Moto g32 Troubleshooting V1.

Artificial

Audit

Approved

Date 2022-07-09

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 Modify the record
No. Time Version Modifier Modify the reason Note
1 2022-5-9 V1.0 create

MENU

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3. BB ................................................................................................................................................. 4
3.1 Overview ............................................................................................................................. 4
3.1.1 Memory .................................................................................................................... 4
3.1.2 Power management .............................................................................................. 5
3.1.3 Battery ...................................................................................................................... 5
3.1.4 38.4M crystal oscillator .......................................................................................... 5
3.1.5 Audio ........................................................................................................................ 6
3.1.6 I/O interface .......................................................................................................... 6
3.1.7 Display ..................................................................................................................... 6
3.2 Common fault analysis and maintenance .......................................................................... 6
3.2.1 Power failure check ............................................................................................... 6
3.2.2 Audio failure ........................................................................................................... 8
3.2.3 USB fault ............................................................................................................... 13
3.2.4 LCD fault ............................................................................................................... 14
3.2.5 Camera fault ........................................................................................................... 16
3.2.6 Flash failure .......................................................................................................... 20
3.2.7 USIM / T-Flash card failure ................................................................................ 20
3.2.8 Motor failure ......................................................................................................... 21
3.2.9 G-Sensor failure ..................................................................................................... 22
3.2.10 M-Sensor failure .................................................................................................. 22
3.2.11 PL-sensor failure.................................................................................................. 23
3.2.12 Fingerprint fault .................................................................................................. 23
3.2.13 Touch Panel fault ................................................................................................. 24
3.2.14 Failure to charge................................................................................................ 24
3.2.15 Unable to power on fault .................................................................................. 29
3.2.16 Automatic power on........................................................................................... 29

3
3. BB
3.1 Overview
The functions completed by baseband circuit mainly include: program data storage,

keyboard input, communication with RF module, RF power control, power management

module control, ruim card interface, serial download interface, camera, T-Flash, Bluetooth,

a sensor, PL sensor, fingerprint function and MMI (human machine interface, such as

display, backlight, buzzer, speaker, microphone, motor, etc.). The baseband part has

regular modules corresponding to the following functions. The functions of each module

are briefly described as follows:

3.1.1 Memory
The baseband part has an UMCP of UFS + lpddr4X SDRAM. UFS + lpddr4X is

configured with 64GB + 4GB,128GB+4GB,128GB+6GB storage capacity, which stores

communication protocol layer and some application layer software, as well as various

system parameters, such as RF control calibration parameters, audio signal correction

value, IMEI number and other important data, and stores user set data, such as telephone

number code, call volume and tone; The storage capacity of SDRAM is 4GB&6GB, which

stores temporary variables during the operation of mobile phone programs.

4
3.1.2 Power management
The power management part consists of. The main functional modules of mt6358

include: 1) input power management; 2) Output power management; 3）housekeeping；4)

IC interface; 5) User interface; 6）housekeeping； 7）GPIOs。

PM6225 Functional block diagram

3.1.3 Battery
This battery pack is a 3.87V nominal lithium-ion secondary battery assembly with a

typical capacity of 5000mAh.

3.1.4 38.4M crystal oscillator
Provide 26M clock of the system;

If the crystal is defective, the phone cannot be turned on.

5
3.1.5 Audio
The microphone adopts two silicon mics, one mic on the main board and one mic on

the small board. The output impedance is Max 400  and is connected to the small PCB

by patch.

The earphone is a standard 3.5mm earphone interface with 6pin pad.

The receiver adopts the size of 10.0mm * 8.0mm * 2.4mm, which is a shrapnel

interface.

Speaker 采用 BOX 组件，FPC 同小板连接。

3.1.6 I/O interface
I / O connector is the interface of type-c. It is mainly used for downloading software,

picture information, etc.

3.1.7 Display
The main screen is 6.49 FHD+ LCD Mid-HiD 90Hz COG.
3.2 Common fault analysis and maintenance
After the SMT of the production line is completed, X-ray inspection will be conducted

before plate cutting. According to the actual situation, X-ray inspection cannot ensure

100% good products, so some faulty plates may be omitted after X-ray inspection. If a

faulty board is found during the test, the first step is to re conduct X-ray inspection, and

carefully check whether there are continuous welding, lap welding, false welding and

other problems. If it is normal, analyze and locate it one by one according to the following

conditions.
3.2.1 Power failure check
The main fault phenomena caused by power failure are: unable to start up, high

leakage current during shutdown and high current during startup. The main causes of this

problem are: false soldering, power filter or ESD device short circuit to ground, burning of

devices connected to power supply, etc.

The steps to locate and solve such problems are as follows:

1， Check the welding of the components connected to the power supply, whether there

is faulty welding, or whether it is connected with tin with its surrounding components.

2， Use a multimeter to eliminate whether there is a short circuit between the power

supply and the ground, and check the causes of the short circuit step by step (mainly:

6
 Tin connection, IC burning, ESD protection device breakdown, capacitor breakdown,

etc.).

3， Start up and test whether the power output is normal.

If the output value of a power supply is abnormal, check whether there is a problem in

the welding of the relevant filter capacitor and whether it is broken down. If the filter

capacitor is broken, replace it; After troubleshooting one by one, the damage of the main

chip can be located at last.

The test position of each power supply and its normal startup value are shown in the

table below
No. Items Test point Nominal Notes
value
System power supply
1 VIO_OUT C1001 1.82

System LDOS power supply

2 S6A C1509 1.33

CAMERA VDDA power supply

3 S7A C1512 2.06

System power supply

4 S5A C1018 0.82

System LDOS power supply

5 L2A C1011 0.75

6 S3A_S4A C1201 0.68 CX MODEM power supply

7 L3A C1020 0.64 System LDOS power supply
Battery supply voltage
8 L9A C1009 1.81

System LDOS power supply

9 L8A C1609 0.4

RF power supply
10 L13A C1615 1.76

RF power supply
11 L1A C1603 0.96

System LDOS power supply

12 L7A C1608 1.33

System LDOS power supply

13 L18A C1613 1.24

Memory power supply

14 S8A C1003 1.14

Memory power supply

15 L6A C1607 0.61

7
 System power supply
16 L4A C1606 0.94

System power supply

17 L12A C1115 1.81

System LDOS power supply

18 L10A C1618 1.82

System LDOS power supply

19 L15A C1125 3.07

Memory power supply

20 L11A C1725 1.81

Memory power supply

21 L24A C1720 2.96

SD CARD power supply

22 L5A R3204 2.91

SD CARD power supply

23 L22A C1616 2.91

APC power supply

24 S1A_S2A C1242 0.88

3.2.2 Audio failure

The audio part mainly includes speaker, receiver, MIC and headset. Firstly, according

to the bad phenomenon, distinguish which part has the problem, and then analyze

according to the following modules.

（1）Speaker circuit

The speaker of m328 mobile phone is on the small board and connected to the

motherboard through FPC. External power amplifier is adopted, and the channel device

is on the motherboard. The schematic diagram of speaker audio output is as follows:

8
 3A L2302 1UH 4.7A 20%
VBATT

C2304

C2305

C2306
1UF 10V 20%

10UF 10V 20%

100NF 10V 20%

VREG_L9A

C2310

C2
B6

E1
E2
E3
4.7UF 6.3V 20%

SW_0
SW_1
SW_2
DVDD

VBAT
F6 C2314 22nF 20 %16V C2315 100nF 25V 20%
B2 VREG
[5,23] SMARTPA_I2S_DATA0 B1 DATAI F1
[5,23] SMARTPA_I2S_DATA1 C2317 10UF 25V 20%
A3 DATAO VBST_0 F2
[5,23] SMARTPA_I2S_WS A2 WCK VBST_1 F3 C2318 10UF 25V 20%
[5,23] SMARTPA_I2S_SCK BCK VBST_2
B5 F4 C2319 10UF 25V 20%
[5] SPK_SMARTPA_INT INTN PVDD_0

VREG_L9A R2303 NC/10K 5% *

C2320 NC/100pF 50V 5%/10%
A4 R2304 120R 5% /NC
[5,18,23,30,44] SAR_I2C_SCL A5 SCL
[5,18,23,30,44] SAR_I2C_SDA SDA E5 B2303 470R 1.6A SPK_OUT_P [31]
VOP
A1 DCR＜0.1Ω
VLDO
E6 B2309 470R 1.6A SPK_OUT_N [31]

DGND_0
DGND_1

PGND_0
PGND_1
B4 VON
AD

BGND
R2306 120R 5% /NC

C2327

C2328

C2329

C2330
C2326
1UF 10V 20% U2302

D4
E4

D3

D5
D6
AW88261

100pF 50V 5%/10%

100pF 50V 5%/10%

33pF 50V 10%

33pF 50V 10%

SH2300
SH2301

Sub Connector

3
FV3101

3
1

2
C3102
C3101

2
NC/33pF 50V 10% NC/1UF 25V 10%

USB_VBUS_C
VREG_L9A
SH3107

SH3108
R3102

C3103
J3101 C3104
54

53

52

51

NC/33PF
100K 5% *

NC/33PF
54

53

52

51

1 50
2 1 50 49
3 2 49 48 USB0_HS_DM [4,18,33]
[5] GRFC2_PRX_TUNER_V3 3 48 USB0_HS_DP [4,18,33]
4 47
[5] GRFC1_PRX_TUNER_V2 5 4 47 46
[5] GRFC0_PRX_TUNER_V1 5 46
6 45
VREG_L21A 7 6 45 44 PRX_SAR_REF [44]
8 7 44 43 PRX_SAR_SENSOR [44]
[5] EINT_ANT_CABLE_DET 9 8 43 42
10 9 42 41
11 10 41 40
[23] SPK_OUT_P 12 11 40 39 SPK_OUT_N [23]
13 12 39 38
14 13 38 37
15 14 37 36 Fuel_VSS [18]
16 15 36 35 VIB
[22] AMIC1_INM 16 35 USB_CC2 [18,33]
17 34
[22] AMIC1_INP 17 34 USB_CC1 [18,33]
R3103 NC 18 33
[22] MIC_BIAS1 19 18 33 32
20 19 32 31 HS_DET_CON [24]
[22,24] B2B_AMIC2_INM 20 31
21 30
[22,24] B2B_AMIC2_INP 22 21 30 29 HSR_CON [24]
23 22 29 28
[18,33] BAT_TEMP_DET_FG 24 23 28 27 HPH_REF_CON [24]
24 27
FV3102

FV3103

25 26
[50] FM_ANT_P 25 26 HSL_CON [24]
55

56

57

58
55

56

57

58

OK-118RF050-2-35-006A
C3112

C3111

C3110
C3105

C3106

C3109

C3108

FV3104

FV3105

C3107

2
NC/33PF

NC/33PF

NC/33PF

NC/33PF

NC/33PF

NC/33PF

NC/33PF

LESD11LL5.0CT5G

LESD11LL5.0CT5G
NC/33PF
LESD8D12CAT5G

LESD8D12CAT5G
1
1

1
SH3105

SH3106

SH3101
SH3104

SH3103

SH3102
2
2

Speaker circuit
Common faults and causes of speaker are:

1. The SPK does not ring. Reasons: 1) whether the SPK itself is broken or missing

SPK; 2) Whether the SPK path device on the small board is abnormal; 3) Whether the FPC

connecting the main board and the small board is loose or falls off; 4) Whether the audio PA

(u1801) is defective; 5) Above is spkr1_ OUT_ Whether there is a problem with the device

on the P / N; 6) Software problems.

2，Small SPK ring tone or noise: 1) the software volume is not set correctly; 2）

SPKR1_ OUT_ Whether the ground capacitance of P / N and ESD device are stuck

reversely or broken down and short circuited; 3) SPK body reason.

3，There is no ringing tone when the machine is switched on and off, but the

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engineering test SPK OK: 1) the profile setting will turn off the ringing tone when the

machine is switched on and off; 2) There is a software problem and there is no boot ring;

（2）Receiver circuit

The handset of the mobile phone is embedded in the front shell of the mobile phone

and connected with the motherboard through a shrapnel type. Mainly used for

communication. The receiver circuit diagram is shown in the figure below.

J2301 J2302
1SP16000441 1SP16000441

1
1

1
[23] REC_OUT_P
REC
[23] REC_OUT_N

FV2300 FV2301

NC NC

Receiver circuit

Common failures and causes of receiver are:

1、 The receiver has no sound: 1) the receiver is poorly assembled and the

contact between shrapnel and board is poor; 2）CDC_ EAR_ Faulty soldering

of devices on P / N line; 3) The receive body is broken; 4) Volume setting or

software problem.

2、 Receiver noise or low volume: 1) poor receiving materials; 2）CDC_ EAR_

The device on the P / N line is welded or burned; 3) Software problems.

10
（3） Mic circuit

1. M328 contains 2 mic circuits. One is the main mic on the small board and the other is

the sub mic on the main board. The 2 MICs are SMD silicon MICs.

2.The schematic diagram of auxiliary mic circuit on the main board is shown in the figure

below:

Sub Connector

3
FV3101

3
1

2
C3102
C3101

2
NC/33pF 50V 10% NC/1UF 25V 10%

USB_VBUS_C
VREG_L9A
SH3107

SH3108
R3102

C3103
J3101 C3104
54

53

52

51

NC/33PF
100K 5% *

NC/33PF
54

53

52

51

1 50
2 1 50 49
3 2 49 48 USB0_HS_DM [4,18,33]
[5] GRFC2_PRX_TUNER_V3 3 48 USB0_HS_DP [4,18,33]
4 47
[5] GRFC1_PRX_TUNER_V2 5 4 47 46
[5] GRFC0_PRX_TUNER_V1 5 46
6 45
VREG_L21A 7 6 45 44 PRX_SAR_REF [44]
8 7 44 43 PRX_SAR_SENSOR [44]
[5] EINT_ANT_CABLE_DET 9 8 43 42
10 9 42 41
11 10 41 40
[23] SPK_OUT_P 12 11 40 39 SPK_OUT_N [23]
13 12 39 38
14 13 38 37
15 14 37 36 Fuel_VSS [18]
16 15 36 35 VIB
[22] AMIC1_INM 16 35 USB_CC2 [18,33]
17 34
[22] AMIC1_INP 17 34 USB_CC1 [18,33]
R3103 NC 18 33
[22] MIC_BIAS1 19 18 33 32
20 19 32 31 HS_DET_CON [24]
[22,24] B2B_AMIC2_INM 20 31
21 30
[22,24] B2B_AMIC2_INP 22 21 30 29 HSR_CON [24]
23 22 29 28
[18,33] BAT_TEMP_DET_FG 24 23 28 27 HPH_REF_CON [24]
24 27

FV3102

FV3103
25 26
[50] FM_ANT_P 25 26 HSL_CON [24]
55

56

57

58
55

56

57

58

1
OK-118RF050-2-35-006A
C3112

C3111

C3110
C3105

C3106

C3109

C3108

FV3104

FV3105

C3107

2
NC/33PF

NC/33PF

NC/33PF

NC/33PF

NC/33PF

NC/33PF

NC/33PF

LESD11LL5.0CT5G

LESD11LL5.0CT5G
NC/33PF
LESD8D12CAT5G

LESD8D12CAT5G
1
1

1
SH3105

SH3106

SH3101
SH3104

SH3103

SH3102
2
2

Sub MIC

B3102 0R/0402
MIC_BIAS4 [22]
SH3403
1

MIC2302
1 2 B3103 0R/0402
1

Power Output AMIC3_INP [22]

MIC Shield
C5355

4 3 100pF 50V 5%/10%

NC GND
B3104 0R/0402 AMIC3_INM [22]
R5308

MSM381A2718Z9EM2E
FV5104

FV5103 C5358 C5359 C5356 C5357

1

1
C5360

C5361

33pF 50V 10%

33pF 50V 10%

1

100nF 6.3V 20%

33pF 50V 10%

0R 5% *

2
NC/33pF 50V 10%

NC/33pF 50V 10%

2

2
SH3405

NC/PESDNC2XD5VBF

SH3406

NC/PESDNC2XD5VBF
SH3404

SH3407

SH3408

The schematic diagram of small board main MIC is as follows:

11
 Main MIC
R1001 0R 5% *
MIC_BIAS1 [1]

FV1002
C1013 C1014 Note
Route MIC_IN1_P and PM_MIC_GND as differential traces.

33pF 50V 10%

100nF 6.3V 20%

SH1005

SH1006
NC/LESD11D5_0CT5G

MIC1001
1 2 R1002 0R 5% * AMIC1_INP [1]
SH1000 Power Output

1
C1015
1
MIC Shield 100pF 50V 5%/10%
4 3 R1005 0R 5% * AMIC1_INM [1]
NC GND

MSM381A2718Z9EM2E

FV1003
C1016 C1017
R1007

0R 5% *

33pF 50V 10%

33pF 50V 10%

NC/LESD11D5_0CT5G

SH1012

SH1014
SH1013

C1002

NC/33pF 50V 10%

USB_VBUS_C

51

52

53

54

J1004
51

52

53

54

50 1
49 50 1 2
48 49 2 3 USB0_HS_DM [1]
[2] GRFC2_PRX_TUNER_V3 47 48 3 4 USB0_HS_DP [1]
[2] GRFC1_PRX_TUNER_V2 46 47 4 5
[2] GRFC0_PRX_TUNER_V1 45 46 5 6
VREG_L21A 44 45 6 7 PRX_SAR_REF [2]
43 44 7 8 PRX_SAR_SENSOR [2]
[2] EINT_ANT_CABLE_DET 42 43 8 9
41 42 9 10
40 41 10 11
[1] SPK_OUT_P 39 40 11 12 SPK_OUT_N [1]
38 39 12 13
37 38 13 14
36 37 14 15 Fuel_VSS [18]
35 36 15 16 VIB
[1] AMIC1_INM 34 35 16 17 USB_CC2 [1]
[1] AMIC1_INP 33 34 17 18 USB_CC1 [1]
[1] MIC_BIAS1 32 33 18 19
31 32 19 20 HS_DET_CON [1]
[1] HS_MIC_N_CON 30 31 20 21
[1] HS_MIC_P_CON 29 30 21 22 HSR_CON [1]
28 29 22 23
[1] BAT_TEMP_DET_FG 27 28 23 24 HPH_REF_CON [1]
26 27 24 25
[1] FM_ANT_P 26 25 HSL_CON [1]
58

57

56

55
58

57

56

55

OK-118RF050-2-35-006A

Common faults and causes of MIC are:

1. MIC is unable to send or record: 1) mic is poorly welded; 2) Mainboard mic_ Faulty
soldering of devices on P / N line; 3) Short circuit to ground of filter capacitor and ESD
device; 3) Mic body is broken; (if there is no sound after mic recording, the speaker
channel may also be broken).
2. Mic has noise or low sound: 1) mic body is broken; 2) Mic dust screen is not pasted,
and ash is injected into the sound hole; 3) Mic sealant sleeve is not installed; 4) Software
problems; 5) The conductive cloth on the small board is not pasted as required;
（4）Headphone circuit
M328 mobile phone uses standard 3.5mm earphone. The circuit schematic diagram

is as follows:

12
 Note
Route MIC_IN2_P and PM_MIC_GND as differential traces.
C1004 C1003
HS_MIC_P_CON [1]
33pF 50V 10% HS_MIC_N_CON [1]
100pF 50V 5%/10%

SH1003
C1011 1nF 50V 20% R1006 NC/0R

FV1001 C1012
ESD5651N-2/TR

SH1017
33pF 50V 10%

SH1004
6 1.8K
RESERVED B1001 1.8K
1
MIC B1002
4 HSL_CON [1]
L 1.8K
J1003 5 B1003
D HS_DET_CON [1]
3 1.8K
R B1004
2
GND HSR_CON [1]
1.8K
PH132-0B17C36M B1005
HPH_REF_CON [1]

R1011

C1024
C1018

FV1011

FV1012

FV1013
C1019 C1022 C1021 C1023 C1020
FV1010

1nF 50V 20%

1nF 50V 20%

33pF 50V 10%

33pF 50V 10%

33pF 50V 10%

33pF 50V 10%
BLM15PD121SN1*

NC/100PF

SH1007

SH1008

SH1009

SH1010

SH1011
ESD5651N-2/TR ESD5651N-2/TR
LESD11D5_0CT5G

NC/ESD5651N-2/TR

C1025 NC/100PF

L1001 68NH 80MA 5% C1026 39pF 50V 5% R1012 100pF 50V 5%/10% FM_ANT_P [1]
SH1016

SH1015

C1027

NC/18PF

3.5mm Headphone interface circuit

Common faults and causes of headphones are:

1、 There is no sound in the headset: 1) the headset is not plugged in place; 2)

Faulty soldering of earphone connector pad; 3）HPH_ Whether the devices on

the R / L line are soldered or damaged; 3) Whether the TVs to ground and the

capacitance to ground are damaged; 4) Damage or faulty soldering of relevant

circuits inside the chip;

2、 Unrecognized when the headset is plugged in and pulled out: 1) headset

detection HS_ Faulty soldering of circuit devices on det or whether the devices

are damaged; 2) Whether the shrapnel of earphone base is in good contact with

the main board; 3) ESD device is short circuited to ground; 4) Software reasons.

3、 MIC of earphone does not send calls: 1) the earphone is not plugged in place;

2）MIC_ Bias2 and amic2_ Faulty soldering of InP circuit device or device

damage.
3.2.3 USB fault
In the test process, the fault of "failed to open serial port" often occurs. The main

causes of this failure are:

1） If the mobile phone cannot be turned on, please refer to the maintenance of

failure to turn on;

2） The USB test point is oxidized and does not have good contact with the fixture;

3） Faulty soldering of USB connector;

13
 4） Due to the USB circuit itself, please check whether the device is soldered and

connected with the test point. Whether the ground TVs device and surge device

are stuck reversely or broken down, resulting in USB_ DM,USB_ DP, VBUS

short circuit to ground.

Sub Connector

3
FV3101

3
1

2
C3102
C3101

2
NC/33pF 50V 10% NC/1UF 25V 10%

USB_VBUS_C
VREG_L9A
SH3107

SH3108
R3102

C3103
J3101 C3104
54

53

52

NC/33PF 51
100K 5% *

NC/33PF
54

53

52

51
1 50
2 1 50 49
3 2 49 48 USB0_HS_DM [4,18,33]
[5] GRFC2_PRX_TUNER_V3 3 48 USB0_HS_DP [4,18,33]
4 47
[5] GRFC1_PRX_TUNER_V2 5 4 47 46
[5] GRFC0_PRX_TUNER_V1 5 46
6 45
VREG_L21A 7 6 45 44 PRX_SAR_REF [44]
8 7 44 43 PRX_SAR_SENSOR [44]
[5] EINT_ANT_CABLE_DET 9 8 43 42
10 9 42 41
11 10 41 40
[23] SPK_OUT_P 12 11 40 39 SPK_OUT_N [23]
13 12 39 38
14 13 38 37
15 14 37 36 Fuel_VSS [18]
16 15 36 35 VIB
[22] AMIC1_INM 16 35 USB_CC2 [18,33]
17 34
[22] AMIC1_INP 17 34 USB_CC1 [18,33]
R3103 NC 18 33
[22] MIC_BIAS1 19 18 33 32
20 19 32 31 HS_DET_CON [24]
[22,24] B2B_AMIC2_INM 20 31
21 30
[22,24] B2B_AMIC2_INP 22 21 30 29 HSR_CON [24]
23 22 29 28
[18,33] BAT_TEMP_DET_FG 24 23 28 27 HPH_REF_CON [24]
24 27

FV3102

FV3103
25 26
[50] FM_ANT_P 25 26 HSL_CON [24]
55

56

57

58
55

56

57

58

1
OK-118RF050-2-35-006A
C3112

C3111

C3110
C3105

C3106

C3109

C3108

FV3104

FV3105

C3107

2
NC/33PF

NC/33PF

NC/33PF

NC/33PF

NC/33PF

NC/33PF

NC/33PF

LESD11LL5.0CT5G

LESD11LL5.0CT5G
NC/33PF
LESD8D12CAT5G

LESD8D12CAT5G
1
1

1
SH3105

SH3106

SH3101
SH3104

SH3103

SH3102
2
2

3.2.4 LCD fault

M328 adopts 6.49 inch LCD and is connected to the main board through board

connector. The circuit schematic diagram of this part is shown in the figure below:
J3001

1 40
GND 2 1 40 39
GND
[5] TP_SPI_SCLK
R3011 0R 5% * SCLK 3 2 39 38
D3_N LCM_D3N_CON [30]
[5] TP_SPI_MOSI
R3012 0R 5% * MOSI 4 3 38 37
D3_P LCM_D3P_CON [30]
[5] TP_SPI_MISO
R3013 0R 5% * MISO 5 4 37 36
GND
[5] TP_SPI_CS
R3010 0R 5% * CS 6 5 36 35
D0_N LCM_D0N_CON [30]
GND 7 6 35 34
D0_P LCM_D0P_CON [30]
[5] TS_RESET_N
R3014 1K 5% * TP_RESET 7 34 GND
VREG_L9A
I2C_SDA89 8 33
33
32
CLK_N LCM_CLKN_CON [30]
R3015 NC/10K 5% * I2C_SCL CLK_P
5055504020

9 32 LCM_CLKP_CON [30]
[5] TS_INT_N
R3016 1K 5% * TP_INT10
11 10 31
31
30
GND
NC 11 30 D1_N LCM_D1N_CON [30]
LED_C312 29
[30] WLED_SINK1 12 29 28 D1_P LCM_D1P_CON [30]
[30] WLED_SINK2 LED_C213 13 28 GND
[30] WLED_SINK3 LED_C114 14 27
27
D2_N LCM_D2N_CON [30]
VREG_WLED LED_A 15
16 15 26
26
25
D2_P LCM_D2P_CON [30]
NC 17 16 25 24
GND
NC 17 24 LEDPWM LCD_CABC [30]
[30] LCM_AVEE
R3017 0R 5% * VSN 18 18 23
23
TE R3018 1K 5% *
LCD_TE [5]
[30] LCM_AVDD
R3019 0R 5% * VSP 1920 19 22
22
21
RESET R3020 1K 5% * LCD_RESET_N [5]
NC 20 21 IOVCC R3021 0R 5% * VREG_L9A
FV3001

FV3002

C3017

C3018

C3019

C3020

FV3003

FV3004

43 41
43 41
FV3005

FV3006

C3021

44 42
44 42
C3013

C3016

NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G

NC/33PF

NC/33PF

NC/33PF

NC/33PF

1UF 10V 20%

1UF 10V 20%

1UF 10V 20%

NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G

LCD interface circuit

14
 LCM BIAS
VPH_PWR L3001 4.7UH 1.62A 20%

C3001
4.7UF 6.3V 20%
U3001
C1 D1
VIN LX E3 R3001 0R 5% *
B1 AVDD LCM_AVDD [30]
[5,33] LPI_DEBUG_UART_TX_BIAS_AVDD A1 ENP D3
[14] LCM_SOURCE_AVEEEN ENN BSTO2 E2
B2 BSTO1
[5,18,51] APPS_I2C_SCL C2 SCL A2 R3002 0R 5% * LCM_AVEE [30]
[5,18,51] APPS_I2C_SDA SDA AVEE
B3 C3 LCMBISA_CFLY 1

C3007 10UF 10V 20%

C3008 10UF 10V 20%

E1 PGND1CFLY 1
D2 PGND2 A3 LCMBISA_CFLY 2
AGND CFLY 2 C3009

C3010
OCP2131WPAD
2.2UF 16V 20%
1

1
0.2

0.2

10UF 25V 20%

TP3003 TP3002
NC NC

EXCX4CE900U 3 2 EMI3001 DSI0_LN3_P [7]

[30] LCM_D3P_CON OUT2 IN2
4 1
[30] LCM_D3N_CON OUT1 IN1 DSI0_LN3_M [7]

EXCX4CE900U 3 2 EMI3002 DSI0_LN0_P [7]

[30] LCM_D0P_CON OUT2 IN2
4 1 DSI0_LN0_M [7]
[30] LCM_D0N_CON OUT1 IN1

EXCX4CE900U 3 2 EMI3003
[30] LCM_CLKP_CON OUT2 IN2 DSI0_CLK_P [7]

[30] LCM_CLKN_CON 4 1 DSI0_CLK_M [7]

OUT1 IN1

EXCX4CE900U 4 1 EMI3004 DSI0_LN1_M [7]

[30] LCM_D1N_CON OUT1 IN1
3 2 DSI0_LN1_P [7]
[30] LCM_D1P_CON OUT2 IN2

[30] LCM_D2P_CON
EXCX4CE900U 3 2 EMI3005 DSI0_LN2_P [7]
OUT2 IN2
[30] LCM_D2N_CON 4 1 DSI0_LN2_M [7]
OUT1 IN1

Common faults and causes of LCD module include:

1、 LCD black screen: 1) LCD is not installed properly or has poor contact with fixture;

2) The LCD backlight circuit is broken. Check whether the backlight enable pin is

pulled high, whether the backlight chip circuit has welding problems, and whether

the backlight IC input / output pin PWM control pin is normal; 3) LCD itself fails; 4)

The conductive cloth on the LCD has burrs and touches the LCD backlight pin; 5)

Whether the Schottky diode is broken down; 5) The bias voltage output (VSP /

VSN) is abnormal.

15
 2、 LCD white screen or flower screen: it indicates that the LCD backlight circuit is

OK, but the display part is abnormal. The fault causes are usually: 1) poor

contact, poor welding or poor contact with fixture of LCD connector; 2) Whether

the EMI device is soldered or short circuited to tin; 3) Software problems.

3、 LCD black spot, bright spot, black line and stripe fault cause: LCD body is

broken.

3.2.5 Camera fault

M328 is designed for four cameras. One front camera is connected to the main board

through connector J2503, and three rear cameras are connected to the main board

through connectors J2500,J2501 and J2502. The control of camera is completed through

MIPI.

[25] AGND1

Main Camera 50M

C2503 C2502 C2504 [25] AGND1
26

25

J2500 C2509
NC
4.7UF 6.3V 20% 2.2UF 6.3V 20%
26

25

SH2501
VCAMA_REAR_AVDD R2502 NC 1 24 AGND NC/33pF 50V 10%
1 24
2 23 0R 5% * R2504
[5] CAM0_RST_N 2 23 CAM_MCLK0 [5]
3 22
[25] CAM_VSY NC 3 22
TP2505 4 21 TP2501
[7] CSI0_C0_LN0_M 4 21 CSI0_A0_CLK_M [7]
TP2509 5 20 TP2510
[7] CSI0_B0_LN0_P 5 20 CSI0_NC_CLK_P [7]
BTB-24F_GB35R-24S-H08

TP2515 6 19
[7] CSI0_B1_LN1_M 6 19
TP2518 7 18 TP2519
[7] CSI0_A1_LN1_P 7 18 CSI0_A2_LN2_M [7]
TP2521 8 17 TP2522
[7] CSI0_C2_LN3_M 8 17 CSI0_C1_LN2_P [7]
TP2523 9 16
[7] CSI0_B2_LN3_P 9 16
[5,25] CCI_I2C_SDA0 10 15
10 15 CAM_IOVDD_1V8
[5,25] CCI_I2C_SCL0 11 14
11 14
12 13
[25] AF_VSS 12 13 AFVDD
FV2502

C2524

C2514

C2515

C2520

C2521
27

28

NC
27

28

2.2UF 6.3V 20%

1UF 10V 20%

C2525 C2526
NC

NC
NC/LESD11D5_0CT5G

NC NC

AF_VSS [25]

DVDD_REAR
SH2504

C2529 C2530
4.7UF 6.3V 20%

NC

U2509 2.8V 56.42mA(Max 67.7)

U2502
4 1
VPH_PWR IN OUT VCAMA_REAR_AVDD 4 1
VPH_PWR IN OUT AFVDD
GND1
GND2

C2567

3
[5] REAR_VCAMA_2.8V_EN EN
GND1
GND2

C2535

3
[5,33] LPI_DEBUG_UART_AFVDD_EN EN
R2536

C2566

R2507

C2536
2
5

2
5

LR5216B28FT5AG
1UF 10V 20%

WR0332-28FF4R
1UF 10V 20%
1UF 10V 20%
NC/100K 5% *

1UF 10V 20%

NC/100K 5% *

AGND1 [25] AGND1 [25]

16M use 1.2V LDO

R2529 NC/0R 5% *
VPH_PWR U2503
R2530 0R 5% * 1.05V 200.54mA(Max 260.7)
4 1 U2510
VREG_S7A IN OUT DVDD_REAR
GND1
GND2

C2537

3
[5,25] DVDD_REAR_EN EN 4 2
VREG_S7A IN BIAS VPH_PWR
C2538

R2508

3 1
GND

DVDD_REAR
2
5

WR0332-11FF4R [5,25] DVDD_REAR_EN EN OUT

1UF 10V 20%

C2512

C2513

C2552
5
1UF 10V 20%

WL2831D105-4TR
NC/100K 5% *

1UF 10V 20%

1UF 10V 20%

1UF 10V 20%

U2505

4 1
VPH_PWR IN OUT CAM_IOVDD_1V8
GND1
GND2

3
[5] CAMERA_DOVDD_1.8V_EN EN

R2509 C2541
2
5

WR0332-18FF4R
C2542
1UF 10V 20%
NC/100K 5%1UF
* 10V 20%

16
 [25] AGND2

Macro Camera 2M

C2507

C2505
C2508
[25] AGND2

26

25
J2502

2.2UF 6.3V 20%

NC/33pF 50V 10%

NC

26

25
SH2502
0R 5% * R2524 1 24
VCAMA_MACRO_AVDD 1 24
2 23 R2505 0R 5% *
[5] CAM1_RST_N 2 23 CAM_MCLK3 [5]
R2503 0R 5% * 3 22
[25] CAM_VSY NC 3 22
TP2506 4 21 TP2507
[25] CSI1_D0_M_Macro 4 21 CSI1_CLK_M_Macro [25]
TP2511 5 20 TP2512
[25] CSI1_D0_P_Macro 5 20 CSI1_CLK_P_Macro [25]

BTB-24F_GB35R-24S-H08
6 19
FV2500 6 19
7 18
NC/LESD11D5_0CT5G 7 18
8 17
8 17
9 16
9 16
10 15
[5,25] CCI_I2C_SDA0 10 15 CAM_IOVDD_1V8
11 14
[5,25] CCI_I2C_SCL0 11 14

C2510

C2511
C2522

C2523

12 13
12 13

27

28

1UF 10V 20%

NC
NC

NC

27

28

For 2M AVDD
U2500

4 1
VPH_PWR IN OUT VCAMA_MACRO_AVDD
GND1
GND2

C2532

3
[14] MACRO_AVDD_EN EN
C2531

R2525

2
5

LR5216B28FT5AG
1UF 10V 20%
1UF 10V 20%

100K 5% *

AGND2 [25]

17
 [25] AGND3

Wide CAMERA 8M C2500 C2501

[25] AGND3

26

25
J2501
4.7UF 6.3V 20% NC C2506

26

25
SH2500
0R 5% * R2500 1 24 NC/33pF 50V 10%
VCAMA_WIDE_AVDD 1 24
2 23 R2501 0R 5% *
[5] CAM3_RST_N 2 23 CAM_MCLK2 [5]
3 22
[25] CAM_VSY NC 3 22
TP2500 4 21 TP2502
[7] CSI1_D0_M_W 4 21 CSI1_CLK_M_W [7]
TP2503 5 20 TP2504
[7] CSI1_D0_P_W 5 20 CSI1_CLK_P_W [7]

BTB-24F_GB35R-24S-H08
TP2508 6 19
[7] CSI1_D1_M_W 6 19
TP2513 7 18 TP2514
[7] CSI1_D1_P_W 7 18 CSI1_D2_M_W [7]
TP2516 8 17 TP2517
[7] CSI1_D3_M_W 8 17 CSI1_D2_P_W [7]
TP2520 9 16
[7] CSI1_D3_P_W 9 16
10 15
[5,25] CCI_I2C_SDA1 10 15 CAM_IOVDD_1V8
11 14
[5,25] CCI_I2C_SCL1 11 14
FV2501

C2516

C2517 12 13
12 13

27

28
27

28
NC NC
C2518 C2519
NC/LESD11D5_0CT5G

NC 1UF 10V 20%

DVDD_1.2V_WCAM
C2527

C2528
4.7UF 6.3V 20%

NC

U2501 1.2V 76.8mA(Max 96.5)

4 1
VREG_S7A IN OUT DVDD_1.2V_WCAM
GND1
GND2

C2533

3
[5] W_CAMERA_LDO_1.2_EN EN
C2534

R2506

2
5

WR0332-12FF4R
1UF 10V 20%
1UF 10V 20%

NC/100K 5% *

For 8M AVDD
U2504 2.8V 22.5mA(Max 30.0)
4 1
VPH_PWR IN OUT VCAMA_WIDE_AVDD
GND1
GND2

3
[14] VCAMA_2.8V_WIDE_EN EN
C2539

R2532

C2540
2
5

LR5216B28FT5AG 1UF 10V 20%

1UF 10V 20%

100K 5% *

[25] AGND3

18
 FRONT CAMERA
[25] AGND4

VCAMA2_LDO
C2543

C2544

[25] AGND4 16M use 1.2V LDO

U2506
1.1V 89mA(Max 115)
R2528 0R 5% * 4 1
VREG_S7A IN OUT Front_CAMERA_DVDD
4.7UF 6.3V 20%

NC

GND1
GND2

C2546
26

25

J2503 C2545 3
[5] Front_DVDD_EN EN
C2547

R2513

NC/33pF 50V 10%

26

25

SH2505
2
5
R2512 0R 5% * 1 24 WR0332-11FF4R
VCAMA_FRONT_AVDD 1 24

1UF 10V 20%

2 23 0R 5% * R2510
[5] CAM2_RST_N 2 23 CAM_MCLK1 [5]
1UF 10V 20%

NC/100K 5% *

3 22
3 22
[25] CSI2_D0_M_F R2511 0R 5% * 4 21 R2514 0R 5% *
4 21 CSI2_CLK_M_F [25]
[25] CSI2_D0_P_F R2515 0R 5% * 5 20 R2516 0R 5% *
5 20 CSI2_CLK_P_F [25]
BTB-24F_GB35R-24S-H08

[25] CSI2_D1_M_F R2517 0R 5% * 6 19

6 19
[25] CSI2_D1_P_F R2518 0R 5% * 7 18 R2519 0R 5% *
7 18 CSI2_D2_M_F [25]
R2520 0R 5% * 8 17 R2521 0R 5% *
[25] CSI2_D3_M_F 8 17 CSI2_D2_P_F [25]
R2522 0R 5% * 9 16
[25] CSI2_D3_P_F 9 16

[5,25] CCI_I2C_SDA1
10
10 15
15
CAM_IOVDD_1V8 For 16M AVDD
C2548

C2549

11 14
[5,25] CCI_I2C_SCL1 11 14
12 13
C2550 C2551 FV2504 12 13 U2508
2.8V 41mA(Max 49)
27

28

NC

1UF 10V 20%

NC NC 4 1
NC/LESD11D5_0CT5G VPH_PWR IN OUT VCAMA_FRONT_AVDD
GND1
GND2
27

28

3
[5] VCAMA2_LDO_EN EN
C2555
R2523

C2554

2
5

LR5216B28FT5AG
1UF 10V 20%

1UF 10V 20%

Front_CAMERA_DVDD
NC/100K 5% *
C2556

C2557
4.7UF 6.3V 20%

NC

[25] AGND4

Common faults and causes of camera include:

1、 Camera initialization failed, unable to enter the camera main interface: 1) poor

contact of camera; 2) Camera body fault; 3) Camera power supply is abnormal; 4)

EMI device problem, faulty soldering or tin damage; 5) Software exception.

2、 Camera preview screen or abnormal color: 1) poor contact of camera; 2) EMI

device welding problems; 3) Restart after restoring factory settings.

3、Camera cannot store photos: 1) the memory of the fuselage is insufficient and

there is no t card inserted; 2) Software exception.

4、If the camera has other problems, please replace the camera and try to confirm

whether there is a problem with the camera body.

19
 3.2.6 Flash failure
M328 rear flash

Flash LED Driver

VPH_PWR L1901 1UH 4.5A 20%

C1901

C1902
SPR1901 SPR1902
80000065 80000065

4.7UF 10V 20%

100nF 10V 10%

1
C1903

1
U1901
4 5 10UF 25V 20%
10/11pin has an internal 330k pull-down resistor to AGND VIN SW0 6
10 SW1
[5] FLASH_TORCH Flash mode enable pin 11 ENF 9
[14] HAPTIC_PWM ENM OUT1 8
MOVIE/TORCH mode enable OUT0
R1901

R1902

2
1 RF 12
RM LED1

R1903

R1904
ENF 1 Flash 0 Mov ie
14
ENM PWM LED2

AGND0
AGND1
PGND

FV1901

FV1902
GND
NC

NC

C1904
1

1
15K 1% *

140K 1% 50V

1
15
7
3
13
OCP8135BVAD

NC
2

2
NC/PESDNC2XD5VBF

NC/PESDNC2XD5VBF
I_flash=8625/R*2_isetf I_movie=7100/R*2_isetm

The causes of flash test fail are as follows:

1、 Chip solder；

2、 Damaged flash lamp or faulty welding。

3.2.7 USIM / T-Flash card failure

M328 adopts nano + nano / SD card holder; The output signal is connected to the

CPU.

SD CARD R3204 10K 5% *

VREG_L22A
SIM1 PCB靠板内
VREG_L5A
J3201

16
R3201 0R 5% * 8 DATA1-2
[4] SDC2_DATA_1 15 DATA1-1
R3202 0R 5% * 7 DATA0-2
[4] SDC2_DATA_0 14 DATA0-1
6 VSS-2 R3212 20K 1% *
13 VSS-1 VREG_L19A
R3222 0R 5% * 5 CLK-2 J3202
[4] SDC2_CLK CLK-1
12
4 VDD-2 9
NANO SIM 18
R3213 33R 5% * UIM1_DATA [5]
[5] UIM1_CLK R3208 33R 5% *
11 VDD-1 8 CLK3 I/O3 17
R3205 0R 5% * 3 CMD-2 7 CLK2 I/O2 16
[4] SDC2_CMD 10 CMD-1 CLK1 I/O1
R3206 0R 5% * 2 CD/DATA3-2 R3209 33R 5% * 6 15
[4] SDC2_DATA_3 CD/DATA3-1 [5] UIM1_RESET RST3 VPP3
9 5 14
DATA2-2 RST2 VPP2 NFC_SWIO_UIM1 [51]
R3207 0R 5% * 1 4 13
[4] SDC2_DATA_2 DATA2-1 RST1 VPP1
FV3202

FV3203

FV3204

FV3205

FV3206

FV3207

FV3208

FV3213

FV3214

R3211 NC 3 12
VREG_L19A VCC3 GND3
C3208

C3201

C3202

C3203

C3204

2 11
VCC2 GND2
FV3209

FV3211

FV3212

CAF11-08136-151901 R3210 0R 5% * 1 10
VSIM1_NFC VCC1 GND1
33pF 50V 10%

1UF 10V 20%

CAF99-06033-1505
NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G

NC/33pF 50V 10%

4.7UF 6.3V 20%

33pF 50V 10%

NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G
NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G

Detect
G1
G2
J3204

GND1 DET
GND2 GND13
G14
G13
R3219 100K 5% * VREG_L9A
SIM2 PCB靠板边
G3 G12
GND3 GND12
FV3201

G4
G5 GND4 G11 SH3201 shortdot-l2 R3217 20K 1% * VREG_L20A
G6 GND5 GND11 G10 R3220 1K 5% * 2 1 J3203
GND6 GND10 UIM1_PRESENT [5]
G71 G9 NANO SIM R3218 33R 5% * UIM2_DATA [5]
1

GND71 GND9
NC/PESDNC2XD5VBF

G72 G8 SH3202 shortdot-l1 R3214 33R 5% * 9 18

GND72 GND8 2 1 [5] UIM2_CLK 8 CLK3 I/O3 17
1

SD_CARD_DET_N [5] 7 CLK2 I/O2 16

CAF00-21134-152307
C3207 CLK1 I/O1
2

100nF 6.3V 20% R3215 33R 5% * 6 15

UIM2_PRESENT [5] [5] UIM2_RESET 5 RST3 VPP3 14
2

4 RST2 VPP2 13
RST1 VPP1
FV3217

R3216 0R 5% * 3 12
VREG_L20A VCC3 GND3
C3205

C3206

2 11
VCC2 GND2
FV3210

FV3215

FV3216

1 10
VCC1 GND1

CAF99-06033-1505
33pF 50V 10%

1UF 10V 20%

NC/LESD11D5_0CT5G
NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G

20
 USIM / T-Flash card circuit

Main fault of this module

1、The reasons for not identifying the card usually include: 1) poor contact of the card

seat; 2) ESD protection device is broken down and short circuited to ground; 3) Whether

there is false welding in the card seat; 4) Whether the card exceeds the stroke or is

inserted reversely.

2、T-Flash card read / write test failed: 1) T-Flash card is a faulty card; 2) There may

be short circuit or false soldering in the resistance; 3) Software reasons.

3、The T-Flash card cannot be transmitted through USB: 1) the read-write test of the

T-Flash card itself fails; 2) Software failure;

3）USB failure, check whether the USB channel is normal.

3.2.8 Motor failure

M328 adopts a welding linear motor, which is located on the small board. The small

board is connected with the main board through FPC. The positive end of the motor is

connected to PMIC output and the negative end is grounded.

ANT1003 ANT1004
818010551
1 818010551

1
1

VIB R1000 0R 5% *
FV1000

C1000 C1001
100nF 6.3V 20%

33pF 50V 10%

NC

R1013 0R 5% *

C1028
33pF 50V 10%

21
 Common motor faults and causes:

1、 The motor has no vibration: 1) the shrapnel of the small plate has poor contact

with the motor; 2) The motor body is broken.

2、 Weak motor vibration; 1) The motor body is broken; 2) Software setup reason.

3、When the motor vibrates, there is sometimes no problem with the motor body.

4、Motor vibration and noise: 1) structural assembly problems; 2) Motor body causes.

3.2.9 G-Sensor failure

M328 G-sensor I2C data reading communication.

A+GYRO
TP2601
U2604

1 13
SDO SCX SNS_I3C_SCL [5]
14 12
[5] SNS_I3C_SDA SDX CSB
5 R2601 NC
TP2602 TP2605 VDDIO VREG_L9A

C2601

C2617
4 8
[5] GY RO_INT INT1 VDD
R2617 0R 5% * 9 11
[5] ACCEL_INT INT2 NC2 10
NC1

NC/100NF 6.3V 20%

2
GNDIO
VREG_L9A ASDx

4.7UF 6.3V 20%

3
GND

ASCx
R2615

R2618 NC/0R 5% *
VIB_LDO_EN2 [31]
7

ICM-42607-P
NC/100K 5% *

ICM-42607-P
Common faults and causes are:

1、 Function NG: check the module circuit for welding or short circuit faults.

2、 Check whether the I2C power supply is normal.

3.2.10 M-Sensor failure

M328 m-sensor uses QMC6385 and I2C data to read communication.

M SENSOR
U2601
A2 A1
[5,26] SNS_I2C_SCL SCL VSS
防撞器件
B2 B1 C2602
[5,26] SNS_I2C_SDA SDA VDD VREG_L9A
C2603 10UF 25V 20%
QMC6308 C2604
4.7UF 6.3V 20%

100nF 6.3V 20%

I2C ADDRESS:44 （2CH）

QMC6308
22
 Common faults and causes are:

1、Function NG: check the module circuit for welding or short circuit faults.

2、Check whether the I2C power supply is normal.

3.2.11 PL-sensor failure
M328 PL-sensor I2C data reading communication.
U2603
3 6
R2604 0R 5% * 2 GND NC 7
[5,26] SNS_I2C_SCL 8 SCL INT 5 ALSP_INT_N [5]
R2606 0R 5% *
[5,26] SNS_I2C_SDA 4 SDA LDR 1 R2609 0R 5% *
R2608 NC/0R 5% * LEDA VDD VREG_L9A
VFP_3.0V

FV2600

C2607

FV2601
C2614

C2608

C2616

C2609

FV2602

FV2604

FV2603

C2610
VCC_ALPS_LDO R2614 0R 5% *

VCC_ALPS
NC/33PF 25V 5%

NC/33PF 25V 5%

NC/1UF 10V 20%

4.7UF 6.3V 20%

4.7UF 10V 20%

NC/33PF 25V 5%
NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G
NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G
I2C: 0x41

Common faults and causes are function NG, and the causes are analyzed as follows

1、Check whether the power supply is normal;

2、Whether the structural rubber sleeve falls off or enters ash;

3、Abnormal welding of PL sensor.

3.2.12 Fingerprint fault
M328 fingerprint module is connected to the motherboard through 14pin connector.

The main data communication port is SPI. The circuit diagram is as follows.

J2600
11
12 13 BAF04-10083-0500 11
12

1 10 R2603 0R 5% *
1 10 FP_SPI_CS_N [5,26]
R2605 0R 5% * 2 9
[5,26] FP_RST_N 2 9 VREG_L9A
3 8 R2607 0R 5% *
3 8 FP_SPI_SCLK [5,26]
R2610 0R 5% * 4 7 R2611 0R 5% *
[5,26] FP_SPI_MOSI 4 7 VFP_3.0V
R2612 0R 5% * 5 6 R2613 0R 5% *
[5,26] FP_INT_N 5 6 FP_SPI_MISO [5,26]
14
C2611

C2612

C2613

C2615
13
14
12pF 50V *

NC/12pF 50V *

1UF 10V 20%

NC/4.7UF 6.3V 20%

[5,26] FP_INT_N FP_RST_N [5,26]

VREG_L9A
VFP_3.0V FP_SPI_CS_N [5,26]
FP_SPI_SCLK [5,26]
FP_SPI_MISO [5,26]
FP_SPI_MOSI [5,26]
FV2605

FV2606

FV2607

FV2608

FV2609

FV2610

FV2611

FV2612

NC NC NC NC NC NC NC NC

The common fault of fingerprint sensor is function NG, and the causes are analyzed

as follows:

23
 1、Check whether the power supply is normal;

2、Whether the connector is welded or damaged;

3、Whether the resistance value is correct and whether the welding is good.

3.2.13 Touch Panel fault

M328 touch panel circuit is very simple, VREG_L9A power supplies power to touch

panel IC, and SPI bus transmits commands and data.

J3001

1 40
GND 2 1 40 39
GND
[5] TP_SPI_SCLK
R3011 0R 5% * SCLK 3 2 39 38
D3_N LCM_D3N_CON [30]
[5] TP_SPI_MOSI
R3012 0R 5% * MOSI 4 3 38 37
D3_P LCM_D3P_CON [30]
[5] TP_SPI_MISO
R3013 0R 5% * MISO 5 4 37 36
GND
[5] TP_SPI_CS
R3010 0R 5% * CS 6 5 36 35
D0_N LCM_D0N_CON [30]
GND 7 6 35 34
D0_P LCM_D0P_CON [30]
[5] TS_RESET_N
R3014 1K 5% * TP_RESET 7 34 GND
VREG_L9A
I2C_SDA89 8 33
33
32
CLK_N LCM_CLKN_CON [30]
R3015 NC/10K 5% * I2C_SCL CLK_P

5055504020
9 32 LCM_CLKP_CON [30]
[5] TS_INT_N
R3016 1K 5% * TP_INT10
11 10 31
31
30
GND
NC 11 30 D1_N LCM_D1N_CON [30]
LED_C312 29
[30] WLED_SINK1 12 29 28 D1_P LCM_D1P_CON [30]
[30] WLED_SINK2 LED_C213 13 28 GND
[30] WLED_SINK3 LED_C114 14 27
27
D2_N LCM_D2N_CON [30]
VREG_WLED LED_A 15
16 15 26
26
25
D2_P LCM_D2P_CON [30]
NC 17 16 25 24
GND
NC 17 24 LEDPWM LCD_CABC [30]
[30] LCM_AVEE
R3017 0R 5% * VSN 18 18 23
23
TE R3018 1K 5% *
LCD_TE [5]
[30] LCM_AVDD
R3019 0R 5% * VSP 1920 19 22
22
21
RESET R3020 1K 5% * LCD_RESET_N [5]
NC 20 21 IOVCC R3021 0R 5% * VREG_L9A
FV3001

FV3002

C3017

C3018

C3019

C3020

FV3003

FV3004

43 41
43 41

FV3005

FV3006

C3021
44 42
44 42
C3013

C3016

NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G

NC/33PF

NC/33PF

NC/33PF

NC/33PF

1UF 10V 20%

1UF 10V 20%

1UF 10V 20%

NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G

NC/LESD11D5_0CT5G
Common faults and causes of touch panel are:

1、 Low sensitivity and slow response of sensor: software problem;

2、 TP no function：

1）First, check whether the FPC of TP is in good contact with the connector;

2）Then measure VREG_L9AWhether the PMU is normal and confirm whether

the power supply is normal;

3) Whether the voltage on I2C line is normal;

4）Whether there are problems such as false soldering, reverse and breakdown

in ESD device welding;

3、Touch Panel abnormal function，

1）Check the touch panel module circuit for welding or short circuit;

2） Software problems.

3.2.14 Failure to charge

M328 uses SGM41512 to realize charging.

24
 Sub Connector

3
FV3101

3
1

2
C3102
C3101

2
NC/33pF 50V 10% NC/1UF 25V 10%

USB_VBUS_C
VREG_L9A

SH3107

SH3108
R3102
C3103
J3101 C3104

54

53

52

51
NC/33PF
100K 5% *

NC/33PF

54

53

52

51
1 50
2 1 50 49
3 2 49 48 USB0_HS_DM [4,18,33]
[5] GRFC2_PRX_TUNER_V3 3 48 USB0_HS_DP [4,18,33]
4 47
[5] GRFC1_PRX_TUNER_V2 5 4 47 46
[5] GRFC0_PRX_TUNER_V1 5 46
6 45
VREG_L21A 7 6 45 44 PRX_SAR_REF [44]
8 7 44 43 PRX_SAR_SENSOR [44]
[5] EINT_ANT_CABLE_DET 9 8 43 42
10 9 42 41
11 10 41 40
[23] SPK_OUT_P 12 11 40 39 SPK_OUT_N [23]
13 12 39 38
14 13 38 37
15 14 37 36 Fuel_VSS [18]
16 15 36 35 VIB
[22] AMIC1_INM 16 35 USB_CC2 [18,33]
17 34
[22] AMIC1_INP 17 34 USB_CC1 [18,33]
R3103 NC 18 33
[22] MIC_BIAS1 19 18 33 32
20 19 32 31 HS_DET_CON [24]
[22,24] B2B_AMIC2_INM 20 31
21 30
[22,24] B2B_AMIC2_INP 22 21 30 29 HSR_CON [24]
23 22 29 28
[18,33] BAT_TEMP_DET_FG 24 23 28 27 HPH_REF_CON [24]
24 27

FV3102

FV3103
25 26
[50] FM_ANT_P 25 55 26 HSL_CON [24]
56

57

58
55

56

57

58

1
OK-118RF050-2-35-006A
C3112

C3111

C3110
C3105

C3106

C3109

C3108

FV3104

FV3105

C3107

2
NC/33PF

NC/33PF

NC/33PF

NC/33PF

NC/33PF

NC/33PF

NC/33PF

LESD11LL5.0CT5G

LESD11LL5.0CT5G
NC/33PF
LESD8D12CAT5G

LESD8D12CAT5G
1
1

1
SH3105

SH3106

SH3101
SH3104

SH3103

SH3102
2
2

Switching Charger Power Path

C1815 4.7UF 10V 20% CHG_REGN [18]

C1816 47nF 25V 20%L1800 1UH 4.7A 20%

R1842

C1817 10UF 25V 20%

C1818

C1819
0R 5% *

C1828 C1820
10UF 10V 20%

10UF 10V 20%

NC/33PF 25V 10% 1UF 50V 10% U1800

RT9471D
25

23

22

21

20

19

VBUS_IN
SW2

SW1
PGND

PMID

REGN

BTST

SD155/BQ25601
24
R1806 10K 5% * 1 VBUS 18
VREG_L9A VAC P2GND
R1804 NC/200R 5% * 2 17
[4,18,31,33] USB0_HS_DP PSEL/D+ P1GND

SGM45142
[4,18,31,33] USB0_HS_DM R1808 NC/200R 5% * 3 16
/PG/D- SY S1 VPH_PWR
4
STAT
PGND SY S0
15

5 14
[5,18,30,51] APPS_I2C_SCL SCL BAT1 VBATT
C1821

R1836 51R 5% 25V 6 13

[5,18,30,51] APPS_I2C_SDA SDA BAT0
/QON
NC1

NC2
/CE
INT
C1822

TS

10UF 10V 20%

7

10

11

12

VREG_L9A R1810 10K 5% *

100pF 50V 5%/10%

[5] EINT_MAIN_Charger
R1819 10K 5% *

KY PDPWR_N [14,33]

R1811 10K 5% * R1812 10K 5% * CHG_REGN [18]

RT9471D I2C slave address :OX53

25
 Charge PUMP

VBUS_IN
U1801
SC8551

H6 C1801 220nF 10V 20% R1801 NC/75K 1% *

E6 CDRVH H7
C6 VBUS1 CDRVL _ADDRMS
VBUS2

C1802

C1804
F6 G6 C1803 4.7UF 10V 20%
D6 VBUS3 REGN
VBUS4
TP1304 D7 G3 VBATT
OVPGATE VOUT1
H3
VOUT2
1UF 50V 10%

22pF 50V 10%

R1829 0R 5% * E7 B3 C1805
VAC VOUT3
VOUT4 A3
C3
VOUT5
D3
VOUT6

22UF 10V 20%

[5,18,30,51] APPS_I2C_SDA R1838 0R 5% * G7 F3
SDA VOUT7
E3
R1839 0R 5% * VOUT8
[5,18,30,51] APPS_I2C_SCL F7
SCL
C7 D4
[5] CHANGER_INT /INT CFH2_1
C4
R1802 10K 5% * CFH2_2 C1806 C1807 C1808
VREG_L9A B4
CFH2_3
D5 A4
PMID1 CFH2_4
G5
PMID2

22UF 10V 20%

22UF 10V 20%

22UF 10V 20%

C5 A2
C1814 10UF 25V 20% PMID3 CFL2_5
F5 B2
PMID4 CFL2_6
E5 C2
PMID5 CFL2_7 C1837 100pF 50V 5%/10%
B5 D2
R1840 0R 5% * PMID6 CFL2_8
A5 H4
R1863 NC TSBAT _SY NCOUT CFH1_1
[18] Charge_PUMP_CS_P A6 G4
R1805 0R 5% * SRP CFH1_2 C1810 C1811 C1812
[18,33] C+ A7 F4
R1864 NC BATP _SY NCIN CFH1_3
[18] Charge_PUMP_CS_N B6 E4
R1807 0R 5% * SRN CFH1_4
[18] C- B7
BATN E2
CFL1_5

22UF 10V 20%

22UF 10V 20%

22UF 10V 20%

R1841 0R 5% * F2
CFL1_6 G2
CFL1_7

GND1
GND2
GND3
GND4
GND5
GND6
GND7
GND8
H5 H2 C1813 100pF 50V 5%/10%
TSBUS CFL1_8

A1
B1
C1
D1
E1
F1
G1
H1

VREG_L9A

R1820
Fuel_Gauge

10K 5% *
U1804

C2 A1
[18] SENSE_P_FG CSP ALERT FUG_INT [5]
C1 A2
[18] SENSE_N_FG CSN SDA SAR_I2C_SDA [5,23,30,44]
R1826 4.7R 1% 50V C3 A3
[18] VBATT_ADC VDD/VBAT SCL SAR_I2C_SCL [5,23,30,44]
B3 B2
VPTS_COUL VPTS VSS Fuel_VSS [18,31]
R1827 B1
TS
电池NTC 10K，上拉电阻R1827 100K 1%
电池NTC 100K，上拉电阻R1827 1.8M 1%
SM5602
100K 1% *R1830

R1828 0R 5% *
[31,33] BAT_TEMP_DET_FG
To NTC
C1825

C1826

C1827
2.2UF 6.3V 20%

1UF 10V 20%

NC/10nF 16V 20%

NC/10K 5% *

SM5602 C2476 2.2UF

CW2217B C2476 NC

26
 VBUS_IN

R1813
VBATT

C1823
220K 1% 25V

R1814

100nF 6.3V 20%

220K 1% 25V
U1802

A1 C2
VCC VIN
A2 B1 B1800 0R/0402 R1815 1K 5% * USB0_HS_DM [4,18,31,33]
[5,18,30,51] APPS_I2C_SCL SCL DM
B3 B2 B1801 0R/0402 R1816 1K 5% *
[5,18,30,51] APPS_I2C_SDA SDA DP USB0_HS_DP [4,18,31,33]
C3 C1
[5] QC_INT INTB RESET QC_RESET_N [14]

R1818
A3
R1817 100K 5% * GND
VREG_L9A
C1824
WT6670F
NC

62K 1% 25V
QC3.0+
VBATT

C1800

C1845

C1809
FV1800

10UF 6.3V 20%

NC/10UF 6.3V 20%

100pF 50V 5%/10%

LTVS3H5.0T1G
J1800

9 4
VBATT+
NA1 VBATT+_1 5 R1800 NC/0R 1%
10 VBATT+_2 VBATT_ADC [18]
NA2 3
11 TH+ 2
TH+ R1803 0R 5% *
NA3 TH- TH-
12 6
NA4 C+ 7
C+ C+ [18,33]
C- C- C- [18]
1
VBATT-_1 8
VBATT-_2
VBATT-
BATCON_2074190081
JP1804
[18,31] Fuel_VSS
JP1800 JP1801
SHORTDOT-L4
R1809
[18] SENSE_P_FG Charge_PUMP_CS_P [18]

[18] SENSE_N_FG Charge_PUMP_CS_N [18]

0.005R 1% 150V

JP1802 JP1803

Battery Connector

27
 C1830

100NF 10V 20%

R1821 860K 5% * VBUS_IN

VREG_L9A VPH_PWR
R1837 R1823

100K 5% *
R1822
NC/100K 5% *
U1803

12

4
100K 5% *
1 R1824 100R 5% *

VDD

VBUS_DET
9 CC1 USB_CC1 [31,33]
[5] IDDIG ID 2 R1825 100R 5% *
6 CC2 USB_CC2 [31,33]
[5] CC_INT INT_N
8 3
[5,18,30,51] APPS_I2C_SCL 7 SCL PORT
[5,18,30,51] APPS_I2C_SDA SDA

C1835

C1836
5

GND
ADDR

EN
10

11
SGM7220XUQT12G-TR

330PF 50V 10%

330PF 50V 10%

CC logic

VREG_L9A

R1831

VBUS_IN NC/100K 5% *
[14] CBL_PWR_N
3

R1832
D

D1801
LN235N3T5G

100K 5% * VGS=4.5 @ Rds=500mR

R1833 1K 5% * 1 G

R1835
R1834
2 S

NC/10K 5% *
100K 5% *

充电器插入则输出低来触发开机,CBL_PWR_N低电平有效

先NC

Abnormal problems, such as failure to charge, may be caused by the following

reasons:

1、 The surge protective device on the main board is abnormal and short circuited to

the ground;

2、 The USB interface of the small board is loose and has poor contact;

3、 OVP chip or sgm41512 is damaged or soldered;

4、 The battery connector is in poor contact or deformed, and the software cannot

identify the battery;

5、Poor contact of main FPC.

28
3.2.15 Unable to power on fault
The failure to power on is the most likely failure of the mobile phone. Software

problems, welding problems and device failure are the main factors leading to failure to

start up. During maintenance, it can be roughly positioned with LCD, startup current,

keyboard, etc.

1、Large shutdown leakage current: the main fault reason is the short circuit to ground

of the devices connected to Vbat. It is usually caused by burning or welding problems

of TVs tube, CPU, PMIC or RF PA.

2、There is no current at startup and no LCD display: 1) the startup key is not plugged

in properly; 2) Poor contact of battery connector (it can be checked by plugging and

charging).

3、 LCD static display after startup: usually due to software, the software needs to be

downloaded again.

4、Turn on the LCD to display the black screen; At present, it is found that it is mainly

caused by memory empty welding and false welding; Or there is a software problem

and the software needs to be downloaded again;

5、The FPC welding of the side key is faulty, and the home of the side key startup key

falls off.

3.2.16 Automatic power on

1、When the power supply is connected and the USB is plugged in, the machine will

not start and restart: it is because the software needs to be connected to the power

supply to start;

2、The FPC of the main board and the small board is reversed, which will also lead to

automatic startup;

3、The FPC body of the side key is poor, and the pwrkey has automatic startup

caused by short circuit.

29