UNIT -3

Fabrication of MEMS Devices

MEMS Manufacturing
Isotropic materials show the same properties in all directions. Anisotropic materials show
different properties in different directions. Anisotropic etching is a subtractive microfabrication
technique that aims to preferentially remove a material in specific directions to obtain intricate
and often flat shapes. Some examples of isotropic materials are cubic symmetry crystals, glass,
etc. Some examples of anisotropic materials are composite materials, wood, etc.
Reference: Fabrication of Microcantilever based Sensor,
Jayu kalambe, Rajendra Patrikar
http://www.rknec.edu/Academics/img/EN/Report2.pdf
Reference: Fabrication of Microcantilever based Sensor, Jayu kalambe, Rajendra Patrikar
http://www.rknec.edu/Academics/img/EN/Report2.pdf
 Fabrication of Micro-cantilever Based Sensor: IITB Under INUP Program

Fabricated Structures:

Resist removed - Aluminium cantilever

Photograph of Fabricated microcantilevers

SEM Images of released polysilicon cantilever
Processing details:
1. RCA cleaning
2. Thermal oxidation (SiO2)
3. 1st level Aluminium deposition , pattern, etch
4. 2nd level Resist spinning, patterning
5. 3rd level of Aluminium deposition, pattern, etch
6. 4th level exposure followed by immediate 5th level Al deposition,
patterning
7. Removal of Sacrificial Layer

SEM images of released Bi-layer (polysilicon-gold) cantilevers

Reference: Design Optimization and fabrication of microcantilever for switching
application,
Deepak Khushalani, Jayu kalambe, Rajesh Pande,Rajendra Patrikar

https://reader.elsevier.com/reader/sd/pii/S0924424714004725?
token=11BD270A298C216433A3D2070FDE79A46234A7574A452F905B263D
A25235479C470675400537173B90CB8BB20AC32B38
 Fabrication & Characterization of MEMS Cantilever Switch for
Power Applications

Fabricated Structures:

Processing details:
i. P-type wafer <100> of high resistivity.
ii. Wafer cleaning- RCA Cleaning.
iii. Thermal Oxidization- Dry Oxidation (100nm)
iv. Metal deposition (Aluminium) for bottom electrode & transmission line
(fraction)– Thermal Evaporation ( 500nm) One, Two and three beam in parallel
v. 1st level Optical Lithography for patterning the bottom electrode and
transmission lines (fraction) – MASK 1
vi. Deposition of Sacrificial layer (PPR) – using Spinners.
vii. 2nd level Optical Lithography to form the anchors ( cantilever beam and
transmission OUT lines) – MASK 2.
viii. Deposition of metal (Aluminium) for the formation of the beam and
remaining transmission line - Thermal Evaporation (500nm).
ix. 3rd level Optical Lithography (without dehydration step ) to pattern the
metal layer to form the beam and remaining transmission line– MASK 3.
x. Removal of sacrificial layer - O2 Plasma Ashing Current Vs Time
Fabricated Device At IITB under INUP Program
 Fabrication of microfluidic channel for detection of
adulterants in milk
Sakshi Rana, Jayu kalambe
Fabricated Structures:

Processing details:
1. RCA cleaning
2. Dehydration bake
3. SU8 spin coat - 100 um
4. Pre bake
5. UV exposure
6. Post bake
7. Developing
8. Hard bake
9. Silanization using Trichlorosilane
10. PDMS curing, hole punching
11. Piranha clean quartz
12. Plasma exposure to bond

Microfluidic chip
Mold images using Olympus Microscope
 Fabrication Steps
• Fabrication of microchannels at IITB
Process steps:

1. Preparation of Mold

2. PDMS Curing
3. PDMS Bonding

24
 Fabrication steps

Process steps:

1. Preparation of Mold

25
 Fabrication steps

2. PDMS Curing

3. PDMS Bonding

26
 Fabricated molds

• The molds are made of SU8

• Thickness of the SU8 patterns is 100 microns
• Different shapes of micromixers are fabricated like wavy
(serpentine), straight, etc.
• Molds silanized to enable PDMS peel off easily

27
Wavy (serpentine)
2” Silicon wafer
Microchannel thickness =
100 microns
Microchannel width = 100
microns

28
Micromixer mold designs

Inlet

29
Fabricated Microchannel at IITB under INUP Program
 Micromotor
Micromotor Fabrication
Fabrication example
Example
Fab Steps :MEMS Wheel and Hub
Fabrication flow for Wheel and Hub
Details process
Microgripper Design & Fabrication
MEMS DEVICE FABRICATION PROCESS
1. Surface Micromachining
2. Bulk Micromachining
3. LIGA (For High Asepct Ratio Devices)
Sputtering, Isotropic and anisotropic etching process
Suggest deposition technique(s) to deposit Cr, Ni, and Ti
Compare between CVD techniques based on temperature and pressure operation

Search for the Devices & process flow of following devices

4. Pressure sensor
5. Accelerometer
6. Micromirror (Which Actuation Method?)
7. MEMS Switch (Clam Clamped Beam/ Cantilever)
8. Biosensor
9. Capacitor
10. Inductor
11. Resonator
12. Transverse comb drive
13. Other devices discussed in the class
 How can you combine MEMS and Integrated Circuits on a
single chip which is also referred as monolithic integration?
Describe typical methods used in integration of MEMS and
CMOS circuits.

Ans: Micro & Smart System, G. K. Ananthasuresh, Ch-8 , 8.1 PN

318

A Beam Made of a “normal” material bends when a load is

applied on it. A Beam Made of a “smart” piezoelectric material
not only bends but produces electric charge when a load is
applied on it. Both materials behave in their specific ways.
Then why is that we consider some materials to be smart?
Does smartness lie in the way we use the material or in their
very nature?
Ans: Micro & Smart System, G. K. Ananthasuresh, Ch-2 , 2.9 PN 45