detergent or Alconox (refer to Section 1 (Materials), Table 1-7).
i. Small cotton swabs.
3-4
j. Timer.
k. Darkened hood.
l. Small camel-hair brush.
Figure 3-1. ZIF Connector Cleaning Tool
3.3.8.3.1.2. Preparation for Cleaning.

a. Provide proper ESDS grounding for the equipment and the operator (refer to Section 6 (ESDS Devices)).
b. Remove all circuit cards from a unit to be cleaned, including front and rear interconnects, if applicable.
c. Remove all Amp connectors.
d. Use filtered antistatic air to blow heavy contaminating particles from all connector surfaces.
e. Inspect the finger areas of each circuit card using an ultraviolet light source in a darkened hood. Check for the presence of
postcoat material on the individual fingers.
f. Remove the particles of postcoat from the connector using a small cotton swab dampened with solvent.
g. Dispose of the cotton swab after each use.
NOTE
For cleaning and rinsing applications, distilled water may be used as direct replacement for deionized water unless
a resistivity of greater than 2 Megohm (MΩ) at 25°Centigrade (C) is specified for the application. Distillation
purifies the water. Both inorganic (charged particles - ions) and solid particles are removed during distillation.
h. Mix 5% of nonionic detergent in deionized (or distilled) water. Place the solution in the first ultrasonic cleaning device. Place
clean deionized (or distilled) water in the second ultrasonic cleaning device.
3-5
3.3.8.3.1.3. Edge Connector Cleaning Procedure.
Do not allow any portion of the circuit card to contact sides or bottom of the ultrasonic cleaning device. Damage
may occur to electronic devices subjected to ultrasound.
a. Hold the circuit card in such a manner that the part of the circuit card to be cleaned is totally under solution but does not touch
the bottom of the ultrasonic cleaning device. Hold the circuit card in a vertical position so that only one edge connector on the
circuit card is being held under the solution.
b. Turn on the ultrasonic cleaning device and clean circuit card for 2 to 3 minutes in the detergent.
c. Rinse circuit card in the second ultrasonic cleaning device for 2 to 3 minutes using clean deionized water.
d. Remove the circuit card and rinse thoroughly in a fast stream of deionized water for about 2 minutes to remove the detergent.
e. Blow dry circuit cards using filtered air with an antistatic nozzle attachment.
f. Repeat process for all the edge connectors.
g. Use a low-power microscope inside a dust-free area and inspect the connector contacts and the immediate area surrounding the
contacts for any foreign particles.
h. Use a small camel-hair brush to remove any foreign particles from the circuit card. Remove all particles regardless of size.
i. Place the cleaned circuit card in a dust-free environment.
j. Do not handle connectors after the cleaning process has been completed. Change solution at the end of each cycle or as required,
but at least after cleaning no more than 16 connectors.
3.3.8.3.1.4. ZIF Connector Cleaning Procedure (front and rear interface circuit cards).
Do not allow any portion of the circuit card to contact sides or bottom of the ultrasonic cleaning device. Damage
may occur to electronic devices subjected to ultrasound.
a. Place the circuit card to be cleaned connector side down in the solution.
b. Turn on the ultrasonic cleaning device and clean circuit card for 2 to 3 minutes in the detergent.
c. Rinse circuit card in the second ultrasonic cleaning device for 2 to 3 minutes using clean deionized water.
d. Remove the circuit card and rinse thoroughly in a fast stream of deionized water for 30 to 60 seconds.
NOTE
If a second ultrasonic cleaning device is not used for rinsing, the circuit cards are rinsed in a fast stream of deion-
ized water for approximately two minutes to remove the detergent.
e. Blow-dry circuit cards using filtered air with an antistatic nozzle attachment.
f. Use a low-power microscope inside a dust-free area and inspect the connector contacts and the immediate area surrounding the
contacts for any foreign particles.
g. Use a small camel-hair brush to remove any foreign particles from the circuit card. Remove all particles regardless of size.
h. Place the cleaned circuit card in a dust-free environment.
i. Do not handle connectors after the cleaning process has been completed. Change solution at the end of each cycle or as required,
but at least after cleaning no more than 16 connectors.
3-6
3.3.9. Covers and Shields.

Perform the following steps to clean covers and shields.
a. Remove dust and dirt using stiff-bristled brush and air jet.
b. Clean painted covers with a mild detergent solution of 57 grams (2 oz) of detergent powder in 3800 Centimeter (cm)3 (1 gal)
of water. Wipe dry with clean, dry, lintless cloth or tissue.
c. Clean sheet metal covers and shields by wiping surfaces with a lintless cloth or tissue moistened with solvent.
d. Dry with a clean, dry, lintless cloth or tissue.
3.3.10. Dial Windows, Lighting Wedges, CRTs and Plastic Display Faces.
Do not spray or pour cleaners directly onto avionics equipment. Spraying or pouring the cleaner may result in
excessive fluid entering openings around buttons, switches and knobs.
Do not use soap and water mixtures for cleaning. Soap and water mixtures that flow into openings around switches,
knobs and buttons may leave soap residues that may affect the operation of the equipment.
Do not use solvents including alcohol on avionics equipment. Solvents may remove painted markings and remove
or degrade the special anti-reflective coatings on the face of the Cathode Ray Tube (CRT) and leave streaks after
drying.
Do not use solvent to clean glass. The glass is coated with an anti-reflective coating that may be damaged using
solvents. Use care at all times when cleaning to prevent damage to the anti-reflective coating. Make sure the
cleaning tissue is flat and not creased when used as this can cause pressure points that may streak or damage the
glass coating.
Take care to prevent scratching the glass. Rings, watches, and bracelets can cause damage to the glass and are
removed or covered while working with glass. After cleaning glass use tissue paper to cover glass.
Glass may be treated with an High Efficiency Anti-Reflective (HEA) coating. Use an air gun with an anti-static
nozzle attachment to dissipate static charge. A static buildup on these surfaces can cause an erroneous meter
deflection. Do not use anti-static solutions. They use chemicals that may damage the HEA coating or leave con-
ductive films on the coating.
Handle glass by the edges, and place glass on a soft cloth. Wear lintless gloves or fingercots. Do not handle the
parts with bare hands and do not place them on anything except a soft cloth. The coating may be permanently
damaged by placing them on printed paper, as the printing adheres to the coating.
Do not use brushes for cleaning. Brushes may leave scratches and remove painted markings.
Perform the following steps to clean dial windows, lighting wedges, CRTs and plastic display faces covers and shields.
a. Before cleaning, blow off glass surface using filtered air with anti-static nozzle attachment to dissipate the static charge and
remove large dust and dirt particles that could scratch the coating.
b. Wipe the glass with non-abrasive, lint-fee lens tissue to remove light fingerprints and dust.
c. To remove oily fingerprints or any residue from the glass, apply glass cleaner to the lens tissue or soft cloth. Do not apply liquid
directly to the glass. This prevents the liquid from running between the glass and the cover.
d. After the glass is clean, use a clean dry lens tissue to remove excess liquid and any streaks. Cleaners should not be left to air dry
on any surface. Air drying usually allows visible deposits to remain. Surfaces are swabbed, wiped or vacuumed dry to remove
excess cleaner.
e. As a final cleaning step, blow glass dry using filtered air with an anti-static nozzle attachment to ensure glass is dry and free of
static charge.
f. For applications where pump spray cleaners are not allowed (such as on board an aircraft), use presaturated cleaning cloth
dry/wipe cloth kits. These cleaning kits may also be used in the shop environment.
3-7
g. Place a static cling plastic liner on the screen surface and as an option, a protective cover tissue to protect it from dust and finger
prints before packaging the unit.
3.3.11. Gears: Metal, Composition, and Plastic.
Do not use solvent to clean gears composed of or containing nylon. Gears composed of epoxy and the supporting
base material are susceptible to softening if too much solvent is used.
Perform the following steps to clean metal, composition, and plastic gears.
a. Remove surface dust from gears with soft-bristled brush.
b. Clean metal gears with solvent using the same procedures that are used to clean castings.
c. Clean nylon gears using bath of 57 grams (2 oz) of detergent powder in 3800 cm3 (1 gal) of water. Remove foreign matter with
stiff-bristled brush. Wipe dry with clean, dry, lintless cloth or tissue.
d. Clean composition or plastic gears other than nylon by wiping with clean, lintless cloth or tissue moistened with solvent.
3.3.12. Insulators, Ceramic and Plastic.
Perform the following steps to clean ceramic and plastic insulators.
a. Wipe with clean, lintless cloth or tissue moistened with solvent.
b. Wipe dry and polish using a clean, dry, lintless cloth or tissue.
3.3.13. Jacks.
Perform the following steps to clean jacks.
a. Remove dust from exteriors with soft-bristled brush and air jet.
b. Blow dust from interior of female contact with air jet.
3.3.14. LCDs and Elastomeric Connectors.
Liquid Crystal Display (LCD) drivers are extremely susceptible to damage from Electrostatic Discharge (ESD)
and appropriate precautions must be used at all times.
Finger cots or gloves must be used at all times when handling the LCD to prevent contamination. Keep finger cots
clean. Contamination can result from touching the face or other surfaces that are dirty or oily.
Perform the following paragraphs to clean LCDs and elastomeric connectors.

3.3.14.1. Equipment and Supplies.
a. A clean room or laminar airflow booth. An area which has not been used for soldering and is at least 8 feet away from a
soldering operation.
b. Rubber gloves or finger cots.
c. Oil filtered air supply with ionized nozzle or with the equivalent antistatic attachment.
d. Methanol alcohol.
e. Lintless wipers.
f. Nalgene bottle, squirt or equivalent, that are filled with isopropyl alcohol.
g. Number 1 Phillips screwdriver.
h. Acetic acid and distilled/deionized water.
3-8
i. Heptane.
j. Acetone.
3.3.14.2. Precautions for Cleaning.
a. Provide proper ESDS grounding for the equipment and the operator (refer to Section 6 (ESDS Devices)).
b. Work area and operator’s hands must be oil free; this includes skin lotions or skin medications.
c. Handle LCD by the edges; do not touch the face or electrical contact area of the LCD.
d. The elastomeric connector acts like a magnet to dust, dirt, and lint. When handling elastomeric connectors, an ionized airflow
should be provided over the work area to reduce static buildup on the connector. Avoid handling the LCD assembly around the
band area where the flex cable is attached to the LCD.
3.3.14.3. Preferred LCD Cleaning Procedure. For the cleaning of LCD displays, Rockwell Collins recommends the use of CPN
005-8414-010. This is a set of three microfiber wipes, dampened with solvents. The first wipe is dampened with high purity isopropyl
alcohol. The second wipe is dampened with deionized/distilled water. The third wipe is dry. The microfiber wipes provide superior
cleaning and the solvents are all gentle enough to use on the sensitive LCD surfaces. Alternatively, the microfiber wipes can be
obtained from Miliken Micro-Fibre (part number 492265-606) and moistened with isopropyl alcohol and deionized/distilled water.
3.3.14.3.1. Alternate LCD Cleaning Procedure.
NOTE
If acetone is used next to painted surface, use extreme care to prevent damaging painted surfaces.
It is very important that the work area, equipment, and the operator’s hands are clean before starting the LCD
cleaning procedures.
a. The operator washes his hands with soap and water, then use isopropyl alcohol to clean the work area, tools, and exterior of the
isopropyl alcohol bottle.
b. Wash and dry hands a second time, then put on rubber gloves.
c. The work area, tools, and isopropyl alcohol bottle is washed a second time with isopropyl alcohol.
d. Surface dirt, oils, lint, etc. are removed from the display with methanol or acetone and wiper. Apply the methanol or acetone
to the wiper and lightly rub the surface of the display in a circular direction.
NOTE
Do not apply cleaning solution directly to the display. Always apply to the wiper then use wiper to clean the
display. Do not clean with dry wiper as this can cause scratches.
e. Residual lamination materials and adhesives, such as Room Temperature Vulcanizing (RTV) adhesive, may not be removable
using methanol. If these materials are present on the display, repeat the procedure in step d. using heptane. After using heptane,
clean the display with methanol.
f. Stains such as water spots can be removed from the display by cleaning with a mixture of one part acetic acid to ten parts
distilled water. Clean the display with methanol after using the acetic acid mixture.
g. Place a static cling plastic liner on the surface of the screen and, as an option, a protective tissue cover to protect it from dust
and finger prints before packaging the unit.
3.3.14.4. Circuit Card Cleaning Procedure.
NOTE
During the process of building a circuit card, solder mask is applied to minimize bridging of solder between met-
alized areas. The circuit card electrical contacts are copper with tin-lead plating; the finish appears shiny. Solder
mask is nonconductive and appears as paint on the metalization. Solder mask cannot be removed without damag-
ing the circuit; replace the circuit card if solder mask is found on the electrical contact area.
3-9
a. Apply isopropyl alcohol to a cotton swab.

b. Hold the circuit card by the edges and gently rub the cotton swab across the electrical contact area.
c. Examine the circuit card under a black light to verify postcoat was not transferred to the electrical contact area during cleaning.
d. Ensure the electrical contacts are not contaminated with HumiSeal.
3.3.14.5. Zebra Connector and Housing Cleaning Procedure. Spray all parts with isopropyl alcohol for approximately 5 seconds.
Wipe using a cotton swab moistened with isopropyl alcohol.
3.3.14.6. Inspection. Allow all parts to air dry. Inspect for residues or contamination such as solder flux, postcoat, or solder
mask. If any residues or contamination are found, repeat the cleaning process. Change rubber gloves and reclean work area, alcohol
dispenser, and tools. If contamination is present after three cleaning attempts, replace the contaminated part.
3.3.15. Machined Metal Parts.
To prevent corrosion, avoid touching any machined or finished surfaces with bare hands after cleaning.
Perform the following steps to clean machined metal parts.

a. Remove surface grease with rags.
b. Immerse part in solvent and scrub until clean. Work solvent over surfaces and into holes and recesses with nonmetallic brush.
Flat wood-backed brushes with fiber bristles are recommended for surfaces. Round bottle or test-tube brushes are recommended
for holes and recesses.
c. Lift part from solvent and drain.
d. Immerse in clean solvent, rinse, and lift from solvent. Position part so that solvent is not trapped in holes or recesses.
e. Dry in dust-free, dry area. A heated, ventilated enclosure is recommended for drying, particularly if the humidity is high (above
50%).
3.3.16. Mechanical Metal Parts.
Miscellaneous mechanical metal parts include ventilating grilles, mounting plates, mounting clamps and brackets, nuts, bolts, screws,
washers, handles, fasteners, and other hardware. Clean in a suitable cleaning machine or according to applicable steps of procedures
for castings (refer to Paragraph 3.3.5).
3.3.17. Mechanical Parts With Dry Film Lubrication.
To prevent contamination, avoid touching dry film lubricated surfaces with bare hands after cleaning.
Perform the following steps to clean mechanincal parts with dry film lubrication.
a. Use a solvent vapor or spray to remove surface contamination. Work solvent over surfaces and into holes with nonmetallic
brush. Flat wood-backed brushes with fiber bristles are recommended for surfaces. Round bottle or test-tube brushes are rec-
ommended for holes and recesses.
b. Dry in dust-free, dry area. If positioning does not permit complete draining, use air jet to blow out trapped solvent. A heated,
ventilated enclosure is recommended for drying, particularly if humidity is high.
3.3.18. Meter Movement.
Meters are extremely delicate. Handle gently.
3-10
NOTE
If any soldering is performed on or near the meter, the meter should be cleaned with fresh solvent. Do not use
isopropyl alcohol on meter movements or meter stops; it leaves a residue.
Keep solvent fresh; replace it often so that a buildup of contaminants does not occur. At the workstation, keep
solvent in a covered 1-oz glass jar. When scrubbing meter parts, use small camel-hair brushes. Do not use the
solvent in the glass jar or the brush to clean anything other than meter mechanisms.
Perform the following steps to clean meters.

a. Use a small camel-hair brush and solvent to clean meter movements and stops.
b. Apply the solvent liberally to the meter mechanisms. Hold a low-pressure vacuum line next to the movements and stops to
catch any excess solvent.
c. Wait 10 seconds to let the solvent completely loosen and remove contamination.
d. Wash the meter mechanisms with solvent a second time. Let the solvent air dry. Do not use forced air to remove solvent. Keep
the meter strut away from the meter stop until the meter stop is dry.
e. Meter stops are adjusted so that the meter struts contact the stops at a 90° angle. After cleaning, allow the meter mechanism to
air dry. Once dry, store the mechanism in a clean tote box.
f. If after cleaning, the stops stick, gently scrape the stops using an X-Acto blade and repeat cleaning.
3.3.19. Molded Plastic Parts.
Plastic parts (especially knobs and switch buttons) made of polycarbonate, acrylic, or nylon are extremely sensitive
to solvents. These plastics are standard materials for the manufacture of most plastic knobs and switch buttons,
especially when a clear plastic is required for illuminated knobs or buttons.
Manufacturing cleaning solvents must not come in contact with these plastics. Unfortunately, when these plastics
are exposed to solvents there may or may not be an immediately noticeable solvent attack on the plastic. The
plastic may not show any signs of a problem but may fail (crack) at a later date due to the latent effect of the
solvent.
The only acceptable cleaning agents for these plastics are water and isopropyl alcohol. The water may be mixed
with a mild detergent and the isopropyl alcohol is used sparingly.
Parts composed of epoxy and the supporting base material are susceptible to softening if too much solvent is used.
Perform the following steps to clean molded plastic parts.

a. Blow loose dirt from surfaces, holes, and crevices with air jet.
b. Clean plastic parts using bath of 57 grams (2 oz) of detergent powder in 3800 cm3 (1 gal) of water. Remove foreign matter with
stiff-bristled brush. Wipe dry with clean, dry, lintless cloth or tissue.
c. Clean parts not containing plastics with clean, lintless cloth or tissue moistened with solvent.
d. Dry with clean, dry, lintless cloth or tissue.
3.3.20. Motors.
Do not use the procedure in Step 3.3.20.a through Step 3.3.20.b. to clean gold-plated commutators. Gold plating
may be damaged.
3-11
NOTE
Perform Step 3.3.20.d. thru Step 3.3.20.h. only if an ultrasonic cleaner is being used.
Perform the following steps to clean motors.

a. Draw a stiff fiberglass brush around the commutator in one direction. Do not draw brush back and forth on commutator. Clean
just enough to remove oxidation (dark colorization). Twice around the commutator is sufficient.
b. Carefully use fiberglass brush to clean brushes on brush ring.
c. Use a vacuum to remove any glass fibers from rotor and brush ring.
d. Place rotor with commutator up and brush ring components in ultrasonic cleaner basket. Clean parts for three minutes in Mi-
crocare Vericlean.
e. Allow solvent to drain off rotor and brush ring.
f. Place basket with rotor and brush ring in vapors from degreaser and spray rotor with Microcare Vericlean (refer to Section 1
(Materials), Table 1-4), electronic grade solvent.
g. Remove basket with parts from degreaser vapors and allow to drain.
h. Use gloves when handling rotor and brush ring. Remove from basket and place in a clean, moisture-proof container until
reinstalled.
Do not keep solvent on brush ring or rotor any longer than 30 seconds. Damage may occur to epoxy insulation.
NOTE
Perform Step 3.3.20.i. through Step 3.3.20.k. if manual cleaning is performed.
i. Use a soft brush to swab solvent on brush ring and rotor.

j. Allow brush ring and rotor to dry.
k. Use gloves when handling rotor and brush ring. Place in a clean, dust- and moisture-proof container until reinstalled.
3.3.21. Sliprings.
Perform the following steps to clean sliprings.
a. Clean sliprings with toluene on all surfaces of the ring.
b. Examine rings under 25X magnification under ambient light conditions for evidence of extraneous contaminants. Any black-
ened areas evidenced on previously used rings must be removed with a sharpened orange stick.
The insulation area must not be touched during the process of cleaning with the orange stick.
c. If cleaning is required with the orange stick, an additional cleaning with toluene must again be repeated.
d. Evidence of black, worn particles that cannot be removed is a cause for replacement of the rings.
3.3.22. Sockets.
Do not use metal tools to remove foreign matter from socket contacts. Damage to contact plating causes corrosion.
Replace any socket having corroded contacts.
3-12
Perform the following steps to clean sockets.

a. Remove rosin from plated contacts with hardwood stick sharpened to wedge point.
b. Clean contacts with small, soft-bristled brush moistened with solvent.
c. Using clean, lintless cloth or tissue moistened with Heptane solvent, remove foreign material from body of socket.
d. Dry with air jet.
3.3.23. Hydraulic Fluid Contamination.
Perform the following steps to inspect for hydralic fuel contamination.
a. Inspect the unit for signs of exposure to Skydrol or other hydraulic fluids. Indications of hydraulic fluid contamination consist
of:
• An unusual oily film.
• Corrosion, with or without an oily surface.
• A blue/purple film (an indication of Skydrol).
• Damaged Humiseal, appearing almost like it was melted due to efforts to chemically clean the unit of hydraulic fluid or as
a result of long term exposure to hydraulic fluid.
b. Units contaminated internally with Skydrol or other hydraulic fluids cannot be cleaned and recertified due to the caustic nature
of hydraulic fluid, the ease of which hydraulic fluid migrates, and the possibility of concealed damage, unless the contaminated
assemblies are replaced or an exception is granted (refer to Step 3.3.23.f).
c. It is permissible to remove Skydrol from external mechanical parts such as dust covers, exposed chassis, and sealed servos
using Kyzen Cybersolve 141R (CPN 005-3205-010) provided that Skydrol has not internally entered the unit. While cleaning
the mechanical parts, be careful to prevent Skydrol from migrating into the unit.
d. When a unit is identified as being contaminated internally with Skydrol or other hydraulic fluid, and the contaminated electronic
assemblies (circuit boards) are not replaced, the equipment type number, part number, and serial number information must be
documented by/for the authorized service center, and attached to the unit is the message "This unit has been contaminated with
hydraulic fluid (fluid 41/MIL-H-5606) and should not be recertified unless contaminated assemblies are replaced."
e. When a unit contaminated with Skydrol on the exterior surfaces has been cleaned and is ready to be returned to service, the
equipment type number, part number, and serial number information, in addition to the satisfactory completion of the return to
service testing, must be documented by/for the authorized service center, and attached to the unit is the message "This unit has
been contaminated with hydraulic fluid (fluid 41/MIL-H-5606)." Specify details of any mechanical assemblies where cleaning
was performed, applicable details on any assemblies that were replaced, and that the unit was returned to service.
NOTE
If an exception for internal cleaning of Skydrol is granted, the work performed must be recorded, giving details of
the exception.
f. Exceptions: If it is felt there is a specific exception to these instructions, which would allow cleaning of the interior of a contam-
inated unit, contact the authorized service center quality administrator. An exception may be granted pending a unit evaluation
by the OEM engineering/manufacturing/quality department. An exception may also be granted if Skydrol has contaminated
non-electrical areas.
3-13/(3-14 Blank)
523-0768039
CHAPTER 4
CHECK
4.1. INTRODUCTION.
This section presents guidelines that should be used to determine the operating condition of disassembled and cleaned assemblies
and components. These guidelines are written to cover the general requirements of all equipments. It is only necessary to review
those guidelines that are applicable to the equipment being checked. To determine what applies, refer to the paragraph headings.
Inspection reveals defects or flaws that result from wear, damage, deterioration, or other causes. Any component or piece part that
is determined to have a defect or flaw as listed in these guidelines should be repaired (if repair procedures are given) or replaced.
Refer to the Section 5 (Repair) for replacement of defective parts.
4.2. PROCEDURES.
Examine the equipment for damage and deterioration. Items to be checked and possible defects to look for are outlined in the
following paragraphs.
a. External inspection before power is applied.
(1) Inspect the exterior of the unit for any obvious signs of physical damage.
(2) Inspect for loose or missing hardware.
(3) Inspect condition of connectors, check for debris and integrity of the contacts
(4) Determine if there are signs of loose hardware inside the unit.
Make sure power is off before you open the unit.
Obey the Electrostatic Discharge Sensitive (ESDS) precautions given in this publication.
b. Internal inspection after power has been applied and initial tests performed.
(1) Use the applicable maintenance manual for disassemble procedures. Open side door or remove cover(s) to gain access to
the unit modules or subassemblies.
(2) Inspect internal connection and cable integrity. Make sure all connections are fully mated.
(3) Inspect Humiseal conformal coating, Make sure no Humiseal is on electrical connections.
(4) Inspect for loose hardware.
(5) Inspect for physical damage.
(6) Inspect for signs of electrical damage caused by excessive current or voltage.
4-1
CHECK 523-0768039
4.2.1. Bearings.
All inspections require the utmost cleanliness. Operators handling bearings should wear rubber gloves or finger-
stalls to prevent corrosion from fingerprint residue.
Do not add any type of preservation material to the bearing. The preservation can contaminate the bearing lubri-
cant.
NOTE
Most bearings have been lubricated for the life of the bearing by the bearing manufacturer. Unless specific in-
structions are given in the component maintenance/overhaul manual it is not recommended that bearings be re-lu-
bricated.
The following basic inspection procedures apply to all bearings used in most equipment. The bearing should be inspected to deter-
mine whether it is reusable or is to be replaced. Critical bearing tolerances can be found in the Check Section of the appropriate
component maintenance/overhaul manual. It is recommended that worn or defective bearings be replaced with new bearings. If
determined usable, the bearing should be reinstalled in the unit or properly wrapped and packaged for storage. Packaging should
be marked clearly on the outside to identify the contained bearing. Any bearing that was cleaned with a cleaning agent in a bear-
ing-cleaning machine, or by hand-washing, should be replaced.
4.2.1.1. Bearings, Porous Bronze.
a. Inspect bearing for pitted, scarred, scuffed, or smeared load-bearing surface. (A smeared bearing surface seals the pores in the
metal, thus preventing proper lubricating action.)
b. Inspect for burns, corrosion, blue discoloration, or any abnormal condition occurring on the load-bearing surface.
4.2.1.2. Bearings, Ball.
a. Check for blue discoloration on any part of the bearing. The discoloration of the metal elements indicates excessive operating
temperature (overheating), commonly caused by improper or inadequate lubrication.
b. Check for tarnished outer surfaces (indicated by a light discoloration of highly finished surfaces).
c. Check for rust.
d. Check for pitted, scarred, scuffed, or galled surfaces of bearings, balls, and races.
e. Check for bent or damaged shields and shield retaining wires.
f. Check for signs of bearing magnetization (attraction between bearings or bearing attraction to iron or steel).
g. Check for undersized Outside Diameter (OD) caused by creepage of outer race in its housing. (Refer to the component mainte-
nance/overhaul manual for bearing tolerances.) This applies to all ball bearings with races that do not separate when the bearing
is removed from associated parts. Also, check for oversize or defective bore caused by the inner race having turned on its shaft
and for excessive radial play. Evaluate bearing by manually rotating the outer race with the gloved finger while the bearing is
held by a bearing holder inserted in its bore. Hold the bearing in several positions while making the check. Listen and feel for
any vibration, clicks, intermittent resistance, or for a totally frozen bearing.
4.2.2. Capacitors.
Inspect capacitors for defects listed in Table 4-1. A capacitor showing any of these defects should be replaced.
4-2
CHECK 523-0768039
Table 4-1. Fixed Capacitor Inspection
DEFECT METAL TYPE MOLDED TYPE CERAMIC

Leakage of electrolyte (at case seams or around terminal insulation) X
Cracked, broken, or charred terminal insulation X
Case damage (dents or holes) X
Case damage (cracks or breakage) X
Loose, broken, or corroded terminal studs, lugs, or leads X X X
Loose, broken, or poorly soldered studs, lugs, or leads X X X
4.2.3. Cathode Ray Tubes.

Inspect wiring (especially anode and focus leads) for cracked or torn insulation, and charring. Inspect Cathode Ray Tube (CRT)
face for scratched or broken face lens. Check neck of CRT for cracks. Inspect CRT chassis for dents or other damage. Also, check
the CRT for a condition known as imprinting. Imprinting is evidenced by being able to "see" an image on the CRT when it is turned
off, or by being able to "see" an image other than the one desired. This condition occurs when a CRT has been operated at maximum
brightness for extended periods of time. Proper management of the intensity controls minimizes the chances of imprinting and helps
to maximize the service life of the CRT. Rockwell Collins recommends that the intensity controls not be left in the maximum bright
position unless conditions (such as direct sunlight, etc.) dictate that maximum brightness be used. When those conditions requiring
maximum brightness are no longer required, adjust the intensity controls to lower the brightness of the CRT to a comfortable viewing
level.
4.2.4. Chassis, Dust Covers.
Inspect chassis and dust cover for deformation, dents, punctures, badly worn surfaces, damaged connectors, damaged fastener de-
vices, deteriorated/missing grommets, or damaged handles. Inspect for corrosion and damage to finish that requires work in finishing
department.
4.2.5. Connectors, Test Jacks.
Inspect connector bodies for broken parts, deformed shells or clamps, and other irregularities. Inspect for cracked or broken insu-
lation and for contacts that are broken, deformed, or out of alignment. Inspect for corroded or damaged plating on contacts and for
loose, poorly soldered, broken, or corroded terminal connections.
4.2.6. Controls.
Check controls for freedom of movement, legibility of lettering and solid mounting.
4.2.7. Covers and Shields.
Inspect covers and shields for punctures, deep dents, and badly worn surfaces. Inspect for damaged fastener devices, corrosion, and
damage to finish that requires work in finishing department.
4.2.8. Dry Film Type Lubrication.
Visually inspect dry filmed (electrofilmed) components for a smooth dull coating, black or gray in color. Perform the following steps
for dry filmed component inspection.
a. Check for chipped or flaked lubrication coating.
b. Check for lubrication that is so thin that base metal can be seen through the lubrication.
c. Check for oil contamination on dry film (bright reflection).
4.2.9. Gears, Metal.
Minimum clearance for a moving part on gear assemblies is 0.003 inch with the parts in their worst relative position. Perform the
following steps for metal gears inspection.
a. Inspect gears for broken, chipped, or badly worn teeth.
4-3
CHECK 523-0768039
b. Inspect gears for cracks and deformation.

c. Inspect surfaces for corrosion or other abnormal conditions.
4.2.10. Gear Trains.
Perform the following steps for gear trains inspection.
a. Rotate gear trains manually. The contacting surfaces of the gear teeth should be smooth and free from interference due to
improper tooth contour or lack of clearance. The action should be smooth throughout at least one complete rotation of the
larger gear, in both directions, and free from excessive irregular movement or "toothy" effect (some toothiness is normal in
loaded gear assemblies).
b. Gears should be engaged a minimum of 60% of full tooth engagement.
c. Width of tooth contact should be at least 75% of the width of the thinner gear, except that gears less than 0.030 inch thick must
have full width contact.
4.2.10.1. Beveled Gears. Beveled gears should have not more than 10% of their width unmeshed. Some applications may vary;
these are called out in either the alignment or assembly sections of the component maintenance/overhaul manual.
4.2.10.2. Gear Loading.
a. Loaded gears should have the proper amount of load as specified in the appropriate component maintenance/overhaul manual
or assembly drawings.
b. In no case should a loaded gear spring be fully compressed or stressed to the point it mechanically binds.
c. Binding in a loaded gear assembly should not be permitted where it may cause the loading to be ineffective.
d. Direction loading in a gear assembly should be consistent with the design of the loading spring and the assembly drawings.
e. Check for any separation of the sections of a loaded gear to the extent that the loaded spring could become disengaged. Gaps
between loaded sections should be less than half the face width of the thinner gear.
4.2.10.3. Clamping Adjustable Gears.
a. Where gears are designed with adjustable clamps, the screw through the clamp may require lubrication. When lubrication is
required to prevent a false indication of tightness, the engineering documentation must define the lubricant to be used.
b. After tightening, the lips of the clamp must not be touching.
c. Where a setscrew collar is used, the screws should not be engaged in the slot(s) of the split hub.
d. Setscrews used on gears require additional locking means other than torquing.
4.2.11. Indicators, Lamps.
Perform the following steps for indicators and lamps inspection.
a. Check indicators for broken, cracked or loose lenses or hardware.
b. Inspect for lamp filament damage and, when applicable, legible lettering.
4.2.12. Insulators, Ceramic or Plastic.
Inspect ceramic or plastic insulators for evidence of damage, such as broken or chipped edges, burned areas, or foreign material.
4.2.13. Jacks.
Inspect jacks for corrosion, rust, loose or broken parts, cracked insulation, and bent or bad contacts.
4.2.14. Laminated Circuit Boards.
Perform the following steps for laminated circuit boards inspection.
a. Inspect circuit cards for deformation, delamination of the substrate material, and check for charring or blistering.
b. Check for broken leads, poor solder joints, loose or cut jumper wires or circuit traces.
c. Check for loose and missing hardware, corrosion, dirt, film or other foreign matter.
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4.2.15. Machined Metal Parts.

Perform the following steps for machined metal parts inspection.
a. Inspect for physical damage to surfaces, corners, and edges.
b. Inspect closely all machined surfaces, holes, bores, counterbores, slots, grooves, shoulder, flanges, teeth, tapped holes, and all
threaded members, both male and female, for damage of any sort, including roughness of surface, corrosion, or foreign matter.
c. Inspect plated or finished areas for damage requiring replating or refinishing beyond touch up repair.
4.2.16. Mechanical Metal Parts.
Perform the following steps for mechanical metal parts inspection.
a. Inspect unmachined mechanical metal parts, including mounting plates, chassis, mounting clamps and brackets, nuts, bolts,
screws, washers, handles, fasteners, and hardware for damage or deformation.
b. Inspect for corrosion and any damage that would require replating or refinishing beyond practical touchup.
4.2.17. Meter Mechanisms.
Perform the following steps for meter mechanisms inspection.
a. Check for signs of excessive wear around magnet.
b. Check for binding or sticking of meter coil throughout its full deflection.
c. Check for physical damage to case, cracked or broken insulation and meter stops, and bent or worn indicator needles.
4.2.18. Molded Plastic Parts.
Perform the following steps for molded plastic parts inspection.
a. Inspect plastic parts, such as terminal boards, mounting blocks, and insulating members for signs of corrosion, cracked or
charred insulation, and loose or missing mounting hardware.
b. Inspect for other abnormal indications that might be a source of later breakdown.
4.2.19. Motors, Potentiometers, Synchros.
Perform the following steps for motors, potentiometers and synchros inspection.
a. Check all parts for signs of excessive heating (blueing of components).
b. Inspect for physical damage to case, cracked or broken insulation, loose or corroded wire or terminals, worn brushes (if appli-
cable), loose/missing mounting hardware, bent or deteriorated drive surfaces, cracked or broken seals, and binding or sticking
bearings.
4.2.20. Resistors.
Perform the following steps for resistors inspection.
a. Inspect fixed composition resistors for cracked, broken, blistered, swollen, or charred bodies and loose, broken, poorly soldered,
or corroded terminal connections.
b. Inspect fixed wire-wound resistors for signs of heating (blueing of leads, browning of resistor body); cracked, broken, or charred
insulation; loose, poorly soldered, broken, or corroded terminal connections; and loose mounting.
4.2.21. Semiconductors.
Perform the following steps for semiconductor inspection.
4.2.21.1. Visual Inspection. Inspect diodes, silicon-controlled rectifiers, and transistors for cracked, broken, blistered, or charred
bodies. Inspect for loose, broken, poorly soldered, or corroded terminal connections.
4.2.21.2. Transistor Testing With An Ohmmeter. If a transistor tester is not available during maintenance, an ohmmeter may, in
some cases, be used to perform fundamental checks to determine transistor serviceability. The ohmmeter does not make absolute
checks, and must not be considered as entirely suitable for all transistors. It does give an accurate indication of quality for switch-
ing transistors and for most amplifier and oscillator transistors. To determine the suitability of a particular ohmmeter for use with
transistors, three characteristics of the instrument must be known. The voltage applied at the test leads must be known. This voltage
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CHECK 523-0768039
changes as the ohmmeter range is changed, and must not exceed 3 to 5 volts. The current available from the internal batteries of
the ohmmeter must be known. Current also changes as the ohmmeter range is changed. Current must not exceed one milliampere.
Also, the polarity of the voltage applied to the ohmmeter test leads must be known. The Triplett model 630 multimeter is well suited
for transistor testing. Voltage available is 1.5 Volts direct current (V dc) on the R X 1000 range. Current available on the R X 1000
range is 0.3 mA. Test lead polarity is positive on the Common (COM) lead, negative on the Voltage (V) lead. During transistor
testing, it is recommended that the test leads be reversed so that the red lead is positive. In the test steps which follow, the positive
lead referred to is the lead which exhibits positive polarity when measured with an external voltmeter. The Triplett 630 multimeter
is an equivalent instrument and may be used if voltage and current output values are within the limits mentioned in this paragraph.
Perform the following steps to test transistors with an ohmmeter.
a. To prepare for testing, remove at least two leads of the transistor from the circuit. If it is impossible to remove the transistor
from the circuit, examine the module schematic and determine the approximate total shunt resistance bridging the two transistor
elements to be checked. Take this resistance into account when performing the following steps. In general, the resistance
indications at the high end of the ranges given apply to small-signal transistors, while the resistance indications at the low end
of the range given apply to large-signal or power transistors. The resistance values stated in the following steps are approximate,
and varies over a wide range with different transistor types and different ohmmeters. The important observations to be made
are:
• The ratio of resistance indications when the ohmmeter leads are reversed
• A open-circuit indication
• A short-circuit indication
b. To test PNP transistors:

(1) Connect the positive lead of the ohmmeter to the emitter, the negative lead to the base. Ohmmeter indication should be
approximately 50 to 150 Ω.
(2) Connect the positive lead of the ohmmeter to the base, the negative lead to the emitter. Ohmmeter indication should be
approximately 30 kΩ to 60 kilohm (kΩ). If the absolute value of resistances read differs greatly from the values above,
check that the ratio of resistances is on the order of 500 to 1 or greater. Indications with large variations from the above
probably indicate a defective transistor.
(3) Connect the positive lead of the ohmmeter to the collector, the negative lead to the base. Ohmmeter indication should be
approximately 50 to 160 Ω.
(4) Connect the positive lead of the ohmmeter to the base, the negative lead to the collector. Ohmmeter indication should be
approximately 30 kΩ to 60 kΩ. If the absolute value of resistances read differs greatly from the values above, check that
the ratio of resistances is on the order of 200 to 1 or greater. Indications with large variations from the above probably
indicates a defective transistor.
(5) Connect the positive lead of the ohmmeter to the emitter, the negative lead to the collector. Ohmmeter indication should
be approximately 100 to 7 kΩ.
(6) Connect the positive lead of the ohmmeter to the collector, the negative lead to the emitter. Ohmmeter indication should
be approximately 5 kΩ to 60 kΩ. If the absolute value of resistances read differs greatly from the values above, check
that the ratio of resistances is on the order of 8 to 1 or greater. Indications with large variations from the above probably
indicate a defective transistor.
(7) Connect the positive lead of the ohmmeter to the base and emitter, the negative lead to the collector. Ohmmeter indication
should be approximately 5 kΩ to 60 kΩ.
(8) Connect the positive lead of the ohmmeter to the emitter, the negative lead to the base and collector. Ohmmeter indication
should be approximately 100 Ω. If the absolute value of resistances read differs greatly from the values above, check that
the ratio of resistances is on the order of 200 to 1 or greater. Indications with large variations from the above probably
indicate a defective transistor.
c. The tests for NPN transistors are identical to those for PNP transistors in Step 4.2.21.2.b above except that the polarity of the
ohmmeter voltage is reversed for all parts of all checks. Indicated resistances and resistance ratios are the same.
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4.2.22. Sockets.
Perform the following steps for sockets inspection.
a. Inspect sockets for loose, broken, or missing socket-mounted rings. Inspect for cracked, broken, or charred insulation.
b. Inspect for broken, corroded, or deformed contacts and loose, poorly soldered, broken, or corroded connections.
4.2.23. Soldered Terminal Connections.
Perform the following steps for soldering terminal connections inspection.
a. Inspect soldered terminal connections for cold-soldered or rosin joints. These joints present a porous or dull, rough appearance.
Check for strength of bond using the point of a tool.
NOTE
Lead-free solder joints will normally be dull in appearance.
b. Examine for excess of solder, protrusions from the joint, pieces adhering to adjacent insulation, and particles lodged between
joints, conductor, or other parts.
c. Inspect for insufficient solder and unsoldered strands of wire protruding from conductor at joint.
d. Also, look for insulation that is stripped back too far from joint, badly frayed at joint, or buried in solder.
e. Inspect for corrosion (verdigris) on copper conductor at the joint.
4.2.24. Solenoids.
Perform the following steps for solenoids inspection.
a. Check solenoid support members for deformation causing misalignment or improper operation.
b. Check the plunger for sluggish action or sticking at any point of travel in either direction.
c. Check for loose coil, corrosion, loose leads or terminals, and for cuts and other damage.
d. Inspect for loose, broken, brittle, or charred insulation on coil or leads between contact support members and between terminals
on relay.
e. Inspect for bent, loose, or broken terminals.
4.2.25. Springs.
Perform the following steps for springs inspection.
a. Check springs for nicks and tool marks that cause stress concentration.
b. Inspect for kinks or bends in the spring shanks and body.
4.2.26. Transformers and Reactors.
Perform the following steps for transformers and reactors inspection.
a. Inspect transformers and reactors for signs of excessive heating (blueing, warpage), damage to case, cracked or broken ceramic
insulators, and other irregularities.
b. Inspect for corroded, poorly soldered, or loose terminals and loose, broken, or missing mounting hardware.
4.2.27. Wiring.
Inspect open and laced wiring of chassis, terminal boards, and parts of equipment. Nicks that exceed 0.25 inch of the smallest
cross section of a conductor should be considered equivalent to a severed strand and should not exceed the limits set in Table 4-2.
Shielded braid on a wire or coaxial cable should have no more than 0.125 inch of the strands or circumference broken or nicked.
Wiring insulation that has cuts, abrasions, burns, or pinch marks which expose the wire conductor or shield should be replaced.
Inspect wiring for improper dress in relation to adjacent wiring and chassis. Ensure wiring is not routed to come into contact with
moving parts, sharp metallic edges (including screw threads) or interference with installation of covers or modules.
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Table 4-2. Wire Nicked/Broken Strand Allowance
MAXIMUM ALLOWABLE NICKED OR BROKEN

NUMBER OF STRANDS
STRANDS
Less than 7 0
7 through 15 1
16 through 18 2
19 through 25 3
26 through 36 4
37 through 40 5
41 or more 6
4.2.28. RF Assemblies.
The check criteria for Radio Frequency (RF) circuitry is not the same as for low-frequency circuitry. Perform the following steps
for RF assemblies inspection.
a. Check for loose components, excessive lead lengths, and foreign matter.
b. Inspect soldered components for cold-soldered or rosin joints. These joints present a porous or dull, rough appearance. Check
for strength of bond using the point of a nonmetallic tool.
NOTE
Lead-free solder joints will normally be dull in appearance.
c. Examine for insufficient solder. Solder should cover the lead up to the body of the component. A slight imprint of the component
lead should be visible. This requirement is different from sub-RF soldering requirements.
d. Look for insulation that is stripped back too far from joint, badly frayed at joint, or buried in solder.
e. Inspect for corrosion (verdigris) on conductor material.
f. Check for nicks in circuit traces or component leads that can change the inductance characteristics of the circuit.
g. Most RF circuit cards are made of either Teflon, polyimide, or ceramic material. A loose component land or circuit trace on an
RF circuit card is normally nonrepairable. Trying to repair one of these circuit cards could alter the inductive characteristics to
the point that the circuit would not work correctly. If, upon inspection, an RF circuit card has a circuit defect, return the circuit
card to the factory for repair analysis.
4.2.29. Radar Flatplate Antenna.
Rockwell Collins flatplate antennas are constructed of brazed aluminum. Inspect for surface blemish and corrosion to the iridite
chromate finish. Perform the following steps for radar flatplate antenna inspection.
a. Check the surface finish for scratches and discoloration due to minor corrosion. Base metal must not be exposed. Surface finish
does not pertain to any area where excess braze material has flowed.
b. Areas of the antenna that have had base metal surface touch up using iridite chromate may display a different appearance than
surfaces treated in the initial conversion coating. The touched-up areas may be lighter on original base metal or a dull gray
when a braze splatter area has been hydrohoned.
c. Minor corrosion or scratches on the outside edge of the antenna have no effect on the electrical performance of the flatplate but
must be reiridited.
4.2.30. Solder Station ESD Check.
To identify defective/unacceptable solder stations, use Tektronix 2440 storage oscilloscope or equivalent. Set up the oscilloscope as
follows and perform the following steps.
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• volts/division 10 volts
• trigger mode normal
• trigger slope positive
• trigger level 2 volts
• time/division 1 µs
• probe x10
a. Turn solder iron on and allow to reach temperature.

b. Connect oscilloscope probe to barrel of solder iron (if tip is too hot, it melts the probe). Ground lead to power ground.
c. Measure spike. A power surge of 0-80 volts is observed as power is applied or removed from the tip. The power cycle time for
a solder iron at temperature is 20-60 seconds.
d. Solder systems with a spike greater than 50 volts must be discarded or marked "not ESD approved". A "not ESD approved" iron
may be used on equipment that does not contain ESD components or for applications that do not affect the ESD components
(example: applying ident strip to front panels).
4.2.31. Self-Adhesive Labels and Decals (General).
Labels and identification plates on the exterior shall be undamaged in appearance and readable without the aid of magnification.
a. Labels shall adhere to the surface that they are applied to and not exhibit tearing, peeling, lifted corners/edges, or other visible
loosening of the label.
b. Decals and labels shall be smooth, undamaged, and free of air bubbles.
c. Markings (letters/numbers/images) shall be clearly legible, free of objectionable scratches or blemishes.
d. Two adjacent labels should not overlap or obstruct markings on either label.
4-9/(4-10 Blank)
523-0768039
CHAPTER 5
REPAIR
5.1. INTRODUCTION.
The repair procedures contained in this section are of a general nature and apply principally to planar assemblies, including the repair
of circuit trace, connector, and component damage. The disassembly and assembly instructions, found in the equipment manuals,
provide the replacement instructions for most defective components other than planar cards. Repair procedures that are unique to a
unit appear in the maintenance section provided for that equipment.
There are two general types of component placement on planar assemblies. One technique uses thru-hole component mounting
technology, the other uses surface mounting technology. Both methods have been in existence for several years. Because of better
reliability and lower cost, the thru-hole method of mounting components has been the standard circuit card loading method. Re-
cently, Surface Mount Device (SMD)s have seen a resurgence and are being integrated into the design of many circuit cards. SMDs
have the advantage of smaller size and lighter weight over standard thru-hole devices. This reduces both card size and component
spacing. Because of the small size and compactness of surface mounted devices, special tools and equipment are required to repair
planar cards. Repair of SMD planar cards is more exacting, making it important to follow precise repair procedures. This section
is arranged to provide thru-hole component replacement procedures, surface mount component replacement procedures and then
circuit card connector and circuit trace repair procedures. These procedures are for Rockwell Collins avionics equipment and may
not be compatible with equipment from other vendors.
Faulty parts usually are detected by performing either the check procedures as listed in this reference manual or the testing or trou-
bleshooting procedures in the equipment maintenance manual. Before installing a new part, it should be inspected and tested.
Most of the repair or replacement instructions found here apply to disassembled equipment. Refer to the equipment’s Disassembly
section for the proper removal instructions.
Upon completion of a repair, install the assembly in the parent equipment and run a complete performance test as indicated in the
equipment maintenance manual. This test is necessary to ensure that the assembly has been restored to proper working order and
no new discrepancies have been introduced. Perform troubleshooting as required. Refer to applicable procedures in the equipment
maintenance manual.
5.2. REPAIR TOOLS AND SUPPLIES.
When making continuity checks after a repair, ensure that the measuring instrument does not use a voltage source
capable of destroying the microcircuits. Instruments such as vacuum tube or transistorized multimeters that op-
erate on a 1.5-V battery in the ohm function are acceptable for this purpose. Short circuit current should be less
than 1.0 mA. Refer to Transistor Testing With an Ohmmeter, Paragraph 4.2.21.2.
Ensure that the proper tools and replacement parts are on hand before beginning any repair activity. When acquiring replacement
parts, refer to the units parts list for correct nomenclature and part number. Refer to the Section 2 (Tools) for a list of general supplies
needed to perform repair procedures. Special tools required are listed in the Special Tools, Fixtures, and Equipment section of the
equipment’s component maintenance/overhaul manual.
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5.3. REPAIR AND REPLACEMENT PROCEDURES.

5.3.1. General.
Remove power cable before disassembling any portion of the equipment. Disassembling the equipment with the
power cable connected is dangerous to life. Leaving power applied may also cause voltage transients that can
damage the equipment.
When troubleshooting intermittent faulty circuits, do not use high-velocity dry air to heat components. High-
velocity dry air can produce large amounts of static electricity which damages surrounding components. To apply
heat to a component, use special infrared heat devices or approved heat gun. To cool components, use dry ice or
an approved aerosol spray. Refer to Section 1 (Materials) for a list of general supplies needed to perform repair
procedures.
Ensure circuit cards are dry prior to application of soldering iron or hot air blowing solder processes. If circuit
cards have been exposed to humidity in excess of 50%, baking is recommended; 30 minutes at +75°Centigrade (C)
(+167°Fahrenheit (F)).
NOTE
September 2006, Rockwell Collins applied Humiseal 1H20AR1 Rockwell Collins Part Number (CPN) (821-1669-
xxx) water based conformal coating to several products. That coating provided improved protection in several ar-
eas, but was more difficult to rework in the field. Section 5.3.1.2 provides guidance for field rework of this coating.
As of April 2015, this coating is obsolete and no longer available for use. It has been determined that 1H20AR1
coating can be patch coated with Humiseal 1B31.
The following steps are general procedures when starting the repair and replacement process.
a. Refer to the Safety Summary section for the general advisories that apply to the following procedures. Use the procedures to
replace the applicable component or make repairs.
b. Inspect the assembly to detect hot spots or any other abnormal deterioration of components.
c. Mark or otherwise identify, all disconnected electrical wiring. Make note of color coding, placement of leads, and methods of
applying insulation (if any) before unsoldering or removing any electrical parts.
d. Initially, most repair activity on a circuit card requires that the HumiSeal protective coating be removed (refer to Paragraph
5.3.1.1).
5.3.1.1. HumiSeal 1B31 Removal.
HumiSeal 1B31 and most solvents have a low flash point and are highly flammable until completely dry. There-
fore, they should be used only in areas approved for use with flammable materials. Do not expose these materials
to excessive heat or to open flame (this includes all smoking materials). Keep containers closed when they are not
in use. Use these materials only in areas that are adequately ventilated. Avoid prolonged breathing of vapors and
repeated contact of materials with skin.
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REPAIR 523-0768039
Use of nonrecommended solvents to clean planar cards may cause extensive damage to the cards and the compo-
nents on them. The type of damage inflicted by some solvents includes delamination of circuit traces, delamina-
tion/measling (bubbling of surface) of card layers, dissolving of adhesives, unwanted drying of components’ nat-
ural oils and destroying component lettering. Compare the chemical makeup of solvents claimed to be equivalent
with those recommended for exact chemical equivalency. Total board stripping to replace a few failed components
is not recommended for the above stated reasons.
NOTE
For Humiseal 1B31 coating removal or for spot removal for repairs or rework, toluene or other Application En-
gineering approved solvent may be used. Approved alternatives include, but are not limited to, xylene (CPN
005-2954-100) and Chemtronics Electro Wash Two Step (CPN 005-3512-020).
Humiseal 1H20AR1 does not readily dissolve in many solvents and other rework methods are needed.
To identify if the coating is Humiseal 1B31 or Humiseal 1H20AR1, take a cotton swab wetted with toluene and
swab the rework area. If the coating readily dissolves, then the coating is Humiseal 1B31 and the rework methods
of Paragraph 5.3.1.1 apply. If the coating does not dissolve readily, then the coating is Humiseal 1H20AR1 and the
rework methods of Paragraph 5.3.1.2 must be used. Exposure to toluene removes the gloss of Humiseal 1H20AR1,
but does not remove the coating itself. If toluene or xylene is not available, a soldering iron can be touched to
the coating of the rework site. If the coating blackens, emits a foul odor, and gets stringy, it is Humiseal 1B31.
Otherwise the coating is Humiseal 1H20AR1.
a. For coating removal or for spot removal for repairs or rework, toluene or other Application Engineering approved solvent may
be used.
(1) Use cotton swabs, pipe cleaners, or small brush and solvent listed in Section 1 (Materials) to remove conformal coating
from the repair area. Resoak as necessary to remove all coating. Do not reuse cotton swab or contamination results.
(2) Use of fiber probes is nonpreferred for HumiSeal removal because it is readily removed by solvents. Take care to contact
only the areas of coating to be removed.
(3) Use a cloth to absorb all excess solvent. Turning the planar card on its edge and gently tapping it against the work surface
(an air jet can also be used) aids in removing any trapped solvent or debris.
b. Any single Printed Wire Assembly (PWA) or batch of coated PWAs, that has to be reworked needs the conformal coating
stripped, then put through the applicable cleaning, drying and coating processes again. Toluene or other approved solvent is
used to strip the coating. A black light is used to verify the coating has been completely removed.
5.3.1.2. Rework/Repair of 1H20AR1 Coating. This section covers rework and repair methods for assemblies coated with Humiseal
1H20AR1 coating. These rework procedures can be generalized for most rework tasks. Printed wiring assemblies coated with
Humiseal 1H20AR1 (now obsolete) may be patch coated with Humiseal 1B31.
5.3.1.2.1. Thermal Removal (Alternate). Due to the thermal stability of the water-based conformal coating, the preferred method
of component removal is to thermally displace the coating with soldering tools, with no prior chemical stripping. When the soldering
tools are properly cleaned and cared for, using standard practices, no degradation in solder tools occurs. The application of reflow
temperatures causes the water based coating to momentarily soften, allowing easy removal of parts with hand tools (example: needle
pointed tweezers).
5.3.1.2.1.1. Surface Mount Devices (SMDs). SMDs may be removed from assembly surfaces using thermal tweezers or soldering
irons, by directly applying the hot surface to the coated solder joint, reflowing the solder, and removing the part from the board.
The surfaces to be soldered may then be treated in accordance with applicable rework and repair instructions. Large components,
such as Quad Flat Pack (QFP)s, may be similarly removed using the thermal displacement method. A small amount of gentle lateral
pressure may be necessary to overcome the adhesive force of any residual coating under the component. Wrapping the component
with wire solder to improve thermal transfer is acceptable. Hot gas rework stations may also be used to remove components such
as Ball Grid Array (BGA)s. As with QFPs a small amount of gentle upward pressure, using a metal probe, may be necessary to
overcome residual coating adhesion, after the solder has come to a liquid condition.
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5.3.1.2.1.2. Through Hole Components. Through hole components may be removed by thermal displacement methods. If vacuum
desoldering tools are used, the coating may cause obstruction of the vacuum tube. In such cases, it is recommended that the coating
be first removed, either by mechanical methods (example: peeling the coating away) or spot removal with the chemical pens, prior
to vacuum desoldering. Desoldering through holes may also be performed using braided solder wick applied to the coated solder
connection.
5.3.1.2.1.3. Connectors. Large connectors may be removed by individually desoldering pins, using either solder wick applied
directly to the coated solder connection, or by using vacuum desoldering tools. Large connectors may also be removed by mass
soldering using flowing solder pots (solder fountains). Mask off the areas to be protected using high temperature polyimide tape.
Apply the flowing solder wave to the connector pins and remove in accordance with standard rework procedures. After removal, any
residual coating may be removed by brushing with a stiff ESD-safe brush. Surfaces to be soldered are then reworked in accordance
with standard rework and repair procedures.
5.3.1.2.1.4. Solder Joint Repair. Solder joints must be reworked using soldering irons applied directly to the solder, thermally
displacing the coating. If flux is used in rework procedures, the reworked site must be cleaned in accordance with the applicable
soldering process drawings, followed by touch up coating of the affected area. If no flux is used in rework procedures, the reworked
site may be touched up without cleaning.
5.3.1.2.1.5. Heavily Coated Assemblies. Selected Rockwell Collins assemblies may have exceptionally thick layers of conformal
coating applied to meet waterproofness requirements. As such, the conformal coating will essentially encase the components, mak-
ing rework of these components more difficult. The thermal rework methods are still preferred for such cases, but the Electrowash
method in Paragraph 5.3.1.2.2 is also effective.
The chemicals in these pens have a National Fire Prevention Association (NFPA), or Hazardous Material Infor-
mation System (HMIS) flammability rating of 3 and must be handled and stored as a flammable material. These
flammable chemicals should not be used near open flames or heat sources to prevent fire hazards.
5.3.1.2.2. Chemical Removal of 1H20AR1 Coating (Preferred). For localized stripping of the 1H20AR1 coating, the preferred
chemical stripper is Chemtronics Electro Wash Two Step (CPN 005-3512-020). It is not recommended that global chemical strip-
ping be attempted on assemblies with this coating applied. For spot stripping, preheating the assembly, and longer exposure times,
improves the rework time. Longer exposure times are needed if the assembly is not preheated. Use of a stiff bristle brush may help
in displacing the coating after the Electrowash material has softened the material. Water based coatings cannot be dissolved and so
may be difficult to totally remove all coating from between the leads of fine pitched parts. The Electrowash chemical can be applied
with a variety of process aids (e.g. syringe, needle-tip bottle, eye dropper, brush, swab). If the Electrowash chemical is dripped on
other areas, wipe it up immediately and clean the area with isopropyl alcohol. The gloss will be diminished, but the coating integrity
will not be affected.
5.3.1.2.2.1. Removal of Ball Grid Array BGA and similar large components. Experience has shown that removal of the water
based coating from the perimeter of a large component allows component removal using existing hot gas rework methods. Removal
of the coating from the top surface of the component improves the efficiency of component removal using vacuum pickups on hot
gas rework machines (e.g. Onyx-29). Preheat the assembly for approximately 5 minutes at 80°C to allow the assembly to warm.
Apply the Electrowash chemical around the perimeter of the device and allow the chemical to work for 1-10 minutes. Using a stiff
brush soaked in Electrowash, scrub the coating in the rework area. Firmly brush area until the coating begins to gel. Repeat the
process with the stiff brush and chemical until desired amount of coating is removed. Remove the gelled coating using process
aids such as blotting material, swabs, clean brushes, etc. Clean the area with isopropyl alcohol and allow to air dry for a minimum
of 5 minutes. Residual conformal coating in the rework site, remaining after component removal, can be removed using this same
approach. Small areas of an assembly surface can be reworked using the same methods outlined for BGA removal. Soak time for the
Electrowash material may be extended to 30 minutes. Placing the assembly under an 80°C IR lamp will also aid in the efficiency of
the removal process. Water based coating can be removed from through-holes using the same methods outlined for BGA removal.
After removal of the coating from the top and bottom sides of a hole, the plug of softened coating can be removed using compressed
air, brush bristles, or small Teflon-coated wires. Clean the area with isopropyl alcohol and allow 5 minutes to dry. After the coating
plug is removed from the hole, if it is a plated through hole, fill the hole with solder and then remove the solder. This removes any
residual coating and ensures proper solderability for components.
5.3.1.2.2.2. Chemical Pens (Not Recommended). Previously, the use of two chemicals, obtainable in metal encased pens with
fibrous tips, was allowed: Chemtronics CW3500 Conformal Coat Remover Pen (CPN 005-3512-010) which contains a mixture of
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REPAIR 523-0768039
hexamethyldisiloxane, Acetone, Propylene glycol methyl ether and N-Methyl pyrrolidone. And Trace Technologies Conformal Coat
Remover Pen (CPN 005-3512-030), which contains tetrahydrofuran (CAS #109-99-9). While these chemical pens can be used to
soften the 1H20AR1 coating, the chemicals have a very sharp odor that is objectionable to most people. The Electrowash chemical
is a safer and less hazardous material.
5.3.1.2.3. Cleanup After Chemical Stripping. Following application of the chemical and removal of the coating, the affected
area must be topically cleaned with mild brushing. A Rockwell Collins recommended topical cleaner (example: ProClean (CPN
005-2892- 010) or Bioact SC-10 (CPN 838-2543-010/020)) must be used to clean the area, followed by a rinse with isopropyl alcohol
(CPN 005-2941-100). Allow the affected area to air dry (ambient air) for a minimum of 5 minutes before re-applying coating, if
necessary.
NOTE
If any of the chemical from the chemical pens drips onto coated areas of the board outside of the rework area,
do not attempt to remove the chemical. Allow the chemical to air dry. The gloss of the coating is decreased, but
product integrity is not impacted. Similarly, flux removal chemicals may affect the gloss of the coating, but product
integrity is not impacted. If a white residue is noted in these dripped areas, it may be removed from the area after
the chemical has evaporated by a topical application of isopropyl alcohol (CPN 005-2941-100). If desired, areas
of dull finish may be touched up with a thin layer of fresh coating.
5.3.1.2.4. A global chemical stripping method for Humiseal 1H20AR1 has not been approved for general use. Do not attempt
global chemical stripping of assemblies coated with Humiseal 1H20AR1.
5.3.1.3. Clean up after Component Removal. Following removal of the component, clean the area with the Electrowash material
and rinse with isopropyl alcohol and allow to air dry for a minimum of 5 minutes.
NOTE
Component removal is best accomplished without application of flux or the spot removal chemicals, which require
additional cleaning, prior to pad preparation.
5.3.1.4. Modification Wires. This method is to be used when modification wires are to be added to an assembly coated with
Humiseal 1H20AR1.
a. Remove the coating in the area where soldering of wires will occur, using the Electrowash methods outlined above. Clean the
stripped area with isopropyl alcohol and allow to dry for 5 minutes. It is not necessary to remove the coating from the entire
modification wire run as the mod-wire adhesive can be bonded directly to the 1H20AR1 coating.
b. Solder and clean the wire termination using applicable work instructions. Apply wire bond adhesive and accelerant over the
top of the coating surface.
c. Clean the surface of the coating in the modification wire run using isopropyl alcohol and allow to air dry for a minimum of 5
minutes.
d. Solder and clean the wire terminations using applicable work instructions. Apply wire bond adhesive and accelerant over the
top of the coating surface. Touch up the wire terminations with fresh Humiseal 1H20AR1.
5.3.1.5. Labels. Due to the improved properties of the water based conformal coating, labels may be applied directly to the coating
surface, without stripping the coating.
5.3.1.6. Reapplication of Coating.
NOTE
As of 30 April 2015, Humiseal 1H20AR1 conformal coating is obsolete. A direct water-based coating replacement
has not been identified. Patch coating with Humiseal 1B31 (CPN 821-0650-020) is acceptable.
a. Method: Recoat exposed areas as needed using Humiseal 1B31 (RCPN 821-0650-020), overlapping the 1H20AR1 coating by
a minimum of 3.18 mm (.125 inch) on all sides. Allow the Humiseal 1B31 coating to come to a tack free condition, allow an
additional 15 minutes, then bake for a minimum of 20 minutes at 60°C (140°F).
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b. It is also permissible to air dry for 24 hours at ambient conditions as an alternative to baking.
5.3.1.7. Autoinserted Thru-Hole Components. Thru-hole devices can be installed on circuit cards by automated machines. When
this method is used, several hundred components can be loaded on a circuit card in a short time. To prevent all the components from
accidently being dislodged and falling off, the component leads are crimped around the thru-holes. This makes repair of autoinsert
loaded circuit cards more difficult. Essentially, the procedures listed in this section works for replacing either manually loaded or
autoinserted components. However, before the autoinserted component can be removed, all solder from all leads or connections
must be removed and the component checked to ensure that only the crimped ends of the component’s leads are holding it in place.
Once this is established, the crimped ends should be straightened to allow the component to be removed from the circuit card without
damaging the thru-holes. Replacement parts can be soldered to the autoinsert circuit cards by the manual component replacement
procedures without crimping leads.
5.3.2. Replacement of Resistors, Diodes, Capacitors, and Wires.
Perform the following steps for the removal and installation of resistors, diodes, capacitors, and wires.
5.3.2.1. Resistor, Diode, and Capacitor Removal.
Do not apply heat at a thru-hole for more than 8 seconds. Never put an iron on a pad as the pad will lift.
Hand soldering of Teflon circuit boards requires special care. Exceeding temperatures of +304°C (+580°F) de-
grades the copper to Teflon interface and result in increasing occurrence of floating pads. Refer to the Radio
Frequency (RF) section Paragraph 5.3.31 for more information.
NOTE
Before removing diodes or polarized capacitors, note polarity markings and orientation on the circuit board.
a. On the back of the board (side opposite components), place soldering iron on the lead of the component to be removed until
the solder begins to melt (see Figure 5-1). Add solder to the tip of the iron to aid in transferring the heat to the hole.
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Figure 5-1. Two-Lead Component Removal Diagram
b. Use a solder sucker and remove the solder from the hole. If necessary more solder may be added to conduct the heat into the
hole and provide better suction for removal. All the solder should be removed so that lead moves freely in hole.
c. With needle-nose pliers, remove the lead from the hole.
d. Repeat the procedure if remaining lead is not connected to ground plane. If lead is connected to the ground plane, proceed with
steps e and f.
e. On the component side of the circuit board, clip the lead as shown in Figure 5-2.
f. Apply soldering iron tip to the lead. When the solder begins to melt, grasp the lead end with needle-nose pliers. Gently extract
the lead from the thru-hole. Care must be taken that the thru-hole is completely heated and that the solder has melted on both
sides of the board. If excessive force is applied, the thru-hole may be pulled out of the board along with the lead.
g. When all leads have been unsoldered, remove component from the circuit board.
NOTE
It may be necessary to reheat some thru-holes. While reheating, use tip of soldering tool and push lead to the
center of the hole to prevent resoldering.
h. When component has been removed, reheat the ungrounded holes. When the solder is melted, use a solder sucker to remove
excess solder. Repeat procedure as necessary until the holes are clean as indicated by lack of solder on the walls, top or bottom.
Allow time for area to cool completely before reapplication of heat.
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Figure 5-2. Ground Plane Lead Removal Diagram
5.3.2.2. Resistor, Diode, and Capacitor Installation.

a. Use a small brush or the tip of a pipe cleaner dipped in solvent. Carefully clean both sides of the surface area, thru-holes, and
pads. For areas damaged by electrolyte, refer to Section 3 (Cleaning), Paragraph 3.3.2.
b. Observe polarity markings and properly orient the component (center body of component between thru-holes). Shape the leads
of the new component so that the leads fit freely into the correct thru-holes.
c. When installing components between terminal pacts provide strain relief as shown in Figure 5-3.
Do not apply heat at a thru-hole for longer than 8 seconds.
NOTE
If one lead of the component is to be connected to a ground plane, connect the lead first. If no connection is to be
made to the plane, skip to step e.
d. Preheat the thru-hole connected to the ground plane. When the solder begins to melt, insert the lead (see Figure 5-4).
e. Gently maneuver the component, inserting the leads into the proper thru-holes. Continue with a gentle rocking movement until
the component is inserted to the proper depth or until the body of the component makes contact with the surface of the circuit
board. Heat thru-holes as necessary to install component. Often resistors 1 watt or larger are mounted 1/4 inch above circuit
board.
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Figure 5-3. Strain-Relief Mounting Diagram
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Figure 5-4. Ground Plane Lead Installation Diagram
NOTE
Do not crimp or bend leads to hold the component in position for soldering. The protruding portion of the lead
should remain straight to prevent damage to the circuit board if subsequent replacement is required.
f. Use small diagonal cutters or end nippers. Cut leads so that the protruding length matches that of other components (approxi-
mately 1.6 mm (1/16 in)).
g. Use flux and solder sparingly. Solder each lead at the side opposite the component. Ensure that the component does not shift
position during the soldering procedure.
h. Carefully inspect all new solder connections for evidence of improper wetting action, holes, cold solder, or short circuit. Solder
should completely fill the thru-hole without excess (see Figure 5-5).
i. Use a small brush or the tip of a pipe cleaner dipped in solvent. Thoroughly clean all new soldered connections. Ensure that
all flux and rosin is removed. A round toothpick may be used to help remove heavy rosin deposits. Solder connections should
appear clean, smooth, and bright.
5.3.2.3. Leads and Wires.
a. Leads and wires must be mechanically secured to their terminals to prevent motion between the members during the soldering
operation.
b. Leads and wires must be wrapped around terminals a minimum of 1/2 turn. Maximum contact is a complete turn, however,
wraps of more than one (1) full turn, although undesirable, are acceptable in noncritical applications provided all other criteria
are met. Wires of 30 gauge and smaller may be wrapped more than one (1) turn (see Figure 5-5).
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Figure 5-5. Wrap on Post Terminals
5.3.3. Replacement of Multilead Components (Transistors, Transformers, Relays, Etc.).

The following applies to the replacement of multilead components.
5.3.3.1. Multilead Component Removal.
a. Locate the component to be removed. Note the position, lead conformation, and physical alignment of the component. Observe
the position of the orientation tab (if any). Determine the pads and thru-holes used for mounting (see Figure 5-6).
Figure 5-6. Two-Lead Component Installation Diagram
b. Lay the circuit board flat on a clean surface with the component side facing down.
Do not apply heat at a pad or thru-hole for longer than 8 seconds.
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NOTE
If any lead is connected to the ground plane, remove that lead last. Do not remove the solder from this thru-hole.
c. Place the soldering iron tip to one pad and lead until the solder begins to melt. Use a solder sucker to remove excess solder.
More solder may be required to conduct heat into the hole and to provide better suction for solder removal.
d. Allow circuit board to cool before applying heat to thru-holes in the same area. Repeat procedure for each lead not connected
to the ground plane. For leads connected to the ground plane, perform step e.
e. Apply soldering iron tip to the pad and lead connected to the ground plane (see Figure 5-7). When the solder begins to melt,
grasp the component and gently extract the lead from the thru-hole. Be careful that the thru-hole is completely heated and that
the solder has melted on both sides of the circuit board. If excessive force or twisting motion is applied, the thru-hole may be
pulled out of the board along with the lead.
Figure 5-7. Multilead Component Removal Diagram
NOTE
It may be necessary to reheat some thru-holes because of residual solder in the holes. While reheating, use the tip
of a soldering aid to push the lead to the center of the hole to prevent resoldering (see Figure 5-6).
f. When all leads have been unsoldered, remove the component from the board.
g. When the component has been removed, reheat each hole that is not connected to the ground plane. When the solder is melted,
use a solder sucker to remove excess solder. Allow the circuit board to cool before reapplying heat in the same area. Repeat
procedure as required until each thru-hole is clean as indicated by the absence of solder on the walls, top and bottom.
5.3.3.2. Multilead Component Installation.
a. Use a small brush or the tip of a pipe cleaner dipped in solvent. Carefully clean both sides of the circuit board in the mounting
area. Clean the mounting holes and pads.
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b. Carefully bend the leads of the new component to the same configuration of the old one so that the leads fit freely into the
correct thru-holes. Do not cut the leads at this time.
NOTE
If any lead is to be connected to the ground plane, connect that lead first. If no connection is to be made to the
plane, skip to step d.
c. Apply soldering iron tip to the thru-hole that is connected to the plane. When the solder begins to melt, insert the proper lead
into the thru-hole. Ensure that the component is properly oriented on the circuit board.
d. Gently maneuver the component, inserting the leads into the proper thru-holes. Continue with rocking movement until the
component is inserted to the proper depth.
e. Hold the body of component (except metal can transistors and integrated circuits) tight to the board. Transistors should be
minimum of 1.02 mm (0.040 inch) off the board so that solder does not flow up the leads and short to case.
NOTE
f. Use small diagonal cutters or end nippers. Cut the leads so that the protruding length matches that of other components (ap-
proximately 1.6 mm (1/16 in)).
g. Use flux and solder sparingly. Solder each lead at the side opposite the component. Ensure that the component does not shift
h. Allow circuit board to cool before applying heat to the other thru-holes. Repeat procedure for each lead.
i. Carefully inspect all new solder connections for evidence of improper wetting action, holes, cold or excess solder, or short
circuits. Solder should completely fill the hole without excess (see Figure 5-8).
j. Use a small brush or the tip of a pipe cleaner dipped in solvent. Thoroughly clean all new soldered points. Ensure that all flux
and rosin is removed. A round toothpick may be used to help remove heavy rosin deposits. Solder points should appear clean,
smooth, and bright.
5.3.4. Replacement of Integrated Circuits (Flatpacks, Thinfilms, and Dual-In-line Packages).
99999999
5.3.4.1. Removal of Flatpacks and Thinfilms.
the position of the orientation notch or dot. Identify the pads used for connecting the component (see Figure 5-8 and Figure
5-9).
b. Lay the circuit board flat on a clean surface with the component side facing up.
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Do not apply heat at a pad for longer than 8 seconds.
c. Place the soldering iron tip to one pad and lead until the solder begins to melt.
d. Use tweezers to lift the unsoldered lead just enough to break solder connection with the pad. Hold lead away from pad long
enough to prevent resoldering.
Figure 5-8. Multilead Component Installation Diagram
Allow circuit board to cool before reapplying heat to the same area.
e. Repeat procedures to unsolder all remaining leads.

f. When all leads have been unsoldered, remove the flatpack from the circuit board. Salvage the tape from the removed compo-
nent.
g. Reheat each pad; use a solder braid dipped in flux to remove excess solder.
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REPAIR 523-0768039
Figure 5-9. Flatpack Lead Forming Diagram
5.3.4.2. Removal of Dual-In-line Packages (DIPs).

the position of the orientation notch or dot. Identify the thru-holes used for connecting the component.
b. Lay the circuit board flat on a clean surface with the component side facing up.
c. Use cutters to carefully clip off the Dual In-line Package (DIP) leads close to the DIP, on the component side of the board.
Remove and discard the DIP package.
d. Place the soldering iron tip to one DIP pin and add fresh solder to transfer heat to the middle of the plated thru-hole. Use a
solder sucker to lift the molten solder.
e. Allow the area to cool.
f. Carefully remove the clipped piece of DIP lead from the cool plated thru-hole from the component side of the board.
g. Repeat procedures to unsolder all remaining clipped DIP leads.
5.3.4.3. Installation of Flatpacks and Thinfilms.
a. Use a small brush or the tip of a pipe cleaner dipped in solvent. Carefully clean both sides of the circuit board and the pads in
the mounting area.
b. Transfer the tape salvaged from the removed component to the one to be installed. Apply the tape to the back of the component.
Use care to ensure a flat fit. If a good transfer cannot be made, cut a piece of pressure-sensitive, high-temperature electrical
tape (CPN 014-3011-040) to the shape of the component body (see Figure 5-9).
c. Use flatpack bending tool or tweezers to carefully bend component leads. Do not cut excess lead length at this time. The
dimensions shown are approximately correct to provide strain relief for the component. Conformation should be maintained as
closely as possible. When the leads are properly prepared, the end portion should be parallel with the bottom of the component
with the tape installed.
d. Ensure that the component orientation is the same as the one removed. Place the component in position on the circuit board.
While holding it in position, use a scriber or other sharp instrument to mark the leads where they extend to the end, but not
beyond, the connection pads. Be careful that board is not damaged.
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Figure 5-10. Flatpack and Thinfilm Soldering Sequence Diagram
e. Use a small diagonal cutter to cut the leads to the length scribed.
Do not allow solder nearer than 1.6 mm (1/16 in) from the component body. Only the lead laying on the circuit
is to be covered with solder. Solder is permissible on the ascending portion of the lead, but not on the portion
that extends straight out from the body. Improper placement of solder may cause heat damage to the flatpack and
seriously degrade the strain relief characteristic of the double bend. Do not apply heat at a lead for longer than 4
seconds. Allow component to cool before reapplying heat.
f. Tin each lead up to the lower bend only.

g. Properly orient component with leads on mounting pads and the body in contact with the surface of the circuit board.
Do not apply heat at a pad and lead for longer than 4 seconds.
h. Use flux and solder sparingly. Tack-solder a lead on each side of component. This helps hold the component in position during
the soldering procedure. Place small quantity of liquid flux on lead and pad prior to heating. Solder leads in the sequence shown
in Figure 5-10.
i. Carefully inspect all new solder connections for evidence of improper wetting action, holes, cold or excess solder, or short
circuit. Ensure that no mechanical strain exists at the component body.
j. Use a small brush or the tip of a pipe cleaner dipped in solvent. Thoroughly clean all new solder points. Ensure that all flux
smooth, and bright.
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5.3.4.4. Installation of Dual-In-line Packages (DIPs).

a. Use a small brush or the tip of a pipe cleaner dipped in solvent. Carefully clean both sides of the circuit board and the plated
thru-holes in the mounting area.
b. The leads of the new DIP should fit freely into the correct thru-holes. Do not cut the leads at this time.
c. Gently maneuver the component, inserting the leads into the proper thru-holes. Continue with rocking movement until the
component is inserted to the proper depth.
NOTE
d. Use small diagonal cutters or end nippers. Cut the leads so that the protruding length matches that of other components (ap-
proximately 1.6-2.3 mm (1/16-3/32 in)).
e. Use flux and solder sparingly. Solder each lead at the side opposite the component. Ensure that the component does not shift
f. Allow circuit board to cool before applying heat to the other thru-holes. Reheat procedure for each lead.
g. Carefully inspect all new solder connections for evidence of improper wetting action, holes, cold or excess solder, or short
circuits. Solder should completely fill the hole without excess (see Figure 5-8).
h. Use a small brush or the tip of a pipe cleaner dipped in solvent. Thoroughly clean all new soldered points. Ensure that all flux
smooth, and bright.
5.3.5. Replacement of Surface Mounted Devices.
SMDs are similar to flatpacks in regard to the method used to secure the component to the planar card. The big differences are that
the surface mounted device is much smaller and includes not only integrated circuits, but also resistors, capacitors, transistors and
diodes. Their small size makes replacing SMDs a very exacting procedure. With surface mounted devices the solder used to make
the electrical connection is obviously making the mechanical connection as well. Thru-hole solder connections can be as much as
90-% defective and still perform satisfactory, while SMD solder joints up to 20-% defective can have definite reliability problems.
NOTE
Because of the exacting nature of SMD planar card repair, it is advisable that the repair operator practice the pro-
cedures on nonusable cards. Once expertise is gained, the repair operator can be given full repair responsibilities.
There are several different styles of surface mounted devices. See Figure 5-11 for a sampling of the various SMDs. Chip resistors
and capacitors have metallized caps that lie directly on the planar card pad. Leadless Chip Carrier (LCC) have contacts on all four
sides, are normally gold in color, and come in packages with 18 to 84 contacts. The larger sizes usually have edge clips (shaped
like the letter J) serving as flexible leads. Plastic Leaded Chip Carriers (PLCC) are plastic molded parts with ”J” shaped leads on
all four sides (see Figure 5-18). Caution must be exercised when applying heat to these devices to prevent melting the plastic body.
Small Outline Integrated Circuits (SOIC) resemble small dip devices having up to 28 leads. The leads bend outward to rest on the
planar card pad. Small Outline Transistor (SOT)s are housed in a small plastic body with three flat leads similar to SOIC devices.
The solder requirements for each class of SMD are slightly different and are typified in the device replacement procedures.
Each surface mounted device rests on a pattern of two or more electrical contacts (pads) on the planar card. The group of pads for a
given device is called a footprint. Figure 5-12 is an example of a pad for a PLCC or LCC device having 18 pads. The number one
contact is normally lengthened to indicate the number one pad.
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REPAIR 523-0768039
Setting up a repair station to replace SMDs requires specialized tools along with specialized procedures. Special tools include some
type of hot gas (air) heating unit to melt solder and a microscope to inspect device placement and solder joints. An inspection glass
(approximately 3 power) for the repair operator also is a very useful tool.
Preparation of mounting locations on planar cards is similar to that of thru-hole device requirements. However, it is more critical
to ensure clean mounting pads for surface mounted devices. The hot air machine is the best system to use when replacing multiple
contact devices. In most cases, it has the capability of placing heat directly on the device solder joints to melt the solder without
affecting nearby devices. The temperature of the hot air machine is adjustable over a wide range. This allows selection of the opti-
mum temperature based on style and type of device to be soldered, and style and type of planar card on which the device is mounted.
Removing chip devices can usually be best accomplished using two soldering irons that have very fine pointed tips (diameter of
approximately 1/32 inch). Special fixtures are available for soldering irons that allow the user to replace multiple contact SMDs.
These fixtures work, but require a high level of competency. Even then there is an extremely high probability of damaging the planar
card by trying to remove the device before the solder is completely melted.
There are several types of hot air machines available for Surface-Mount Technology (SMT) repair. The Air-Vac DRS-24 and Onyx
29 systems (see Paragraph 5.3.42) have been used successfully by Rockwell Collins in the rework and repair of printed wiring
assemblies in the factory and their use is recommended for field repair. Similar machines from other manufacturers will also work.
For repairs on small components, hot air pens from JBC have been found to work well. It is suggested that the hot air machine be left
on to maintain consistent temperatures. Regardless of the machine used, it is important that the operator have a good understanding
of the operation of the unit as outlined in the unit’s operating manual. The instructions provided in this manual are of a general
nature and apply primarily to the repair of Rockwell Collins manufactured equipment.
Surface mounted devices have the same static sensitive characteristics as thru-hole devices. Refer to the Electro-
static Discharge Sensitive (ESDS) caution in the Safety Summary section of this manual.
5.3.5.1. Removal of SMDs. The following general procedures should be followed when planning repair work on any planar card
with surface mounted devices.
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Figure 5-11. Various SMDs
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Figure 5-12. Typical SMD Footprint
5.3.5.1.1. General Preparation for SMD Removal.

a. Clean the planar card of any accumulation of dirt and grime.
b. Remove any obstructions (heat sinks, labels, etc) that may block access to the object device.
c. Refer to Paragraph 5.3.1.1 for a description of conformal coating removal.
d. Before beginning any repair procedure the planar cards should be baked if the relative humidity exceeds 50%. This minimizes
possible delamination or measling (bubbling) of planar card material or trace material when adding heat for solder melting
purposes. Bake one hour at 105°C (221°F) or six hours at 85°C (185°F). Store the planar card in a dry environment (desiccated
or evacuated chamber) if final repair procedures are delayed in excess of seven hours after the cleaning process.
e. Coat the electrical contacts to be unsoldered with flux (aids unsoldering process).
f. There may be several thru-holes connected by circuit traces to footprints of the SMD to be replaced. If these thru-holes are
filled with solder, use a soldering iron and a solder sucker to remove the solder from the thru-hole. This simplifies unsoldering
the SMD.
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Indiscriminate heating on one side of some SMD planar cards can cause extensive damage to the circuit card. The
thermal expansion characteristics of the substrate, especially ceramic based cards, cause one side to expand at a
faster rate than the other. To avoid this problem, it is best to preheat the planar cards to slightly below solder-
melt temperatures. All settable soldering irons and hot air machine equipment should be set to a temperature that
adequately melt the solder in 5 to 10 seconds for small unheat sinked components. More time may be needed for
larger components and heat sinks; do not exceed 20 seconds. The following is the approximate guide for hot air
machine setup.
Extreme caution should be taken if temperature is set above 216° ± 10°C (420° ± 10°F) to avoid overheating and
delamination.
Temperature indicating fluids can be used to determine when the desired operating temperature has been obtained.
To use this fluid, place a smear of the fluid on the component or spot on the board to be heated. Allow the fluid to air
dry. Heat the smear area with the unsoldering equipment. Once the dried fluid reflows, the indicated temperature
has been reached.
Generally, components mounted on two sided boards react to the melting of the solder using 363°F indicator,
average multilayer boards at 388°F, and heavy multilayer heatsink boards at 400°F.
Figure 5-13. Example of Hot Air Funnel
g. In areas where device spacing is very tight, the hot air machine exhaust may not be funneled closely enough to prevent unsol-
dering nearby devices and could possibly blow them away. To prevent unwanted unsoldering, place aluminum foil around the
SMD to be removed so that it spreads out over the surrounding area leaving only the specific SMD exposed (see Figure 5-13).
This deflects heat away from the undesired areas and funnels it to where it is needed.
h. Jumper wires may be soldered directly to a contact or lead surface of the SMD or to a connecting thru-hole. Use a soldering
iron to remove any jumper wires before attempting to remove the SMD from the planar card. Be sure to identify wire and its
exact location for reinstallation.
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REPAIR 523-0768039
i. Due to the small size of SMDs, especially chip resistors and capacitors, it is usually best to discard them after removal as the
unsoldering process may have caused damage.
5.3.5.1.2. Removal of Multilead (Contact) SMDs.
a. Perform the general preparation procedures as outlined in Paragraph 5.3.5.1.1.
NOTE
The most effective method of removing SMDs with more than three leads is with a hot air machine that heats all
connections at the same time. Some SMDs are held in place usually during the wave soldering process by a spot
of adhesive between the planar card and the bottom of the SMD. Normally, by the time the solder has melted, the
adhesive has been warmed enough to release the SMD by using a minimal amount of force.
If the hot air machine uses upper and lower air tubes, it is important when components are mounted on both sides
of a board that the board material can be heated from both sides, yet maintain a temperature on the side that it is
not desirable to remove a component below the solder melting point.
b. Turn the hot air machine on and allow sufficient time for the air temperature to stabilize.
c. Place the planar card in the holding bracket. If terminal has air-funneling templates, select and install the template that most
closely matches the size of the SMD to be removed.
d. Place the planar card so that the SMD to be removed is centered under the hot air exhaust port.
e. Heat the SMD solder contacts. Gently probe with a dental probe at one corner of the SMD until it moves, indicating the solder
has reached its melting point. For printed circuit boards that have heavy heat sinks, heat around the component a few seconds
before heating the component to be removed. This reduces the heatsinking effect of the ground and voltage planes as well as
the printed circuit board material.
f. When the SMD can be easily deflected, use the probe to lift (flip) the device off its mounting pad.
g. Remove the planar card from the hot air machine and allow it to cool while removing the SMD from the work area.
h. If SMD replacement exceeds six hours and if humidity is higher than 50%, remove the planar card to storage area to prevent it
from drawing excess moisture.
5.3.5.1.3. Removal of Chip SMDs.
NOTE
One of the more effective methods of removing chip capacitors and resistors is by using two soldering irons,
soldering iron tip size should be as small as possible. A hot air machine can be used but tends to melt the solder
around several devices as it is extremely difficult to funnel the air down to affect just one device.

b. Using two soldering irons, place one iron on each chip SMD solder termination (see Figure 5-14).
c. When the solder completely melts, use the soldering irons to lift or flip the device from its mounting pads.
d. If SMD replacement exceeds six hours and if humidity is higher than 50%, remove the planar card to storage area to prevent it
5.3.5.1.4. Removal of SOT SMDs.
b. With a soldering iron, melt the solder on one leg of the SOT. Use a (dental) probe to gently lift the lead clear of the planar card
footprint.
c. Repeat step b for the other two SOT leads; then remove the device from the planar card.
d. If SMD replacement exceeds six hours and if humidity is higher than 50%, remove the planar card to storage area to prevent it
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REPAIR 523-0768039
5.3.5.2. Replacement of SMDs.
NOTE
If component being used has gold plated leads, the component leads must be tinned and then solder wicked off.
Do not add any liquid flux to the location where flush mounted parts (see Figure 5-14) will be located. Flux does
not wash out properly from under the body and can create a moisture path.
Figure 5-14. Chip Component Removal
5.3.5.2.1. Replacement of Multilead (Contact) SMDs.

a. Inspect planar card pad area under microscope. Check for possible trace line delaminations or cracks.
b. Check device (especially SOICs) to ensure leads have not been bent out of place. All leads should be evenly spaced with the
contact surfaces of the leads in the same geometric plane.
c. Apply flux to solder pads; reheat pad area with a soldering iron to redress the pads. Add solder if needed or use solder braid
to remove excess solder. Reflowing solder removes any bridges, spikes, or splashes that may have occurred during the SMD
removal procedure.
d. Remove with solvent all flux residue that may have been left under the removed SMD.
e. Once planar card is cleaned, apply a new coating of solder paste to the solder footprints. Note orientation of footprint keying
while placing planar card in hot air machine (see Figure 5-15). Pretin the component leads for good solder flow between the
board and component.
f. Use a tweezers and probe to set replacement SMD into properly oriented position on the planar card pads. Apply temperature
indicating fluid as required.
g. Once the solder begins to melt, the PLCC and LCC devices should swim into proper position. This is caused by the surface
tension between the solder and the SMD contacts. SOIC devices must be properly oriented.
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REPAIR 523-0768039
h. Check each SMD contact surface for proper wetting by the solder. Allow board to cool before removal.
i. Remove the planar card from the hot air machine and allow it to cool.
j. Clean all device solder contacts with solvent to remove any remaining flux or flux residue.
k. Inspect all solder joints under a microscope; check for proper solder application, cracks, or voids; check for circuit trace de-
laminations and SMD orientation.
(1) See Figure 5-16 for the proper distribution of solder to LCC devices. The castellation (recessed contact surface) should
be covered with solder that bulges slightly outward from the castellation.
(2) See Figure 5-17 for the proper distribution of solder to SOIC or SOT devices. All leads must remain flexible, solder should
not extend above the midpoint between the heel and knee of the lead for SOICs. For SOTs, solder should not extend beyond
the upper bend or "knee" area of the lead.
Figure 5-15. Device Orientation
Figure 5-16. Good LCC Solder Joint
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REPAIR 523-0768039
Figure 5-17. Good (SOIC, SOT) Solder Joint
l. Inspect the conformal coating in the general area of the SMD just replaced. Look for signs of bubbling, flaking or peeling. Use
solvent to remove any damaged coating.
m. Replace any heat sinks, labels, or devices that were removed previously.
n. Reapply fresh HumiSeal 1B31 over the repaired area as required per Paragraph 5.3.26.2.
5.3.5.2.2. Replacement or Mounting of Multilead SMDs for Hot Air Reflow.
NOTE
When mounting parts, after solder paste has been reflowed or when replacing parts, the following procedure is to
be followed.
a. Wick all solder off pads that component is to be soldered on.

b. Apply solder paste to pad using dispenser (hypodermic needle) or a tooth pick.
c. Select appropriate hot air machine head for component being mounted.
d. Apply heat until flow of solder is observed.
e. Remove heat.
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REPAIR 523-0768039
Chip capacitors and resistors may have no identifying characteristics that distinguish between individual chip val-
ues. Do not remove replacement chips from their package until they are to be installed on the planar card; then
remove only one at a time. If a chip is dropped, it is advisable that the chip be thrown away to prevent mixups
with chips that may have been dropped previously.
Tantalum Capacitors: It is unacceptable to rework a tantalum capacitor to meet the acceptable solder on the end
terminations. The tantalum capacitor should be removed and replaced if acceptable solder or part placement is not
met the first time it is soldered. Tantalum capacitors that are resoldered will be damaged.
It is unacceptable to solder a jumper wire to a tantalum capacitor that has already been soldered. The tantalum
capacitor is removed and replaced; the jumper wire is soldered during the same process of soldering the tantalum
capacitor. Tantalum capacitors that are resoldered will be damaged.
NOTE
Tantalum Surface Mount Capacitors may be identified by a polarity band or dimple located on one end of the
capacitor. The polarity band or dimple represents the anode. (+).
5.3.5.2.3. Replacement of Chip SMDs. Chip SMDs is the name given to resistors and capacitors. At first glance it is almost
impossible to tell them apart. Both components have a basic rectangular shape. Each component usually has a ceramic base or
carrier upon which the resistive or capacitive element is placed. Solder-tinned end terminations make the electrical contacts to the
circuit card. Figure 5-19 shows several different chip resistors and capacitors and shows how to identify some of the components’
differing characteristics.
Resistors have a resistive element placed on one side of the ceramic carrier. The resistive element is a darker color than the ceramic
carrier and may have a notch in it. The notch varies in size from one resistor to the next. The notch is cut into the resistive element
at manufacture to give the exact value. Resistors should always be mounted with the resistive element pointing up, away from the
circuit card. There is only a thin protective coating covering the resistive element on resistors. When removing or installing chip
resistors, do not use sharp probes. If the resistive element becomes scratched, the resistor’s value most probably changes. Chip
resistors should be stored in their original packaging until the moment they are to be installed on a circuit card. The packaging
material protects the resistive elements from damage and is the only means of identifying the value of a chip resistor. When a chip
resistor is removed from a circuit card, it should be discarded.
Capacitors differ from resistors in that their element completely encases the ceramic carrier. They are the same color on all sides.
Where polarity is not important, a chip capacitor can be mounted with either of its wider flat surfaces up. The polarity of polarized
capacitors can vary; there is no industry standard to control how capacitors are marked. As with chip resistors, chip capacitors should
be stored in their original packaging until the moment they are to be installed on a circuit card. The packaging material protects the
capacitor element from damage and is the only means of identifying the value of a chip capacitor. When a chip capacitor is removed
from a circuit card, it should be discarded. See Figure 5-19 for some of the more common methods used to identify the positive end
cap of polarized capacitors.
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REPAIR 523-0768039
Figure 5-18. PLCC Solder Joint (Sheet 1 of 2)
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REPAIR 523-0768039
Figure 5-18. PLCC Solder Joint (Sheet 2 of 2)
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REPAIR 523-0768039
b. Using solder braid, remove solder from one of the chip mounting pads. Clean the area of any solder debris.
c. Apply flux to remaining pad and reheat with the soldering iron to redress it. Add solder if needed or use solder braid to remove
excess solder. Reflowing solder removes any bridges, spikes, or splashes that may have occurred during the chip removal
procedure.
d. Remove with solvent any excess flux residue that may have been left under the removed chip.
e. Once planar card is cleaned, apply a new coating of flux to the solder pads.
Chip resistors are constructed of a resistive element deposited on a mylar or ceramic carrier. Chip resistors must
be mounted with this resistive element up (away from circuit card). The resistive side of chip can be identified by
comparing its coloration. The resistive element side is a darker color.
f. Use tweezers and probe to set replacement chip into position on the planar card pads
g. Solder the chip to the solder loaded pad. Then (adding solder) solder the chip to the pad previously devoid of solder.
h. Check each chip contact surface for proper wetting by the solder.
i. Clean both solder contacts with solvent to remove any remaining flux or flux residue.
Figure 5-19. Examples of Chip SMDs
j. Inspect both solder joints under a microscope, check for proper solder application, cracks, or voids, and check for circuit trace
delaminations and chip orientation. See Figure 5-20 which depicts the proper application of solder to chip devices.
k. Inspect the conformal coating in the general area of the chip just replaced. Look for signs of bubbling, flaking or peeling. Use
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REPAIR 523-0768039
l. Replace any heat sinks, labels or devices that were removed previously.
m. Reapply fresh HumiSeal 1B31 over the repaired area as required per Paragraph 5.3.26.2.
5.3.5.2.4. Replacement of SOT SMDs.
b. Using solder braid, remove solder from two pads (from the same side) of the SOT mounting pad. Clean the area of any solder
debris.
c. Apply flux to remaining pad and reheat with the soldering iron to redress it. Add solder if needed or use solder braid to remove
excess solder. Reflowing solder removes any bridges, spikes, or splashes that may have occurred during the SOT removal
procedure.
d. Remove with solvent any excess flux residue that may have been left under the removed SOT.
e. Once planar card is cleaned, apply a new coating of flux to the solder pads.
f. Use tweezers to set replacement SOT into position on the planar card pad.
g. Solder the SOT to the solder loaded pad. Then (adding solder) solder the SOT to the pads previously devoid of solder.
h. Check each SOT lead for proper wetting by the solder.
i. Clean all solder contacts with solvent to remove any remaining flux or flux residue.
Figure 5-20. Good (Chip) Rigid Solder Joint
j. Inspect all solder joints under a microscope; check for proper solder application, cracks, or voids; check for circuit trace de-
laminations and SOT orientation (see Figure 5-17).
k. Inspect the conformal coating in the general area of the SOT just replaced. Look for signs of bubbling, flaking or peeling. Use
l. Replace any heat sinks, labels or devices that were removed previously.
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REPAIR 523-0768039
m. Reapply fresh HumiSeal 1B31 over the repaired area as required per Paragraph 5.3.26.2.
5.3.5.2.5. Alternate Soldering Method. Removal of SMDs is nearly impossible with a single-tip soldering iron. However, devices
can be added to a planar card with a soldering iron and the use of a probe for positioning (see Figure 5-21).
a. Follow the general preparation procedures as outlined previously for the type of device to be replaced. Only use solder braid
to remove solder from each pad.
b. Position device and solder one lead at a time until all are done.
c. Repeat the inspection and cleaning portion of the device replacement procedure.
d. Contact area.
Figure 5-21. Alternate Component Installation
NOTE
Do not add additional flux to the location where flush mounted parts will be located. Flux does not wash out
properly from under the body and can create a resistance path.
Use core solder and not solder paste when mounting SMD parts on boards with a solder iron.
5.3.6. Replacement of Thinline Connector Contacts.

The following applies to the replacement of thinline connector contacts.
5.3.6.1. Thinline Connector Contact Removal.
a. Place the unit on a flat surface with the device side facing up and the thinline connector at the front.
b. Locate the contact to be removed.
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REPAIR 523-0768039
NOTE
If the contact to be removed is not in the top row, it is necessary to remove additional adapters (interconnecting
wires from the connector to the sideboard) to gain access to the defective contact. Adapters above the damaged
contact in the same vertical row must be removed. Note the placement of each adapter removed to permit proper
reassembly.
c. Use small, curved needle-nose pliers. Grasp the top row adapter at the angle area.
d. Apply soldering iron tip to the junction. When the solder begins to melt, carefully bend the adapter away from the contact.
Bend just far enough to break the solder bond. Avoid excessive pressure at the junction of the adapter and sideboard.
e. Apply a small quantity of flux to the junction of the adapter and the sideboard thru-hole.
f. Apply soldering iron tip to the fluxed junction. When the solder begins to melt, extract the adapter from the thru-hole. Save
the adapter for reinstallation.
g. Repeat procedure to remove additional adapters as necessary to gain access to the contact that is to be removed.
Allow the sideboard to cool before reapplying heat to the same area on the sideboard.
h. Reheat each unsoldered junction. Use a solder sucker to remove solder. Do not remove solder from a thru-hole that is connected
to the ground plane.
i. Repeat as necessary until holes and contacts are clean, as indicated by the absence of solder on the walls, top and bottom.
j. Use a lightweight hammer and small drift punch. At the wiring side of the connector, gently tap the contact. Drive the contact
clear of the housing.
5.3.6.2. Thinline Connector Contact Installation.
a. Use a small brush or tip of a pipe cleaner dipped in solvent. Carefully clean the area surrounding each unsoldered point.
b. Insert a new contact, CPN 372-2603-XXX and 372-2604-XXX, from the mating side of the connector housing. Use fingers
until the contact begins to seat and the finger pressure is no longer effective.
c. Use a lightweight hammer. Gently tap the contact into the housing until fully seated. When properly seated, both ends of the
contact should protrude from the housing the same distance as the other contacts.
d. Inspect the adapter removed from this position. If reusable, skip to step f.
e. If the adapter is damaged or badly deformed, replace it with a new one, CPN 768-3771-001.
f. Use small, curved needle-nose pliers. Carefully shape the adapter to the same conformation as the other adapters in the same
horizontal row. The cup portion should just touch and rest under the contact. The other end should protrude through the appro-
priate thru-hole at the sideboard.
g. Use flux and solder sparingly. Solder the adapter to the contact.
h. Use small diagonal cutters or end nippers. At the rear of the sideboard, cut adapter to match the length of the others.
i. Use flux and solder sparingly. Solder adapter into the thru-hole.
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REPAIR 523-0768039
j. Repeat steps d through i to install adapters that were removed to permit access to the defective contact.
k. Carefully inspect all new soldered connections for evidence of improper wetting action, holes, cold or excess solder, or short
circuit. Solder should completely fill the thru-holes without excess.
l. Use a small brush or tip of a pipe cleaner dipped in solvent. Thoroughly clean the area surrounding all new solder points.
Ensure that all flux and rosin is removed. A round toothpick may be used to help remove heavy rosin deposits. Solder point
holes should appear clean, smooth, and bright.
5.3.7. Replacement of Sideboard Connector Pins.
99999999
5.3.7.1. Sideboard Connector Pin Removal.
NOTE
Replacement of bent connector contacts is usually not required; with care, most pins can be straightened. Broken
contacts, however, must be replaced.
a. Ensure that special tools are available before starting the removal procedure. The backing tool (CPN 772-5936-001), insertion
tool (CPN 772-5938-001), and impact tool can be fabricated locally or ordered by part number from Rockwell Collins. See
Figure 5-22 for fabrication details.
b. Lay the sideboard, with the parallel board removed, flat on a clean work surface. The device side should face up. Locate the
contact to be removed.
c. Using small diagonal cutters or end nippers, cut off mating side of contact approximately 3.2 mm (1/8 in) above the sideboard
surface (see Figure 5-23).
d. Apply a small quantity of flux to the contact mounting pad.
Do not apply heat at a mounting pad for longer than 8 seconds. Allow the sideboard to cool between applications
of heat.
e. Apply soldering iron tip to the fluxed junction. When the solder melts, use a solder sucker to remove as much solder as possible.
f. Turn sideboard over and repeat procedure at the wiring side of the same thru-hole.
NOTE
Note the position of the shoulder of the contact to be removed. The replacement contact must be seated in the
same position.
g. Lift the sideboard and position it so that the device side faces down. Carefully place the backup tool over the contact to be
removed (see Figure 5-23). Ensure that the slot in the backup tool is aligned with the long portion of the contact shoulder.
The sideboard should be resting on and completely supported by the backup tool. Ensure that the sideboard is
in parallel contact with the surface of the backup tool. The sideboard must not be tilted in any direction. If firm
parallel contact is not maintained, damage to the mounting pads may result.
h. Use the impact tool and a lightweight hammer. Place the small tip of the impact tool at the base of the contact. Lightly tap the
impact tool until the contact drops out of the housing into the slot of the backup tool.
5.3.7.2. Sideboard Connector Pin Installation.
a. Use a small brush or tip of a pipe cleaner dipped in solvent. Carefully clean the area surrounding each unsoldered point.
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REPAIR 523-0768039
b. Carefully measure a contact installed on the sideboard. Cut a new contact, CPN 373-2236-010, to the same length (see Figure
5-23).
c. Prepare the mating end of the contact as shown in Figure 5-23.
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REPAIR 523-0768039
Figure 5-22. Impact, Backup, and Insertion Tools Design
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REPAIR 523-0768039
Figure 5-23. Sideboard Contact Extraction/Insertion Diagram
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REPAIR 523-0768039
NOTE
The insertion tool has a square hole to maintain contact alignment during insertion. The depth of the slot assures
proper depth of insertion and proper alignment of the contact shoulder.
d. Insert the prepared contact into the insertion tool as shown in Figure 5-23.
e. Tilt the sideboard and, at the device side, insert the contact into the proper thru-hole.
f. At the wiring side, position the backup tool under the hole. Ensure that the slot is aligned in the direction of the contact shoulder.
g. Position the sideboard so that the wiring side is firmly in parallel contact with the backup tool. Ensure that the contact shoulder
is in the same position as the removed contact.
h. Inspect the position and vertical alignment of the contact. Use fingers if necessary to straighten the contact.
i. Check the shoulder position. If not properly aligned, position the insertion tool over the contact and engage the shoulder in the
slot. Carefully apply a clockwise or counterclockwise pressure as required to properly align the shoulder.
Do not apply heat at a thru-hole for longer than 8 seconds. Permit the circuit board to cool between applications
of heat.
j. Use solder and flux sparingly. Solder the contact into the thru-hole. Solder should completely fill the hole and just cover the
upper edge of the contact shoulder
k. Use a small brush or tip of a pipe cleaner dipped in solvent. Thoroughly clean the area around the new solder point. Ensure
that all flux and rosin is removed. A round toothpick may be used to help remove heavy rosin deposits. Solder point should
appear clean, smooth, and bright.
5.3.8. Replacement of Blue-Line Connector Contacts.
The following applies to the replacement of blue-line connector contacts.
5.3.8.1. Blue-Line Connector Contact Removal.
a. Place the board flat on a clean work surface. The wiring side should be face up. Identify the contact to be removed.
Do not apply heat at a thru-hole for longer than 8 seconds. Permit the circuit board to cool between applications
of heat.
b. At the wiring side, apply soldering iron to the contact. Add solder to the iron.
c. When solder melts, use a solder sucker to remove all solder from the thru-hole.
NOTE
If the contact to be removed is in a lower cavity of a double row housing and a contact is in the upper cavity
directly above the contact to be removed, use soldering iron and solder sucker to unsolder the securing tabs of the
upper contact. Use a scriber or other pointed tool and push the tab through the board. Bend the tab slightly with
pliers so the lower row cavity is not obstructed.
d. Use a soldering aid or a blunt probe. Press the contact through the connector housing. It may be necessary to straighten the
contact securing tabs to permit removal. Reheat the thru-hole if necessary.
e. Reheat the contact mounting pad and hole. Use a solder sucker to remove as much solder as possible from the thru-hole.
5.3.8.2. Blue-Line Connector Contact Installation.
a. Use a small brush or the tip of a pipe cleaner dipped in solvent. Carefully clean the area surrounding the unsoldered point.
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REPAIR 523-0768039
b. Place the circuit board flat on a clean work surface. The mating side of the connector should face up.
c. Note the orientation of the securing tabs in the installed contacts.
d. Insert a new contact into the housing; refer to the equipment parts list for correct contact replacement part number. Do not cut
securing tabs at this time. Ensure that the securing tabs are oriented to match the installed tabs.
e. Press the contact from the mating side; exert enough pressure to seat the contact in housing. Seat contact to match the existing
contacts.
f. Turn the circuit board over so that the wiring side of the connector faces up. Use fingers to bend the long securing tabs along
side the mounting pad.
g. Using small diagonal cutters, cut tabs to match length of installed tabs. Ensure that tab ends are flush with the tip surface of
the mounting pad.
Ensure that no solder flows into the contact.
h. Use solder and flux sparingly. Solder the contact to the mounting pad.
i. Use a small brush or the tip of a pipe cleaner dipped in solvent. Thoroughly clean the area surrounding the new solder point.
Ensure that all flux and rosin is removed. A round toothpick may be used to help remove heavy rosin deposits. The soldered
connection should appear clean, smooth, and bright.
5.3.9. Crimping Solderless Connections.
The following applies to crimping solderless connections.
5.3.9.1. Tooling.
a. All crimp connections are made with the specified crimping tool. Substitution of a crimp tool other than the one specified is
not recommended. Refer to Crimp Contact Tools Index in Section 2 (Tools), Table 2-2 for a listing of the most commonly used
crimp tools and associated tools and contacts.
b. Crimp tools may be manual or automatic. All tools must use a mechanism so that, once the crimping operation is started, the
tool cannot be opened until the cycle is complete.
c. Tools must be certified at intervals specified for the individual tool. Tools used must have a current certification tag or equiva-
lent.
5.3.9.2. Wire Preparation.
a. Wires to be crimped must not be soldered or tinned. Strands must not be twisted other than as normally manufactured.
b. Solid, copper clad steel, or copperweld wire may be used in crimp connections only when specified in the applicable component
and process specification.
c. Conductor damage, due to stripping, must not exceed that specified for solder operations.
d. Any number of wires may be crimped in any crimp terminal provided the cross-sectional area of the wires does not exceed that
for which the terminal was designed. Tensile strength requirement must be at least equal to the single conductor being tested.
5.3.9.3. Crimp Connections.
a. All strands of the conductor must be contained within the crimp region of the contact. The number of conductor strands must
not be reduced, and the contact must not be altered to facilitate fit for termination. When inspection holes are provided, the
bare wire must be clearly visible through these holes. See Figure 5-24 for a terminal with insulation support and Figure 5-25
for a terminal without insulation support.
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REPAIR 523-0768039
Figure 5-24. Terminal with Insulation Support
b. Where crimped components employ insulation supports, the conductor insulation must enter into the support sufficiently so
that no bare wire is exposed at this end (see Figure 5-25). The insulation should never extend into the crimp (wire) barrel area.
When more than one wire is crimped in the same contact or when wire with oversized insulation is used, the insulation may be
outside the insulation support section of the contact.
c. Where crimped components do not employ insulation supports, the insulation must end not more than 0.062 inch plus one
conductor diameter from the contact (see Figure 5-25).
Figure 5-25. Terminal Without Insulation Support
d. When crimping open-ended terminations, the stripped wire must be clearly visible at the front end of the crimp barrel. Maxi-
mum protrusion of the stripped wire through the crimp barrel must be two (2) wire diameters, but in no case interfere with the
installation and seating of the mounting hardware (see Figure 5-26).
e. Crimps are located between the inspection hole (where applicable) and the end of the crimp barrel. In all cases, the wire should
pass through the crimped areas.
f. Crimping of a contact termination won't crack the base metal of the contact or damage the contact plating to the extent that base
metal is exposed.
5.3.9.4. Crimp Terminal Lugs.
a. Crimping of lugs won't crack the base metal of the contact nor damage the contact plating to the extent that base metal is
exposed.
b. After installation, lugs may be bent to provide clearance if there is no cracking of the base metal, flaking or peeling of the
plating on the lug.
c. The wire crimp is centered on the wire barrel.
d. When crimping terminations, the stripped wire must be clearly visible at the front end of the crimp barrel. Maximum protrusion
of the stripped wire through the crimp barrel is two wire diameters, but in no case should it interfere with the installation and
seating of the mounting hardware.
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REPAIR 523-0768039
Figure 5-26. Open-Ended Termination
e. Where the lug has an insulation barrel, the wire insulation enters the insertion end of the insulation barrel sufficiently so that
no bare wire are exposed at this end.
f. In no instance should the insulation extend into the crimp (wire) barrel area. The wire insulation mates flush to the wire crimp
barrel to receding one lead diameter back from the insertion end of the wire crimp barrel.
5.3.10. Replacement of Coaxial or High-Voltage, High-Current Contacts and Cable Preparation.
Perform the following for removal of coaxial or high-voltage and high currrent contacts, and cable preparation.
5.3.10.1. Coaxial or High-Voltage, High-Current Contact Removal.
a. Using extraction tool (CPN 370-8040-030, Cannon part number CET-C6B-1) from the mating side of the contact, insert the
barrel of the tool over the contact. Exert enough pressure on the tool frame to cause the barrel of the tool to seat over the contact.
b. Slowly press the plunger on the tool inward until the plunger touches the contact.
c. Hold the handle down firmly with thumb and forefinger, and depress the plunger with the palm of the hand.
NOTE
A tendency to pull the thumb and finger back rather than push the palm is common. This type of action lets the
retaining rings expand and the contact cannot be removed.
d. The contact should release and move out of the connector housing toward the wiring side.
5.3.10.2. Coaxial Cable Preparation for Contacts for Single and Double Shielded Cable.
NOTE
This procedure covers the instructions for attaching coaxial connector CPN 372-2519-XXX.
a. Use a sharp knife and a small pair of diagonal cutters. Prepare the cable as shown in Figure 5-27, view A. Refer to Table 5-1
and Table 5-2 for dimensions for the type of cable being prepared. The dash number -001 is the cable assembly procedure for
straight only, male and female connectors as described by Rockwell Collins drawing 372-2519. Likewise, the dash number
-002 cable assembly procedure for right angle only, male and female connectors as described by Rockwell Collins drawing
372-2519.
b. Slide the outer sleeve of the connector onto the coaxial cable. The largest end should face the end of the cable to which the
connector is to be attached.
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REPAIR 523-0768039
NOTE
In some instances, the sleeve may be a straight piece of tubing, in which case either end may face the prepared
end of the cable.
Both shields are trimmed to the same dimension, however, the outer shield must be temporarily rolled back to
allow removal of insulation between the shields, (not applicable for single shielded cable).
c. Do not nick braids or center conductor. Pre-tin cable center conductor and connector inner sleeve.
d. Insert trimmed cable (dielectric and center conductor) into inside diameter of inner sleeve (see Figure 5-27, view B). The inner
sleeve slides between the cable dielectric and braid as shown. Slide the cable in until the cable center conductor bottoms in the
connector solder cup. The cable braid should not extend beyond the inner sleeve.
e. Use solder sparingly; solder the center conductor connection. Do not overheat the connection or use excessive amounts of
solder.
f. Smooth the braid of the cable over the inner sleeve and slide the outer sleeve over the braid until it butts against the back face
of the connector.
g. Solder outer sleeve to braid through the solder access hole. Solder outer sleeve to back face of connector.
h. Position shrink tubing around outer sleeve, sleeving should not extend more than 1/4 inch beyond outer sleeve.
i. Shrink the sleeving and secure with heat gun.
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REPAIR 523-0768039
Figure 5-27. Coaxial Cable Connector Preparation Diagram
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REPAIR 523-0768039
Table 5-1. Cable Data (Part 1 is -001)
372-2519 STRIPPING DIMENSIONS CRIMP TOOL
DASH COAXIAL X Y Z ROCKWELL BUCHANAN PART

NUMBER CABLE COLLINS PART NUMBER
NUMBER
010 RG-196/U .260/.240 .332/.302 .088/.068 *357-8622-100 613399
020 RG-196/U .260/.240 .332/.302 .088/.068 *357-8622-100 613399
030 RG-58 1.97/.177 .244/.224 .119/.099 *357-8622-160 613367
040 RG-58 1.97/.177 .244/.224 .119/.099 *357-8622-160 613367
050 T-209 (Brand .332/.302 .385/.365 .088/.068 *357-8622-120 613389
Rex)
060 T-209 (Brand .332/.302 .385/.365 .088/.068 *357-8622-120 613389
Rex)
070** RG-624/U .332/.302 .385/.365 .088/.068 - -
080** RG-624/U .332/.302 .385/.365 .088/.068 - -
090 RG-223/U .332/.302 .385/.365 .088/.06 *357-8622-160 613367
RG-1428/U
100 RG-223/U .332/.302 .385/.365 .088/.06 *357-8622-160 613367
RG-1428/U
210 RG-188/U .260/.240 .322/.302 .088/.068 *357-8622-110 613392
220 RG-188/U .260/.240 .322/.302 .088/.068 *357-8622-110 613392
240 425-1601-000 .260/.240 .322/.302 .135/.115 N/A N/A
250 425-1601-000 .260/.240 .322/.302 .135/.115 N/A N/A
340 RG-58 .197/.177 .244/.224 .119/.099 *357-8622-160 613367
350 RG-58 .197/.177 .244/.224 .119/.099 *357-8622-160 613367
360 RG-180 .260/.240 .322/.302 .135/.115 *357-8622-140 613386
370 RG-180 .260/.240 .322/.302 .135/.115 *357-8622-140 613386
380 RG-316DS .260/.240 .322/.302 .088/.068 359-8103-220 N/A
Note: Crimp tool consists of pop-in die set only that requires an additional handle 357-8622-010. (* Small Nest), (** Obsolete)
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REPAIR 523-0768039
Table 5-2. Cable Data (Part 2 is -002)
372-2519 STRIPPING DIMENSIONS CRIMP TOOL

DASH COAXIAL CABLE X Y Z ROCKWELL BUCHANAN
NUMBER COLLINS PART PART
NUMBER NUMBER
110 RG-196/U .244/.224 .398/.378 .072/.052 *357-8622-100 613399
120 RG-196/U .244/.224 .398/.378 .072/.052 *357-8622-100 613399
130 RG-58/U .322/.302 .432/.412 .103/.083 *357-8622-160 613367
140 RG-58/U .322/.302 .432/.412 .103/.083 *357-8622-160 613367
150 T-209 (Brand Rex) .322/.302 .432/.412 .103/.083 *357-8622-120 613389
160 T-209 (Brand Rex) .322/.302 .432/.412 .103/.083 *357-8622-120 613389
170** RG-62/U .322/.302 .432/.412 .103/.083 - -
180** RG-62/U .322/.302 .432/.412 .103/.083 - -
190 RG-223/U, .322/.302 .432/.412 .103/.083 *357-8622-160 613367
RG-1428/U
200 RG-223/U, .322/.302 .432/.412 .103/.083 *357-8622-160 613367
RG-1428/U
260 425-1601-000 .244/.224 .398/.378 .072/.052 N/A N/A
270 425-1601-000 .244/.224 .398/.378 .072/.052 N/A N/A
280 RG-188/U .244/.224 .398/.378 .072/.052 *357-8622-110 613392
290 RG-188/U .244/.224 .398/.378 .072/.052 *357-8622-110 613392
* Small Nest, ** Obsolete
5.3.10.3. Coaxial Cable Contact Installation.

a. Grasp the wire and the back of the contact between thumb and forefinger. Hold the contact straight and start it into the thinline
housing.
Do not use pliers or any other tool to facilitate insertion as this may permanently damage the contact.
b. Push the contact in with a straight and even pressure until the contact clicks into place. When in position, the contact rotates
easily.
c. Rotate and pull lightly on the wire to ensure the contact is properly seated.
5.3.10.4. Coaxial Cable Preparation for Contacts for Single Shielded Cable.
a. Use a sharp knife and a small pair of diagonal cutters. Prepare the cable as indicated in Figure 5-28. Do not nick braid or center
conductor.
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REPAIR 523-0768039
Figure 5-28. Connector Trimming Preparation Diagram
b. Insert trimmed cable into inside diameter of inner sleeve. The coax braid slides over the inner sleeve as shown in Figure 5-29.
Slide outer sleeve on coax cable.
c. The cable is pressed in until the inner sleeve wedges between coax braid and dielectric.
d. In this position, the cable dielectric should not bottom on the connector center contact, and the cable center conductor should
feed completely through the connector center contact, as shown in Figure 5-29 and Figure 5-30.
Figure 5-29. Trim Cable Insertion
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REPAIR 523-0768039
Figure 5-30. Coax Braid
e. When a-d herein are satisfied, the center conductor connection can be soldered. Use minimum amount of heat and do not over
solder.
f. Smooth the coax braid over the inner sleeve. The cable braids should not extend beyond the inner sleeve. Slide outer sleeve
over braid until it butts up against rear face of the connector.
g. Crimp outer sleeve in the position as indicated by the drawing. Use crimp tool and place access cover on connector body.
h. Press in tightly and solder around the edges.
5.3.11. Backplane Removal.
Perform the following steps for backplane removal.
NOTE
Removal of the backplane should only be attempted when replacement is necessary or a connector pin must be
replaced.
Prior to backplane removal, ensure that all station power is off.
a. At the front of the shelf, loosen the Air Transport Rack (ATR) enclosure fasteners and move them to one side.
b. Grasp the handle of the ATR and firmly pull the unit from the shelf.
c. Repeat the removal procedure for each ATR on the shelf.
d. Loosen the 3.2-mm (1/8-in) retaining bolt in the center of the Input/Ouput (I/O) connector.
e. Firmly grasp the I/O connector handle, and pull the connector free from the backplane jack.
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REPAIR 523-0768039
f. At the rear of the shelf, remove the tags that show location of all external cables that are connected to the backplane jacks.
g. Remove the lower screws (without lockwashers) across the bottom of the backplane that fastens into the shelf frame.
h. Remove the corresponding screws at the top of the backplane. Use care in removing the last screws to ensure the backplane
does not fall from the shelf.
5.3.12. Backplane Disassembly.
Perform the following for backplane disassembly.
a. Lay the backplane on flat work surface with the connector pins pointing upward.
b. Remove the screws at top of the backplane that are connected to the top retaining bar.
c. Remove the lower screws connected to the bottom retaining bar.
d. Remove the screws securing the female thinline connector housings to the backplane.
NOTE
Where quick-disconnect plug housings are not used, the nut is staked to the backplane.
e. Remove the two retaining bars and backing plane.

5.3.13. Replacement of Tuning Fork and Blade-Type Connectors.
Perform the following for the tuning fork blade and blade type connector removal and installation.
5.3.13.1. Tuning Fork and Blade-Type Connector Removal.
NOTE
If the female thinline connector containing the tuning fork to be removed also contains coaxial or high-voltage,
high-current connectors, refer to Paragraph 5.3.10.1 for removal procedures.
a. Remove the screw in the center of the connector housing that contains the pin to be removed.
b. To remove the connector housing, grasp it near the top and bottom, and with a slight rocking action lift the contact housing
from the contact pin field.
c. Locate the pin to be replaced on the mating side of the backplane.
d. Using a soldering iron and a pair of needle-nose pliers, grasp the connector to be removed so that an even vertical pull can be
exerted. Do not pull at this time.
e. Apply the soldering iron to base of the pin where it enters the backplane.
f. When the solder melts around the base of the pin, apply an even, steady, upward pull on the pin until it is completely free of
the backplane.
NOTE
Do not jerk or twist the contact being removed as unrepairable damage may result to the thru-hole and the back-
plane. Do not apply heat to the thru-hole for more than 8 seconds.
5.3.13.2. Tuning Fork and Blade-Type Connector Installation.

a. Reheat the thru-hole and, with a solder sucker, remove all excess solder from both sides of the hole.
b. Insert new contact (CPN 372-2514-020, tuning-fork type, or 372-2604-XXX and 372-2603-XXX, male-blade type) into the
thru-hole. Reheating may be necessary as some solder remains in the thru-hole.
c. Seat the new contact to a height equal to that of adjacent contacts (mating side). Ensure the new contact is aligned with the
surrounding contacts.
d. At the mating side of the backplane, solder the new contact to the board. Use solder sparingly to avoid solder buildups.
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REPAIR 523-0768039
e. Check the reverse side of the contact to ensure that solder has flowed through the thru-hole.
f. Using a pipe cleaner or small brush dipped in solvent, clean the newly soldered area.
g. Use a pair of diagonal cutters to cut the new contact to the length of the surrounding pins.
Ensure that the cut portion of the contact does not fly wildly after being cut, as personal injury may result.
h. With a smooth machine file, form the tip of the new contact to conform with surrounding pins. Ensure no barbs are present
after filing.
5.3.14. Backplane Reassembly.
Perform the following steps for backplane reassembly.
a. Carefully place the connector housing over the pinfield, ensuring proper alignment of the contacts with their respective holes
in the housing.
b. Apply an even downward rocking pressure to the top and bottom of the housing until all contacts are seated and the housing is
flush with the backplane.
c. Replace the screw removed from the center of the housing.
d. Place the backing panel over the housings and onto the backplane.
e. Position the top retaining bar over the matching holes in the backplane.
f. From the wiring side of the backplane, replace the screws and lockwashers. Do not tighten these screws at this time.
g. Replace the lower retaining bar in the same manner using screws and lockwashers. Do not tighten these screws at this time.
h. From the mating side of the backplane, insert the housing mounting screws and secure with the self-locking nuts removed
during disassembly (if removable).
i. Tighten the screws previously installed in the retaining bars.
NOTE
Refer to Paragraph 5.3.10.3 for installation procedure of coaxial or high-voltage, high-current connectors if appli-
cable.
5.3.15. Backplane Installation.

Perform the following steps for backplane installation.
a. Position the backplane assembly on the ATR shelf in the same position from which it was removed.
b. Secure the backplane to the shelf with remaining screws. Begin with the corner screws of the top row.
c. Reinstall the I/O connector in the J1 position of the backplane. Secure the connector to the jack by tightening the bolt located
in the center of the connector.
Do not overtighten the I/O connector retaining bolt as damage to the connector may result.
d. Reinstall each ATR case in their proper position. Ensure each case type number corresponds to the type number silk-screened
at the front of the shelf.
e. Secure the ATR cases to the shelf with the retainers provided at the front of the shelf.
5.3.16. Replacement of Blue-Line Plug Contact.
Perform the following steps for blue-line plug contact removal, crimping, and installation.
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REPAIR 523-0768039
5.3.16.1. Blue-Line Plug Contact Removal.

a. At the rear of the connector housing there are rows of L-shaped cavities with an offset portion towards the center of the housing.
b. Insert the tip of the extraction tool (CPN 351-0519-001; Amp Inc, part number 91029-1 is no longer available. See Figure 5-32
for fabrication drawing) into the offset in the cavity (see Figure 5-31). Allow the wire lead to lie in the channel of the tool
handle.
c. Push the tool tip into the cavity and press it against the inside surface of the cavity. When the tip reaches the proper depth, it
snaps into a recess in the cavity. Pull back lightly on the tool, making sure the tip is engaged.
d. Keep the tip of the extraction tool against the shoulder and the inside surface of the cavity. Move the tool handle toward the
center of the housing (counterclockwise) so that the tip depresses the lance of the contact.
e. With the lance depressed, a short tug on the lead disengages the lance from the shoulder. The tool and contact can now be
removed from the cavity.
Figure 5-31. Blue-Line Connector Snap-In Contact Extraction Diagram
Figure 5-32. Contact Extraction Tool, Fabrication Diagram
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REPAIR 523-0768039
5.3.16.2. Blue-Line Plug Contact Crimping.

a. Refer to Table 5-3 for correct contact selection and crimp section for the gauge of wire being used.
b. Strip the insulation from the lead to the proper length, as indicated in Table 5-3, for the gauge of wire being used.
c. Select the proper contact to accommodate the wire gauge being used.
d. Open the crimp tool handles by completely closing them until the ratchet releases the handles and they spring to normal open
position.
Once ratchet has been engaged, the handles cannot be opened until they are fully closed and the crimp cycle is
completed.
e. Determine the correct die entry to be used by reference to wire size range as noted in Table 5-3.
f. Hold the contact with the wire barrel and insulation facing toward the front of the tool, and insert the contact into applicable
die. Contact should be positioned with the tool locator resting between the wire barrel and the insulation barrel.
g. Hold the contact in place, and close the handles until the lower crimping inserts move up and hold the contact in place without
deforming the wire barrel or insulation barrel.
h. Holding the wire straight, insert the stripped portion into the wire barrel until the insulation butts against the tool locator. The
tip of the stripped portion should be under the holddown feature of the crimping tool.
i. Hold the wire in place. Complete the crimp by closing the tool handles until the ratchet releases.
j. Remove the crimped contact from the tool.
k. Ensure that the insulation support portion of the contact appears rounded rather than flattened or oval shaped, so that this portion
does not interfere with the insertion of the contact into the contact block. The insulation support portion of the contact is not
meant to effect an actual crimp on the insulation.
l. Ensure that only the stripped portion of the wire is captured within the wire barrel crimp. The bare wire should be visible in
front of the wire barrel and not extend more than 0.8 mm (1/32 in). The insulated portion of the wire should never be contained
in the wire barrel.
m. The end portions of the insulation support should contact each other after crimping to form a complete loop. The wire barrel
section of the contact should be completely closed after crimping.
Table 5-3. Contact, Wire, and Crimp Tool Data
CONTACT WIRE CRIMP TOOL

ROCK- AMP INC. GAUGE STRIPPING ROCKWELL AMP INC. PART CRIMP
WELL PART LENGTH (IN) COLLINS PART NUMBER SECTION
COLLINS NUMBER NUMBER
PART
NUMBER
372-2255- 85969 20 0.188-0.141 372-8092-010 90202-1 20-22
010
22
372-2255- 85967 24 0.172-0.109 372-8092-010 90202-1 24-30
020
26
28
30
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REPAIR 523-0768039
5.3.16.3. Blue-Line Plug Contact Installation.

a. Position the contact with the contact housing cavity as shown in Figure 5-33.
b. Push the contact into the cavity until an audible snap is heard, indicating that the lance has snapped into position holding the
contact within the cavity.
c. Pull slightly on the wire to ensure that the contact remains in the cavity.
Figure 5-33. Blue-Line Connector Snap-In Contact Insertion Diagram
5.3.17. Replacement of I/O Connector Snap-In Contacts.

Perform the following for the removal, crimping, and installation of the I/O connnector snap-in contacts.
5.3.17.1. I/O Connector Snap-In Contact Removal.
a. Insert extraction tool (CPN 372-8091-010, Cannon part number CET-TF) into vertical slots of connector that house the contact
to be removed.
NOTE
CPN 372-8091-010 may be used as an alternative extraction tool for CPN 372-2514-010/030/110/130 or 372-
2514-080/180.
b. Ensure tool is fully inserted and then push slide portion of tool forward holding handle in position to keep the tool from working
out.
c. With the tool inserted, grasp the contact from the wiring side and gently pull free from housing.
d. Remove extraction tool from housing.
5.3.17.2. I/O Connector Snap-In Contact Crimping.
a. Strip 3.17 mm (1/8 in) of insulation from the lead to be crimped to the new contact.
b. Open the crimp tool handles (CPN 372-8091-030, Cannon part number CCT-TF) by completely closing them until ratchet
releases; handles spring to normal open position.
Once ratchet has been engaged, the handles cannot be opened until they are fully closed and the crimp cycle
completed.
c. Position contact (CPN 372-2514-010) in crimp tool with tool locator resting between the wire barrel and insulation barrel.
d. Hold the contact in place, close the handles until the lower crimping inserts move up, and hold the contact in place without
deforming the wire barrel or insulation barrel.
e. Hold the wire straight and insert the stripped portion into the wire barrel until the insulation butts against the tool locator.
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REPAIR 523-0768039
f. Hold the wire in place and complete crimp by closing the tool handles until the ratchet releases.
g. Remove crimped contact from the tool.
h. Ensure that the insulation support portion of the contact appears rounded rather than flattened or oval shaped so that this portion
does not interfere with the insertion of the contact into the housing.
i. Ensure that only the stripped portion of the contact is captured within the wire barrel crimp. The base wire should be visible in
front of the wire barrel and not extend more than 0.8 mm (1/32 in). The insulated portion of the wire should never be contained
in the wire barrel.
j. The end portions of the insulation support should contact each other after crimping to form a complete loop. The wire barrel
section of the contact should be completely closed after crimping.
k. The mechanical connection of the wire to the contact should not break, loosen, or become distorted before the minimum tensile
strength listed in Table 5-4 is achieved.
Table 5-4. Crimp Tensile Strength
WIRE GAUGE MINIMUM TENSILE STRENGTH

20 20 lbs
22 12 lbs
24 8 lbs
l. Test specimens should have the wire stripped approximately one inch from the contact as an aid in failure analysis.
m. An axial load should be applied at the rate of 1± 0.25 inch per minute. The load indicating scale on the test equipment should be
graduated in unites which are compatible with the loads being applied. The reproducibility and accuracy of the tensile testing
machine should be ± 1.0 pounds in the range of 50 to 100 pounds.
5.3.17.3. I/O Connector Snap-In Contact Installation. This is the alternate procedure for installation when no insertion tool is used.
a. Grasp the wire between thumb and fore finger just between the crimp. A tweezers or long nose pliers may be used.
b. Push the contact into the housing cavity until the lance has snapped into position and holds the contact in the cavity. Care should
be taken not to bend the wire while loading.
A minimum service loop of two inches is required to facilitate contact removal.
c. Pull slightly on the lead to ensure that the contact remains in the cavity. To make certain that the contact is seated after insertion,
a light pull of 2-4 pounds should be applied to the wire.
5.3.18. Soldering High-Voltage Circuitry.
Perform the following steps when soldering high-voltage circuitry.
a. Insulation must be stripped from the wire using thermal strippers or a mechanical stripper that produces consistent results with
no possibility for nicking or damaging the conductor.
b. The insulation must not be embedded in the solder joint. The insulation clearance must be less than two wire diameters (in-
cluding insulation) or 1.6 mm (1/16 in), whichever is larger.
c. A minimum amount of solder should cover the soldered wire and form a slight fillet between the terminal and each side of the
wire. The contour of the members of a solder connection must be visible after soldering. The joint should have a smooth good
fillet between parts, good adherence between parts, and no excess solder.
d. Flux residue must be removed immediately after soldering.
e. Check the solder joint for the following unacceptable solder connections.
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REPAIR 523-0768039
(1) Incomplete coverage of metal surfaces, wires, leads, or terminals that are joined.
(2) Cold or fractured solder joints.
(3) Nonadherence of the solder to the joined surfaces.
(4) Excess solder, peaks, strings, or bridges of solder between adjacent parts or circuits.
f. If a solder connection is to be repaired or reheated, the old solder must be removed and new solder applied. If the reason for
repair is insufficient solder, only additional solder need be applied. Areas and devices adjacent to the solder joint must not be
burned or scorched.
5.3.19. Repair of Circuit Pads.
Perform the following when repairing circuit pads.
5.3.19.1. Circuit Pad Repair Limitations.
a. Repair of pads on both sides of a common hole that connects with internal circuitry is prohibited.
b. Slightly lifted pads may be repaired by re-bonding with adhesive. If badly damaged, the pad and adjoining conductor should
be removed back to where a good bond exists and a repair pad is applied.
c. Pads that come in direct contact with box socket tangs can be repaired only if damage is no greater than slight lifting of the
edges.
d. Hidden pads that serve as conductor terminations should not be repaired if the repair is not visible for inspection after soldering.
e. Pads on two layer boards that do not serve as conductor terminations do not need to be replaced.
5.3.19.2. Circuit Pad Repair Process.
a. Apply a thin coat of adhesive under lifted edge of pad using a toothpick.
b. Push pad back into position with fiber stick.
c. If the pad is torn or if there are breaks in it, remove the pad and adjoining conductor (to where a good bond with board exists)
with an X-Acto knife. If pad has been soldered, remove pad with appropriate soldering iron.
d. Select proper repair pad. Center pad over hole to be repaired, using a toothpick through the hole in the pad.
e. Cut pad conductor using X-Acto knife; allowing for a minimum of 3 conductors width overlap (see Figure 5-34). If a repair pad
with conductor is being used from a scrapped Printed Wiring Board (PWB) or PWA, carefully scrape repair pad and conductor
on the bottom side to remove all PWB laminate base material using an X-Acto knife or equivalent. Scrape the existing conductor
on the PWA needing repair to remove solder mask.
Figure 5-34. Overlap For Pad Repair of PWAs
f. Tin the scraped side of the repair pad with conductor and existing conductor. Align the tinned side of the repair pad and con-
ductor to the Plated Through Hole (PTH) barrel and the existing conductor.
g. Apply a light coat of flux to pad conductor and circuit conductor area to be soldered.
h. Solder repair conductor to circuit conductor.
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REPAIR 523-0768039
(1) Repair conductor must be held firmly against circuit board with stick until solder solidifies.
(2) Solder should completely fill the hole and should form a 100% fillet around wire or lead to the pads on both sides of PWA.
(3) Take care not to overheat board or conductor.
(4) Apply only enough solder to allow adequate alloying action to take place.
i. Remove soldering iron and allow solder to solidify.
j. Insert proper size wire into hole in pad, and form both ends of wire to repair pad as shown in Figure 5-35 using a scribe.
Figure 5-35. Wire Insertion for Pad Repair Diagram
NOTE
For repair of PWAs with lead protrusion requirements of .020 inch or less, a device lead can be inserted into the
hole where the pad is being repaired; the clinched lead may be used to make the circuit interconnect in place of
the wire.
k. Apply light coat of flux to both pads and wire or lead.

l. Solder both ends of wire to the repair pad as shown in Figure 5-35.
(1) Make sure the pad remains centered over hole while soldering.
(2) Solder must completely fill planar board hole around wire and must form a fillet around wire on both sides of board.
m. Remove iron and allow solder to solidify.
n. After solder has solidified, clean soldered area with an approved solvent using a pipe cleaner. Wipe cleaned spot dry with a
lintless tissue.
o. Apply a thin coat of adhesive (for circuit bonding) from the material list to the edges of the repair pad and conductor to the
PWA extending a minimum of .010 inch beyond the repaired area.
p. Apply postcoat to required area (if applicable) according to Paragraph 5.3.26.2.
q. Perform a final inspection.
5.3.20. Repair of Conductor Lines.
Perform the following when repairing conductor lines.
5.3.20.1. Lifted Conductor or Broken Conductor more than 3.2 mm (1/8-in) from Pad.
• No more than .500 inch of conductor line should be rebonded to the board.
• Damaged conductor replacement should meet a minimum of 3 conductors widths overlap to the undamaged portion of the existing
conductor.
• The total length of uninsulated wire used for repairing a damaged conductor should be in accordance with Table 5-5 from the
wire requirements herein.
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REPAIR 523-0768039
Table 5-5. Uninsulated Wire Requirements
WIRE GAUGE BARE WIRE DIAMETER INSULATION TOTAL ALLOWANCE UNINSULATED

(Inch) DIAMETER LENGTH OF WIRE
38 .004 inch .018 inch .070 inch
36 .005 inch .019 inch .075 inch
34 .006 inch .020 inch .080 inch
32 .008 inch .033 inch .130 inch
30 .010 inch .034 inch .135 inch
28 .013 inch .037 inch .145 inch
26 .016 inch .040 inch .160 inch
24 .020 inch .044 inch .175 inch
22 .025 inch .049 inch .195 inch
18 .040 inch Uninsulated Only .160 inch
a. Apply a thin coat of adhesive under lifted portion of the conductor.

b. Push conductor back into position with fiber stick.
c. Apply a thin coat of the same adhesive to the edges of the conductor and the PWA extending a minimum of .010 inch beyond
the repaired area.
d. If conductor has a break or similar defect (see Figure 5-36), trim conductor in the defective area with an X-Acto knife back to
where a good bond with board exists. If conductor has been soldered, remove excess solder with soldering iron.
(1) Using flattened braid dipped in flux, position braid against conductor requiring removal of solder.
(2) Place iron on side of braid and wick solder from conductor area.
e. Select a proper width repair conductor from the scrap board or an uninsulated piece of bus wire or ribbon strip of a diameter
compatible with the width of the original conductor.
(1) Scrape the external conductor to remove any solder mask or PWB laminate base material and tin the conductor by applying
flux and solder.
(2) For conductor breaks .500 inch in length or greater, select a red etched insulated wire with the same width as that of the
original conductor.
f. Cut repair conductor allowing for 3 conductors widths overlap minimum at each end of the repaired conductor, cut and strip
red etched insulated wire, or cut an uninsulated wire allowing for 2 wire diameter overlap minimum overlap at each end of the
repaired conductor/wire (see Figure 5-36).
g. Place the repair conductor in position at the repair spot on the original conductor.
h. Form repair conductor to board using fiber stick. If break in conductor is small, forming of repair conductor is not necessary.
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REPAIR 523-0768039
Figure 5-36. Repaired Conductor Overlap Diagram
NOTE
Conductor defects of any length may be repaired by routing an insulated and etched conductor between the breaks
or between terminations. The wire may be secured to the board its entire length or it may be spot bonded with
adhesive at approximately 25.4-mm (1-in) intervals. Be sure that the type of tape used permits adherence to the
postcoat. When attached to a conductor line only, the repair conductor should contact the original conductor a
minimum of 3.2 mm (1/8 in) at each end.
i. Apply a light coat of flux to repair conductor and original conductor area to be soldered.
j. Solder repair conductor to circuit conductor at both ends as shown in Figure 5-36.
(1) Repair conductor must be held firmly against circuit board with stick until solder solidifies.
(2) Take care not to overheat board or conductor.
(3) Heat repair conductor until solder wets between the two conductors. (If using a wire lap, solder each end of the wire to
the existing conductor back to where a good bond exist with PWB).
k. Remove soldering iron and allow solder to solidify. The repair conductor should be approximately centered on the original
conductor after soldering.
l. After solder has solidified, clean soldered area with solvent using a pipe cleaner. Wipe cleaned spot dry with lintless tissue.
m. Apply a thin coat of adhesive (for circuit bonding) to the edge of the repair conductor and the PWA extending .010 inch beyond
the repaired area. If using a wire that exceeds 1.00 inch in length it should be secured to the PWA with adhesive (for wire-
bonding) over their entire length or spot bonded at intervals not exceeding 1.00 inch in length.
n. If space permits, uninsulated repair wire should be permanently identified with a decal. Equivalent decals should be no larger
than .13 inch x .35 inch.
o. Apply postcoat to required area (if applicable) according to Paragraph 5.3.26.2.
p. Perform a final inspection.
5.3.20.2. Broken Conductor less than 3.2 mm (1/8-In) from Pad.
a. If conductor has a break or similar defect within 3.2 mm (1.8 in) of the edge of the connecting pad, it should be repaired
by soldering a repair pad on top of the original pad and connecting the board conductor and repair pad conductor. If board
conductor has been soldered, remove excess solder with soldering iron.
b. Select proper repair pad and position over hole adjacent to conductor break using toothpick through hole in pad.
c. Cut pad conductor using X-Acto knife; allow for a 3.2-mm (1/8-in) minimum to 6.6-mm (1/4-in) maximum overlap beyond
breakage point.
d. Tin original pad on the board by applying solder.
e. Tin repair pad by applying solder.
f. Apply a light coat of flux to original pad and mating surface of repair pad.
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REPAIR 523-0768039
g. Position fluxed side of repair pad to original pad on board, forming pad conductor, unless break in conductor is small making
forming unnecessary.
h. Solder repair pad to original pad by heating repair pad with soldering iron until solder melts between the two pads. Make certain
pad remains centered over hole while soldering.
i. Solder end of repair conductor to original conductor.
j. Remove iron and allow solder to solidify.
k. After solder has solidified, clean soldered area with solvent using a pipe cleaner. Wipe cleaned spot dry with a lintless tissue.
l. Apply a thin coat of adhesive (for circuit bonding) from the material list to the edges of the repair pad and conductor to the
PWA extending a minimum of .010 inch beyond the repaired area.
m. Apply postcoat to required area (if applicable) according to Paragraph 5.3.26.2.
n. Perform a final inspection.
5.3.21. Repair of Plated Holes With No Internal Connections (Two Layer Boards).
NOTE
An open-plated hole with no internal connection is one in which the continuity has been lost between conductor
pads on opposite surfaces of the board.
Perform the following when repairing plated holes with no internal connections on 2 layer boards.
a. Remove solder, if any, from around hole to be repaired.
(1) Using flattened braid dipped in flux, position braid against pad requiring removal of solder.
(2) Place iron on side of braid and wick solder from pad areas.
b. Insert proper size wire into hole in pad, and form both ends of wire to pad.
NOTE
When a device lead is to be inserted into the hole being repaired, the clinched lead may be used to make the circuit
interconnect in place of the wire.
c. Apply light coat of flux to pad area.

d. Solder both ends of wire to the pads. Solder must completely fill planar board hole around wire and must form a fillet around
wire on both sides of board.
e. Remove iron, and allow solder to solidify.
f. After solder has solidified, clean soldered area with solvent using a pipe cleaner. Wipe cleaned spot dry with a lintless tissue.
g. Apply postcoat to required area (if applicable) according to Paragraph 5.3.26.2.
h. Perform a final inspection.
5.3.22. Repair of Short Circuits.
Perform the following when repairing short circuits.
5.3.22.1. Repair of Internal Short Circuits. Internal circuit repairs should be performed by qualified personnel only. Conductors
should not be cut or pierced to gain access to the circuit requiring repair.
a. Using a drill or pin vise with a drill bit diameter that is equal to or less than the Minimum Electrical Spacing (MES) requirement
for the layer where the short exist as specified on the PWB drawing, remove one conductors width or MES, whichever is greater
of conductive material causing short. Adjacent circuits beside, above, or below the circuit short should not have their cross
sectional area reduced or damaged during the repair process. This does not include ground and or power planes.
b. Use an approved solvent (for general cleaning) to clean the cavity and remove loose particles or slivers of the conductive
material.
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REPAIR 523-0768039
c. Solvent should be evaporated prior to adding adhesive in accordance with the general requirements.
d. Apply an adhesive (for fill and re-drill) into cavity in small amounts to minimize air entrapment that can cause voids. Overfill
approximately .010 inch around full periphery of the cavity.
e. Assure complete seal of the walls of the cavity and that the cured adhesive does not have voids or soft spots.
5.3.22.2. Repair of External Short Circuits. External conductor repairs should be performed by qualified personnel.
a. Remove minimum one conductors width or MES, whichever is greater of conductive material causing short with an X-Acto
knife or equivalent. The MES should be maintained and no more than 25% of the adjacent conductor cross sectional area should
be removed or damaged during the short removal process.
b. Use an approved solvent (for general cleaning) to clean the cavity and remove loose particles or slivers of the conductive
material.
c. Apply an adhesive (for fill and re-drill) to the PWA extending a minimum of .010 inch beyond the repaired area.
5.3.23. Repair of Open Thru-Holes.
NOTE
An open thru-hole may occur from damage to the hole during assembly or replacement of a defective device. It
results in an open circuit from the thru-hole wall to the connecting conductor (see Figure 5-37).
Figure 5-37. Open Thru-Hole (Left) and Repair (Right) Diagram
99999999
a. With appropriate drill, mill out the pad and plated thru-hole to the circuit having the open. Drill slowly and with very light
pressure.
b. Select proper (add pad) from the material list or from a scrap board, if applicable. If a 3 conductors width minimum overlap
with the existing conductor can not be maintain due to PWB design constraints select the appropriate size wire from the material
list to connect the external conductor with the PTH repair to complete the circuit.
c. Cut repair pad and conductor, using an X-Acto knife or equivalent, allowing for a minimum of 3 conductors width overlap.
If a repair pad with conductor is being used from a scrapped PWB or PWA, carefully scrape repair pad and conductor on the
bottom side to remove all PWB laminate base material using an X-Acto knife or equivalent. Scrape the existing conductor on
the PWA needing repair to remove solder mask.
d. Tin exposed conductor and repair pads (if needed) with solder and flux.
NOTE
A repair pad is required when no pad exists around the hole or when the existing pad must be removed due to
damage. It is not required when a good pad exists even though it may be open to the thru-hole wall, as long as an
eyelet contacts the existing pad.
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REPAIR 523-0768039
e. Select appropriate eyelet (funnel flange or flat flange). Use a funnel flange eyelet except where Minimum Electrical Clearance
would be violated. Use a flat flange style eyelet on PWAs with lead protrusion requirements of .020 inch or less. A flat flange
style eyelet should be used if the flattened flange of the eyelet is used as the isolated pad. Insert eyelet (with repair pads if
needed) into appropriate side of board and seat well. Support the eyelet using the appropriate eyelet-backing tool for the eyelet
selected.
f. Align pads with surrounding board features and flare, as shown in Figure 5-38, using a hand flare setting tool. DO NOT flatten
flanges that will be soldered.
Figure 5-38. Eyelet Insertion For Pad Repair
g. Flux and solder eyelet flares and pads.

h. If applicable, insert and solder component lead or wire. When an eyelet is used in conjunction with a pad on only one side of
the PWA, the eyelet should be filled 100% with solder. When an eyelet is used in conjunction with pads on both sides of the
PWA the eyelet should be filled 100% with solder.
i. After solder has solidified, clean soldered area with solvent using pipe cleaner. Inspect to assure proper soldering and cleaning.
j. Inspect to assure that filler has covered exposed board surfaces and there are no voids or soft spots.
k. Apply postcoat to required area (if applicable) according to Paragraph 5.3.26.2.
l. Conduct a final inspection.
5.3.24. Repair of Internal Open Circuits (Conductors).
Perform the following when repairing internal open circuit conductors.
5.3.24.1. Method 1 - External Jumper Wire. This procedure should not be used for repair of open circuit on the flexible portion of
a PWA.
a. Wire terminations should only be made to external PWB features of the PWA.
b. Using PWB drawings, determine termination points that connect to the open internal circuit line.
c. When connections exist on the surface of the board (such as unused thru-holes) which can be used to complete the connection
of an open internal conductor circuit, than an external jumper wire may be used (see Figure 5-39).
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REPAIR 523-0768039
Figure 5-39. External Jumper Wire Positioning Diagram
d. Select a (red insulated etched wire) according to the existing conductors width as specified in Table 5-6.
e. Cut repair wire as short as practical. To provide proper strain relief, wires .500 inch or greater in length should lay flat to the
PWA and should be routed in both the X and Y directions. It is identified as a repair wire by stamp or decal. Cut repair wire as
short as practical, route it in the X-Y directions, solder it in place, and identify it as a repair wire by stamp or decal.
f. If wire is over 25.4 mm (1 in) in length, it should be secured to the board by adhesive (or small transparent tape on postcoated
boards).
g. Perform a final inspection.
Table 5-6. Uninsulated Wire Requirements
REPAIR WIRE PWB CONDUCTOR

AWG WIRE CONDUCTOR OPERATING CURRENT COPPER CONDUCTOR WIDTH
DIAMETER (Inches) RATING (Amps) (Inches)
38 .004 .25 Up to .0025
36 .005 .36 Up to .0045
34 .006 .51 Up to .006
32 .008 .72 Up to .010
30 .010 1.02 Up to .018
28 .013 1.44 Up to .025
26 .016 2.05 Up to .045
24 .020 2.92 Up to .065
22 .025 4.12 Up to .140
20 .032 5.89 Up to .175
18 .040 8.29 Up to .360
16 .051 11.7 Up to .450
14 .064 16.6 Up to .950
5.3.24.2. Method 2 - Internal Repair Conductor.

a. With X-Acto knife remove enough of surrounding board material beside the open circuit to assure a clean area with no slivers
or smear of conductive material.
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REPAIR 523-0768039
NOTE
This caution applies if one or more conductive layers have been pierced to gain access to conductor requiring
repair.
b. Remove any loose particles and clean cavity with pipe cleaner moistened with solvent.
c. Tin exposed conductor and repair conductor with solder and flux. Repair conductor must be of sufficient length to provide
3.2-mm (1/8 in) minimum overlap on each end (see Figure 5-40).
Figure 5-40. Repair Conductor in Place Over Open Circuit Diagram
d. Use tweezers to position conductor segment flat against exposed board conductor and perform solder operation. Additional
solder should not be needed; tinned conductors should provide enough.
e. After solder has solidified, clean soldered area with solvent using pipe cleaner.
f. Inspect to assure proper preparation and cleaning.
g. Bake board 1 hour minimum at 75° ± 5°C to evaporate solvent. Allow board to cool to room temperature (approximately 20
minutes).
h. Apply filler material to cavity in small amounts to minimize chances of air entrapment which would cause voids. Overfill
approximately 0.8 mm (1/32 in) around full periphery of cavity.
i. Cure in oven for 3 hours minimum at 75° ± 5°C or 6 hours minimum at 65° ± 5°C. Allow to cool, and with X-Acto knife remove
slight excess of filler material until flush with board surface.
j. Inspect to assure complete seal of cavity with board surface and that filler material has no voids or soft spots.
k. Apply postcoat to required area (if applicable) according to Paragraph 5.3.26.2.
l. Perform a final inspection.
5.3.25. Repair of Horizontal and Vertical Box Connectors.
Perform the following when repairing horizontal and vertical box connectors.
5.3.25.1. Limitations of Repair.
a. The chipped area should not extend into the contact cavity.
b. The connector should not show signs of cracks extending from the chipped area.
c. Flakes or chips on connectors may be repaired in no more than two locations on a connector using colored epoxy matching the
connector. The epoxy should be worked to simulate the original.
5.3.25.2. Repair Process.
a. Remove all loose particles from the chipped area.
b. Clean the area to be repaired with one of the solvents (for general cleaning) from the material list.
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REPAIR 523-0768039
c. (Rubber plugs) from the material list may be placed over contact cavities that are adjacent to the damaged area to prevent
adhesive from entering the cavities.
d. Build/fill chipped area to original configuration using the adhesive (for connectors) from the material list in small amounts to
minimize air entrapment that causes voids.
e. After the adhesive has cured and cooled use a file or emery board to smooth out the repaired portion of the connector as nec-
essary.
f. Remove the rubber plugs.
g. The adhesive should not have voids or soft spots.
5.3.26. HumiSeal 1B31 Postcoating.
HumiSeal 1B31 and most solvents have a low flash point and are highly flammable until completely dry. There-
fore, they should be used only in areas approved for use with flammable materials. Do not expose these materials
to excessive heat or to open flame (this includes all smoking materials). Keep containers closed when they are not
in use. Use these materials only in areas that are adequately ventilated. Avoid prolonged breathing of vapors and
repeated contact of materials with skin.
Use of nonrecommended solvents to clean planar cards may cause extensive damage to the cards and the de-
vices on them. The type of damage inflicted by some solvents includes delamination of circuit traces, delamina-
tion/measling (bubbling of surface) of card layers, dissolving of adhesives, unwanted drying of devices’ natural
oils and destroying device lettering. Compare the chemical makeup of solvents claimed to be equivalent with
those recommended for exact chemical equivalency.
99999999
5.3.26.1. Procedures for Removal of HumiSeal Contamination.
5.3.26.1.1. General Comments. In all cases where HumiSeal contamination exists, the user has the option of eliminating contam-
ination from affected areas or replacing the contaminated parts. In all instances, the area around the affected part/parts should be
re-HumiSealed. HumiSeal contamination of the aforementioned areas can be determined by examining the areas under an ultraviolet
(black) light. HumiSeal appears blue in color when observed under the ultraviolet light. Be extra careful when applying postcoat
material around or near connectors, so as not to get any postcoat material on or in connectors.
5.3.26.1.2. Removal of HumiSeal on Square Pin Terminals Used for Connectors or Test Points
a. HumiSeal on square pin terminals (used for connectors or test points) in excess of 0.100 inch on pins 0.300-inch long or longer
or 0.060 inch on pins shorter than 0.300 inch can be removed by using a pipe cleaner dipped in a solvent such as Toluene or
equivalent. The contaminated area may need to be wiped several times in order to completely rid the area of HumiSeal. It is
suggested that a freshly dipped pipe cleaner be used each time.
b. The square pin terminals should be inspected under an ultraviolet light to ensure that all the excess HumiSeal has been removed.
After successfully ridding the square pin terminals of HumiSeal, some touchup may be required at the base of each affected
terminal. This can be accomplished by using a fine artist’s brush and HumiSeal 1B31. Dip the brush in HumiSeal, and very
carefully recoat the base of the terminals. HumiSeal must come to the edge of the pad to which the square pin terminal is
soldered. However, no attempt need be made to cover the solder fillet of each pin. In any case, HumiSeal must not extend up
the square pin terminal (measured from board surface) more than 0.100 inch on pins 0.300-inch long or longer or 0.060 inch
on pins shorter than 0.300 inch.
5.3.26.1.3. Removal of HumiSeal in Contacts.
a. If HumiSeal is only on one or two contacts of a blue-line connector, several methods of HumiSeal removal have proven suc-
cessful.
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REPAIR 523-0768039
b. The HumiSeal can be removed from the contact by injecting a solvent such as Toluene solvent or equivalent into the contact;
followed by injecting bursts of air from an air hose through the back side of the connector to aid in removing any solvent. This
process should be repeated as often as required in order to remove HumiSeal from contact.
c. A second method for HumiSeal removal is to dip the end of a pipe cleaner into the solvent and repeatedly wipe the pipe cleaner
over the affected area. Care should be taken not to leave residue from the pipe cleaner on the contact. Again, injecting bursts
of air from an air hose through the back side of the connector aids in removing any solvent.
NOTE
Always apply air pressure to the back side of the connector first. This greatly reduces the chance of blowing
solvent on other HumiSealed areas of the board.
5.3.26.1.4. Removal of HumiSeal In Connectors. In the event that many contacts in the connector show evidence of HumiSeal
contamination, the entire connector should be stripped using Toluene solvent or equivalent. The entire connector should be sub-
merged in one of the recommended solvents as many times as required in order to completely rid the contacts of any HumiSeal. It is
recommended that solvent used for the first contamination removal attempt be adequate enough to remove HumiSeal from approxi-
mately 1 inch beyond connector. The solvent should be refreshed often to ensure complete and thorough cleaning of contaminated
areas. After cleaning, inspect connector under the ultraviolet light and repeat process as required. Injecting bursts of air from an air
hose through the back side of the connector aids in removing any solvent.
5.3.26.2. HumiSeal 1B31 (Postcoat) Application.
5.3.26.2.1. General Precautions of HumiSeal Application.
a. Do not use postcoat material with expired shelf or pot life.
b. Do not agitate postcoat materials as this may cause air bubbles in the container.
c. Do not allow conductive foreign material to be entrapped in the coating.
Circuit cards manufactured prior to the mid-1970 may have been postcoated with Drifilm 88 conformal coating.
Drifilm 88 is no longer available. If repair activity has been performed on a Drifilm 88 coated assembly, the
complete assembly has to be washed with solvent. All traces of Drifilm 88 must be removed before the assembly
can be coated with HumiSeal 1B31, as Drifilm 88 and HumiSeal 1B31 are not chemically compatible. A Drifilm
88 coated assembly has a clear appearance versus the glossy, yellowish hue for HumiSeal 1B31 coated assemblies.
Intermittent electrical problems may be caused by HumiSeal 1B31 being too high on square pin terminals (in
excess of 0.100 inch on pins 0.300-inch long or longer or 0.060 inch on pins shorter than 0.300 inch), on contacts
or in blue-line connectors. HumiSeal contamination of the aforementioned areas can be determined by examining
the areas under an ultraviolet (black) light. HumiSeal appears blue in color when observed under the ultraviolet
light. Be extra careful when applying postcoat material around or near connectors, so as not to get any postcoat
material on or in connectors.
Follow manufacturers recommendation concerning exposure to ultraviolet light.
d. The following items are not to be postcoated at all: variable resistors, capacitors, or inductor tuning lugs; test points; test
select pins/terminals; Electromagnetic Interference (EMI) Shields/Mechanical stiffeners; keyways; card handles and guides;
mounting posts; ribbon cables; heat-dissipating fins or heat sinks; mechanical switching items; connector pins; lead-in surfaces;
Modulation (MOD) labels and labels reserved for Programmable Read-Only Memory (PROM)s; clearance holes; bearing sur-
faces; strain relief leads; index pins; guide pins; spacer hardware or solder connections that are suspended off the board and
terminate to a pin, terminal, lug or similar component. See Figure 5-41 for example illustrations of these parts.
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REPAIR 523-0768039
Figure 5-41. Components to be Free of Conformal Coating
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REPAIR 523-0768039
The following parts do not have to be completely free of conformal coating, instead they have keep out zones that should not be
coated:
Card Connectors Connector contacts and lead in surfaces should be free of conformal coating. The board edge
immediately adjacent to a card connector should be defined as the leading edge. A perimeter may be
masked around the connector to prevent the intrusion of the coating material into the contact area. The
perimeter may not exceed .060 inch. Adjacent pads or exposed circuitry within this .060 inch wide
perimeter should be coated.
Solderable Connectors For soldered connectors (horizontal or vertical) a .060 inch wide perimeter around the connectors
may be free of the coating material. Adjacent pads or exposed circuitry are coated, provided they are
accessible and does not result in flooding of the connectors.
Horizontal Connectors The pads and solder connections on the opposite side of the printed circuit assembly should be coated.
The board edge immediately adjacent to a horizontal card connector is defined as the leading edge.
The entire length of this edge may be free of coating. Manufacturing engineering may determine those
leading edges which should be free of conformal coating for horizontal card connectors.
Vertical Connectors The pads and solder connections of vertical connectors on the opposite side of the board may be masked
to prevent intrusion of the coating material. This masked area may extend .060 inch maximum from
the edges of the connector pads. Adjacent pads or exposed circuitry within this .060 inch perimeter
should be coated. If it is required that the pads and board surface between the pads be covered, the
maximum extension of coating coverage should be to the edge of the through hole in the center of the
pad. The through hole, in the center of the pad, should be free of coating. The edge of the card equal
to the length of the connector may be free of conformal coating.
Solderless (or Press-Fit) The pads and contacts on the opposite side of the board should be free of the coating material. This
Horizontal Connectors uncoated area may extend .060 inch maximum from the edges of the connector pads. The board edge
immediately adjacent to a solderless horizontal connector should be defined as the leading edge.
The entire length of this edge may be free of coating. Solderless horizontal or vertical connectors
replaced on the PWA and soldered should follow the applicable requirements for soldered connectors.
Manufacturing engineering may determine those leading edges which should be free of conformal
coating for solderless horizontal connectors. For these connectors (also called solderless pin connectors),
the connector latch opening areas on the PWB, top and bottom sides, need not be conformal coated.
Solderless Vertical The requirements defined for a solderless horizontal connector are also applicable for a solderless
Connectors vertical connector, reference and applicable figures.
Thin Line Connectors A thin line connector is any horizontal card connector which has all the contacts of the connector
exiting the back of the connector in a waterfall configuration. The connector contacts and lead in
surfaces, for a typical thin line connector, should be free of conformal coating. The leads on the back of
the connector may be conformal coated. Adapters, mounting hardware and the outside surfaces of the
connector shell may be covered with conformal coating. The solder connections between the contact
adapters on the top side of the Printed Circuit Assembly (PCA) may be coated. Coating may come
within .060 inch from outside edge of connector pad. The solder connections, on the opposite side of
the assembly, should be covered with conformal coating.
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REPAIR 523-0768039
Connector Mounted Off The connector contacts and mating surfaces should be free of conformal coating. The remaining
Board on Posts surfaces of the connector housing may be coated. The associated mounting hardware and mounting
posts may be coated. Any exposed clad mounting surfaces, on the same side of the assembly as the
connector, may be coated provided the mounting post has been securely fastened to the clad surface. It
is not necessary to coat the solder joints at the base of the contacts. The solder joints and pads on the
opposite side of the board should be coated. The clad mounting surfaces, on the opposite side of the
assembly, may be free of coating if the post has been mechanically flared and staked or rolled. If the
post has been fastened using hardware, on the opposite side of the assembly, coating may cover the
hardware and any exposed clad surfaces.
Ribbon Cables Wicking of the conformal coating material up wires and into the ribbon cable insulation material may be
allowed if the insulation material is not silicone or urethane based.
Ribbon Cable Ribbon cable connectors not attached to the printed wiring board (connector is at the free end of the
Connectors cable) and the ribbon cable itself should be free of conformal coating. If a ribbon cable soldered to the
connector and the connector is soldered to the PWA, the connector may be coated. If the connector
attachment to the PWA is solderless (press fit type), the connector should not be coated.
Plug Connectors The connectors mating surfaces, including latches (if applicable) and the connector contacts should
be free of the conformal coating. The remaining surfaces of the connector housing may be coated. A
.060 inch wide perimeter around the connector housing/base may be free of the coating to prevent
flooding into the contact area.
Small SMT Connectors A .060 inch wide perimeter around the connector body may be free of the coating material. Adjacent
(example: CPN pads or exposed circuitry within the 0.060-inch wide perimeter should be coated only if wicking or
372-7571-130) flooding of the contacts within the connector will not occur.
Rear Entry SMT A .060 inch wide perimeter around the connector body may be free of the coating material. Adjacent
Connectors (example: pads or exposed circuitry within the .060 inch wide perimeter should be coated only if wicking or
CPN 372-7571-040, flooding of the contacts within the connector will not occur. On the opposite side of the PWA, the
150, 160) conformal coating can stop .060 inch from the perimeter of the non-plated through holes and may wick
up to the non-plated through holes, but should not enter the holes.
Socket Contacts Socket contacts, for Integrated Circuits (ICs), pin diodes, and similar components, should be free of
conformal coating. A .060 inch wide perimeter may be free of the coating around the socket or socket
housing to prevent intrusion of the coating material into the contact area. Adjacent pads or exposed
circuitry within this .060 inch wide perimeter should be coated. The IC socket, shown in Figure 5-15,
has the center of the socket housing removed, like a pocket or window. Any exposed circuitry or
subsequent pads within this visible area may be coated. The solder joints of socket contacts, on the
opposite side of the assembly, should be coated.
Pins, Terminals, and Square pins, index pins, guide pins, test points, and test select pins/terminals should be free of
Test Points conformal coating to the extent that any coating present, does not interfere with subsequent connections.
The coating may cover the solder at the base of the pin and extend not more than .060 inch above the
board surface for pins with a Z dimension less than or equal to .300 inch or extend not more than .100
inch above the board surface for pins with a Z dimension greater than .300 inch. This rule is applicable
for pin protrusion on either side of the board.
NOTE
Cognizant engineer may determine coating coverage of pin protrusions not intended
for mating connectors, unless otherwise specified.
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REPAIR 523-0768039
Adjustable and Adjustment screws, adjustable filters, the interior of unsealed parts such as adjustable coils, switches,
Unsealed Components test jacks, jack tips, transformers and other similar areas should be free of conformal coating. The
coating may come within .060 inch of the part. Exposed circuitry (lines) and/or adjacent pads within
the .060 inch area should be coated.
Programmable Devices The top surface of an erasable programmable device may be free of conformal coating. The glass
window should be completely free of conformal coating.
Programmable Boards Applicable production floor documents may indicate that a part be free of conformal coating for
or Assemblies placement of the PROM label during programming or that a label with the words "Reserved for
PROM Label" be located on the board for placement of the PROM label on top of that label during
programming.
Light Emitting Diodes Light Emitting Diode (LED)s (including surface mount LEDs) and photo diode lenses should be free
(LEDs) and Photo of coating. Conformal coating should come within .060 inch of the part. Exposed circuitry and/or
diodes adjacent pads within .060 inch of the LEDs and photo diodes should be coated. The solder joints on the
opposite side of the assembly should also be coated.
Clad Mounting For clad mounting pads which are designated on the PCA engineering drawing to be free of conformal
Pads/Identified Clad coating, the coating should come within .060 inch of the pad edge. Exposed circuitry and/or adjacent
Areas pads within .060 inch of a clad mounting pad/identified clad area should be covered with conformal
coating. Also, unless specific dimensional limits are stated on the drawing, areas identified by cross
hatching may be masked with round tape dots of adequate size to provide general working clearance for
mating surfaces.
Unclad Mounting Holes For unclad mounting holes which are designated on the printed circuit assembly engineering drawing
to be free of conformal coating, the coating should come within .125 inch of the hole edge. Exposed
circuitry and/or adjacent pads within .125 inch of an unclad mounting hole should be covered with
conformal coating. Also, unless specific dimensional limits are stated on the drawing, areas identified
by cross hatching may be masked with round tape dots of adequate size to provide general working
clearance for mating surfaces.
Insulated Wires Insulated wires with one or both end terminating on the board should have the strip length and solder
connection covered with conformal coating. It is not necessary to coat the insulation on the wire.
MOD Labels and Labels These labels should be free of conformal coating. Conformal coating may come within .060 inch of
Reserved for PROMS these labels. Exposed circuitry and/or adjacent pads within .060 inch area should be coated.
Open Bottom, The top mating surface of the spacer should be free of conformal coating. The exposed threads, on
Threaded, Spacer the opposite end of the spacer, should also be free of conformal coating. Coating is allowed to cover
the sides of the spacer, the exposed mounting surface, and the rolled or flared portion of the spacer
on the opposite side.
Open Bottom Spacer The top mating surface of the spacer should be free of conformal coating. The through hole, on the
opposite end of the spacer, should also be free of coating. Coating is allowed to cover the sides of the
spacer, the exposed mounting surface, and the rolled or flared portion of the spacer on the opposite side.
Closed Bottom, The top mating surface of the spacer should be free of conformal coating. Coating is allowed to cover
Threaded Spacer the sides of the spacer, the exposed mounting surface, and the entire bottom side of the spacer.
Spacer with Captured The top mating surface of the spacer and the captured hardware should be free of conformal coating.
Hardware The exposed hardware, on the opposite end of the spacer, should also be free of coating. Conformal
coating is allowed to cover the sides of the spacer, the exposed mounting surface, and the rolled or
flared portion of the spacer on the opposite side.
Spacer Fastened by The top mating surface of the spacer should be free of conformal coating. Coating is allowed to cover
Hardware the sides of the spacer, the exposed mounting surface, and the hardware used to fasten the spacer
on the opposite side.
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REPAIR 523-0768039
Stud The exposed threads of the stud should be free of conformal coating. To the extent that any coating
present should not interfere with subsequent connection. The area to be masked off at the base of the
stud on the printed circuit assembly should be specified on the engineering drawing. The bottom
surface of the stud may be coated.
Angle Nut The front and back mating surfaces and the threads of the angle nut should be free of conformal coating.
The remaining two sides, the top of the angle nut, and the mounting surface may be coated. The bottom
of the angle nut may also be coated. Floating angle nut should be completely free of conformal coating.
Radiative Heatsinks Finned, or ribbed, etc. heatsinks that dissipate heat to circulating airflow should be free of conformal
coating. Solder joints and leads of parts mounted on these heatsinks should be coated. Part body
may be free of coating.
Conductive Heatsinks Heat sinks that dissipate heat to thermally conductive chassis/housing, etc, may be conformal coated,
unless otherwise specified on engineering drawing. Solder joints and leads of parts mounted on these
heatsinks should be coated. Part body may be free of coating.
Silicone Pads/Sheets Used as heat transfer media is not conformal coated unless specified on the engineering drawing. Solder
joints and leads of parts mounted on these heatsinks should be coated. Part body may be free of coating.
Plastic Bodied All exposed surfaces of the transistor should be coated. When the bottom surface of the transistor has to
Transistor be attached or bonded at next assembly, that bottom surface should be free of the conformal coating.
Components Mounted Components mounted on side rails or on brackets may be free of conformal coating. However, exposed
on Side Rails or leads or solder joints spaced less than .060 inch apart should be coated provided they are accessible.
Brackets
e. Do not handle cleaned areas prepared for postcoating; use gloves to prevent contamination. All solder flux must be removed
to eliminate all possible contamination due to resistive growth.
f. A bubble that is distended (expands) above the surrounding coating is not allowed. A large bubble or a cluster of small bubbles
exceeding .090 inch in any dimension is not allowed. Small bubbles trapped within the coating or within webbing are allowed
if the .090-inch dimension is not exceeded. Bubbles should not exceed 50% of the distance between conductors provided the
minimum electrical clearance of .005 inch is maintained, and should not expose conductors, bridge lands, or adjacent conduc-
tors.
g. The coated assembly must have no visible blistering, cracking, pinholes, voids or peeling of the coating material or corrosion
of the board assembly. Any separation of the coating material from the base laminate is unacceptable; this is usually identified
by an air pocket appears as a white milky or cloudy spot.
h. There must be no conductive foreign material entrapped in the coating, or foreign material or flux.
i. The edges of the board must be covered with postcoating unless otherwise specified.
5.3.26.2.2. HumiSeal Application Procedures.
Generally, circuit boards in units outside the aircraft pressure vessel, such as aircraft nose avionics racks, are
subject to higher humidity and water ingestion. These circuit cards usually require thicker HumiSeal coating than
units mounted in the aircraft cabin area. When thick HumiSeal coating is applied, air drying is recommended,
rather than baking. Baking may cause the HumiSeal to reflow and migrate into unwanted areas as well as flatten
out, making it difficult to maintain the desired thick coat. A low-heat bake cycle at +50°C (+122°F) minimizes
the reflow effect.
a. Preheat oven to 75° ± 5°C (167° ± 9°F).

b. Thoroughly clean with solvent the circuit card areas to be postcoated. Cleaning procedures are in accordance with approved
method(s) and the area rinsed one more time with isopropyl alcohol to assure all residues are removed. Cleaned area(s) should
be allowed to air dry at room temperature for a minimum of 15 minutes in front of an ionizing air blower, or for 30 minutes in
ambient air prior to applying the touch up conformal coating.
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c. Vapor degreased PWAs should be air dried 15 minutes minimum and may be baked at +100° ± 8°C for 30 minutes to remove
surface moisture before the conformal coating is applied. PWAs cleaned in aqueous solutions in a batch washer (not in an
in-line conveyor system) are baked at +100° ± 8°C for 90 minutes minimum and 4 hours maximum before the conformal
coating is applied. PWAs cleaned in in-line aqueous wash systems are baked at +100° ± 8°C for 30 minutes minimum or baked
in accordance with applicable production work instructions established for specific cleaning equipment.
d. Apply postcoat to the non-device side of the assembly with a brush, syringe, or spray (spray preferred except for unusual
requirements as specified in product manual). Apply a smooth, uniform coat without bare spots, runs, or globules. The applied
conformal coating should cover the PWA as called out in the applicable engineering drawing and this document. Postcoat
should overlap any existing postcoat. A black light may be used for verification. Areas or components that were masked off
should show no evidence of being coated.
Whenever possible, application of HumiSeal should be confined to a brush or syringe operation in isolated lo-
cations where components have been replaced during repair. Very complex masking procedures are required to
utilize spray coating while avoiding connector contamination or variable resistor/capacitor HumiSeal penetration.
e. Excess thickness in coating with Humiseal may cause the coating to later crack or delaminate from the circuit card during
conditions of thermal stress. The optimum thickness for application of Humiseal after board coating or repair is 0.001 to 0.005
in (1 to 5 mils). This is most effectively achieved by using Humiseal which is of the proper viscosity. Proper viscosity also
determines how well the Humiseal flows around and underneath components so that voids are not created where moisture can
get trapped. If HumiSeal appears stringy (cobwebbing), it may require thinning with Toluene. The following test for checking
for proper viscosity may be useful to new or less experienced operators. Straighten a size #1 paper clip and insert vertically
into about two inches of Humiseal and extract the clip. Stringing of the Humiseal to the surface and dropping only two or three
droplets in five seconds indicates that the Humiseal is too thick. It can be thinned by adding small amounts of Toluene and
remixing. When the viscosity is correct, the clip clears the Humiseal with little stringing and drops about five droplets in four
to six seconds. If the Humiseal has been overthinned, enough won’t accumulate on the wire to form droplets.
NOTE
Ovens that are used for curing silicone-based materials (example: adhesives, conformal coating, potting or encap-
sulating materials, etc) should not be used for baking uncoated PWAs that are to be conformal coated.
f. For brush, syringe dispensed or flood coating applications, coated PWAs should be air dried for 30 minutes minimum at ambient
conditions before baking at +50° ± 5°C for 60 minutes minimum, or at +77° ± 5°C for 45 minutes minimum. The coated PWAs
may also be air dried at room temperature for 24 hours minimum, or air dried for 30 minutes minimum at room temperature and
then put through the baking cycle on an in-line conveyor oven system that is being used for select or automated spray coating
application. For Infared (IR) baking/drying, the coated PWA should be air dried for a minimum of 15 minutes at ambient
conditions and then baked using IR heating of +60° ± 5°C (PWA surface temperature) for 20 minutes minimum for -001, and
40 minutes minimum for -002 and -004. IR bake time should not exceed 120 minutes for any dash number.
g. For IR baking/drying, the touched up PWA should be air dried for 5 minutes minimum at ambient conditions, then baked for 5
minutes minimum using IR heating of 60° ± 5°C (PWA surface temperature). IR bake time should not exceed 60 minutes.
h. Repeat step d and step e for the device side of the assembly.
i. (Optional) - Oven cure the postcoat by baking the assembly for 1 hour (RF assemblies 30 minutes) at +50 ± 5°C (+122° ± 6°F) .
j. After postcoating, inspect the assembly for proper HumiSeal application under a black light. Coating should be hard, with
smooth to slightly irregular glossy appearance.
k. Touch up any void areas of postcoat. Large bubbles can be touched up by adding a small amount of Toluene to reflow the
HumiSeal. Cure the assembly after touchup again.
l. Hand cleaning with toluene should be in accordance with approved method(s) and the area rinsed one more time with isopropyl
alcohol to assure all residues are removed. Cleaned area(s) are allowed to air dry at room temperature for a minimum of 15
minutes in front of an ionizing air blower, or for 30 minutes in ambient air prior to applying the touch up conformal coating.
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m. Replace components, clean flux from board, air dry, and apply HumiSeal. Touch up with Humiseal should be performed on the
reworked/repaired area and the coating should overlap onto existing coating.
5.3.27. Nonplanar Card Repair Procedures.
Perform the following when repairing nonplanar cards.
5.3.27.1. Pressed Ball Bearings. It is strongly recommended that bearings not be relubricated or repaired. If defective, replace
with new bearing.
5.3.27.1.1. Ball Bearings Handling Cleanliness.
a. All work with bearings should be done in a clean, dry, dust-free, static-free work area.
b. Use clean and well maintained nonmagnetic bearing handling instruments and associated equipment. Instruments should be
spray cleaned, not dipped or soaked in a beaker of solvent.
c. Bearings should be handled with specially designed handheld tools, such as tweezers with special work ends.
d. Lint-free clothing should be worn in the work area.
e. Keep solvents and other fluids away from bearings to prevent the fluid from being absorbed by the bearing.
f. If it is necessary to handle the bearings by hand (without tools), the operator should wear finger cots that are clean, dry, and
undusted or they can choose to wear lint-free gloves. Skin residue can cause contamination or corrosion.
5.3.27.1.2. Ball Bearing Handling Practices.
a. Bearings should be kept in the original unopened package until they are to be installed.
b. Only the required number of bearings should be brought into the work area, then removed from protective package one at a
time, as required.
c. Any unused bearings that have been removed from their original package should be properly identified and stored in clean, dry,
covered containers.
d. Avoid machining and soldering operations in close proximity to bearings in an assembly. If soldering or machining is necessary,
isolate the bearings to keep them from being contaminated.
e. Maintenance of the demagnetized bearing condition is necessary. If there is any indication that the bearing has become mag-
netized, pass it through a demagnetizer before removing the bearing from its package.
5.3.27.1.3. Ball Bearing Installation Practices.
a. Bearing housing, bearing shafts, and the assembly tools must be clean, free of burrs, and demagnetized before contacting bear-
ings.
b. Assembly tools should mount the bearings squarely onto the bearing shaft and into the bearing housing. Misalignment during
installation can severely distort a bearing.
c. Apply a force only to the ring or race being press fit. Shock or impact forces should never be used to seat a bearing.
d. Perceptible continuous rotation of the outer race in housing, or of the shaft in an inner race, is not acceptable. Intermittent creep
is acceptable, provided it is not caused by a defective bearing.
5.3.27.2. Pressed Sleeve Bearings.
5.3.27.2.1. Sleeve Bearing Handling Cleanliness.
a. The porous material used to make sleeve bearings is impregnated with lubricating oil.
b. Care must be taken to avoid contamination with other oils or chemicals that might dilute the impregnating oil.
5.3.27.2.2. Sleeve Bearing Handling Practices.
a. Do not store sleeve bearings in containers made of material such as cardboard or paper that absorbs oil from the bearings. If
possible, store bearings in manufacturer’s original containers prior to installation.
b. Assemblies which contain sleeve bearings should be packaged such that oil from the bearings is not absorbed.
c. Do not re-use sleeve bearings.
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5.3.27.2.3. Sleeve Bearing Installation Practices.

a. There are multiple methods, one is preferred, the others are non-preferred.
b. The preferred method begins by sizing a sleeve bearing bore. This is done by inserting a mandrel of proper size through the
bearing inside diameter during the pressing operation.
c. Adequate force must be used to properly seat sleeve bearings but excessive force can damage the bearing flange.
d. The other methods, burnishing and reaming, are non-preferred because they tend to reduce surface porosity.
5.3.27.3. Covers and Shields. Replace damaged screws, straighten dented or warped sections, and retouch scratched or worn
painted surfaces.
5.3.27.4. Dry Film Lubricated Mechanical Parts.
a. Defective dry film (electrofilm) lubricated parts cannot be repaired. When a dry filmed part has been determined to be defective,
per the guidelines in the Section 4 (Check), the part should be replaced.
b. New dry filmed parts must be cleaned and exercised before they are installed in an equipment to ensure proper operation.
Failure to adequately exercise and clean new dry film type lubricated parts may cause high torques, sticking mech-
anisms, and ultimate failure of the equipment.
Do not apply lubricant to the gears of assemblies that have a dull black or gray coating of electrofilm. Electrofilm
and other lubricants are incompatible; they often form a paste that causes the gear train to stick. When lubricants
are required in neighboring assemblies, apply the lubricant sparingly; excess lubricant can be thrown out onto
electrofilmed surfaces.
c. New mechanical parts need to be mated either in a fixture or the instrument, and exercised until all mating surfaces with the dry
film type lubricant appear smooth and somewhat polished. Once the parts have been exercised, disassemble and thoroughly
clean the part. A vapor degreaser or solvent spray may be used; however, do not immerse the part. Use vapor and rinse. A
properly exercised and cleaned part leaves minimal residue on a clean, lintless tissue.
5.3.27.5. Frame. Straighten misshapen areas and refinish where needed. Retouch minor damage to silk screening.
5.3.27.6. Unit Rear Panel or Test Connectors. Straighten bent pins and damaged shell areas. Replace any wires that are broken or
have damaged insulation. If connector insert is cracked or broken, replace connector.
5.3.27.7. Wiring.
NOTE
When necessary to disturb the dress of the wires, carefully ensure that the original wire dress is maintained when
replacing wires.
a. Replace damaged wiring with wire of same size and color code. Ensure that no bare wires are touching chassis or other bare
wires, or metal cases of other parts.
b. If wire is to be removed from a terminal or device, tag wire to prevent incorrect connections.
5.3.28. Painting, Touchup.
Touchup paints have a low flash point and are highly flammable until completely dry. Therefore, they should only
be used in areas approved for use with flammable materials. Do not expose these materials to excessive heat or
to open flame (this includes all smoking materials). Keep containers closed when they are not in use. Use these
materials only in areas that are adequately ventilated. Avoid prolonged breathing of vapors and repeated contact
with skin.
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Perform the following when painting or touchup painting.

5.3.28.1. Levels of Finish Damage. There is considered three definitions of damage.
a. Light: scratches, nicks, chips, rough spots caused by abrasion, ripples, runs, or sags in the finish itself; little or no exposure to
the base material.
b. Medium: Damage involving larger areas which are greater than 0.250 inch and there is exposure to the basis material but not
to the extent of complete refinishing of the discrete surface.
c. Heavy: Surface damage that requires complete refinishing of discrete surface.
d. Assess the areas before repair when attempting repair of heavy damage, check the assembly for scoring, pitting, dents or other
physical damage.
e. If substrate is salvageable, no physical damage, remove all remaining coatings, by means specified in MIL-T-704. Leave only
the base material.
5.3.28.2. Surface Preparation. These methods are for light or medium damage.
a. The surface to be painted must be free of dirt and oil.
b. Sand lightly with 150-280 grit sandpaper, maximum. This is only if required to remove chips of paint.
c. Clean the surface using one of the cleaning solvents listed in Section 1 (Materials).
d. Allow enough time for cleaning solvent to evaporate.
e. Mask area if necessary to keep paint from marking or damaging other finished surfaces.
f. Refer to Section 1, Table 1-15 for a list of touchup paints.
5.3.28.3. Painting Procedure.
NOTE
Touchup paint is packaged in 12-oz aerosol cans and 1/2-pint cans. Paint may be sprayed provided there is ade-
quate ventilation.
a. To apply touchup paint to small areas or chipped areas, spray or pour paint into a small paper cup. Apply paint with a small
brush or swab.
b. Apply paint with a small brush or swab, as required. Surface and ambient temperature must be at least 50°F (10°C).
c. Let painted surfaces air-dry for a minimum of 10 minutes, depending on the paint type, before assembly. Unit must be dry to
the touch.
d. Touchup paint should match the area, according to it’s specifications, that is being touched up.
e. For 005-8360-XXX, the paint is dry to the touch in two to three minutes. Full cure is achieved in one hour.
For 005-2216-XXX, allow the paint to dwell for 20 minutes on part to allow the solvents to flash off. After the dwell period,
back at 275°F for 30 minutes, or allow part to air dry overnight.
5.3.29. General Lubrication Procedures.
Perform the following for general lubrication.
Always perform lubrication procedures as specified in the equipment maintenance manual. Do not lubricate com-
ponents that are not lubricated in the equipment maintenance manual.
a. Specific lubrication requirements for a unit are shown in the equipment maintenance manual. Always follow the equipment
maintenance manual for lubrication procedures.
b. Use only the lubricant specified in the equipment maintenance manual.
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c. Lubricate only the specified surfaces.

d. Do not mix different types of lubricants together.
5.3.29.1. Lubricant Application.
a. All surfaces to be lubricated should be clean and free from moisture, solvents, and other contaminants at the time of application
of the lubricant. Lubricants should not be applied to rusted or corroded surfaces.
b. Adequate precautions should be taken during the handling of highly finished surfaces prior to lubrication to prevent contami-
nation by body moisture or other agents that may initiate corrosion after the lubricant is applied.
c. All lubricants should be applied in a neat and consistent manner.
d. Excessive amounts of lubricant should not be applied.
e. In no case should a grease be heated or melted to aid in its application to the part to be lubricated.
f. Oil or grease lubricants should never contact dry film/electro-film surfaces.
g. If lubricant is applied with a brush, broken bristles must be removed from the lubricated part.
h. Relubrication should be performed with the same type lubricant as originally specified. If doubt exists concerning what type
of lubricant should be on a part, it should be thoroughly cleaned before lubricating.
5.3.29.2. Protection of Lubricants.
a. Do not use contaminated lubricants.
b. All lubricants should be kept in closed containers to protect them from contamination. The part number and the shelf life should
be marked on the container.
c. Old and contaminated lubricant should be removed from its container. The container should be cleaned before fresh lubricant
is added, or discard the old container and use a new one.
5.3.29.3. Protection of Lubricated Parts.
a. Parts with exposed lubricated surfaces should be handled and packaged so that the lubricant is protected from contamination
or loss of lubricant.
b. Lubricated ball bearings should be stored in the manufacturer’s original containers until time of actual installation. Uncontam-
inated storage containers should be provided for lubricated sintered metal (porous bronze) bearings.
5.3.30. Adhesives.
Several different adhesives are used in the manufacture of avionics equipment. Always refer to the equipment
maintenance manual for a list of the adhesives to be used in an equipment. Use only the adhesive specified and
only in the application specified in the equipment maintenance manual.
Use extreme caution when removing parts so that circuit traces under the part are not cut or pads are not lifted
from the circuit card.
Most of the adhesives used in avionics equipment are of a silicone base. They are used to hold components to a circuit card or
assembly to prevent stress on solder connections and to make component mounting more rigid. Refer to Table 5-7 for the most
commonly used silicone adhesives.. In the left column are silicone adhesives that are no longer recommended for use in avionics
equipment. The right column shows the replacement silicone adhesives.
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Table 5-7. Common Adhesives
OBSOLETE ADHESIVES REPLACEMENT ADHESIVES

DESCRIPTION ROCKWELL COLLINS DESCRIPTION ROCKWELL COLLINS
PART NUMBER PART NUMBER
Silastic 732 005-0701-000 RTV 3145** 005-3167-010*
Silastic 732 005-0701-020 RTV 3145 005-3167-010*
RTV 732 (white) 005-1180-010 RTV 738 005-1196-010*
RTV 732 (clear) 005-1180-020 RTV 3145 005-3167-010*
RTV 732 (black) 005-1180-030 RTV 739 005-2757-010
None None RTV 3140 005-1692-010
RTV 3145 005-1531-XXX RTV3145 005-3167-010, -030
D1-SEA210A/210B 838-0008-XXX RTV3145 005-3167-010, -030
* Note: Use 005-2983-XXX when faster curing adhesive is required.
** Note: All RTV materials are from Dow Corning.
NOTE
Silicone adhesives generally have a long cure time (refer to the manufacturer’s recommended curing guidelines)
and they are not easily removed when a repair action is required.
a. To remove a part that has been secured with adhesive, use a sharp knife or razor blade to cut the adhesive between the circuit
card and the part.
b. Unsolder all electrical connections. Gently work the part back and forth while lifting the part. Use the knife to cut any remaining
adhesive until the part can be lifted from the circuit card.
c. Once the part is removed, clean all remaining adhesive from the circuit card according to the instructions in the Section 3
(Cleaning).
5.3.30.1. Hot Melt Adhesive. In several applications, a hot melt adhesive can be used in place of other adhesives. When perform-
ing repair activity, RTV3145, CPN 005-3167-010, may be used if all hot melt material is removed prior to the application of the
RTV3145. Perform the following procedures when using hot melt adhesive.
5.3.30.2. Equipment and Supplies.
• Hot melt adhesive (CPN 838-0005-010) (refer to Section 1 (Materials), Table 1-16).
• Hot melt gun or applicator (refer to Section 2 (Tools), Table 2-1).
• Applicable cleaning solvents for the circuit card/assembly being repaired.
5.3.30.3. General Requirements.

a. Hot melt adhesive should be stored in its original or an enclosed container when not being used in the hot melt applicator or
gun.
b. Hot melt adhesive should only be used for rigidizing and bonding parts to circuit cards and assemblies that are attached by
soldered leads or have a mechanical connection. The parts should not be under pressure to move from the position they are
mounted in.
c. Hot melt adhesive should be applied to cover a minimum of 75% of the bonding surface.
d. Hot melt adhesive should be used only in applications that do not exceed +105°C (+221°F) continuously and for short periods
up to +110°C (+230°F), such as power supplies, near power resistors or other power devices.
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e. All parts should be solvent cleaned before applying hot melt adhesive.
f. Wait 10 minutes after applying hot melt adhesive to clean circuit cards or assemblies with solvent.
g. Wait another 15 minutes after cleaning a circuit card or assembly before storing the circuit card or assembly in a sealed container.
h. Circuit cards can be postcoated after the hot melt adhesive has cured for a minimum of 10 minutes.
i. Circuit cards or assemblies removed from a +100°C (+212°F) (or above) oven should be allowed to air-cool for a minimum of
three minutes before handling.
5.3.30.4. Hot Melt Application Procedures.
a. Allow the hot melt gun a minimum of 5 minutes to reach operating temperature. Operating temperature is reached when the
hot melt adhesive flows from the gun’s nozzle with ease.
b. Bend part leads to the required position and cut to length for soldering.
c. Apply hot melt adhesive to the part, to the circuit card, or to the part already positioned on the circuit card (see Figure 5-42).
The required adhesion is not achieved if the part is not positioned immediately, since the adhesive starts to cure as soon as it is
applied. In order to achieve a good bond, it is important that the part is not moved during the initial setup time (about 1 minute).
The hot melt adhesive takes 5 minutes to cure at room temperature.
d. The hot melt adhesive should appear uniform in color with few or no air bubbles. The bond joint should show good adhesion
between the two adhesive surfaces. Any adhesive strings should be removed.
e. Solder the electrical connections of the part after the hot melt adhesive has cured.
5.3.30.5. Hot Melt Repair Procedures.
5.3.30.5.1. Component Removal.
a. Unsolder connection or remove mechanical connection.
b. Use a solder iron rated at 800°F. Apply the solder iron to the component. After about one minute, the adhesive bond softens.
Remove the component from the adhesive with the tip of the solder iron or pliers (see Figure 5-42).
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Figure 5-42. Hot Melt Adhesive Application (Sheet 1 of 2)
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Figure 5-42. Hot Melt Adhesive Application (Sheet 2 of 2)
5.3.30.5.2. Adhesive Removal.

a. Removal of all the adhesive is not required. Additional adhesive bonds to existing adhesive.
b. The adhesive left may be smoothed out by remelting the adhesive with the tip of the hot melt applicator gun. If the adhesive
must be removed to make clearance, use one of the following methods:
(1) Soften the adhesive by applying heat to the adhesive with a heat gun rated between 500°F and 750°F. Apply the heat to
the adhesive until it softens. Using a tongue depressor or another blunt ended instrument, remove the adhesive. Repeated
applications of heat to the adhesive may be required until all of the adhesive is removed with the tongue depressor.
(2) Use a piece of solder wick and solder iron. Place the solder wick on the adhesive and heat the solder wick with the solder
iron tip. The adhesive wicks up the solder wick. The solder wick and solder iron tip used to remove adhesive should not
be used in any soldering or de-soldering operation (see Figure 5-42).
5.3.30.5.3. Replacing Components. Replace components in accordance with Paragraph 5.3.30.4.
5.3.30.5.4. Repair of Adhesive Bond Without Replacing Component. If an adhesive bond needs to be re-applied without removing
the components, the preferred method is to unsolder the component and re-bond it using the following method:
a. Remove the component by unsoldering the leads or by removing the mechanical connection.
b. Smooth out the adhesive left by remelting the adhesive with tip of the hot melt applicator gun.
c. Replace components in accordance with Paragraph 5.3.30.4.
5.3.30.5.5. Repair of Bond by Partial Component Removal Method. See Figure 5-43.
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Figure 5-43. Hot Melt Adhesive Repair
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5.3.31. Special Considerations for RF Circuit Card Repair.

The repair procedures for RF circuit cards are different from the repair procedures for lower frequency assemblies. At RF frequen-
cies, current does not flow through the conductor. Instead, current tends to flow on the surface of the conductor. Current also follows
the path of least resistance. In a microstrip circuit, the fields tend to constrain the current to flow on the undersurface of the conductor
tracing, as shown in Figure 5-44.
Figure 5-44. RF Current Flow
The part lead should be in contact with the pad of the conductor trace. If the part is not mounted in close proximity to the circuit
card, with the part leads against the conductor, the current has to flow through the solder, an area of lossy conduction, thus changing
the characteristics of the circuit (see Figure 5-45).
Figure 5-45. Area of Lossy Conduction
In addition, the part leads should make initial contact with the pad as close to the conductor break as possible to reduce the surface
current path and thus minimize circuit inductance (see Figure 5-46).
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Figure 5-46. Part To Circuit Location
Circuit inductance can be more of a problem with parts that have radial or axial leads, as shown in Figure 5-47. Axial lead parts
should be mounted as close to the circuit card as possible, unless the maintenance manual specifies differently. Part leads should
be as short as possible. Care must be taken when bending leads close to the body of a part to prevent part damage and subsequent
circuit failure.
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Figure 5-47. Axial/Radial Lead Mounting
RF circuit cards are made from ceramic, polyimide, or Teflon because of their RF characteristics and their low
expansion/contraction characteristics over large temperature changes.
However, repairing lifted circuit pads or broken circuit traces on these circuit cards is not recommended. Adhe-
sives generally do not bond to the circuit card material, and attempting to repair a circuit trace or pad can change
the operation of the circuit. RF circuit cards should be returned to the factory for repair evaluation.
5.3.31.1. General Soldering Guidelines. Hand soldering of parts onto RF circuit cards requires special care. Exceeding tempera-
tures of +304°C (+580°F) can cause circuit pads and circuit traces to separate from the circuit card. To reduce the chance of damaging
RF circuit traces and pads, use a soldering iron that has an adjustable temperature control. Measure the temperature at the tip of the
soldering iron with a thermocouple (see Figure 5-48). Do not use the soldering irons indicated temperature. Adjust the temperature
at the tip of the soldering iron for not more than +301°C (+575°F) as indicated by the thermocouple. Do not add liquid flux during
hand soldering. Close attention may be required to determine that solder wetting is occurring at the component termination and pad
surfaces during soldering. The additional solder that is desirable for high frequency applications may cause it to be difficult to detect
dewetting or nonwetting conditions.
The presence of solder balls, solder splatters, peaks, or solder slivers in a solder termination is not acceptable.
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Figure 5-48. Measuring Soldering Iron Temperature
5.3.31.2. Replacement of Chip Parts (Leadless Resistors and Capacitors). Often one end of a chip component is connected to
ground. In an RF circuit there may be several plated thru holes or rivets that can be in contact with ground and the chassis. This
characteristic of RF circuits makes it difficult to apply enough heat in a localized area to melt solder. It is recommended that the
assembly be placed in an oven and warmed to at least +50°C (+122°F) and not more than +80°C (+176°F), which makes soldering
and unsoldering easier. Sufficient heat has been applied to a chip part when the surface of the solder fillet is smooth and concave.
When removing chip parts, use two thermally controlled soldering irons. Place a soldering iron tip on each end of the part. Once
the solder is melted, the part can be removed. Remove excess solder with a solder-wick and remove excess flux with solvent.
5.3.31.3. RF Power Transistor Removal.
Use caution when removing RF power transistors, as they may contain beryllium oxide ceramic, especially under
the transistor die.
NOTE
Too much heat and force near the input and output traces causes the traces to lift or delaminate.
a. To remove power transistors, use a temperature-controlled soldering iron and a solder wick and solder sucker to remove solder
from under the power transistors leads.
b. Heat the lead and lift it slightly with a sharp tool (dentist’s probe).
c. Alternate between each lead and work the device away from the circuit card.
d. Two temperature-controlled soldering irons can be used to apply heat to both leads on a flange mounted device, and it should
be possible to lift the part out. To increase heat conduction, a small amount of solder can be added to the tops of the leads,
especially if they are wide, flat leads.
5.3.31.4. Low Power RF Transistor and Mixer Diode Removal.
a. Before removing low-power RF transistors or mixer diodes note the lead dress (positioning and solder application). The lead
dress is especially important for 4-lead ceramic packages.
b. In some cases, the leads have stress relief added (slight bend in the leads and extra length) to prevent the solder joints from
failing over several temperature cycles.
c. The lead dress for the replacement part should be identical to that of the original part and the same amount of solder should be
used.
d. Solder all part leads using SN62 solder. SN62 is a 2% silver-tin-lead solder. Using SN62 reduces the leaching of the metaliza-
tion from the ends of leadless components. Leaching has occurred on a component if the solder no longer wets the connection
surfaces.
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REPAIR 523-0768039
e. Part leads and printed wiring surfaces (trace pads) should be precleaned and tinned to ensure good solder joints. Do not use
additional flux for soldering. The part leads should be in contact with the trace pad. The body of the part should be as close to
the circuit card as possible.
f. All part leads should be completely covered at the joint with solder; a very slight impression of the lead is allowed (this is the
direct opposite of non-RF soldering requirements). Where possible, apply solder to cover leads up to the body of the part.
5.3.31.5. Photodiode and Photo Transistor Replacement. Photodiodes/Phototransistors are temperature sensitive components and
require special care when soldering. Excessive heat can result in increased leakage resulting in improper sensing.
5.3.31.5.1. Photodiode and Photo Transistor Replacement Materials.
a. Use a calibrated soldering iron with a tip that has a temperature range of 260°C to 301°C (500°F to 575°F). Do not heat longer
than 5 seconds at a time. Allow 30 seconds to cool, if necessary, before reapplying heat.
b. Use SN63/Lead solder cored with no clean flux (refer to Section 1 (Materials), Table 1-9).
c. An acceptable alternate is the use of separate no clean flux (refer to Section 1 (Materials), Table 1-8).
5.3.31.5.2. Photodiode and Photo Transistor Replacement Procedure. Solder the top side of the device on the circuit board first.
The flange on the lens side of the device should be in contact with the circuit board pads when soldered.
5.3.31.5.2.1. Top Side Soldering Procedure.
a. Insert device(s) in appropriate non-plated thru holes on the printed wiring board. Solder the tabs only.
b. The iron tip should be placed on the land pattern adjacent to the tab on the device. As the land pattern begins to reflow, move
the iron tip towards the tab carefully touching the tab (without rotating the device) and make a solder bridge between the tab
and the iron tip.
c. Feed a minimum amount of solder to the pad to provide a preferred solder connection. The solder connection should be made
with a maximum 5-second dwell time. Apply the solder, keeping it from wicking all the way to the leads.
d. If solder runs partially around the hole, do not attempt rework. Use as is.
Do not touch lens with soldering iron tip because the lens may be damaged.
5.3.31.5.2.2. Bottom Side Soldering Procedure.

a. Place the soldering iron tip on land pattern near device. As the land pattern reflows, move the tip towards the device.
b. When the tip touches the device, apply a solder bridge between the tip and device and solder around the device in a 360° circular
motion.
c. Apply a minimum amount of solder to attain a well-wetted solder connection showing evidence of lead profile. Board thickness
variations may result in a minimal lead protrusion and therefore require a very minimum amount of solder.
d. The solder connection should be made with a 5-second dwell time. A second 360° with the iron may be made.
e. The solder joint of the bottom side should be well-wetted assuring solder connection 360° around the device. The solder joints
on each side of the board should be well-wetted to both the circuit board pads and the device with fillets as specified in the
Workmanship Standard Manuals referenced in applicable documents, except the outline of the device tabs do not have to be
visible in the solder.
5.3.31.5.3. Photodiode and Photo Transistor Replacement Cleaning. Solder connections may be cleaned using an approved flux
cleaning solvent (refer to Section 1 (Materials), Table 1-6).
5.3.31.6. Component Positioning.
5.3.31.6.1. Leadless Parts.
a. The best positioning for leadless parts places a part flat against the circuit pads and centered on both pads. The location of a
part is acceptable if it meets all of the guidelines shown in Figure 5-49.
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Figure 5-49. Leadless Part Placement
b. Pad contact - A minimum of .010 inch of the bottom metalization should contact the pad at both ends.
c. Devices with end terminations should be positioned such that the metalization side overhang does not exceed 10% of the com-
ponent metalization width. Minimum electrical clearance should be maintained.
d. Mispositioned devices, solder smears, solder splatter on circuit lines should not reduce the spacing between uninsulated con-
ductors of different potentials to less than 75% of the actual spacing.
e. The maximum distance any termination may be raised off the pad, due to solder thickness, is 0.015 inch.
5.3.31.6.2. Round or Coined Leads.
a. The best positioning for parts with round or coined leads is flat against the circuit pads and centered on both pads. The location
of a part is acceptable if it meets all of the guidelines shown in Figure 5-50.
b. Leads/wires may be skewed but should not exhibit side overhang.
c. Toe Overhang - Toe end of leads/wires may overhang pad provided:
• Minimum electrical clearance to a conductor of a different potential is maintained.
• Total overhang does not exceed 0.25 diameter (0.25D).
• Minimum pad contact requirement is maintained.
d. The heel of a round lead /wire should be in contact with the pad. The toe of a round lead/wire may be raised off the pad to the
extent that the distance from the pad surface to the bottom of the toe does not exceed 1/2 times the original diameter (0.5D) of
the lead/wire.
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Figure 5-50. Round or Coined Lead Part Placement
5.3.31.6.3. Flat/Ribbon Lead Parts.

a. The best positioning for parts with flat leads is flat against the circuit pads and centered on both pads. The location of a lead is
acceptable if no more than 25% of the lead width extends over the circuit pad.
b. Toe end of leads, of leaded components, may overhang pad provided:
• Minimum electrical clearance to a conductor of a different potential is maintained.
• Total overhang does not exceed 25% of the lead width or 0.020 inch whichever is less.
• Minimum pad contact requirement is maintained.
c. The heel of a lead should be in contact with the pad. The toe of a lead may be raised off the pad to the extent that the distance
from the surface of the toe to the bottom of the lead, including solder, does not exceed 2 times the thickness of the lead or 0.020
inch whichever is less.
5.3.31.6.4. Cylindrical End Cap Terminated.
a. Terminations should contact pad a minimum of 0.010 inch at both ends.
b. Cylindrical end cap terminated components should not exhibit side overhang by more than 10% of the component metalization
diameter. Minimum electrical clearance to a conductor of a different potential should be maintained.
c. The maximum distance any termination may be raised off the pad, due to solder thickness, is .015 inch.
5.3.32. Circuit Board Modification Using Terminal Strip/Anyboard.
Repair terminal strips/anyboards with connected plated thru holes, and/or SMD pads may be added to provide multiple termination,
provided they are securely attached to the board with an approved epoxy, such as A12T adhesive. Repair terminal strips/anyboards
are used because of modifications to circuit cards during service bulletin incorporation (see Figure 5-51).
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Figure 5-51. Mounting of Repair Terminal Strip/Anyboard
5.3.32.1. Installation of Terminal Strip/Anyboard.

a. Cut terminal strip/anyboard to required length.
b. Terminal strips are bonded to the board as specified by design with one of the adhesives (for component bonding) from the
material list and bonded in accordance the bonding procedures for each individual components.
c. Position anyboard assembly on circuit board and add wires from anyboard to circuit board.
d. Bond anyboard assembly to circuit board using approved adhesive, a suggested adhesive is the A12T adhesive. Allow cure
time of one hour at 95°C (preferred) or 24 hours at room temperature.
5.3.32.2. Removal or Replacement of Terminal Strip/Anyboard.
a. Remove jumper wires from anyboard to circuit board.
b. Using an oven or temperature controlled hot air gun, heat assembly area containing the anyboards to 95C for 30 minutes to
soften the A12T adhesive.
c. Grasp the anyboard assembly with pliers and move from side to side until anyboard breaks loose from adhesive.
d. If another anyboard is to be installed in the same location, smooth out the adhesive using a heated flat tipped soldering iron
and/or X-Acto knife. Be careful not to damage the circuit board surface.
e. Clean the area using acceptable solvents.
f. A new anyboard may be installed at the repaired area using Paragraph 5.3.32.1 instructions.
g. Reapply postcoat material removed during repair/installation.
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5.3.33. Radar Flatplate Surface Finish Repair.
Chemical chromate compounds become acidic in solution, and the same precautions used in handling other acid
should be followed. Skin areas which come in contact with the powdered compound or solution should be flushed
with water immediately. Do not use where solution may be entrapped.
Rags, swabs, brushes, and other implements used for applying chemical chromate solution must not be allowed
to dry out unless thoroughly rinsed. The dry compound is a strong oxidizing material and constitutes a fire hazard
when in contact with highly combustible materials.
Glass or polyethylene containers should be used to store and dispense chromate solutions utilized in the touch-up
repair procedure.
Perform the following procedures for radar flatplate surface finish repair.
a. Clean the antenna surface with alcohol, naptha or equivalent using clean cloth or cotton swab.
b. Apply chromate solution with a soft bristle brush (preferably nylon), clean cloth, or cotton swab. Avoid rubbing or scuffing
with applicator.
c. Allow 30 seconds to 6 minutes to develop specified color. For adequate corrosion protection the color of the coating must be
iridescent and/or light yellow to light gold. A variation in color between areas of the same part are not cause for rejection.
d. Do not allow applied solution to dry prior to rinsing.
e. Rinse with plain water using clean cloth or cotton swab.
f. Air dry before handling.
g. When thoroughly dry, the film must adhere tightly to the metal. Powdery coatings which can be readily rubbed off are consid-
ered defective.
h. The film must be continuous and essentially free from breaks, scratches, or other defects.
5.3.34. Replacing Clear Windows On Edgelit Control Panels.
Perform the following procedures when replacing clear windows on edgelit control panels.
a. Remove all defective windows and previous bonding materials.
b. Cut new Lexan® (polycarbonate) to appropriate size. Use clear sheet, 0.032 inch thick CPN 820-1503-050. The sheet material
may be sawed or sheared to size, however, the preferred method is sawing because it leaves a smoother edge.
c. Clean both the light panel and the Lexan® window using a solvent wipe of isopropyl alcohol just prior to bonding. Allow
excess solvent to evaporate.
d. Bond the window into the edgelit panel using one of the two following methods.
(1) RTV-3145 Adhesive Method. Using RTV-3145 (CPN 005-2983-XXX) clear adhesive, apply the adhesive to achieve a
uniform bond thickness to the surface the window bears against. Install the window taking care to avoid smearing the
adhesive over the face of the window. Care should also be taken to avoid applying an excessive amount of adhesive to the
surfaces to be bonded. Clean up excess adhesive using isopropyl alcohol or other mild solvent while the adhesive is still
wet.
Assembly work that does not include heating or structural tests may continue when the adhesive has cured to a tack-free con-
dition (approximately one hour at 17% humidity). Total cure time is from 60 hours at 90% relative humidity, to 140 hours at
17% relative humidity. Do not stress the bond line until the appropriate time has passed at the given humidity level.
(2) Epoxy Method. Using EPO-TEK 301 (CPN 005-2633-010) two part epoxy, mix by weight 20 parts of part A with 5 parts
of part B in a wax free container. Mix completely. Apply the epoxy to the surface the window should bear on. Apply
enough pressure to firmly hold the parts in place, but avoid excessive pressure which would cause a starved bond line. Cure
at room temperature for eight hours and clean up excess adhesive using alcohol. Either finish cure at room temperature
for a minimum of an additional eight hours or cure for 2.5 ± 0.5 hours at 60° ± 5°C or at 100°C for 1.5 hours ± 0.5 hours
after the bond line reaches temperature.
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5.3.35. Replacement of Aircraft Instrument Dial Windows.
Most windows have an antireflective coating applied to both sides that may be damaged by careless procedures.
Do not allow adhesive on the visible surfaces when window is mounted in case.
This procedure provides information for replacement of dial windows used in aircraft instruments such as a Flight Director Indicator.
a. Remove the screws, knobs, and tape that retain the bezel assembly (case) to the instrument.
b. Carefully slide the case off the instrument.
c. Place case in oven or by use of other suitable means raise immediate ambient temperature to a range of 100°C to 120°C (212°F
to 248°F).
d. Heat until the adhesive reaches a state of plasticity sufficient to allow removal of window by light, steady finger pressure.
Window removes toward inside of case.
e. Remove all remaining adhesive from window recess in case, and apply a 3/32 to 1/8 inch bead of PR-1425 (838-0013-030)
along the opening periphery.
f. Place new window in case, and hold in place until adhesive is sufficiently cured. Cure at room 50° ± 5°C for a minimum of 12
hours for B-1/2 and 24 hours for B-2. They can be alternately cured at room temperature (~25°C), B-1/2 can be cured for 24
hours and B-2 can be cured for 48 hours.
NOTE
Pot life is 2 hours minimum for PR-1425-2 (B-2) and 30 minutes for PR-1425-1/2 (B-1/2) at room temperature
and a maximum of 50% relative humidity.
g. Remove all excess adhesive from case and/or window. Adhesive may be easily removed at room temperature with a scraper.
The adhesive is not sensitive to ordinary solvents.
5.3.36. Repair of Threaded Holes in Cast or Wrought Materials.
This procedure describes the use of Helical coil thread inserts: their use, description, installation, removal, and repair using both
tanged and tangless inserts. Tooling required for both tanged and tangless varieties are also covered. Assemblies may be sent to
Rockwell Collins for Helical insert installation and repair if the repair facility is not available or if the operator is not qualified to
perform the following processes.
Threaded inserts are used to install a steel thread into a softer metal, or to repair an existing threaded hole or insert that has been
damaged.
NOTE
Helical inserts are available in tanged and tangless configurations. The tangless is preferred because there is no
tang to break off, they need no orientation, and are quick to remove for repair.
The substitution of tangles inserts for tanged inserts is acceptable as long as dimensional (excluding tanged fea-
ture), material, finish and performance requirements are maintained. The substitution of tanged inserts for tangles
inserts is NOT allowed. When substituting tangles inserts for tanged, all inserts utilized within that specific piece
part, should of the same type, tanged or tangless, but not a combination of both.
5.3.36.1. Damaged Thread Repair.

a. Review the assembly drawing to determine the nominal thread size of the stripped/damaged threads.
b. The minimum material wall thickness is the minimum distance between the insert’s major diameter and the wall of the material
(refer to Table 5-8 and see Figure 5-52). Helical length is to be such that the screw is flush with the bottom of the helical thread,
or pass through it.
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REPAIR 523-0768039
c. Oversize inserts and twinserts (one insert inside an insert) manufactured by Heli-coil, or equivalent, may be used to repair
damaged insert holes. Refer to Table 5-8 for minimum material wall thickness.
Table 5-8. Minimum Material Thickness
ALUMINUM ALLOYS STEEL ALLOYS

SCREW 356 380 2017 2024 5052 6061 7075 300 COLD 400 HT
SIZE SERIES ROLLED 17-4PH
2-56 0.011 0.014 0.010 0.010 0.010 0.010 0.010 0.012 0.012 0.010
4-40 0.010 0.013 0.010 0.010 0.010 0.010 0.010 0.016 0.016 0.010
6-32 0.020 0.022 0.015 0.010 0.015 0.012 0.010 0.020 0.020 0.010
8-32 0.021 0.026 0.017 0.011 0.016 0.014 0.010 0.023 0.023 0.010
10-32 0.023 0.029 0.020 0.013 0.017 0.016 0.010 0.027 0.026 0.010
Figure 5-52. Minimum Material Thickness
5.3.36.1.1. Hole Preparation. Refer to Table 5-9 for hole size and Table 5-10 for tap size information. The same information
applies to tanged and tangless applications.
NOTE
Holes countersunk at 82° instead of 90° do not work with insertion tools. In addition, holes must be tap-drilled
oversize as specified.
Holes that are tap drilled standard size either breaks the insertion tool or, more likely, cause shear out of the top
two threads in the insert. These are symptoms of hole problems and NOT tool problems.
If the insert fits tight, the hole is usually bad.
When the hole to be repaired is a blind hole of specified depth, an insert of the next shorter available length is acceptable. After
insertion of the insert, a screw must engage with at least seven threads for optimum strength. For a blind hole with missing hardware
(screw missing), a satisfactory method to determine insert length is listed below.
a. Determine the depth of the existing hole.
b. Determine an appropriate chip clearance distance at the bottom of the hole.
c. Determine the number of full threads that exist in the hole when tapping the hole to accept a helical thread insert using a
bottoming tap (bottom 2 1/2 threads minimum will not be full threads).
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REPAIR 523-0768039
d. Determine the actual distance available for the insert installation, remembering the requirements for inserting the inserts below
the bottom of the lead-in countersink by 0.010 inch
e. Install the longest insert that the intended screw projection will meet or exceed. This means the bottom of the screw must be
flush or beyond the bottom of the insert.
Table 5-9. Recommended Drill Size
DIMENSIONS FOR TAP DRILL HOLE AND COUNTER SINK IF APPLICABLE

SCREW SIZE DRILL SIZE DRILL SIZE STEEL COUNTERSINK DIAMETER
ALUMINUM
MIN MAX
2-56 3/32 (0.0938) #41 (0.096) 0.09 0.11
4-40 #31 (0.120) #31 (0.120) 0.14 0.17
6-32 #26 (0.147) #25 (0.1495) 0.18 0.21
8-32 #17 (0.1730) #16 (0.1770) 0.20 0.23
10-32 #7 (0.2010) 13/64 (0.2031) 0.23 0.26
12-24 #1 (0.2280) #1 (0.2280) 0.26 0.29
1/4-28 G (0.2610) 6.7mm (0.2638) 0.31 0.34
Table 5-10. Heli-coil Tap Part Numbers
SCREW SIZE STRAIGHT FLUTE

PLUG BOTTOMING
2-56 02CPB 02CBB
4-40 04CPB 04CBB
6-32 06CPB 06CBB
8-32 2CPB 2CBB
10-32 3FPB 3FBB
12-24 1CPB 1CBB
1/4-20 4FPB 4FBB
5.3.36.2. Tang Removal When Using a Tanged Insert. When clearance requires the removal of the tang, it should be broken off
cleanly so that no part projects onto the inside diameter of the insert. The tang should always be removed for a through hole.
5.3.36.3. Criteria For Proper Insert Installation.
a. Tapped holes prepared for inserts must be countersunk 120° ± 5° except when the material is too thin and the additional driving
depth required would cause the end of the bottom coil of the insert to protrude. The top edge of the insert should be installed 1
to 1 1/2 pitches below the top surface of the tapped hole.
b. Without a countersunk hole, the top edge of the insert should be installed 3/4 to 7/4 pitch below the top surface of the tapped
hole.
5.3.36.4. Insert Installation Procedure. For drilling, tapping, and inserting operations, use Safetap (CPN 838-2537-010) or equiv-
alent as a non-Ozone Depleting Substance (ODS) solution that aids in machining lubrication.
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REPAIR 523-0768039
a. Select the proper insert to match the required thread size and appropriate length (refer to Paragraph 5.3.36.1.1).
b. Drill hole to appropriate diameter according to Table 5-9. When drilling blind holes, the depth of hole must take into consider-
ation the style of tap to be used, and chip clearance.
(1) Countersink the hole 120° ± 5° to the diameter referred to in Table 5-9 if possible (refer to Paragraph 5.3.36.3).
(2) Tap hole using an appropriate tape. Heli-coil tap part numbers are referred to in Table 5-10.
(3) Remove chips.
c. Install appropriate insert using tooling referred to in Table 5-11 or Table 5-12. Refer to Table 5-11 for tanged Heli-coils. Refer
to Table 5-12 for tangless Camloc inserts. Install 1 to 1.5 pitch below the top surface for a countersunk hole, and 1/4 to 1/2
pitch below the top surfaces on holes that do not have a countersunk lead-in for the insert.
NOTE
If trouble is experienced in installing the insert, the problem is rarely found with the insert. Instead, check hole
preparation for the proper tap drill size, and verify the proper tap was used.
d. If using a tanged insert, remove the tang, if required, using tooling referred to in Table 5-11 (refer to Paragraph 5.3.36.2).
e. Verify proper depth of threads by installing an appropriate screw to the required depth before assembly.
Table 5-11. Heli-coil Tooling Part Numbers
SCREW SIZE INSERTION TOOL EXTRACTOR TANG BREAKOFF TOOLS

FOR 2 DIAMATER OVER 2 DIAMETER
OR LESS
2-56 551-02 1227-02 3695-02 3695-02-3
4-40 7551-04 1227-06 3695-04 3695-04-30
6-32 7551-06 1227-06 3695-06 3695-06-30
8-32 7551-2 1227-06 3695-2 3695-2-30
10-32 7552-3 1227-6 3695-3 3695-3-30
12-24 7551-1 1227-6 3695-3 3695-3-30
1/4-20 7551-4 1227-6 3695-4 3695-4-30
Note: Heli-coil Div., Emhart Fastening Systems Group, Shelter Rock Ln., Danbury, CT 06810 (203)925-3109.
Table 5-12. Camloc Tangless Tools
SCREW SIZE INSTALLATION TOOL REMOVAL TOOL

2-56 860-2530-010 860-2530-050
4-40 860-2530-020 860-2530-060
6-32 860-2530-030 860-2530-070
8-32 860-2530-040 860-2530-080
10-32 CT-16002-3 CT-16002R-3
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Table 5-12. Camloc Tangless Tools - Continued
SCREW SIZE INSTALLATION TOOL REMOVAL TOOL

12-24 CT-16002-4 CT-16002R-4
Fairchild Industries Inc., Fairchild Aerospace Fastener Div., 3000 W Lomita Blvd, Torrance, CA. 90505-513, (213-530-2220)
5.3.37. Knob Setscrew Torque Values.

99999999
a. When the applicable Illustrated Parts Catalog or Illustrated Parts List specifies that locking hardware or other locking devices
be installed, make sure that all the specified devices are installed before tightening any installed or specified knob retaining
setscrews.
b. When locking hardware or other locking devices are not specified, torque the knob retaining setscrews as referred to in Table
5-13.
Table 5-13. Torque Requirements for Setscrews
SETSCREW SIZE TORQUE REQUIREMENTS (INCH/LBS)

No. 0 0.35 (5.6 in oz) to 0.38 (6 in oz)
No. 2 1.05 (17 in oz) to 1.13 (18 in oz)
No. 4 3.5 (56 in oz) to 3.8 (61 in oz)
No. 6 6.3 (101 in oz) to 6.8 (109 in oz)
No. 8 14.0 (224 in oz) to 15.0 (240 in oz)
No. 10 23.1 (370 in oz) to 24.8 (396 in oz)
5.3.38. Application of Heat Sink Compound.
This material contains silicone oil. Contamination occurs if silicones are allowed on areas subject to coating or
bonding. Heat sink compound is applied only after all cleaning, bonding, and post coating are completed. Excep-
tion: only repair facilities that possess the equipment and skills to avoid contamination may apply heat sink grease
after thoroughly hand cleaning the assembly, and prior to applying bonding and/or post coating material.
Heat Sink Compound is a thermally conductive grease that improves the transfer of heat between two surfaces. The heat sink com-
pound prevents air gaps from forming between the two surfaces which can cause poor heat conductivity. The good transfer of heat
between the two surfaces promotes better cooling.
NOTE
The following procedures may be used only if the assembly was received with heat sink compound previously
applied.
a. Remove all heat sink compound from previously coated surfaces.

b. Apply a uniform thin film of heat sink compound to both mating surfaces.
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REPAIR 523-0768039
NOTE
Do not trap any foreign material in the grease or between the mating surfaces. The maximum thickness of the heat
sink compound between the assembled mating surfaces is 0.002 inches. Apply only the white greaselike material.
Discard any thin oil-like material coming from the tube or container.
c. Mate the assemblies coated with heat sink compound and secure them together.
d. Use a Q-tip or pipe cleaner to remove grease not contributing to the heat sink action between the two assemblies.
5.3.39. Routing Wires, Wire Bundles, and Cables.
Perform the following steps when routing wires, wire bundles, and cables.
a. Wires and cables should be routed so that they cannot contact moving parts, heat-generating parts, sharp metallic edges (in-
cluding screw threads), or interfere with installation of covers, components, or other modules.
b. When routing individual wires or cables out of a bundle to a termination point, leave slack so normal vibration and movements
due to flight do not induce tension, torsion, or compression stress.
c. Wires/cables using metallic shielding unprotected by an outer insulation should be secured, routed or protected to prevent the
shielding from touching terminals or unprotected conductors of a different potential.
d. When forming bends in wires, wire bundles, and cables, observe the allowable bend radius parameters referred to in Table 5-14.
Table 5-14. Allowable Bend Radius for Repair of Wire, Cable, or Wire/Cable Bundle
WIRE, CABLE, BUNDLE TYPE MINIMUM ALLOWABLE BEND RADIUS

Bare bus or enamel insulated wire Twice the diameter of the conductor
Insulated wire Twice the diameter of the insulation
Ribbon cable Twice overall ribbon thickness (fold lines are acceptable)
Flex circuit card Six times the overall circuit thickness
Cable bundles Three times outside cable diameter, but no coaxial cable within
the cable may be bent more sharply than five times individual
cable outside jacket diameter.
Flexible coaxial cables or polyethylene cables Five times the outside jacket diameter
Semi-rigid coaxial cable When bend radii are not specified by design, the minimum
inside bend radius is .125 inch.
5.3.40. Binding and Restraining Wire Bundles and Cable Bundles.

Perform the following steps when binding and restraining wire bundles and cable bundles.
a. Wire bundles and cable bundles received from the factory bound with a plastic or Teflon sleeve may not be bound using any
other method.
b. Wire bundles and cable bundles that remain fixed in place and are not bound as described in step a may be bound with appro-
priate nylon cable ties listed in Table 5-15 or with lacing tape (CPN 435-1019-030).
c. Wire bundles and cable bundles that remain fixed in place may be restrained by appropriate plastic loop clamps listed in Table
5-16, cushioned metallic loop clamps listed in Table 5-17, wire routing clamps listed in Table 5-18, or such other hardware
specified in engineering drawings.
d. Wire bundles that must remain flexible may be restrained and bound using lacing tape (CPN 435-1019-030) if no other method
is provided.
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Table 5-15. List of Nylon Cable Ties
ROCKWELL COLLINS PART MAXIMUM BUNDLE DIAMETER MINIMUM BUNDLE DIAMETER

NUMBER (INCHES) (INCHES)
435-0002-010 0.62 0.06
435-0002-020 1.75 0.06
435-0002-030 4.0 0.06
435-0002-040 3.5 0.19
435-0002-050 1.75 0.06
435-0002-060 4.0 0.06
435-0002-070 3.5 0.06
435-0002-080 1.25 0.19
435-0002-090 8.0 0.06
435-0002-100 1.25 0.19
435-0002-110 2.0 0.06
435-0002-120 1.75 0.06
435-1122-000 1.75 0.0625
435-1123-000 1.75 0.0625
435-1124-000 1.75 0.0625
435-1125-000 1.75 0.0625
435-1126-000 1.75 0.0625
435-1127-000 1.75 0.0625
435-1128-000 1.75 0.0625
435-1129-000 1.75 0.0625
435-1130-000 1.75 0.0625
435-1131-000 1.75 0.0625
435-1132-000 4.0 0.0625
435-1133-000 4.0 0.0625
435-1134-000 4.0 0.0625
435-1135-000 4.0 0.0625
435-1136-000 4.0 0.0625
435-1137-000 4.0 0.0625
435-1138-000 4.0 0.0625
435-1139-000 4.0 0.0625
435-1140-000 4.0 0.0625
435-1141-000 4.0 0.0625
435-1142-000 3.5 0.1875
435-1143-000 3.5 0.1875
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Table 5-15. List of Nylon Cable Ties - Continued
ROCKWELL COLLINS PART MAXIMUM BUNDLE DIAMETER MINIMUM BUNDLE DIAMETER

435-1144-000 3.5 0.1875
435-1145-000 3.5 0.1875
435-1146-000 3.5 0.1875
435-1147-000 3.5 0.1875
435-1148-000 3.5 0.1875
435-1149-000 3.5 0.1875
435-1150-000 3.5 0.1875
435-1151-000 3.5 0.1875
435-1169-100 (MS3367‐4‐9) .625 0.06
435-1169-200 (MS3367‐5‐9) 1.25 0.19
435-1169-300 3.0 0.1875
Table 5-16. List of Plastic Loop Clamps
ROCKWELL COLLINS PART NUMBER MAXIMUM CABLE DIAMETER (Inches)

150-0708-010 0.125
150-0708-020 0.188
150-0708-030 0.25
150-0708-040 0.312
150-0708-050 0.375
150-0708-060 0.438
150-0708-070 0.5
150-0708-080 0.562
150-0708-090 0.625
150-0708-100 0.688
155-0708-110 0.75
155-0708-120 0.812
155-0708-130 0.875
155-0708-140 1.0
155-0708-150 1.125
155-0708-160 1.5
155-0708-170 2.0
155-0708-180 0.938
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Table 5-16. List of Plastic Loop Clamps - Continued
ROCKWELL COLLINS PART NUMBER MAXIMUM CABLE DIAMETER (Inches)

155-0708-190 1.25
155-0708-200 1.063
Table 5-17. List of Cushioned Metal Loop Clamps
ROCKWELL COLLINS DIAMETER OF CLOSED BAND MATERIAL CUSHION MATERIAL

PART NUMBER CLAMP
139-0737-010 0.625 Aluminum Chloroprene
139-0737-030 0.25 Steel Silicone
139-0737-040 0.125 Steel Silicone
139-0737-050 0.188 Steel Silicone
139-0737-060 0.3125 Steel Silicone
139-0737-070 0.375 Steel Silicone
139-0737-080 0.438 Steel Silicone
139-0737-100 0.562 Steel Silicone
139-0737-110 0.625 Steel Silicone
139-0737-120 0.688 Steel Silicone
139-0737-140 0.812 Steel Silicone
139-0737-150 0.875 Steel Silicone
139-0737-160 0.938 Steel Silicone
139-0737-180 1.063 Steel Silicone
139-0737-190 1.125 Steel Silicone
139-0737-200 1.188 Steel Silicone
139-0737-220 1.3125 Steel Silicone
139-0737-230 1.375 Steel Silicone
139-0737-240 1.438 Steel Silicone
139-0737-260 1.562 Steel Silicone
139-0737-270 1.625 Steel Silicone
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Table 5-17. List of Cushioned Metal Loop Clamps - Continued

PART NUMBER CLAMP
139-0737-280 1.688 Steel Silicone
139-0737-300 1.812 Steel Silicone
139-0737-310 1.875 Steel Silicone
139-0737-320 1.938 Steel Silicone
139-0737-340 2.0625 Steel Silicone
139-0737-350 2.125 Steel Silicone
139-0737-360 2.188 Steel Silicone
139-0737-380 2.312 Steel Silicone
139-0737-390 2.375 Steel Silicone
139-0737-410 20625 Steel Silicone
139-0737-420 2.688 Steel Silicone
139-0737-440 2.812 Steel Silicone
139-0737-450 2.875 Steel Silicone
139-0737-470 3.125 Steel Silicone
139-0737-490 3.375 Steel Silicone
139-0737-510 3.625 Steel Silicone
139-0737-530 4.125 Steel Silicone
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Table 5-17. List of Cushioned Metal Loop Clamps - Continued

PART NUMBER CLAMP
139-0737-640 0.25 CRES* Flourosilicone
* Note: CRES is an abbreviation for Corrosion Resistant Steel
Table 5-18. List of Wire Routing Clamps
ROCKWELL MAXIMUM MINIMUM CLAMP TYPE/SHAPE FASTENER HOLE

COLLINS BUNDLE BUNDLE SIZE (INCHES)
PART DIAMETER DIAMETER
150-0564-010 0.40 0.30 Standoff Kurly-lok 0.187
150-0564-020 0.40 0.30 Standoff Twist-lok 0.217
150-0564-030 0.47 None Padded Aluminum None, Adheres to
surface
150-0564-040 0.18 None Flat C None, Adheres to
surface
150-0564-050 0.25 None Adhesive Flat C
150-0564-060 0.25 None Adhesive Flat C
150-0564-070 2.5 None Flat (for ribbon cable) 0.25
150-0564-080 0.20 X 0.42 None Wire Saddle with locking top 0.187
150-0564-090 0.39 X 0.62 None 0.187
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Table 5-18. List of Wire Routing Clamps - Continued
ROCKWELL MAXIMUM MINIMUM CLAMP TYPE/SHAPE FASTENER HOLE

COLLINS BUNDLE BUNDLE SIZE (INCHES)
PART DIAMETER DIAMETER
150-0564-100 0.12 (two separate) None Double half-U 0.125
150-0564-110 0.25 None Single half-U 0.125
5.3.41. Inspection and Repair of Fiber Optic Cables.

Rework and repair of Fiber Optic Cable Assemblies are performed in accordance with Rockwell Collins process specifications. The
pertinent procedures from that specification are reproduced in the section that follows.
5.3.41.1. Pertinent Fiber Optic Terms and Acronyms.
• VFL: Visual Fault Locator: A piece of equipment that emits a laser light in the core of a fiber to detect breaks in the fiber.
• Optical End Face: Either end of a fiber which in turn gets plugged into a connector.
• Visual Check: The use of an optical scope to view the fiber optic end face for contamination.
• ESH: Environment, Safety and Health.
• Fibercheck Software: Software that indicates if your optical end face is clean.
• CleanBlast: A system that cleans the end face of a fiber optic cable.
• Optical Scope: A scope that is used to view the end of a fiber optic cable for cleanliness.
• SM: Single Mode: A single signal is sent through the fiber optic cable.
• MM: Multi Mode: Many signals are sent through the fiber optic cable.
• RIB: Ribbon: Ribbon cable fiber optic.
5.3.41.2. General Requirements. Alcohol containers should be kept clean at all times and clearly identified as to only be used
on fiber optic cables. Microscopic contaminates can be transferred to optical components causing scratches and deposit of debris
particles, which causes failures when scoped. Refer to Table 5-19. for materials for use with fiber optic rework and repair.
Table 5-19. Fiber Optic Repair Tools
DESCRIPTION ROCKWELL COLLINS PART NUMBER

Alcohol Dispenser 004-0004-010/030
Bag of 10, 1.25 mm Cleaning Pipes 372-0466-170
Straight Insert Extraction Tool 372-0466-210
Spigot Wrench for Locking Device 372-0466-200
Right Angle Insert Extraction Tool 372-0466-190
Bag of 10, 1.25 mm Cleaning Sticks 372-0466-160
Quantity 200, 1.25 mm CLETOP Sticks 372-0466-120
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Table 5-19. Fiber Optic Repair Tools - Continued
DESCRIPTION ROCKWELL COLLINS PART NUMBER

Bag of 6, Cleaning Papers 372-0466-180
Westover Digital Scope with Fibercheck Westover FBP-P5000
Westover CleanBlast System Westover FCL-P1000
1.25 mm Ferrule End Face Cleaner 372-0466-010
2.5 mm Ferrule End Face Cleaner 372-0466-020
Visual Fault Locator Exfo FLS-240
Hexagonal Key with 5/64 inch (2 mm) Flats 372-0466-150
#16 Metal Insertion & Extraction Tool 370-8053-030
Canned Air 005-2866-010
Isopropyl Alcohol 005-0837-000
Optopop End Face Cleaner Single Wipe Optical Microscope 372-0466-040 Westover FM-DI100
(x 100)
Optopop End Face Cleaner Single Wipe Replacement Reel 372-0466-060
Optostick 1.25 mm 372-0466-070
Optostick 2.5 mm 372-0466-080
Cletop Cleaning Cassette 372-0466-090
Cletop Cleaning Replacement Reel 372-0466-100
Module should not be powered up while doing any of the activities outlined in this procedure.
5.3.41.3. Handling Requirements.

• Fiber optic cables should be packaged individually.
• Fiber optic cables should be kept in original packaging until used.
• A fiber optic cable (either end of a fiber which in turn gets plugged into a connector) should not be touched with bare hands.
• When using spiral wrap, the fiber optic cable should not be spun to get the cable into the spiral wrap.
• The bend radius of the fiber optic cable should not be violated (see Figure 5-91).
• When securing cable, insure the device used does not squeeze, pinch or make an impression in the cable. Doing so may make the
cable unusable.
• Cleaning pipes, sticks and paper used to clean fiber optic cables should only be used once then disposed of properly.
5.3.41.4. Cleaning Requirements for End Face of a Fiber Optic Cable.

5.3.41.4.1. General.
• Cleanliness of the fiber optic cable end face is extremely important for system performance; therefore, cleaning and visual checks
are necessary.
• Cleaning and a visual check of the fiber optic cable end face is recommended after removing the protective cap for installation.
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• Cleaning and a visual check of mating test cables should be done before each use.
• Cleaning and a visual check of the fiber optic cable end face should be done immediately prior to mating into the test station.
• If a visual check is done without the use of Fibercheck® software, criteria found in Paragraph 5.3.41.5 applies.
NOTE
The protective cap is not an air-tight seal and is only intended to protect the end face from damage, not contami-
nation.
Approved safety glasses should be worn at all times. The Fiber Instruments Sales Pocket Fault Locator contains
a Class IIIA laser. Do not stare into the beam as permanent damage to the eye could occur. The EXFO FLS-240
Visual Fault Locator contains a Class IIA laser. The light that is emitted does not cause damage to the human eye,
although prudence suggests you do not stare into the beam.
5.3.41.4.2. Cleaning Process.

5.3.41.4.2.1. Cleaning Process with Ferrule End Face Cleaner, Optopop™ End Face Cleaner or Cletop™ Cleaning Cassette for
Single Fiber Optic Cable End Face. See Figure 5-53 for a ferrule end face cleaner.
Figure 5-53. Ferrule End Face Cleaner
5.3.41.4.2.2. Equipment. Refer to equipment in Table 5-20.
Table 5-20. Fiber Optic Equipment
EQUIPMENT VENDOR PART NUMBER

Fiber Instrument Sales Pocket Fault Locator F19000
Westover Scientific Portable CleanBlast™System FCL-P1000
Westover Scientific Digital Inspection Probe FBP-P5000
Westover Scientific Solvent Refill Cap Assembly FCLP-RCA-1
Westover Scientific CleanBlast Solvent FCLP-SOL1
Westover Scientific Filter, Air, 0.01µ, 1/8 inch NPTF FCLP-FA-F1
EXFO FLS-240 Visual Fault Locator FLS-240
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Table 5-20. Fiber Optic Equipment - Continued
EQUIPMENT VENDOR PART NUMBER

EXFO 2.5 mm to 1.25 mm Visual Fault Locator GP-1008
adaptor
Personal Computer Requirements:
Pentium III - 1 Gigahertz (GHz) Central
Processing Unit (CPU) or higher
Windows 2000 (SP4) or Windows XP
128 MB Random Access Memory (RAM)
minimum
30 Megabyte (MB) hard disk space for
application software
One open Universal Serial Bus (USB) 2.0 port
5.3.41.4.2.3. General Guidance on Setup.

a. When not inspecting the fiber optic cable end faces, close out of the FiberChek2™software. This powers down the inspection
probe.
b. Do not attach the inspection probe until after the Personal Computer (PC) has been set up with the software. Follow the vendor’s
installation procedure for the software.
c. After software installation, the inspection probe can be attached to the PC.
(1) Plug in the probe to an available USB port on the PC (see Figure 5-54). The "Found New Hardware Wizard" should
automatically appear. Choose the "Install the Software Automatically" option.
Figure 5-54. Inspection Probe Illustration
(2) The next screen shows "Hardware Installation". Click "Continue Anyway".
(3) Click "Finish" at the next screen (Completing the Found New Hardware).
(4) Remove the CD from the drive and store safely.
d. Set up the "FiberChek2" Profile.
(1) Open the FiberChek2 shortcut.
(2) From the Tools drop down menu, choose "Profile. The Profiles Screen appears.
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(3) From the list of profiles, select Single Mode (SM) "SM, In-Service". Click on the two arrows that are pointing left. Do the
same for Ribbon (RIB) "RIB, SM, In-Service", and "RIB, Multi-Mode (MM), In-Service" profiles. Click the OK button
when done.
e. Set up the FiberChek2 Calibration.
(1) From the Tools drop down menu, choose "Calibrate". The Calibration Screen comes up.
(2) From the list of calibrations, select "Ribbon Tips". Click on the two arrows that are pointing left. "Ribbon Tips" gets
added to the menu on the right. Click OK when done.
(3) If no other end faces need viewing, then close out the FiberChek2 software by choosing File, then Exit.
f. Set up the Inspection Probe.
(1) If the inspection probe has never been plugged into the PC before, use the initial setup procedure shown above.
(2) Plug the probe into the available USB port.
(3) Open the FiberChek2 software. The system is now ready to inspect fiber optic cables.
5.3.41.4.3. Inspection of Cable End Faces using FiberChek2 System.
a. Select a tip and place on the inspection probe barrel. Screw the probe barrel around the tip.
b. Select the correct Calibrate Setting in the FiberChek Software (see Figure 5-55). Use the “L-TIP SLONG REACH (-L) TIPS”
for tips that have a vendor part number ending in -L. Use "STANDARD TIPS (WITH BAP1)" for all other tips.
Figure 5-55. FiberChek Screen (Dirty Fiber)
c. Place Fiber Optic cable end face into the tip on the inspection probe (see Figure 5-56).
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Figure 5-56. Fiber Optic Cable Mated to Inspection Probe Barrel
d. The image of the fiber end face is shown on the software screen. Use the focus control dial on the inspection probe to bring the
image into focus.
e. Once the image is in focus, click the "Test Fiber" button located on the upper left side of the screen. Alternatively, you can
click the "Quick Capture" button on the inspection probe.
f. A new screen comes up detailing all the areas where contamination or damage has been found. In the lower right corner of the
screen, the Inspection Result is either a "Fail" or "Pass". If an error message entitled "Problems inspection the high magnifica-
tion image" comes up, treat the result as a failure.
g. Gently remove the Fiber Optic cable interface from the inspection probe.
h. If the inspection result was a "Pass", continue on with Test / Assembly processes.
i. If the result was a "Fail", then the fiber optic end face must be cleaned with an approved process.
j. Repeat the inspection steps following cleaning. If you observed more than 3 failed results on the same Fiber Optic cable end
face, the fiber optic cable should be replaced.
5.3.41.4.4. Cleaning Fiber Optic End Faces with the CleanBlast System. Figure 5-57. shows the CleanBlast™System. It isrec-
ommended that the TFT display that comes with the system not be used, it will not work with the FiberChek2 software system.
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Figure 5-57. CleanBlast System
a. Ensure the system is plugged in.

b. Turn on the switch in the upper right hand corner of the system.
c. Choose a cleaning tip and thread into the handset (see Figure 5-58).
Figure 5-58. Cleaning Tip Threaded Onto Handset
d. If the system has not been used during the previous four hours, the system needs to be primed before continuing. To prime the
system, do the following.
(1) Ensure that the tip is properly attached to the handset.
(2) Press the prime button twice in succession. The primer button is located next to the solvent refill compartment.
e. Ensure that the nozzle is pointed away from people or objects.
f. Hold the tip and fiber optic cable end face in one hand and the handset in the other.
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g. Gently press the tip into the handset and notice that the Power/Ready indicator light turns to green, which indicates the system
is ready to clean. While holding the fiber compressed into the handset, hit the Run button on the handset.
h. After the cleaning cycle is complete, gently remove the fiber optic cable end face from the tip. Use caution not to hit the fiber
optic cable end face on anything that might contaminate the surface.
i. View the end of the fiber optic cable end face for cleanliness using the FiberChek2 software.
5.3.41.4.4.1. Refilling the CleanBlast Solvent Reservoir. Replacement solvent is needed with the Low Solvent LED lights up.
When this LED lights, more solvent must be added before the system can be used.
a. Unplug the system from the outlet.
b. Rotate the refill cap to the left.
c. Attached the solvent refill cap assembly lid to a new bottle of solvent.
d. Attach the two quick connect valves on the solvent refill cap assembly to the ports on the CleanBlast System and hold the bottle
vertical to let the contents drain into the solvent reservoir (see Figure 5-59).
Figure 5-59. Solvent Reservoir
e. Disconnect the two quick connect valves.

f. Rotate the solvent refill cap to the right to close.
g. Plug in the CleanBlast system again. Prime the system as outlined above.
5.3.41.4.4.2. Air Filter Replacement. The two micro air filters must be replaced with the Service LED indicator lights are on.
a. Ensure that the CleanBlast system is unplugged.
b. Loosen the two release knobs and open the panel (see Figure 5-60).
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Figure 5-60. CleanBlast System Interior
c. Loosen the drain plugs on the water trap bowls.

d. Unscrew and remove the water trap bowls.
e. Unscrew and remove the two filters and replace with new filters (see Figure 5-61).
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Figure 5-61. Replacement of Filters
f. Put the water trap bowls back on and screw down.

g. Tighten the drain plugs.
h. Close and screw down the panel.
i. Using a paper clip, press the Service Reset Button.
j. Plug unit back in.
5.3.41.4.5. Hand Cleaning Process.
a. Remove the dust cap from the end face of the connector (see Figure 5-62).
Figure 5-62. Dust Cap Removal
b. Complete a visual check of the fiber optic cable end face (refer to Paragraph 5.3.41.5).
c. If the connector is contaminated, continue with the following steps.
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(1) Clean the end face with a cleaning paper impregnated with alcohol. (Ensure that working surface is clean and flat). It is
recommended that clean gloves be worn. Hold connector perpendicular to cleaning surface and wipe in only one direction
(see Figure 5-63). Cleaning paper should be discarded after each use.
Figure 5-63. End Face Cleaning
(2) Dry by spraying canned air on the end face eliminating any traces of alcohol (see Figure 5-64).Complete a visual check.
If contamination is present, repeat steps.
Figure 5-64. Drying of End Face
(3) Insert the cable assemblies into the multi-pin connector.

5.3.41.4.6. Hand Cleaning Process for End Faces in Multi-Pin Connectors.
a. If the connector (plug or receptacle depending on the connector series) is equipped with a sleeve holder use the hexagonal key
5/64 inch (2 mm) flats to remove the sleeve holde (see Figure 5-65). Make sure to pull sleeve holder straight out to ensure no
damage is done to the contacts.
Figure 5-65. Sleeve Holder Removal
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b. Complete a visual check

c. If contamination is present continue with the following steps:
(1) Clean the end face with a cleaning pipe or stick impregnated with alcohol (see Figure 5-66).
Figure 5-66. End Face Cleaning
(2) Dry by spraying canned air on the end face eliminating any traces of alcohol or by using a cleaning pipe without alcohol
(see Figure 5-67). Complete a visual check. If contamination is present, repeat steps.
Figure 5-67. Drying of End Face
5.3.41.5. Workmanship Criteria - Fiber Optics. General Requirements are listed below.
• Inspection or process verification of fiber optic cable connectors and the cable’s fiber end face should be done at 100X minimum
magnification to a maximum of 400X for defect resolution.
• The acceptance criteria is used as a product verification step to ensure the fiber end face of the cable passes the appropriate test
step. When verifying the cable fiber end face, a nonconformance should not be recorded into any inspection database system if
the rework process is simply cleaning the cable fiber end face.
• All fiber optic cables that do not pass the appropriate test step should be recorded into the appropriate inspection database (ex-
ample: SAP).
• Core area fiber end face should be considered when applying accept/reject criteria. Core area is the center portion of the fiber
(see Figure 5-68).
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Figure 5-68. Fiber End Face Examples Showing Critical Core Area
5.3.41.5.1. Fiber Optics Visual Acceptance Criteria - 100X Magnification (see Figure 5-69 through Figure 5-73).
Figure 5-69. Acceptable Fiber Optic: Clean, no debris or contamination on the core of the fiber end face.
Figure 5-70. Rejected Fiber Optic: Dust particles on fiber end face, potential contamination of the core.
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Figure 5-71. Rejected Fiber Optic: Powders, contamination on the fiber end face, including core.
Figure 5-72. Rejected Fiber Optic: Oils, residue remaining on the fiber end face, including core.
Figure 5-73. Rejected Fiber Optic: Alcohol, staining of the fiber end face.
5.3.41.5.2. Fiber Optics Visual Acceptance Criteria - 200X Magnification (see Figure 5-74 through Figure 5-87).
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Figure 5-74. Acceptable Fiber Optic: Light polishing scratches across the surface of the fiber; however, light through
the core is readily visible.
Figure 5-75. Rejected Fiber Optic: Residue, oil from bare hands while handling of the fiber optic cable.
Figure 5-76. Rejected Fiber Optic: Foreign material in core area. Light through the core is not visible.
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Figure 5-77. Rejected Fiber Optic: Scratches across face of fiber, typical of coarse polish. Light through the core is not visible.
Figure 5-78. Acceptable Fiber Optic: Very light or no scratches on the fiber end face surface although light polishing marks
are visible around the fiber. Light through the core is readily visible.
Figure 5-79. Acceptable Fiber Optic: Smooth, no evidence of polishing marks or other deformation. Light through the
core is readily visible.
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Figure 5-80. Rejected Fiber Optic: Radial cracks are not acceptable. They may propagate into the core area.
Figure 5-81. Rejected Fiber Optic: Damage from improperly inserting fiber end face contact into connector (too much force).
Figure 5-82. Rejected Fiber Optic: A pit from leaving debris on the fiber end face and using a locking fiber connector.
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Figure 5-83. Rejected Fiber Optic: Fiber end face surface pulverized.
Figure 5-84. Rejected Fiber Optic: Severe chip and cracking.
Figure 5-85. Rejected Fiber Optic: Heavy cracks and chips. Core area damaged.
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Figure 5-86. Rejected Fiber Optic: Deep edge and surface cracks and chips. Core area damaged.
Figure 5-87. Rejected Fiber Optic: Cracks and minor damage on surface. Light through the core is not visible.
5.3.41.6. Contact Installation - Insertion and Extraction. Perform the following steps when installing a contact into multi-pin
connectors (EPXB, ARINC 600, MIL-DTL-38999, etc.).
5.3.41.6.1. Contact Insertion.
a. Install the contact into the insertion/extraction tool using the blue extremity (see Figure 5-88).
Figure 5-88. Contact Installation
b. Insert the contact into the connector cavity. It is critical to correctly align contact key with the keying mark (see Figure 5-89),
or keying cavity in the connector shell (see Figure 5-90).
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Figure 5-89. Connector Cavity
Figure 5-90. Connector Keying Cavity
5.3.41.6.2. Contact Extraction.

a. When the contact is required to be removed from the connector cavity due to improper insertion, use the white end of the
insertion/extraction tool.
b. When extracting a contact, it is critical to correctly align contact key with the keying mark or keying cavity in the connector
shell (see Figure 5-89 and Figure 5-90).
c. The fiber optic cable should not be pulled on or bent while extracting the contact.
5.3.41.7. Routing Requirements. Bend radius is important when routing fiber optic cable inside a Line Replaceable Unit (LRU).
Make sure to follow the minimum bend radius shown in Figure 5-91, unless specified by design.
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Figure 5-91. Minimum Bend Radius
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5.3.41.8. Visual Fault Locator Detection. A piece of equipment that emits a laser light into the core of a fiber to detect breaks in
the fiber. Perform the following steps when inspecting for faults with the Fiber Instrument Sales Visual Fault Locator. The process
makes use of the Fiber Instrument Sales Pocket Visual Fault Locator (VFL) F19000 (see Figure 5-92). The VFL contains a Class
IIIA laser. Do not stare into the beam as permanent eye damage could occur. This device can only be used with 2.5mm fiber optic
end faces.
Figure 5-92. Fiber Instrument Sales Pocket Fault Locator F19000
a. Check to make sure the 2 AA batteries are good.

b. Remove the clear protective cover off the tip.
c. Gently insert a fiber optic cable end face into the tip.
d. Slide the black button to the "On" position to emit a constant beam, and to the "Mod" position for a flashing setting.
e. A break in an optical fiber appears as a glow in most optical fibers tested using a VFL (see Figure 5-93). Not all fibers used
in aerospace allows light from a break to escape the outer jacket due to jacket density. Cables exhibiting this condition should
not be used.
Figure 5-93. Break in Fiber Optic Cable
f. Slide the black button to the Off position when done.

g. Gently pull the end face out of the tip.
5.3.41.9. Inspecting for Faults Using the EXFO FLS-240 Visual Fault Locator System. This is an alternative to the Fiber Instru-
ment Sales device. Perform the following steps when inspecting faults using the EXFO FLS-240 Visual Fault Locator System (see
Figure 5-94).
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Figure 5-94. EXPO Visual Fault Locator
a. Make sure the 2 AAA batteries are good.

b. The EXFO system contains a Class IIA laser. The light that is emitted does not cause damage, but prudence suggests you do
not stare into the beam.
c. Remove the black cap from the VFL.
d. The tip of this VFL is designed for 2.5 mm fiber optic cable end faces. If a 1.25 mm fiber optic cable end face is to be viewed,
install the adaptor. The white end of the adapter goes into the 2.5 mm tip of the VFL.
e. Gently insert a fiber optic cable end face into the tip.
f. Press the silver button on the end of the VFL to turn on the device. The black button near the top of the VFL changes the beam
style between constant and flashing.
g. Look for damage as outlined before.
h. Press the silver button on the end of the VFL to turn off when done.
5.3.41.10. Excessive Bending Causing Optical Loss. Excessive bending of fiber causes optical losses, demonstrated using a visual
fault locator. Light can be seen escaping the optical fiber by the slight red glow (see Figure 5-95). Cable exhibiting this condition
should not be used.
Figure 5-95. Microbend
5.3.41.11. Excessive Bending Causing Jacket Damage. Excessive bending and compression of the optical fiber causes damage
to the outer and inner jackets of an optical cable. This type of damage can be seen as bunching or creasing of the outer jacket (see
Figure 5-96). Cables exhibiting this condition should not be used.
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Figure 5-96. Damaged Fiber Optic Cable Jacket
5.3.41.12. Excessive Pinching Causing Optical Loss. Pinching an optical cable in a cable assembly causes stress losses as demon-
strated by using a visual fault locator. Losses are observed as a red glow of light that escapes the fiber (see Figure 5-97). Cables
exhibiting this condition should not be used.
Figure 5-97. Stress Point
5.3.42. Rework and Repair of Ball Grid Arrays.

As Rockwell Collins products become more complex and smaller in size, printed wiring assemblies contain increasing amounts of
small components called Ball Grid Array (BGA)s. In a BGA device, the interconnection between the integrated circuit and the
assembly surface is accomplished through small spheres of solder on the bottom side of the component page (see Figure 5-98).
Rework and repair of BGA components differs from standard rework and repair methods as the solder connections are on the bottom
side of the component and therefore inaccessible.
Figure 5-98. BGA Device
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The following rework and repair guidance is based on the use of an Air-Vac Onyx 29 hot gas rework station (see Figure 5-99).
Similar hot gas rework stations may be used if the critical times and temperatures are maintained. The user should be familiar with
this equipment (see Onyx 29 User Manual # 0029.00.902) and should be trained on this equipment prior to any rework.
Figure 5-99. Air-Vac Onyx 29 Hot Gas Rework Station
5.3.42.1. Preparation for BGA Rework and Repair.

• Remove Humiseal 1B31 from the rework area using a suitable rework chemical such as toluene or xylene. If toluene or xylene
use is not available, use the Electrowash method covered in this section.
• This method presumes the previous removal of Humiseal 1B31 conformal coating from the rework site. Humiseal 1H20AR1
conformal coating does not require removal prior to BGA rework, though removal of the coating around the perimeter of the
component may make the rework process easier.
• The methods contained in this document can also be used to rework and repair other components, such as Quad Flat Pack (QFP)s,
with a suitable alteration in methods.
• If there is any question of whether the component/assembly can be reworked, the assembly should be returned to Rockwell Collins
for repairs.
5.3.42.1.1. Underfilled Parts. To increase reliability of BGA components, the components may be underfilled with a blue Loctite
FP4527 underfill adhesive (CPN 821-1646-010). This underfill material is not reworkable. If the component is underfilled with this
material, the component should not be reworked and the assembly should be considered as scrap. Non-underfilled components may
be reworked using standard processes.
5.3.42.1.2. Safety Precautions.
• Be familiar with the location and use of the latching Emergency Stop (E-stop) button.
• Operate the Onyx 29 per the manufacturers recommended procedures.
• Keep flux and cleaning solvents away from open heat and flame.
• Wear safety glasses at all times.
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• Allow machine nozzle to cool before removing or use nozzle removal tools whenever handling a hot nozzle.
• Power should be disconnected when servicing unit.
• When flux material is splashed/rubbed into eyes, irrigate with water for 10-15 minutes; then promptly seek medical attention.
Have an available person bring medical assistance while irrigating eyes.
The hot gas tool and the pre-heater reach temperatures well above 60°C. Hot Surface warning labels are found on
the covers of each heated surface.
5.3.42.1.3. Process Precautions.

• When the machine is in the removal or replacement cycle, do not attempt to reposition the PWB or rotate the nozzle.
• The machine itself should be positioned in an area free of drafts. Strong air currents around the machine can affect the thermal
stability of the process. If your facility’s Air-Vac machine is in an area that experiences drafts, building an enclosure may be a
solution to assure that rework recipes run the same each time. See Figure 5-100 for enclosures.
• When BGAs are in close proximity to other components, unintended reflow can occur in the adjacent components. Such compo-
nents can be shielded by covering them with clean aluminum foil (see Figure 5-101) or by use of a custom masking fixture (see
Figure 5-102).
• When Rework is being done on a larger BGA and smaller BGA’s are adjacent, place the assembly with the smaller BGA’s toward
the front near the Cooling Port on the Onyx 29 rework system (see Figure 5-103).
• During vision alignment, ensure that the camera is in proper position to avoid placement errors due to incorrect viewing angle.
• Some assemblies contain moisture sensitive parts that can be damaged by hot gas reflow without a prior pre-bake of the compo-
nent. Rockwell Collins process specifications and IPC-J-STD-20 contain provisions for handling moisture sensitive components.
Figure 5-100. Air-Vac Machine Enclosure
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Figure 5-101. Aluminum Foil Heat Sink
Figure 5-102. Board Substrate Heat Sink
Figure 5-103. Cooling Port at Low Velocity
5.3.42.1.4. Equipment and Supplies.

• Air-Vac, Onyx 29, selective soldering system
• Refer to Section 1 (Materials) for a list of Rockwell Collins approved solders and fluxes
• Onyx 29 nozzles appropriate to device being reworked
• Thermal gloves
• Isopropyl alcohol, technical grade or better
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5.3.42.2. Equipment Power-Up.

a. Switch on the PC, allowing Windows to load.
b. Switch on the system power I/O at the Onyx 29, which is located at the front to the left side.
c. Switch fiber optic light source on and set to high.
d. At the Windows XP prompt: (username: administrator) (password: press ok, no password is necessary). If the local policy is
to require usernames and passwords, adjust the following entries accordingly.
e. Double click the icon visual machines and the software will be started.
f. Enter the user name and password. (username: operator) (password: operator)
g. The visual machines software will prompt to execute the calibration program: do you want to calibrate < standard.itc >? Press
Yes.
h. At this time the system is physically moving the axes during calibration. Make sure there are no tools or any other parts in the
working area.
5.3.42.3. Program Execution.
a. Click on the open program icon located on the left of the screen.
b. Double click on the desired program from the directory. The program execution steps will be different between an assembly
number program name (example: 601-0888-003) and a BGA type including size, ball count and material program name (ex-
ample: 35mm 352 SBGA). The header shows the name and the description of the selected program. If no program is selected
it will display "no program".
c. Press Start.
5.3.42.4. Selected Process List.
a. Press all located on the top-left corner of graphical image window, to turn all components to red (non-active).
b. Right click on graphical image of component desired.
c. All processes are shown in green (active): Removal, Site cleaning and Soldering no flux dipping.
d. Change any process which you do not wish to execute to red (non-active).
e. Press Resume.
5.3.42.5. Loading Assembly.
a. Install board fasten hold down clips.
b. Load board into left-front corner of pre-heater platform. Refer to graphical plot for correct orientation.
c. Fasten board using the hold down clips.
d. Press Resume.
5.3.42.6. Assembly Programs Only.
a. Teach BZF position.
b. Press twice the Enable button located on the machine operator blue panel, located on front machine.
c. Use the blue ring on machine to position laser pointer on board origin. Refer to graphical plot for correct board origin location.
d. Press Resume.
5.3.42.7. Live Video.
a. Live video will activate next and ask to position view cam on site.
b. Press Resume.
c. Position view cam on device. Adjust camera focus and zoom.
d. Adjust position of light so that it is on the site. A grainy picture indicates insufficient light. Typically the light position needs
to be adjusted so it is focused on the site.
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e. Position camera away from pre-heater to avoid contact with the robot during nozzle changes.
f. Teach site position (used on BGA type programs only).
(1) Double click on "vision unit" to activate laser pointer (red dot) to teach the site position.
(2) Uncheck robot enable box.
(3) Use blue ring on machine to position laser pointer on the top-left corner of the device.
(4) Select "set position" for position 1.
(5) Move laser pointer to the bottom-right corner of the device.
(6) Select "set position" for position 2.
(7) Select "move to final pos". The laser pointer should move to the center of the device.
(8) Select "OK".
(9) Select "accept" to store the newly taught position.
g. Board Infrared (IR) Position.
(1) Board temp sensor pos of assembly < Uxx > window will open.
(2) A non-contact IR sensor is located underneath the front of the vision housing.
(3) Double click on "head of robot".
(4) Use the blue ring to manually position the robot head, so that the yellow triangle sticker on the front of the vision housing
is over an area on the front of the board free of components to monitor board temperature.
(5) Select "OK".
(6) Select "accept" to store the IR sensor position.
5.3.42.8. Removal Process.
a. Change nozzle to Nxx EZxx, where xx refers to the nozzle size.
b. The robot head will move forward. Install nozzle listed.
c. Use the nozzle handling tool to remove the existing nozzle and to install the new one. The nozzle locking fingers are spring-
loaded.
d. Visually square the nozzle.
e. Press Resume.
f. The nozzle will touch the device using the force sensor and retract.
g. The removal profile will be displayed and executed.
Do not touch the board as the platform temperature will significantly increase.
h. At the end of process, the nozzle vacuum is automatically activated and the part removed.
i. Load < reject bin > into packed # 1 of manual loader.
j. The shuttle extends and the device is automatically dropped off.
k. Remove the device from the shuttle.
l. Press Resume.
5.3.42.9. Site Cleaning Process.
a. Change nozzle: site clean nozzle (5mm tip).
b. Remove the component nozzle and install the site cleaning nozzle.
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The nozzle in the machine is hot. Be sure to use the nozzle handling tool to change nozzles.
c. Verify the composite vacuum tip on the site nozzle is clean before installing it. Be sure that the gray vacuum cup makes a good
connection on the vacuum manifold.
d. To verify good connection to the vacuum manifold, click on Sig Tab located on bottom left part of screen. Select site clean
vacuum (hot gas tool) turning to green (active). Place a finger on composite vacuum tip and verify vacuum is on. Once vacuum
is on, turn vacuum off.
e. Press Resume.
5.3.42.10. View Cam.
a. Position view cam.
b. Press Resume.
5.3.42.11. Flux Site.
a. Flux the site while nozzle is pre-heating.
b. Manually flux the site while the nozzle is pre-heating. Make sure to complete application before the timer completes.
c. The component removal process is then executed.
d. The board cooling system is activated for 1 minute to cool down the board and pre-heater.
e. Clean the site with an approved Rockwell Collins flux cleaning solvent (refer to Section 1 (Materials)).
f. Press Resume.
5.3.42.12. Replacing Components.
a. Install the appropriate nozzle.
The site clean nozzle is extremely hot. Be sure to use the nozzle handling tool to change nozzles and place on
designated holder.
b. Remove the site cleaning nozzle and place on designated holder.

c. Install the component nozzle and visually square. Press Resume.
d. Position view cam. Press Resume.
e. Verify polarity and place component in the adjustable insertion tool. Press Resume.
f. Load <component shuttle> into pocket #1 of manual loader.
g. Install the insertion tool in the component shuttle. Press Resume. The component is automatically picked up.
h. Match component with board. The component is brought to the vision position. The component spheres are superimposed over
the pads.
i. Use the front machine panel controls to square the device to the site. X direction uses the left thumb wheel. Y direction uses
the right thumb wheel. Rotation (theta) uses the center buttons.
j. Press skip to go to next corner. You can go back and forth between corners as many times as needed until the part is perfectly
aligned.
k. Press Resume.
l. Apply flux to the device or site unless this has already been applied.
m. Press Resume.
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n. The component will be automatically placed into position.

o. The replacement profile is displayed and executed.
5.3.42.13. System Power Down.
a. Press the E-stop button.
b. Exit the visual machine software, the database is saved automatically.
c. Switch off the system power I/O at the Onyx 29.
d. Shut down the PC. Switch off the monitor.
5.3.42.14. Troubleshooting.
5.3.42.14.1. No Power.
a. Check if the main 3-phase power is switched on (located on the back side of the system).
b. Check if the system I/O switch of the Onyx 29 is switched on. Check all the fuses according to the owners manual section 10.5
of the Onyx 29.
c. Make sure the green LED on the right side of the operator panel is turned on.
5.3.42.14.2. Emergency Stop Cannot be Released.
a. Check if the system has power, if there is no power on the system, refer to the previous section. Make sure the emergency
switch button on the front panel is released.
b. Check that none of the axes are at its mechanical limit. Move all axes slightly in the direction center of the traveling range.
5.3.42.14.3. No Air Pressure.
a. Check the facility pressure, the input pressure into the machine and into the machine support.
b. Check the power of the system, the machine support main switch, and the machine main switch.
5.3.42.14.4. Hot Gas Heater can not be Enabled, No Heat is being Generated.
a. Check that the E-stop is released and enough air pressure into the system is provided (see previous sections) the safety system
status should be at the state safety system: ready.
b. Check the hot gas system fuses F71 of the Onyx 29 (refer to user manual section 10.5 fuses of the Onyx 29).
c. Check that a nozzle with the type hot gas nozzle is mounted. This can be seen in the maintenance screen of the hot gas system.
Indicating the nozzle selected for each profile.
d. Ensure the temperature reading is not above or below the established reading that was set up during the initial programming.
Otherwise, the analog sensor is not properly connected.
5.3.42.14.5. No Vacuum at the Nozzle.
a. Check the facility pressure and the input pressure into the machine. The input pressure must be above 5.5 bar (80 psi).
b. Check if the nozzle flange has a perfect seal. If this can not be tested, mount the camera calibration nozzle and check the vacuum
with the calibration nozzle mounted.
5.3.42.14.6. Height During Site Clean Process is not Constant. If the site clean tool is raising its position during the site clean
process, and it is moving way above the board, then clean the site clean tool. It might be that the vacuum channel inside the tool is
full of solder.
5.3.42.15. Operator Prevention Maintenance.
5.3.42.15.1. Weekly.
a. Clean site clean nozzle with isopropyl alcohol.
b. Wipe painted surfaces with a dry cloth.
c. Check pressure on the air flow gauges on back of tool, verify 5.5 bars. Adjust if necessary.
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5.4. OVERHAUL.
5.4.1. General.
The following overhaul information is applicable to all equipment types.
a. The condition of the product to be overhauled must not be so bad as to make performing an overhaul impossible or impractical.
b. All parts required to perform the overhaul and any required repairs and service bulletins must be available/obtainable
c. All units will conform to the nameplate type number and part number.
d. The applied modification information sticker or plate must conform to the actual configuration of the unit.
e. The unit must meet or exceed applicable test specifications stated in the related equipment component maintenance manual.
f. The unit must have affixed, an Airworthiness Release Form/Tag (e.g. FAA 8130-3., EASA Form 1) with applicable form/tag
information completed, including the term “overhaul” appropriately marked, and signed by an authorized individual.
5.4.2. Overhaul for Electronic Equipment.
The following overhaul information is applicable to electronic equipment.
a. Soldering, PC boards, components, wiring and hardware are to be inspected and restored in accordance with the applicable
sections of this manual.
b. The operator performing the overhaul is permitted, but not required, to replace components that, to his/her experience-based
knowledge, are prone to early failure, are approaching the end of their normal life span, or have been succeeded in newer
generation equipment by an improved part. Replacement parts selection is based on the parts list in the component maintenance
manual for that assembly/subassembly part number.
5.4.3. Overhaul for Mechanical Equipment.
The following overhaul information is applicable to mechanical equipment.
a. Any processes, procedures, specifications stipulated in the related component maintenance manual are to be adhered to.
b. Synchro and motor sliprings, brushes, commutators, bearings, and slip clutches are to be inspected, cleaned, adjusted and relu-
bricated for return to service per the applicable component maintenance manual. Damaged or worn segments may be replaced
separately, or the entire component may be replaced, dependent upon economic and part availability considerations.
c. Gear mesh, wear and lubrication shall be inspected. Gears should be cleaned, mesh adjusted and lubrication applied per the
component maintenance manual. Gears, damaged or worn are to be replaced.
d. Electro-filmed assemblies are susceptible to catastrophic failure if exposed to petroleum or silicon-base lubricants. Nearby
mechanical assemblies should be sparingly lubricated to prevent migration into electro-filmed gears. Accidentally lubricated
electro-filmed gears should be thoroughly cleaned and inspected for damage. Any damaged electro-filmed component, or one
in which wear has exposed base metal or will do so before the next anticipated maintenance period, should be replaced.
e. High-speed bearings (gyro rotors, motors) are to be replaced with each overhaul.
f. Meter movements are to be exercised throughout their full dynamic range to detect stickiness, adequate pointer clearance, and
absence of particles in air gaps. Meters should also be exercised in three axis and, if possible, simultaneously, to ensure lack of
interference throughout the dynamic range.
g. Aircraft servos may be overhauled in the general shop area per the applicable component maintenance manual.
h. Mechanical assemblies are to be inspected in conformance to the applicable component maintenance manual.
5.5. TEST AIDS.

5.5.1. General.
The following information is applicable to Test Aids used to test circuit cards/subassemblies.
a. Test Aids are defined as Original Equipment Manufacturer (OEM) units that are used specifically for testing circuit cards/sub-
assemblies to verify those circuit cards/subassemblies as airworthy. A successful OEM specified return to service test of the
Test Aid shall be considered as approved return to service testing of all circuit cards/subassemblies within the Test Aid under
test.
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b. Circuit cards/subassemblies successfully tested using a Test Aid are removed from the Test Aid and must be tagged, labeled,
or permanently marked as traceable to the Test Aid used to test those circuit cards/subassemblies.
c. Test Aids are also known as Golden Units or Shop Aids and the terms can be used interchangeably.
5.5.2. Test Aid Requirements.
The following requirements are applicable to Test Aids used to test circuit cards/assemblies.
a. Test Aids must have OEM released maintenance data (such as component maintenance manual) that includes return to service
testing for the applicable Test Aid.
b. Test Aids must be certified a minimum of every 12 months using the return to service test in the approved OEM maintenance
data.
c. Test Aids must be maintained as an approved OEM, FAA-TSO or FAA-PMA configuration as defined in the OEM maintenance
data.
d. Any changes to a Test Aid configuration as specified in the OEM maintenance data must be verified by having the Test Aid
successfully pass the return to service test specified in the OEM maintenance data immediately after the configuration changes
are made.
5.6. SELF-ADHESIVE LABELS AND DECALS (REMOVAL AND APPLICATION).

5.6.1. Label and Decal Application.
When necessary, do the steps below to apply labels and decals.
5.6.1.1. The bonding surface shall be clean prior to the label application. When surfaces are not visually clean, use isopropyl
alcohol to remove residues from the bonding surface.
5.6.1.2. Tweezers or equivalent tools shall be used to apply labels to the bonding surface. Label adhesive surface should not contact
contaminating surfaces (such as bare hands).
5.6.1.3. Labels will adhere to the surface they are applied and not exhibit tearing, peeling, lifting or air bubbles.
5.6.2. Label and Decal Removal.
When necessary, do the steps below to remove labels and decals.
5.6.2.1. Use tweezers or equivalent tools to remove the label/decal from the bonding surface. Use care not to damage the bonding
surface with sharp tools.
NOTE
If necessary, use a heat source on the label/decal material to make it less rigid and the adhesive more pliable.
5.6.2.2. Use isopropyl alcohol to clean and remove residues from the bonding surface.
5.7. LEAD-FREE SOLDERING.

5.7.1. Lead-Free Product.
The Lead Free Solder section is intended to cover only those situations that are unique to lead free solder designs. The Lead Free
Solder section is applicable to lead free solder appearance acceptance, unless otherwise specified by design.
NOTE
Product that requires the use of lead-free solder shall be specified by design.
5.7.2. General Requirements.

Soldering and Cleaning Processes
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5.7.2.1. Only solders in accordance with IPC-J-STD-006 will be used. Refer to Table 1-10 for a list of approved lead-free solders.
Only fluxes (liquid and paste) in accordance with IPC-J-STD-004 will be used. Refer to Table 1-11 for a list of approved lead-free
flux.
5.7.3. Solder Connection Appearance.
Use the acceptance criteria shown below for printed circuit boards with Plated Through Hole (PTH) components.
5.7.3.1. Acceptable.
1. Solder fillets have a matte appearance.
2. Solder fillets have good wetting to the leads and the pads.
Figure 5-104. Acceptable
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5.7.3.4. ACCEPTABLE.
5.7.4. Shrinkage Voids.

5.7.4.1. A void formed in the solder fillet during the solidification of the solder alloy in a lead-free soldering process. Typically,
this occurs on the solder destination side of the board rather than on the solder application side.
5.7.4.2. Shrinkage voids in a solder connection shall not be acceptable when they are visually identified using the inspection mag-
nification of 1.75x to 5.25x. Shrinkage voids identified at a higher magnification are acceptable.
5.7.4.2.1. Acceptable
1. No evidence of voiding and there is good wetting to the lead pad and barrel on the solder destination side of the board.
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Figure 5-108. Acceptable Shrinkage Voids
5.7.4.2.2. Rejected
1. Shrinkage void is visible at normal inspection range.
Figure 5-109. Rejected Shrinkage Voids
5.7.4.2.3. Rejected
1. Shrinkage void is visible at normal inspection range.
Figure 5-110. Rejected Shrinkage Voids
5.7.5. Solder Fillet Lifting.

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5.7.5.1. Lifting of the solder fillet from the PTH pad on a board during the solidification of the solder alloy in a lead-free soldering
process. Typically, this occurs on the solder application side of the board rather than on the solder destination side.
5.7.5.2. Fillet lifting in a PTH solder connection shall not be acceptable when visually identified using the inspection magnification
of 1.75x to 5.25x. Fillet lifting identified at a higher magnification is acceptable.
1. No evidence of voiding and there is good wetting to the lead, barrel and/or the pad on the solder destination side of the board.
Figure 5-111. Acceptable Solder Fillet Lifting
5.7.5.2.2. Rejected
1. Solder fillet lifting is visible at normal inspection range.
Figure 5-112. Rejected Solder Fillet Lifting
5.7.6. Surface Mount Solder Connection/Termination Appearance.

Use the acceptance criteria shown below for printed circuit boards with Surface Mount Device SMD components installed.
5.7.6.1. The accept/reject criteria referenced herein are to be determined by the means of visual inspection after the soldering
process is completed. A SMD solder connection shall be visually inspected with magnification of 1.75x to 10x.
2. Solder fillets have good wetting to the terminations and the pads.
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Figure 5-113. Acceptable SMD Solder
5.7.6.1.4. Rejected
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1. Solder fillet has no wetting to the termination.
Figure 5-116. Rejected SMD Solder
5.7.6.2. Acceptable
2. SSolder fillets have good wetting to the leads and the pads.
5.7.6.3. Acceptable
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523-0768039
CHAPTER 6
ESDS DEVICES
6.1. INTRODUCTION.
Industry has become increasingly aware of the damage Electrostatic Discharge (ESD) can cause to Metal-Oxide Semiconduc-
tor (MOS) devices. Low production yields gave initial early evidence of this. More recently this same evidence has suggested
similar ESD sensitivity in other parts; evidence strengthened through use, testing, and failure analysis. The tendency toward
greater complexity and increased packaging density has heightened this sensitivity to the point where some state-of-the-art
microtechnology parts can be destroyed or damaged by static voltages as low as 20 volts. Microelectronic and semiconductor
devices, thick and thin film resistors, chips and hybrid devices, and piezoelectric crystals are all susceptible to common electrostatic
voltage levels. All equipment, not having adequate protective circuits, containing these components are also ESD sensitive. The
human body, all work surfaces, floors (especially if waxed), furniture, personal clothing, clean room garments, packaging materials,
and high velocity gas or liquid flow equipment are prime generators of electrostatic voltages. Movements such as sliding, rubbing,
or separating of materials can frequently result in electrostatic voltages of 15,000 volts. Maintenance shops absorb the majority
of the expense associated with ESD failure. Latent failures reduce the Mean Time Between Repairs (MTBR). To support this
maintenance activity, a large inventory of spares must be on hand. Proper ESDS handling has substantial cost benefits.
6.2. GENERAL INFORMATION.

The primary objective of all electrostatic prevention methods is to eliminate static charge accumulation. Any subassembly, assem-
bly, or printed circuit board containing ESDS devices is considered electrostatic sensitive and is handled according to the handling
procedures called out in this section. Top level assemblies or equipments that are fully assembled with all covers and shields in
place and properly attached are not normally considered electrostatic sensitive. Follow any packaging or special handling proce-
dures specified for the equipment. Storage of units should be in antistatic bags or better. Some units have connectors protected with
Caplugs® (cap covers). If available, use these cap covers in addition to the antistatic bag. It is not mandatory to use the cap covers.
6.3. DEFINITION OF TERMS.

The following are definitions of ESDS terms.
TERM DEFINITION
Antistatic Materials Antistatic materials do not charge triboelectrically and exhibit a surface resistivity between 1 x
109 Ω/square and 1 x 1014 Ω/square. These materials are used to replace insulating and static
generating materials and may also be used to line static shielding containers.
Antistatic Treated A static generating material is treated (coated) with a spray or lotion that reduces the material’s
static generating capability.
Buried Layer Containers Containers (bags or tote bins) with a conductive layer placed between insulating or antistatic
materials and thus not exposed to the outside. Static shielding is accomplished by this layer.
Surface resistivity measurements cannot be made. Special techniques for the verification and
qualification of the static shielding properties of buried layer containers are required.
Conductive Materials Conductive materials exhibit a surface resistivity of equal to or less than 1 x 105 Ω per square as
measured with a surface resistivity meter. Static shielding containers are made from conductive
materials.
Device Electrical and electronic component such as a microcircuit, discrete semiconductor, resistor,
capacitor, thick or thin film device or piezo-electric crystal.
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TERM DEFINITION
Electrostatic Charge An electrical charge at rest, caused by the transfer of electrons within a body or from one body
to another.
Electrostatic Discharge A transfer of electrostatic energy between substances of different electrical potentials. The
(ESD) discharge may occur without direct contact.
ESD Safe Area A work environment with materials and equipment that limit electrostatic voltages.
ESD Protected Area Designated environment provided with materials and equipment to limit electrostatic potentials
(the voltage difference between a point and an agreed upon reference).
ESD Protective Property of materials capable of reducing the generation of static electricity, dissipating an
electrostatic charge or providing shielding from ESD or electrostatic fields.
ESD Protective Packaging A packaging system that limits triboelectric charging of static electricity rapidly dissipates
electrostatic charges over its surface or volume and provides shielding from ESD spark discharge
or electrostatic fields.
ESD Safe Material A material that limits triboelectric charging too less than 50 volts. (example: Paper, Metal,
Anti-Static/Static Dissipative/Conductive Plastics, etc.) Not all ESD Safe Materials provide
shielding.
ESD Safe Workstation A workstation equipped with materials and equipment that limit electrostatic field voltages to less
than 50 volts at 12 inches. The area protects ESDS devices/assemblies/equipment from damage
induced by electrostatic fields, direct discharge or triboelectrically generated voltages.
Electrostatic Discharge Electronic devices that are susceptible to damage from electrostatic discharge of 3999 volts
Sensitive Device (ESDS) or less. These items include all semiconductors which use MOS, Complementary Metal-Oxide
Semiconductor (CMOS), Metal Semiconductor (MES), and Gate Array (GA)s technology, and
other select electrical devices.
Electrostatic Discharge Any assembly that contains an ESDS device is considered an ESDS assembly. Circuit cards,
Sensitive Assemblies subassemblies, and modules internal to equipment are also included.
ESD Sensitivity The electrostatic discharge level that causes component failure.
ESD Sensitivity (Class 1) Susceptible to damage from ESD voltages from 0 to 1,999 volts.
ESD Sensitivity (Class 2) Susceptible to damage from ESD voltages of 2,000 to 3,999 volts.
ESD Sensitivity (Class 3) Susceptible to damage from ESD voltages of 4,000 to 15,999 volts.
Facilitator Individual assigned the lead role for the management or supervision of personnel.
Foot Strap A foot strap is a conductive device that attaches to the foot of an operator to ground the operator to
a conductive floor surface. It is not necessary for the foot strap to contact bare skin.
Ground Conducting connection between an electrical circuit or equipment and the Earth or to some
conducting body that serves in place of Earth (example: an unpainted metal surface of a machine
having an electrical hookup, an electrical outlet box, a work bench with electrical outlets, or a
dedicated ground wire tied to the electrical ground system).
Grounded Person Any person who is wearing a wrist strap which is attached to a ground which has a nominal path
resistance to ground of 106 Ω to 1 x 109 Ω; is wearing conductive shoes or grounding shoe straps
and is standing on a dissipative floor system or grounding floor mat.
Handling Hand manipulating or machine processing of items. Includes actions such as inspecting,
manufacturing, assembling processing, testing, repairing, reworking, maintaining, installing,
transporting, analyzing failures, wrapping, packaging, marking, kitting, or labeling.
6-2
TERM DEFINITION
High Voltage Testing Testing which consists of voltages applied directly to the Unit Under Test (UUT) or induced in the
UUT, which exceeds 40 Volts direct current (V dc) or 50 Volts alternating current (V ac).
Protected ESDS Assembly Any ESDS assembly which is handled properly within an ESD Safe Area. Assemblies outside
of the ESD Safe area should be totally enclosed in an ESD Protective Bag or ESD Protective
Container, a Top Level (TL) with dust covers and conductive caps on all external connectors, or a
module with metal covers on all sides and no contact points exposed and conductive caps on all
external connectors.
Static Charge Generator This is a general term for nonconductive or insulating materials (example: adhesive tape, untreated
plastic foam, and most plastics). This type of material easily generates and holds a static charge and
is a potential hazard to ESDS devices/assemblies.
Static-Dissipative Materials Static dissipative materials exhibiting a surface resistivity between of at least 1 x 105 Ω/square
but less than 1 x 1012 Ω/square and a volume resistivity of at least 1 x 104 Ω-Centimeter (cm)
but less than 1 x 1011 Ω-cm.
Static Electricity Same meaning as electrostatic charge. Static electricity can be generated by rubbing one item
against another.
Static Shielding Packaging used to protect components from direct ESD and electrostatic fields.
Surface Resistivity Surface resistivity is a value that indicates the ability of a material to dissipate electrical charges.
Surface resistivity meters may be used to qualify and verify static dissipative and conductive
material.
Topical Antistat Substance that is topically applied to a material to render the material surface static dissipative
or less susceptible to triboelectric charging.
Totally Enclosed In bag with bag folded over or in tote with lid in place.
Triboelectric Charge Triboelectric charge is a buildup of static charge due to the contact and separation of two materials.
Friction or rubbing enhances this effect due to the contact and separation of many parts of
the surfaces. When tape is pulled from a roll, the adhesive side separates from the top side,
demonstrating triboelectric charging.
Wrist strap A wrist strap is often an elastic band that an operator wears around the wrist which has an electrical
connection that is used to connect to a cable. The cable is connected to a conductive work surface
pad at ground potential and the wrist strap must contact the bare skin to be effective.
6.4. STATIC SAFEGUARDED WORKSTATION.

A static safeguarded workstation or static protective work area can be any area designated for the repair and/or handling of ESDS
devices or assemblies. The presence of an electrically grounded mat (made of conductive material) on a work surface identifies
the station as an ESD protective work surface. All ESD protective workstations should be properly grounded and checked. The
following apply for static safeguarded workstation.
a. A static safeguarded workstation, as a minimum, has dissipative work surfaces which are connected to ground so that the
discharge current is limited to less than 0.5 milliamperes. The work surfaces utilize conductive mats or surfaces of 105 to
109 Ω/square and is connected to electrical ground through a resistance of approximately 1 Megohm (MΩ), except for metal
benches where standard construction methods preclude this practice. There is a conductive cable or cord from the work surface
that can be connected to a wrist strap.
When a soft mat is placed on top of another dissipative surface, the bottom surface must be tied to the constant monitor system.
The top, soft mat grounds through the bottom dissipative surface and does not need to be marked.
Carts used as ESD protective workstations must be grounded.
Grounded work surfaces must be kept clean. These surfaces are cleaned with soap and water or an approved cleaner. Other
cleaners may leave a film residue that can reduce the effectiveness of the grounded work surface.
6-3
b. Dissipative floor coverings or mats may be applied to all floors in a static safeguarded area. These surfaces are cleaned with
soap and water or an approved cleaner. Other cleaners may leave a film residue that can reduce the effectiveness of the grounded
work surface. Do not apply floor wax to any floor covering or mat. The wax acts as an insulator.
c. Items such as hard Laminate table tops, table top mats, tile, rolled flooring, floor mats, carpeting, etc. are cleaned on a monthly
basis (at a minimum, based on usage and location) with approved cleaning materials in Section 1 (Materials). These are cleaned
(example: mopped, buffed, etc.) per the supplier’s recommendations. Do not use any wax, polish, or other type of cleaner not
approved.
d. The application of ionized air is specified in the special repair or handling procedures.
Ionized air blowers may be used when the repair process requires the use of static charge generators and other methods of charge
dissipation do not work. An ionized air blower must be energized for at least three minutes before it is capable of providing
ESD protection; this is the time necessary to remove accumulated charges from the area. Personnel using ionized air blowers
for ESD protection must be within the path and range of the ionized air stream for it to be effective.
Ionizing nozzles are recommended for all airdrops. Ionizing air nozzles are used with all air hose guns in static safeguarded
work areas. Hoses with ionized nozzles are to be identified as ESD protective with yellow tape around the hose.
Ionized air guns and blowers are tested every three months and recorded on the Ionized Air Gun/Blower Cleaning and Test Log
or equivalent.
e. Topical Antistats are allowed but not preferred. Purchase ESD protective items for workstations.
Items made of insulating or static generating material (including test fixtures) may be topically treated with an antistatic solution
and used on an ESD protective workstation. Topical antistats are applied by Maintenance or designee.
If an item made of insulating or static generating material is used on the workstation, it must be treated annually and identified
with a tag/sticker to indicate the item is "staticide" treated.
Note, It is recommended that the first time items are treated the next treatment due date be in six (6) months. If the treated items
are still antistatic at the end of the six (6) months, the next due date can be extended (not to exceed twelve (12) months), after
retreating. Heavily used items may need more frequent treatments. If the treated items are no longer antistatic at the end of the
six (6) months, the next due date is shortened, after retreating.
If there are "treated" static generators on the station, all items are treated annually and one (1) tag/sticker may be placed on the
front edge of the station.
The tag/sticker includes the date (month and year) when item was treated and when the next treatment is due. Use yellow
stickers whenever possible.
Do not spray topical antistats directly onto Printed Wiring Board (PWB) surfaces or ESD protective surfaces.
f. Electrical Equipment: All electrical equipment and machinery in static safeguarded work area must be electrically grounded so
that the resistance from exposed metallic surfaces to workstation ground connections does not exceed 100 kilohm (kΩ).
g. Special considerations for test stations: Electrical power and electrical test signals are turned off before ESDS devices or as-
semblies are connected to or disconnected from test connectors. Power supply voltages are applied before and removed after
test stimuli/signals are applied or removed.
NOTE
Non-essential items are not allowed on any ESD-Safe work surfaces and are not be allowed to approach within 12
inches of unprotected ESDS devices, assemblies, and equipment. Essential items can be brought within 12 inches
of the ESDS assembly or equipment only during the time the essential task is being performed, and immediately
upon completion of the essential task, be moved to an area that is not on any ESD-safe work surface and is more
than 12 inches away from the ESDS assembly or equipment.
h. Unacceptable practices at or within 12 inches of static safeguarded areas include:

• Unpacking of parts or material contained in static generating material when ESDS devices are exposed.
• Storing of static generating packaging material within 12 inches of exposed ESDS devices, all personnel within 12 inches
of unpackaged ESDS devices, and trash cans.
Do not use ungrounded shelves or desks as either work surfaces or storage areas in a static safeguarded work area.
6-4
Do not use wooden pedestals unless they are placed on a conductive mat connected to ground. Personnel using the wooden
pedestal are connected to ground with a wrist strap.
i. Materials that are known static generators must be kept at least 12 inches away from static safeguarded work areas. Examples
of static generating materials include nonconductive solder removal tools, nonconductive plastics such as plastic and styrofoam
cups, plastic work instruction protectors, clear plastic bags, untreated foam padding packaging material, tape, and brushes with
nonconductive nylon or plastic bristles.
j. Use ESD approved gloves, finger cots, smocks, jump suits, booties, facemasks, and head coverings. For safety purposes when
removing items from ovens and test chambers, leather gloves, cotton gloves, or potholders made of non-static generating ma-
terials may be used.
6.5. REPAIR TOOLS AND SUPPLIES.

Special care is taken when installing or removing ESDS devices to ensure that the proper tools and supplies are being used. When
purchasing new tools or assembly aids, every effort is made to purchase tools made of ESD protective materials. Hand tools available
with handles made of antistatic or static-dissipative materials should be used. Where insulating handles are necessary, separate
ground connectors are required, such as on 3-wire soldering irons. Maintenance personnel should always ground the tip of the tool
on a conductive table prior to applying it to an ESDS device. Place tools and fixtures on a grounded surface when not in use to help
minimize static charge buildup. Refer to Section 1 (Materials) for recommended materials, and Section 2 (Tools) for recommended
tools.
6.6. HANDLING PROCEDURES/PRECAUTIONS.
NOTE
The requirements for static safeguarding workstations are provided in Paragraph 6.4.
6.6.1. General.
The following applies to general ESDS devices.
a. All assemblies are considered ESDS after the first component is installed.
b. ESD protective bags and containers are placed on a grounded surface or handled by a grounded person prior to removal of the
contents. This permits dissipation of any accumulated charge.
When working on an ESDS assembly at an ESD protective workstation, the assembly rests on a grounded workstation surface
in an approved fixture or in (on) a conductive fixture. It is also permissible to be held in the grounded operators hands or to be
in an open conductive tote (bag) on the grounded work surface.
Do not use nonconductive materials to elevate the assembly from the grounded work surface (mat or table). These practices
insulate the assembly from the grounding surface.
c. It is permissible to attach small round dots or arrows on a PWB (example: to identify defects on PWBs). Use ESD approved
larger adhesive-backed items.
d. Air ionization is a supplement to all existing ESD protection methods. An ESD Committee member or member must review
these areas to assure that the static control precautions used are adequate. Air ionization is used at workstations where ESD is
a hazard created by the work process or procedure only when safe ESD control cannot be met by other means.
6.6.2. Material Handling.
The following applies for ESDS material handling.
a. The handling of ESDS devices is restricted to static safeguarded work areas by personnel wearing either foot straps or wrist
straps connected to ground.
b. Whenever ESDS items are in an ESD protective bag/container, they are not be removed from the protective bag/container unless
the person handling the item is grounded and all unnecessary nonconductors within the periphery of the static safe work area
are removed or in accordance with the ESD restrictions listing.
c. Personnel must be grounded with a wrist or foot strap when handling ESDS devices or assemblies.
6-5
NOTE
Use lotion, when necessary due to dry skin, to improve electrical contact between skin and wrist straps. Use
only I.C. Lotion (Rockwell Collins Part Number (CPN) 005-8488-010) when handling electronic components or
assemblies. The lotion contains no mineral oil, glycerin, silicone, or lanolins that could contaminate the assembly.
d. Individual ESD items are packaged in ESD protective bags/containers.

Place all ESDS devices or assemblies in antistatic packaging (one item per bag), as described in Paragraph 6.7, before removing
them from a static-free workstation.
e. Rubbing any item at an ESD protective workstation is avoided.
f. When handling unprotected ESDS items, the following practices are adhered to:
• Avoid unnecessary contact/touching of the component leads.
• When possible, handle an assembly by its chassis, metal frame, or board edges.
• Restrain hair to prevent contact with ESDS items.
• Avoid clothing contact with any unprotected ESDS item.
g. Components which are not identified as ESDS are packaged in ESD protective bags or other conductive containers. Stock,
reinspection, and international kitting may process and handle non-ESDS items in supplier provided packaging. (example: in
corrugated cardboard, foam packages in which components are initially received).
h. Use ESD approved protective containers for transportation or storage of ESDS items.
i. If antistatic tubes are used for storage or transportation of ESDS components, the tubes should be in ESD protective bags or
conductive totes. When sealing the ends of a component tube with tape, only approved ESD protective tapes are allowed.
j. When shorting of the leads is required by the Individual Part Specification (IPS), component leads should be shorted together
using conductive foam.
6.6.3. Connection and Contact.
ESDS items being worked on are kept on a grounded work surface within an ESD protected area. The following applies for handling
ESDS parts or assemblies.
a. Special precautions may be required at test stations to prevent shorting of the assembly under test. Placing the assembly on an
insulator is unacceptable.
b. Materials that are known static generators must be kept at least 2 feet away from ESDS devices. Examples of static generat-
ing materials include: Gloves and smocks made from synthetic materials, nonconductive solder removal tools, nonconductive
plastics such as plastic and styrofoam cups, plastic work instruction protectors, clear plastic bags, untreated foam padding pack-
aging material, tape, brushes with nonconductive nylon or plastic bristles and paper notebooks are acceptable if they do not
contain plastic sheet protectors.
c. Tools and fixtures used are conductive between the working surface and the gripping point or base to provide charge neutral-
ization through the operators or stations.
d. Wrist and shoe straps used by personnel should be compatible with the type of ground mat, flooring, or electrical ground pro-
vided for its use.
e. Wrist straps are connected to electrical ground through a resistance of approximately 1 MΩ to limit current to less than 0.5
milliamps.
f. Wrist straps are worn around the arm between the wrist and the elbow and must be in direct contact with bare skin. A wrist strap
must be worn tight enough to ensure it stays in contact with the skin at all times. When seated, a wrist strap must also be worn.
g. Cloth type wrist straps can be taken home by the operator and washed, using any mild detergent.
NOTE
Personnel who experience allergic reactions from a wrist strap are to contact their facilitator, Industrial Engi-
neer (IE), or quality personnel. If wrist straps cannot be used, the work surface must be static safeguarded using
an ionized air blower.
6-6
h. Shoe straps or dissipative shoes can be worn in lieu of a wrist strap when working in areas which utilize a conductive floor
system or grounded floor mat.
Shoe straps are worn on both shoes. One shoe strap must remain in contact with a conductive floor system or grounded floor
mat at all times.
To prevent contamination (loss of electrical characteristics) or shortening of wear-life, dissipative shoes and shoe straps should
not be worn outside of buildings. If they are worn outside of buildings, they should be retested before work resumes.
Dissipative shoes are worn on both feet. One shoe must remain in contact or in a conductive path with the ESD protective floor
surface at all times.
When seated at an ESD protective workstation, if the conductive path between the floor and the dissipative shoes is broken, a
wrist strap is also worn. If the person is wearing dissipative shoes, and the footrest of the chair or bench is conductive to the
floor, a wrist strap is not required.
i. Regular inspections are made to ensure that wrist and foot straps have continuity and that the required series impedance is
present. Grounding of the work surface should also be checked. Refer to Paragraph 6.9 for foot, wrist, and work surface testing
information.
j. Minimize contact of ESDS parts or assemblies with personnel clothing. Synthetic material is an excellent source of static
electricity.
k. Do not touch any metal item that protrudes through an ESD protective bag. Protruding pins may be prevented by applying
non-static generating material (example: conductive foam, antistatic foam, etc.) over the pins.
l. When placing or removing ESD conductive connector caps from any ESDS assembly, personnel should not touch the exposed
pins.
6.6.4. Paperwork.
The following applies when handling ESDS paperwork.
a. Paperwork, antistatic paper holders and bags can be placed in ESD protective bags or other ESD protective container and may
encounter the ESDS assembly.
b. Paperwork may not come between an unprotected ESDS item and the grounded work surface (example: mat, tabletop, wire
rack, bottom surface of tote, etc.).
c. Staples should not used to attach paperwork to, or hold shut, ESD protective bags for circuit card assemblies, modules, or com-
ponents that are being forwarded to Finished Goods, customer(s), or Service Goods inventory. Product acceptance documents,
which are required by contract or requested by the customer, may be in the same ESD protective bag. Ensure the documents
sent with the unit does not damage the finish or otherwise degrade the appearance or function of the unit.
d. Paperwork may be stapled (not preferred) to the outside of ESD protective bags provided the bag is folded and the staple is
placed on the fold.
6.7. TRANSPORTATION AND STORAGE.

Anytime an ESDS assembly is transported outside an ESD protected area (example: moving from any workstation to water wash,
wave solder, ovens, post coat, etc.), it must be totally enclosed in an ESD protective container or ESD protective bag. The following
applies for ESDS transportation and storage.
a. ESDS items should be covered or stored in approved ESD protective bags or lidded ESD totes, unless work in process (example:
curing adhesive, drying conformal coat, wave solder, etc.) precludes it, at the end of each work shift.
b. Personnel must be properly grounded when handling unprotected egg crates (honeycomb racks) or racks that contain ESDS
assemblies.
c. Metal, conductive egg crates (honeycombs), racks, or perforated trays do not provide protection from induced electrostatic
fields. In areas where grounded floor mats or conductive flooring is used, the crates, racks, and trays do not have to be placed
in ESD protective containers or ESD protective bags during transportation, if dissipative shoes, shoe straps, or grounded carts
are being properly used.
d. Flux coated assemblies are transported in totes to prevent contamination of ESD protective bags. Totes used to transport flux
coated assemblies are cleaned periodically using approved ESD supplies for the flux cleaning processes.
6-7
e. Trays and other containers meeting the ESD protective covering requirements handling procedures may be used for transporta-
tion and storage of unprotected ESDS items.
6.7.1. Internal.
The following applies for internal transportation and storage.
a. Use conductive floor surfaces, foot straps, and ionized air blowers in areas where ESDS devices must be moved from one
workstation to another.
b. Conductive floor surface material should be similar to station working surfaces and similarly grounded.
c. Ionized air blowers neutralize charge on all contacted areas but are limited in range. Blowers are especially useful in removal
of static charge from insulating surfaces; however, ESDS assemblies should not be placed on these surfaces unless necessary.
d. If ESDS devices must be transported away from a static safeguarded work area, the ESDS devices must be placed in an antistatic
bag. The antistatic bag must cover the ESDS device completely.
e. When moving or storing a complete unit, the rear connector is protected with an antistatic connector cover (refer to the parts
catalog) and fitted in an antistatic bag or better (refer to Table 2-4).
6.7.2. External.
The following applies for external transportation and storage.
a. When shorting of the leads is required by the IPS, component leads are shorted together using conductive foam and then placed
in and ESD protective bag or other ESD protective container. Examples of components that may require leads to be shorted
together include axial leaded resistors, diodes, etc. Transportation and storage of ESDS parts at the component level require
that all device leads be effectively shorted together.
b. Components are placed in conductive carriers.
Open ended, non-plugged, conductive carriers must be placed in an ESD protective bag or other ESD protective container prior
to transport.
c. Conductive containers and ESD protective bags do not require ESD markings. All other ESD protective bags or other ESD
protective containers have an external marking. The marking includes, but is not limited to:
• ESD warning labels.
• Containers imprinted with an ESD caution note or symbol.
• Bags that are imprinted or labeled with an ESD caution note or symbol.
• Component Dual In-line Package (DIP) tubes identified as antistatic.
d. Free-flow material (example: styrofoam peanuts, etc.) are not be used to package ESDS items but may be used as external
packing material.
Anti-static bubble pack may be used as external packing material.
6.7.3. Component Level.
Transportation and storage of ESDS parts at the component level require that all device leads be effectively shorted together. To
accomplish this, one or a combination of the following methods are used. The following applies for component transportation and
storage.
a. Insert all leads of the device into high-density conductive foam (typically black).
b. Components are placed in anti-static carriers and placed in an ESD protective bag or other ESD protective container.
c. Insert devices in a dual In-line Carrier (IC) tube of aluminum or plastic that is specially treated to prevent generation of static
charges (must to labeled as static charge dissipative). Tube color is not an indication of ESD protection capability. The tubes
protect the ESDS devices from triboelectric charging. They do not provide shielding. Therefore, IC tubes are placed in antistatic
containers for transportation and storage.
d. Short all leads together with metal clips or store in grounded metal containers.
6-8
NOTE
Conductive bags with paper or other insulating materials bonded to their exterior are not used unless a conductive
path is present from the interior of the bag to an area on the exterior. This path is needed to allow neutralization
of internal charges. Foil-lined, nonconductive containers must have foil around the outside and on the bottom for
the same reason.
6.7.4. Assembly Level.

Antistatic protection is required for all assemblies containing ESDS parts anytime an assembly is removed from a static safeguarded
workstation. The following applies for assembly level transportation and storage.
a. The assembly must be entirely enclosed by an antistatic bag. Partial coverage or laying the assembly on the antistatic bag is
unacceptable, as is wrapping the assembly in the antistatic bag.
b. Whenever anti-static bags are impractical, ionized air may be used.
c. Do not open an anti-static bag without a properly connected wrist/foot strap.
d. All procedures that apply to ESDS devices at the component level also apply to the assembly level.
6.7.4.1. Assembly Level Storage of ESDS Assemblies Outside of an ESD Protected Area. The following applies for assembly
level storage of EDS assemblies outside of a ESD protected area.
a. Planar - Printed wiring assemblies containing electronic components are stored totally enclosed in ESD protective containers,
totally enclosed in ESD protective bags, or otherwise protected from ESD.
b. Modules and Partial TLs - All ESDS modules are stored totally enclosed in ESD protective containers, totally enclosed in ESD
protective bags, plugged into their mating chassis (if the chassis provides protection from ESD), or otherwise protected from
ESD.
c. TL Units - TL units containing ESDS assemblies without covers or ESD conductive connector caps in place are stored totally
enclosed in ESD protective containers, totally enclosed in ESD protective bags, or otherwise protected from ESD.
6.7.5. ESD Protective Bags.
The following applies when using ESD protective bags for transportation and storage.
a. ESD protective bags (refer to Section 2 (Tools),Table 2-4) may be any combination of conductive, static dissipative, and anti-
static plastics, metals, and metallized plastics, etc. depending on ESD classification.
b. Static shielding type bags are used for protecting ESDS devices. (Any type of static shielding bag may be used.) Only the
static shielding type bags (example: - RCAS 3600, 3M 330, CC 2000, or DRI-SHIELD 2700) are used for protecting ESDS
assemblies.
c. ESD protective bags are used for protecting ESDS items.
d. The contents of all ESD protective bags are treated as ESDS items.
e. Bags should be large enough to totally enclose the item, at least two inches larger than the item, so the bag can be folded over
and stay folded over when the bag is removed from an ESD protected area. Heat-sealing, when utilized, does not require a
folded seal.
f. Conductive rubber bands and paperclips may be used to help keep the bag folded.
g. Any bag which is torn, or contains punctures larger than 1/8 inch diameter should be discarded. There should be no protrusions
from the bags.
6.7.6. Non-ESDS Protective Bags.
Perform the following when using Non-ESD protective bags for transportation and storage.
6.7.6.1. Antistatic Bags.
a. Antistatic bags (pink or blue) alone do not provide adequate ESD protection for transportation or storage of ESDS items. They
are recommended for non-ESDS items to replace static generating packaging materials.
b. Static generating materials (example: tapes, rubber bands, bubble pack, etc.) should not be used to bundle antistatic carriers
which contain ESDS items.
6-9
6.7.6.2. Clear Plastic Bags/Containers.

a. Clear plastic bags/containers are static generators and are not be allowed at ESD protective workstations.
b. Clear Plastic bags are not be allowed within 12 inches of unprotected ESDS devices/assemblies/equipment.
6.7.7. ESD Protective Containers.
The following applies when using ESD protective containers for transportation and storage.
a. Only ESD protective containers are used for protecting ESDS items.
b. The contents of all ESD protective containers are treated as ESDS items.
c. Containers must be large enough to totally enclose the ESDS item so the lid is in place and stays in place when the container is
removed from an ESD protected area.
6.7.8. Non-ESD Protective Containers.
The following applies when using Non-ESD protective containers for transportation and storage.
6.7.8.1. External Supplier Containers - Non-ESD protective containers received from Rockwell Colllins suppliers are considered
static generators and kept 12 inches from unprotected ESDS devices/assemblies/equipment.
6.7.8.2. External Supplier Bags - Non-ESD protective bags received from Rockwell Collins suppliers are considered static gener-
ators and kept 12 inches from unprotected ESDS devices/assemblies/equipment.
6.8. ADDITIONAL PRECAUTIONS.

The following additional precautions are taken to minimize static accumulation and subsequent damage to parts or assemblies.
a. Nylon or synthetic gloves and smocks are not be worn.
b. Plastic cups, paper protectors, plastic solder suckers, and other nonconductive plastics are not allowed at a static safeguarded
workstation.
c. Handle ESDS devices by their cases whenever possible; avoid touching the leads or contacts. Avoid unnecessary contact/touch-
ing of the component leads.
When possible, handle an assembly by its chassis, metal frame, or board edges.
d. Use natural bristle brushes, not synthetic ones.
e. Small paper tags and string are not considered static generating material and do not pose a threat on the inside of an antistatic
bag.
f. Paper should not be placed between ESDS devices and the static safeguarded work surface. Paper such as forms and work
instructions are exempt from the 2-foot rule.
g. Staples should not be used to attach paperwork to, or hold shut, ESD protective bags for circuit card assemblies, modules, or
components that are being forwarded to Finished Goods, customer(s), or Service Goods inventory.
h. Product acceptance documents, which are required by contract or requested by the customer, may be in the same ESD protective
bag. Prevent documents sent with the unit from damaging the finish or otherwise degrading the appearance or function of the
unit.
i. Placing a hand on the static safeguarded work surface provides a ground path equal to the wrist strap as long as the contact is
maintained. When the hand is removed from the static safeguarded work surface, the ground path is lost.
6.9. ANTISTATIC DEVICE TEST AND CHECK.

All antistatic equipment (see Figure 6-1) should be tested on a regular basis. Several testing methods are available, depending on
the manufacturer of the antistatic equipment. The following information provides general guidelines that should be maintained as
recommended by Rockwell Collins. Refer to Table 6-1 for a list of specialized test equipment. Instructions for using these meters
are provided by the manufacturer. Meters that are equivalent to those listed may be used.
6-10
Figure 6-1. Static Safeguarded Workstation
Table 6-1. ESDS Workstation Test Equipment
STATIC SAFEGUARDED WORKSTA- METER MEASUREMENT PARAMETER

TION EQUIPMENT
Foot strap 3M Company Model 716 A pass/fail indication is shown.
Wrist strap 3M Company Model 716 A pass/fail indication is shown.
Wrist strap cord 3M Company Model 716 A pass/fail indication is shown.
Work surface mat or floor mat Hymar Meters Company Model 10/100-V megohmmeter shows a total
DB603 resistive reading as measured across
two 5-lb electrodes.
6.9.1. General Check.

Perform the following paragraphs when checking antistatic devices.
6.9.1.1. Individual Workstation (Surface Resistivity) Check. No record of this check is required. The person assigned to an ESD
protective workstation must visually perform the following each day before beginning work.
a. Check all table tops/mats, ground cords, and hardware attachments for obvious damage or wear.
b. Ensure the wrist strap ground cord is attached only to the swivel on the mat, a constant monitor system, or an electrical ground.
Wrist strap ground cords should be connected to the workstation constant monitor system in lieu of the swivel when both are
provided. Wrist strap ground cords should not be attached directly to the mat material when a constant monitor system is
present.
6-11
NOTE
An ESD mat placed on a grounded dissipative tabletop need not be connected directly to ground.
c. Adjust the wrist strap so it fits tight enough to be in contact with the skin at all times.
6.9.1.2. Wrist Strap / Workstation Grounding System Test. The following applies to the wrist strap / work station grounding system
test as defined on the Daily Individual ESD Wrist Strap / Workstation Grounding System Test Log (form 074-8432-584).
NOTE
This test is not required when a constant monitor system is used to monitor an operator, a wrist strap, a mat, and/or
a workstation.
a. Tests are performed by the user and recorded on the Daily Individual ESD Wrist Strap / Workstation Grounding System Test
Log or equivalent.
b. Tests are accomplished once per shift at a minimum. If an individual wrist strap / ground cord assembly was not tested during
the required shift period due to the operator’s absence, the wrist strap / workstation is tested the day the individual returns to
work.
NOTE
Test failures could be due to poor skin contact. Application of approved ESD hand lotion improves the contact
necessary for effective personnel grounding.
c. During the tests, it is desirable to rapidly wiggle the wrist strap ground cord to detect intermittent conditions.
6.9.1.3. Workstation Constant Monitor Test. The following applies to the workstation constant monitor test. No record of this test
is needed.
a. Constant monitor systems are tested after installation by Maintenance or designee.
b. Constant monitor systems are retested by Maintenance or designee after:
• Relocation of the constant monitor system.
• Replacement of the work surface (i.e., new soft mat).
• Replacement of the constant monitor system wiring, including ground cords, snaps, connectors, etc.
c. When an audible alarm is sounded, ESDS items should not be handled until the reason for the alarm is identified and corrected.
d. In the event a constant monitor system indicates an operator grounding alert, try applying approved ESD hand lotion to wrists
and hands. If this does not correct the problem (cancels the alert), adjust the tightness of the wrist strap. If this does not correct
the problem, contact the Line Facilitator, IE, Quality personnel, or Maintenance or designee for evaluation of the alert.
e. In the event a constant monitor system indicates a work surface grounding alert, contact the Line Facilitator, IE, Quality per-
sonnel, or Maintenance or designee for evaluation of the alert.
6.9.1.4. Dissipative Shoes and Shoe Strap Grounding System Test. Tests are performed by the user and recorded on the Daily ESD
Dissipative Shoe / Shoe Strap Grounding System Test Log (form 074-8432-585) or equivalent. Each shoe strap and dissipative shoe
is tested independent of each other at least twice daily (start of shift and prior to returning to work after lunch/dinner break). If the
dissipative shoes and/or shoe straps are removed, a retest is required. Dissipative shoes and shoe straps should not be worn outside
the building. If they are, a retest is required prior to returning to work. Ensure dissipative shoes and shoe straps are dry before testing.
6.9.1.5. ESD Flooring System Surface Resistivity Certification Test. This test is not required when a constant monitor system is
installed. Testing is required every 13 months. Tests are performed by the user and recorded on the ESD Flooring System Surface
Resistivity Certification Test Log [form 074-8432-583) or equivalent.
6-12
6.9.1.6. Ionized Air Gun/Blower Cleaning and Testing. The following applies for ionized air gun/blower cleaning and test.
a. Blower terminals and filters on semi-electric ionized air blowers (example: Simco Blowers) should be cleaned by Maintenance
or designee regularly, at a maximum of three (3) month intervals for the filters and six (6) month intervals for the terminals,
and recorded on the Ionized Air Gun/Blower Cleaning and Test Log (form 074-8432-582) or equivalent).
b. Ionized air guns and blowers are tested every three (3) months and recorded on the Ionized Air Gun/Blower Cleaning and Test
Log or equivalent. Ionized air guns must be cleaned by Maintenance or designee at a maximum of three (3) month intervals.
6.9.1.7. ESD Protective Work Surface Check.
a. Conductive plates are allowed to be at ground potential.
b. ESD protective work surfaces should be checked by maintenance or designee upon initial setup and re-checked every time the
workstation ground is disturbed (example: workstation moved, work surface replaced/exchanged, etc.).
NOTE
If a station has both dissipative laminate and soft tablemats, both surfaces are included in the check/re-check.
c. In the event of a chemical spill on the ESD protective work surface, the work surface must have a surface resistivity test done
on it by maintenance or designee.
6.9.2. Surface Resistivity Test.
In the event of an electrical ground fault in the repair or test equipment, a 1 MΩ resistor in the ground cord protects
a technician from electrical shock. The wrist strap terminal and the ground terminal should not be allowed to
short-circuit the 1 MΩ resistor in the ground cord.
The following applies to surface resistivity tests.

a. Wrist strap and cord - check on a daily basis. The resistance as checked from the wrist strap metal to end of the wrist strap
should be from 470 kΩ to 2 MΩ.
b. Work surface top or mat (example: hard laminate table tops, table top mats, etc.) - check on a weekly basis. The resistance as
checked across the ground cord terminal and the wrist strap cord terminal must have a surface resistivity of between 105 and
109Ω/square.
c. Work area - check on a weekly basis.he resistance from the metal on the wrist strap through the wrist strap cord, work surface
mat, and ground cord to the ground cord’s termination connector should be from 1 to 10 MΩ.
d. Foot strap - check on a daily basis. Shoe straps are worn in accordance with manufacturers’ instructions and do not need to
make skin contact to be effective. Wearers who do extensive walking must inspect the strap for wear-through and replace if
necessary. Make sure the foot strap is clean and fits snugly. Check for worn or frayed straps. Replace if the attachment hardware
does not stay in place or is loose.
e. Floor mat (example: floor mats, rolled flooring, tile, carpet, etc.) - check on a weekly basis. The resistance as checked across
two connectors must have a surface resistivity of between 105 and 109Ω/square.
f. Floor mat ground cord - check on a weekly basis. The resistance across the ground cord should be from 470 kΩ to 2 MΩ.
g. Heat Shields. The shields, fixtures, work surface, or grounded floor mat must have a surface resistivity of not greater than
109Ω/square.
6-13/(6-14 Blank)
523-0768039
APPENDIX A
CONVERSION TABLES, METRIC FACTORS
A.1. METRIC ESTIMATION.

Metric units are easily estimated, but conversion factors be used when more accurate results are required. Since few people can
look at a distance and accurately say that it is one yard long or two yards high, one can say it is one meter long or two meters high
with about the same degree of accuracy. This is also true when converting degrees Celsius to degrees Fahrenheit. Simply double
the Celsius temperature and add 32. By this method 20°Centigrade (C) would be 72°Fahrenheit (F). This is incorrect by 4°F, but
who can feel 4°F? If you remember that miles per hour is about 60% of kilometers per hour you can say that 100 KPH is about 60
MPH and 50 KPH is about 30 MPH. For all practical purposes, a liter of milk is the same as a quart of milk even though the liter is
slightly larger. One last thing to remember is that one pound is about 1/2 of a kilogram or a kilogram is 2.2 pounds. Remembering
these relationships should make the transition less difficult.
A.2. METRIC PREFIXES AND SYMBOLS.

Use the following prefixes when the basic unit of measurement would be cumbersome. For instance, long distances would be ex-
pressed in kilometers, whereas small distances or dimensions would be expressed in millimeters. The basic unit of measurement is
the same; only the prefix has changed. A kilometer is 1000 meters and a millimeter is 1/1000 of a meter.
PREFIX SYMBOL DECIMAL EQUIVALENT EXPONENTIAL EXPRESSION

exa E 1,000,000,000,000,000,000 1018
peta P 1,000,000,000,000,000 1015
tera T 1,000,000,000,000 1012
giga G 1,000,000,000 109
mega M 1,000,000 106
kilo K 1,000 103
hecto h 100 I02
deka da 10 10
deci d 0.1 10-1
centi c 0.01 10-2
milli m 0.001 10-3
micro µ 0.000001 10-6
nano n 0.000000001 l0-9
pico p 0.000000000001 10-12
femto f 0.000000000000001 l0-15
atto a 0.000000000000000001 10-18
A-1
appendix A 523-0768039
A.3. CONVERSION TABLES.

Refer to Table A-1 for inches, fractions, and decimals to millimeters conversion. Refer to Table A-2 for temperature conversion.
Refer to Table A-3 for length, area, volume, liquid measure,weight, torque, and pressure conversion. Refer to Table A-4 for decimal
feet to inches conversion. Refer to Table A-5 for inches and fractions to decimal feet conversion. Refer to Table A-6 for standard
metal gauges conversion. Refer to Table A-7 for recommended drill sizes for thread forming taps conversion.
Table A-1. Inches, Fractions, and Decimals to Millimeters
FRACTIONS OF AN INCH DECIMALS OF AN INCH MILLIMETERS

1/64 0.0156 0.397
1/32 0.0313 0.794
3/64 0.0469 1.191
1/16 0.0625 1.588
5/64 0.0781 1.984
3/32 0.0938 2.381
7/64 0.1094 2.778
1/8 0.1250 3.175
9/64 0.1406 3.572
5/32 0.1563 3.969
11/64 0.1719 4.366
3/16 0.1875 4.763
13/64 0.2031 5.159
7/32 0.2188 5.556
15/64 0.2344 5.953
1/4 0.2500 6.350
17/64 0.2656 6.747
9/32 0.2813 7.144
19/64 0.2969 7.541
5/16 0.3125 7.938
21/64 0.3281 8.334
11/32 0.3438 8.731
23/64 0.3594 9.128
3/8 0.3750 9.525
25/64 0.3906 9.922
13/32 0.4063 10.319
27/64 0.4219 10.716
7/16 0.4375 11.113
29/64 0.4531 11.509
15/32 0.4688 11.906
A-2
Table A-1. Inches, Fractions, and Decimals to Millimeters - Continued

31/64 0.4844 12.303
1/2 0.5000 12.700
33/64 0.5156 13.097
17/32 0.5313 13.494
35/64 0.5469 13.891
9/16 0.5625 14.288
37/64 0.5781 14.684
19/32 0.5938 15.081
39/64 0.6094 15.478
5/8 0.6250 15.875
41/64 0.6406 16.272
21/32 0.6563 16.669
43/64 0.6719 17.066
11/16 0.6875 17.463
45/64 0.7031 17.859
23/32 0.7188 18.256
47/64 0.7344 18.653
3/4 0.7500 19.050
49/64 0.7656 19.447
25/32 0.7813 19.844
51/64 0.7969 20.241
13/16 0.8125 20.638
53/64 0.8281 21.034
27/32 0.8438 21.431
55/64 0.8594 21.828
7/8 0.8750 22.225
57/64 0.8906 22.622
29/32 0.9063 23.019
59/64 0.9219 23.416
15/16 0.9375 23.813
61/64 0.9531 24.209
31/32 0.9688 24.606
A-3
Table A-1. Inches, Fractions, and Decimals to Millimeters - Continued

63/64 0.9844 25.003
1 inch°C / °F 1.000 25.400
Table A-2. Temperature Conversion Chart
°C / °F °C / °F °C / °F °C / °F °C / °F °C / °F °C / °F °C / °F
-40 / -40.0 -38 / -36.4 -36 / -32.8 -34 / -29.2 -32 / -25.6 -30 / -22.0 -28 / -18.4 -26 / -14.8
-24. / -11.2 -22 / -7.6 -20 / -4.0 -19 / -2.2 -18 / -0.4 -17 / +1.4 -16./ 3.2 -15 / 5.0
-14./ 6.8 -13 / 8.6 -12 / 10.4 -11 / 12.2 -10 / 14.0 -9 / 15.8 -8 / 17.6 -7 / 19.4
-6 / 21.2 -5 / 23.0 04 / 24.8 -3 / 26.6 -2 / 28.4 -1 / 30.2 0 / 32.0 1 / 33.8
2 / 35.6 3 / 37.4 4 / 39.2 5 / 41.0 6 / 42.8 7 / 44.6 8/46.4 9 / 48.2
10 / 50.0 11 / 51.8 12 / 53.6 13 / 55.4 14 / 57.2 15 / 59.0 16 / 60.8 17 / 62.6
16 / 60.8 17 / 62.6 18 / 64.4 19 / 66.2 20 / 68.0 21 / 69.8 22 / 71.6 23 / 73.4
24 / 75.2 25 / 77.0 26 / 78.8 27 / 80.6 28 / 82.4 29 / 84.2 30 / 86.0 31 / 87.8
32 / 89.6 33 / 91.4 34 / 93.2 35 / 95.0 36 / 96.8 37 / 98.6 38 / 100.4 39 / 102.2
40 / 104.0 41 / 105.8 42 / 107.6 43 / 109.4 44 / 111.2 45 / 113.0 46 / 114.8 47 / 116.6
48 / 118.4 49 / 120.2 50 / 122.0 55 / 131.0 60 / 140.0 65 / 149.0 70 / 158 75 / 167
80 / 176 85 / 185 90 / 194 95 / 203 100 / 212 105 / 221 110 / 230 115 / 239
120 / 248 125 / 257 130 / 266 135 / 275 140 / 284 145 / 293 150 / 302 155 / 311
160 / 320 165 / 329 170 / 338 175 / 347 180 / 356 185 / 365 190 / 374 195 / 383
200 / 392 205 / 401 210 / 410 215 / 419 220 / 428 225 / 437 230 / 446 235 / 455
240 / 464 245 / 473 250 / 482 255 / 491 260 / 500 265 / 509 270 / 518 275 / 527
280 / 536 285 / 545 290 / 554 295 / 563 300 / 572 305 / 581 310 / 590 315 / 599
320 / 608 325 / 617 330 / 626 335 / 635 340 / 644 345 / 653 350 / 662 355 / 671
360 / 680 365 / 689 370 / 698 375 / 707 380 / 716 385 / 725 390 / 734 395 / 743
400 / 752 405 / 761 410 / 770 415 / 779 420 / 788 425 / 797 430 / 806 435 / 815
440 / 824 445 / 833 450 / 842 455 / 851 460 / 860 465 / 869 470 / 878 475 / 887
480 / 896 485 / 905 490 / 914 495 / 923 500 / 932 550 / 1022 600 / 1112 650 / 1202
700 / 1292 750 / 1382 800 / 1472 850 / 1562 900 / 1652 950 / 1742 1000 / 1832 1050 / 1922
1100 / 2012 1150 / 2102 1200 / 2192 1250 / 2282 1300 / 2372 1350 / 2462 1400 / 2552 1450 / 2642
1500 / 2732 1550 / 2822 1600 / 2912 1650 / 3002 1700 / 3092 1750 / 3182 1800 / 3272 1850 / 3362
A-4
Table A-2. Temperature Conversion Chart - Continued
°C / °F °C / °F °C / °F °C / °F °C / °F °C / °F °C / °F °C / °F
1900 / 3452 1950 / 3542 2000 / 3632 2050 / 3722 2100 / 3812 2150 / 3902 2200 / 3992 2250 / 4082
2300 / 4172 2350 / 4262 2400 / 4352 2450 / 4442 - - - -
Table A-3. Conversion Formulas for Length, Area, Volume, Liquid Measure,Weight, Torque, and Pressure.
TO CONVERT INTO MULTIPLY BY CONVERSELY

MULTIPLY BY
LENGTH
Inches Millimeters 25.40 0.03937
Inches Meters 0.02540 39.37
Feet Meters 0.3048 3.2808
Yards Meters 0.9144 1.0936
Miles (statute) Kilometers 1.6093 0.6214
Miles per Hour (MPH) Kilometers per Hour (KPH) 1.6093 0.6214
AREA
Square Feet Acres 2.296 x 10-5 43,500
Square Feet Sq. Inches 144 6.944 x 10-3
Square Inches Sq. Centimeters 6.4516 0.1550
Square Feet Sq. Meters 0.0929 10.7639
Square Yards Sq. Meters 0.8361 1.1960
Square Miles Sq. Kilometers 2.590 0.3861
Square Millimeters Sq. Centimeters 0.01 100
Square Meters Sq. Centimeters 10,000 0.0001
Square Kilometers Sq. Meters 1 x 106 1 x 10-6
VOLUME
Cubic Inches Cubic Centimeters 16.3872 0.0610
Cubic Centimeters Cubic Millimeters 1000 0.001
Cubic Feet Cubic Meters 0.0283 35.3145
Cubic Yards Cubic Meters 0.7646 1,3079
LIQUID MEASURE
Cubic Inches Liters 0.01639 61.02
Quarts Liters 0.9463 1.057
Gallons (U.S.) Liters 3.785 0.2642
Liters Cubic Centimeters 1000 0.001
WEIGHT (MASS)
A-5
Table A-3. Conversion Formulas for Length, Area, Volume, Liquid Measure,Weight, Torque, and Pressure. - Continued
TO CONVERT INTO MULTIPLY BY CONVERSELY

MULTIPLY BY
Ounces Grams 28.35 3.527 x 10-2
Pounds Kilograms 0.4536 2.205
TORQUE
Foot Pounds Inch Pounds 12 0.0833
Foot Pounds Ounce Inches 192 5.208 x 10-3
Foot Pounds Gram-centimeters 1.383 x 104 1.235 x 10-5
Foot Pounds Kilogram-meters 0.1383 7.233
PRESSURE
Lbs per sq inch Dynes per sq centimeter 6.8946 x 104 1.450 x 10-5
Lbs per sq inch Kilograms per sq centimeter 0.0703 14.223
Lbs per sq foot Kilograms per sq meter 4.8824 0.2048
Table A-4. Decimal Feet to Inches (Nearest 16th)
HUNDREDTHS
TENTHS
.00 .01 .02 .03 .04 .05 .06 .07 .08 .09
0.0 0 1/8 1/4 3/8 1/2 5/8 3/4 13/16 15/16 1-1/16
0.1 1-3/16 1-5/16 1-7/16 1-9/16 1-11/16 1-13/16 1-15/16 2-1/16 2-3/16 2-1/4
0.2 2-3/8 2 -1/2 2-5/8 2-3/4 2-7/8 3 3-1/8 3-1/4 3-3/8 3-1/2
0.3 3-5/8 3-3/4 3-13/16 3-15/16 4-1/16 4-3/16 4-5/16 4-7/16 4-9/16 4-11/16
0.4 4-13/16 4-15/16 5-1/16 5-3/16 5- 1/4 5- 3/8 5-1/2 5-5/8 5-3/4 5-7/8
0.5 6 6-1/8 6-1/4 6-3/8 6-1/2 6-5/8 6-3/4 6-13/16 6-15/16 7-1/16
0.6 7-3/16 7-5/16 7-7/16 7-9/16 7-11/16 7-13/16 7-15/16 8-1/16 8-3/16 8-1/4
0.7 8-3/8 8-1/2 8-5/8 8-3/4 8-7/8 9 9-1/8 9-1/4 9-3/8 9-1/2
0.8 9-5/8 9-3/4 9-13/16 9-15/16 10-1/16 10-3/16 10 -5/16 10-7/16 10-9/16 10-11/16
0.9 10-13/16 10-15/16 11-1/16 11-3/16 11-1/4 11-3/8 11 -1/2 11-5/8 11 -3/4 11-7/8
Example: To convert 0.25 feet to inches, find 0.2 in the left hand column and find 0.05 in the row across the top. Then find the
place in the table where these rows and columns intersect. Read 3 inches.
Table A-5. Inches and Fractions to Decimal Feet
INCHES 0 1/8 1/4 3/8 1/2 5/8 3/4 7/8

0 .000 .010 .021 .031 .042 .052 .063 .073
1 .083 .094 .104 .115 .125 .135 .146 .156
2 .167 .177 .188 .198 .208 .219 .229 .240
A-6
Table A-5. Inches and Fractions to Decimal Feet - Continued
INCHES 0 1/8 1/4 3/8 1/2 5/8 3/4 7/8

3 .250 .260 .271 .281 .292 .302 .313 .323
4 .333 .344 .354 .365 .375 .385 .396 .406
5 .417 .427 .438 .448 .458 .469 .479 .490
6 .500 .510 .521 .531 .542 .552 .563 .573
7 .583 .594 .604 .615 .625 .635 .646 .656
8 .667 .677 .688 .698 .708 .719 .729 .740
9 .750 .760 .771 .781 .792 .802 .813 .823
10 .833 .844 .854 .865 .875 .885 .896 .906
11 .917 .927 .938 .948 .958 .969 .979 .990
Example: To convert 3-1/2 inches into decimal feet, find in the left hand column and find 1/2 in the row across the top. Then find
the place in the table where these rows and columns intersect. Read 0.292 feet.
Table A-6. Standard Metal Gauges
GAUGE NO. AMERICAN OR Brown & Sharp (B&S) (INCHES)

1 .2893
2 .2576
3 .2294
4 .2043
5 .1819
6 .1620
7 .1443
8 .1285
9 .1144
10 .1019
11 .09074
12 .08081
13 .07196
14 .06408
15 .05707
16 .05082
17 .04526
18 .04030
19 .03589
20 .03196
A-7
Table A-6. Standard Metal Gauges - Continued
GAUGE NO. AMERICAN OR Brown & Sharp (B&S) (INCHES)

21 .0284
22 .02535
23 .02257
24 .02010
25 .01790
26 .01594
27 .01420
28 .01264
29 .01126
30 .01003
31 .008928
32 .007950
33 .007080
34 .006350
35 .005615
36 .005000
37 .004453
38 .003965
39 .003531
40 .003145
This chart is used for copper, brass, and non-ferrous alloy sheets, wire, and rods.
Table A-7. Recommended Drill Sizes for Thread Forming Taps
TAP SIZE BASIC MAJOR DRILL SIZE DECIMAL M.M. EQUIVALENT

DIAMETER EQUIVALENT
0 - 80 .0600 54 .0050 1.396
0 - 64 .0730 51 .0670 1.702
1 - 72 .0730 51 .0670 1.702
2 - 56 .0860 5/64 .0781 1.984
2 - 64 .0860 47 .0785 1.994
3 - 48 .0990 43 .0890 2.260
3 - 56 .0990 43 .0890 2.260
4 - 40 .1120 38 .1015 2.578
4 - 48 .1120 38 .1015 2.578
A-8
Table A-7. Recommended Drill Sizes for Thread Forming Taps - Continued
TAP SIZE BASIC MAJOR DRILL SIZE DECIMAL M.M. EQUIVALENT

DIAMETER EQUIVALENT
5 - 40 .1250 33 .1130 2.870
5 - 44 .1250 32 .1160 2.946
6 - 32 .1380 1/8 .1250 3.174
6 - 40 .1380 30 .1285 3.264
8 - 32 .1640 25 .1495 3.798
8 - 36 .1640 24 .1520 3.860
10 - 24 .1900 11/64 .1719 4.366
10 -32 .1900 16 .1770 4.496
12 - 24 .2160 8 .1990 5.054
12 - 28 .2160 7 .2010 5.106
1/4 - 20 .2500 #1 .2280 5.792
1/4 - 28 .2500 15/64 .2344 5.954
5/16 - 18 .3125 L .2900 7.366
5/16 - 24 .3125 M .2950 7.492
3/8 - 16 .3750 S .3480 8.840
3/8 - 24 .3750 T .3580 9.094
7/16 - 14 .4375 13/32 .4062 10.318
7/16 - 20 .4375 Z .4130 10.490
1/2 - 13 .5000 15/32 .4688 11.906
1/2 - 20 .5000 31/64 .4844 12.304
A.4. OHM'S LAW.

Ohm's Law is a very basic rule of electronics dealing with the relationship between Voltage (E), Current (I), and Resistance (R). In
the memory aid (see Figure A-1), cover the unknown value on either triangle with a finger tip and the triangle automatically reveals
the correct formula to use. Example: If you want to know the current in a circuit, cover the letter "I" or the word "amps" and the
formula is revealed as either E divided by (or over) R or volts divided by (or over) ohms. Therefore, I = E/R = Volts/Ohms. The
basic formula for power uses these same three fundamental units: volts, amps, and ohms. Power (P) is expressed in watts. It is P
= E x I where P is power in watts, E is voltage, and I is current in amps. The power law can be combined with Ohm's Law to yield
other useful formulas as listed.
• I = E/R
• E = IR
• R = E/I
• P = IE
• P = E2/R
• P = I2R
A-9
Figure A-1. Memory Aid for Remembering Ohm's Law
A.5. COAXIAL CABLE CHARACTERISTICS.

There are many types of coaxial cables. Refer to Table A-8 for the characteristics of some common coaxial cables in use. See Figure
A-2 for coaxial cable parts.
Table A-8. Coaxial Cable Characteristics
CABLE TYPE NOMINAL DIAMETER (INCHES) NOMINAL REMARKS

IMPEDANCE IN CAPACITANCE IN
OHMS PFD/FT
RG-58 53.5 .195 28.5 Single Shielded
RG-58C/U 50.0 .195 30.8 Single Shielded
RG-59B/U 75.0 .242 20.6 Single Shielded
RG-178 50.0 .086 29.4 Double Shielded
RG-179B 75.0 .100 19.4 Single Shielded
RG-401 50.0 .250 29.3 Semi-Rigid
RG-402 50.0 .141 29.3 Semi-Rigid
RG-405 50.0 .085 ---- Semi-Rigid
A-10
Table A-8. Coaxial Cable Characteristics - Continued
CABLE TYPE NOMINAL DIAMETER (INCHES) NOMINAL REMARKS

IMPEDANCE IN CAPACITANCE IN
OHMS PFD/FT
RG-23 125.0 .65 x .945 12 Twin Conductor
(Balanced)
RG-181 125.0 .640 12 Twin Conductor
Figure A-2. Coaxial Cable
A.6. GRASSHOPPER FUSES.

See Figure A-3 for the grasshopper fuse (screw down type). See Figure A-3 for the grasshopper fuse (screw down type) character-
istics. See Figure A-4 for the grasshopper fuse (plug-in type).
Figure A-3. Grasshopper Fuse (Screw Down Type)
Table A-9. Grasshopper Fuse (Screw Down Type) Characteristics
FUSE SYMBOL CURRENT RATING (AMPS) VOLTAGE RATINGS COLOR CODE

(Volts or Less)
35A 1 1/3 90 White
35B 1 1/3 90 White
35B 2 90 Orange
A-11
Table A-9. Grasshopper Fuse (Screw Down Type) Characteristics - Continued
FUSE SYMBOL CURRENT RATING (AMPS) VOLTAGE RATINGS COLOR CODE

(Volts or Less)
35C 2 90 Orange
35D 1 1/3 90 White
35E 3 90 White
35F 1/2 90 Red
35G 3 90 Blue
35H 5 90 Green
35J 1/2 160 Red
35K 1 1/3 160 White
35L 2 160 Orange
35M 3 160 Blue
35N 5 160 Green
35P 3/4 160 Tan
35R 18/100 90 Yellow
35S 1/4 160 Pink
35T 65/100 90 Tan
Figure A-4. Grasshopper Fuse (Plug-In Type)
A-12
Table A-10. Grasshopper Fuse (Plug-In Type) Characteristics
CURRENT RATING (AMPS) COLOR CODE

18/100 Yellow
1/4 Violet
1/2 Red
65/100 Black
3/4 Brown
1 Gray
1 1/3 White
2 Orange
3 Blue
3 1/2 White and Blue
5 Green
7 1/2 Black and White
10 Red and White
All listed fuses are rated at 125 Volts alternating current (V ac) or 60 Volts direct current (V dc).
A.7. RESISTOR COLOR CODE.

See Figure A-5 for carbon composition resistor color codes. See Figure A-6 for a dot band resistor color coding that are not com-
monly used and see Figure A-5 color code chart to determine the values. Various other types of resistor codes and resistors exist that
are not shown here. Should a question arise, check the component with an ohmmeter .See Figure A-7 for metal film resistor codes
with failure rate coding. See Figure A-8 for Wire Wound (RWR) resistor codes with failure rate coding. RWR type resistors are not
often used in microwave application. Failure rate coding applies only to RWR resistors which have an established reliability rating.
A-13
Figure A-5. Carbon Composition Resistor Codes (Military Marking System)
A-14
Figure A-6. DOT - Band System
A-15
Figure A-7. Metal Film Resistor Codes with Failure Rate Coding
A-16
Figure A-8. Wire Wound Resistor Codes with Failure Rate Coding
A-17
A.8. RESISTOR NETWORKS.

Basically there are two types of resistive networks: Dual-In-line Package (DIP) and Single-In-line Package (SIP). See Figure A-9
for an example of each.
Figure A-9. Resistive Networks - DIP and SIP
A.9. CAPACITORS.
See Figure A-10 for different types of capacitors being typographically marked. See Figure A-11 for ceramic capacitors and refer to
Table A-11 for ceramic capacitor characteristics. See Figure A-12 for dipped tantalum capacitor and refer to Table A-12 for tantalum
capacitor characteristics.
A-18
Figure A-10. Capacitors
Figure A-11. Ceramic Capacitors
A-19
Table A-11. Ceramic Capacitor Characteristics
COLOR A-TEMP COEF (ppm/°C) DIGITS OF CAPACI- MULTI- E - TOLERANCE

TANCE (pfd) PLIER
EIA MILITARY B C D 10 pdf or less over 10 pfd
(%)
Black 0 0 0 0 1 ±2.0 ±20*
Brown -33 -30 1 1 10 ±0.1* ±1
Red -75 -80 2 2 100 ±0.25** ±2
Orange -150 -150 3 3 1,000 -- ±3*
Yellow -220 -220 4 4 10,000 -- +100.0*
Green -330 -330 5 5 -- ±0.5 ±5
Blue -470 -470 6 6 -- -- -
Violet -750 -750 7 7 -- -- --
Gray +150 to -1500 +30 8 8 0.01 ±0.25* +80 -20*
White +100 to -750 +330* 9 9 0.01 ±1.0 ±10
Gold -- +100 -- -- -- -- --
* EIA (formerly RETMA)
** MIL-C-20C
NOTE
General usage of these capacitors has declined in recent years.
A-20
Figure A-12. Dipped Tantalum Capacitor
Table A-12. Tantalum Capacitor Characteristics
COLOR CODE FOR CAPACITANCE IN PICOFARADS VOLTAGE RATING

1ST FIGURE 2ND FIGURE MULTIPLIER
Black 0 0 -- 4 V dc
Brown 1 1 -- 6 V dc
Red 2 2 -- 10 V dc
Orange 3 3 -- 15 V dc
Yellow 4 4 x 104 20 V dc
Green 5 5 x 105 25 V dc
Blue 6 6 x 106 35 V dc
Violet 7 7 x 107 50 V dc
Gray 8 8 -- --
White 9 9 -- --
NOTE
The color coding method can be tricky; a 220 Picofarad (pfd) (red-red-violet) might use the same shade of red for the 1st
and 2nd figures. Then the capacitor would have only two stripes, a double wide red at the top and a violet at the bottom.
Different shades of yellows and oranges are also confused.
A-21
A.10. COILS.
See Figure A-13 for coils. A silver band, wider that the other bands, near one end of the coil is the MIL identifier. The inductance
value in microhenries is indicated by three additional bands. For inductance values of 10 microhenries or more, the color code is
the same as for resistors. When either the first or second of the three bands is gold, the gold band represents the decimal point for
inductance values less than 10 microhenries. The other two colors represenet the significant figures using the same digit values as
for resistors. For small chokes, dots may be used instead of bands. Some manufacturers may not follow this marking code. If there
is any question or doubt about a chokes value, it should be checked by actual measurement on a suitable bridge.
Figure A-13. Coils
A.11. DIODES.
See Figure A-14 for a marked diode. There are many different types of diodes. Some are marked with type numbers (example:
1N645), printed on the component. Other diodes use a color code to indicate type. Most diodes have a colored double width band
close to one end, or the colored coding bands are grouped near one end. This end of the component is the cathode end. The cathode
may also be indicated by the bar of the diode symbol. An example of a banded type diode follows. Always begin reading from the
cathode end. The cathode may also be indicated by the bar of the diode symbol. See Figure A-15 for banded diodes. Always begin
reading from the cathode end. Use the resistor color code. This is followed by digits with suffix letter indication, then refer to Table
A-13 for diodes that exceed four bands. See Figure A-16 for a typical diode polarity guide.
A-22
Figure A-14. Diodes
Figure A-15. Diode Bands
For banded diodes, the standard resistor color code is used for digits with suffix letters indicated as follows.
Brown A
Red B
Orange C
Yellow D
Green E
Blue F
A-23
Table A-13. Banded Diodes that Exceed Four Bands Information
EIA TYPE 1ST BAND 2ND BAND 3RD Band 4TH Band 5TH BAND
IN 1234A Brown - 1 Red - 2 Orange - 3 Yellow - 4 Brown - A
IN 1695 Brown - 1 Blue - 6 White - 9 Green - 5 Black - 0
A-24
Esta hoja fue impresa desde la BTV y pertenece a la revisión
Figuredel manualTypical
A-16. N° 03, deDiode
fecha 18/06/2015
Polarity- Guide
VERIFICAR SU VIGENCIA
A.12. LIGHT EMITTING DIODES.

See Figure A-17 for Light Emitting Diode (LED)s. These require some special attention to properly identify the cathode terminal.
The following is a summary of some different type commercial grade LEDs and how to tell which lead is the cathode.
Figure A-17. Light Emitting Diodes
A.13. SILICON CONTROLLED RECTIFIERS.

See Figure A-18 for Silicon Controlled Rectifier (SCR)s, These are also known as Thyristors. These semi-conductors are bi-stable,
meaning they are content to stay in either of two states, on or off. When properly placed in a circuit, this device remains off until a
voltage is applied to the Gate (G). Then it conducts independently of the gate voltage. Remember that there are many different case
designs and that more detailed information about each of them is available from the individual component specifications. Triacs are
another type of Thyristor commonly used. However, there are several case designs and any attempt to show pin configurations in
this Appendix could result in confusion. It is recommended that the individual component specifications be consulted. An example
of an SCR and its schematic symbol.
Figure A-18. Silicon Controller Rectifier
A-25
A.14. TRANSISTORS.
See Figure A-19 for a typical circuit symbol for a basic transistor. C denotes Collector. B denotes Base. E signifies Emitter. See
Figure A-20 for the Field Effect Transistor (FET). See Figure A-21 for examples of other transistor base diagrams. See Figure A-22
for the Dual-In-line Package (DIP) and the metal can configurations. The basic layout is the same, although the pin count may vary.
A-26
Figure A-19. Transistors
A-27
Figure A-20. Field Effect Transistor
NOTE
Many FETs of this case design are Metal-Oxide Semiconductor (MOS) devices and require special handling to
prevent damage due to static build-up and discharge. Parts of this type are shipped with all the leads shorted
together by special clips or conductive foam.
A-28
Figure A-21. Transistor Diagrams
A-29
Figure A-22. DIP and Metal Can
A.15. RELAYS.
See Figure A-23 for an example of a common relay.
Figure A-23. Relay
A.16. SURFACE MOUNT DEVICE PACKAGES.

See Figure A-24 and Figure A-25 and Figure A-26 for examples of more common Surface Mount Device (SMD) package styles.
There are hundreds of SMDs in use in avionics equipment. The first thing to remember is that there are no industry standards for
SMD packages. Pinout and package shape can be different from one vendor to the next for many different reasons. Refer to the
applicable maintenance aid diagrams or schematic diagrams for specific device use and pinout information. Where necessary refer
to the manufacture part number and data book.
A-30
Figure A-24. Surface Mount Device Packages
A-31
A-32
523-0768039
APPENDIX B
EQUIPMENT SHELF LIFE/RECERTIFICATION
B.1. INTRODUCTION.
Rockwell Collins Avionics and Flight Entertainment equipment shelf life and recertification guidelines have been established for
products manufactured by three business units of Rockwell Collins: Air Transport Systems, Passenger Systems, and Business and
Regional Systems. These guidelines for each business unit are listed below.
B.2. ROCKWELL COLLINS AIR TRANSPORT SYSTEMS/PASSENGER SYSTEMS GUIDELINES.

B.2.1. Scope.
The following information defines shelf life guidelines for Air Transport Systems/Passenger Systems products. In addition, storage
environments are recommended that provides the maximum shelf life of Air Transport and Flight Entertainment products.
B.2.2. Definitions and Conditions.
Shelf Life (SL) refers to the period of time that an Line Replaceable Unit (LRU) can remain in storage and be expected to perform
to specifications when required. The shelf life recommendations assume a controlled environment with regard to humidity, contami-
nants, and temperature cycling/extremes. Rockwell Collins recommends the following guidelines. Storage in the original packaging
is also recommended.
Humidity: less than 60%,

Temperature: 68° ± 18°Fahrenheit (F) (20° ± 10°Centigrade (C))
Contaminants: noncorrosive
Contaminants: no excess particulates
Observing the shelf life schedule and environmental controls ensures a high probability that the unit is operational when required
for use. After the recommended time has elapsed, the unit should be recertified per the Component Maintenance Manual (CMM).
Failure to retest the unit at the end of the period decreases the probability that the unit functions according to specifications when
required for service.
B.2.3. Shelf Life Guidelines for Product Types.
There are several basic categories of equipments used in determining shelf life. These categories are based on equipment complexity,
types of components, types and quantity of mechanical components, and whether lubrication is required. The longest shelf life period
is currently set at five years. This is for the least complex types of equipments such as simple mounts which may require only visual
inspection after five years to recertify. Other categories are listed below. Note, there may be variation in shelf life within these
basic categories due to differences in equipment complexities and technology. It is important to note that the following numbers
are guidelines to assist individual airlines in determining what storage period is best to meet their needs. Airlines should determine
actual storage periods based on their own unique circumstances and practices.
EQUIPMENT SHELF LIFE

Video Tape Players 24 months
Projectors 24 months
Entertainment System Controllers 36 months
Entertainment Touch Screen Displays 12 months
B-1
appendix B 523-0768039
EQUIPMENT SHELF LIFE

Digital Computers 36 months
Digital Sensors 24 months
Analog Computers 24 months
Analog Sensors 12-18 months
EFIS Displays 12 months
Electromechanical Displays 12 months
Panels 18-24 months
Servos 10-12 months
Mounts and Connectors 36-60 months
B.2.4. Recertification.
After the specified shelf life period, the unit can be returned to storage and the shelf life time reset to zero by retesting to specifi-
cation. This recertification can vary from simple visual inspection to complete testing per the CMM depending on unit complexity.
Additional guidance on resetting the shelf life clock can be obtained by contacting the product specialist for the individual product.
B.3. BUSINESS AND REGIONAL SYSTEMS GUIDELINES.

Maintaining the environmental controls and shelf life schedule listed below ensures a high probability that the unit is operational
when required for use.
B.3.1. Storage Guidelines.
Rockwell Collins recommends the following storage conditions.
• Temperature between 68° ± 7°F (20° ± 4°C).
• Humidity between 30% and 50%.
• Storage in original shipping containers whenever possible. If this is not possible, then stored in the original bag (or equivalent
ESD protective bag), on a shelf covered with a 3/4 inch compressible, conductive foam pad.
• In an area free of dust, dirt, lint or chemical fumes.
• Instruments with CRT displays must be stored at least two feet away from highly magnetic devices (magnetrons).
B.3.2. Recertification Guidelines.

A summary of the equipment types and the recommended recertification periods are shown below. By the end of the shelf life period,
units should be recertified per the detailed performance test in the applicable manual. Connectors and mounts require only a visual
inspection.
RECERTIFICATION PERIOD
CLASS DESCRIPTION SUBCLASS MONTHS
General Computers, Radios, Control Panels All 24
CRTs Display units containing CRTs All 12
Calibrated Units which require calibration/recertification per Radio Altimeters 24
Federal Aviation Regulations Part 91 (FAR 91)
Transponders 24
Air Data Computers 24
Barometric Altimeters 12
B-2
appendix B 523-0768039
RECERTIFICATION PERIOD
CLASS DESCRIPTION SUBCLASS MONTHS
Indicators Units which have delicate jewel meter movements All 12
Servo/Gyro Units which have gears, ball bearings, bellows or All 12
other mechanical parts
Battery Units with batteries which require recharging All 3
Mounts Mechanical mounts All 60
Connectors Connector kits All 36
B-3/(B-4 Blank)
523-0768039
GLOSSARY
Term Definition
ABRASION A scraped or roughened surface on a conductor or strand of a conductor.

AXIAL LEADED COM- A component with leads that are parallel to the main axis of the component.
PONENT
BLISTERING A localized swelling or separation between any layers of the base laminate or between the laminate
and the metal cover.
BRIDGING Solder shorting or the spanning by solder of sections that should be open between two or more
conductors and/or component terminals (example: spikes, slivers, solder balls, whiskers, etc.).
BUS WIRE A length of solid wire (may be insulated).
CABLE Two or more wires secured together.
CAKING Unmelted solder paste causing a grainy appearance in the solder joint.
CASTELLATION Concave extension of the pad up to the sides of a chip carrier intended for the purpose of viewing
solder characteristics.
CHIP/FLAKE The area from which a small fragment has been dislodged from the surface of the material.
COLD SOLDER A poor solder joint caused by insufficient heat. (Insufficient heat may be the result of a dirty soldering
iron tip, a cold soldering iron, soldering too rapidly, or using a soldering iron that is too small.)
COMPONENT Electrical or electronic item (example: semiconductor, capacitor, resistor, diode, transistor, integrated
circuit, and hybrid circuit). Square pins, blade pins, blueline/blackline connectors, and backplane
(mother board) connectors are not considered components. Within this document, the term component
is equivalent to part and device.
COMPONENT FAIL- Condition in which a tested component does not meet one or more specified static or dynamic data
URE sheet parameters.
CRACK A fissure in the glass, ceramic, board material, or other item which extends completely through the
material with or without separation occurring.
CRAZE Small breaks or checks existing only on the surface of an item (usually insulating material).
CRIMP Joining of a conductor with a lug, ferrule, or other crimp device using pressure to displace the metal
in both devices.
DELAMINATE The separation of board layers.
DEPTH OF THROAT Distance from edge of substrate to point where terminal contacts the pad.
DETENT A spring-loaded device attached to a switch or similar part to assure stops at predetermined positions.
DEWETTING Nonadherence of solder to a conductor evidenced by a convex boundary between the solder and the
conductor.
DIP Dual in-line package.
EMBEDMENT A process for encasing parts in a protective material, filling the connecting areas within an assembly,
and requiring a mold or container to confine the material while it is hardening.
ENCAPSULATION A postcoating process for encasing parts with a protective material which is generally not over 100
mils thick and does not require a mold or container.
END PLAY Axial movement of a part between its extreme opposite positions.
Glossary-1
glossary 523-0768039
GLOSSARY
Term Definition
END TAIL The end of the last turn of a wrapped wire connection.
END TURN The last or tap turn of a wrapped wire connection.
ESDS Electrostatic discharge sensitive - Applies to a component that may be damaged by static discharge.
These components need special handling.
EYELET A rolled or flared fastener used to mechanically secure two or more parts together.
FEATHERING Smooth, continuous solder flow to land pattern (not globular in appearance) from leadless device.
FERRULE A short tube.
FILLET The concave surface of a solder extending between a lead and pad (or two leads) joined by soldering.
The boundary of the fillet must gradually taper to a feathered edge away from the joint.
FLAGGING A lead which has been cut with a rotary cutter and, as a result, part of the lead material is deformed
into a flat, thin flag.
FLATPACK A flat, rectangular integrated- or hybrid-circuit package with leads coming from the sides of the
package, in the same plane as the package.
FLUX A chemically active compound that aids in the wetting of metals with solder.
FROSTY SOLDER A solder joint that has a porous "gray tin" appearance, caused by overheating or reheating too many
times.
GAP SIZE Opening in clip area of terminal designed to assure a mechanical hold on the substrate.
GEAR ALIGNMENT The lateral (width of tooth) engagement of mating gear teeth.
GEAR BACKLASH The play or lost motion between two or more gears caused by the clearance between mating gear teeth.
GEAR LOADING The use of spring device(s) to eliminate gear backlash.
GEAR MESH The depth of tooth engagement of mating teeth.
GEAR RUNOUT The wobble evident during rotation of a gear.
GEAR TOOTHINESS The irregular or rough feel of a gear train due to lack of clearance between teeth or a mismatch
of engaging tooth contours.
HIGHTURN A turn of wire raised off the post by interference with adjacent turns of wire. This condition is caused
by the operator applying excessive pressure to the wrapping tool during the wrapping process.
HORIZONTAL X axis.
INDENTATION A deformation of the surface of a conductor or strand of a conductor by a dull or blunt instrument.
INSULATED WIRE A single insulated metallic conductor of solid, stranded, or tinsel construction.
INSULATION The nonconductive coating over wire to prevent accidental shorting to other wires or circuits.
LACING CORD A special cord used to secure insulated wires.
LACING STITCH A continuous wrap of a group of wires using lacing cord.
LAND PATTERN Pad surface attached to board circuit for the purpose of soldering leadless devices to circuits.
LCC Leadless chip carrier.
LEACHING (ALLOY- Migration of metallization into solder joint during soldering (loss of solderable surface).
ING)
LEAD EXTENSION That part of a lead or wire that extends beyond the solder connection.
Glossary-2
GLOSSARY
Term Definition
LEADLESS DEVICE Component not having a lead which extends beyond the body of the component.
LEAD TURN The first turn of the wrapped wire connection.
LEG LENGTH Distance from substrate to end of leg with carrier strip removed.
LOCKWASHER A washer placed under a nut to prevent the nut from backing off or loosening.
LOSSY Material which dissipates more than the usual energy due to high resistance to the flow of RF current.
MANUAL WIRE Wrapping where the wrapping assembly (bit, sleeve, and motor assembly) is handheld and manually
WRAPPING positioned.
MARKING Any method of identification of parts, assemblies, or equipments stating tolerances, part numbers,
dates, manufacturer, ratings, or similar characteristics.
MEASLING/CRAZING Measling appears as discrete spots or "crosses" below the surface of the base laminate. Crazing
appears as connected white spots on or below the surface of the base laminate.
METALLIZATION Metal fired onto ceramic chip carriers, resistors, capacitors, etc, for the purpose of solder adhesion.
METAL-OXIDE SEMI- Electrical device susceptible to damage from electrostatic discharge.
CONDUCTOR (MOS)
MICROSTRIP A microwave transmission component in which a single conductor is supported above a ground
plane. Also called strip line.
MOUNTING PLANE Land pattern on surface of the board.
NICK
NICK A partial severance of a conductor or strand of a conductor by a sharp instrument.
ODP Ozone depletion potential.
OVERWRAP The piling up of a wire turn or turns on a previously made turn within the same wrapped wire
connection.
PAD/LAND That portion of a conductive pattern usually, but not exclusively, used for the connection or attachment
of components/leads.
PART LEAD A solid or stranded wire that serves as a connection and, in some cases, as mechanical support for
small electronic parts or assemblies.
PERPENDICULAR Z axis; the property of being at right angles to a plane.
PLATED THRU HOLE A hole in which an electrical connection is made between internal and external conductive patterns, or
both, by the deposition of metal on the wall of the hole.
PLCC Plastic leaded chip carrier.
Glossary-3
GLOSSARY
Term Definition
POINT-TO-POINT An individual wire supported only at the terminations and not a part of a cable.
WIRING
POTTING An embedding process where the protective material bonds to the mold or container so that it becomes
integral with the item.
RADIAL LEADED (Referred to as nonaxial leaded component) A component with lead egress perpendicular to the
COMPONENT primary axis of the component.
SCORCHING A brown discoloration (charring) of the base laminate. (This charred discoloration is not to be
confused with the brown oxide transfer discoloration visible on boards immediately after etching.)
SCR Silicon controlled rectifier.
SCREW, BINDING A screw which is undercut beneath the head. It is used in electrical applications because its undercut
HEAD binds and eliminates fraying of stranded wire. Not recommended as a Phillips recessed head.
Glossary-4
GLOSSARY
Term Definition
SEMIAUTOMATIC Wrapping where the wrapping assembly (bit, sleeve, and motor assembly) or the terminal posts or
WIRE WRAPPING both are automatically positioned for wrapping.
SHIELD A conductive sheath (usually braided) over insulated wire.
SHRINK SLEEVING Sleeving that shrinks as heat is applied, resulting in a tight fit without other means of support.
SL Shelf life.
SLACK The amount of flexure beyond the minimum distance between two points.
SLEEVING A length of insulation installed over bare wires, component leads, or other items to provide insulating
properties.
SLIVERS Portions of tin-lead (solder) plating overhang on conductor edges partially or completely detached.
SMD Surface mounted device.
SOIC Small outline integrated circuit.
SOLDER A single metal or an alloy of two or more metals which, when melted, is used to join metallic surfaces
through the phenomenon of wetting. Usually, the major constituents are tin and lead.
SOLDER BALLS Small spheres of solder adhering to laminated, mask, and/or conductor surfaces.
SOLDERED CONNEC- An electrical connection that uses solder for bonding two or more metals with an alloy (solder).
TION
SOLDER PASTE Extremely small solder balls combined with flux and nondrying agents into a paste consistency.
SOLDER PINHOLE A depression or hole in a soldered connection, the extent of which cannot be determined by normal
visual examination.
SOLDER VOID A depression or hole in a soldered connection, the extent of which can be determined by normal
visual examination.
SOT Small outline transistor.
SPLICING Any process of soldering, crimping, or welding of leads or wires in which the point of connection is
not supported by a terminal and the assembly is not embedded.
STANDOFF Distance that terminal holds substrate away from mounting board.
STICKING Tiny balls, flecks, or specks of solder adhering to laminate or mask.
SUBSTRATE Any material which provides a supporting surface for other materials.
TERMINAL A tie-point device used for making electrical connections. Solder type terminals in common use
include turret, bifurcated (slotted), hook, eye, tab, and solder cup.
Glossary-5
GLOSSARY
Term Definition
TERMINAL POST A rigid metallic post of rectangular or square cross section on which a solid round wire is wrapped to
provide a mechanical and electrical connection.
THIN FILM Process of depositing conductive or insulating material on a substrate in thin layers and patterns to
form electronic components.
THROUGH VIA A via hole that is connected between the primary side and secondary side of a printed wiring board.
TIE A length of lacing cord or a special plastic device wrapped around two or more wires to form a cable
or to secure them to another part, having a terminating tie for each wrapping.
TIGHTNESS All screw-type fasteners should be tight. The word "tight" means the screw should be firmly secured
and that there should be no relative movement possible between the attached parts.
TINNING The process of applying a thin coating of solder over a conductor end to facilitate soldering to
a terminal or other device.
TOROID A "doughnut-shaped" coil or transformer.
TUBELET A funnel-flange eyelet flared approximately 90 degrees after insertion.
UNWRAPPING TOOL A tool used to unwrap the wire turns of a wrapped-wire connection from a terminal post.
VAPOR PHASE RE- A hot vapor process used to heat solder and assembly, and bring solder to the molten stage for
FLOW adherence of component to assembly.
VERTICAL Y axis.
VIA HOLE A plated thru hole used as a through connection but in which there is no intention to insert a compound
lead or other reinforcing material (used only on sequentially laminated boards).
WAVE SOLDERING A machine technique for producing soldered joints by using a shaped orifice and a pumping system
to produce a standing wave of liquid solder through which the object being soldered can be passed.
Cascade soldering utilizes two or more standing waves of liquid solder in sequence.
WEBBING A continuous film or curtain of solder parallel to but not necessarily adhering to a surface or between
separate sections of circuitry that should be free of solder.
WEEPING Adhesive preform that has melted and spread into the solder or on pad surface to be soldered.
WETTING The adhesion of a liquid to a solid surface.
WHISKERS Slender acicular (needle-shaped) metallic growth between conductors and/or lands.
WIRE A length of solid, stranded, or tinsel conductor (includes component leads unless otherwise specified).
WIRE DRESS The direction or positioning of wiring within the mechanical assembly to provide optimum spacing
and location.
WIRE ROUTING The physical placement or orientation of wires.
WIRE STRIPPING The removal of insulation from an insulated wire.
WIRE TURN (or turn) One complete turn of wire around the terminal post which touches all corners of the terminal post. To
determine the number of turns on a terminal post, find the first corner the wire touches and count the
wires crossing this corner. The number of turns is one less than this number.
WORKING SURFACE The entire surface of an insulating material from which a terminal, pin, or lead extends.
Glossary-6
GLOSSARY
Term Definition
WRAPPED WIRE CON- This connection consists of a helix of continuous, solid, uninsulated wire tightly wrapped around the
NECTION (or wrap) terminal post to produce a mechanically and electrically stable connection. The number of turns
required depends on the gauge of wire used. In addition to the length of uninsulated wire wrapped
around the terminal post, an additional turn of insulated wire should be wrapped around the terminal
to help ensure better vibration characteristics.
WRAPPING LEVEL The section of terminal post occupied by a wrapped wire connection. For this specification each
terminal has one, two, or three wrapping levels. The first level is closest to the terminal base, the second
level is the middle wrapping area, and the third level is nearest the top or free end of the terminal.
WRAPPING TOOL A tool consisting of a bit and sleeve assembly required to wrap a solid conductor wire around a
terminal post.
Z MAX The maximum height dimension allowed for all components mounted on printed circuit boards as
determined by the applicable design engineer.
Z MAX BOTTOM The measurement from the TOP major surface of the board (prior to postcoating) to the top of the
tallest component on the BOTTOM side of the board.
MAX TOP The measurement from the TOP major surface of the board (prior to postcoating) to the top of the
tallest component on the TOP side of the board.
Glossary-7/(Glossary-8 Blank)
523-0768039
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Table 1. Related Specifications

2. ACRONYMS AND ABBREVIATIONS.

ATR Air Transport Rack

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3. OZONE DEPLETING CHEMICALS.

Group I (from section 602 of the CAA)

3.1. Class 2 Ozone Depleting Chemicals.

Table 1. Eliminated Class 2 Ozone Depleting Chemicals

CHEMICAL NAME ODP1 CAS NUMBER

Table 1. Eliminated Class 2 Ozone Depleting Chemicals - Continued

HCFC-133a (C2H2F3C1) 0.02-0.06 75-88-7

Table 1. Eliminated Class 2 Ozone Depleting Chemicals - Continued

HCFC-252 (C3H4F2C13) 0.005-0.04 819-00-1

Figure 1. Electrostatic Discharge Label

10. LEAD FREE.

Figure 1-1. Chemical Hazard Label

Table 1-1. National Fire Protection Association Codes

CODE BLUE RED YELLOW

Table 1-1. National Fire Protection Association Codes - Continued

CODE BLUE RED YELLOW

Table 1-2. Non-Alcohol Solvents

ITEM (PURITY) CAS1 ROCKWELL NFPA2 HAZARD DESCRIPTION

Acetone, Spec 67-64-1 005-2954-130 Purer grade for critical cleaning

Naphtha 8030-30-6 005-2954-060 Removes adhesive residue of tape and

Naphtha, VM & P 64742-89-8 005-2954-110 For use in critical cleaning applications

Table 1-2. Non-Alcohol Solvents - Continued

ITEM (PURITY) CAS1 ROCKWELL NFPA2 HAZARD DESCRIPTION

Toluene 108-88-3 005-2954-090 Thinner and remover of Humiseal 1B31

Xylene 1330-20-7 005-2954-100 Thinner and remover of Humiseal 1B31

n-Heptane 142-82-5 005-2954-030 Cold cleaning, removes silicon based

HFE-7100 Blend 838-2545-020 Hydrofluoroether vapor degreasing solvent

Dry Cleaning 8052- 41- 3 None Fast evaporating solvent

Table 1-2. Non-Alcohol Solvents - Continued

ITEM (PURITY) CAS1 ROCKWELL NFPA2 HAZARD DESCRIPTION

Table 1-3. Alcohols

ITEM CAS1 ROCKWELL NFPA2 HAZARD DESCRIPTION

Alcohol, 67-63-0 005-2941-080 Removes excess rosin flux, cleans variable

Table 1-3. Alcohols - Continued

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