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 Hyperscale Cooling
Strategies
Tom Cabral, CPI Product Application Specialist

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Three Laws of Thermodynamics
• Describes systems that exchange energy with each other or some environment

‒ The system doing the work or heat being absorbed and number of particles could be changed

1st 2nd 3rd

Energy can change
forms, but is neither
created or destroyed.
A system cannot convert
all absorbed heat into
work. Machines that are
one hundred percent
efficient do not exist.
There is a lowest
temperature, at which a
system is maximally
ordered, and where the
entropy trends to zero.

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Definitions
• Airflow

‒ Air passing over the device chip to absorb the heat energy and
exit (typically the rear of the device).

• Hybrid – rear door heat exchanger

‒ Air still passing over the chip, but liquid is introduced at the
cabinet level.

• Direct to Chip

‒ Refrigerant / liquid is channeled over the chip to absorb the

heat energy.

• Full Immersion

‒ All electronic circuitry is submerged in liquid bath.

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 Strategies for Air Isolation

Hot Air Isolation

Hot Aisle Containment (HAC) Cold Aisle Containment (CAC) (Chimney or
Vertical Exhaust Duct
VED)

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Strategies for Air Isolation

Feature VED CAC HAC

Separates Hot Waste Air Yes Yes Yes

Working Environment 77-80°F 95-130°F 95-130°F

N+1 Cooling Deployment Per Room Per Aisle Per Room

Thermal Ride Through Mass 15X X 13.5X

IT Deployment Increments Cabinet Pair of Rows Pair of Rows

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Airflow

GOOD Airflow
Starts in the Cabinet

Server Server

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Liquid Rear Door Heat Exchangers
• Water or refrigerant

• Claims of up to 100kW

• Transition frames for racks

• Allows standard hardware usage

• Doesn’t require aisle containment

• Does require plumbing water/refrigerant

to the cabinet

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D2C – Direct to Chip – Cold Plate
• Water, treated water or dielectric fluid

• Strong acceptance by server manufacturers

• InRack (80kW) or Larger CDU’s for multiple racks

• Warm-water loop can be used to reduce energy consumption

• Access to PDU’s more challenging

‒ generally behind manifolds

• Leak prevention/confidence in solutions to prevent leaks are

very important – via connector types or other means/vacuum

• Can be single-phase or two-phase

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D2C – Direct to Chip – Cold Plate

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Liquid

• Dielectric solution
• All technology components must be specifically
designed for this solution
• Can get more ‘compute’ in smaller square footage
• higher power usage effectiveness (PUE)

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Liquid
• Water / refrigerant absorbing the heat directly from the electronics

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Questions?

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