Professional Documents
Culture Documents
MOSFET
CoolSiCªAutomotivePowerDevice750VG1 PG-HDSOP-22
The750VCoolSiC™isbuiltoverthesolidsiliconcarbidetechnology
developedinInfineoninmorethan20years.Leveragingthewidebandgap
SiCmaterialcharacteristics,the750VCoolSiC™MOSFEToffersaunique 22
combinationofperformance,reliabilityandeaseofuse.Suitableforhigh 12
temperatureandharshoperations,itenablesthesimplifiedandcost TAB
effectivedeploymentofthehighestsystemefficiency. 1
11
Features
•Highlyrobust750Vtechnology,100%avalanchetested
•Best-in-classRDS(on)xQfr
•ExcellentRDS(on)xQossandRDS(on)xQG
•UniquecombinationoflowCrss/CissandhighVGS(th) Drain
Pin 12-22, Tab
•Infineonproprietarydieattachtechnology
•Cuttingedgetopsidecoolingpackage(QDPAK)
•Driversourcepinavailable Gate *1
•Best-in-classRDS(on)inSMDdevice Pin 1
Driver
Source
Pin 2 Power
Potentialapplications
•Circuitbreakers(HVbatterydisconnectswitch,DCandAClowfrequency
switch,HVE-fuse)
•Uni-andbidirectionalOnBoardChargersandHV-LVDCDCconverters
(hardswitchinghalfbridgesandsoftswitchingtopologies)
Productvalidation
QualifiedaccordingtoAECQ101
Pleasenote:Thesourceanddriversourcepinsarenotexchangeable.
Theirexchangemightleadtomalfunction.
Table1KeyPerformanceParameters
Parameter Value Unit
VDSSoverfullTj,range 750 V
RDS(on),typ 7.8 mΩ
RDS(on),max 10.6 mΩ
QG,typ 178 nC
IDM,max 708 A
Qoss,typ@500V 352 nC
Eoss,typ@500V 63.1 µJ
TableofContents
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Thermal characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Operating range . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Electrical characteristics diagrams . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Test Circuits . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Package Outlines . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
Appendix A . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Revision History . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
Disclaimer . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
1Maximumratings
atTj=25°C,unlessotherwisespecified.
Note: for optimum lifetime and reliability, Infineon recommends operating conditions that do not exceed 80%
of the maximum ratings stated in this datasheet.
Table2Maximumratings
Values
Parameter Symbol Unit Note/TestCondition
Min. Typ. Max.
- - 173 TC=25°C
Continuous DC drain current1) IDDC A
- - 128 TC=100°C
Peak drain current2) IDM - - 708 A TC=25°C,VGS=18V
Avalanche energy, single pulse EAS - - 926 mJ ID=34.7A,VDD=50V;seetable11
Avalanche current, single pulse IAS - - 34.7 A -
MOSFETdv/dtruggedness dv/dt - - 200 V/ns VDS=0...500V
Gate source voltage (static) VGS -5 - 23 V -
Gate source voltage (transient) VGS -10 - 25 V tp≤500ns,dutycycle≤1%
Power dissipation Ptot - - 625 W TC=25°C
Storage temperature Tstg -55 - 150 °C -
Operating junction temperature Tj -55 - 175 °C -
Mounting torque - - - n. a. Ncm -
- - 173 VGS=18V,TC=25°C
Continuous reverse drain current1) ISDC A
- - 74 VGS=0V,TC=25°C
- - 708 TC=25°C,tp≤250ns
Peak reverse drain current2) ISM A
- - 232 TC=25°C
Insulation withstand voltage VISO - - n. a. V Vrms,TC=25°C,t=1min
1)
LimitedbyTj,max
2)
PulsewidthtplimitedbyTj,max
Final Data Sheet 3 Rev.2.0,2023-08-28
CoolSiCªAutomotivePowerDevice750VG1
AIMDQ75R008M1H
2Thermalcharacteristics
Table3Thermalcharacteristics
Values
Parameter Symbol Unit Note/TestCondition
Min. Typ. Max.
Not subject to production test.
Parameter verified by
Thermal resistance, junction - case Rth(j-c) - - 0.24 °C/W
design/characterization according to
JESD51-14.
Soldering temperature,
Tsold - - 260 °C reflow MSL3
reflow soldering allowed
3Operatingrange
Table4Operatingrange
Values
Parameter Symbol Unit Note/TestCondition
Min. Typ. Max.
Gate-source voltage operating range
VGS -2 - 20 V -
including undershoots1)
Recommended turn-on voltage VGS(on) - 18 - V -
Recommended turn-off voltage VGS(off) - 0 - V -
1)
Importantnotice:Ifthegatesourcevoltageofthedeviceinapplicationexceedstheoperatingrange(Table4),thedevice
RDS(on)andVGS(th)mightexceedthemaximumvaluestatedinthedatasheetattheendofthelifetimeofthedevice.Inorderto
ensure sound operation of the device over the planned lifetime, the maximum ratings (Table 2) and the application note
AN2018-09 must be considered.
Final Data Sheet 4 Rev.2.0,2023-08-28
CoolSiCªAutomotivePowerDevice750VG1
AIMDQ75R008M1H
4Electricalcharacteristics
atTj=25°C,unlessotherwisespecified
Table5Staticcharacteristics
For applications with applied blocking voltage > 525 V, it is required that the customer evaluates the impact of
cosmic radiation effect in early design phase and contacts the Infineon sales office for the necessary technical
support.
Values
Parameter Symbol Unit Note/TestCondition
Min. Typ. Max.
VGS=0V,ID=3.24mA,
Drain-source voltage1) VDSS 750 - - V
Tj=-55°Cto175°C
Gate threshold voltage2) VGS(th) 3.5 4.3 5.6 V VDS=VGS,ID=32.4mA
- 1 75 VDS=750V,VGS=0V,Tj=25°C
Zero gate voltage drain current IDSS µA
- 10 - VDS=750V,VGS=0V,Tj=175°C
Gate-source leakage current IGSS - - 100 nA VGS=20V,VDS=0V
- 9.6 - VGS=15V,ID=90.3A,Tj=25°C
- 7.8 10.6 VGS=18V,ID=90.3A,Tj=25°C
Drain-source on-state resistance RDS(on) mΩ
- 7.2 - VGS=20V,ID=90.3A,Tj=25°C
- 14 - VGS=18V,ID=90.3A,Tj=175°C
Internal gate resistance RG,int - 3 - Ω f=1MHz
Table6Dynamiccharacteristics
External parasitic elements (PCB layout) influence switching behavior significantly.
Stray inductances and coupling capacitances must be minimized.
For layout recommendations please use provided application notes or contact Infineon sales office.
Values
Parameter Symbol Unit Note/TestCondition
Min. Typ. Max.
Input capacitance Ciss - 6135 - pF VGS=0V,VDS=500V,f=250kHz
Reverse transfer capacitance Crss - 37 - pF VGS=0V,VDS=500V,f=250kHz
Output capacitance 3)
Coss - 392 510 pF VGS=0V,VDS=500V,f=250kHz
Output charge 3)
Qoss - 352 458 nC calculationbasedonCoss
Effective output capacitance, VGS=0V,
Co(er) - 505 - pF
energy related4) VDS=0...500V
Effective output capacitance, ID=constant,VGS=0V,
Co(tr) - 704 - pF
time related5) VDS=0...500V
VDD=500V,VGS=18V,ID=90.3A,
Turn-on delay time td(on) - 22 - ns
RG=1.8Ω;seetable10
VDD=500V,VGS=18V,ID=90.3A,
Rise time tr - 30 - ns
RG=1.8Ω;seetable10
VDD=500V,VGS=18V,ID=90.3A,
Turn-off delay time td(off) - 50 - ns
RG=1.8Ω;seetable10
VDD=500V,VGS=18V,ID=90.3A,
Fall time tf - 16 - ns
RG=1.8Ω;seetable10
1)
TestedatTj=25°C,minimumVDSSverifiedbydesignoverfulljunctiontemperaturerange.
2)
Tested after 1 ms pulse at VGS = +20 V. “Linear mode” operation is not recommended. For assessment of potential “linear
mode” operation, please contact Infineon sales office.
3)
Maximum specification is defined by calculated six sigma upper confidence bound.
4)
Co(er)isafixedcapacitancethatgivesthesamestoredenergyasCosswhileVDSisrisingfrom0to500V.
5)
Co(tr)isafixedcapacitancethatgivesthesamechargingtimeasCosswhileVDSisrisingfrom0to500V.
Final Data Sheet 5 Rev.2.0,2023-08-28
CoolSiCªAutomotivePowerDevice750VG1
AIMDQ75R008M1H
Table7Gatechargecharacteristics
Values
Parameter Symbol Unit Note/TestCondition
Min. Typ. Max.
VDD=500V,ID=90.3A,
Plateau gate to source charge QGS(pl) - 50 - nC
VGS=0to18V
VDD=500V,ID=90.3A,
Gate to drain charge QGD - 45 - nC
VGS=0to18V
VDD=500V,ID=90.3A,
Total gate charge QG - 178 - nC
VGS=0to18V
Table8Reversediodecharacteristics
Values
Parameter Symbol Unit Note/TestCondition
Min. Typ. Max.
Drain-source reverse voltage VSD - 3.9 5.3 V VGS=0V,IS=90.3A,Tj=25°C
VDD=500V,IS=90.3A,
- 47 - diS/dt=1000A/µs;seetable9
MOSFET forward recovery time tfr ns
- 26 - VDD=500V,IS=90.3A,
diS/dt=4000A/µs;seetable9
VDD=500V,IS=90.3A,
- 418 - diS/dt=1000A/µs;seetable9
MOSFET forward recovery charge 1)
Qfr nC
- 677 - VDD=500V,IS=90.3A,
diS/dt=4000A/µs;seetable9
VDD=500V,IS=90.3A,
MOSFET peak forward recovery - 18 - diS/dt=1000A/µs;seetable9
Ifrm A
current - 52 - VDD=500V,IS=90.3A,
diS/dt=4000A/µs;seetable9
1)
QfrincludesQoss
Final Data Sheet 6 Rev.2.0,2023-08-28
CoolSiCªAutomotivePowerDevice750VG1
AIMDQ75R008M1H
5Electricalcharacteristicsdiagrams
Diagram1:Powerdissipation Diagram2:Safeoperatingarea
700 103
600 1 µs
102
500
101
10 µs
400
Ptot[W]
IDS[A]
100
100 µs
300
1 ms
10-1
200
10 ms
10-2
100
DC
0 10-3
0 25 50 75 100 125 150 175 100 101 102 103
TC[°C] VDS[V]
Ptot=f(TC) IDS=f(VDS); TC=25 °C; D=0; parameter: tp
Diagram3:Safeoperatingarea Diagram4:Max.transientthermalimpedance
3
10 100
102
1 µs
101
Zth(j-c),max[K/W]
10 µs 0.5
IDS[A]
0
10 10-1
100 µs
0.2
-1
10
1 ms
0.1
0.05
10 ms
10-2 0.02
0.01
DC
single pulse
10-3 10-2
100 101 102 103 10-5 10-4 10-3 10-2 10-1
VDS[V] tp[s]
IDS=f(VDS); TC=80 °C; D=0; parameter: tp Zth(j-c),max=f(tP); parameter: D=tp/T
Diagram5:Typ.outputcharacteristics Diagram6:Typ.outputcharacteristics
1200 900
20 V 800
1000 20 V
18 V 700 18 V
800 600
15 V
15 V 500
IDS[A]
IDS[A]
600
400
12 V
400 300
12 V
10 V
200
200
10 V 8V
100
8V
0 0
0 5 10 15 20 0 5 10 15 20
VDS[V] VDS[V]
IDS=f(VDS); Tj=25 °C; parameter: VGS IDS=f(VDS); Tj=175 °C; parameter: VGS
Diagram7:Typ.drain-sourceon-stateresistance Diagram8:Drain-sourceon-stateresistance
0.030 2.0
0.025
1.5
RDS(on)[normalized]
RDS(on)[Ω]
0.020 10 V 12 V 15 V 18 V 20 V
1.0
0.015
0.010 0.5
0 150 300 450 600 750 900 1050 -50 -25 0 25 50 75 100 125 150 175
IDS[A] Tj[°C]
RDS(on)=f(IDS); Tj=125 °C; parameter: VGS RDS(on)=f(Tj); ID=90.3 A; VGS=18 V
Diagram9:Typ.transfercharacteristics Diagram10:Typ.gatecharge
1200 20
18
1000
16
25 °C
14
800
175 °C 12
VGS[V]
IDS[A]
600 10
500 V
8
400
6
4
200
0 0
0 2 4 6 8 10 12 14 16 18 20 0 50 100 150 200
VGS[V] QG[nC]
IDS=f(VGS); VDS=20 V; parameter: Tj VGS=f(QG); IDS=90.3 A pulsed; parameter: VDD
Diagram11:Typ.reversedraincurrentcharacteristics Diagram12:Typ.reversedraincurrentcharacteristics
3
10 103
25 °C
102 102
175 °C
ISD[A]
ISD[A]
101 101
175 °C
100 25 °C 100
10-1 10-1
0.0 1.0 2.0 3.0 4.0 5.0 6.0 7.0 8.0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0
VSD[V] VSD[V]
ISD=f(VSD); VGS=0 V; parameter: Tj ISD=f(VSD); VGS=18 V; parameter: Tj
Diagram13:Avalancheenergy Diagram14:Drain-sourcebreakdownvoltage
1000 810
900
800
800
700
790
600
EAS[mJ]
VDSS[V]
500 780
400
770
300
200
760
100
0 750
25 55 85 115 145 175 -50 -25 0 25 50 75 100 125 150 175
Tj[°C] Tj[°C]
EAS=f(Tj); ID=34.7 A; VDD=50 V VDSS=f(Tj); ID=3.24 mA
Diagram15:Typ.capacitances Diagram16:Typ.Cossstoredenergy
4
10 90
Ciss
80
70
103 60
Coss 50
Eoss[µJ]
C[pF]
40
102 30
Crss 20
10
101 0
0 100 200 300 400 500 600 0 100 200 300 400 500 600
VDS[V] VDS[V]
C=f(VDS); VGS=0 V; f=250 kHz Eoss=f(VDS)
Diagram17:Typ.Qossoutputcharge
400
350
300
250
Qoss[nC]
200
150
100
50
0
0 100 200 300 400 500 600
VDS[V]
Qoss=f(VDS)
6TestCircuits
Table9Bodydiodecharacteristics
Test circuit for body diode characteristics Body diode recovery waveform
VDS
+
VDD
RG2 VDS
IS
- Is
ISO tfr
IS
VDD
dIs / dt
RG1 Ifrm
Qfr
Ifrm
Table10Switchingtimes
Switching times test circuit for inductive load Switching times waveform
VDS
90%
Table11Unclampedinductiveload
Unclamped inductive load test circuit Unclamped inductive waveform
VDSS
VDD
ID
VDS
VDS VDS
ID
7PackageOutlines
PACKAGE - GROUP
NUMBER: PG-HDSOP-22-U01
MILLIMETERS
DIMENSIONS
MIN. MAX.
A 2.25 2.35
A1 0.00 0.15
A2 0.89 1.10
A3 0.5
b 0.50 0.70
b1 0.50 0.90
c 0.46 0.58
D 15.30 15.50
D1 10.23 10.43
E 14.90 15.10
E1 11.91 12.11
e 1.14
N 22
H 20.86 21.06
L 1.20 1.40
O 0° 8°
Figure1OutlinePG-HDSOP-22,dimensionsinmm
8AppendixA
Table12RelatedLinks
• IFXCoolSiCªAutomotivePowerDevice750VG1Webpage:www.infineon.com
• IFXCoolSiCªAutomotivePowerDevice750VG1applicationnote:www.infineon.com
• IFXCoolSiCªAutomotivePowerDevice750VG1simulationmodel:www.infineon.com
• IFXDesigntools:www.infineon.com
RevisionHistory
AIMDQ75R008M1H
Revision:2023-08-28,Rev.2.0
Previous Revision
Revision Date Subjects (major changes since last revision)
2.0 2023-08-28 Release of final version
Trademarks
Allreferencedproductorservicenamesandtrademarksarethepropertyoftheirrespectiveowners.
Disclaimer
WeListentoYourComments
Anyinformationwithinthisdocumentthatyoufeeliswrong,unclearormissingatall?Yourfeedbackwillhelpustocontinuously
improvethequalityofthisdocument.Pleasesendyourproposal(includingareferencetothisdocument)to:
erratum@infineon.com
Publishedby
InfineonTechnologiesAG
81726München,Germany
©2023InfineonTechnologiesAG
AllRightsReserved.
LegalDisclaimer
Theinformationgiveninthisdocumentshallinnoeventberegardedasaguaranteeofconditionsorcharacteristics
(“Beschaffenheitsgarantie”).
Withrespecttoanyexamples,hintsoranytypicalvaluesstatedhereinand/oranyinformationregardingtheapplicationofthe
product,InfineonTechnologiesherebydisclaimsanyandallwarrantiesandliabilitiesofanykind,includingwithoutlimitation
warrantiesofnon-infringementofintellectualpropertyrightsofanythirdparty.
Inaddition,anyinformationgiveninthisdocumentissubjecttocustomer’scompliancewithitsobligationsstatedinthis
documentandanyapplicablelegalrequirements,normsandstandardsconcerningcustomer’sproductsandanyuseofthe
productofInfineonTechnologiesincustomer’sapplications.
Thedatacontainedinthisdocumentisexclusivelyintendedfortechnicallytrainedstaff.Itistheresponsibilityofcustomer’s
technicaldepartmentstoevaluatethesuitabilityoftheproductfortheintendedapplicationandthecompletenessoftheproduct
informationgiveninthisdocumentwithrespecttosuchapplication.
Information
Forfurtherinformationontechnology,deliverytermsandconditionsandpricespleasecontactyournearestInfineon
TechnologiesOffice(www.infineon.com).
Warnings
Duetotechnicalrequirementscomponentsmaycontaindangeroussubstances.Forinformationonthetypesinquestionplease
contactyournearestInfineonTechnologiesOffice.
InfineonTechnologiesComponentsmayonlybeusedinlife-supportdevicesorsystemswiththeexpresswrittenapprovalof
InfineonTechnologies,ifafailureofsuchcomponentscanreasonablybeexpectedtocausethefailureofthatlife-support
deviceorsystem,ortoaffectthesafetyoreffectivenessofthatdeviceorsystem.Lifesupportdevicesorsystemsareintended
tobeimplantedinthehumanbody,ortosupportand/ormaintainandsustainand/orprotecthumanlife.
Iftheyfail,itisreasonabletoassumethatthehealthoftheuserorotherpersonsmaybeendangered.
Authorized Distributor
Infineon:
AIMDQ75R008M1HXUMA1