Wireless Charging Base-LAPTOP

Dell Inc.
Sebastian 2
Wireless Charging Base
Architecture Requirements Document
Document Revision 0.85

Document Owner(s)
Tim Radloff, Nitin Gupte, Don Nguyen (Intel)
DELL CONFIDENTIAL AND PROPRIETARY

This document and the information contained in it is confidential information of Dell and embodies trade secret and proprietary intellectual property of Dell. It
is legally protected and SHALL not be copied, modified, reverse engineered, published, disclosed, disseminated outside of Dell or otherwise used, in whole or
in part, without Dell’s written consent. Copyright 2011 by Dell Inc. The copyright notice does not imply publication of this document or its contents.
Dell - Internal Use - Confidential
1 Purpose of the ARD
The purpose of this document is to provide Dell employees and ODM partners with architectural requirements for developing and
qualifying new Dell platforms.

2 Revision History
Version Description Author Date

0.21 Initial Release – Baseline matching Sebastion 1 ARD v 020 with Nitin Gupte 2015-01-22
regulatory updates
0.3 Updated system description in 3.1 Tim Radloff 2015-01-26
Deleted variant matrix in section 3; Jayton will be an independent
accessory available with any tablet SKU
Updated Cstl in section 3.2 with Jayton tablet CSTL as of DPE
Deleted carrier certification in section 3
Update all of section 4 – ID pics, chassis architecture and form factor,
chassis construction
Altered section 5 to match Jayton Productivity KB base (need EE
confirmation of validity + any additions)
Updated section 6 with Sebastian 2 specific views and stacks for Option
A
Updated thermal results and CPE simulation data in section 7
Miscellaneous edits throughout section 8
Minor edits of NUDDs
0.35 Updated Section 9 with Jayton WC block Diagram, Voltage select pin in Nitin Gupte 2015-01-27
table 9.1 and battery capacities
0.8 Updated Section 9 with Jayton WC block diagram from Adie and all the Don Nguyen 2015-04-10
usage scenario tables Nitin Gupte
0.85 Changed bottom housing material to PC+30% GF to match change to T. Radloff 2015-04-10
Jayton productivity KB base in section 4.2.2
Changed KB open angle to 120 deg to match current Jayton status in
section 5
Elimnated references to “Option A” from section 6
Changed bottom view graphic in section 6.1.2
Updated Z-stack through PRU in section 6.1.3 based on 040815 design

status
Updated Z-stack through Coil in section 6.1.4 based on 040815 design
status
Added preliminary weight estimate in 6.1.5 based on 0320 weight report
Reflected move of rectifier to PRU coil and further broke down the
inductive self heating in section 7.1
Updated section 7.2 with 040815 thermal data
Updated section 8.3 with graphic showing Jayton hall sensor location
Minor edits to NUDDs in section 17

Table of Contents
1 Purpose of the ARD ............................................................................................................................................................................... 2
2 Revision History ..................................................................................................................................................................................... 3
3 System Overview ............................................................................................................................................................................... 129
3.1 System Description....................................................................................................................................................................... 129
3.2 CstL ............................................................................................................................................................................................ 1310
3.2.1 Enterprise CstL ................................................................................................................................................................ 1310
3.2.2 Consumer CstL ................................................................................................................................................................ 1411
4 ME Scope ......................................................................................................................................................................................... 1512
4.1 Chassis Architecture ................................................................................................................................................................... 1512
4.1.1 ID Language..................................................................................................................................................................... 1512
4.1.2 Dimension Targets & Weight Goal ................................................................................................................................. 2017
4.1.3 Form Factor ...................................................................................................................................................................... 2118
4.2 Chassis Construction .................................................................................................................................................................. 2219
4.2.1 Palmrest (C cover) ........................................................................................................................................................... 2219
4.2.2 Bottom Housing (D Cover) .............................................................................................................................................. 2219
4.2.3 Cradle ............................................................................................................................................................................... 2219
4.2.4 Miscellaneous .................................................................................................................................................................. 2219
5 I/O and Other Requirements............................................................................................................................................................. 2320
6 System Reference Layout ................................................................................................................................................................. 2522
6.1.1 Top View ......................................................................................................................................................................... 2522
6.1.2 Bottom View .................................................................................................................................................................... 2623

6.1.3 Z-Stack Through PRU ..................................................................................................................................................... 2724
6.1.4 Z-Stack Through Coil ...................................................................................................................................................... 2825
6.1.5 Preliminary Weight Estimate ........................................................................................................................................... 3027
7 Thermal Design Requirements and Simulation Status ..................................................................................................................... 3027
7.1 Thermal Requirements ............................................................................................................................................................... 3027
7.2 Thermal Simulation Summary ................................................................................................................................................... 3229
8 Miscellaneous ME Requirements ..................................................................................................................................................... 3532
8.1 CRU/FRU List ............................................................................................................................................................................ 3532
8.2 Label Plan ................................................................................................................................................................................... 3532
8.3 Hall Switch (LCD Lid Close Switch) ......................................................................................................................................... 3532
8.4 Mechanical Specs ....................................................................................................................................................................... 3633
9 Wireless Charging Architecture Requirements ................................................................................................................................ 3734
9.1 Block Diagram ........................................................................................................................................................................... 3734
9.2 High-Level requirements ............................................................................................................................................................ 3835
9.3 Charging Options ....................................................................................................................................................................... 3936
9.4 Wireless Charging Base (WCB) ................................................................................................................................................. 4037
9.4.1 Power Receiver Unit (PRU)............................................................................................................................................. 4138
9.4.2 PRU Board ....................................................................................................................................................................... 4441
9.4.3 Coil Board ........................................................................................................................................................................ 4744
10 FW Support Requirement ................................................................................................................................................................. 4946
10.1 PRU FW Update Flow ............................................................................................................................................................. 4946
10.1.1 Wireless Charging Pad Detection and Connection ........................................................................................................ 4946
1. I2C update via EC: .............................................................................................................................................................. 5047

a. Pros: ....................................................................................................................................................................................... 5047
b. Cons: ................................................................................................................................................................................... 5047
2. BLE update OTA: ............................................................................................................................................................... 5047
11 BIOS/EC Update .............................................................................................................................................................................. 5249
11.1 Refer to SW/FW ARD from Cristian Chis – Get the document name and url location .......................................................... 5249
12 Regulatory and Environmental Requirements ................................................................................................................................. 5350
12.1 Product Safety - ENG0004221, HJ741, C8485 and ENG0002520. ........................................................................................ 5350
12.2 Battery Safety- ENG0004262, ENG0006462 and ENG0002520. ........................................................................................... 5350
12.3 Battery Chargers and Battery Charging Circuits - ENG0001839and ENG0002520. .............................................................. 5350
12.4 RFI/EMC- ENG0002520. ........................................................................................................................................................ 5350
12.5 Environmental- ENV0199, 6T198, ENV0380, R8630, N6685, G3515and DN362 and ENG0002520, ENV0025, ISO 11469,
UX264. ............................................................................................................................................................................................. 5350
12.6 Energy- FW252 ........................................................................................................................................................................ 5350
12.7 Telecom and Radio- ENG0002520 .......................................................................................................................................... 5350
13 Reliability Requirements .................................................................................................................................................................. 5451
14 Advance Serviceability Design Guideline ....................................................................................................................................... 5552
14.1 Diagnostics ............................................................................................................................................................................... 5552
14.2 Minimum Repair Time ............................................................................................................................................................. 5552
14.3 Ease of Serviceability Not sure if this is applicable ................................................................................................................. 5552
14.4 Low Cost Maintenance ............................................................................................................................................................. 5855
14.5 Consistent System and Component Identification ................................................................................................................... 5855
15 Dell Engineering Specification and Recommendations ................................................................................................................... 5956
15.1 Dell Process and Requirement Document References ............................................................................................................. 5956
16 PRU Key Components List .............................................................................................................................................................. 6058
17 NUDDs ............................................................................................................................................................................................. 6259
18 RFQ Roles and Responsibilities ....................................................................................................................................................... 6360
18.1 DELL ........................................................................................................................................................................................ 6360
18.2 ODM ......................................................................................................................................................................................... 6360
1 Purpose of the ARD ............................................................................................................................................................................... 2
2 Revision History ..................................................................................................................................................................................... 3
3 System Overview ................................................................................................................................................................................... 9
3.1 System Description........................................................................................................................................................................... 9
3.2 CstL ................................................................................................................................................................................................ 10
3.2.1 Enterprise CstL .................................................................................................................................................................... 10
3.2.2 Consumer CstL .................................................................................................................................................................... 11
4 ME Scope ............................................................................................................................................................................................. 12
4.1 Chassis Architecture ....................................................................................................................................................................... 12
4.1.1 ID Language......................................................................................................................................................................... 12
4.1.2 Dimension Targets & Weight Goal ..................................................................................................................................... 17
4.1.3 Form Factor .......................................................................................................................................................................... 18
4.2 Chassis Construction ...................................................................................................................................................................... 19
4.2.1 Palmrest (C cover) ............................................................................................................................................................... 19
4.2.2 Bottom Housing (D Cover) .................................................................................................................................................. 19
4.2.3 Cradle ................................................................................................................................................................................... 19
4.2.4 Miscellaneous ...................................................................................................................................................................... 19
5 I/O and Other Requirements................................................................................................................................................................. 20
System Reference Layout ..................................................................................................................................................................... 22

6 .............................................................................................................................................................................................................. 22
6.1.1 Top View ............................................................................................................................................................................. 22
6.1.2 Bottom View ........................................................................................................................................................................ 23
6.1.3 Z-Stack Through PRU ......................................................................................................................................................... 24
6.1.4 Z-Stack Through Coil .......................................................................................................................................................... 25
6.1.5 Preliminary Weight Estimate ............................................................................................................................................... 27
7 Thermal Design Requirements and Simulation Status ......................................................................................................................... 27
7.1 Thermal Requirements ................................................................................................................................................................... 27
7.2 Thermal Simulation Summary ....................................................................................................................................................... 29
8 Miscellaneous ME Requirements ......................................................................................................................................................... 32
8.1 CRU/FRU List ................................................................................................................................................................................ 32
8.2 Label Plan ....................................................................................................................................................................................... 32
8.3 Hall Switch (LCD Lid Close Switch) ............................................................................................................................................. 32
8.4 Mechanical Specs ........................................................................................................................................................................... 33
9 Wireless Charging Architecture Requirements .................................................................................................................................... 34
9.1 Block Diagram ............................................................................................................................................................................... 34
9.2 High-Level requirements ................................................................................................................................................................ 35
9.3 Charging Options ........................................................................................................................................................................... 36
9.4 Wireless Charging Base (WCB) ..................................................................................................................................................... 37
9.4.1 Power Receiver Unit (PRU)................................................................................................................................................. 38
9.4.2 PRU Board ........................................................................................................................................................................... 41
9.4.3 Coil Board ............................................................................................................................................................................ 44
10 FW Support Requirement ..................................................................................................................................................................... 46

10.1 PRU FW Update Flow ................................................................................................................................................................. 46
10.1.1 Wireless Charging Pad Detection and Connection ............................................................................................................ 46
1. I2C update via EC: .................................................................................................................................................................. 47
a. Pros: ........................................................................................................................................................................................... 47
b. Cons: ....................................................................................................................................................................................... 47
2. BLE update OTA: ................................................................................................................................................................... 47
11 BIOS/EC Update .................................................................................................................................................................................. 49
11.1 Refer to SW/FW ARD from Cristian Chis – Get the document name and url location .............................................................. 49
12 Regulatory and Environmental Requirements ..................................................................................................................................... 50
12.1 Product Safety - ENG0004221, HJ741, C8485 and ENG0002520. ............................................................................................ 50
12.2 Battery Safety- ENG0004262, ENG0006462 and ENG0002520. ............................................................................................... 50
12.3 Battery Chargers and Battery Charging Circuits - ENG0001839and ENG0002520. .................................................................. 50
12.4 RFI/EMC- ENG0002520. ............................................................................................................................................................ 50
12.5 Environmental- ENV0199, 6T198, ENV0380, R8630, N6685, G3515and DN362 and ENG0002520, ENV0025, ISO 11469,
UX264. ................................................................................................................................................................................................. 50
12.6 Energy- FW252 ............................................................................................................................................................................ 50
12.7 Telecom and Radio- ENG0002520 .............................................................................................................................................. 50
13 Reliability Requirements ...................................................................................................................................................................... 51
14 Advance Serviceability Design Guideline ........................................................................................................................................... 52
14.1 Diagnostics ................................................................................................................................................................................... 52
14.2 Minimum Repair Time ................................................................................................................................................................. 52
14.3 Ease of Serviceability Not sure if this is applicable ..................................................................................................................... 52
14.4 Low Cost Maintenance ................................................................................................................................................................. 55
14.5 Consistent System and Component Identification ....................................................................................................................... 55
15 Dell Engineering Specification and Recommendations ....................................................................................................................... 56
15.1 Dell Process and Requirement Document References ................................................................................................................. 56
16 PRU Key Components List .................................................................................................................................................................. 58
17 NUDDs ................................................................................................................................................................................................. 59
18 RFQ Roles and Responsibilities ........................................................................................................................................................... 60
18.1 DELL ............................................................................................................................................................................................ 60
18.2 ODM ............................................................................................................................................................................................. 60

3 System Overview
3.1 System Description
Dell, in partnership with Intel, will introduce a new wireless charging keyboard base as part of the Jayton tablet ecosystem. This
ARD outlines the architectural requirements for the development of this base. A charging pad may or may not be developed by
Dell as part of this ecosystem. Regardless, the keyboard base will be compliant to A4WP standards and should be compatible to
any A4WP compliant charging base.
Sebastian 2 will closely follow the design of the Jayton Productivity keyboard base in both ID and form. Ideally, it will leverage
all mechanical parts and vary only in the components necessary to enable wireless charging. These include a wireless charging
receiver control board (PRU) and associated coil, a derivative battery pack based on a Dell-approved battery cell, and an
expanded pogo interface. The electrical design will include a battery charger that takes input from the wireless charging module
and circuitry to enable and control power delivery to the tablet.

3.2 CstL
The following list is the Jayton tablet CSTL as of DPE and is for reference only to help in determining the potential scope of
work for the KB base. The final CSTL that is applicable to the wireless charging KB base will be confirmed at DPE (ARD 1.0).
3.2.1 Enterprise CstL

3.2.2 Consumer CstL

4 ME Scope
4.1 Chassis Architecture
Design of the wireless charging KB base should maximize part leverage with the Jayton productivity KB base. The goal is to have
common mechanical parts that enable the population of standard or wireless charging components i.e. PRU board, coil, battery and
base board. Ideally the base board is common to or a derivative of the productivity KB base board achieved by the pop and de-pop of
components if necessary.
4.1.1 ID Language
It is intended that the wireless charging base precisely follow the form and ID of the Jayton productivity KB base. Any
deviations should be highlighted to Dell engineering and ID teammembers as soon as possible. Requirements that might be
unique to the wireless charging KB base will be defined in a separate ID book.

4.1.2 Dimension Targets & Weight Goal
The wireless charging KB base should match the dimensions of the Jayton productivity KB base which is matched to the Jayton
tablet.
 X = 279.30 mm
 Y = 189.76 mm
 Z = 9.59 mm (not including feet)
o Note that cradle should be designed to give 0.6mm spacing between KB palmrest and tablet front surface.
The weight of the tablet should be equivalent to the Jayton productivity KB base weight + adjustments for the wireless charging
components and battery pack. For reference, the nominal Jayton productivity KB base weight is estimated to be 691g.

4.1.3 Form Factor

4.2 Chassis Construction
Below is for base material reference only. CMF can be found as part of the Jayton productivity KB ID book. Alternative materials
should be discussed with Dell SA and/or SE before changes are made.
4.2.1 Palmrest (C cover)

0.6 mm Aluminum overlay + 1.0 mm PC+ABS or agreed to alternative
4.2.2 Bottom Housing (D Cover)
1.2 mm PC+30% GF or agreed to alternative
4.2.3 Cradle
1.5 mm PC+ABS or agreed to alternative
4.2.4 Miscellaneous
Internal support brackets and counterbalance weights should target the most cost effective materials that can meet functional
requirements. Mg-Al should be last alternative for resolving any structural concerns.

5 I/O and Other Requirements
Keyboard
 NST keyboard with Backlight and Cap Lock LED (in keycap), no numeric keypad
 Support for regional keyboard layouts
 Adjustable hinge Angle / Articulation. Maximum opening angle to match Jayton KB base (120°). Increased range should be
investigated.
Integrated Battery
 14Whr; 2S1P
 Leverage 305194 battery cell from Jayton KB base
Power and Charging
 NVDC charger via USB Type C with PD
 USB Type C connector SHALL be inaccessible when docked to the Tablet
 1x dual color (Amber/White) Power / Charge / Diagnostic LED
 Battery authentication only when connected to the Tablet. Productive Base does not support Battery authentication in
standalone mode.

Buttons
 No Buttons (Power, Wireless ON/OFF, Media Direct, WHK, Volume Up/Down, etc.)
o Wireless ON/OFF to be supported via Fn-Key (UI)
Video and Data ports
 None
 Precision Touch Pad - Synaptics TM-P2819-001 (Similar to Jefferson)
 No additional Pointing devices
 No Touch Pad illumination
Active Stylus Garage
 Support to garage and charge 5.3mm Super Cap Active Stylus; Explore magnetic attach for 9.5mm pen accessory (UI)
 Reference charging circuit
 Charger characteristics: Super Cap + ASIC

o Voltage: 2.5 ~ 5.25V (max)
o Current: 100 ~ 200mA (max)
Interface to Tablet
 Pogo pins
Security
 No Cable Lock

註解 [A1]: Should we rem
6 System Reference Layout

6.1.1 Top View

6.1.2 Bottom View

6.1.3 Z-Stack Through PRU
NOTE: Critical stack is driven through battery and has been established as part of the Jayton Productivity KB base development.

6.1.4 Z-Stack Through Coil

6.1.5 Preliminary Weight Estimate
7 Thermal Design Requirements and Simulation Status

7.1 Thermal Requirements
The KB base must meet NB cooling requirements as follows (28C ambient):
o Keyboard skin temperature: 43 C
o Palmrest skin temperature: 39 C
o Palmrest L/R delta temperature: 6 C
o Bottom skin temperature: 53 C
o NOTE: 5 deg C allowance for above temperatures with lid closed and LCD off.
Below are the key component powers that should be factored into the thermal design of the KB base:
Item Power (Watt)

PRU coil 1
PRU inductor 0.2
PRU coil rectifier (total) 0.8
PRU VR 0.4
PTU coil 1.75
PTU PCB w/ components 3.4
Inductive self-heating of metal components in KB base (excluding 1.08 KB support
areas shadowed by ferrite shield) 0.07 PRU PCB
0.14 PRU Coil
KB base board 1
Total 9.84

7.2 Thermal Simulation Summary
Thermal solution overview:

Simulated results as of 040815

8 Miscellaneous ME Requirements
8.1 CRU/FRU List
All serviceabile components will be FRU only. Service expectations should be similar to the Jayton productivity KB base.
ODM must develop and provide a detailed document showing the procedure (screw location, quantity and order) for removal and
replacement of the following components:
o Bottom cover, battery, PRU coil, PRU PCBA, motherboard.
8.2 Label Plan

ODM must develop and provide a detailed document showing the location of all required labels.
8.3 Hall Switch (LCD Lid Close Switch)

The KB base shall have a hall sensor magnet placed in the same location as the Jayton Productivity KB base (which is compatible
to Jayton tablet hall sensor placement shown below).

8.4 Mechanical Specs
The KB base shall meet requirements listed in the Latitude System Mechanical Spec list (ENG0004160) and Eng. Design and
Tooling checklist (ENG0011607).
The KB base should be tested in combination with the Jayton tablet and meet all requirements for design and reliability specified
in the Jayton and Sebastian RSV requirements documents.

9 Wireless Charging Architecture Requirements
9.1 Block Diagram
Figure 9-1: Wireless-Charging Architecture Block Diagram
Jayton Tablet Power Path Block Diagram 3.3V
219K
B_POGO_DET_R T_POGO_DET_R
3.3V → 1.55V 0V → 3.14V
195K
Vcc BASE TABLET
from Battery 3.3V
Vcc
10K
B_POGO_DET_L T_POGO_DET_L
ACOK
0V → 0V 3.3V → 0V
D M7412 3 - 2
0
1SHOT_CLR C Q
BATPRES#
R Q
+AC_BAT_SYS
VBUS_ACOK A
To System VR BASE TABLET
S3
B
DSKTP_OK
AC#1 S1b
30W AC/DC +CHG_IN 10mohm
VBUS1 +VBUS1_IN +BAT_TABLET
USB Type C Type C
w/PD VBUS_ACOK
Charger Q8806
+BATT_LDO_T
Adapter 1SHOT_CLR
NVDCI BAT_GATE_1_TABLET S3a S3b
bq24777 LDO
+ WCI2C_EN
Ref -
+SYS_DOCK
SYSTEM_WAKE#
TI TPS65982 BMU SYS_PRES# One PWR_BUTTON#
SMBUS
5VBUS1
Shot
ACOK
PROC_HOT
I2C to EC DSKTP_ACOK Microchip ACAV_IN
TPS43060 WC_ACOK Host Controller +BAT_TAB_EN#
Boost VR
5V @ 1.5A VBUS_ACOK POGO_DET#
VCONN_1
CC_1
GPIO5
GPIO7
USB_ID to PCH
+DOCK_POGOPIN
EN_VBUS2 S4
SYSTEM_WAKE#
DEBUG4
DEBUG3
GPIO8 +BAT_TAB_EN
FAULT# +BAT_TABLET
GPIO0
AC_DOCK_IN
SPI VBUS1 LDO
TPS70933
+BAT_DOC K_EN S4a S4b
S5a
S5 S5b
+BATT_LDO_T +BATT_LDO_P
POL AC_DOCK_IN DSKTP_ACOK
AMSEL 3.3V +
+DOCK_POGOPIN
EN -
I2C_INT
I2C
Ref
VCC_EC
D8803
+3V_LDO
VBUS2 5V @ 1.5A
POGO_DET#
Type A TPS2546 From 3.3V
VBUS_ACOK
D+/D- EN
BC1.2 D+/D- Switcher +3.3V
POGO_DET#_L POGO_DET_R
EN_VBUS2
CTL
ILIM
3.3V +5V_ALW
ILIM_SEL
to PCH
I2C
Load
I2C_INT
10K Switch
DOCK_PWR_EN
195K
+BATT_LDO_P
AC#2 PWR POGO

DET L
I2C
DAT
I2C
CLK
GND
DOCK
PWR PWR
PWR GND
DOCK
GND
DOCK
I2C 5V
VBUS
D- D+
POGO
DET R
Batt
LDO
30W AC/DC TABLET 40 Pin Conn. 12/ 20V 12/ 20V INT
USB Type C
w/PD
Adapter P-BASE PWR POGO I2C I2C GND
PWR PWR
PWR GND GND I2C 5V
D- D+
POGO Batt
12/ 20V DET L DAT CLK DOCK 12/ 20V DOCK DOCK VBUS DET R LDO
INT
+BATT_LDO_P
I2C#1_INT
TI CC2541 S8
VBUS_P
I2C#1
Blocked when Type C S7a
Wireless 1,2,3
S7b
docked with Tablet #2
Source from
Charger
10W @ 12V
S7 5V_VBUS
Ref_H
+ +BATT_LDO_P
-
POGO_DET#
8 10 7 4,5 6,9,12 WB_ACOK Vcc POGO_DET#
S9
I2C_INT
+ 215K +
(SMBUS)
I2C#2
+VCC_EC
WC_EN
- IO Ref_L -
S9_ON
Expander
WB_EN# +BATT_LDO_P
POGO_DET#
Dell Proprietary VBUS2 VBUS_BASE

CHG_IN
10mohm
Charger
Confidential iADP iADP
NVDCI
bq24777 BAT_GATE_1_BASE
BAT_FET
ACAV_IN
ACOK USB2.0
5V @ 1.5A
DO NOT DISTRIBUTE CC_2

+BAT_BASE
ALPS
SMBUS
VCONN_2 to I2C#2 PTP

TI TPS65982 WB_EN#
PTP_INT
SPI
FAULT# I2C#1_INT PTP_EN
SYSTEM_WAKE# +BATT_LDO_P
SYSTEM_WAKE# I2C#1
FAULT#
SMBUS
LDO
WC_EN I2C#2 (SMBUS)
Charge Ctr
+VCC_EC
WB_ACOK
+BAT_BASE BMU SYS_PRES# One
POGO_DET#
VBUS2 LDO
Shot
TPS70933
+3.3V MSP430
5V_VBUS
Source Ctr KSO/KSI
KB
+BAT_BASE_LDO Load GPIO
Switch EN
GPIO
KB BL
Stylus
PTP_EN
PTP_INT
04/08/2015
Note: System Schematics take precedence over this document. Signal names on this document may be different from schematics.
MW/AT

Figure 9-2: Jayton Wireless Charging Base
9.2 High-Level requirements

1. Wireless Charging Power Receiver Output Power is 10W minimum to recharge Jayton Tablet Battery and Base Battery
(34Whr (2S1P) and 14Whr (2S1P) respectively) in 5.5 hours while system is in OFF (Connected Standby) mode.
2. Charges Tablet Battery via spring contact as defined in Productivity Base
3. High-Level Use-Cases while Notebook sits on mat (On-Table Mode only)
a. W/C Base sits on Mat; Mat charges W/C Base only
b. W/C Base and Tablet sit on Mat; Mat charges W/C Base and Tablet

9.3 Charging Options
Table 9-1: Charging Options
CASE TABLET WC BASE PRIMARY PWR SOURCE TABLET POWER WC BASE POWER
WCB TABLET MODE MODE DESCRIPTION
# USB ADP 1 BATT WC PWR USB ADP 2 BATT TABLET WCB S3 S4 S5 CHGR S7 S8 S9 CHGR
1 N Y Detach X X X X X X X N/A N/A N/A N/A N/A N/A N/A N/A Detach Mode - Tablet Only
2 Y N Detach N/A N/A OFF Unplugged Discharged N/A OFF N/A N/A N/A N/A OFF OFF OFF OFF No Power Mode; No Tablet
3 Y N Detach N/A N/A OFF Unplugged Full N/A Base Batt N/A N/A N/A N/A OFF OFF OFF OFF No Tablet; WCB powered by WCB Battery
4 Y N Detach N/A N/A OFF Inserted Discharged N/A USB ADP 2 N/A N/A N/A N/A OFF OFF OFF ON No Tablet; WCB powered by USB ADP 2
5 Y N Detach N/A N/A OFF Inserted Full N/A USB ADP 2 N/A N/A N/A N/A OFF OFF OFF ON No Tablet; WCB powered by USB ADP 2 w/ Full WCB Battery
6 Y N Detach N/A N/A 10W Unplugged Discharged N/A WC PWR N/A N/A N/A N/A ON OFF OFF ON No Tablet; WCB powered by WCP
7 Y N Detach N/A N/A 10W Unplugged Full N/A WC PWR N/A N/A N/A N/A ON OFF OFF ON No Tablet; WCB powered by WCP w/ Full WCB Battery
8 Y N Detach N/A N/A 10W Inserted Discharged N/A USB ADP 2 N/A N/A N/A N/A OFF OFF OFF ON No Tablet; WCB powered by USB ADP 2 w/ WCP
9 Y N Detach N/A N/A 10W Inserted Full N/A USB ADP 2 N/A N/A N/A N/A OFF OFF OFF ON No Tablet; WCB powered by USB ADP 2 w/ WCP & Full WCB Battery
10 Y Y Attach Unplugged Discharged OFF Unplugged Discharged OFF OFF OFF OFF OFF OFF OFF OFF OFF OFF Attach Mode with No Power
11 Y Y Attach Unplugged Discharged OFF Unplugged Full Base Batt Base Batt OFF OFF ON OFF OFF ON ON OFF Attach Mode, Tablet/WCB powered by WCB Battery
12 Y Y Attach Unplugged Discharged 10W Unplugged Discharged WC PWR WC PWR ON ON OFF ON ON ON ON OFF Attach Mode, Tablet/WCB powered by WCP
13 Y Y Attach Unplugged Discharged 10W Unplugged Full WC PWR WC PWR ON ON OFF ON ON ON ON OFF Attach Mode, Tablet/WCB powered by WCP w/ Full WCB Battery
14 Y Y Attach Unplugged Full OFF Unplugged Discharged Tablet Batt Tablet Batt ON OFF OFF OFF OFF ON ON OFF Attach Mode, Tablet/WCB powered by Tablet Batt
15 Y Y Attach Unplugged Full OFF Unplugged Full Base Batt Base Batt OFF OFF ON OFF OFF ON ON OFF Attach Mode, Tablet/WCB powered by WCB Batt
16 Y Y Attach Unplugged Full 10W Unplugged Discharged WCP WC PWR OFF ON ON ON ON ON ON OFF Attach Mode, Tablet/WCB powered by WCP w/ Full Tablet Battery
17 Y Y Attach Unplugged Full 10W Unplugged Full WC PWR WC PWR OFF ON ON ON ON ON ON OFF Attach Mode, Tablet/WCB powered by WCP w/ both Full Batteries
18 Y Y Attach Inserted Discharged OFF Unplugged Discharged USB ADP 1 USB ADP 1 ON OFF OFF ON OFF ON ON OFF Attach Mode, Tablet/WCB powered by USB ADP 1
20 Y Y Attach Inserted Discharged 10W Unplugged Discharged USB ADP 1 USB ADP 1 ON OFF OFF ON ON ON ON OFF Attach Mode, Tablet/WCB powered by USB ADP 1 w/ WCP
21 Y Y Attach Inserted Discharged 10W Unplugged Full USB ADP 1 USB ADP 1 ON OFF OFF ON ON ON ON OFF Attach Mode, Tablet/WCB powered by USB ADP 1 w/ WCP & Full WCB Battery
22 Y Y Attach Inserted Full OFF Unplugged Discharged USB ADP 1 USB ADP 1 OFF OFF ON ON OFF ON ON OFF Attach Mode, Tablet/WCB powered by USB ADP 1 w/ Full Tablet Battery
23 Y Y Attach Inserted Full OFF Unplugged Full USB ADP 1 USB ADP 1 ON OFF OFF ON OFF ON ON OFF Attach Mode, Tablet/WCB powered by USB ADP 1 w/ both Full Batteries
24 Y Y Attach Inserted Full 10W Unplugged Discharged USB ADP 1 USB ADP 1 OFF OFF ON ON ON ON ON OFF Attach Mode, Tablet/WCB powered by USB ADP 1 w/ Full Tablet Battery & WCP
25 Y Y Attach Inserted Full 10W Unplugged Full USB ADP 1 USB ADP 1 ON OFF OFF ON ON ON ON OFF Attach Mode, Tablet/WCB powered by USB ADP 1 w/ both Full Batteries & WCP
Note:
1. “N” = Not Available or Not inserted; “Y” = Available or Inserted; “X” = Either way or don’t care.
2. Use-Case #1, since WCB is not in this mode, there is no wireless-charging in this mode. Refer to Jayton documentation for
details of Tablet-only operation
Detailed use-case flows will be documented in the Detailed Use-Case Flow document (to be completed later).
Note that in the Wireless Charging Base (WCB), the power consumed by the electronic circuitries is very low, hence power is
supplied through the LDO with input from the power-OR fro BAT_BASE, VBUS2 and 5V_VBUS.

9.4 Wireless Charging Base (WCB)
Refer to ME/ID section for illustration of the WCB which comprises of the following main blocks:
 Jayton Base components and circuitries (i.e. keyboard, track pad …) The details on this block is documented in the Jayton
ARD.
 Power Receiver Unit. Refer to below section for more details.

Figure 9-3: WCB Block Diagram
9.4.1 Power Receiver Unit (PRU)

The PRU contains the following sub-blocks:
 PRU PCB
 Coil PCB
 Cabling between the PRU PCB and Coil PCB
Figure 9-4: PRU Block Diagram

Figure 9-5: PRU and Coil PCB

9.4.2 PRU Board
9.4.2.1 Board Outline and Component Placement
Figure 9-6: PRU PCB Outline and Component Placement
Refer to above figure for the board outline and component placement including z-height information (all components shall be lower
than the z-height restriction of 1.5mm). The dimension of the PRU PCB is 57x44x0.8mm (x-y-z).
9.4.2.2 Detailed Description

The PRU PCB rectifies the AC power (6.78MHz, up to 40V) from the Coil-PCB and regulates it, using a Buck-Boost Regulator, to a
19V DC voltage to provide power to the WCB circuitries. The BLE IC communicates to the WCP (Wireless Charging Pad) via a
built-in Blue-Tooth antenna (refer to red-color block in 錯誤! 找不到參照來源。Figure 9-23). One additional regulator (3.3V) is
used to provide power to the BLE and miscellaneous house-keeping circuitries.
9.4.2.3 Pin List
Table 9-219: PRU Pin List
PIN # PIN NAME PIN DESCRIPTION I/O/PWR VOLTAGE LEVEL

1 VWC Output Voltage of Wireless Charger PRU PWR 12V
4 I2CSCL I2C Clock I/O 3.3V
5 I2CSDA I2C Data I/O 3.3V
6 GND Ground PWR 0V
7 I2CALERT I2C Alert O 3.3V
8 3.3V VIN +3.3V for BLE PWR 3.3V
9 GND Ground PWR 0V
10 CHRDIS Charge Disable I 3.3V
11 Vselect No connect – 19V (BP2), Gnd – 12V (Jayton) IN 0V (GND)
12 GND Ground PWR 0V
 Connection to the Base circuitries is via a 12-pin 0.5mm pitch WTB connector (P/N: Aces 50264-01201-001). FPC
information will be to be updated by Tim
 Connection to the Coil-PCB is via a flex 4-wire cable.

9.4.2.3.1 3.3V power supply and I2C Buffer
Figure 9-7: 3.3V VIN and I2C Buffer block diagram
Refer to Figure 9-7. Supply voltage (VCC) to the BLE uC is provided by a Diode-OR between the 3.3V Buck on the PRU Board and
the Base System VREG 3.3V output via either Diode D1 or Load-Switch LS. A Buffer is used to prevent the BLE I2C from being
loaded down with the case of an unpowered PRU Board.

9.4.3 Coil Board
9.4.3.1 Detailed Description
The Coil Board contains the following components:

 Receiver Coil which is made of the PCB trace
 AC and Tuning Capacitors to account for system’s parasitics such as metal coupling, etc…
 Rectifier Diodes to rectify the sinusoidal AC voltage
 Ferrite sheet(s) to reduce coupling of the RX Coil to its surrounding metals
 Connection to the PRU Board via a 4-pin cable
Figure 9-8: Coil Board block diagram

9.4.3.2 RX Coil
Figure 9-9: Overall Rx Coil Mechanical Information
Refer to latest Coil Board for the updated mechanical information.

10 FW Support Requirement
10.1 PRU FW Update Flow

10.1.1 Wireless Charging Pad Detection and Connection
a. When Wireless Charging base is first placed on the mat, the Base receives the periodic beacon from mat and starts
BLE advertisements.
b. Mat receives the BLE advertisements and also, detects change in impedance to identify that it is the same device that
has been placed on the mat.
c. Mat responds to the advertisement with connection request and establishes connections with the base.
d. Mat evaluates the capabilities (FW, HW version etc.) of the Base by reading the static parameter of base.
e. Mat informs its capabilities (FW, HW version etc.) by writing the static parameter to the base.
f. Base writes Dynamic parameter about itself to the mat and Mat responds with PRU control packet indicating
“Charge Enable” allowing wireless charge to begin.
g. After “Charge Enable” is received, Host EC is notified of the wireless charging connection.
h. Host EC sends ACPI notification to OS about the Wireless charging mat
10.1.1.1 Host Wireless Charging Application

a. Wireless Charging application running on the Host OS, receives the Wireless Charging mat availability event and
gets information about the Base and Mat capabilities.
b. WC Application sends a query to the Web service (OEM site) about the latest FW specification available for the
base.
c. Optionally, a location for FW image is also provided for developers to patch the FW (Local FW updates).
d. After receiving the FW version for the base and/or the Pad from the web service, it is compared against the FW of
the base and/or pad.
e. If an update is required, App sends command to PRU to prepare to receive the latest FW update. After the full FW
is received and validated by the PRU, It sends a PRU update message to PTU through a proprietary BLE service
message, where PRU enters FW update mode while still receiving charge from the PTU. After the new FW is
updated, ACK message is sent to the application.
Two options available here to transfer the PRU FW image over to the PRU.
1. I2C update via EC: In this mode, FW image is transferred to the PRU via the Host EC using the I2C connection b/w the host
and the base.
a. Pros: No user interaction required as FW transfer is through I2C. The transfer is secure as there is no wireless
connectivity involved.
b. Cons: Host EC FW needs to be modified to support the capability of transferring FW image through I2C to PRU.
2. BLE update OTA: In Win8.1 and Win Threshold, auto-pairing with BLE device isn’t supported through API’s. As a result, in
order to establish BLE connection w/ PRU, user will have to manually select the PRU device and after connection has been
established WC application can transfer the FW image to the PRU.
The task to identify PRU can be simplified through the following protocol to allow the user to easily identify PRU and connect
readily with the device.
a. As part of the command by the application to cause PRU FW update command, WC Application sends the system
name and current user login to the PRU.
For eg: Home_PC%Siva (system name%user login name)
b. PRU will then change its advertising name into “Home_PC%Siva_Wireless base” and also return an ACK to the
application about the successful reception of the message.
c. This will help the user to clearly identify the base from other BLE devices in the vicinity.
Pros:
 No major FW changes. Host FW image will modify to support BLE related commands are required to support initial
commands from application.
Cons:
 User interaction is required. Application needs to inform the PRU of the host name %user name and BLE connection
name must be changed accordingly.
 Increased Security exposure as FW is sent OTA
 >Win8.1 is required in order to use BLE APIs
Figure 10-1 shows the sequence diagram of this communication b/w PRU, PTU and the application. Given the complexity in
achieving BLE OTA FW flashing, the preferred method for PRU FW update must be over I2C, as there will be no user involvement.

Figure 10-1: PRU FW Update Sequence diagram via I2C
Cloud
WC App Host EC PRU PTU
Service
Base placed
on PTU
Advertisement
Connect Request
Dynamic Parameter
Charge Enable
WC ready
WC ready
Query latest FW version
FW Version ACK
Query FW version
PRU_PTU FW version
PRU_PTU FW version
PRU_PTU FW version
alt
FW Update
FW Version > PRU/PTU FW Version
FW update available
ACK ACK
Send FW Image
FW Image through I2C
FW Update mode
ACK
Rx &
Flash FW
FW update complete
ACK
Update complete
Update complete
FW Version = Latest
Do Nothing

11 BIOS/EC Update
11.1 Refer to SW/FW ARD from Cristian Chis – Get the document name and url location

12 Regulatory and Environmental Requirements
Systems, PSUs, EPSs, Batteries and Peripherals shall comply with all legal requirements for all countries product will be shipped to as defined
by the Country Ship to List (CStL) through the sales life of the product. For more information please see the Dell specifications listed below.
For additional assistance contact Regulatory Compliance Engineer assigned to the program and see Regulatory Statement of Work.
12.1 Product Safety - ENG0004221, HJ741, C8485 and ENG0002520.

At a minimum, all platforms and peripherals marketed, sold or shipped by Dell shall comply with the applicable safety standards for the
product and marked by at least one third-party safety agency that requires factory surveillance. If the product is utilizing a UL NRTL mark and
built in any Dell factory, then acceptable traceability has to be provided. If the product is utilizing a CCC mark and built in any Dell factory, then
acceptable critical component verification test report has to be provided.
12.2 Battery Safety- ENG0004262, ENG0006462 and ENG0002520.
12.3 Battery Chargers and Battery Charging Circuits - ENG0001839and ENG0002520.
12.4 RFI/EMC- ENG0002520.
12.5 Environmental- ENV0199, 6T198, ENV0380, R8630, N6685, G3515and DN362 and ENG0002520, ENV0025,
ISO 11469, UX264.
Note: Must be compliant with EU RoHS or the local legal requirement, whichever is most stringent, and a Supplier Declaration of
Conformity (SDOC) must be provided to Dell.
12.6 Energy- FW252

12.7 Telecom and Radio- ENG0002520
For additional assistance contact Regulatory Compliance Engineer assigned to the program and see Regulatory Statement of
Work.

13 Reliability Requirements
The complete platform must meet quality and life cycle requirements per Dell specifications.
Motherboards and PSUs need to comply with Dell De-rating specification 9E154 and deliverables by the Dell De-rating Tool,
DIDT.
For the following capacitor types, motherboards and PSUs must adhere to the Dell PSL (TM657) and PSU PSL (ENG0002619)
respectively; and comply with Dell De-rating specification (9E154)
Liquid Electrolytic Capacitors
Solid Electrolytic Capacitors
Tantalum Polymer Capacitors
Other Liquid E-cap suppliers can be used if they first demonstrate compliance to Dell E-Cap Qualification spec REL0049 for
Dell Reliability approval.
Must meet Dell PSU/adapter specification (H6578) with the addition that the PSU/adapter must be designed to 3 years/24x7
(100% duty cycle)
Must adhere to Dell Non-Negotiable List (DPN J847K)
All electrical connectors/interconnects must be compliant to the connector plating requirements in Section 4.4.4 of ENG0011674
LCD shock isolation material must be utilized in the +/- X and +/-Y positions at minimum to prevent excessive field exposure to
LCD Glass cracking. Validation of the solution shall be confirm during execution of the new requirements listed in Shock &
Vibration Spec list included those listed below
New/updated requirements listed in Shock & Vibration SOW (SV0416) and Reliability SOW (REL0032) include,
but are not limited to:
Weighted Shock Test – SV1119 (160G Design Goal)
Free Fall Drop Test – SV1038 (Category II and IV)
Internal Connector Cycling – REL0873
Front of Screen Loading test (Feature Dependent <0.5mm LCD Glass) – REL0069
Bold Peak 2 12.5” FHD w/Touch is 0.7mm glass, could be NA

14 Advance Serviceability Design Guideline
The complete Serviceability Requirements Document should be referenced from Agile Part Number: ENG0004802
14.1 Diagnostics
All Dell products must be able to utilize consistent diagnostic methods currently employed by other platforms. These need to be
multi tiers diagnostics such as ePSA, beep and/or LED codes, BIST.
14.2 Minimum Repair Time

Design consideration needs to be geared towards designs that allow as many Customer Replaceable components (CRU) as
possible vs. on site technician or even return to Depot requirements for repair of key components. CRU’s not only save Dell
money, they result in the shortest amount of down time for our customers.
Requirements
No key component removal steps should require the removal of more than the desired commodity targeted for
removal. (Access to key components via removal of access door is acceptable)
FRU/CRU items (e.g. suspend-switch magnets) that require functional alignment should be attached via a
method other than adhesives. (excludes EMI Gaskets, removable rubber bumpers and screw caps)
Hinge up Display assembly should allow installation or removal without removing other major components (i.e.
Motherboard, palm rest, thermal solution etc.)
Tool less removable covers (i.e. hinge covers, battery covers, etc.) should not include electrical parts or cables
permanently attached.
Glue or bonding agents should not be used to retain components intended to be service replacement parts.
(Excludes cabled coin-cell; EMI Gasket, removable rubber bumpers and screw caps).
14.3 Ease of Serviceability Not sure if this is applicable

While many aspects of ease of serviceability rely heavily on Diagnostics and Minimum Repair times, this section also relies on
design of commodities with the ability to:
Self-test and predict failures before they happen. Current commodities today that meet this requirement are HDD’s through
SMART test and batteries via heath status, other methods to early detect key commodities need to be considered/developed.
This will allow pro-actively, system to send self-dispatch notifications to Dell and prevent system failures.

Common foot print of multiple sourced sub-assemblies is also key in meeting ease of serviceability. Some AIO LCD sub-
assemblies from multiple sources have been radically different in look and fell and connection locations which result in
confusion not only for factories but on field technicians which work across the full spectrum of Dell products.
Requirements
The system shall reserve a minimum of 10 GB of HDD/SSD Recovery Partition space for Dell Backup and
Recovery Manager System image(s).
The system shall reserve a minimum of 1 GB of HDD/SSD space for the Dell Backup and Recovery Manager
application.
Mechanical components in serviceable areas of the system shall be designed to prevent injury to service
personnel.
Labels must not cover screws used to access a FRU.
System shall provide a mechanism (e.g. Jumper, Application) to clear BIOS password in the field.
Bezels shall not obstruct the view of high-level status or error indicators without providing alternative method
to view the indicators.
FRUs/CRUs shall be designed so that they can only be installed in the proper orientation.
Cables shall not be routed in such a way that requires the removal of a major component (e.g. motherboard) to
remove or replace the cable. (excluding DC-IN Jack cable solution)
Cables for one component shall not be routed across another component thus requiring the first components
cable to be removed in order to access the second component.
Module connectors with limited or no visibility to the service technician shall use blind-mate connectors.
All cable / component connectors shall provide some method to ensure a complete connection (e.g. tactile
feedback, etc.).
Connectors and sockets requiring orientation specific insertion shall provide mechanical keying to assure
correct match-up of mating connectors and proper orientation.
LCD cables shall have a design to ensure cable retention on both ends of the cable (eg. Locking Connectors)
Breaking the thermal bond between a component and its heat-sink should not be required for any FRU other
than that component and heat-sink.
Screws necessary to remove a FRU should not be hidden by any other non-FRU/CRU item.
Self-tapping / self-threading screws shall not be used for FRU/CRU retention.
Screw locations required for removal of any internal FRU/CRU shall be marked.
Markings for FRU/CRU (eg. memory, drives, etc.) ordering shall be provided.
Markings for identification of major FRU locations shall be provided.
Markings for FRUs/CRUs shall match what is displayed by BIOS.
EMI springs or gaskets shall be securely fastened to the chassis and cannot be damaged or knocked off with
normal use or service.
Markings for system board interface ports shall be labeled (e.g. SATA, PCI, DIMM, CPU).
All FRU system components and sub-assemblies are to be self-aligning. No fixtures, gages, shims or other
tools are to be made necessary to assure proper fit and location of any FRU.
Top commodities should be a CRU. This includes HDD, Memory, ODD, WLAN and Battery (as applicable)
For a FRU part being assembled or mounted by screws, all the screws used shall be of one single type.
For CRU (Customer Replaceable Unit) when tools are required, it shall be restricted to an ordinary household
screw driver. (e.g. no Torx screws)

14.4 Low Cost Maintenance
By utilization of common commodities, commodities that can be easily replaced and then repair, Dells warranty cost will be kept
to the lowest possible per systems. This is also very important for our retail outlets and carry-in locations which cannot stock
large variety of parts to service our product portfolios. Minimum revision changes and backwards compatibility are also key in
keeping minimum inventory levels.
Requirements
To prevent electrical shorting between antenna cables and PCBAs when wireless cards are not present, cable
routing should provide adequate retention or insulating caps to any exposed metallic surfaces.
Cables must be routed in a manner to ensure they do not become damaged.
Cables designed to be removed or replaced in the field shall provide a mechanism to remove stress from the
cable during removal (e.g. pull tabs or grips)
Cables shall be secured in place by mechanical means such as clips or hooks, which shall allow easy release of
cables repeatedly without suffering damage or deformation. No tape shall be allowed.
LCD Panels should be designed to be field serviceable without requiring an entire Hinge Up Display
replacement.
14.5 Consistent System and Component Identification

Dells ability to track parts by PPID is vital and in some cases a legal requirement for traceability for components which could
result in safety issues. Warranty entitlement is also dependent upon system labeling information which identifies the product
through unique numbering which identifies make/model. It will also be key to support Phone Home support.
Requirements
Service Tag shall be externally viewable.
Express Service Code shall be externally viewable.
FRUs/CRUs shall be marked per Dell's PPID standard

15 Dell Engineering Specification and Recommendations
15.1 Dell Process and Requirement Document References
The attached represents a set of baseline engineering specifications the must be followed. Any cases where these requirements
conflict with requirements explicitly given in the other sections of this ARD must be brought to Dell’s attention for clarification.
Specification Revision
Ref. Number Specification Title
Number Number
Battery
ENG0001779 A02 Dell Li Ion Pack Safety Qualification Specification
ENG0002520 A11 Dell Battery Safety Specification
ENG0001839 A01 Dell Charger Safety Requirements
1W829 A06 Dell Battery EE specification 1W829 Rev A06
IEEE 1625 or IEEE Standard for Rechargeable Batteries for Multi-Cell Mobile
2008
CTIA1625 Computing Devices
CB IEC60950-1
2nd Edition Battery Safety
or UL60950-1
UL2054 2nd Edition Household and Commercial Batteries
Secondary cells and batteries containing alkaline or other non-acid
electrolytes – Safety requirements for portable sealed secondary
IEC62133 2nd Edition
cells, and for batteries made from them, for use in portable
applications
EC 1275 2008 ErP Lot 6: Standby and Off-mode EC 1275/2008
IEC61960 Power Capacity Test Report
IEC62321 CE 2006/66/EC Material Test Report (Lead, Cadmium, Mercury)
Transportation Tests (Tests T1. T2, T3, T4, T5, T6, T7,
UN38.3
P1 and P2)
N/A Ver. 0.8 Batman 2 BIOS/EC Specifications
Mechanical
Dell DN362 A04 Dell Plastics requirements Spec
Specification Revision
Ref. Number Specification Title
Number Number
ENG0011674 A01 Dell Connector Plating Requirements
6724U A05 Dell Corporate Cosmetic Spec
ENG0004160 A10 Notebook System Mechanical Specification
ENG0000137 A03 OEM Mechanical Drawing Guideline
ENG0011584 A05 XLOB System Usability Spec
Environmental
Dell 6T198 A14 Dell Restricted Materials including RoHS 2.0
9E154 A08 Dell De-rating specification 9E154
ENV0023 A08 R-Phrase restriction as per 6T198 and DFE
ENV0199 A04 BFR/CFR/PVC Free
Dell ENV0380 A00 R-Phrase restriction
Environmental Affairs World Wide Legal and Market Energy
FW252 A03-00
Requirements
ENG0004779
Service
ENG0004802 A16 Client Serviceability Requirements Document
Repair Readiness and Test Tool Requirement for Mobility (Small
ENG0011760 A05
Form Factor) Document
Quality and Reliability

BUSINESS CLIENT NB/DT SHOCK & VIBRATION
SV0416 A12
ENGINEERINGSOW
16 PRU Key Components List

Components Vendor Value Qty Part Number
Receiver Coil 1
Ferrite Sheet 1
2 Layer PCB 55mmx90mm 1
Other components
PRU Control & Sense Murata 5.1nH 1 LQW15AN5N1B00

PRU Control & Sense TI LM26LVCISD-100 1 LM26LVCISD-100
PRU Control & Sense TI CC2541F256RHAT 1 CC2541F256RHAT
PRU Control & Sense Maxim Integrated MAX44284 1 MAX44284FAUT+
PRU Control & Sense TXC 9HT10-32.768KBZF-T 1 9H03220008
PRU Control & Sense KYOCERA CX3225GB32000D0HEQZ1 1 CX3225GB32000D0HEQZ1
PRU Control & Sense Murata 4.7u 1 C1005X5R0J475K050BC
PRU Rectifier DIODES DFLS240L-7 4 DFLS240L-7
PRU Rectifier DIODES DFLT33A-7 1 DFLT33A-7
PRU Rectifier VISHAY 0.05 1 WSL0805R0500FEA
PRU Regulator Murata 22uF 3 GRM21BR61E226ME44L
PRU Regulator TDK 10uH 2 VLF504015MT-100M
PRU Regulator ON Semiconductor BSS138LT1G 2 BSS138LT1G
PRU Regulator ROHM ELECTRONICS 2SK3541 2 2SK3541T2L
PRU Regulator VISHAY 0.02 2 WSL0805R0200FEA
PRU Regulator RICHTEK RT7272A 1 RT7272AGSP
PRU Regulator MPS MPQ4470 1 MPQ4470
PRU Regulator Maxim Integrated max9938feuk+ 1 MAX9938FEUK+T
PRU Regulator Toshiba TCR3DM33 1 TCR3DM33
PRU Regulator VISHAY SiS443DN-T1-GE3 2 SiS443DN-T1-GE3
4 layer PCB 57mmx44mm 1

17 NUDDs
NUDD Description Status/Mitigation Plan Contingency

rd
Dell recommended coil size 300mmx Use 3 party Charging pad (using
Compatibility with 190mm larger than Intel’s reference Intel’s reference design)
New design. Exiting DPE without any
Charging Pad
details on Charging Pad
Exceed skin temps for charging pad Thermal simulation of concept Spec
New Charging Base Thermals or base. layout. adjustment /
waiver
Difficulty finding low profile Low profile component available
Low profile component components to fit within FF/ID from a single supplier
New
availability requirements
New Technology
New WC - Safety
New BT Cross communication

Coupling to other metal components Early mockup testing at Intel
E-Field coupling to other may affect efficiency and contribute
New
metal to component self-heating. Additional shielding in thermally
sensitive areas.

18 RFQ Roles and Responsibilities
18.1 DELL
Box.net utilized as primary documentation portal during RFQ
Folders setup for each ODM
Provide documentation to ODM as a basis for RFQ bid
18.2 ODM
Review documents and provide proposals to satisfy all requests and investigations
ODM to provide all feedback via Box.net in the ODM response folder
ODM to complete the RFQ Response Template prior to Dell face to face visit
Recommend that ODM provide email notification to Dell PD when content is uploaded to Box.net


Wireless Charging Base-LAPTOP

Uploaded by

Document Information

Original Title

Copyright

Available Formats

Share this document

Share or Embed Document

Sharing Options

Did you find this document useful?

Is this content inappropriate?

Copyright:

Available Formats

Wireless Charging Base-LAPTOP

Uploaded by

Copyright:

Available Formats

Dell Inc.

Architecture Requirements Document

Document Revision 0.85

DELL CONFIDENTIAL AND PROPRIETARY

Dell - Internal Use - Confidential

Version Description Author Date

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

4.2.1 Palmrest (C cover)

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

 Charger characteristics: Super Cap + ASIC

Dell - Internal Use - Confidential

6 System Reference Layout

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

7 Thermal Design Requirements and Simulation Status

Item Power (Watt)

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

8.2 Label Plan

8.3 Hall Switch (LCD Lid Close Switch)

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

Jayton Tablet Power Path Block Diagram 3.3V

Vcc BASE TABLET

from Battery 3.3V

I2C to EC DSKTP_ACOK Microchip ACAV_IN

TPS43060 WC_ACOK Host Controller +BAT_TAB_EN#

AC#2 PWR POGO

Dell Proprietary VBUS2 VBUS_BASE

DO NOT DISTRIBUTE CC_2

VCONN_2 to I2C#2 PTP

Dell - Internal Use - Confidential

9.2 High-Level requirements

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

9.4.1 Power Receiver Unit (PRU)

Dell - Internal Use - Confidential

Dell - Internal Use - Confidential

Figure 9-6: PRU PCB Outline and Component Placement

9.4.2.2 Detailed Description

Dell - Internal Use - Confidential

9.4.2.3 Pin List

Table 9-219: PRU Pin List

PIN # PIN NAME PIN DESCRIPTION I/O/PWR VOLTAGE LEVEL

Dell - Internal Use - Confidential

Figure 9-7: 3.3V VIN and I2C Buffer block diagram