DESIGN FOR MANUFACTURABILITY

By R. Devi AP/ECE
DESIGN FOR MANUFACTURABILITY
• Process of optimizing the circuit design at affordable manufacturing
cost
• Optimization at various level in circuit as follows :
• Physical
• Redundancy
• Power
• Process speed
• Yield analysis
• Power : The High power applied to the device failure and metal migration failures.
This is because of excess current in the wires. Moreover, the high power devices
increases the temperature of die affecting the device performance and power
parameter .

• Remedy : Power must be reduced by using power minimization techniques.

• Process Speed : The circuit design can be considerably using different process
simulations at various levels in it.

• Yield Analysis : A chip with poor performance or that are manufactured in bulk
undergo yield analysis in laboratory to identify the reasons for failure .
Once the part of structure causing the failure is determined ,its layout is redesigned.
Boundary Scan Test