Professional Documents
Culture Documents
soldering quality. Our equipment is able to”see” solder joints that are
under packages such as BGAs, CSPs and FLIP chips WHERE the solder
This allows us to verify that the assembly is done right. The defects and
analyzed and the process altered to reduce the defects and improve
the quality of the final products. In this way not only are actual faults
detected, but the process can be altered to reduce the fault levels on
To make sure the components to be used are good quality, there are
includes:
* Packaging examined:
-Country of origin
edges, etc.)
Our highly skilled and trained engineers receive the components for
process includes:
Automated
Selected
Defect Defect Detection by
Inspection Defect Class
No. Description final proto
Technology(s)
type
1 Dry joints AOI Soldering No
4 BGA voiding X-ray Soldering Yes
5 BGA bridging X-ray Soldering Yes
6 BGA tilted X-ray Soldering Yes
BGA missing
7 X-ray Soldering Yes
balls
https://www.raypcb.com/pcba-quality-control/