Wire Bonder Study report

Date
 Wire Bonder Study report

1. Background

2. Purpose

3. BONDING DIAGRAM
 Wire Bonder Study report
4.0 Procedure

5.0 Evaluation matrix.

 Wire Bonder Study report
6.0 Output evaluation.

5.1
5.2
5.3
5.4
5.5
5.6
 Qualification Proper
(1)Wire Bonder Model :?
(2) Machine# : ?
(3)Capillary : ?
(4)Gold Wire :?
(5)Bonding Temp :?
(6)Package :?
(7) Device :?

1/26/21 UNISEM 5
 Bonding diagram.

1/26/21 UNISEM 6
SIP Parameter
 Below is 1st bond parameter used :
 Base Time :
 Base Power :
 Base Force :
 FAB :

 Below is 2nd bond parameter used :

 Base Time :
 Base Power :
 Base Force :

1/26/21 UNISEM 7
 Output response
No Item
1 Ball dimension
2 WPT
3 BST
4 Ball and wedge shape
5 Cratering test
6 Intermetallics
Sample size
3 units, all balls
10 units, all wires
10 units, all wires
1 balls and wedges
2 units, all pads
2 units, 5 balls
Target/Requirement
Ball Diameter average (X,Y) : 76 -96.3 um
Ball thickness : 7-14 um
Min per wire 8 g
Cpk computation use 4 g
Min per wire 33 g
Cpk computation use 23.1 g
SEM photo
No cratering on pad
>60%

1/26/21 UNISEM 8
  Result
Setting 1st 1st 2nd 2nd Ball Size Avg, um
Bond Bond Bond Bond (76 - 96.3 um)
Force Power Force Power MC#

MIN
MAX
Setting 1st 1st 2nd 2nd Ball Thick Avg, um
Bond Bond Bond Bond (7 – 14 um)
Force Power Force Power
MC#

MIN
MAX
Setting 1st 1st 2nd 2nd Wire Pull Avg, g
Bond Bond Bond Bond (min 8 g, cpk use 4 g)
Force Power Force Power
MC#

MIN
MAX
Setting 1st 1st 2nd 2nd Ball Shear Avg, g
Bond Bond Bond Bond (Min 33.2 g, cpk use 23.1 g)
Force Power Force Power
403

Remark : PASS/ MIN

FAIL MAX

1/26/21 UNISEM 9
  Result
Setting 1st 1st 2nd 2nd Cratering Test
Bond Bond Bond Bond MC#
Force Power Force Power

MIN
MAX

Setting 1st 1st 2nd 2nd IMC , %

Bond Bond Bond Bond 403
Force Power Force Power

MIN
MAX

 Data Gathering

 Raw data using excel

Worksheet

1/26/21 UNISEM 10
 Conclusion
.

 Recommendation

1/26/21 UNISEM 11