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GOOD AFTER NOON TO ALL

WE ARE HERE TO PRESENT YOU A

PRESENTATION ON
What is crosstalk ?
How it occurs ?
An unwanted coupling from a
neighboring signal wire to a network
node introduces Interference. The
injected noise depends upon the
transient value of the other signals
routed in the neighborhood
 
The digital integrated circuit designing is rapidly approaching a
point where conventional device signal models are no longer
effective in predicting the behavior of ICs. The maintenance of
signal integrity possesses a challenge in designs implemented in
deep sub-micron technology that operates at speeds approaching
10GHz and above. Smaller devices are more condensed in
geometry and smaller signal swings are used to achieve high-
speed performance. This high-speed approach results in higher
noise-coupling rate and lower noise margin as the side effects.
Consequently, signal integrity and interconnect
modeling becomes more critical and a limiting factor for avoiding
crosstalk
 
Crosstalk is a well-known phenomenon at all levels of electronic
packaging from system level cables through wires on printed
circuit board ,multi-chip-modules to chip level routing and
inside of VLSI interconnection. It causes undesired signal noise
to be coupled from an active line (Aggressor) into a quiet line
(Victim). Depending on its magnitude, the induced noise onto
the victim may influence the timing behavior of the victim
signal by increasing its setup time. It may even cause failure by
inducing false pulses or causing false signal levels which may be
propagated through the circuit. With increasing integration
density and reduced cycle times, these effects become more
visible and more destructive, so they need to be handled more
carefully. Crosstalk needs to be considered in particular on
Crosstalk may occur over
many paths like
Inductive Crosstalk and Capacitive
crosstalk :
This type of Crosstalk comes into
existance when the interconnects
are routed close to each
other,signals on the line crosstalk
to each other via near field
electromagnetic coupling
Substrate Crosstalk:
The common substrate serves as a channel
for signal coupling when Interconnects are
placed far a apart,such a noise source is
called Substrate Crosstalk.They play a
significant negative role in mixed signal IC’s
where low resistive silicon substrate can be
modeled as resistive and capacitive
network and noise can spread globally
through the network.
Power/Ground CrossTalk:
Signals may effect one another via
a shared power supply and
ground leading to Power Supply
and Ground Crosstalk
Return Signal Crosstalk:
When a pair of signals share a return path having a finite impedance, a transition
on one signal induces a voltage across the shared return impedance that appears
as a noise on the other signal thereby giving scope to return signal crosstalk
Crosstalk effects:

Crosstalk primarily causes noise on non-switching wires as


A capacitor does not like to change its voltage instantaneously.
A wire has high capacitance to its neighbor and when the neighbor switches from 1-> 0 or 0->1, the wire tends to
switch too called capacitive coupling or crosstalk
Types of Crosstalk
Crosstalk can be a difficult phenomenon to
grasp, particularly since there are two types of
crosstalk, forward and backward, which behave
quite differently. Though, the magnitude of
forward crosstalk increases as the length of the
coupled region increases, its pulse width
remains nearly constant and independent of the
length of the coupled region.
However in case of backward crosstalk,
there is nearly constant magnitude
independent of the length of the coupled
region (as long as the coupled region is
"long enough"). But its pulse width is twice
as long as the coupled region. Crosstalk
can be a serious problem in some designs
as it has some very subtle effects that are
hard to recognize. As a result:
Parasitic coupling capacitance and
inductance between interconnect
introduces crosstalk between
signals
Level of crosstalk depends on
signal frequency, layout geometry
and material characteristics
Crosstalk sensitivity varies - some
nodes (pre-charge control
function) may be very sensitive,
others (static gate nodes)
Minimize crosstalk by re-
designing layout to minimize
coupling C & L (e.g. by increasing
spacing between critical signals)
Backward Crosstalk:
In case of backward crosstalk, the backward crosstalk
pulse is (almost) constant amplitude in magnitude but
twice as wide as the propagation time represented by
the coupled region. This backward crosstalk pulse
width is trouble understanding. The width is not a
function of coupling strength. Width is purely a
function of the length of the coupled region. Hence
the backward crosstalk pulse width is purely a function
of the length of the coupled region. Backward
crosstalk grows fairly quickly to a constant magnitude
pulse whose pulse width is twice as wide as the
propagation time down the coupled region.
Forward Crosstalk:
As the aggressor signal moves forward one more increment,
the first two victim elements get kicked further along and
bump into the third element. This continues as the aggressor
keeps kicking the forward crosstalk elements along. By the
time the aggressor signal reaches the end of its trace, the
forward crosstalk elements are all bunched together at the far
end of the victim trace. The forward crosstalk signal never
travels in the reverse direction, it doesn't care whether there is
a reflecting barrier or not. The quantity of the forward
elements represents the magnitude of the forward crosstalk
signal. The forward crosstalk signal will continue to increase in
magnitude the longer is the coupled region. Although there is
a theoretical limit to how high the forward crosstalk signal can
grow, it is never likely to reach that limit on circuit boards (the
coupled region can't be long enough).
For simplicity the forward crosstalk signal can be
assumed to grow larger and larger as the
coupled region increases. All the elements
representing the signal are clustered on top of
each other. This represents the width of the
forward crosstalk pulse. In theory, the width of
the forward crosstalk pulse is no wider than the
rise time of the aggressor signal that creates it.
The pulse starts to build as the aggressor signal
starts to rise, and it finishes building when the
aggressor signal has reached its maximum value.
Forward versus Backward Crosstalk
 
RULES TO AVOID CROSSTALK

1.Greater separation between traces is better.


2.Lower frequency harmonics and slower rise times are better.
3.Keep the sensitive traces in stripline environments.
WHAT IS INTERCONNECTS ?
In past, on-chip interconnect wires were not
considered to be a major issue and had only been
considered in special cases or when performing high-
precision analysis. However, with the introduction of
deep-submicron semiconductor technologies, there
have been rapid changes. While the gate delay used to
dominate the net delay, the on-chip interconnects
delay now account for up to 60% of the total delay in a
deep submicron design. The on-chip interconnect delay
needs to be accurately quantified; as any error in the
on-chip interconnect delay can translate into a large
portion of error in the total delay
Another phenomenon that occurs in a deep submicron
design is that in order to maintain proper resistance
(and therefore voltage drop) in each conducting wire,
the conductor’s height is not reduced, if at all, as fast as
the width. Due to the different aspect ratio, the
coupling capacitance between adjacent wires, which
was ignored in past is now significant. The frequency-
dependent resistance and inductance (i.e., the skin
effect) of each conductor can be readily obtained by
subdividing the cross section of each conductor into
many segments, replacing each segment by a resistor
and inductor in series, and then
reducing the aggregate resistors and inductors through
a circuit formulation
Classification of VLSI Interconnects ?
At the lowest level are the polysilicon
lines characterized as RC lines.
Metal interconnects on chip
Chip to chip interconnects
on a module.
TIME FOR
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Tuesday, December 07, 2021 33


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