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Prepared for:
Prepared by: BEST, Inc. 3603 Edison Place Rolling Meadows, IL 60008
10 PCBs
Requested Services
BEST, Inc. was asked to perform dye and pry analysis on the BGA devices of ten assemblies. The PWAs were visually and x-ray inspected. There were no abnormalities noted from the visual inspection. The x-ray inspection indicated some voiding of the TI BGA.
Results
There was no evidence of any dye penetration at the interconnect between the ball and the pad on all of the BGAs that were processed. What was seen was a great deal of solder voiding of the TI device at the solder ball to BGA interface. The amount of solder voiding present on the TI BGAs is enough to present a high risk of failure. The failure of the solder interconnect will probably occur after thermal cycling or mechanical stresses. The solder voids are a defect in accordance with IPC-A-610 revision D, class 2 (paragraph 8.2.12.4).
Recommendation
The root cause of the solder voiding has to be identified. This may be caused by the thermal profile needing adjustment, or from the use of different alloys. Further research is necessary.
Illustration 1: Serial #1210, Board, TI BGA, solder voids (light spots in solder balls)
Illustration 2: Serial #1210, Board, TI BGA, solder voids (light spots in solder balls)
Illustration 4: Serial #0362, Board, TI BGA, solder voids (on top of solder ball)
Illustration 8: Serial #1262, Board, Samsung BGA, no observed problems (50X magnification)
Illustration 10: Serial #1262, BGA, Samsung BGA, pads ripped from board
Tested by:
Date: ______________
Date: ______________