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Imperfections

in Solids
 Point defects are where an atom is missing or
have an irregular position in the lattice structure.

Define Point Defects.


Self interstitial – an atom from the crystal
that is crowded into an interstitial
site, a small void space that under ordinary
circumstances is not occupied.
Substitutional Impurity – there is an atom
of a different type than the bulk atoms
which has replaced one of the bulk atoms
in the lattice. They are usually close in
size, about 15% åto the bulk atom.
Interstitial Impurity – atoms are much
smaller than the atoms in the bulk matrix.
It fits into the open space between the
bulk atoms of the lattice structure.
Vacancies – one normally occupied
from which an atom is missing
Vacancies
Frenkel – a cation–vacancy and a
cation–interstitial pair.
Frenkel
Schottky imperfection – type of
vacancy in which an atom being free
from regular site, migrates through
successive steps and settles at the
crystal surface.
 Line defects/dislocations atoms are
out of position in the crystal
structure. It is generated and move
when a stress is applied.

Define Line Defects.


Edge Dislocation – an extra half-
plane of atoms is introduced midway
through the crystal, distorting
nearby planes of atoms. The burgers
vector is perpendicular to the
dislocation line
Screw Dislocation – A linear crystalline
defect associated with the
lattice distortion created when normally
parallel planes are joined together
to form a helical ramp. The
Burgers vector is parallel to the dislocation
line.
 Combination of Edge and Screw Dislocation

Define Mixed Dislocation


 It arise at the boundary between two grains or
small crystals within a larger crystal.

Define Surface Defects.


Grain Boundaries – the
boundary separating two small grains or
crystals having different crystallographic
orientations in polycrystalline materials.
Tilt Boundaries – occurs in
between of two slightly
misaligned grains that appears
as an array of edge
dislocations.
Twin Boundaries -
appears as an array of
screw dislocations.
Stacking Faults – formed by
fault in the stacking
sequence of atomic planes in
crystals.
 It is a three-dimensional aggregates of atoms or
vacancies.
 Much larger defects compared to the previous
ones
 Common examples are cracks, pores, and other
phases

Define Volume Defects


(or Bulk defects.
Inclusions – varies in size from a few
microns to macroscopic dimensions;
relatively large, entered the system as a
dirt and usually formed through
precipitation.
Voids – holes in the solid
formed by trapped gases or by
the accumulation of vacancies.
Microscopic Examination
Microscopic Techniques
Optical Microscopy

• “Light” microscope

• Uses a series of lenses to magnify images

• Has three basic lenses (4x, 10x, and a third


ranging from 20x – 100x)

• Has a magnification limit of 2000x


Example of an Optical
Microscope
Microscopic Techniques:Electron
Microscopy
Uses focused beam of electrons to magnify target

Magnification up to 2,000,000x

Has 4 main types: TEM, SEM, REM, STEM


Transmission Electron
Microscopy (TEM)

 Original form of electron microscope

 Utilizes an electron gun with a tungsten filament

 Image projected unto a phosphor viewing screen


Scanning Electron
Microscopy (SEM)
Scans rectangular area by using a focused beam of
electrons

Electrons give off differing energies based on


structure of target

Microscope reads these energies and produces a


visual representation
Reflection Electron
Microscopy (REM)

Like TEM, uses a beam of electrons to develop a


picture of the target

Reads the reflected beam of electrons to form visual


representation
Scanning Transmission Electron
Microscope (STEM)

A type of Transmission Electron Microscope

Electrons focus on a small area of specimen

Electrons pass through the sample, and a visual is formed


Thank you for listening!
=D

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